CN117201897A - Photosensitive assembly and camera device thereof - Google Patents

Abstract

The present application provides a photosensitive assembly, comprising: the device comprises a first circuit board, a second circuit board, a photosensitive chip, a molded body and a radio frequency connector, wherein the molded body comprises a first molded body, a second molded body and a third molded body, the first molded body, the second molded body and the third molded body can be coated on the first surface and the second surface of the first circuit board, the third surface and the fourth surface of the second circuit board and the non-photosensitive area of the photosensitive chip, and the radio frequency connector is semi-exposed on the second molded body. The application also provides a corresponding image pickup device and a manufacturing method of the multi-layer circuit board molding.

Description

Photosensitive assembly and camera device thereof

Technical Field

The present disclosure relates to imaging devices, and particularly to an imaging device with a molded package.

Background

Along with the development of society and the improvement of human living standard, automobiles become basic consumer products, and meanwhile, the development is also towards the direction of intelligence, safety and individuation, wherein in the implementation process of safety, the combination of cameras and automobiles is more and more intimate, video images and sound in the whole running process of the automobiles can be recorded at any time, more scientific video and audio basis is provided for traffic accidents and positioning, and the guarantee is provided for property and personal safety.

The camera in the car is applied to 360 panoramic images, driving record monitoring, electronic rearview mirrors, identity recognition, auxiliary safe driving, fatigue driving monitoring and other directions, most of cars are equipped with a driving recorder at present, the most important part of the driving recorder is the camera, and factors such as the definition of the images and the irradiation angle range are mainly considered when people select the camera, so that the reliability of the camera is also required greatly. The existing camera generally adopts front and rear shells, a PCB (printed circuit board), a wide-angle optical lens, a radio frequency connector, a radiator and the like, and the fixing among various components often needs screw structures and the like, so that the risks of screw chip stain and component failure are provided.

In actual use, after the camera installed on the vehicle runs on the automobile for a period of time, the phenomenon of picture shaking, blurring, tilting or no picture appears, so that a driver cannot view a blind area through the camera or cannot use the camera to shoot pictures and the like. Through multiple tests, the reason for the offset is that the wide-angle optical lens of the camera and the focusing of the photosensitive chip are offset due to vibration generated in the long-time running process of the vehicle, and the reason for the offset is that a certain gap exists between the internal circuit board and the shell when the camera is assembled, so that the circuit board and the shell are loose and offset in the long-time vibration or shaking process. In addition, in the camera assembly process, due to the fact that the number of components is large, too high assembly errors often occur, and then the quality of the camera is affected.

In order to solve the problems, the invention provides a molded and packaged image pickup device scheme, and the molded and packaged structure is adopted in the image pickup device to replace the original part of components, so that the exposure of the components is avoided, and meanwhile, the risk of stain is reduced. The above-described problems can be partially or mostly solved while improving the reliability of the image pickup apparatus.

Disclosure of Invention

Further objects and advantages of the present invention will become fully apparent from the following description and the accompanying drawings.

The invention provides an imaging device with a molding packaging structure, wherein the transverse area of a circuit board and a shell of the imaging device in the prior art occupy a certain space, and the circuit board and the shell are easy to loosen in the movement process to cause certain offset, so that the imaging of the imaging device is influenced to a certain extent. How to improve the imaging quality of the imaging device and simultaneously greatly improve the reliability of the imaging device and ensure the miniaturization of the whole structure is one of the problems which are urgently needed to be solved at present.

In order to improve the reliability and imaging quality of the camera device, the invention adopts the molded body to enhance the strength and flatness of the camera device, replaces the structures of front and rear shells, heat radiation bodies, screws and the like of cameras in the prior art, effectively solves the technical difficulties, avoids exposing the components by fully or semi-coating the components by the molded structure, reduces the stain risk, and ensures the miniaturization of the integral structure while improving the reliability and imaging quality of the camera device.

An object of the present invention is to provide an image pickup apparatus that uses a molding package instead of a lens holder or a bracket to provide an installation area for an optical lens and to save a height space.

Another object of the present invention is to provide an image pickup apparatus, in which the internal components are fully or semi-encapsulated by molding, so as to avoid exposure of the components and reduce the risk of failure of the components.

Another object of the present invention is to provide an imaging device, in which a molding structure is disposed on a first surface and a second surface of a circuit board, so as to improve attachment accuracy and compensate for attachment accuracy errors caused by unevenness of the circuit board itself.

Another object of the present invention is to provide an imaging device, in which a molded body formed by a molding process is provided with a certain height, so that a sufficient space is reserved for a circuit injection molded therein, and the stability of circuit conduction is ensured.

Another object of the present invention is to provide an image pickup apparatus, which uses a molding package structure to improve the structural strength of the image pickup apparatus, and prevent the circuit board from loosening and shifting during the vibration process, thereby affecting the quality of the image pickup apparatus.

Another object of the present invention is to provide an image pickup apparatus, which maximally balances the warpage of a circuit board caused by stress acting on the circuit board through a molding structure, changes the uncontrollable influence factor of unevenness and warpage, which are difficult to avoid when the circuit board is manufactured, on the imaging quality into a controllable one, and compensates the influence of the controllable influence factor on the imaging through active calibration and algorithm in the subsequent assembly process.

Another object of the present invention is to provide an image pickup apparatus, in which a molding structure is used to replace a screw for locking, so as to reduce the risk of dirt on the screw, and the screw has a complex process and poor waterproof effect.

Another object of the present invention is to provide an image pickup apparatus, which uses a molding structure instead of a heat sink structure, and has good heat dissipation performance due to the process characteristics of the molding itself, so as to improve the heat dissipation problem of the circuit board and the photosensitive chip.

Another object of the present invention is to provide an image pickup apparatus, in which a molding body disposed on a second surface of a circuit board can semi-cover a radio frequency connector, so that the radio frequency connector can be semi-exposed on a molding body.

Another object of the present invention is to provide an imaging device, in which an rf connector is disposed at a side deviating from an optical axis, so as to facilitate installation and meet the requirements of the imaging device.

In order to achieve the above object, the present invention provides an image pickup apparatus, wherein the image pickup apparatus includes a photosensitive member and an optical lens held on a photosensitive path of the photosensitive member. The photosensitive assembly includes: the imaging device comprises a first circuit board, a second circuit board, a photosensitive chip, a molded body and a radio frequency connector, wherein the molded body comprises a first molded body, a second molded body and a third molded body, the first molded body, the second molded body and the third molded body can be coated on the first surface and the second surface of the first circuit board, the third surface and the fourth surface of the second circuit board and the non-photosensitive area of the photosensitive chip, the radio frequency connector is semi-exposed on the second molded body, and the radio frequency connector is arranged on one side deviating from an optical axis and is convenient for the imaging device to install.

According to one aspect of the present invention, there is provided an image pickup apparatus comprising:

a photosensitive assembly;

an optical lens held on a photosensitive path of the photosensitive assembly;

wherein, sensitization subassembly includes:

a first circuit board having opposite first and second surfaces; at least one of the two surfaces of the first circuit board is provided with an electronic component;

a second circuit board having a third surface and a fourth surface opposite to each other; at least one of the two surfaces of the second circuit board is provided with an electronic component; the second surface of the first circuit board is opposite to the third surface of the second circuit board;

a photosensitive chip having opposite first and second surfaces, the first surface of the photosensitive chip having a photosensitive region and a non-photosensitive region located around the photosensitive region, wherein the second surface of the photosensitive chip is coupled to the first surface of the first circuit board;

and the molded body is integrally combined with the first circuit board and the second circuit board.

According to one embodiment of the present invention, the molded body includes a third molded body integrally bonded between the second surface of the first wiring board and the third surface of the second wiring board.

According to one embodiment of the present invention, the first circuit board and the second circuit board are stacked on two sides of the third molded body.

According to one embodiment of the present invention, the photosensitive assembly further includes a flexible electrical connection portion, and the first circuit board is electrically connected to the second circuit board through the flexible electrical connection portion.

According to one embodiment of the present invention, the flexible electrical connection unit is disposed at a center position of the first circuit board and the second circuit board, and the flexible electrical connection unit is connected to the second surface of the first circuit board and the third surface of the second circuit board.

According to one embodiment of the present invention, the photosensitive assembly further includes at least one electronic component coupled to the surface of the circuit board, and at least a portion of the at least one electronic component is encapsulated in the molding body.

According to one embodiment of the present invention, at least one electronic component is disposed on the second surface of the first circuit board or the third surface of the second circuit board, and the third molding body encapsulates the electronic component.

According to one embodiment of the present invention, the molded body includes a second molded body integrally bonded to a fourth surface of the second circuit board, and the photosensitive assembly further includes a radio frequency connector, wherein the radio frequency connector is semi-exposed from the second molded body.

According to one embodiment of the invention, the radio frequency connector comprises an outer conductor and a coaxial cable; the outer side of the outer conductor is in contact with the second molded body.

According to one embodiment of the invention, the second molding body is formed around the radio frequency connector, and the second molding body has a relief space for the radio frequency connector.

According to another aspect of the present invention, there is further provided a method for manufacturing a multilayer wiring board by molding, comprising the steps of:

providing an upper circuit board and a lower circuit board;

at least one surface of the upper circuit board and at least one surface of the lower circuit board are provided with electronic components;

and curing the insulating molding material to form a molded body on one surface of the lower circuit board, between the upper circuit board and the lower circuit board and one surface of the upper circuit board sequentially through the molding die.

According to one embodiment of the invention, the molded body coats the circuit layers on the surfaces of the upper circuit board and the lower circuit board, wherein the bonding pads of the circuit layers are exposed, and the molded body is provided with the avoidance space of the radio frequency connector.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the appended claims.

Drawings

Fig. 1 shows a schematic configuration of an image pickup apparatus of the related art.

Fig. 2 is a schematic diagram showing the overall structure of the image pickup apparatus in the present application.

FIG. 3 is an exploded view of an image pickup apparatus according to the present application

FIG. 4 is a schematic cross-sectional view showing an X-axis direction of an image pickup apparatus according to the present application

FIG. 5 is a schematic view showing a cross section in the X-axis direction of a photosensitive member in the present application

FIG. 6a shows a schematic front view of a first molded body according to the present application

FIG. 6b shows a schematic view of the back structure of the first molded body according to the present application

FIG. 7a is a schematic view showing the front structure of a second molded body according to the present application

FIG. 7b shows a schematic view of the back structure of a second molded body according to the present application

FIG. 7c is a schematic cross-sectional view showing the X-axis direction of the second molded body in the present application

Fig. 8 is a schematic diagram showing the overall structure of an image pickup apparatus having a multilayer wiring board in the present application

Fig. 9 is an exploded view showing an image pickup apparatus having a multilayer wiring board in the present application

FIG. 10 is a schematic sectional view showing an X-axis direction of an image pickup apparatus having a multilayer wiring board in the present application

FIG. 11 is a schematic view showing a cross section in the Y-axis direction of an image pickup apparatus having a multilayer wiring board in the present application

Fig. 12 is a schematic view showing the structure of a multilayer wiring board according to the present application

FIG. 13a is a schematic view showing a front exploded view of a multilayer wiring board according to the present application

FIG. 13b is a schematic view showing the back exploded view of the multilayer wiring board of the present application

Fig. 14a, 14b and 14c are schematic views showing a manufacturing process of a multilayer wiring board based on a molding process in the present application

The above and other objects, features and advantages of the present application will become more apparent by describing embodiments of the present application in more detail with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate the application and together with the embodiments of the application, and not constitute a limitation to the application. In the drawings, like reference numerals generally refer to like parts or steps.

Detailed Description

Hereinafter, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein.

In the description of the present application, it should be noted that, for the azimuth words such as terms "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the azimuth and positional relationships are based on the azimuth or positional relationships shown in the drawings, it is merely for convenience of describing the present application and simplifying the description, and it is not to be construed as limiting the specific scope of protection of the present application that the device or element referred to must have a specific azimuth configuration and operation.

It should be noted that the terms "first," "second," and the like in the description and in the claims are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

The terms "comprises" and "comprising," along with any variations thereof, in the description and claims, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

Summary of the application

As described above, in order to meet the increasingly wide market demands, high reliability, high heat dissipation, high strength, and small size are the irreversible development trend of the existing image pickup apparatuses. However, it is very difficult to realize four aspects of high reliability, high heat dissipation, high strength, and small size in the same image pickup apparatus.

In the existing camera device, the camera device generally comprises a shell, a PCB board, a wide-angle optical lens, a rear cover radio frequency connector, a radiator and the like; fig. 1 illustrates a schematic structural view of a conventional camera device in which a PCB board 1 is positioned inside a case by fasteners; the shell comprises a camera front shell 4 and a camera rear shell 5; a sealing ring 6 is arranged between the front camera shell 4 and the rear camera shell 5, and the front camera shell 4 is provided with a wide-angle optical lens 2 electrically connected with the PCB 1; the camera rear shell 5 is connected with a rear cover radio frequency connector 3 electrically connected with the PCB 1; a waterproof sealing ring and a water-absorbing expansion joint are arranged between the rear cover radio frequency connector 3 and the camera rear shell 5; the center of the wide-angle optical lens 2 coincides with the center of the image sensor mounted on the PCB board 1, and the wide-angle optical lens 2 is hermetically connected with the camera front housing 4. The sealing ring 6 is arranged in a cavity formed by splicing the front camera shell 4 and the rear camera shell 5, and the sealing ring 6 is provided with a clamping piece matched with a notch on the rear camera shell 5. In addition, the upper and lower ends of camera procapsid 4 are provided with the mounting groove, install the equipment screw in the inboard of mounting groove, and the top of camera procapsid 4 sets up a radiator, and the radiator assembles the concatenation with camera procapsid 4 and camera rear housing 5, and the rethread equipment screw is fixed through four mounting grooves, forms camera's casing.

The rear cover radio frequency connector generally comprises a plastic shell, an outer conductor and a crimping sleeve, and is generally matched with a coaxial cable, wherein the coaxial cable comprises a sheath, a central conductor, a shielding layer and an insulating layer, the central conductor is used as a main signal path, the insulating layer is coated on the outer side of the central conductor, and the shielding layer is coated on the outer side of the insulating layer for grounding; the insulating layer isolates the shielding layer from the central conductor while imparting impedance characteristics to the cable; the outside cladding of shielding layer is a sheath for the shielding layer is insulating with the center conductor, has played the effect of protection cable simultaneously. One end of the central conductor is inserted into the groove of the outer conductor, so that the central conductor and the outer conductor are fixed, the outer sides of the central conductor and the outer conductor are provided with a crimping sleeve, the inner side of the crimping sleeve is provided with a cavity for accommodating the central conductor and the outer conductor, the outer side wall is provided with threads, the installation and the fixation of the central conductor and the outer conductor are facilitated, and the outer side of the crimping sleeve is provided with a plastic shell, so that the protection effect on the internal element is achieved.

Having described the basic structure of the image pickup apparatus, various non-limiting embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Schematic image pickup apparatus

As shown in fig. 2, an image pickup apparatus 10 according to an embodiment of the present application is illustrated, which includes a photosensitive member 20 and an optical lens 30 held on a photosensitive path of the photosensitive member 20. Referring to fig. 3 and 4, in an embodiment of the present application, the optical lens 30 includes at least one optical lens 32 for collecting imaging light from the object and transmitting the imaging light to the photosensitive assembly 20. The photosensitive assembly 20 includes a circuit board 21, a photosensitive chip 22 electrically connected to the circuit board 21, a filter element 23 held on a photosensitive path of the photosensitive chip 22, at least one electronic component 24 electrically connected to the circuit board 21, and a radio frequency connector 25 electrically connected to the circuit board 21, wherein the photosensitive assembly 20 is configured to receive light passing through the optical lens 30 to form a photographed image.

Accordingly, fig. 5 shows a schematic cross-sectional view of the X-axis direction of the photosensitive assembly in one embodiment of the present application. It should be noted that, the direction perpendicular to the optical axis direction and the central axis of the rf connector 25 is not coincident with the optical axis is the X-axis direction; the direction perpendicular to the optical axis direction and the direction in which the central axis of the rf connector 25 coincides with the optical axis is the Y-axis direction. Referring to fig. 5, in the embodiment of the present application, the circuit board 21 has a set of opposite upper and lower surfaces, i.e., a first surface 211 and a second surface 212. The first surface 211 of the circuit board 21 is disposed toward the optical lens 30. The photo-sensing chip 22 has a set of opposite upper and lower surfaces, i.e., a first surface 221 and a second surface 222. Wherein the first surface 221 of the photosensitive chip 22 has a photosensitive region 223 and a non-photosensitive region 224 surrounding the photosensitive region 223. In a specific example, the photosensitive region 223 is located in a central region of the first surface 221 of the photosensitive chip 22, and the non-photosensitive region 224 is disposed around the photosensitive region 223. In the embodiment of the present application, the photosensitive chip 22 is mounted on and electrically connected to the circuit board 21, and the second surface 222 of the photosensitive chip 22 is stacked on the first surface 211 of the circuit board 21, or the second surface 222 of the photosensitive chip 22 is disposed opposite to the first surface 211 of the circuit board 21.

Further, with continued reference to fig. 3, 4 and 5, in an embodiment of the present application, the photosensitive assembly 20 further includes a molding body 26 integrally formed on the surface of the circuit board 21 through a molding process. The first surface 211 and the second surface 212 of the circuit board 21 are each provided with a molding body 26, and accordingly, in a specific example of the present application, the molding body 26 includes a first molding body 261 and a second molding body 262, that is, the first molding body 261 is located at the first surface 211 of the circuit board 21, and the second molding body 262 is located at the second surface 212 of the circuit board 21, it should be noted that, in the embodiment of the present application, the photosensitive assembly 20 further includes at least one electronic component 24 (including but not limited to a resistor, a capacitor, an inductor, etc.) electrically connected to the surface of the circuit board 21, and the electronic component 24 may be attached to an edge area of the surface of the circuit board 21 and spaced from the photosensitive chip 22 by a certain distance, where at least a portion of the at least one electronic component 24 is covered by the first molding body 261 or the second molding body 262. For example, in some embodiments of the present application, the at least one electronic component 24 is disposed on the first surface 211 of the circuit board 21, and the at least one electronic component 24 is covered by the first molding 261 which is also formed on the first surface 211 of the circuit board 21.

Accordingly, fig. 6a and 6b show schematic structural views of the first molded body, wherein fig. 6a shows schematic structural views of the front side of the first molded body in one embodiment of the present application, and fig. 6b shows schematic structural views of the back side of the first molded body of fig. 6 a. It should be noted that, the surface facing the optical lens is a front surface structure, and the surface far away from the optical lens is a back surface structure. Referring to fig. 6a and 6b, in the embodiment of the present application, a surface of the first molded body 261 in contact with the first surface 211 of the circuit board 21 is a bottom surface 2611 of the first molded body 261, and a surface of the first molded body 261 away from and parallel to the first surface of the circuit board 21 is a top surface 2612 of the first molded body 261. The bottom surface 2611 of the first molded body 261 has a through hole structure, wherein the bottom surface 2611 of the first molded body 261 has an inner bottom side 26111 and an outer bottom side 26112. The inner bottom edge 26111 of the first molded body 261 is positioned outside the photosensitive area 223 of the photosensitive chip 22; the outer bottom edge 26112 of the first molded body 261 is located outside the outer edge of the wiring board 21, preferably flush with the outer edge of the wiring board 21. The distance from the top surface 2612 of the first molded body 261 to the first surface 211 of the circuit board 21 is greater than the height of the electronic component 24, so that the first molded body 261 completely covers the electronic component 24 after molding, and the first molded body protects the electronic component 24 from falling off and being damaged by external force.

Accordingly, fig. 7a, 7b and 7c show schematic structural views of the second molded body, wherein fig. 7a shows a schematic front structural view of the second molded body in one embodiment of the present application, fig. 7b shows a schematic rear structural view of the second molded body of fig. 7a, and fig. 7c shows a schematic sectional view of the second molded body of fig. 7a in the X-axis direction. Referring to fig. 7a, 7b and 7c, in the embodiment of the present application, the surface of the second molded body 262 contacting the second surface 212 of the circuit board 21 is a bottom surface 2621 of the second molded body 262, and the surface of the second molded body 262 away from and parallel to the second surface 212 of the circuit board 21 is a top surface 2622 of the second molded body 262. The top surface 2622 and the bottom surface 2621 of the second molded body 262 have a relief space 2623, and the relief space 2623 is offset from the central area of the second molded body 262 and can accommodate the size of the rf connector 25; the bottom surface 2621 of the second molded body 262 has an inner bottom edge 26211 and an outer bottom edge 26112, and the top surface 2622 of the second molded body 262 has an inner top edge 2621 and an outer top edge 2622. The inner bottom edge 26211 and the inner top edge 2621 of the second molding body 262 are located outside the rf connector 25, and the outer bottom edge 26212 and the outer top edge 2622 of the second molding body 262 are flush with the outer bottom edge 26112 of the first molding body 261 in a projection direction, that is, the bottom surface 2611 of the first molding body 261 and the bottom surface 2621 of the second molding body 262 have the same shape and overlap in a projection position in an optical axis direction, so that the second molding body 262 balances the warpage of the circuit board caused by stress acting on the circuit board 21 by the first molding body 261 to the maximum extent, and it is understood that the bottom surface 2611 of the first molding body 261 and the bottom surface 2621 of the second molding body 262 may not overlap in the projection direction and have different area sizes.

Further, the outer side edge 26112 of the bottom surface 2611 of the first molded body 261 and the outer side edge 2621 of the bottom surface 2621 of the second molded body 262 are flush with the outer side edge of the circuit board 21, the outer side edge 26112 of the bottom surface 2611 of the first molded body 261 serves as the runner inlet and the runner outlet of the first molded body 261, and the outer side edge 26212 of the bottom surface 2621 of the second molded body 262 serves as the runner inlet and the runner outlet of the second molded body 262, thereby ensuring that the entire molded body 26 is filled.

Still further, in the embodiment of the present application, the photosensitive assembly 20 further includes a filter element 23, as shown in fig. 4, preferably, the filter element 23 is attached below the optical lens 30, and the filter element 23 is connected to the lower surface of the optical lens 30 through an adhesive, and the filter element 23 is maintained on the photosensitive path of the photosensitive assembly 20, so that the incident light can reach the photosensitive chip 22 after being filtered by the filter element 23. Alternatively, the filter element 23 is disposed on the first surface 221 of the photosensitive chip 22, for example, the filter element 23 is implemented as a filter film coated on the first surface 221 of the photosensitive chip 22. It should be noted that the filter element 23 can also be directly attached to the top surface 2612 inside the first molded body 261, and the first molded body 261 can replace the filter element holder in the prior art, further reducing the overall height of the image pickup device 10.

Accordingly, with continued reference to fig. 4, in the embodiment of the present application, the optical lens 30 is a lens group, and includes a lens barrel 31 and one or more optical lenses 32 disposed therein. The optical lens 30 is disposed above the photosensitive assembly 20, wherein at least one optical lens 32 is disposed inside the lens barrel 31, and the lens barrel 31 surrounds the outer side of the optical lens 32; the first molding body 261 is provided under the optical lens 30, the optical lens 30 can be directly attached to the top surface 2612 of the first molding body 261, and the optical lens 30 and the first molding body 261 are connected by an adhesive to be held on the photosensitive path of the photosensitive assembly 20.

In some embodiments of the present application, as shown in fig. 6a and 6b, the first molded body 261 can further replace a lens holder or a lens bracket in the existing image capturing device to provide a mounting carrier for the optical lens 30. Accordingly, when the optical lens 30 is mounted on the first molded body 261, the lateral avoidance distance and the longitudinal avoidance distance between the originally reserved lens holder and the electronic component 24 are eliminated compared with a general image pickup apparatus, and therefore, the cross-sectional dimensions of the image pickup apparatus 10 and the photosensitive assembly 20 thereof can be further reduced, and the height dimensions of the image pickup apparatus 10 and the photosensitive assembly 20 thereof can be further reduced. Because of the process characteristics of the molding process, the surface of the molded structure has very high flatness, and in view of quantization, in the embodiment of the present application, the top surface 2612 of the first molded body 261 may have flatness of rz=5um, and the flatness RZ of the circuit board 21 is typically 20um, so that the attaching precision error caused by the unevenness of the circuit board 21 itself can be further compensated by mounting the optical lens 30 on the first molded body 261, so that the optical lens 30 will not deviate, and the imaging quality of the optical lens 30 is ensured.

It should be noted that, in the molding process, the molding mold acts on the circuit board panels formed by assembling a plurality of circuit boards, and the single circuit board and the molded integrated assembly are formed by integrally injection molding and then cutting, so that at least two sides of the molded body 26 are flush with the outer edge of the circuit board 21. And because of the process characteristics of the molding process, the top surface 2622 of the second molded body 262 has quite high flatness, the second molded body 262 further compensates the assembly precision error caused by the unevenness of the circuit board 21, and changes the uncontrollable influencing factor of the unevenness and the warpage, which are difficult to avoid when the circuit board 21 is manufactured, on the imaging quality into controllable, and compensates the influence of the controllable influencing factor, such as field curvature, on the imaging by active calibration and algorithm in the subsequent assembly process. After the molding process is completed, the first molding body 261 and the second molding body 262 together generate an acting force on the circuit board 21, so as to improve the overall flatness of the circuit board 21. After other processes such as welding the photosensitive chip 22 and attaching the optical lens 30, the accumulated error value can be effectively minimized.

Accordingly, in the embodiment of the present application, the first molding body 261 can replace the front camera housing of the image pickup device in the prior art, so that the thickness dimension of the image pickup device 10 can be reduced, and the miniaturized design of the structure can be realized; on the one hand, due to the process characteristics of the molding process, the first molded body 261 has very high strength, so that the front shell of the camera is prevented from loosening and shifting in the moving process, and the reliability risk point is reduced; on the other hand, the first molded body 261 has a smaller weight than the camera front case, thereby reducing the weight of the image pickup apparatus 10.

Accordingly, with continued reference to fig. 7a, 7b and 7c, in the embodiment of the present application, the inner side of the second molded body 262 is attached to the radio frequency connector 25, and further, the height of the second molded body 262 is slightly smaller than the height of the radio frequency connector 25, so that the radio frequency connector 25 can be semi-exposed out of the second molded body 262; the radio frequency connector 25 is located at one side of the second molded body 262, that is, the radio frequency connector 25 is eccentrically disposed at the circuit board 21 and/or the second molded body 262, so that the image pickup device 10 is easily mounted to a car machine or an external connection device; the second molded body 262 can replace the rear camera housing of the prior art camera device, reduce the thickness of the camera device 10, realize a miniaturized design, and protect the rf connector 25.

In addition, as shown in fig. 4, the second molding body 262 can replace the molding shell and the crimp sleeve in the rf connector 25 to reduce the mounting error between components, the rf connector 25 includes an outer conductor 251 and a coaxial cable 252, wherein the coaxial cable 252 includes a central conductor 2521, the central conductor 2521 is used as a main signal path, an insulating layer is coated on the outer side of the central conductor 2521, and a shielding layer is coated on the outer side of the insulating layer for grounding; the insulating layer isolates the shielding layer from the center conductor 2521 while imparting impedance characteristics to the cable; the outside of the shield layer is covered with a sheath so that the shield layer is insulated from the center conductor 2521 and also serves to protect the cable. Wherein the outer conductor 251 has a recess 2511, such that one end of the center conductor 2521 is received in the recess 2511 of the outer conductor 251 to facilitate the fixation thereof; based on this, one end of the outer conductor 251 is fixed to the circuit board 21, and the other end is fixed to the center conductor 2521, so that the radio frequency connector 25 and the circuit board 21 can be electrically connected. The second molded body 262 can cover the outer conductor 251 and the coaxial cable 252 in the rf connector 25, thereby protecting the internal components. The radio frequency connector 25 and the second molding body 262 may further have a glue layer therebetween, and after the installation, the glue layer is cured to form a sealing protection structure for isolating dust and preventing the circuit board 21 main body and the photosensitive chip 22 above the glue layer from being polluted. Optionally, the rf connector 25 may be further located at the center of the second molding body 262 to form an rf coaxial connector, where the center of the rf connector 25 is on the same optical axis as the photosensitive chip 22 and the optical lens 30, so as to enhance the structural strength of the image capturing device 10.

It should be noted that, in the use process of the image capturing apparatus 10, a heating situation often occurs, which causes a problem of discomfort in hand touch, and the first surface 211 and the second surface 212 of the circuit board 21 are both provided with electronic components 24, and the photosensitive chip 22 needs to dissipate heat in time when in a working state, so that the heat conduction problem of the image capturing apparatus 10 is more remarkable, otherwise, a certain failure risk is caused, and the image capturing apparatus 10 is usually provided with a heat dissipation body, so that the problem that each component cannot be normally used due to the excessively high temperature of the image capturing apparatus 10 is prevented, and the service life of the image capturing apparatus 10 is further prolonged; the radiator is arranged at the second surface 212 of the circuit board 21, and the radiator is usually fixed by a screw structure, but the process of the screw is complex, and meanwhile, the requirement on precision is high, and the waterproof effect is poor; due to the process characteristics of the molding, the heat dissipation performance is good, and the heat dissipation problem of the circuit board 21 and the photosensitive chip 22 can be improved. The second molded body 262 can replace the heat radiating body and the screw structure, so that the waterproof effect of the camera device 10 can be enhanced while ensuring that each component can radiate heat in time.

It should be noted that, when the automobile travels for a long time, the vibration generated in this process may cause a certain deviation of focusing of the optical lens 30 and the photosensitive chip 22 of the image pickup device 10, and the reason for the deviation is often that when the image pickup device 10 is assembled, a certain gap exists between the inner circuit board 21 and the housing, so that the circuit board 21 and the housing are caused by loosening and deviation in the process of vibrating or shaking for a long time. In addition, in the camera assembly process, due to the fact that the number of components is large, too high assembly errors often occur, and then the quality of the camera is affected. The first molding body 261 and the second molding body 262 can replace the front housing and the rear housing of the camera in the prior art, and due to the process characteristics of molding, the front housing and the rear housing have quite high strength and hardness, and the structural strength of the camera device 10 can be improved, so the first molding body 261 and the second molding body 262 can play a role in protecting various components, and the first molding body 261 and the second molding body 262 can completely cover the components inside the camera device 10, so that the camera device 10 is prevented from loosening and shifting in the process of vibrating or shaking for a long time, the focusing performance of the optical lens 30 and the photosensitive chip 22 is more accurate, the shifting is avoided, and the imaging quality of the camera device 10 is further improved.

In another embodiment of the present application, a CSP chip package (i.e., a chip scale package) is used, and the photo-sensing chip 22 has a pair of opposing surfaces, i.e., a first surface 221 and a second surface 222. The first surface 221 of the photosensitive chip 22 is disposed toward the optical lens 30. The second surface 222 of the photosensitive chip 22 is fixed to the first surface 211 of the circuit board 21, preferably by soldering, bonding on the second surface 222 of the photosensitive chip 22, and encapsulating by molding. The electronic component 24 may be located beside the outer edge of the photosensitive chip 22, and the molded CSP chip can improve the overall flatness of the CSP chip after soldering with the circuit board 21.

In another embodiment of the present application, a stacked circuit board molding method is adopted, and since the electronic components 24 inside the image pickup device 10 are numerous, occupy a large space, and all need to be connected with the main body of the circuit board 21, in order to meet the performance of each component, the main body of the circuit board 21 is often designed to have a large size and a long lateral length, which are not consistent with the reliability and the miniaturization design of the image pickup device 10, thus providing a molded and packaged image pickup device 10 with a multi-layer circuit board stack.

Accordingly, the circuit board 21 is provided in multiple layers, in this embodiment, as shown in fig. 8, the circuit board 21 further includes a first circuit board 27 and a second circuit board 28, the circuit board near one end of the optical lens 30 is the first circuit board 27, and the circuit board near one end of the radio frequency connector 25 is the second circuit board 28; accordingly, fig. 13a and 13b show exploded views of the structure of the multilayer wiring board, wherein fig. 13a shows an exploded view of the front structure of the multilayer wiring board in one embodiment of the present application, and fig. 13b shows an exploded view of the back structure of the multilayer wiring board of fig. 13 a. Referring to fig. 13a and 13b, the first circuit board 27 has a set of opposite surfaces, i.e., a first surface 271 and a second surface 272. The first surface 271 of the first circuit board 27 is disposed toward the optical lens 30; the second circuit board 28 has a set of opposite surfaces, namely a third surface 281 and a fourth surface 282. The third surface 281 of the second circuit board 28 is disposed toward the optical lens 30; the first surface 271 of the first circuit board 27 is fixedly connected to the photosensitive chip 22, as shown in fig. 9, and a flexible electrical connection portion 29 is disposed between the first circuit board 27 and the second circuit board 28. Further, fig. 11 is a schematic sectional view of an image pickup apparatus having a multilayer wiring board in the Y-axis direction in one embodiment of the present application. Referring to fig. 9 and 11, the flexible electrical connection unit 29 is connected to the second surface 272 of the first circuit board 27 and the third surface 281 of the second circuit board 28, and the flexible electrical connection unit 29 is located at the center of the first circuit board 27 and the second circuit board 28, so that the first circuit board 27, the flexible electrical connection unit 29 and the second circuit board 28 form a sandwich-like structure; the fourth surface 282 of the second circuit board 28 is fixedly connected with the radio frequency connector 25, and the electronic components 24 are distributed on the first surface 271 and the second surface 272 of the first circuit board 27 and the third surface 281 and the fourth surface 282 of the second circuit board 28, so that each electronic component 24 can be reasonably distributed in the internal space of the image pickup device 10, and on the other hand, the transverse dimension of the image pickup device 10 can be reduced, and the miniaturized design of the image pickup device 10 is realized.

Further, fig. 10 shows a schematic cross-sectional view in the X-axis direction of an image pickup apparatus having a multilayer wiring board in one embodiment of the present application. The upper side of the first surface 271 of the first circuit board 27, the space between the first circuit board 27 and the second circuit board 28, and the lower side of the fourth surface 282 of the second circuit board 28 are molded, wherein the upper side region of the first surface 271 of the first circuit board 27 has a first molded body 261, the lower side region of the fourth surface 282 of the second circuit board 28 has a second molded body 262, and the lower side region of the second surface 272 of the first circuit board 27 and the upper side region of the third surface 281 of the second circuit board 28 have a third molded body 263, as shown in fig. 12. Each formed molded body is integrally combined with the first circuit board 27 and the second circuit board 28, and each formed molded body has an avoidance space for other components, so that the image pickup device 10 has higher reliability, the first circuit board 27 and the second circuit board 28 are stacked and arranged on the third molded body 263, so that the image pickup device 10 has no stress risk, and reliability risk points of the image pickup device 10 are reduced.

It should be noted that the flexible electrical connection unit 29 is disposed at the central positions of the first circuit board 27 and the second circuit board 28, that is, the flexible electrical connection unit 29 is covered by the third molded body 263, and the flexible electrical connection unit 29 disposed at the central position can reasonably utilize the internal space, so as to avoid increasing the lateral dimension of the image capturing apparatus 10.

Specifically, the manufacturing process of the multilayer wiring board based on the molding process is as follows:

fig. 14a, 14b and 14c are schematic views showing a manufacturing process of a multilayer wiring board based on a molding process. First, an SMT (surface mount technology) process is performed on the fourth surface 282 of the second circuit board 28, that is, the electronic component 24 is mounted on the fourth surface 282 of the second circuit board 28, and the electronic component 24 is fixed to and electrically connected with the second circuit board 28.

Referring to fig. 14a, 14b and 14c, the molding die 40 includes a first molding die 41, a second molding die 42 and a third molding die 43. The second molding body 262 is formed on the fourth surface 282 of the second circuit board 28 by curing the insulating molding material through the first molding die 41, wherein the second molding body 262 encapsulates the conductive traces of the trace layer on the fourth surface 282 of the second circuit board 28.

Further, an SMT (surface mount technology) process is performed on the third surface 281 of the second circuit board 28, that is, the electronic component 24 is mounted on the third surface 281 of the second circuit board 28, and the electronic component 24 is fixed to and electrically connected with the second circuit board 28. Further, an SMT (surface mount technology) is performed on the second surface 272 of the first circuit board 27, that is, the electronic component 24 is mounted on the second surface 272 of the first circuit board 27, the electronic component 24 is fixed to and electrically connected with the first circuit board 27, so that the first circuit board 27 and the second circuit board 28 are electrically connected, and the connection mode includes, but is not limited to, setting a flexible electrical connection portion 29 for connection, preferably, adopting a flexible connection mode, the influence of a conductive connection medium between the first circuit board 27 and the second circuit board 28 can be improved, and then the gap between the two can be adjusted, and meanwhile, the height of different electronic components 24 and the height of the molded body 26 can be adapted to meet the overall strength.

Further, the second molding die 42 is abutted against the second surface 272 of the first circuit board 27, so that the second molding die 42 can be supported on the first circuit board 27, the molding process is facilitated in the space formed between the second surface 272 of the first circuit board 27 and the third surface 281 of the second circuit board 28, and the second molding die 42 has molding runners, thereby ensuring the circulation of molding.

Referring to fig. 14a and 14b, a space formed between the second surface 272 of the first circuit board 27 and the third surface 281 of the second circuit board 28 by the second molding die 42 is cured by an insulating molding material to form a third molded body 263, wherein the third molded body 263 covers the flexible electrical connection portion 29, and the third molded body 263 covers the conductive circuit of the circuit layer of the second surface 272 of the first circuit board 27 and the conductive circuit of the circuit layer of the third surface 281 of the second circuit board 28.

Further, an SMT (surface mount technology) process is performed on the first surface 271 of the first circuit board 27, that is, the electronic component 24 is mounted on the first surface 271 of the first circuit board 27, and the electronic component 24 is fixed to and electrically connected with the first circuit board 27.

Referring to fig. 14c, a first molding body 261 is formed on the first surface 271 of the first circuit board 27 by curing an insulating molding material through the third molding die 43, wherein the first molding body 261 encapsulates the conductive traces of the trace layer on the first surface 271 of the first circuit board 27, and the central portion of the first molding body 261 is in a hollow state so as to provide the photosensitive path of the photosensitive chip 22.

With continued reference to fig. 14c, finally, portions of the first wiring board 27 and the second wiring board 28 having edges larger than the first, second and third molded bodies 261, 262 and 263 are removed such that edges of the first, second, first, second and third molded bodies 27, 28, 261, 262 and 263 are flush.

Based on the multilayer circuit board with the molding process of this manufacturing process, a mounting manner of the image pickup device 10 is obtained: the first surface 271, the second surface 272 of the first circuit board 27, the third surface 281 and the fourth surface 282 of the second circuit board 28 are respectively molded in the bottom-to-top direction, and the insulating molding material is used for curing to form the first molded body 261, the second molded body 262 and the third molded body 263, so that the imaging device 10 can have higher reliability and more stable structure through the multi-molding process; after the molding process is completed, the optical lens 30 is attached, so that the optical lens 30 is free from the influence of high temperature, high pressure and the like caused in the molding process, and the deformation of the optical lens 30 is avoided.

The foregoing has outlined the basic principles, features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (13)

1. A photosensitive assembly, comprising:

a first circuit board having opposite first and second surfaces; at least one of the two surfaces of the first circuit board is provided with an electronic component;

a second circuit board having a third surface and a fourth surface opposite to each other; at least one of the two surfaces of the second circuit board is provided with an electronic component; the second surface of the first circuit board is opposite to the third surface of the second circuit board;

a photosensitive chip having opposite first and second surfaces, the first surface of the photosensitive chip having a photosensitive region and a non-photosensitive region located around the photosensitive region, wherein the second surface of the photosensitive chip is coupled to the first surface of the first circuit board;

and the molded body is integrally combined with the first circuit board and the second circuit board.

2. The photosensitive assembly of claim 1, wherein the molded body comprises a third molded body integrally bonded between the second surface of the first wiring board and the third surface of the second wiring board.

3. The photosensitive assembly of claim 2, wherein the first and second circuit boards are stacked on both sides of the third molded body.

4. The photosensitive assembly of claim 1, further comprising a flexible electrical connection, wherein the first circuit board is electrically connected to the second circuit board via the flexible electrical connection.

5. The photosensitive assembly of claim 4, wherein the flexible electrical connection section is disposed at a center position of the first and second circuit boards, and the flexible electrical connection section is connected to the second surface of the first circuit board and the third surface of the second circuit board.

6. The photosensitive assembly of claim 1, further comprising at least one electronic component coupled to a surface of the circuit board, at least a portion of the at least one electronic component being encapsulated within the molded body.

7. A photosensitive assembly according to claim 3, wherein at least one electronic component is disposed on the second surface of the first circuit board or the third surface of the second circuit board, and the third molding body encapsulates the electronic component.

8. The photosensitive assembly of claim 1, wherein the molded body comprises a second molded body integrally bonded to a fourth surface of the second circuit board, the photosensitive assembly further comprising a radio frequency connector, wherein the radio frequency connector is semi-exposed to the second molded body.

9. The photosensitive assembly of claim 8, wherein: the radio frequency connector comprises an outer conductor and a coaxial cable; the outer side of the outer conductor is in contact with the second molded body.

10. The photosensitive assembly of claim 8, wherein the second molding is formed circumferentially around the rf connector and the second molding has a relief space for the rf connector.

11. An image pickup apparatus comprising a photosensitive member as claimed in any one of claims 1 to 10 and an optical lens held on a photosensitive path of the photosensitive member.

12. A method of manufacturing a multilayer wiring board molding comprising the steps of:

providing an upper circuit board and a lower circuit board;

at least one surface of the upper circuit board and at least one surface of the lower circuit board are provided with electronic components;

and curing the insulating molding material to form a molded body on one surface of the lower circuit board, between the upper circuit board and the lower circuit board and one surface of the upper circuit board sequentially through the molding die.

13. The manufacturing method according to claim 12, wherein the molded body covers the upper circuit board and the circuit layer on the surface of the lower circuit board, wherein the pads of the circuit layer are exposed, and the molded body has a relief space for the radio frequency connector.