CN117167685A - Matrix type LED heat dissipation device for car lamp - Google Patents
Matrix type LED heat dissipation device for car lamp Download PDFInfo
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- CN117167685A CN117167685A CN202311293829.0A CN202311293829A CN117167685A CN 117167685 A CN117167685 A CN 117167685A CN 202311293829 A CN202311293829 A CN 202311293829A CN 117167685 A CN117167685 A CN 117167685A
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- radiator
- fan
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- led
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- 239000011159 matrix material Substances 0.000 title claims abstract description 55
- 230000017525 heat dissipation Effects 0.000 title abstract description 23
- 239000000758 substrate Substances 0.000 claims description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 7
- 238000000641 cold extrusion Methods 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000004512 die casting Methods 0.000 description 4
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 3
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 206010063385 Intellectualisation Diseases 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The application discloses a matrix type LED heat dissipation device of a car lamp, which comprises a matrix type LED light source, a PCB (printed circuit board), a heat pipe assembly, a radiator and a fan, wherein the matrix type LED light source is packaged on the PCB, the heat pipe assembly is arranged in the radiator, the PCB is arranged at the front end of the radiator, and the fan is arranged at the rear of the radiator. The matrix LED heat dissipation device of the car lamp can realize small volume, light weight and low cost; the heat generated after the matrix LED is lighted can be rapidly LED out, and the temperature of the LED is reduced.
Description
Technical Field
The application relates to the technical field of LED heat dissipation devices, in particular to a matrix LED heat dissipation device for a car lamp.
Background
With the rapid development of automobile lighting technology, matrix type headlights become standard on the lighting system of middle and high-end vehicles due to the characteristics of intellectualization, individuation and science and technology, matrix type LED pixels are developed from hundred grades to ten thousand grades, and the heat dissipation of the automobile lights is a great challenge. The heat dissipation mode commonly used in the industry at present is the combination of PCB board, radiator and fan, and the PCB board is installed on the radiator, and the fan is installed in radiator below or rear according to lamps and lanterns space. The radiator generally adopts the process forms of die casting, stamping and the like, the radiator is subjected to the process, the cross section of the fin is generally linear, and the fin is parallel to the radiator substrate.
Currently, the following problems are common in the existing matrix type LED heat dissipation devices on the market:
1. matrix LED heat abstractor volume and weight are big, and is with high costs: in order to cope with the huge heat generated by matrix LEDs, lamp manufacturers consider various schemes to dissipate heat in the design stage, such as increasing the volume of a radiator, increasing the parts of an air duct, using water cooling, etc., but the cost and weight are greatly increased while improving the heat dissipation performance, which is contrary to the design direction of light weight, miniaturization and low cost of the existing lamps.
2. The heat generated by the matrix LED cannot be quickly conducted to the radiator to cause heat accumulation, the fan is arranged below the radiator to occupy the space in the lamp, the airflow of the fan arranged behind the radiator can be hindered by the radiator substrate, specifically, the heat generated after the matrix LED is lightened is conducted to the radiator through the PCB board, the heat conductivity coefficient of the common board of the PCB board is lower (aluminum substrate: 237W/m.K and copper substrate: 400W/m.K), so that the heat is accumulated and cannot be quickly conducted to the radiator; when the fan is arranged below the radiator, a larger space in the lamp is occupied; when the fan is arranged behind the radiator, the wind direction of the fan is vertical to the radiator base plate, and the base plate can block the advancing direction of the airflow, so that the generated hot airflow is not easy to flow quickly.
3. The die-casting aluminum radiator has low heat conductivity coefficient, high weight, low dimensional accuracy and strength of the punched aluminum radiator, small heat dissipation area of the fins with the linear cross section, and small number of the fins blown by the fan, which are distributed in parallel on the heat dissipation base plate, particularly, when the die-casting aluminum radiator is adopted, the die-casting aluminum radiator has low heat conductivity coefficient (96W/m.K), large volume and heavy weight; when the radiator adopts the punching press radiator, then punching press radiator dimensional accuracy and fin intensity are low, and linear type fin radiating area is less, and parallel distribution is on the radiator base plate, and the fin quantity that the fan can blow is less, and the utilization ratio is low.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art.
Therefore, the application provides the matrix LED heat dissipation device for the car lamp, which has the advantages of small volume, light weight, low cost and rapid heat dissipation.
The matrix type LED heat dissipation device for the vehicle lamp comprises a matrix type LED light source, a PCB (printed circuit board), a heat pipe assembly, a radiator and a fan, wherein the matrix type LED light source is packaged on the PCB, the heat pipe assembly is installed in the radiator, the PCB is installed at the front end of the radiator, and the fan is installed at the rear of the radiator.
The application has the advantages of small volume, light weight and low cost; the heat generated after the matrix LED is lighted can be rapidly LED out, and the temperature of the LED is reduced.
According to one embodiment of the application, the matrix type LED light source is a single multi-luminous-surface LED chip, or the matrix type LED light source is a matrix type structure formed by a plurality of single-luminous-surface LED chips.
According to one embodiment of the application, the heat pipe assembly comprises a disc-shaped heat pipe and a plurality of strip-shaped heat pipes, wherein the strip-shaped heat pipes are uniformly distributed in a radial manner in the circumferential direction of the disc-shaped heat pipe.
According to one embodiment of the application, the heat sink is made by a cold extrusion aluminum process.
According to one embodiment of the application, the radiator comprises a radiator base plate, a mounting groove, a boss, a radiator mounting column and a radiating fin, wherein the mounting groove is arranged on the front surface of the radiator base plate and used for mounting a heat pipe assembly, the boss is arranged on the rear surface of the radiator base plate and used for improving heat conduction, the radiator mounting column is arranged behind the radiator base plate, and the radiating fin is arranged behind the radiator base plate.
According to one embodiment of the application, the fan is positioned and installed on the radiator installation column behind the radiator, the fins behind the radiator are provided with the sink grooves matched with the shape of the fan, and the fan is inlaid in the sink grooves.
According to one embodiment of the application, the boss is located directly behind the matrix LED light source.
According to one embodiment of the application, the boss is a conical boss, the diameter of the top surface of the boss is smaller than or equal to the diameter of the rotating shaft of the fan, and the diameter of the bottom surface of the boss is larger than or equal to the diameter of the blade of the fan.
According to one embodiment of the present application, the heat radiating fins are uniformly arranged on the heat sink base plate in accordance with the rotation axis of the fan.
According to one embodiment of the application, the cross section of the radiating fin is wavy.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and drawings.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a schematic diagram of the structure of the present application;
FIG. 2 is a second schematic diagram of the structure of the present application;
FIG. 3 is a schematic structural view of a heat pipe assembly;
FIG. 4 is a schematic view of a fan mounting location;
fig. 5 is a fin profile.
The reference numerals in the figures are: 1. matrix type LED light source; 2. a PCB board; 3. a heat pipe assembly; 31. a disc-shaped heat pipe; 32. a plurality of strip heat pipes; 4. a heat sink; 41. a mounting groove; 42. a heat sink substrate; 43. a boss; 44. a radiator mounting post; 45. and a heat radiating fin.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of the present application, it should be understood that the directions or positional relationships indicated by the terms "one side", "the other side", "the two sides", "the middle", "the upper end", "the lower end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.
In the description of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "disposed" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, directly connected, or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
The following specifically describes a vehicle lamp matrix LED heat dissipating device according to an embodiment of the present application with reference to the accompanying drawings.
Referring to fig. 1, 2, 3, 4 and 5, the matrix type LED heat dissipation device for the car lamp of the application comprises a matrix type LED light source 1, a PCB 2, a heat pipe assembly 3, a radiator 4 and a fan 5, wherein the matrix type LED light source 1 is packaged on the PCB 2, the heat pipe assembly 3 is installed in the radiator 4, the PCB 2 is installed at the front end of the radiator 4, and the fan 5 is installed at the rear of the radiator 4.
The heat pipe assembly 3 includes a disc-shaped heat pipe 31 and a plurality of strip-shaped heat pipes 32, the plurality of strip-shaped heat pipes 32 are uniformly distributed in a radial shape in the circumferential direction of the disc-shaped heat pipe 31, and the disc-shaped heat pipe 31 and the plurality of strip-shaped heat pipes 32 are in an integrated structure. The diameter of the disc-shaped heat pipe 31 is not smaller than the matrix LED boundary, the length of the strip-shaped heat pipe 32 reaches the edge of the radiator substrate 42, the heat conductivity coefficient of the heat pipe assembly 3 is high (10000-100000W/m.K, which is 250 times of copper and 500 times of aluminum), the heat generated by the light source can be rapidly conducted to the radiator substrate 42, and the heat is emitted into the air through the radiating fins 45, so that the phenomenon that the heat is accumulated below the LED and cannot be timely emitted to cause LED damage is avoided. In addition, it should be noted that the number of the strip heat pipes 32 can be adjusted according to the total power of the LEDs.
The heat sink 4 includes a heat sink base 42, a mounting groove 41 provided at a front surface of the heat sink base 42 for mounting the heat pipe assembly 3, a boss 43 provided at a rear surface of the heat sink base 42 for improving heat conduction, a heat sink mounting post 44 provided at a rear of the heat sink base 42, and a heat dissipation fin 45 provided at a rear of the heat sink base 42. The radiator base plate 42, the mounting groove 41, the boss 43, the radiator mounting post 44, and the radiator fin 45 are integrally formed.
The mounting process of the matrix LED heat dissipation device of the car lamp is as follows: the heat pipe assembly 3 is first installed in the installation groove 41 of the heat sink 4, then the PCB board packaged with the matrix LED light source 1 is fastened to the front end of the heat sink 4 by screws, and the fan 5 is fastened to the rear of the heat sink 4 by screws.
The matrix type LED light source 1 is a single multi-luminous-surface LED chip, or the matrix type LED light source 1 is a matrix type structure formed by a plurality of single-luminous-surface LED chips.
The radiator 4 is made by cold extrusion aluminum process, namely the radiator 4 adopts cold extrusion aluminum process, the heat conductivity coefficient is high, the weight is light, simultaneously manufacturing precision and radiating fin 45 intensity are high, radiating fins 45 are evenly arranged on the radiator base plate 42 according to the rotation axis of the fan 5, namely the radiating fins 45 are evenly arranged on the radiator base plate 42 according to the rotation axis of the fan 5, all radiating fins 45 can be blown by fan air flow, gaps between the radiating fins 45 are air channels, the air flow can quickly radiate heat of the radiating fins 45 into the air, the cross section of the radiating fins 45 is wave-shaped, 15% of radiating area can be increased under the same fin length, and the radiator volume is effectively reduced under the same radiating requirement.
The fan 5 location is installed on the radiator erection column 44 at radiator 4 rear, be provided with on the fin at radiator 4 rear with the heavy groove of fan 5 appearance looks adaptation, fan 5 inlay in heavy groove, specifically, the radiating fin 45 at radiator 4 rear digs heavy groove according to fan 5 appearance, make fan 5 inlay completely inside radiator 4, fan 5 does not additionally occupy the lamp inner space, fan 5 air-out face is inside radiating fin 45 simultaneously, the phenomenon of leaking out can not appear, increase fan 5 availability factor.
The boss 43 is located directly behind the matrix LED light source 1. The boss 43 is a conical boss, the boss 43 comprises a top surface, a bottom surface and a side surface, the diameter of the top surface of the boss 43 is smaller than or equal to the diameter of the rotating shaft of the fan 5, and the diameter of the bottom surface of the boss 43 is larger than or equal to the diameter of the blade of the fan 5. Specifically, the rear surface of the radiator substrate 42 is provided with the conical boss 43, the boss 43 is positioned right behind the LED, heat conduction to the rear speed can be improved, meanwhile, the diameter of the top surface of the boss 43 is not larger than the diameter of the rotating shaft of the fan 5, the diameter of the bottom surface of the boss 43 is not smaller than the diameter of the blade of the fan 5, the air flow of the fan 5 blows to the side surface of the boss 43, the side surface is an inclined side surface, and compared with the traditional vertical plane, the wind speed is obviously improved. The side surface of the boss 43 may be designed as an inclined surface or an arc surface.
According to the matrix type LED heat dissipation device for the car lamp, the brand-new heat pipe assembly 3, the extruded aluminum radiator 4 and the fan 5 are combined, the phenomenon that the matrix type module is poor in heat dissipation performance is improved, the heat pipe assembly 3 is used for solving the problem that matrix type LED heat cannot be dissipated due to accumulation, the fan 5 is inlaid and installed inside the heat dissipation fins 45, the space in the lamp is not occupied, air leakage is avoided, the radiator substrate 42 is designed to be of a boss structure, heat conduction and the air flow speed of the fan 5 can be increased, the heat dissipation fins 45 are rotationally arranged, the fan 5 can be guaranteed to blow each fin, the cross section of the fin is wavy, the heat dissipation area is increased, and the weight of the module is reduced.
The foregoing is only a preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art, who is within the scope of the present application, should make equivalent substitutions or modifications according to the technical scheme of the present application and the inventive concept thereof, and should be covered by the scope of the present application.
Claims (10)
1. A car light matrix LED heat abstractor, its characterized in that: including matrix LED light source (1), PCB board (2), heat pipe assembly (3), radiator (4) and fan (5), matrix LED light source (1) encapsulation is in on PCB board (2), heat pipe assembly (3) are installed in radiator (4), PCB board (2) are installed the front end of radiator (4), fan (5) are installed the rear of radiator (4).
2. The vehicle lamp matrix LED heat sink of claim 1, wherein: the matrix type LED light source (1) is a single light emitting surface LED chip, or the matrix type LED light source (1) is a matrix type structure formed by a plurality of single light emitting surface LED chips.
3. The vehicle lamp matrix LED heat sink of claim 1, wherein: the heat pipe assembly (3) comprises a disc-shaped heat pipe (31) and a plurality of strip-shaped heat pipes (32), wherein the strip-shaped heat pipes (32) are uniformly distributed in the radial direction of the disc-shaped heat pipe (31).
4. The vehicle lamp matrix LED heat sink of claim 1, wherein: the radiator (4) is made by a cold extrusion aluminum process.
5. The vehicle lamp matrix LED heat sink of claim 1, wherein: the radiator (4) comprises a radiator substrate (42), a mounting groove (41) which is arranged on the front surface of the radiator substrate (42) and used for mounting the heat pipe assembly (3), a boss (43) which is arranged on the rear surface of the radiator substrate (42) and used for improving heat conduction, radiator mounting columns (44) which are arranged behind the radiator substrate (42) and radiating fins (45) which are arranged behind the radiator substrate (42).
6. The vehicle lamp matrix LED heat sink of claim 5, wherein: the fan (5) is positioned and installed on a radiator installation column (44) behind the radiator (4), a sink groove matched with the appearance of the fan (5) is formed in a fin behind the radiator (4), and the fan (5) is inlaid in the sink groove.
7. The vehicle lamp matrix LED heat sink of claim 5, wherein: the boss (43) is located right behind the matrix type LED light source (1).
8. The vehicle lamp matrix LED heat sink of claim 5, wherein: the boss (43) is a conical boss, the top surface diameter of the boss (43) is smaller than or equal to the diameter of a rotating shaft of the fan (5), and the bottom surface diameter of the boss (43) is larger than or equal to the diameter of a fan blade of the fan (5).
9. The vehicle lamp matrix LED heat sink of claim 5, wherein: the radiating fins (45) are uniformly arranged on the radiator base plate (42) according to the rotation shaft of the fan (5).
10. The vehicle lamp matrix LED heat sink of claim 5, wherein: the cross section of the radiating fin (45) is wavy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311293829.0A CN117167685A (en) | 2023-10-07 | 2023-10-07 | Matrix type LED heat dissipation device for car lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311293829.0A CN117167685A (en) | 2023-10-07 | 2023-10-07 | Matrix type LED heat dissipation device for car lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117167685A true CN117167685A (en) | 2023-12-05 |
Family
ID=88935528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311293829.0A Pending CN117167685A (en) | 2023-10-07 | 2023-10-07 | Matrix type LED heat dissipation device for car lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117167685A (en) |
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2023
- 2023-10-07 CN CN202311293829.0A patent/CN117167685A/en active Pending
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