CN117193558A - Electronic equipment - Google Patents
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- CN117193558A CN117193558A CN202311153493.8A CN202311153493A CN117193558A CN 117193558 A CN117193558 A CN 117193558A CN 202311153493 A CN202311153493 A CN 202311153493A CN 117193558 A CN117193558 A CN 117193558A
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- Measuring Fluid Pressure (AREA)
Abstract
The application discloses electronic equipment, and belongs to the technical field of electronic products. The electronic device includes: the electronic equipment comprises a frame body and a pressure sensing module, wherein the pressure sensing module comprises a first sensing layer and a second sensing layer which are electrically connected, the first sensing layer is arranged on a first side of the frame body, the second sensing layer is arranged on a second side of the frame body, the first side and the second side are two opposite sides of the frame body, and the first side is one side of the frame body facing to a sensing surface of the electronic equipment; the first sensing layer and the second sensing layer deform and provide a pressure sensing signal when the first sensing layer is pressed.
Description
Technical Field
The application belongs to the technical field of electronic products, and particularly relates to electronic equipment.
Background
In the scheme of the under-screen pressure sensing module in the related art, a cantilever structure under the screen is generally adopted to realize the touch function of the screen. However, because the cantilever beam support is in point-to-surface contact with the screen of the whole machine, when the cantilever beam support is in contact with the screen, the screen is locally stressed, stamping is easy to generate, black clusters can be displayed on the screen when the screen is severe, and the display effect of the screen is affected. In addition, in order to ensure the structural strength of the cantilever beam bracket, the cantilever beam bracket is generally made of metal materials, so that the cantilever beam bracket needs a larger occupied space in the thickness direction of the whole structure.
Disclosure of Invention
The application aims to provide electronic equipment which can solve the problem of large occupied space of a pressure sensing module in the related technology.
In order to solve the technical problems, the application is realized as follows:
in a first aspect, an embodiment of the present application provides an electronic device, including: the electronic equipment comprises a frame body and a pressure sensing module, wherein the pressure sensing module comprises a first sensing layer and a second sensing layer which are electrically connected, the first sensing layer is arranged on a first side of the frame body, the second sensing layer is arranged on a second side of the frame body, the first side and the second side are two opposite sides of the frame body, and the first side is one side of the frame body facing to a sensing surface of the electronic equipment;
the first sensing layer and the second sensing layer deform and provide a pressure sensing signal when the first sensing layer is pressed.
In the embodiment of the application, the first side is the side of the frame body facing the sensing surface of the electronic device, that is, the first sensing layer is the sensing layer facing the sensing surface of the electronic device, and the second sensing layer is the sensing layer facing away from the sensing surface of the electronic device; therefore, after the first induction layer receives the pressing force, the pressing force can be transmitted to the second induction layer positioned on the second side of the frame body through the first induction layer and the frame body, so that the second induction layer can deform, and the electronic equipment can output corresponding pressure sensing signals based on deformation amounts of the first induction layer and the second induction layer, so that the pressing touch control function of the electronic equipment is realized. .
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 2 is a second schematic diagram of an electronic device according to an embodiment of the present application;
FIG. 3 is a third schematic diagram of an electronic device according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 to 4, an embodiment of the present application provides an electronic device, including a frame 10 and a pressure sensing module 20, where the pressure sensing module 20 includes a first sensing layer 21 and a second sensing layer 22 electrically connected, the first sensing layer 21 is disposed on a first side of the frame 10, the second sensing layer 22 is disposed on a second side of the frame 10, the first side and the second side are two-phase back sides of the frame 10, and the first side is a side of the frame 10 facing a sensing surface of the electronic device;
in the case of pressing the first sensing layer 21, the first sensing layer 21 and the second sensing layer 22 deform and provide a pressure sensing signal.
The frame 10 may be understood as a structure such as a frame or a middle frame of an electronic device; the frame may be understood as a side frame of the electronic device, and the middle frame may be understood as a frame structure of the electronic device for supporting devices such as a motherboard and a screen.
The above-mentioned providing of the pressure sensing signal can be understood that the electronic device can output the pressure sensing signal based on the deformation of the first sensing layer 21 and the second sensing layer 22, so as to realize the pressing touch function of the electronic device.
The pressing of the first sensing layer 21 may be understood as pressing of the first sensing layer 21 after the pressing force to the sensing surface of the electronic device is transmitted to the first sensing layer 21.
The first sensing layer 21 and the second sensing layer 22 may be a hierarchical structure made of sensing materials, and may deform based on the change of external force, so that the pressure sensing module 20 can sense and identify the touch operation on the sensing surface.
Since the first side is the side of the frame 10 facing the sensing surface of the electronic device, i.e. the first sensing layer 21 is the sensing layer facing the sensing surface of the electronic device, and the second sensing layer 22 is the sensing layer facing away from the sensing surface of the electronic device; therefore, after the first sensing layer 21 receives the pressing force, the pressing force can be transmitted to the second sensing layer 22 located on the second side of the frame 10 through the first sensing layer 21 and the frame 10, so that the second sensing layer 22 can deform, and the electronic device can output corresponding pressure sensing signals based on the deformation amounts of the first sensing layer 21 and the second sensing layer 22, so that the pressing touch function of the electronic device is realized.
Optionally, the frame 10 has a through hole, the electronic device further includes a conducting member 30, the conducting member 30 is disposed in the through hole, one end of the conducting member 30 is connected to the first sensing layer 21, and the other end of the conducting member 30 is connected to the second sensing layer 22.
In this embodiment, through setting up the through-hole on framework 10 to set up the conduction spare 30 that can electrically connect first inductive layer 21 and second inductive layer 22 in the through-hole, so that realize the electric connection of first inductive layer 21 and second inductive layer 22, and then make things convenient for electronic equipment to export the pressure sense signal to based on the deformation of first inductive layer 21 and second inductive layer 22, realize electronic equipment's press touch function.
Optionally, the conductive member 30 includes a conductive via 31, a first conductive connection portion 32 and a second conductive connection portion 33, the conductive via 31 is disposed in the through hole, one end of the conductive via 31 is connected to the first sensing layer 21 through the first conductive connection portion 32, and the other end of the conductive via 31 is connected to the second sensing layer 22 through the second conductive connection portion 33.
The first conductive portion 32 may be understood as a pad structure disposed on the first side of the frame 10 and electrically connected to the conductive via 31; the second conductive portion 33 may be understood as a pad structure provided on the second side of the housing 10 and electrically connected to the conductive via 31.
In the present embodiment, the first sensing layer 21 and the second sensing layer 22 are electrically connected by providing a conductive structure penetrating the frame 10; compared with the implementation of the electric connection of the first sensing layer 21 and the second sensing layer 22 by adopting a circuit board or a board-to-board connector, the stacking thickness of the pressure sensing module 20 on the frame 10 can be effectively reduced, and the occupied space of the pressure sensing module 20 on the electronic equipment is further reduced.
Optionally, the pressure sensing module 20 further includes a third conductive connection portion 23 and a fourth conductive connection portion 24, the first conductive connection portion 32 is connected to the first sensing layer 21 through the third conductive connection portion 23, and the second conductive connection portion 33 is connected to the second sensing layer 22 through the fourth conductive connection portion 24.
In this embodiment, by providing the third conductive connection portion 23 and the fourth conductive connection portion 24, the through hole is prevented from being disposed in the coverage area of the first sensing layer 21 on the frame body 10, so as to improve the supporting effect of the frame body 10 on the first sensing layer 21, and prevent the first sensing layer 21 from cracking after being stressed, thereby achieving the purpose of improving the sensing effect of the pressure sensing module 20.
Optionally, the electronic device further includes a first insulating coating 40 and a second insulating coating (not shown), the first insulating coating 40 is located on the first side of the frame 10 and covers the first sensing layer 21, the first conductive connection portion 32 and the third conductive connection portion 23, and the second insulating coating is located on the second side of the frame 10 and covers the second sensing layer 22, the second conductive connection portion 33 and the fourth conductive connection portion 24.
In the present embodiment, by providing the first insulating layer 40, not only the stability of the electrical connection between the first sensing layer 21 and the first conductive connection portion 32 and the third conductive connection portion 23 can be improved, but also the first sensing layer 21 can be protected from being damaged; accordingly, by providing the second insulating coating, not only the stability of the electrical connection between the second sensing layer 22 and the second conductive connection portion 33 and the fourth conductive connection portion 24 can be improved, but also the second sensing layer 22 can be protected from being damaged.
In some embodiments, the first insulating coating 40 or the second insulating coating may be an ink coating and have good insulating properties.
It can be understood that, in the case where the frame body 10 is a frame of an electronic device, the sensing surface of the electronic device may be an outer surface of the first insulating coating 40, that is, the outer surface of the first insulating coating 40 may be used as the sensing surface of the electronic device, so as to implement a pressing touch function of the electronic device.
The touch sensing function on the frame can be used for realizing side key functions of the electronic equipment, such as a power-on/off function and a volume adjusting function of the electronic equipment, namely, the power-on operation, the power-off operation, the volume adjusting operation and the like of the electronic equipment can be realized through the pressing touch function of the electronic equipment on the frame.
Optionally, the electronic device further includes a screen 50, where the screen 50 is stacked with the first sensing layer 21, and the sensing surface of the electronic device is a display surface of the screen 50.
In this embodiment, the first sensing layer 21 is stacked on the screen 50, so that the touch pressure acting on the display surface can be transferred to the first sensing layer 21 through the screen 50 to deform the first sensing layer 21; meanwhile, the touch pressure transferred to the first sensing layer 21 can be transferred to the second sensing layer 22 located on the second side of the frame body 10, so that the second sensing layer 22 is deformed, and the electronic device can output corresponding pressure sensing signals based on the deformation of the first sensing layer 21 and the second sensing layer 22, thereby realizing the sensing of touch operation on the screen 50 and further realizing the screen touch function of the electronic device.
The above-mentioned screen 50 is laminated with the first sensing layer 21, which may be understood as that the first sensing layer 21 is laminated with the inner side of the screen 50, so that the touch pressure acting on the screen 50 can be transferred to the first sensing layer 21 and deform the first sensing layer 21; meanwhile, the deformation of the first sensing layer 21 can also drive the frame body 10 to deform, so that the second sensing layer 22 positioned on the second side of the frame body 10 can also deform, namely, the pressing force acting on the first sensing layer 21 can be transmitted to the second sensing layer 22 through the frame body 10, the pressing force can also act on the second sensing layer 22, and the second sensing layer 22 can also deform.
Optionally, the electronic device further includes an elastic layer (not shown), and the first sensing layer 21 is disposed on the first side of the frame 10 through the elastic layer.
In this embodiment, by providing the elastic layer on the first side of the housing 10, the deformation amount of the first sensing layer 21 can be increased, and the pressure sensing signal output by the pressure sensing module 20 can be further improved, that is, the purpose of improving the sensitivity of the pressure sensing module 20 can be achieved.
The elastic layer may be a high temperature silica gel layer, a thermoplastic polyurethane rubber (TPU) layer, or other hierarchical structures with good elastic ability.
Among them, TPU is mainly classified into polyester type and polyether type, and it HAs a wide hardness range (60 HA-85 HD), and HAs the characteristics of wear resistance, oil resistance, transparency, good elasticity, etc.
Optionally, the electronic device further includes a motherboard (not shown) that may be electrically connected to the first sensing layer 21 and the second sensing layer 22 through the vias 30, and the first sensing layer 21 and the second sensing layer are used to form a wheatstone bridge structure.
In the present embodiment, the wheatstone bridge structure is formed by the first sensing layer 21 and the second sensing layer 22, so that the pressure sensing signal output from the pressure sensing module 20 can be further improved, and the purpose of improving the sensitivity of the pressure sensing module 20 can be achieved.
For example, in the case that the resistance value changes due to the deformation of the first sensing layer 21 and the second sensing layer 22, the pressure difference between the first sensing layer 21 and the second sensing layer 22 can be detected based on the wheatstone bridge principle and converted into an electrical signal, so that the detection of the pressure of the touch operation acting on the sensing surface is realized, and the pressure sensing function of the electronic device is further realized.
The third conductive connection portion 23 and the fourth conductive connection portion 24 may be conductive connection structures made of conductive paste, and are used for electrically connecting the first sensing layer 21 and the first conductive connection portion 32 and electrically connecting the second sensing layer 22 and the second conductive connection portion 33, respectively.
The conductive paste may be silver paste, and the electrical connection between the first sensing layer 21 and the first conductive connection portion 32 and the electrical connection between the second sensing layer 22 and the second conductive connection portion 33 may be achieved by printing.
Optionally, as shown in fig. 4, the electronic device further includes an antenna radiation line 60, and the antenna radiation line 60 is disposed on the housing 10.
In some embodiments, the antenna radiation line 60 and the first sensing layer 21 are located on the same side of the frame 10, and the antenna radiation line 60 and the first sensing layer 21 are spaced apart.
In this embodiment, the antenna radiation circuit 60 and the first sensing layer 21 of the electronic device share one frame 10, so that the layout of the functional devices in the electronic device can be effectively improved, and the occupied space required by the pressure sensing module 20 can be further reduced.
It can be understood that, in the case that the frame body 10 is a side frame, the pressure sensing module 20 can be understood as a pressure key of the electronic device, and compared with a conventional physical key, a key hole can be avoided being formed on the side frame, so that a waterproof function of the electronic device is improved.
The conventional side key functions such as the volume adjustment function and the on-off function of the electronic device can be realized based on the pressure sensing module 20.
In some embodiments, the fabrication of the frame 10 may be accomplished using laser direct structuring (Laser Direct Structuring, LDS) techniques. The LDS technology is a production technology of a special laser processing, injection and chemical (electro) plating process, and the principle of the LDS technology is that a common plastic element/circuit board is endowed with functions such as an electric interconnection function, a supporting element function, a supporting and protecting function of a plastic shell, and the functions such as shielding, an antenna and the like generated by combining a mechanical entity with a conductive pattern are combined into a whole to form the 3D-MID, so that the LDS technology is suitable for ICSubstrate, HDIPCB, leadFrame local circuits, pattern manufacturing and the like.
In the actual manufacturing process, the frame body 10 can be formed based on a mode of mold injection molding; then a conducting layer is formed on the frame body 10 in a laser activation mode, for example, a special chemical agent is added for laser activation to enable an object to generate a physical chemical reaction to form a metal core, and besides activation and rough surface formation, copper can be rooted on the frame body 10 in a metallization process; further, the conductive member 30 may be formed on the frame 10 by chemical (electro) plating, for example, a circuit of 5-8 μm such as copper, nickel, etc. is electroplated on the surface of the metallized plastic used only as an electrode, so that the plastic becomes an MID device or pad, circuit, via hole with conductive circuit; finally, the frame 10 provided with the pressure sensing module 20 is manufactured by printing the sensing layer, the conductive paste and the like, and the manufactured frame 10 provided with the pressure sensing module 20 is assembled on the whole machine of the electronic equipment.
The electronic device may be a device with a touch function, such as a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a wearable device, an ultra-mobile personal computer (ultra-mobile personal computer, UMPC), a netbook, or a personal digital assistant (personal digital assistant, PDA).
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. An electronic device, comprising: the electronic equipment comprises a frame body and a pressure sensing module, wherein the pressure sensing module comprises a first sensing layer and a second sensing layer which are electrically connected, the first sensing layer is arranged on a first side of the frame body, the second sensing layer is arranged on a second side of the frame body, the first side and the second side are two opposite sides of the frame body, and the first side is one side of the frame body facing to a sensing surface of the electronic equipment;
the first sensing layer and the second sensing layer deform and provide a pressure sensing signal when the first sensing layer is pressed.
2. The electronic device of claim 1, wherein the housing has a through hole, the electronic device further comprising a conductive member disposed in the through hole, one end of the conductive member being connected to the first sensing layer, and the other end of the conductive member being connected to the second sensing layer.
3. The electronic device of claim 2, wherein the conductive via includes a conductive via, a first conductive portion, and a second conductive portion, the conductive via is disposed in the through hole, one end of the conductive via is connected to the first sensing layer through the first conductive portion, and the other end of the conductive via is connected to the second sensing layer through the second conductive portion.
4. The electronic device of claim 3, wherein the pressure sensing die set further comprises a third conductive connection portion and a fourth conductive connection portion, the first conductive connection portion being connected to the first sensing layer through the third conductive connection portion, the second conductive connection portion being connected to the second sensing layer through the fourth conductive connection portion.
5. The electronic device of claim 4, further comprising a first insulating coating and a second insulating coating, the first insulating coating being located on the first side and covering the first inductive layer, the first conductive contact, and the third conductive contact, the second insulating coating being located on the second side and covering the second inductive layer, the second conductive contact, and the fourth conductive contact.
6. The electronic device of claim 5, wherein the frame is a bezel of the electronic device and the sensing surface is an outer surface of the first insulating coating.
7. The electronic device of any one of claims 1-5, further comprising a screen disposed in a stack with the first sensing layer, the sensing surface being a display surface of the screen.
8. The electronic device of any one of claims 1-5, further comprising an elastic layer, wherein the first sensing layer is disposed on the first side of the frame via the elastic layer.
9. The electronic device of any one of claims 1-5, further comprising an antenna radiating line disposed on the housing.
10. The electronic device of claim 9, wherein the antenna radiating line and the first sensing layer are located on a same side of the housing, and the antenna radiating line and the first sensing layer are spaced apart.
11. The electronic device of any one of claims 2-5, further comprising a motherboard electrically connected to the first and second sensing layers, respectively, through the vias, and the first and second sensing layers are configured to form a wheatstone bridge configuration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311153493.8A CN117193558A (en) | 2023-09-08 | 2023-09-08 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311153493.8A CN117193558A (en) | 2023-09-08 | 2023-09-08 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117193558A true CN117193558A (en) | 2023-12-08 |
Family
ID=88990042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311153493.8A Pending CN117193558A (en) | 2023-09-08 | 2023-09-08 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117193558A (en) |
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2023
- 2023-09-08 CN CN202311153493.8A patent/CN117193558A/en active Pending
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