CN117225985A - Integrated preparation method of capillary core and shell of temperature equalization plate - Google Patents
Integrated preparation method of capillary core and shell of temperature equalization plate Download PDFInfo
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- CN117225985A CN117225985A CN202311296490.XA CN202311296490A CN117225985A CN 117225985 A CN117225985 A CN 117225985A CN 202311296490 A CN202311296490 A CN 202311296490A CN 117225985 A CN117225985 A CN 117225985A
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- temperature equalization
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- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 51
- 239000002184 metal Substances 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 27
- 239000002131 composite material Substances 0.000 claims abstract description 26
- 238000009792 diffusion process Methods 0.000 claims abstract description 10
- 238000007731 hot pressing Methods 0.000 claims abstract description 10
- 238000002844 melting Methods 0.000 claims abstract description 10
- 230000008018 melting Effects 0.000 claims abstract description 10
- 229910001220 stainless steel Inorganic materials 0.000 claims description 22
- 238000005245 sintering Methods 0.000 claims description 13
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 239000010935 stainless steel Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 9
- 239000011148 porous material Substances 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000012459 cleaning agent Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 238000007493 shaping process Methods 0.000 abstract description 3
- 238000005219 brazing Methods 0.000 description 5
- 150000002431 hydrogen Chemical class 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The application discloses an integrated preparation method of a capillary core and a shell of a temperature equalization plate, wherein the capillary core and the shell are formed by adopting a hot-pressing diffusion bonding method; the capillary core is prepared by one or more layers of composite metal wire mesh, and the composite metal wire mesh is formed by compositing 1-5 layers of metal wire mesh with the same material; all the metal wires are layered and compounded according to a certain sequence to form a composite metal wire, wherein the thickness of the composite metal wire is 0.2-1 mm, the aperture is 30-150 mu m, and the porosity is 30-60%; the difference between the melting point of the shell and the melting point of the composite wire mesh is less than 100 ℃ and the ratio of the thermal expansion coefficients is 0.9 to 1.1. The method can complete the combination of the multi-layer wire mesh and the combination of the capillary core and the shell through a hot-pressing diffusion combination method once, and the method has simple process, and the prepared capillary core and the shell have good combination effect and can not influence the porous characteristic of the capillary core; the capillary core and the shell are formed at one time, and the size matching is good; through the direct shaping of mould, the casing roughness is high, avoids the problem such as deformation that capillary core and casing welding process caused.
Description
Technical Field
The application relates to the technical field of thermal management, in particular to a method for integrally preparing a capillary core and a shell of a temperature equalization plate.
Background
As electronic devices have been increasingly miniaturized, functionalized, integrated, and high-frequency, the increase in heat density has become a serious challenge impeding their development, limiting the application of electronic components. Heat pipes, temperature plates, and the like are considered to be effective electronic thermal management materials due to their high thermal conductivity, high stability, and high reliability, and have been widely used in various fields of electronic devices, aerospace, military, and the like.
The existing temperature equalization plate preparation technology using the silk screen as the capillary core generally comprises the steps of firstly sintering and compounding a plurality of layers of silk screens, fixing the silk screen capillary core and a punched shell through spot welding or brazing, and then carrying out subsequent steps. By adopting the preparation technology, problems exist in both spot welding and brazing links, on one hand, the capillary core and the shell are fixed by adopting spot welding, so that the bonding strength is poor, and the capillary core is likely to fall off, on the other hand, the spot welding only forms contact between the capillary core and part of the shell, gaps exist at the non-welded part, a steam film is easy to form at the position in the heat transmission process, and the heat transmission effect is seriously affected; when the brazing is used for fixing, the molten brazing filler metal can enter the pores of the silk screen through capillary action in the brazing heating process, and part of the meshes are blocked, so that the heat transfer performance is affected.
Disclosure of Invention
The application provides an integrated preparation method of a capillary core and a shell of a temperature equalization plate, and aims to solve the problems in the background art.
The technical scheme provided by the application is as follows:
the integrated preparation method of the capillary core and the shell of the temperature equalization plate comprises the steps of adopting a hot-pressing diffusion bonding method to prepare the capillary core and the shell;
the capillary core is prepared from one or more layers of composite metal wire mesh, and the composite metal wire mesh is formed by compositing 1-5 layers of metal wire mesh with the same material;
the metal wire mesh is layered and compounded according to a certain sequence to form the composite metal wire mesh, wherein the thickness of the composite metal wire mesh is 0.2-1 mm, the aperture is 30-150 mu m, and the porosity is 30-60%;
the difference between the melting point of the shell and the melting point of the composite wire mesh is smaller than 100 ℃, and the ratio of the thermal expansion coefficients is 0.9-1.1.
Further, when the capillary core and the shell are prepared, the shell is paved on the bottom layer, and the wire mesh is paved on the shell from bottom to top according to the sequence of the average pore diameter from small to large.
Further, a die for preparing the temperature equalization plate is provided with grooves matched with the required temperature equalization plate in size, the die comprises 1 piece of an upper die and 1 piece of a lower die, 10-30 pieces of a middle die are arranged, the upper die is provided with protrusions, the lower die is provided with grooves, the upper side and the lower side of the middle die are respectively provided with the grooves and the protrusions, the taper of the grooves and the protrusions is larger than 1 degrees, the flatness of the die assembly surface is smaller than 0.3mm, the depth of the grooves is larger than the height of the protrusions, the height difference is the total thickness of-0.1 to-0.5 mm after the shell and the capillary core are compounded, and the gap between the grooves and the protrusions is the total thickness of-0.1 to-0.5 mm after the shell and the capillary core are compounded.
Further, the materials of the wire mesh and the shell comprise stainless steel, copper, aluminum, nickel-based alloy, aluminum alloy and copper alloy.
Further, the sintering environment of the temperature equalization plate is vacuum, hydrogen, nitrogen or argon, and the sintering temperature is 600-1300 ℃.
Further, the integrated preparation method of the capillary core and the shell of the temperature equalization plate comprises the following steps:
s1, cutting all metal wire mesh and plates for a shell into required sizes, cutting the metal wire mesh and the plates into the same sizes, and cleaning the metal wire mesh and the plates by using a metal cleaning agent to remove surface oxide skin and greasy dirt;
s2, paving all the metal wire meshes from bottom to top according to the aperture from small to large, placing the plate at the lowest layer, placing the paved plate and the metal wire meshes between dies, and alternately stacking processing materials and the dies according to the requirement, wherein the processing materials are the plate and the metal wire meshes;
and S3, charging the charged processing materials into a furnace, heating to 600-1300 ℃ in the atmosphere of vacuum, hydrogen, nitrogen or argon, preserving heat for 0.5-4 h, cooling to 45 ℃ along with furnace cooling after finishing preserving heat, and discharging to obtain the temperature equalizing plate.
Further, in step S3, pressurization is further required in the sintering process of charging the processing material, where the specific pressurization operation is as follows:
the preliminary pressurization is carried out for 0.5T before the temperature rise, the metal starts to generate plastic deformation along with the temperature rise, and the pressurization pressure is gradually increased to 1-5T.
Compared with the prior art, the application has the beneficial effects that:
the application provides an integrated preparation method of a capillary core and a shell of a temperature equalization plate, wherein the combination of a plurality of layers of metal wire meshes and the combination of the capillary core and the shell can be completed by a hot-pressing diffusion combination method once; the capillary core and the shell are formed at one time, and the size matching is good; through the direct shaping of mould, the casing roughness is high, avoids the problem such as deformation that capillary core and casing welding process caused.
Drawings
FIG. 1 is a schematic diagram of a capillary wick and a sheet material for a housing and a mold charging in an embodiment of the present application.
The reference numerals are as follows:
1-upper die, 2-middle die, 3-lower die, 4-wire mesh, 5-shell, 6-groove and 7-bulge.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the embodiments described below are some, but not all, embodiments of the application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Accordingly, the following detailed description of the embodiments of the application, taken in conjunction with the accompanying drawings, is intended to represent only selected embodiments of the application, and not to limit the scope of the application as claimed. All other embodiments, which can be made by one of ordinary skill in the art without undue burden on the person of ordinary skill in the art based on the embodiments of the present application, are within the scope of the present application.
In describing embodiments of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific circumstances.
Referring to fig. 1, the application provides a method for integrally preparing a capillary core and a shell of a temperature equalization plate, which is formed by adopting a hot-pressing diffusion bonding method.
The capillary core is prepared by one or more layers of composite metal wire mesh, and the composite metal wire mesh is formed by compounding 1-5 layers of metal wire mesh 4 made of the same material.
All the wire meshes 4 are layered and compounded according to a certain sequence to form a composite wire mesh, wherein the thickness of the composite wire mesh is 0.2-1 mm, the pore diameter is 30-150 mu m, and the porosity is 30-60%. Within this pore size and porosity range, it is ensured that the capillary wick has sufficient capillary force and fluid medium transport channels.
The difference between the melting point of the shell 5 and the melting point of the composite wire mesh is less than 100 ℃ and the ratio of the thermal expansion coefficients is 0.9-1.1.
The shell 5 and the composite wire mesh can be made of the same material or other metal materials which have a melting point difference of less than 100 ℃ and a thermal expansion coefficient ratio of 0.9-1.1 and cannot react. The difference of melting points is small, so that the two materials can realize solid-phase sintering at the same sintering temperature, and one of the materials is prevented from forming a liquid phase to block meshes. The small difference of the thermal expansion coefficients can avoid the falling of the capillary core caused by the difference of the shrinkage rates of the capillary core and the shell in the cooling process.
Optionally, the mold for preparing the temperature equalization plate is made of materials which do not react with the metal wire mesh and the shell plate, the mold is provided with grooves matched with Wen Banche inches, the mold comprises 1 piece of upper mold 1 and 1 piece of lower mold 3, 10-30 pieces of middle mold 2, the upper mold 1 is provided with protrusions 7, the lower mold 3 is provided with grooves 6, the upper side and the lower side of the middle mold 2 are respectively provided with grooves 6 and protrusions 7, the taper of the grooves 6 and the protrusions 7 is more than 1 degrees, the flatness of the assembling surface of the mold is less than 0.3mm, the depth of the grooves 6 is greater than the height of the protrusions 7, the difference in height is the total thickness of-0.1 to-0.5 mm after the shell and the capillary core are compounded, and the gap between the grooves 6 and the protrusions 7 is the total thickness of-0.1 to-0.5 mm after the shell and the capillary core are compounded.
Optionally, the materials of the wire mesh 4 and the shell 5 include stainless steel, copper, aluminum, nickel-based alloy, aluminum alloy and copper alloy.
Optionally, when the capillary core of the temperature equalization plate and the shell are integrally prepared, the sintering environment is vacuum, hydrogen, nitrogen or argon, and the sintering temperature is 600-1300 ℃.
The application provides a method for integrally preparing a capillary core and a shell of a temperature equalization plate, which comprises the following steps:
s1, cutting all the wire mesh 4 and the shell 5 into required sizes by using plates, cutting the wire mesh 4 and the plates into the same sizes, and cleaning the wire mesh 4 and the plates by using a metal cleaning agent to remove surface oxide skin and greasy dirt.
S2, paving all the wire meshes 4 from bottom to top according to the aperture from small to large, placing the plate at the lowest layer, placing the paved plate and the wire meshes 4 between the dies, and alternately stacking the processing materials and the dies according to the requirement, wherein the processing materials are the wire meshes 4 and the plate.
And S3, charging the well-loaded processing materials into a furnace, heating to 600-1300 ℃ in the atmosphere of vacuum, hydrogen, nitrogen or argon, preserving heat for 0.5-4 h, cooling to 45 ℃ along with furnace cooling after finishing preserving heat, and discharging to obtain the temperature-equalizing plate.
Optionally, in step S3, pressurization is further required in the sintering process of loading the processing material into the furnace, where the specific pressurization operation is as follows:
the preliminary pressurization is carried out for 0.5T before the temperature rise, the metal starts to generate plastic deformation along with the temperature rise, and the pressurization pressure is gradually increased to 1-5T.
It should be noted that in step S3, stage pressurization is performed according to the deformation temperatures of different materials during pressurization, so as to control the porosity of the capillary core, and ensure the bonding strength between the capillary core and the housing 5.
Example 1
The embodiment provides a combination method of a capillary core and a shell of a stainless steel temperature-equalizing plate, wherein the capillary core is prepared by adopting four layers of composite 316L stainless steel wire mesh, the shell 5 is prepared by adopting a 316L stainless steel metal sheet, and the method combines the four layers of 316L stainless steel wire mesh by adopting a hot-pressing diffusion combination method, and simultaneously combines the composite wire mesh with the shell 5.
The hot-pressing diffusion bonding method is a method for bonding a plurality of layers of metal wire mesh 4 and simultaneously bonding a composite metal wire mesh with the shell 5 by paving the shell 5 of a 316L stainless steel metal sheet and four layers of 316L stainless steel metal wire mesh according to a certain sequence, placing the layers of metal wire mesh between an upper die 1 and a lower die 3, pressurizing and heating to a certain temperature under a certain atmosphere and preserving heat.
The four layers of 316L stainless steel wire mesh have average pore diameters of 10 mu m, 50 mu m, 100 mu m and 150 mu m respectively, the thickness of the four layers of stainless steel composite wire mesh after hot-pressing diffusion bonding is 0.5mm, the average pore diameter is 25 mu m, and the porosity is 35%.
The sintering environment is hydrogen atmosphere, the temperature is 1300 ℃, and the heat preservation time is 2 hours. The pressurization pressure was 3T.
The mould is the graphite mould with recess and arch, and upper mould 1 and lower mould 3 each 1, and middle mould 2 is 15, and recess 6 degree of depth 5mm in the mould, protruding 7 height 4.6mm, recess 6 and protruding 7 tapering are 2, and mould fitting surface's planarization is 0.2mm, and upper and lower mould assembly clearance is 0.4mm.
As shown in fig. 1, the method for combining the capillary core and the shell 5 of the stainless steel temperature equalization plate provided in this embodiment has the following preparation process:
s1, cutting four layers of 316L stainless steel wire mesh and 316L stainless steel sheet metal shell 5 into 400X 800mm, and cleaning the 316L stainless steel wire mesh and the shell 5 by using a metal cleaning agent to remove surface oxide skin, greasy dirt and the like.
S2, laying a plurality of layers of 316L stainless steel wire meshes and the shell 5 from bottom to top according to the sequence of the shell 5, the 10 mu m stainless steel wire meshes, the 50 mu m stainless steel wire meshes, the 100 mu m stainless steel wire meshes and the 150 mu m stainless steel wire meshes. The laid shells 5 and 316L stainless steel wire mesh were placed between the dies and 16 layers were laid in total.
And S3, charging the loaded materials into a furnace, heating to 1300 ℃ in a hydrogen atmosphere, and preserving heat for 2 hours. The preliminary pressurization was performed for 0.5T before the temperature was raised, to 1T at 850℃and to 3T at 1050 ℃. And after the heat preservation procedure is completed, cooling to 45 ℃ along with furnace cooling, releasing pressure, and discharging to obtain the 316L temperature-equalizing plate capillary core and shell composite member.
In this example, the wick was composed of four layers of 316L stainless steel wire mesh, the thickness of the wick was 0.5mm, the average pore diameter was 25 μm, and the porosity was 35%. Within this pore size and porosity range, it is ensured that the capillary wick has sufficient capillary force and fluid medium transport channels.
In summary, the application provides an integrated preparation method of a capillary core and a shell of a temperature equalization plate, wherein the combination of a plurality of layers of metal wire meshes 4 and the combination of the capillary core and the shell 5 can be completed by a hot-pressing diffusion combination method once, the method has simple process, and the prepared capillary core and the shell 5 have good combination effect and can not influence the porous characteristic of the capillary core; the capillary core and the shell 5 are molded at one time, and the size matching is good; through the direct shaping of mould, casing 5 roughness is high, avoids the problem such as deformation that capillary core and casing 5 welding process caused.
The foregoing description is merely illustrative of the preferred embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present application should be covered. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (7)
1. The integrated preparation method of the capillary core and the shell of the temperature equalization plate is characterized in that the capillary core and the shell are formed by adopting a hot-pressing diffusion bonding method;
the capillary core is prepared from one or more layers of composite metal wire mesh, and the composite metal wire mesh is formed by compositing 1-5 layers of metal wire mesh with the same material;
the metal wire mesh is layered and compounded according to a certain sequence to form the composite metal wire mesh, wherein the thickness of the composite metal wire mesh is 0.2-1 mm, the aperture is 30-150 mu m, and the porosity is 30-60%;
the difference between the melting point of the shell and the melting point of the composite wire mesh is smaller than 100 ℃, and the ratio of the thermal expansion coefficients is 0.9-1.1.
2. The method for integrally preparing the capillary core and the shell of the temperature equalization plate according to claim 1, which is characterized in that:
when the temperature equalization plate is prepared, the shell is paved on the bottom layer, and the wire mesh is paved on the shell from bottom to top according to the sequence of the average pore diameter from small to large.
3. The method for integrally preparing the capillary core and the shell of the temperature equalization plate according to claim 1 or 2, which is characterized in that:
the die for preparing the temperature equalization plate is provided with grooves matched with the required temperature equalization plate in size, the die comprises 1 piece of upper die and 1 piece of lower die, 10-30 pieces of middle die are arranged, the upper die is provided with protrusions, the lower die is provided with grooves, the upper side and the lower side of the middle die are respectively provided with the grooves and the protrusions, the conicity of the grooves and the protrusions is more than 1 degrees, the flatness of the die assembly surface is less than 0.3mm, the depth of the grooves is greater than the height of the protrusions, the height difference is-0.1 to-0.5 mm of total thickness after the shell and the capillary core are compounded, and the gap between the grooves and the protrusions is-0.1 to-0.5 mm of total thickness after the shell and the capillary core are compounded.
4. The method for integrally preparing the capillary core and the shell of the temperature equalization plate according to claim 3, comprising the following steps:
s1, cutting all metal wire mesh and plates for a shell into required sizes, cutting the metal wire mesh and the plates into the same sizes, and cleaning the metal wire mesh and the plates by using a metal cleaning agent to remove surface oxide skin and greasy dirt;
s2, paving the metal wire mesh from bottom to top according to the aperture from small to large, then placing the plate at the lowest layer, placing the paved plate and the metal wire mesh between dies, and alternately stacking processing materials and the dies according to the requirement, wherein the processing materials are the plate and the metal wire mesh;
and S3, charging the loaded processing materials into a furnace, heating to 600-1300 ℃ in the atmosphere of vacuum, hydrogen, nitrogen or argon, preserving heat for 0.5-4 h, cooling to 45 ℃ along with furnace cooling after finishing preserving heat, and discharging to obtain the integrated capillary core and shell.
5. The method for integrally preparing a capillary core and a shell of a temperature equalization plate according to claim 4, wherein in step S3, pressurization is further required in the sintering process of charging the processing material, and the specific pressurization operation is as follows:
the preliminary pressurization is carried out for 0.5T before the temperature rise, the metal starts to generate plastic deformation along with the temperature rise, and the pressurization pressure is gradually increased to 1-5T.
6. The method for integrally preparing the capillary core and the shell of the temperature equalization plate according to claim 5, which is characterized in that:
the materials of the wire mesh and the shell comprise stainless steel, copper, aluminum, nickel-based alloy, aluminum alloy and copper alloy.
7. The method for integrally preparing the capillary core and the shell of the temperature equalization plate according to claim 5 or 6, which is characterized in that:
the sintering environment of the capillary core and the shell is vacuum, hydrogen, nitrogen or argon, and the sintering temperature is 600-1300 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311296490.XA CN117225985A (en) | 2023-10-09 | 2023-10-09 | Integrated preparation method of capillary core and shell of temperature equalization plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311296490.XA CN117225985A (en) | 2023-10-09 | 2023-10-09 | Integrated preparation method of capillary core and shell of temperature equalization plate |
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