CN117177474A - Welding machine for packaging solid state disk - Google Patents
Welding machine for packaging solid state disk Download PDFInfo
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- CN117177474A CN117177474A CN202311442819.9A CN202311442819A CN117177474A CN 117177474 A CN117177474 A CN 117177474A CN 202311442819 A CN202311442819 A CN 202311442819A CN 117177474 A CN117177474 A CN 117177474A
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- 238000003466 welding Methods 0.000 title claims abstract description 54
- 239000007787 solid Substances 0.000 title claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 7
- 210000001503 joint Anatomy 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XBWAZCLHZCFCGK-UHFFFAOYSA-N 7-chloro-1-methyl-5-phenyl-3,4-dihydro-2h-1,4-benzodiazepin-1-ium;chloride Chemical compound [Cl-].C12=CC(Cl)=CC=C2[NH+](C)CCN=C1C1=CC=CC=C1 XBWAZCLHZCFCGK-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
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Abstract
The invention relates to the technical field of hard disk processing, in particular to a welding machine for packaging a solid state disk, which comprises a base, wherein a support column is fixedly arranged on the upper surface of the base, a supporting plate is fixedly arranged at the top end of the support column, a surrounding baffle is fixedly arranged on the upper surface of the supporting plate, the surrounding baffle and the supporting plate are both L-shaped, a limit strip is arranged at the position above the base, which is close to two sides, a supporting rod is fixedly arranged on the lower surface of the limit strip, the bottom end of the supporting rod is fixedly connected with the upper surface of the base, a chute is further formed in the outer wall of the limit strip, a limit ring is further arranged above the base, and sliding plates are fixedly arranged on the outer walls of the two sides of the limit ring. Compared with the mode of welding the chip by clamping the chip with tweezers, the invention can rapidly limit the PCB, effectively ensure the stability of the PCB during welding, and rapidly complete the butt joint of the chip and the welding position point of the chip, so that the welding process is more stable and rapid, and the use effect is better.
Description
Technical Field
The invention relates to the technical field of hard disk processing, in particular to a welding machine for packaging a solid state disk.
Background
The solid state disk belongs to one kind of hard disk, and relative to mechanical hard disk, the solid state disk has higher read-write speed, and the cost is also relatively higher, and the inside main part of solid state disk is a PCB board, and the welding has control chip, cache chip and the flash memory chip that is used for storing data on the PCB board.
At present, in the process of repairing or chip upgrading a solid state disk, a required chip is usually required to be welded to a PCB board manually, but the existing welding mode mainly clamps the chip through tweezers, and is butted with a chip welding position point, and the welding operation is realized by timely completing the melting of solder through an air heater under the condition of keeping not shaking, so that the welding operation is realized.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a welding machine for packaging a solid state disk.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides a welding machine for solid state disk encapsulation, includes the base, the last fixed surface of base is provided with the pillar, and the fixed layer board that is provided with in top of pillar, the last fixed surface of layer board is provided with encloses the fender, and encloses fender and layer board and be L shape, the position that the base top is close to both sides all is provided with spacing, and the lower fixed surface of spacing is provided with the bracing piece, fixed connection between the bottom of bracing piece and the upper surface of base, the spout has still been seted up to the outer wall of spacing, the top of base still is provided with the spacing ring, and the both sides outer wall of spacing ring is all fixed and is provided with the slide, the slide runs through the spout, and the one end fixed stop that is provided with of spacing ring is kept away from to the slide still includes:
the material supporting mechanism is arranged in the base and used for lifting the chip to be welded to a proper height;
the limiting mechanism is arranged above the base and used for limiting the position of the PCB;
the pick-up mechanism is arranged in the limiting ring and used for assisting in picking up the chip to be welded and enabling the chip to be welded to move to the position point where the chip to be welded is welded.
As still further aspects of the invention: stop gear is including fixed the setting in the pivot of base upper surface, and the top of pivot rotates and is provided with the movable frame, the activity is provided with the fly leaf in the movable frame, the fixed baffle that is provided with in the one end of fly leaf, and the baffle is close to the fixed telescopic link that is provided with in one side outer wall of movable frame, the telescopic link runs through the movable frame, and the outside of telescopic link has cup jointed elastic component one, the fixed dog that is provided with of one end that the baffle was kept away from to the telescopic link, the outer wall fixed connection of one end and baffle of elastic component one, and the outer wall fixed connection of the other end and the movable frame of elastic component one, the upper surface fixed of the fly leaf other end is provided with the loose axle, and the top rotation of loose axle is provided with the swivel plate, the position that the swivel plate upper surface is close to both ends is all fixed and is provided with the clamping lever.
As still further aspects of the invention: the lower surface of fly leaf still is fixed and is provided with the die-pin, and the bottom of die-pin is seted up flutedly, it is provided with the ball to rotate in the recess.
As still further aspects of the invention: the upper surface of the movable frame is fixedly provided with an upright post, and the top end of the upright post is rotationally connected with the lower surface of the supporting plate.
As still further aspects of the invention: the inner side of the enclosing shield is fixedly provided with a rubber strip, and the outer side of the clamping rod is sleeved with a rubber sleeve.
As still further aspects of the invention: the picking mechanism comprises a rotary table which is arranged in a limiting ring in a rotating mode, a lifting disc is arranged above the rotary table, a movable rod is fixedly arranged on the lower surface of the lifting disc, the movable rod penetrates through the rotary table, a mounting plate is arranged at the bottom end of the movable rod, a piston cylinder is fixedly arranged on the outer wall of the mounting plate in a penetrating mode, a piston rod is movably arranged in the piston cylinder, the piston rod sequentially penetrates through the rotary table and the lifting disc, a grab handle is fixedly arranged at the top end of the piston rod, a stop rod is fixedly arranged on the outer wall of the piston rod, the stop rod is located between the rotary table and the lifting disc, an elastic piece II is fixedly arranged on the lower surface of the lifting disc, the bottom end of the elastic piece II is fixedly connected with the upper surface of the rotary table, a communicating pipe is arranged below the piston cylinder, a sucker is arranged at the bottom end of the communicating pipe in a communicating mode, an annular distribution supporting rod is fixedly arranged on the lower surface of the mounting plate, and the bottom end of the supporting rod is higher than the bottom end of the sucker.
As still further aspects of the invention: the material supporting mechanism comprises a tray, a threaded hole is formed in the lower surface of the base, a screw is connected to the threaded hole in a threaded mode, the tray is rotatably arranged on the top end of the screw, an adjusting wheel is arranged at the bottom end of the screw in a fixed mode, a limiting rod is further arranged on the lower surface of the tray, and the limiting rod penetrates through the base.
Compared with the prior art, the invention has the beneficial effects that:
according to the welding machine for packaging the solid state disk, the PCB used for fixing the chips can be placed on the supporting plate, the edge of the PCB is attached to the surrounding baffle, then the position of the PCB at the diagonal line position relative to the surrounding baffle can be limited through the limiting mechanism, the stability of the PCB can be effectively ensured when the chips are welded, then the chips to be welded can be placed on the supporting mechanism, the chips are picked up through the pick-up mechanism in the limiting ring, then the pick-up mechanism is moved, the pick-up mechanism can be assisted to move through the sliding plate moving in the sliding groove of the limiting strip, the chips are enabled to move to the chip welding position point on the PCB, the chips are enabled to be in butt joint with the chip welding position point, after butt joint, hot air is blown to the chips through the hot air gun, the welding flux at the welding point can be welded to the PCB, the chips can be directly taken down from the supporting plate after welding, compared with a mode of clamping the chips by tweezers, the welding process is more stable and rapid, and the use effect is better.
Drawings
Fig. 1 is a schematic diagram of a front view structure of a welding machine for packaging a solid state disk according to an embodiment of the present invention;
fig. 2 is a schematic top view of a welding machine for packaging a solid state disk according to an embodiment of the present invention;
FIG. 3 is a schematic side view of a welding machine for packaging a solid state disk according to an embodiment of the present invention;
fig. 4 is an enlarged schematic view of a enclosure and a movable frame of a welding machine for packaging a solid state disk according to an embodiment of the present invention;
fig. 5 is a schematic bottom view of a limiting mechanism of a welding machine for packaging a solid state disk according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a front view of a pick-up mechanism of a welding machine for packaging a solid state disk according to an embodiment of the present invention;
fig. 7 is a schematic bottom view of a pick-up mechanism of a welding machine for packaging a solid state disk according to an embodiment of the present invention;
fig. 8 is a schematic bottom view of a welding machine for packaging a solid state disk according to an embodiment of the present invention.
In the figure: 101-base, 102-strut, 103-pallet, 104-enclosure, 105-support bar, 106-limit bar, 107-chute, 108-slide, 109-baffle, 110-stop collar, 201-spindle, 202-movable frame, 203-movable plate, 204-baffle, 205-telescoping rod, 206-first elastic member, 207-stopper, 208-movable shaft, 209-rotary plate, 210-clamping rod, 301-support rod, 302-ball, 401-column, 501-rubber bar, 502-rubber sleeve, 601-turntable, 602-movable rod, 603-lifting disc, 604-mounting plate, 605-piston cylinder, 606-piston rod, 607-grab handle, 608-second elastic member, 609-stop rod, 610-abutment rod, 611-communication tube, 612-suction cup, 701-tray, 702-stop rod, 703-screw, 704-adjusting wheel.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent.
As shown in fig. 1-8, a welding machine for packaging a solid state disk provided by an embodiment of the invention includes a base 101, a post 102 is fixedly disposed on an upper surface of the base 101, a supporting plate 103 is fixedly disposed at a top end of the post 102, a surrounding block 104 is fixedly disposed on an upper surface of the supporting plate 103, the surrounding block 104 and the supporting plate 103 are both L-shaped, a limit bar 106 is disposed at a position above the base 101 near two sides, a supporting bar 105 is fixedly disposed on a lower surface of the limit bar 106, a bottom end of the supporting bar 105 is fixedly connected with an upper surface of the base 101, a chute 107 is further disposed on an outer wall of the limit bar 106, a limit ring 110 is further disposed above the base 101, sliding plates 108 are fixedly disposed on two side outer walls of the limit ring 110, the sliding plates 108 penetrate through the chute 107, and a baffle 109 is fixedly disposed at one end of the sliding plate 108 far from the limit ring 110, and the welding machine further includes:
the material supporting mechanism is arranged in the base 101 and is used for lifting the chip to be welded to a proper height;
the limiting mechanism is arranged above the base 101 and used for limiting the position of the PCB;
the pick-up mechanism is disposed in the limiting ring 110, and is used for assisting in picking up the chip to be soldered and moving the chip to the position point to be soldered.
The PCB for fixing the chip can be placed on the supporting plate 103, the edge of the PCB is attached to the surrounding baffle 104, then the diagonal position of the PCB relative to the surrounding baffle 104 can be rapidly limited through the limiting mechanism, the stability of the PCB during chip welding can be effectively ensured, then the chip to be welded can be placed on the material supporting mechanism, the chip is picked up through the pick-up mechanism in the limiting ring 110, then the pick-up mechanism is moved, the pick-up mechanism can be assisted by the movement of the sliding plate 108 in the sliding groove 107 of the limiting strip 106, the chip is moved to a chip welding position point on the PCB, the chip is abutted to the chip welding position point, after the chip is abutted, hot air is blown to the chip through the hot air gun, so that the solder at the welding point is melted, the chip can be welded on the PCB, the PCB can be directly taken off from the supporting plate 103 after the welding, compared with a mode of welding by clamping the chip with tweezers, the welding process is more stable and rapid, and the use effect is better.
As an embodiment of the present invention, referring to fig. 2, 3, 4 and 5, the limiting mechanism includes a rotating shaft 201 fixedly disposed on an upper surface of the base 101, a movable frame 202 is rotatably disposed at a top end of the rotating shaft 201, a movable plate 203 is movably disposed in the movable frame 202, a baffle 204 is fixedly disposed at one end of the movable plate 203, a telescopic rod 205 is fixedly disposed on an outer wall of a side of the baffle 204, which is close to the movable frame 202, the telescopic rod 205 penetrates the movable frame 202, an elastic member 206 is sleeved on an outer side of the telescopic rod 205, a specific structure of the elastic member 206 is not limited, in this embodiment, preferably, the elastic member 206 adopts a spring, a stop 207 is fixedly disposed at an end, far from the baffle 204, of the telescopic rod 205, one end of the elastic member 206 is fixedly connected with an outer wall of the baffle 204, another end of the elastic member 206 is fixedly connected with an outer wall of the movable frame 202, a movable shaft 208 is fixedly disposed at an upper surface of another end of the movable plate 203, and the top end of the movable shaft 208 is rotatably provided with a rotating plate 209, the positions, close to two ends, of the upper surface of the rotating plate 209 are fixedly provided with clamping rods 210, when the PCB is placed, the movable plate 203 can be pulled firstly, so that an elastic piece 206 on the outer side of the telescopic rod 205 is compressed, the PCB is ensured to be placed between the enclosing block 104 and the clamping rods 210, then the PCB can be placed on the supporting plate 103, the edge of the PCB is adhered to the inner side of the enclosing block 104, then the movable plate 203 can be loosened under the condition that the clamping rods 210 are ensured to be positioned on two sides of the diagonal of the PCB, at the moment, under the reset action of the elastic piece 206, the clamping rods 210 are adhered to the side edges of the PCB, and the rotating shaft 201 can be rotated in a self-adaptive manner, so that the direction of the movable frame 202 is kept consistent with the direction of the diagonal of the PCB, the clamping limit of the PCB can be automatically realized, the PCB board of convenient not unidimensional carries out quick limit, simultaneously, the rotating plate 209 of fly leaf 203 top also can play the effect of lifting to the PCB board for the PCB board is placed more stably, when needs take the PCB board, only need the fly leaf 203 again can, the use is very convenient.
As an embodiment of the present invention, referring to fig. 2, 3, 4 and 5, a supporting rod 301 is fixedly disposed on the lower surface of the movable plate 203, a groove is formed at the bottom end of the supporting rod 301, a ball 302 is rotatably disposed in the groove, the supporting rod 301 can lift the movable plate 203, and the ball 302 at the bottom of the supporting rod 301 can assist the movable plate 203 to move, so that the rotation process of the movable plate 203 along with the movable frame 202 is smoother, and the use effect is better.
As an embodiment of the present invention, referring to fig. 4, an upright 401 is fixedly disposed on an upper surface of the movable frame 202, and a top end of the upright 401 is rotatably connected with a lower surface of the supporting plate 103, so that the supporting plate 103 can be lifted by the upright 401, and the supporting plate 103 is more stable and has better use effect.
As an embodiment of the present invention, referring to fig. 4 and 5, a rubber strip 501 is fixedly disposed on the inner side of the enclosure 104, a rubber sleeve 502 is sleeved on the outer side of the clamping rod 210, and the rubber strip 501 and the rubber sleeve 502 can protect the edge of the PCB, so as to effectively avoid damage to the edge of the PCB during the clamping process, and the use effect is better.
As an embodiment of the present invention, referring to fig. 6, 7 and 8, the pickup mechanism includes a turntable 601 rotatably disposed in a limiting ring 110, a lifting disk 603 is disposed above the turntable 601, a movable rod 602 is fixedly disposed on a lower surface of the lifting disk 603, the movable rod 602 penetrates through the turntable 601, a mounting plate 604 is fixedly disposed at a bottom end of the movable rod 602, a piston cylinder 605 is fixedly disposed on an outer wall of the mounting plate 604, a piston rod 606 is movably disposed in the piston cylinder 605, a cross section of the piston rod 606 is square, the piston rod 606 sequentially penetrates through the turntable 601 and the lifting disk 603, a grip 607 is fixedly disposed at a top end of the piston rod 606, a stop lever 609 is fixedly disposed on an outer wall of the piston rod 606 and is disposed between the turntable 601 and the lifting disk 603, a second elastic member 608 is fixedly disposed on a lower surface of the lifting disk 603, and a specific structure of the second elastic member 608 is not limited, in this embodiment, preferably, the second elastic member 608 is a spring, the bottom end of the second elastic member 608 is fixedly connected with the upper surface of the turntable 601, the communicating pipe 611 is communicated under the piston cylinder 605, the bottom end of the communicating pipe 611 is communicated with the suction cup 612, the lower surface of the mounting plate 604 is fixedly provided with the supporting rods 610 distributed in an annular shape at equal distance, the bottom end of the supporting rod 610 is higher than the bottom end of the suction cup 612, the height of the chip to be welded can be adjusted by the lifting mechanism, the supporting rod 610 can be just abutted against the upper surface of the chip to be welded when the first elastic member 206 is in an unstretched and uncompressed state, when the chip needs to be picked up, the lifting disk 603 can be pulled upwards firstly, so that the second elastic member 608 is stretched, the mounting plate 604 rises together, then the mounting plate 604 can be moved to the upper side of the chip to be welded, and the lifting disk 603 is released, the reset effect of the elastic piece II 608 can enable the supporting rod 610 to be just supported on the surface of the chip, and because the bottom end of the supporting rod 610 is higher than the bottom end of the sucker 612, when the supporting rod 610 supports the chip, the sucker 612 is in a pressed state, the chip can be tightly attached to the upper surface of the chip, then the sucker 607 can be held to pull the piston rod 606 upwards, air in the sucker 612 is pumped into the piston cylinder 605, at the moment, the sucker 612 can absorb the chip, and the piston rod 606 is further lifted upwards, the stop rod 609 can be blocked by the lifting disk 603, the lifting disk 603 is further lifted together, the elastic piece II 608 is stretched, meanwhile, the sucker 612 can drive the chip to be lifted together, at the moment, the held sucker 607 can be moved to the position above the position to be welded by the chip, the sucker 607 can be rotated together, the mounting orientation of the chip can be flexibly adjusted, after the chip is completely aligned with the position to the chip, the sucker 605 can be gradually moved downwards until the chip is absorbed by the chip, and the chip is completely attached to the piston rod 607, and the elastic piece II can be further lifted together, and the chip can be directly lifted by the lifting rod 612, the clamping rod 612 can be directly pressed down by the welding position of the sucker 612, and the chip can be conveniently and tightly lifted by the clamping rod 610.
As an embodiment of the present invention, referring to fig. 3, the material supporting mechanism includes a tray 701, a threaded hole is provided on the lower surface of the base 101, a screw 703 is screwed in the threaded hole, the tray 701 is rotatably disposed at the top end of the screw 703, an adjusting wheel 704 is fixedly disposed at the bottom end of the screw 703, a limit rod 702 is further disposed on the lower surface of the tray 701, the limit rod 702 penetrates through the base 101, a chip to be welded can be placed on the tray 701, the screw 703 can be driven to rotate by rotating the adjusting wheel 704, the screw 703 can drive the tray 701 to move up and down, and the placement height of the chip can be adjusted, which is very convenient to use.
When the chip fixing device is used, a PCB (printed circuit board) for fixing chips can be placed on the supporting plate 103, the edge of the PCB is attached to the surrounding baffle 104, then the diagonal position of the PCB relative to the surrounding baffle 104 can be quickly limited through the limiting mechanism, the stability of the PCB during chip welding can be effectively ensured, then the chips to be welded can be placed on the material supporting mechanism, the chips are picked up through the picking mechanism in the limiting ring 110, then the picking mechanism is moved, the picking mechanism is assisted to move through the sliding plate 108 in the sliding groove 107 of the limiting strip 106, the chips are moved to the chip welding position point on the PCB, the chips are butted with the chip welding position point, after the chips are butted, hot air is blown to the chips through the hot air gun, the solder at the welding point is melted, the chips can be welded to the PCB, the PCB can be directly taken down from the supporting plate 103 after the welding is finished, compared with the mode of welding by clamping core pieces through tweezers, the welding process is more stable and rapid, and the using effect is better.
It should be noted that, although the present disclosure describes embodiments, not every embodiment includes only a single embodiment, and the description is for clarity only, and those skilled in the art should understand that the embodiments of the disclosure may be combined appropriately to form other embodiments that can be understood by those skilled in the art.
Claims (7)
1. The utility model provides a welding machine for solid state disk encapsulation, includes the base, its characterized in that, the last fixed surface of base is provided with the pillar, and the fixed layer board that is provided with in top of pillar, the last fixed surface of layer board is provided with encloses the fender, and encloses fender and layer board and be L shape, the position that the base top is close to both sides all is provided with spacing, and the lower fixed surface of spacing is provided with the bracing piece, fixed connection between the upper surface of the bottom of bracing piece and base, the spout has still been seted up to the outer wall of spacing, the top of base still is provided with the spacing ring, and the both sides outer wall of spacing ring is all fixedly provided with slide, the slide runs through the spout, and the one end fixed baffle that is provided with of spacing ring is kept away from to the slide still includes:
the material supporting mechanism is arranged in the base and used for lifting the chip to be welded to a proper height;
the limiting mechanism is arranged above the base and used for limiting the position of the PCB;
the pick-up mechanism is arranged in the limiting ring and used for assisting in picking up the chip to be welded and enabling the chip to be welded to move to the position point where the chip to be welded is welded.
2. The welding machine for packaging the solid state disk according to claim 1, wherein the limiting mechanism comprises a rotating shaft fixedly arranged on the upper surface of the base, the top end of the rotating shaft is rotatably provided with a movable frame, the movable frame is movably provided with a movable plate, one end of the movable plate is fixedly provided with a baffle, the outer wall of one side of the baffle, which is close to the movable frame, is fixedly provided with a telescopic rod, the telescopic rod penetrates through the movable frame, the outer side of the telescopic rod is sleeved with an elastic piece I, one end of the telescopic rod, which is far away from the baffle, is fixedly provided with a stop block, one end of the elastic piece I is fixedly connected with the outer wall of the baffle, the other end of the elastic piece I is fixedly connected with the outer wall of the movable frame, the upper surface of the other end of the movable plate is fixedly provided with a movable shaft, the top end of the movable shaft is rotatably provided with a rotary plate, and the positions, which are close to the two ends, of the upper surface of the rotary plate are fixedly provided with clamping rods.
3. The welding machine for packaging the solid state disk of claim 2, wherein the lower surface of the movable plate is also fixedly provided with a supporting rod, the bottom end of the supporting rod is provided with a groove, and balls are rotatably arranged in the groove.
4. The welding machine for packaging solid state disks according to claim 3, wherein the upper surface of the movable frame is fixedly provided with a stand column, and the top ends of the stand column are rotatably connected with the lower surface of the supporting plate.
5. The welding machine for packaging the solid state disk of claim 4, wherein rubber strips are fixedly arranged on the inner side of the enclosure, and rubber sleeves are sleeved on the outer sides of the clamping rods.
6. The welding machine for packaging the solid state disk according to claim 1, wherein the pick-up mechanism comprises a rotary table which is rotatably arranged in a limiting ring, a lifting disc is arranged above the rotary table, a movable rod is fixedly arranged on the lower surface of the lifting disc, the movable rod penetrates through the rotary table, a mounting plate is arranged at the bottom end of the movable rod, a piston cylinder is fixedly arranged on the outer wall of the mounting plate in a penetrating manner, a piston rod is movably arranged in the piston cylinder, the piston rod sequentially penetrates through the rotary table and the lifting disc, a grab handle is fixedly arranged at the top end of the piston rod, a stop lever is fixedly arranged at the outer wall of the piston rod, the stop lever is arranged between the rotary table and the lifting disc, an elastic piece II is fixedly arranged on the lower surface of the lifting disc, the bottom end of the elastic piece II is fixedly connected with the upper surface of the rotary table, a communicating pipe is arranged below the piston cylinder, a sucking disc is communicated with the bottom end of the communicating pipe, an annular supporting rod is fixedly arranged on the lower surface of the mounting plate, and the bottom end of the supporting rod is higher than the bottom end of the sucking disc.
7. The welding machine for packaging the solid state disk of claim 1, wherein the material supporting mechanism comprises a tray, a threaded hole is formed in the lower surface of the base, a screw is connected to the threaded hole in a threaded mode, the tray is rotatably arranged at the top end of the screw, an adjusting wheel is fixedly arranged at the bottom end of the screw, a limiting rod is further arranged on the lower surface of the tray, and the limiting rod penetrates through the base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311442819.9A CN117177474B (en) | 2023-11-02 | 2023-11-02 | Welding machine for packaging solid state disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311442819.9A CN117177474B (en) | 2023-11-02 | 2023-11-02 | Welding machine for packaging solid state disk |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117177474A true CN117177474A (en) | 2023-12-05 |
| CN117177474B CN117177474B (en) | 2024-01-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311442819.9A Active CN117177474B (en) | 2023-11-02 | 2023-11-02 | Welding machine for packaging solid state disk |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130032947A1 (en) * | 2011-08-05 | 2013-02-07 | Park Sang-Sick | Semiconductor package and method of manufacturing the same |
| CN204102577U (en) * | 2014-08-29 | 2015-01-14 | 深圳市嘉合劲威电子科技有限公司 | Solid state hard disc testing jig |
| CN108857184A (en) * | 2018-08-13 | 2018-11-23 | 安徽星宇生产力促进中心有限公司 | A kind of microelectronic device package bonding machine |
| CN114043156A (en) * | 2022-01-12 | 2022-02-15 | 深圳市家鹏顺五金塑胶有限公司 | Charger PCB board welding jig |
| CN115457991A (en) * | 2022-08-11 | 2022-12-09 | 深圳市源微创新实业有限公司 | Integrated packaging structure of solid state disk and packaging method thereof |
| CN218634424U (en) * | 2022-10-26 | 2023-03-14 | 广西科林半导体有限公司 | Automatic all-in-one of capsulating of solid state hard drives |
| CN219310473U (en) * | 2023-01-03 | 2023-07-07 | 深圳市群光视觉科技有限公司 | Chip packaging positioning jig |
-
2023
- 2023-11-02 CN CN202311442819.9A patent/CN117177474B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130032947A1 (en) * | 2011-08-05 | 2013-02-07 | Park Sang-Sick | Semiconductor package and method of manufacturing the same |
| CN204102577U (en) * | 2014-08-29 | 2015-01-14 | 深圳市嘉合劲威电子科技有限公司 | Solid state hard disc testing jig |
| CN108857184A (en) * | 2018-08-13 | 2018-11-23 | 安徽星宇生产力促进中心有限公司 | A kind of microelectronic device package bonding machine |
| CN114043156A (en) * | 2022-01-12 | 2022-02-15 | 深圳市家鹏顺五金塑胶有限公司 | Charger PCB board welding jig |
| CN115457991A (en) * | 2022-08-11 | 2022-12-09 | 深圳市源微创新实业有限公司 | Integrated packaging structure of solid state disk and packaging method thereof |
| CN218634424U (en) * | 2022-10-26 | 2023-03-14 | 广西科林半导体有限公司 | Automatic all-in-one of capsulating of solid state hard drives |
| CN219310473U (en) * | 2023-01-03 | 2023-07-07 | 深圳市群光视觉科技有限公司 | Chip packaging positioning jig |
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| CN117177474B (en) | 2024-01-16 |
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