CN117174619A - Tool for semiconductor packaging - Google Patents

Abstract

The invention discloses a fixture for semiconductor packaging, which relates to the technical field of semiconductor packaging and comprises a substrate and a plurality of through grooves formed in the substrate, wherein the through grooves are distributed in an array, clamping mechanisms are slidably arranged in the through grooves, the clamping mechanisms are distributed at the left end and the right end of the inner wall of the through grooves, auxiliary centering mechanisms are slidably arranged in the through grooves, and the auxiliary centering mechanisms are positioned at the upper end and the lower end of the inner wall. In the invention, the left and right clamping and fixing of the semiconductor carrier plate are realized by arranging the clamping mechanisms in the through grooves of the substrate; simultaneously realize centering from top to bottom and through flattening mechanism and place the cooperation of board and realize spacing around the semiconductor carrier plate through supplementary centering mechanism to make the frock size have the adjustability of certain extent, thereby improve the flexibility that the frock used.

Description

Tool for semiconductor packaging

Technical Field

The invention relates to the technical field of semiconductor packaging, in particular to a fixture for semiconductor packaging.

Background

Semiconductor packaging refers to the process of processing a wafer that passes testing to obtain individual chips according to product model and functional requirements.

When packaging the semiconductor, need install the semiconductor on the semiconductor carrier plate, current semiconductor carrier plate need with the help of fixed frock with the non-contact among a plurality of semiconductor carrier plates when transporting, but current fixed frock's size is comparatively fixed mostly, if semiconductor carrier plate and fixed frock mismatch can make the semiconductor carry can not place or can appear the collision between semiconductor carrier plate and the fixed frock to the frock use flexibility of restriction.

Disclosure of Invention

The invention aims to solve the problem of the defects in the prior art, and provides a tooling for semiconductor packaging.

In order to achieve the above purpose, the present invention adopts the following technical scheme:

the fixture for packaging the semiconductor comprises a substrate and a plurality of through grooves formed in the substrate, wherein the through grooves are distributed in an array, clamping mechanisms are slidably arranged in the through grooves, the clamping mechanisms are distributed at the left end and the right end of the inner wall of the through grooves, auxiliary centering mechanisms are slidably arranged in the through grooves, and the auxiliary centering mechanisms are positioned at the upper end and the lower end of the inner wall;

the clamping mechanism comprises two placing plates which are arranged in the inner walls of the left side and the right side of the through groove in a sliding manner, type frames are arranged at the top of each placing plate, the openings of the type frames face towards similar ends, two inclined supporting rods are hinged at the end of each type frame, which is opposite to the end of each other, the two inclined supporting rods at one side of the type frame are symmetrically arranged up and down, one ends of the two inclined supporting rods, which are far away from the type frame, are respectively hinged with the surfaces of a thread seat, the two thread seats are arranged at the upper end and the lower end of a screw rod, the screw rod is rotatably arranged in a base plate, two sections of symmetrical thread sections are arranged at the upper end and the lower end of the screw rod, the rotation directions of the two sections of the thread sections are opposite, the two vertically adjacent screw rods are connected through a coupling, the two horizontally adjacent screw rods are synchronously rotated through the cooperation of a belt wheel and a synchronous belt, and any screw rod is driven by a motor;

two the similar one end of type frame all slides side-to-side and is provided with splint, two the one end that splint deviate from each other all is pegged graft through picture peg and type frame's lateral wall interdynamic, be provided with a plurality of first reset springs between splint and the inner wall of type frame, two the one end that splint deviate from each other is provided with the locating plate with type frame's lateral wall butt.

As a further description of the above technical solution:

the top ends of the two clamping plates are rotatably provided with a flattening mechanism which is in contact with the front end of the semiconductor carrier plate, the flattening mechanism comprises pressing plates which are rotatably arranged at the upper end and the lower end of the front part of the clamping plates through rotating shafts, gears are arranged at the front parts of the two rotating shafts, tooth grooves meshed with the gears are formed in the inner walls of the front end and the rear end of each -type frame, one end, close to an opening of each -type frame, of each tooth groove is communicated with an opening groove for sliding the corresponding gear, the clamping plates and the pressing plates are strip-shaped plates, and the cross sections of the front surface and the rear surface of each pressing plate are smaller than the cross section of the front surface of each clamping plate;

slopes which are convenient to contact with the top end of the semiconductor carrier plate are formed on the rear sides of one ends, close to the two pressing plates, of the two pressing plates, and second adhesive layers are arranged on the rear sides of the pressing plates and the rear sides of the slopes;

the two clamping plate top ends are mutually deviated one end of which is fixedly provided with a fourth magnet, and the side wall of the clamping plate is provided with a third magnet which is attracted with the fourth magnet.

As a further description of the above technical solution:

the auxiliary centering mechanism comprises a storage groove which is formed in the middle of the upper end and the lower end of the through groove, a sliding plate is arranged in the storage groove in a sliding mode, two sliding covers are fixedly arranged at the similar ends of the sliding plates, a first pushing plate is arranged at the similar ends of the sliding covers in a detachable mode, a second reset spring is arranged between the sliding plates and the inner wall of the storage groove, two first magnets are embedded into the ends, deviating from each other, of the sliding plates, and first electromagnets which are respectively attracted with the two first magnets are arranged in the storage groove.

As a further description of the above technical solution:

the trigger assembly is installed in the connecting wire of first electro-magnet and external power source, trigger assembly is including installing in arbitrary one type frame curb plate outer wall's installation box, the installation box internal fixation is provided with the conducting ring, the slip grafting has the conducting strip in the conducting ring, the one end and the picture peg fixed connection of conducting strip, the positive pole end electric connection of conducting strip and first electro-magnet, the conducting ring is with external power source's positive pole end electric connection, the negative pole end of first electro-magnet is with external power source's negative pole end electric connection.

As a further description of the above technical solution:

the two sliding covers are internally provided with push rods in a vertical sliding mode, the two similar ends of the push rods are detachably provided with second push plates, the two ends, deviating from each other, of the push rods are fixedly provided with second magnets, the two sliding covers are internally provided with second electromagnets which are attracted with the two second magnets, a third reset spring is arranged between the push rods and the inner walls of the sliding covers, and the push rods penetrate through the middle of the first push plates in a sliding mode.

As a further description of the above technical solution:

the utility model discloses a sliding plate, including sliding plate, fixed contact, sliding bar, ejector pad, extension groove, fourth reset spring, the sliding bar is offered to the one end of sliding plate, the mounting groove has been offered to the one end of sliding plate in, fixed contact with the positive end electric connection of second electro-magnet in fixed mounting has in the mounting groove, fixed contact and sliding contact electric contact, sliding contact left and right sides slip sets up in the mounting groove, the sliding bar of making with insulating material is installed to the one end that sliding contact was kept away from to the sliding contact, the ejector pad is kept away from to the sliding bar is dismantled to the one end that sliding contact was kept away from, the end that the ejector pad slip runs through the sliding plate and the inner wall butt of accomodating the groove, two the extension groove with ejector pad butt has been offered to the one end lateral wall that accomodates the groove is close, be provided with fourth reset spring between the inner wall of sliding bar and mounting groove.

As a further description of the above technical solution:

one end of the top block, which is far away from the sliding rod, is arc-shaped; the one end that the mounting groove inner wall kept away from the storage groove opening is the slope form that is convenient for kicking block slip.

As a further description of the above technical solution:

a first anti-drop plate for preventing the sliding plate from sliding out is detachably arranged at one end of the opening of the mounting groove; the sliding cover is characterized in that a second anti-falling plate is detachably arranged at the opening of the sliding cover, and one end of the second anti-falling plate, which is far away from the sliding cover, is fixedly connected with the first push plate.

As a further description of the above technical solution:

one end of the second push plate, which is far away from the push rod, is provided with a first adhesive layer.

As a further description of the above technical solution:

and a third adhesive layer is arranged at one end of each clamping plate close to the other clamping plates.

Compared with the prior art, the invention has the following beneficial effects:

in the invention, the left and right clamping and fixing of the semiconductor carrier plate are realized by arranging the clamping mechanisms in the through grooves of the substrate; simultaneously realize centering from top to bottom and through flattening mechanism and place the cooperation of board and realize spacing around the semiconductor carrier plate through supplementary centering mechanism to make the frock size have the adjustability of certain extent, thereby improve the flexibility that the frock used.

Drawings

Fig. 1 is a schematic diagram of the overall structure of a tooling for semiconductor packaging according to the present invention;

fig. 2 is a schematic diagram of a partial structure of a tooling for semiconductor packaging according to the present invention;

fig. 3 is a front view of a clamping mechanism in a tool for packaging a semiconductor according to the present invention;

fig. 4 is a top view of a clamping mechanism in a tooling for semiconductor packaging according to the present invention;

FIG. 5 is a side view of an intermediate platen for semiconductor packaging according to the present invention;

FIG. 6 is an enlarged view of FIG. 3 at A;

fig. 7 is a schematic structural diagram of an auxiliary centering mechanism in a tooling for semiconductor packaging according to the present invention;

FIG. 8 is a motion state diagram of FIG. 7;

fig. 9 is a schematic partial structure of an auxiliary centering mechanism in a tooling for semiconductor packaging according to the present invention.

In the figure: 1. a substrate; 2. a through groove; 3. a clamping mechanism; 31. placing a plate; 32. a diagonal brace; 33. a screw seat; 34. a screw rod; 35. a clamping plate; 36. inserting plate; 37. type rack; 38. a positioning plate; 4. an auxiliary centering mechanism; 41. a slide plate; 42. a sliding cover; 43. a first push plate; 44. a first magnet; 45. a first electromagnet; 46. a push rod; 47. a second push plate; 48. a second magnet; 49. a second electromagnet; 410. a slide bar; 411. a top block; 412. a sliding contact; 413. a stationary contact; 414. an extension groove; 415. a first adhesive layer; 416. a first anti-drop plate; 417. a second anti-drop plate; 5. a flattening mechanism; 51. a pressing plate; 511. a second adhesive layer; 52. a gear; 53. a third magnet; 6. a trigger assembly; 61. a mounting box; 62. a conductive ring; 63. and a conductive sheet.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.

In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

Referring to fig. 1-9, a tool for packaging a semiconductor comprises a substrate 1 and a plurality of through grooves 2 formed in the substrate 1, wherein the through grooves 2 are distributed in an array, clamping mechanisms 3 are slidably arranged in the through grooves 2, the clamping mechanisms 3 are distributed at left and right ends of the inner wall of the through grooves 2, auxiliary centering mechanisms 4 are slidably arranged in the through grooves 2, and the auxiliary centering mechanisms 4 are positioned at the upper and lower ends of the inner wall;

the clamping mechanism 3 comprises two placing plates 31 which are arranged in the inner walls of the left side and the right side of the through groove 2 in a sliding manner, type frames 37 are arranged at the ends, deviating from each other, of the tops of the two placing plates 31, the openings of the two type frames 37 face towards similar ends, two inclined supporting rods 32 are hinged at the ends, deviating from each other, of the two type frames 37, the two inclined supporting rods 32 at one side of the type frames 37 are symmetrically arranged up and down, one ends, far from the type frames 37, of the two inclined supporting rods 32 are respectively hinged with the surfaces of screw bases 33, the two screw bases 33 are respectively arranged at the upper end and the lower end of each screw rod 34, the screw rods 34 are rotatably arranged in the base plate 1, two sections of symmetrical screw segments are arranged at the upper end and the lower end of each screw rod 34, the rotation directions of the two sections of the screw rods 34 are opposite, the similar ends of the two screw rods 34 which are vertically adjacent are connected through a coupler, and the two screw rods 34 which are horizontally adjacent are synchronously rotated through the cooperation of a belt pulley and a synchronous belt, and any screw rod 34 is driven by a motor; specifically, the belt wheel and the synchronous belt are positioned at the top end of the screw rod 34, and the motor is a stepping motor, so that the moving position of the placing plate 31 is conveniently controlled;

the two 35 type frames 37 are provided with clamping plates 35 in a sliding manner at the left and right sides, two clamping plates 35 are mutually separated from one another, two clamping plates 35 are mutually inserted through the side walls of the type frames 37, a plurality of first reset springs are arranged between the clamping plates 35 and the inner walls of the type frames 37, one ends of the two clamping plates 35, which are mutually separated, are provided with positioning plates 38 which are in butt joint with the side walls of the type frames 37, specifically, a motor is started, and then the screw rods 34 are driven to rotate, at the moment, the two screw rods 34 at the vertically adjacent side are connected through a coupling, at the moment, the vertical plurality of screw rods 34 synchronously rotate, and the two screw rods 34 which are transversely adjacent are synchronously rotated through the cooperation of pulleys and synchronous belts, so that the placing plates 31 in the through grooves 2 in the base plate 1 can synchronously move towards the middle of the through grooves 2 in the process that the two threaded seats 33 drive the diagonal brace rods 32 to move, at the process that the two placing plates 31 are mutually close, the left and right ends of the semiconductor carrier plates on the two placing plates 31 are respectively in contact with the clamping plates 35, at the moment, the two clamping plates 35 are driven to be in butt joint with the clamping plates 35, at the inner walls of the 37 of the two clamping plates 37, and the two clamping plates 35 are far away from the middle of the positioning plates 35, and the positioning plates are far from the side of the semiconductor carrier plates 35, and the side of the clamping plates are located at the opposite sides of the clamping plates, and the clamping plates 35.

Further, the top ends of the two clamping plates 35 are rotatably provided with a flattening mechanism 5 which is in contact with the front ends of the semiconductor carrier plates, the flattening mechanism 5 comprises a pressing plate 51 which is rotatably arranged at the upper end and the lower end of the front part of the clamping plates 35 through rotating shafts, gears 52 are arranged at the front parts of the two rotating shafts, tooth grooves meshed with the gears 52 are formed in the inner walls of the front end and the rear end of the -type frame 37, one end, close to the opening of the -type frame 37, of each tooth groove is communicated with an opening groove for sliding the gear 52, the clamping plates 35 and the pressing plate 51 are strip-shaped plates, and the cross sections of the front surface and the rear surface of the pressing plate 51 are smaller than the cross sections of the front surface of the clamping plates 35;

the rear sides of the adjacent ends of the two pressing plates 51 are respectively provided with a slope which is convenient for contacting with the top end of the semiconductor carrier, and the rear sides of the pressing plates 51 and the slopes are respectively provided with a second adhesive layer 511; specifically, by the arrangement of the second adhesive layer 511, the front end surface of the semiconductor carrier is prevented from being damaged when the pressing plate 51 contacts with the front end surface of the semiconductor carrier;

a fourth magnet is fixedly arranged at one end, which is away from the top ends of the two clamping plates 35, of the clamping plate 51, and a third magnet 53 which is attracted with the fourth magnet is arranged on the side wall of the clamping plate 51; specifically, the positioning of the pressing plate 51 after the pressing plate 51 is separated from the semiconductor carrier is realized through the arrangement of the third magnet 53 and the fourth magnet; when the clamping plate 35 slides in the type frame 37, the clamping plate 35 drives the two gears 52 at the top to slide in the open grooves in the type frame 37, and then drives the two gears 52 to be meshed with the tooth grooves in the type frame 37 to rotate; when the two gears 52 slide in the open slot in the type frame 37, the pressing plate 51 does not rotate, and when the two gears 52 and the tooth slot in the type frame 37 are meshed and rotate, the pressing plate 51 is driven to rotate, so that one far end of the pressing plate 51 is abutted with the front end of the semiconductor carrier plate, and as a slope is formed at one abutted end of the pressing plate 51 and the upper end of the semiconductor carrier plate, the front end of the semiconductor carrier plate protruding forward from the clamping plate 35 is pressed backwards, the front end of the semiconductor carrier plate is flush with the front end of the clamping plate 35, and the phenomenon that the semiconductor carrier plate is inclined in the process of clamping the semiconductor carrier plate by the two clamping plates 35 is avoided; specifically, the time for which the platen 51 rotates is: the actual time control is determined by the position of the tooth slot before the two clamping plates 35 completely clamp the semiconductor carrier; and the angle of rotation of the clamping plate 35 is determined by the length of the tooth slot.

Further, the auxiliary centering mechanism 4 comprises storage grooves which are formed in the middle of the upper end and the lower end of the through groove 2, sliding plates 41 are arranged in the two storage grooves in a vertical sliding mode, sliding covers 42 are fixedly arranged at the similar ends of the two sliding plates 41, first pushing plates 43 are detachably arranged at the similar ends of the two sliding covers 42, second reset springs are arranged between the sliding plates 41 and the inner walls of the storage grooves, first magnets 44 are embedded into the opposite ends of the two sliding plates 41, and first electromagnets 45 which are respectively attracted with the two first magnets 44 are arranged in the two storage grooves; specifically, when the first electromagnet 45 is powered off, under the action of the two second return springs, the two sliding plates 41 are rapidly driven to slide close to each other, so as to further drive the two sliding covers 42 to rapidly slide in a centering manner, and further drive the two first push plates 43 to rapidly slide in a centering manner to be close to the upper end and the lower end of the semiconductor carrier;

further, a trigger assembly 6 is installed in a connecting wire between the first electromagnet 45 and an external power supply, the trigger assembly 6 comprises an installation box 61 installed on the outer wall of a side plate of any type frame 37, a conductive ring 62 is fixedly arranged in the installation box 61, a conductive sheet 63 is inserted in the conductive ring 62 in a sliding manner, one end of the conductive sheet 63 is fixedly connected with the plugboard 36, the conductive sheet 63 is electrically connected with the positive end of the first electromagnet 45, the conductive ring 62 is electrically connected with the positive end of the external power supply, and the negative end of the first electromagnet 45 is electrically connected with the negative end of the external power supply; specifically, when the clamping plate 35 slides in the type frame 37, the clamping plate 35 drives the inserting plate 36 to slide, and then drives the conductive sheet 63 to slide in the conductive ring 62 until the conductive sheet 63 is separated from the conductive ring 62, and at this time, the first electromagnet 45 and the external power supply cannot form a loop, so that the first electromagnet 45 in the inner walls of the upper and lower ends of the through slot 2 is powered off.

Further, push rods 46 are arranged in the two sliding covers 42 in a vertical sliding mode, second push plates 47 are detachably arranged at the close ends of the two push rods 46, second magnets 48 are fixedly arranged at the ends, away from each other, of the two push rods 46, second electromagnets 49 which are attracted with the two second magnets 48 are respectively arranged in the two sliding covers 42, a third reset spring is arranged between the push rods 46 and the inner wall of the sliding cover 42, and the push rods 46 penetrate through the middle of the first push plates 43 in a sliding mode; specifically, when the second magnet 48 is powered off, under the action of the two third return springs, the two push rods 46 are rapidly driven to slide close to each other, so that the two second push plates 47 are rapidly driven to abut against the upper end and the lower end of the semiconductor carrier, and centering of the semiconductor carrier in the vertical direction in the through groove 2 is achieved.

Further, the mounting groove has been seted up in the one end of slide 41, fixed contact 413 with second electro-magnet 49 positive terminal electric connection has been fixedly installed in the mounting groove, fixed contact 413 and slidingtype contact 412 electric contact, slidingtype contact 412 side-to-side slides and sets up in the mounting groove, slidingtype contact 412 keeps away from fixed contact 413's one end and installs slide bar 410 of making with insulating material, the one end dismantlement of slidingtype contact 412 is kept away from to slide bar 410 installs kicking block 411, the tip that the kicking block 411 is slided and runs through slide 41 and the inner wall butt of holding the groove, the extension groove 414 with kicking block 411 butt has been seted up to the close one end lateral wall of two holding grooves, be provided with fourth reset spring between slide bar 410 and the inner wall of mounting groove, specifically, along with the slip that two slide 41 are close to each other, the kicking block 411 of slide 41 tip will slide into extension groove 414 under the effect of reset spring, and then drive slidingtype contact 412 and keep away from fixed contact 413 through slide bar 410, the second electro-magnet 49 outage in two sliding hoods 42 this moment, and the upper and lower both ends of two second push plates 47 and semiconductor carrier plate are the butt time: the actual time control is determined by the length of the conductive ring 62 before the two clamping plates 35 completely clamp the semiconductor carrier.

Further, the end of the top block 411 away from the slide bar 410 is arc-shaped; the end of the inner wall of the mounting groove, which is far away from the opening of the storage groove, is in an inclined shape which is convenient for the top block 411 to slide, and specifically, the top block 411 is convenient for the top block 411 to slide on the inner wall of the storage groove and the inner wall of the mounting groove through the arc-shaped arrangement of the end part of the top block 411; the inclined shape of the inner wall of the installation groove is convenient for the sliding of the top block 411, so that the impact when the top block 411 slides into the installation groove is avoided, and the service life of the top block 411 is prolonged;

further, a first escape prevention plate 416 for preventing the sliding plate 41 from sliding out is detachably installed at an open end of the installation groove; the second anti-drop plate 417 is detachably installed at the opening of the sliding cover 42, and one end of the second anti-drop plate 417, which is far away from the sliding cover 42, is fixedly connected with the first push plate 43.

Further, the end of the second push plate 47 far away from the push rod 46 is provided with a first adhesive layer 415, specifically, through the arrangement of the first adhesive layer 415, the upper end and the lower end of the semiconductor carrier are prevented from being damaged when the second push plate 47 contacts with the upper end and the lower end of the semiconductor carrier.

Further, the third adhesive layer is disposed at one end of the two clamping plates 35, and specifically, by the arrangement of the third adhesive layer, the damage to the left and right ends of the semiconductor carrier plate is avoided when the clamping plates 35 are contacted with the left and right ends of the semiconductor carrier plate

Working principle: when the clamping device is used, a plurality of semiconductor carrier plates are placed in a plurality of through grooves 2 one by one, the semiconductor carrier plates are positioned at the front ends of two placing plates 31 in the through grooves 2, then a motor is started, and then the screw rods 34 are driven to rotate, at the moment, because the two screw rods 34 on the vertically adjacent sides are connected through a coupling, the vertical screw rods 34 synchronously rotate, and the two screw rods 34 transversely adjacent to each other synchronously rotate through the matching of a belt wheel and a synchronous belt, the placing plates 31 in the through grooves 2 in the base plate 1 synchronously move towards the middle parts of the through grooves 2 in the process that two screw seats 33 drive diagonal brace 32 to move, in the process that the two placing plates 31 are mutually close to each other in the through grooves 2, the left end and the right end of the semiconductor carrier plate on the two placing plates 31 are respectively contacted with the clamping plates 35, and then the clamping plates 35 are driven to slide in a type frame 37, and a first reset spring is extruded until a positioning plate 38 on one side of the semiconductor carrier plate 35 is far away from the side of the semiconductor carrier plates is abutted against the inner wall of the type frame 37, so that the positioning of the clamping plates 35 is realized, and the clamping plates 35 are clamped on the left and right sides of the clamping plates 35;

when the clamping plate 35 slides in the type frame 37, the clamping plate 35 drives the inserting plate 36 to slide, and then drives the conductive sheet 63 to slide in the conductive ring 62 until the conductive sheet 63 is separated from the conductive ring 62, at this time, the first electromagnet 45 and an external power supply cannot form a loop, so that the first electromagnet 45 in the inner walls of the upper end and the lower end of the through groove 2 is powered off, at this time, under the action of the two second return springs, the two sliding plates 41 are rapidly driven to slide close to each other, and further the two sliding covers 42 are rapidly driven to slide in a centering manner, and further the two first pushing plates 43 are rapidly driven to slide in a centering manner close to the upper end and the lower end of the semiconductor carrier; along with the sliding of the two sliding plates 41 approaching each other, the top blocks 411 at the end parts of the sliding plates 41 slide into the extending grooves 414 under the action of the fourth reset spring, so that the sliding type contacts 412 are driven by the sliding rods 410 to be far away from the fixed contacts 413, at the moment, the second electromagnets 49 in the two sliding covers 42 are powered off, at the moment, under the action of the two third reset springs, the two push rods 46 are rapidly driven to slide approaching each other, and then the two second push plates 47 are rapidly driven to be abutted with the upper ends and the lower ends of the semiconductor carrier, so that the semiconductor carrier is centered in the vertical direction in the through groove 2;

specifically, the time for the two second push plates 47 to abut against the upper and lower ends of the semiconductor carrier is: the actual time control is determined by the length of the conductive ring 62 before the two clamping plates 35 completely clamp the semiconductor carrier;

when the clamping plate 35 slides in the type frame 37, the clamping plate 35 drives the two gears 52 at the top to slide in the open grooves in the type frame 37, and then drives the two gears 52 to be meshed with the tooth grooves in the type frame 37 to rotate; when the two gears 52 slide in the open slot in the type frame 37, the pressing plate 51 does not rotate, and when the two gears 52 and the tooth slot in the type frame 37 are meshed and rotate, the pressing plate 51 is driven to rotate, so that one far end of the pressing plate 51 is abutted with the front end of the semiconductor carrier plate, and as a slope is formed at one abutted end of the pressing plate 51 and the upper end of the semiconductor carrier plate, the front end of the semiconductor carrier plate protruding forward from the clamping plate 35 is pressed backwards, the front end of the semiconductor carrier plate is flush with the front end of the clamping plate 35, and the phenomenon that the semiconductor carrier plate is inclined in the process of clamping the semiconductor carrier plate by the two clamping plates 35 is avoided;

specifically, the time for which the platen 51 rotates is: the actual time control is determined by the position of the tooth slot before the two clamping plates 35 completely clamp the semiconductor carrier; and the angle of rotation of the clamping plate 35 is determined by the length of the tooth slot.

The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.

Claims (10)

1. The tooling for the semiconductor packaging is characterized by comprising a substrate (1) and a plurality of through grooves (2) formed in the substrate (1), wherein the through grooves (2) are distributed in an array, clamping mechanisms (3) are slidably arranged in the through grooves (2), the clamping mechanisms (3) are distributed at the left end and the right end of the inner wall of the through grooves (2), auxiliary centering mechanisms (4) are slidably arranged in the through grooves (2), and the auxiliary centering mechanisms (4) are positioned at the upper end and the lower end of the inner wall;

the clamping mechanism (3) comprises two placing plates (31) which are arranged in the inner walls of the left side and the right side of the through groove (2) in a sliding manner, type frames (37) are arranged at the ends, deviating from each other, of the tops of the two placing plates (31), the openings of the type frames (37) face towards similar ends, two type frames (37) are hinged with two diagonal braces (32) at the ends, deviating from each other, of the type frames (37), the two diagonal braces (32) at one side of the type frames (37) are arranged symmetrically up and down, one ends, far from the type frames (37), of the two diagonal braces (32) are hinged with the surfaces of thread seats (33), the two thread seats (33) are arranged at the upper end and the lower end of a screw rod (34), the screw rod (34) is rotatably arranged in a base plate (1), the upper end and the lower end of the screw rod (34) are provided with two sections of symmetrical thread segments, the rotation directions of the two sections of thread segments are opposite, the two adjacent screw rod ends are vertically adjacent to each other, one another end is connected with one another through two adjacent screw rod drives through a synchronous belt pulley (34), and the screw rod (34) is synchronously matched with one screw rod (34) through a synchronous belt;

two the equal side-to-side sliding of the one end that type frame (37) is close is provided with splint (35), two the one end that splint (35) deviate from each other all is pegged graft through picture peg (36) and the lateral wall interaction of type frame (37), be provided with a plurality of first reset springs between the inner wall of splint (35) and type frame (37), two the one end that splint (35) deviate from each other is provided with locating plate (38) with the lateral wall butt of type frame (37).

2. The tooling for packaging the semiconductor according to claim 1, wherein the top ends of the two clamping plates (35) are rotatably provided with a flattening mechanism (5) which is in contact with the front end of the semiconductor carrier plate, the flattening mechanism (5) comprises a pressing plate (51) which is rotatably arranged at the upper end and the lower end of the front part of the clamping plates (35) through rotating shafts, gears (52) are arranged at the front parts of the two rotating shafts, tooth grooves meshed with the gears (52) are formed in the inner walls of the front end and the rear end of the -type frame (37), an opening groove for sliding the gears (52) is communicated with one end of the tooth groove, which is close to the opening of the -type frame (37), the clamping plates (35) and the pressing plate (51) are strip-shaped plates, and the cross sections of the front surface and the rear surface of the pressing plate (51) are smaller than the cross sections of the front surface of the clamping plates (35);

the rear sides of the close ends of the two pressing plates (51) are respectively provided with a slope which is convenient for contacting with the top end of the semiconductor carrier plate, and the rear sides of the pressing plates (51) and the slopes are respectively provided with a second adhesive layer (511);

a fourth magnet is fixedly arranged at one end, away from each other, of the top ends of the two clamping plates (35), and a third magnet (53) attracted with the fourth magnet is arranged on the side wall of the clamping plate (51).

3. The tooling for packaging semiconductors according to claim 1, wherein the auxiliary centering mechanism (4) comprises a storage groove which is formed in the middle of the upper end and the lower end of the through groove (2), sliding plates (41) are arranged in the two storage grooves in an up-down sliding mode, sliding covers (42) are fixedly arranged at the similar ends of the two sliding plates (41), first pushing plates (43) are detachably arranged at the similar ends of the two sliding covers (42), a second reset spring is arranged between the sliding plates (41) and the inner wall of the storage groove, first magnets (44) are embedded into the opposite ends of the two sliding plates (41), and first electromagnets (45) which are respectively attracted with the two first magnets (44) are arranged in the two storage grooves.

4. The tooling for semiconductor packaging according to claim 3, wherein a trigger assembly (6) is installed in a connection wire between the first electromagnet (45) and an external power supply, the trigger assembly (6) comprises an installation box (61) installed on the outer wall of a side plate of any type frame (37), a conductive ring (62) is fixedly arranged in the installation box (61), a conductive sheet (63) is inserted in the conductive ring (62) in a sliding manner, one end of the conductive sheet (63) is fixedly connected with the plugboard (36), the conductive sheet (63) is electrically connected with the positive end of the first electromagnet (45), the conductive ring (62) is electrically connected with the positive end of the external power supply, and the negative end of the first electromagnet (45) is electrically connected with the negative end of the external power supply.

5. The tooling for packaging semiconductors according to claim 3, wherein push rods (46) are arranged in the two sliding covers (42) in a vertical sliding manner, second push plates (47) are detachably arranged at the similar ends of the two push rods (46), second magnets (48) are fixedly arranged at the opposite ends of the two push rods (46), second electromagnets (49) which are attracted with the two second magnets (48) are respectively arranged in the two sliding covers (42), a third return spring is arranged between the push rods (46) and the inner wall of the sliding cover (42), and the push rods (46) penetrate through the middle of the first push plates (43) in a sliding manner.

6. The tooling for semiconductor packaging according to claim 5, wherein a mounting groove is formed in one end of the sliding plate (41), a fixed contact (413) electrically connected with the positive end of the second electromagnet (49) is fixedly installed in the mounting groove, the fixed contact (413) is electrically contacted with the sliding contact (412), the sliding contact (412) is arranged in the mounting groove in a left-right sliding manner, one end of the sliding contact (412) away from the fixed contact (413) is provided with a sliding rod (410) made of an insulating material, one end of the sliding rod (410) away from the sliding contact (412) is provided with a top block (411) in a detachable manner, the end part of the top block (411) penetrating through the sliding plate (41) is in butt joint with the inner wall of the accommodating groove, one end side wall of the two accommodating grooves is provided with an extending groove (414) in butt joint with the top block (411), and a fourth reset spring is arranged between the sliding rod (410) and the inner wall of the mounting groove.

7. The tooling for packaging a semiconductor according to claim 6, wherein one end of the top block (411) away from the slide bar (410) is arc-shaped; one end of the inner wall of the mounting groove, which is far away from the opening of the storage groove, is inclined so as to facilitate the sliding of the top block (411).

8. The tooling for packaging a semiconductor according to claim 6, wherein a first anti-slip plate (416) for preventing the slide plate (41) from slipping out is detachably mounted at one end of the mounting groove opening; the second anti-falling plate (417) is detachably arranged at the opening of the sliding cover (42), and one end, far away from the sliding cover (42), of the second anti-falling plate (417) is fixedly connected with the first push plate (43).

9. The tooling for packaging semiconductors according to claim 6, wherein a first adhesive layer (415) is disposed at one end of the second push plate (47) away from the push rod (46).

10. A tool for packaging semiconductors according to claim 1, wherein the adjacent ends of the clamping plates (35) are provided with a third glue layer.