CN117203368A

CN117203368A - Mask jig, film forming method and film forming apparatus

Info

Publication number: CN117203368A
Application number: CN202280030763.3A
Authority: CN
Inventors: 平野正树
Original assignee: Tatsuta Electric Wire and Cable Co Ltd
Current assignee: Tatsuta Electric Wire and Cable Co Ltd
Priority date: 2021-05-31
Filing date: 2022-03-30
Publication date: 2023-12-08
Also published as: DE112022002864T5; WO2022254945A1; JPWO2022254945A1

Abstract

A mask jig (1) capable of efficiently forming a stable-quality film on the surface of a substrate is provided with a main body (11) and a mask (12). The main body (11) includes a1 st surface (11 s 1) and a2 nd surface (11 s 2) located on the opposite side of the 1 st surface (11 s 1). The mask (12) is disposed on the 2 nd surface (11 s 2) side of the main body (11) so as to overlap the main body (11), and includes a 3 rd surface (12 s 1) and a 4 th surface (12 s 2) on the opposite side of the 3 rd surface (12 s 1). The mask (12) is formed of an imide resin.

Description

Mask jig, film forming method and film forming apparatus

Technical Field

The present disclosure relates to a mask jig, a film forming method, and a film forming apparatus.

Background

Conventionally, a cold spraying method is known as one of the spraying methods. In the cold spray method, a film is formed on a substrate by spraying a film-forming material together with a carrier gas onto the substrate (for example, refer to japanese patent application laid-open No. 2017-170369).

In the sputtering method such as the cold spraying method, a mask jig disposed on the surface of the substrate is used to limit the film formation range (for example, refer to japanese patent application laid-open No. 2002-361135). The planar shape of the film formation region can be defined by supplying the film formation material to the surface of the substrate through the through-hole formed in the mask jig.

Prior art literature

Patent literature

Patent document 1: japanese patent application laid-open No. 2017-170369

Patent document 2: japanese patent laid-open No. 2002-361135

Disclosure of Invention

Problems to be solved by the invention

In the sputtering method such as the cold spraying method, when a mask jig is used, a film made of a film forming material is formed on the surface of the mask jig. When a film is formed on the surface of the mask jig, as a result, the processing conditions (film formation conditions) when the film formation material is supplied to the surface of the substrate through the through-holes of the mask jig may be changed from the conditions at the beginning of film formation. As a result, it is difficult to stably form a film on the surface of the substrate. In order to ensure the quality of the film formed on the surface of the substrate, it is necessary to perform a process of removing the film formed on the surface of the mask jig at regular intervals. As a result, it is difficult to efficiently form a film with stable quality on the surface of the substrate. JP-A2002-361135 discloses a study for suppressing film formation on the surface of a mask jig. However, from the viewpoint of more efficiently forming a stable film on the surface of the substrate, it is preferable to further improve the production of a mask jig or the like from a material which is not easily formed.

The purpose of the present disclosure is to provide a mask jig, a film forming method, and a film forming apparatus that can efficiently form a stable film on the surface of a substrate.

Solution for solving the problem

The mask jig of the present disclosure is used in a sputtering method. The mask jig includes a main body and a mask. The main body portion includes a1 st surface and a2 nd surface located on the opposite side of the 1 st surface. The mask is disposed on the 2 nd surface side of the main body so as to overlap the main body, and includes a 3 rd surface and a 4 th surface located on the opposite side of the 3 rd surface. The mask is formed of an imide resin.

The film forming method of the present disclosure includes a step of disposing the mask jig so as to face the surface of the substrate. In the step of disposing the mask jig, the mask jig is disposed such that the 1 st surface of the mask jig faces the surface of the substrate. The film forming method of the present disclosure further includes a step of blowing powder as a film forming raw material onto the surface of the substrate by cold spray through the 1 st through hole and the 2 nd through hole of the mask jig.

The film forming apparatus of the present disclosure includes a spray gun including a nozzle, a powder supply unit, a gas supply unit, and the mask jig. The powder supply unit supplies powder as a film-forming raw material to the spray gun. The gas supply unit supplies a working gas to the spray gun. The mask jig is disposed between the substrate and the spray gun.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the above, a film having stable quality can be efficiently formed on the surface of the base material.

Drawings

Fig. 1 is a schematic diagram showing the structure of a film forming apparatus according to the present embodiment.

Fig. 2 is a schematic cross-sectional view showing a mask jig according to the present embodiment, and a base material and a base jig provided with the mask jig.

Fig. 3 is a schematic cross-sectional view showing an enlarged view of example 1 of the form of the region a surrounded by a dotted line in fig. 2.

Fig. 4 is a schematic cross-sectional view showing an enlarged view of example 2 of the form of the area a surrounded by a dotted line in fig. 2.

Fig. 5 is a schematic cross-sectional view showing an enlarged view of example 3 of the form of the area a surrounded by a dotted line in fig. 2.

Fig. 6 is a schematic cross-sectional view showing an enlarged view of example 4 of the form of the area a surrounded by a dotted line in fig. 2.

Fig. 7 is a schematic cross-sectional view showing an enlarged view of example 5 of the form of the region a surrounded by a dotted line in fig. 2.

Fig. 8 is a schematic cross-sectional view showing still another modification of the mask jig of fig. 2.

Fig. 9 is a flowchart showing a film formation method according to the present embodiment.

Fig. 10 is a schematic cross-sectional view of example 1 showing the form of the mask jig used in example 3.

Fig. 11 is a schematic cross-sectional view of example 2 showing the form of the mask jig used in example 3.

Fig. 12 is a schematic cross-sectional view of example 3 showing the form of the mask jig used in example 3.

Fig. 13 is a photograph of the adhesion pattern of the film forming raw material at the inner wall of the inclined portion formed on the main body portion of the sample 11 of example 3 as viewed from above.

Fig. 14 is a photograph of the adhesion pattern of the film forming raw material at the inner wall of the inclined portion formed on the main body portion of the sample 12 of example 3 as viewed from above.

Fig. 15 is a photograph of the adhesion pattern of the film forming raw material at the inner wall of the inclined portion formed on the main body portion of the sample 13 of example 3 as viewed from above.

Detailed Description

Embodiments of the present disclosure are described below. In addition, the same reference numerals are given to the same structures, and the description thereof is not repeated.

Structure of film Forming apparatus

Fig. 1 is a schematic diagram showing the structure of a film forming apparatus according to the present embodiment. Referring to fig. 1, a film forming apparatus 100 mainly includes a spray gun 2, a powder supply unit 3, a gas supply unit 4, and a mask jig 1, and the spray gun 2 includes a nozzle 2b.

The spray gun 2 mainly includes a spray gun main body 2a, a nozzle 2b, a heater 2c, and a temperature sensor 9. A nozzle 2b is connected to the 1 st end of the gun body 2a, which is the front end side. A pipe 6 is connected to the 2 nd end of the gun body 2a, which is the rear end side. The pipe 6 is connected to the gas supply unit 4 via a valve 7. The gas supply unit 4 supplies the working gas to the spray gun 2 via the pipe 6. By opening and closing the valve 7, the supply state of the working gas from the gas supply portion 4 to the spray gun 2 can be controlled. A pressure sensor 8 is disposed in the pipe 6. The pressure sensor 8 measures the pressure of the working gas supplied from the gas supply unit 4 to the pipe 6.

The heater 2c heats the working gas supplied from the 2 nd end of the gun body 2a to the inside of the gun body 2a. The heater 2c is disposed on the 2 nd end side of the gun body 2a. The working gas flows inside the lance body 2a along arrow 31. A temperature sensor 9 is connected to a connection portion between the nozzle 2b and the gun body 2a. The temperature sensor 9 measures the temperature of the working gas flowing inside the lance body 2a.

A pipe 5 is connected to the nozzle 2b. The pipe 5 is connected to the powder supply unit 3. The powder supply unit 3 supplies powder as a film forming raw material to the nozzle 2b of the spray gun 2 via the pipe 5.

The mask jig 1 is disposed between the substrate 20 and the torch 2. The mask jig 1 has a1 st through hole 11c and a2 nd through hole 12a (see fig. 2). The 1 st through hole 11c and the 2 nd through hole 12a limit a film formation region on the surface of the substrate 20. The specific structure of the mask jig 1 will be described later.

< action of film Forming apparatus >)

In the film forming apparatus 100 shown in fig. 1, as indicated by an arrow 30, a working gas is supplied from the gas supply portion 4 to the spray gun 2 via the pipe 6. As the working gas, for example, nitrogen, helium, dry air, or a mixture thereof can be used. The pressure of the working gas is, for example, about 1 MPa. The flow rate of the working gas is, for example, 300L/min or more and 500L/min or less. The working gas supplied to the 2 nd end of the gun body 2a is heated by the heater 2 c. The heating temperature of the working gas may be set appropriately according to the composition of the film forming raw material, and may be set to, for example, 100 ℃ to 500 ℃. The working gas flows from the gun body 2a to the nozzle 2b. Powder 10 as a film forming raw material is supplied from the powder supply unit 3 to the nozzle 2b via the pipe 5 as indicated by arrow 32. As the powder 10, for example, nickel powder, tin powder, or a mixed material of tin powder and zinc powder can be used. Alternatively, as the powder, for example, aluminum powder may be used. The particle size of the powder 10 is, for example, 1 μm or more and 50 μm or less.

The powder 10 supplied to the nozzle 2b is ejected from the tip of the nozzle 2b toward the substrate 20 together with the working gas. A mask jig 1 is disposed on the surface of the substrate 20. The ejected powder 10 reaches the surface of the base material 20 via the 1 st through hole 11c and the 2 nd through hole 12a (see fig. 2) of the mask jig 1. A film is formed on the surface of the base material 20, the film using the ejected powder 10 as a raw material.

Structure of mask jig

Fig. 2 is a schematic cross-sectional view showing a mask jig according to the present embodiment, and a base material and a base jig provided with the mask jig. Referring to fig. 2, the mask jig 1 is used in a cold spraying method as an example of a sputtering method. The mask jig 1 includes a main body 11 and a mask 12.

The body 11 includes a1 st surface 11s1 and a2 nd surface 11s2. The 2 nd surface 11s2 is located on the opposite side of the 1 st surface 11s1. The 1 st surface 11s1 and the 2 nd surface 11s2 are rectangular, for example. The thickness of the body 11, that is, the distance from the 1 st surface 11s1 to the 2 nd surface 11s2 is substantially constant over the entire body 11. Thus, the main body 11 is a plate-like member having a rectangular planar shape.

Mask shell 12 includes a 3 rd surface 12s1 and a 4 th surface 12s2. The 4 th surface 12s2 is located on the opposite side from the 3 rd surface 12s 1. The 3 rd surface 12s1 and the 4 th surface 12s2 are rectangular, for example. The thickness T of the mask 12, that is, the distance from the 3 rd surface 12s1 to the 4 th surface 12s2 is substantially constant over the entire mask 12. Thus, the mask shell 12 is a plate-like member having a rectangular planar shape. The mask 12 is disposed on the 2 nd surface 11s2 side of the main body 11, i.e., on the upper side of fig. 2, so as to overlap with the main body 11. The mask 12 is disposed so that the 3 rd surface 12s1 faces and contacts the 2 nd surface 11s2 of the main body 11.

The mask 12 is formed of an imide resin. Specifically, the mask 12 is formed of, for example, polyamide imide. The mask 12 may be formed of, for example, polyimide instead of polyamide imide.

The body 11 has a1 st through hole 11c. The 1 st through hole 11c penetrates the body 11 so as to reach the 2 nd surface 11s2 from the 1 st surface 11s1. The 1 st through hole 11c may have any planar shape, for example, a circular shape in a plan view, or may have a rectangular shape (particularly, a square shape).

The 1 st through hole 11c may be a part lacking a member constituting the main body 11, and has a columnar portion 11a and an inclined portion 11b. The columnar portion 11a has an inner wall extending in a direction substantially orthogonal to the 1 st surface 11s1 and the 2 nd surface 11s 2as a whole. That is, in the cross-sectional view of fig. 2, two portions of the inner wall of the columnar portion 11a that are disposed at positions offset from each other by 180 ° with respect to the center and that are opposite to each other extend parallel to each other. Therefore, in the cross-sectional view of fig. 2, the inner wall of the left end and the inner wall of the right end of the columnar portion 11a are parallel to each other. The substantially orthogonal direction herein allows an error within ±1° with respect to the completely right-angle direction. The inner wall of the inclined portion 11b extends in a direction inclined with respect to a direction substantially orthogonal to the 1 st surface 11s1 and the 2 nd surface 11s2. That is, in the sectional view of fig. 2, the inner wall of the left end and the inner wall of the right end of the inclined portion 11b each extend in a direction different from the inner wall of the columnar portion 11a. The inner wall of the left end and the inner wall of the right end of the inclined portion 11b each extend in a direction inclined with respect to the 1 st surface 11s1 and the 2 nd surface 11s2.

As shown in fig. 2, the inclined portion 11b is preferably formed on the 2 nd surface 11s2 side of the columnar portion 11a, and the inner wall is preferably inclined so that the diameter thereof gradually increases from the 1 st surface 11s1 side to the 2 nd surface 11s2 side. However, the present invention is not limited thereto, and the inclined portion 11b may be formed on the 1 st surface 11s1 side of the columnar portion 11a, for example. The inclined portion 11b may incline the inner wall so that the diameter thereof gradually decreases from the 1 st surface 11s1 side to the 2 nd surface 11s2 side. Alternatively, for example, the inclined portion 11b may be formed only in the central portion in the direction connecting the 1 st surface 11s1 and the 2 nd surface 11s2 without being connected to any of the 1 st surface 11s1 and the 2 nd surface 11s2. In this case, the columnar portion 11a reaching the 1 st surface 11s1 is formed on the 1 st surface 11s1 side of the inclined portion 11b, and the columnar portion 11a reaching the 1 st surface 11s1 is formed on the 1 st surface 11s1 side of the inclined portion 11b. Preferably, at the boundary between the columnar portion 11a and the inclined portion 11b adjacent to each other, the inner wall of the columnar portion 11a is continuous with the inner wall of the inclined portion 11b.

In fig. 2, the 1 st through hole 11c has both the columnar portion 11a and the inclined portion 11b as an example. However, the 1 st through hole 11c is not limited to this, and may have only the columnar portion 11a, or may have only the inclined portion 11b. In addition, the diameter of the 1 st through hole 11c and the like is the diameter of a circle when the planar shape of the 1 st through hole 11c is the circle. However, when the planar shape of the 1 st through hole 11c or the like is square, the diameter of the 1 st through hole 11c or the like is the length of one side of the square.

The mask cover 12 has a2 nd through hole 12a formed therein. The 2 nd through hole 12a penetrates the mask cover 12 so as to reach the 4 th surface 12s2 from the 3 rd surface 12s 1. Like the columnar portion 11a, the 2 nd through hole 12a has an inner wall extending in a direction substantially orthogonal to the 1 st surface 11s1 and the 2 nd surface 11s 2as a whole. However, the 2 nd through hole 12a may extend in a direction inclined with respect to the direction substantially orthogonal to the 3 rd surface 12s1 and the 4 th surface 12s2, as in the inclined portion 11b. The inclination angle of the inner wall of the 2 nd through hole 12a with respect to the direction orthogonal to the 3 rd surface 12s1 may be, for example, 10 ° or less with respect to the direction orthogonal to the 3 rd surface 12s 1.

Although not shown, the 1 st through hole 11c and the 2 nd through hole 12a are not integrally extended in the depth direction of the paper surface of fig. 2 over the mask jig 1, but are formed only in a partial region in the depth direction of the paper surface. That is, the 1 st through hole 11c and the 2 nd through hole 12a have a short dimension in the depth direction of the paper surface in fig. 2. Specifically, the dimensions of the 1 st through hole 11c and the 2 nd through hole 12a in the depth direction of the paper surface in fig. 2 are equal to the dimensions in the left-right direction in fig. 2 or slightly increased or decreased compared to the dimensions in the left-right direction.

The base jig 21 is a member for setting the substrate 20 as a film formation target. The base jig 21 is a plate-like member having a rectangular planar shape. The main surface side of one side of the base jig 21, that is, the main surface of the upper side of fig. 2, may be provided in contact with the 1 st surface 11s1 of the main body portion 11 constituting the mask jig 1as shown in fig. 2. However, as shown in fig. 1, the main surface of the base jig 21 may be provided so as not to contact the 1 st surface 11s1 (so as to have a gap with the 1 st surface 11s 1).

A groove 22 is formed in a main surface of the base jig 21 opposite to the 1 st surface 11s1. The groove 22 is formed as a recess recessed in a direction orthogonal to the main surface in a part of the main surface on one side of the base jig 21. The base material 20 is set in the base jig 21 by fitting the base material 20 into the groove 22.

The spin holes 13 are formed so as to penetrate through all of the mask shell 12, the main body 11, and the base jig 21, which are stacked in contact with each other. The fastening holes 13 are formed so that holes formed in the mask cover 12, the main body 11, and the base jig 21 overlap each other in a plan view. In this way, the mask 12 can be fixed to the main body 11 and the base jig 21 by the fasteners. Therefore, the mask cover 12 and the main body 11 can be replaced individually. As a result, when the lives of the mask shell 12 and the main body 11 are different, the cost at the time of replacement can be suppressed as compared with a structure in which the main body 11 and the mask shell 12 are integrated.

As shown in fig. 2, the diameter of the screw hole 13 in the base jig 21 may be smaller than the diameters of the screw holes 13 in the mask shell 12 and the main body 11, and the diameters of the screw holes 13 in the mask shell 12 and the main body 11 may be the same. However, the diameters of the screw holes 13 in the main body 11 and the base jig 21 may be the same, and the diameter of the screw holes 13 in the mask 12 may be larger than the diameter of the screw holes 13 in the main body 11.

Next, the materials, dimensions, and the like of the respective members constituting the above will be described. The main body 11 of the mask jig 1 may be made of any material, for example, copper, which is a metal material having high heat dissipation property. This can alleviate the thermal influence on the base material 20. However, instead of copper, for example, a metal such as stainless steel or steel, a ceramic such as carbon or alumina, or the like may be applied to the main body 11.

The body 11 may have a thin film formed on the surface of copper, for example. The thin film is preferably made of a material having low affinity for a material to be formed using the mask jig 1, for example. That is, for example, when the mask jig 1 is used for forming aluminum by sputtering, it is preferable to form a thin film of a material having low affinity for aluminum (less likely to contact aluminum, less likely to mix, less likely to bond), such as tin, on the surface of the main body 11 made of copper.

In particular, the minimum angles θ1 and θ2 formed between the inner wall of the 1 st through hole 11c, in particular, the inclined portion 11b of the body 11 and the 1 st surface 11s1 and the 2 nd surface 11s2 are preferably 30 ° to 60 °. That is, angles θ1 and θ2 between the inner wall of the inclined portion 11b and the dash-dot line parallel to the 1 st surface 11s1 and the like shown in fig. 2 are preferably 30 ° or more and 60 ° or less. The angle θ1 and the angle θ2 may be equal or different. The inner wall includes a curved surface at a portion. The inclination angles θ1 and θ2 of the inner wall may be constant throughout the inner wall, but the inner wall may include surfaces having different inclination angles θ1 and θ2 locally.

The mask cover 12 of the mask jig 1 preferably has a thickness T, which is a distance between the 3 rd surface 12s1 and the 4 th surface 12s2, of 0.5mm or more and 2.0mm or less. The base jig 21 is preferably formed of a metal material having high heat dissipation. Specifically, the base jig 21 is preferably formed of any one of a copper-based metal material and an aluminum-based metal material. Further, the body 11 is preferably 1.5mm to 3mm in thickness, which is the distance between the 1 st surface 11s1 and the 2 nd surface 11s2. In the mask jig 1, the mask cover 12 is preferably thinner than the main body 11. However, the thickness of the main body 11 and the mask 12 may be equal. Alternatively, the mask 12 may be thicker than the main body 11.

The diameter of the 2 nd through hole 12a is equal to or larger than the diameter of the 1 st through hole 11c. "above" includes both the equal case and the greater (more) case. That is, the diameter of the 2 nd through hole 12a may be the same as the diameter of the 1 st through hole 11c or may be larger than the diameter of the 1 st through hole 11c. In addition, in the case where the diameter of the 2 nd through hole 12a is larger than the diameter of the 1 st through hole 11c, the 2 nd central axis 12as passing through the center of the 2 nd through hole 12a in plan view may be on the same straight line as the 1 st central axis 11as passing through the center of the 1 st through hole 11c in plan view. That is, as shown in fig. 2, the 2 nd central axis 12as and the 1 st central axis 11as may coaxially overlap. Alternatively, although not shown, for example, the 1 st central axis 11as in fig. 2 may be disposed at a position offset to the right or left with respect to the 2 nd central axis 12as, and both axes may be axes at different positions. The relationship between the diameters of the 1 st through hole 11c and the 2 nd through hole 12a will be described below, including possible modifications.

Fig. 3 is a schematic cross-sectional view showing an enlarged view of example 1 of the form of the region a surrounded by a dotted line in fig. 2. Referring to fig. 3, in example 1, the 1 st through hole of the body 11 is formed only by the columnar portion 11a, and the diameter is constant throughout. The 2 nd through hole 12a of the mask 12 has a constant diameter throughout the entire surface, as in the columnar portion 11a. The diameter of the columnar portion 11a is equal to the diameter of the 2 nd through hole 12a. Such a structure is also possible.

Fig. 4 is a schematic cross-sectional view showing an enlarged view of example 2 of the form of the area a surrounded by a dotted line in fig. 2. Referring to fig. 4, in example 2, the 1 st through hole of the main body 11 is formed only by the columnar portion 11a, and the 2 nd through hole 12a of the mask 12 has a constant diameter throughout the entire area, as in example 1. The diameter of the 2 nd through hole 12a is larger than the diameter of the columnar portion 11a. In example 2 of fig. 4, the columnar portion 11a and the 2 nd through hole 12a as shown in fig. 3 are not equal in diameter. Such a structure is also possible.

Fig. 5 is a schematic cross-sectional view showing an enlarged view of example 3 of the form of the area a surrounded by a dotted line in fig. 2. Referring to fig. 5, in example 3, the 1 st through hole of the main body 11 is formed only by the inclined portion 11b. The inclined portion 11b is inclined with respect to the direction orthogonal to the 1 st surface 11s1 and the 2 nd surface 11s2 so that the diameter thereof gradually increases from the 1 st surface 11s1 side to the 2 nd surface 11s2 side. The maximum diameter D1, which is the maximum value of the diameters of the inclined portions 11b in a plan view, is formed on the 2 nd surface 11s2, and the minimum diameter D2, which is the minimum value of the diameters of the inclined portions 11b in a plan view, is formed on the 1 st surface 11s1. On the other hand, the 2 nd through hole 12a of the mask 12 has a constant diameter D3 as a whole, as in the columnar portion 11a. The diameter D3 of the 2 nd through hole 12a is larger than the minimum diameter D2 of the inclined portion 11b and smaller than the maximum diameter D1 of the inclined portion 11b. Such a structure is also possible.

Fig. 6 is a schematic cross-sectional view showing an enlarged view of example 4 of the form of the area a surrounded by a dotted line in fig. 2. Referring to fig. 6, in example 4, similarly to example 3, the 1 st through hole of the main body 11 is formed only by the inclined portion 11b, and the inner wall is inclined so that the diameter thereof gradually increases from the 1 st surface 11s1 side to the 2 nd surface 11s2 side. The diameter D3 of the 2 nd through hole 12a of the mask cover 12 is constant throughout. The diameter D3 of the 2 nd through hole 12a is larger than the minimum diameter D2 of the inclined portion 11b and equal to the maximum diameter D1 of the inclined portion 11b. Such a structure is also possible.

Fig. 7 is a schematic cross-sectional view showing an enlarged view of example 5 of the form of the region a surrounded by a dotted line in fig. 2. Referring to fig. 6, in example 5, the shapes of the 1 st through hole and the 2 nd through hole 12a are the same as those of example 3 and example 4, and thus description thereof will not be repeated. The diameter D3 of the 2 nd through hole 12a is equal to the minimum diameter D2 of the inclined portion 11b and smaller than the maximum diameter D1 of the inclined portion 11b. Such a structure is also possible.

Note that, although not shown, in the case where the 2 nd through hole 12a of the mask 12 has only an inclined portion (or has an inclined portion locally as will be described later) in which the inner wall is inclined similarly to the inclined portion 11b of the 1 st through hole 11c, the diameter of the 2 nd through hole 12a is considered to be the minimum value in the above description.

< still another modification >

Fig. 8 is a schematic cross-sectional view schematically showing still another modification of the mask jig of fig. 2. The 2 nd through hole 12a of the mask cover 12 may be formed to intersect (be orthogonal to) an end portion intersecting the 4 th surface 12s 2as shown in fig. 2. However, referring to fig. 8, the 2 nd through hole 12a may be formed to be relatively round at an end portion intersecting the 4 th surface 12s2, for example, like a part of a spherical surface (curved surface). That is, in the cross-sectional view of fig. 8, the portion where the 2 nd through hole 12a and the 4 th surface 12s2 intersect may be formed as a curved surface 12R having a curved shape (for example, a partial shape of an arc or an ellipse). The same applies to the end of the 2 nd through hole 12a intersecting the 3 rd surface 12s 1.

In addition, in the case where the 2 nd through hole 12a of the mask cover 12 extends in a direction inclined with respect to the direction orthogonal to the 3 rd surface 12s1 and the like, the inclination angle of the inclined portion may be formed in two or more stages. That is, the inclined portion may be formed to have two or more inclined portions having different inclination angles. As an example, in fig. 8, the inner wall of the 2 nd through hole 12a has two inclined portions 12a1 and 12a2 having different angles with respect to the 3 rd surface 12s 1.

The above is not limited to the mask 12, and the same applies to the main body 11. The inner wall of the inclined portion 11b of the main body 11 may be formed to have an inclination angle of two or more stages. As an example, for example, the partial inclined portion 11b of fig. 8 has two inclined portions 11b1 and 11b2 having different angles with respect to the 1 st surface 11s1. The end portion of the 1 st through hole 11c intersecting at least one of the 1 st surface 11s1 and the 2 nd surface 11s2 may be formed to be relatively round like a curved surface (curved shape in the cross-sectional view of fig. 8).

< Effect >

The mask jig 1 of the present disclosure is used in a sputtering method. The mask jig 1 includes a main body 11 and a mask 12. The main body 11 includes a1 st surface 11s1 and a2 nd surface 11s2 located on the opposite side of the 1 st surface 11s1. The mask 12 is disposed on the 2 nd surface 11s2 side of the main body 11 so as to overlap the main body 11. Mask shell 12 includes a 3 rd surface 12s1 and a 4 th surface 12s2 located on the opposite side of 3 rd surface 12s 1. The mask 12 is formed of an imide resin.

It is difficult to form a film formed by a thermal spraying method on the surface of the mask cover 12 formed of an imide resin which is a resin material having high heat resistance. Therefore, when the powder 10 (see fig. 1) of the material for film formation is supplied from the mask shell 12 side, it is possible to suppress the powder from forming a film on the surface of the mask jig 1 on which film formation is not to be performed, when the substrate or the like to be formed is disposed downstream of the powder from the mask jig 1. The mask 12 is disposed on the 2 nd surface 11s2 side of the main body 11 so as to overlap the main body 11 (so as to cover the surface of the main body 11), and can suppress film formation on the surface of the main body 11. Therefore, the film formation conditions can be suppressed from changing relative to the conditions initially set at the start of film formation. Thus, for example, a film having stable quality can be efficiently formed on the surface of the substrate, compared with the case where the surface treatment is performed as post-treatment on the formed mask.

In the mask jig 1, a1 st through hole 11c extending from the 1 st surface 11s1 to the 2 nd surface 11s2 is formed in the body 11. A2 nd through hole 12a extending from the 3 rd surface 12s1 to the 4 th surface 12s2 is formed in the mask cover 12. The diameter of the 2 nd through hole 12a is equal to or larger than the diameter of the 1 st through hole 11c. Such a structure is also possible. The diameter of the 2 nd through hole 12a may be larger than the diameter of the 1 st through hole 11c.

The region of the surface of the substrate where the film is formed is defined by the 1 st through hole 11c formed in the body portion 11 adjacent to the substrate. This is to form a film in a region overlapping with the region where the 1 st through hole 11c is formed. By setting the diameter of the 2 nd through hole 12a to be equal to or larger than the diameter of the 1 st through hole 11c (larger than the diameter of the 1 st through hole 11 c), it is possible to suppress that the region of the main body 11 inside the 1 st through hole 11c where the film is formed is covered by the region of the mask 12 excluding the through holes, thereby preventing the film from being formed. In addition to stabilization of the film quality and high efficiency of film formation by the mask 12, the problem that film formation cannot be performed due to partial clogging of the 1 st through hole 11c by the mask 12 can be suppressed. That is, the mask jig 1 can maintain the function as a mask by using the through holes formed in the mask jig 1.

Further, if the diameter of the 2 nd through hole 12a is made larger than the diameter of the 1 st through hole 11c, the following effects can be obtained. Due to repetition of the number of film formation, the region of the mask 12 adjacent to the 2 nd through hole 12a may be deformed by heat during use, and the shape of the 2 nd through hole 12a may be deformed. In this case, if the diameter of the 2 nd through hole 12a is made larger than the diameter of the 1 st through hole 11c, the region to be formed inside the 1 st through hole 11c of the main body 11 will not overlap with the region of the mask 12 other than the through hole. This is because, since the 2 nd through hole 12a is large, even if the mask 12 is deformed, the mask 12 forms a margin for not blocking a part of the 1 st through hole 11c. Therefore, the mask function of the mask jig 1 including the mask cover 12 can be maintained.

In the mask jig 1, a1 st through hole 11c extending from the 1 st surface 11s1 to the 2 nd surface 11s2 is formed in the body 11. A2 nd through hole 12a extending from the 3 rd surface 12s1 to the 4 th surface 12s2 is formed in the mask cover 12. The inner wall of the 1 st through hole 11c extends in a direction inclined with respect to the direction orthogonal to the 1 st surface 11s1 and the 2 nd surface 11s2. The diameter D3 of the 2 nd through hole 12a is not less than the minimum diameter D2 of the 1 st through hole 11c and not more than the maximum diameter D1 of the 1 st through hole 11c. Such a structure is also possible.

The region of the surface of the substrate where the film is formed is defined by the smallest diameter D2 of the 1 st through hole 11c formed in the body portion 11 adjacent to the substrate. This is to form a film in a region overlapping with the smallest diameter D2 of the 1 st through hole 11c. The diameter D3 of the 2 nd through hole 12a is also the same as the minimum diameter D2 of the 1 st through hole 11c. Thus, the region to be formed inside the 1 st through hole 11c of the main body 11 can be suppressed from overlapping with the region of the mask 12 other than the 2 nd through hole 12a. Therefore, in addition to the stabilization of the film quality and the high efficiency of the film formation by the mask 12, the problem that the blocked portion cannot be formed due to the partial blocking of the 1 st through hole 11c by the mask 12 can be suppressed. That is, the mask jig 1 can maintain the function as a mask by using the through holes formed in the mask jig 1.

In addition, the powder 10 (see fig. 1) passing through the 2 nd through hole 12a of the mask 12 may adhere to the inner wall of the 2 nd through hole 12a. Here, in the mask jig 1, the inner wall of the 1 st through hole 11c has an inclined portion 11b. Therefore, the collision energy when the powder 10 (see fig. 1) passing through the 2 nd through hole 12a of the mask 12 collides with the inner wall of the 1 st through hole 11c can be reduced as compared with the case where the inner wall is not inclined with respect to the direction orthogonal to the 1 st surface 11s1. Therefore, film formation on the edge, i.e., the inner wall, of the through hole of the mask jig 1 can be suppressed.

In the mask jig 1, a minimum angle formed between the inner wall of the 1 st through hole 11c and the 1 st surface 11s1 and the 2 nd surface 11s2 may be 30 ° or more and 60 ° or less. As a result, as described above, the collision energy when the powder 10 (see fig. 1) passing through the 2 nd through hole 12a of the mask cover 12 collides with the inner wall of the 1 st through hole 11c can be reduced. Therefore, film formation on the edge, i.e., the inner wall, of the through hole of the mask jig 1 can be suppressed.

In the mask jig 1, the thickness of the mask cover 12 may be 0.5mm or more and 2.0mm or less from the viewpoint of improving the above-described operation and effect.

< film Forming method >

Fig. 9 is a flowchart showing a film formation method according to the present embodiment. Referring to fig. 9, the film forming method according to the present embodiment is a film forming method performed using the mask jig 1 and the film forming apparatus 100 shown in fig. 1 to 7, and mainly includes a preparation step (S10), a film forming step (S20), and a post-treatment step (S30).

The preparation step (S10) includes a step of disposing the mask jig 1 so as to face the surface of the substrate 20 as shown in fig. 1. In this arrangement step, the mask jig 1 is arranged such that the 1 st surface 11s1 (see fig. 2 to 7) of the mask jig 1 faces the surface of the substrate 20. As described above, the main body 11 of the mask jig 1 is preferably formed of a material having low affinity for the material of the powder blown in the subsequent film forming step (S20).

In the film forming step (S20), powder as a film forming raw material is blown onto the surface of the substrate 20 by cold spray using the film forming apparatus 100 through the 1 st through hole 11c and the 2 nd through hole 12a (see fig. 2) of the mask jig 1. As a result, a film made of the film-forming raw material is formed on the surface of the substrate 20.

In the post-treatment step (S30), the mask jig 1 is removed from the surface of the substrate 20. Then, a treatment necessary for processing the base material 20 or the like is performed. This can form a film on the surface of the base material 20.

In the film forming method described above, since the mask jig 1 of the present embodiment is used, the amount of deposition of the film forming raw material on the mask jig 1 can be reduced, and thus the time during which the film forming process (S20) can be continuously performed can be prolonged. Alternatively, by using the mask jig 1 described above, the number of times that the mask jig 1 can be reused can be increased.

Hereinafter, various embodiments for confirming the effect of the mask jig of the present disclosure will be described.

Example 1

< sample >)

When a mask jig having no mask 12 and consisting only of a main body 11 was disposed so as to face the surface of a substrate 20 as shown in fig. 1 and 2, and film formation was performed by the film forming apparatus 100 of fig. 1, the amount of deposition of a film forming raw material on the surface of the main body 11 was examined. The 1 st through hole 11c of the main body 11 is formed only by the inclined portion 11b, and the angles θ1 and θ2 (see fig. 2) formed between the inclined portion and the 1 st surface 11s1 are set to 45 °. A sample of such a mask jig composed only of the main body 11 and different in material was prepared. Specifically, sample 1 formed of stainless steel SUS304, sample 2 formed of carbon steel, and sample 3 formed of copper were prepared. The planar shape of each sample was a quadrilateral shape, and the dimensions thereof were 42mm in the transverse direction, 30mm in the longitudinal direction, and 3mm in the thickness. The maximum diameter of the inclined portion 11b was 6mm, and the minimum diameter was 2mm. The 1 st through holes 11c are formed in a matrix shape by forming two through holes at a distance from each other in a longitudinal direction (short side direction) in a plan view and forming 3 through holes at a distance from each other in a lateral direction (long side direction) orthogonal to the longitudinal direction.

< film Forming Process and results >)

Using the above-described samples 1 to 3, a film was formed on the surface of the substrate by a cold spray method. As a film-forming raw material, a powder formed of aluminum is used. The aluminum powder was spherical in shape and 10 μm in diameter. The material of the base material 20 is alumina (Al ₂ O ₃ ). The shape of the base material 20 is a plate shape having a square planar shape. The dimensions of the substrate were 42mm in the transverse direction, 30mm in the longitudinal direction, and 3mm in the thickness.

As film forming conditions, dry air was used as a working gas, the temperature of the working gas was 270 ℃, the flow rate of the working gas was 400 liters/min, and the pressure of the working gas was about 0.7MPa. The width (nozzle width) of the region from which the film forming raw material is sprayed from the film forming apparatus to the surface of the mask jig was set to 5mm. The speed (scanning speed) at which the region to be sprayed with the film forming material is moved so as to include the region in which the through-hole is formed on the surface of the mask jig was set to 5 mm/sec. The dimensions of the film formation range (region where the film formation raw material is sprayed) on the surface of the mask jig were set to be 5mm wide by 30mm long. In each sample, a film was formed on the surface of the substrate by spraying the film-forming raw material 5 times into the film-forming range.

According to the above conditions, a film was formed on the surface of the substrate using each of the samples 1 to 3, and the amount of deposited film forming raw material (mg/pass) per 1 shot and the amount of deposited film forming raw material (mg) after 5 shots were measured in the regions of each of the samples 1 to 3 where the film forming raw material was sprayed. The results are shown in table 1 below.

TABLE 1

According to table 1, when the material of the body 11 is copper as in the sample 3, the amount of deposition of the film forming material can be reduced as compared with other materials. That is, when the main body 11 (mask jig) is made of a material having a higher thermal conductivity than when the main body 11 (mask jig) is made of a material having a lower thermal conductivity, the amount of deposition of the film forming material can be reduced.

Next, the material of the main body 11 was copper, and a thin film (surface treatment) of a material having low affinity with the film-forming material was formed on the surface thereof, and the same measurements as described above were performed. Specifically, sample 4, in which a thin film of tin having a low affinity with aluminum as a film-forming raw material was formed by plating on the surface of the same sample as sample 3, was prepared. Sample 5, in which a thin film of chromium was formed on the surface of the same sample as sample 3 by plating, was prepared. The results of sample 3 and the measurement results of samples 4 and 5 in table 1 are shown in table 2 below.

TABLE 2

According to table 2, in sample 4 having a thin film of tin having a low affinity with aluminum as a film forming material formed on the surface, the amount of deposited film forming material can be reduced as compared with samples 3 and 5.

Example 2

< sample >)

Using a sample of a mask jig having only the main body 11 and no mask as in example 1 and a sample of a mask jig 1 having the main body 11 and the mask 12as in the present embodiment, film formation was performed by the film forming apparatus 100 of fig. 1, and the amounts of deposition of the film forming raw materials on the columnar portions formed in the main body of the mask jig at this time were compared. Specifically, sample 6 was prepared, and sample 6 was formed of stainless steel SUS304 as in sample 1 of example 1, but was composed of only main body portion 11 having the same form as in fig. 3 and 4, and 1 st through hole 11c of main body portion 11 was formed of only columnar portion 11a. Further, a sample 10 having a main body 11 similar to the sample 6 and a mask 12 provided above the main body 11 was prepared. The mask 12 of the test piece 10 prepared for constituting the mask jig 1 is formed of polyamide imide. The mask cover 12 is provided with a2 nd through hole 12a extending in a direction perpendicular to the 3 rd surface 12s1 (see fig. 2). The thickness of the mask cover 12 was 1.5mm, and the diameter of the 2 nd through hole 12a was 5mm. A2 nd through hole 12a is formed at a position overlapping the 1 st through hole 11c in a plan view of the mask cover 12.

< film Forming treatment >

Using the above-described samples 6 and 10, a film was formed on the surface of the substrate by a cold spray method. As a film-forming raw material, a powder formed of aluminum was used. The aluminum powder was spherical in shape and 10 μm in diameter. The material of the base material 20 was set to stainless steel (SUS 304). The shape and size of the base material 20 were the same as those of example 1.

As film forming conditions, dry air was used as a working gas, the temperature of the working gas was 270 ℃, the flow rate of the working gas was 400 liters/min, and the pressure of the working gas was about 0.7MPa. The nozzle width was set to 5mm. The scanning speed was set to 10 mm/sec. The dimensions of the film formation range were set to 5mm wide by 30mm long. In each sample, a region in which the film forming raw material was sprayed only 1 time was formed in the film forming range.

According to the above conditions, a film was formed on the surface of the substrate using each of the samples 11 to 13, and the weight (adhesion amount) of the film forming raw material adhering to the surface was measured and observed on the inner wall of the columnar portion 11a of the main body portion 11 of each of the samples 6 and 10. The results are shown in table 3 below.

TABLE 3 Table 3

In table 3, the lamination amount of the sample 10 having the mask 12 formed of polyamide imide was negative, which indicates that the film forming raw material was not adhered at all. According to table 3, when the material of the main body 11 is stainless steel SUS304, the mask cover 12 made of the heat-resistant imide resin is covered, so that the adhesion of the film forming raw material to the mask jig 1 can be suppressed.

Example 3

< sample >)

Fig. 10 is a schematic cross-sectional view of example 1 showing the form of the mask jig used in example 3. Fig. 11 is a schematic cross-sectional view of example 2 showing the form of the mask jig used in example 3. Fig. 12 is a schematic cross-sectional view of example 3 showing the form of the mask jig used in example 3. Referring to fig. 10 to 12, a sample 11 of the mask jig 1 having the structure shown in fig. 10, a sample 12 of the mask jig 1 having the structure shown in fig. 11, and a sample 13 of the mask jig 1 having the structure shown in fig. 12 were prepared.

Specifically, each of the samples 11, 12, and 13 in fig. 10, 11, and 12 has substantially the same configuration as the mask jig 1 in fig. 2. That is, the 1 st through hole 11c of the main body 11 has both the columnar portion 11a and the inclined portion 11b, and the 2 nd through hole 12a of the mask cover 12 extends in a direction orthogonal to the 1 st surface 11s1 (see fig. 2) and the like. The diameter of the columnar portion 11a was set to 2mm, and the maximum diameter of the inclined portion 11b was set to 6mm. The thickness of the mask 12 was set to 1.5mm. The main body 11 is made of copper, and the mask 12 is made of polyamide imide.

For the samples 11, 12, 13 of fig. 10, 11, 12, the samples of the mask jig 1 were prepared in which the diameter of the 2 nd through hole 12a was different for each sample. Specifically, in the sample 11 of fig. 10, the diameter of the 2 nd through hole 12a is the largest and is sufficiently larger than the largest diameter of the inclined portion 11b. In the sample 12 of fig. 11, the diameter of the 2 nd through hole 12a is slightly smaller than the maximum diameter of the inclined portion 11b but sufficiently larger than the minimum diameter of the inclined portion 11b. Specifically, in the sample 12 of fig. 11, the diameter of the 2 nd through hole 12a is set to 5mm. In sample 13 of fig. 12, the diameter of the 2 nd through hole 12a is set to be the same as the minimum diameter of the inclined portion 11b. Specifically, in sample 13 of fig. 12, the diameter of the 2 nd through hole 12a was set to 2mm. That is, fig. 11 is similar to fig. 5 or 6, and fig. 12 is similar to fig. 7. Fig. 10 is not similar to any of fig. 3 to 7.

< film Forming treatment >

Using the above-described samples 11 to 13, a film was formed on the surface of the substrate by a cold spray method. As a film-forming raw material, a powder formed of aluminum is used. The aluminum powder was spherical in shape and 10 μm in diameter. The material of the base material 20 was set to stainless steel (SUS 304). The shape and size of the base material 20 were the same as those of example 1.

As film forming conditions, dry air was used as a working gas, the temperature of the working gas was 270 ℃, the flow rate of the working gas was 400 liters/min, and the pressure of the working gas was about 0.7MPa. The nozzle width was set to 5mm. The scanning speed was set to 5 mm/sec. The dimensions of the film formation range were set to 5mm wide by 30mm long. In each sample, a region in which the film forming raw material was sprayed only 1 time was formed in the film forming range.

After forming a film on the surface of the substrate using each of the samples 11 to 13 under the above conditions, the weight (adhesion amount) of the film forming raw material adhering to the surface was measured and observed on the inner wall of the inclined portion 11b of the main body portion 11 of each of the samples 11 to 13.

< result >

Adhesion amount at the inner wall of the inclined portion 11b of each sample:

fig. 13 is a photograph of the adhesion pattern of the film forming raw material at the inner wall of the inclined portion formed on the main body portion of the sample 11 of example 3 as viewed from above. Fig. 14 is a photograph of the adhesion pattern of the film forming raw material at the inner wall of the inclined portion formed on the main body portion of the sample 12 of example 3 as viewed from above. Fig. 15 is a photograph of the adhesion pattern of the film forming raw material at the inner wall of the inclined portion formed on the main body portion of the sample 13 of example 3 as viewed from above. Referring to fig. 13 to 15, the amount of the sample 11 attached was 80mg. In contrast, the samples 12 and 13 were not attached. As a result, the mask jig of the present disclosure (particularly, the mask jig having the through holes having the dimensions as shown in fig. 5 and 7) can reduce the amount of deposition of the film forming raw material.

The presently disclosed embodiments are considered in all respects to be illustrative and not restrictive. At least two of the embodiments disclosed herein may be combined within a range that does not contradict each other. The basic scope of the disclosure is indicated not by the description above, but by the claims, which are intended to include all changes that come within the meaning and range of equivalency of the claims.

Description of the reference numerals

1. A mask jig; 2. a spray gun; 2a, a spray gun main body part; 2b, a nozzle; 2c, a heater; 3. a powder supply unit; 4. a gas supply unit; 5. 6, piping; 7. a valve; 8. a pressure sensor; 9. a temperature sensor; 10. a powder; 11. a main body portion; 11a, a columnar portion; 11as, 1 st central axis; 11b, 11b1, 11b2, 12a1, 12a2, inclined portions; 11c, the 1 st through hole; 11s1, 1 st side; 11s2, 2 nd side; 12. a mask cover; 12a, the 2 nd through hole; 12as, 2 nd central axis; 12R, curved surface; 12s1, 3 rd surface; 12s2, 4 th side; 13. a screw hole is formed; 20. a substrate; 21. a base jig; 22. a groove portion; 100. a film forming device.

Claims

1. A mask jig is used in a sputtering method, wherein,

the mask jig includes:

a main body portion including a1 st surface and a2 nd surface located on a side opposite to the 1 st surface; and

a mask cover which is arranged on the 2 nd surface side of the main body part in a mode of overlapping with the main body part and comprises a 3 rd surface and a 4 th surface positioned on the opposite side of the 3 rd surface,

the mask is formed of an imide resin.

2. The mask jig of claim 1, wherein,

the body portion is formed with a1 st through hole extending from the 1 st surface to the 2 nd surface,

a2 nd through hole extending from the 3 rd surface to the 4 th surface is formed in the mask,

the diameter of the 2 nd through hole is equal to or larger than the diameter of the 1 st through hole.

3. The mask jig of claim 2, wherein,

the diameter of the 2 nd through hole is larger than the diameter of the 1 st through hole.

4. The mask jig of claim 1, wherein,

the inner wall of the 1 st through hole extends in a direction inclined with respect to a direction orthogonal to the 1 st surface and the 2 nd surface,

the diameter of the 2 nd through hole is not less than the minimum diameter of the 1 st through hole and not more than the maximum diameter of the 1 st through hole.

5. The mask jig of claim 4, wherein,

the minimum angle between the inner wall and the 1 st and 2 nd surfaces is 30-60 deg.

6. The mask jig according to any one of claims 1 to 5, wherein,

the thickness of the mask is more than 0.5mm and less than 2.0 mm.

7. A film-forming method, wherein,

the film forming method comprising the step of disposing the mask jig according to claim 1 so as to face the surface of the substrate,

in the disposing step, the mask jig is disposed so that the 1 st surface of the mask jig faces the surface of the substrate,

the film forming method further includes a step of blowing powder as a film forming raw material onto the surface of the substrate by cold spray through the 1 st through hole and the 2 nd through hole of the mask jig.

8. A film forming apparatus, wherein,

the film forming apparatus includes:

a spray gun comprising a nozzle;

a powder supply unit that supplies powder as a film-forming raw material to the spray gun;

a gas supply unit that supplies a working gas to the spray gun; and

the mask jig of claim 1, disposed between a substrate and a spray gun.