CN216744185U - Efficient heat dissipation structure of LED on car lamp circuit board - Google Patents
Efficient heat dissipation structure of LED on car lamp circuit board Download PDFInfo
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- CN216744185U CN216744185U CN202220482902.3U CN202220482902U CN216744185U CN 216744185 U CN216744185 U CN 216744185U CN 202220482902 U CN202220482902 U CN 202220482902U CN 216744185 U CN216744185 U CN 216744185U
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Abstract
The utility model relates to the technical field of vehicle lamp lighting, in particular to a high-efficiency heat dissipation structure of an LED on a circuit board of a vehicle lamp. The heat dissipation device comprises a passive heat dissipation device and an active heat dissipation device, wherein a heat radiator is bonded with a circuit board through a heat conduction adhesive layer, and the heat radiator is arranged right opposite to a heat dissipation through hole; the temperature sensor is arranged under the LED light source and used for monitoring the heat generated by the LED light source in real time, the lower surface of the radiator in the passive radiating device is provided with a clamping groove, the radiating fan is arranged on the fan bracket to form a fan assembly, the fan assembly is clamped on the clamping groove, and the radiating fan is arranged right opposite to the radiating through hole to increase the air circulation efficiency. The heat dissipation through hole is organically combined with the radiator and the heat dissipation fan, the heat dissipation through hole is designed, convection heat dissipation is more sufficient, active heat dissipation with the fan is achieved, convection is fully considered, and heat generated around the high-power light source LED is timely dissipated through air circulation formed by the fan.
Description
Technical Field
The utility model relates to the technical field of vehicle lamp lighting, in particular to a high-efficiency heat dissipation structure of an LED on a circuit board of a vehicle lamp.
Background
With the improvement of the development level of automobiles, the functions of the automobile lamp become more and more abundant and intelligent while meeting the requirements of daily lighting, and in order to meet more requirements, the LED light source on the surface of the circuit of the automobile lamp has to adopt a high-power LED light source, but the problem faced by the high-power light source is the heat dissipation problem.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: the high-efficiency heat dissipation structure of the LED on the car lamp circuit board organically combines the heat dissipation through hole with the radiator and the heat dissipation fan, and the design of the heat dissipation through hole enables convection heat dissipation of LED accessories of the car lamp circuit board to be more sufficient, and the heat dissipation efficiency of the circuit board through hole structure is achieved.
The technical scheme adopted by the utility model for solving the technical problems is as follows: an efficient heat dissipation structure of an LED on a circuit board of a car lamp is used for dissipating heat of an LED light source mounted on the circuit board and comprises a passive heat dissipation device and an active heat dissipation device, wherein the passive heat dissipation device comprises a plurality of heat dissipation through holes and a heat radiator which are formed in the circuit board; the active heat dissipation device comprises a heat dissipation fan and a temperature sensor, wherein the temperature sensor is installed under the LED light source and used for monitoring the heat generated by the LED light source in real time, a clamping groove is formed in the lower surface of the heat dissipation device in the passive heat dissipation device, the heat dissipation fan is installed on the fan support to form a fan assembly, the fan assembly is clamped on the clamping groove, and the heat dissipation fan is arranged right opposite to the heat dissipation through hole and used for increasing the air circulation efficiency.
Furthermore, the radiator is also provided with a heat dissipation through hole which is opposite to the heat dissipation through hole.
Furthermore, a temperature sensor is arranged in the middle of the radiator and is arranged in the clamping groove.
Further, the heat dissipation via hole is the surrounding type or the annular surrounding type setting all around, and the number of turns of heat dissipation via hole is greater than 2 circles.
Furthermore, a plurality of radiating fins or radiating columns are uniformly arranged on the lower surface of the radiator.
Furthermore, the heat dissipation through holes and the heat dissipation through holes are coaxially arranged.
Furthermore, a conducting layer is arranged on the inner wall of the heat dissipation through hole.
The utility model has the beneficial effects that: the utility model fully considers three forms of heat dissipation, particularly considers conduction heat dissipation and convection heat dissipation in heat dissipation, organically combines the heat dissipation through hole with the radiator and the heat dissipation fan, and designs the heat dissipation through hole, so that the convection heat dissipation is more sufficient, and fully considers the convection for active heat dissipation with the fan, and the heat generated around the high-power light source LED is dissipated in time through airflow circulation formed by the fan.
Drawings
The utility model is further illustrated with reference to the following figures and examples.
FIG. 1 is a schematic structural diagram of a preferred embodiment of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is a schematic view of the present invention with the cover removed;
in the figure: 1. the LED lamp comprises a heat dissipation fan, 2 parts of a heat conduction adhesive layer, 3 parts of a circuit board, 4 parts of an LED lamp source, 5 parts of heat dissipation through holes, 7 parts of a heat radiator, 8 parts of heat dissipation through holes, 10 parts of a temperature sensor and 11 parts of a clamping groove.
Detailed Description
The utility model will now be described in further detail with reference to the drawings and preferred embodiments. These drawings are simplified schematic diagrams each illustrating the basic structure of the present invention only in a schematic manner, and thus show only the constitution related to the present invention.
The efficient heat dissipation structure of the LED on the car lamp circuit board is used for dissipating heat of an LED light source 4 mounted on the circuit board 3 and comprises a passive heat dissipation device and an active heat dissipation device, wherein the passive heat dissipation device comprises a plurality of heat dissipation through holes 5 and a heat sink 7 which are formed in the circuit board 3, the heat sink 7 is attached to the circuit board 3 through a heat conduction adhesive layer 2, and the heat sink 7 is arranged opposite to the heat dissipation through holes 5;
the active heat dissipation device comprises a heat dissipation fan 1 and a temperature sensor 10, wherein the temperature sensor 10 is installed under the LED light source 4 and used for monitoring the heat generated by the LED light source 4 in real time, a clamping groove 11 is formed in the lower surface of a heat sink 7 in the passive heat dissipation device, the heat dissipation fan 1 is installed on a fan support to form a fan assembly, the fan assembly is clamped on the clamping groove 11, and the heat dissipation fan 1 is arranged right opposite to a heat dissipation through hole 5 and used for increasing the air circulation efficiency.
As shown in fig. 2 to 3, the heat sink 7 is further provided with a heat dissipating through hole 8, and the heat dissipating through hole 8 is disposed opposite to the heat dissipating through hole 5, so as to ensure that air can freely pass through the heat sink 7 and the circuit board 3, thereby providing conditions for active heat dissipation of the fan assembly.
As shown in fig. 2, a temperature sensor 10 is mounted at a position right in the middle of the heat sink 7, and the temperature sensor 10 is mounted in the card slot 11.
The heat dissipation through holes 5 can be correspondingly adjusted according to the size of the circuit board 3 and the power of the LED light source 4, when the power of the LED light source 4 is lower than the light source base surface with a certain numerical value (2W), the diameter of the heat dissipation through holes can be generally set to be larger than 0.4mm, the hole spacing is larger than 1.1mm, the heat dissipation through holes 5 can be set to be of a surrounding type and an annular surrounding type, and the number of the through holes is larger than 2 circles;
when the power of the LED light source 4 is larger than the light source base surface with a certain numerical value (2W), the surface manufacturing capability of a PCB surface manufacturing supplier can be combined, the distance between the adjacent heat dissipation through holes 5 is reduced as much as possible, the number of turns of the heat dissipation through holes 5 is increased, and the thickness of the conducting layer of the inner layer of the hole wall is increased, so that the heat conducting capability of the heat dissipation through holes is increased.
The diameter of the heat dissipation through holes 5 is larger than 0.4mm, the hole distance between every two adjacent heat dissipation through holes 5 is larger than 1.1mm, the heat dissipation through holes 5 are arranged in a surrounding mode or an annular surrounding mode, and the number of turns of the heat dissipation through holes 5 is larger than 2 circles.
A plurality of radiating fins or radiating columns are uniformly arranged on the lower surface of the radiator 7, and the radiating through holes 5 and the radiating through holes 8 are coaxially arranged.
The heat dissipation through hole 5 conducts the heat on the high-power LED lamp source 4 from the light source base surface of the circuit board 3 to the heat sink 7, and the heat dissipation fins or the heat dissipation columns on the lower surface of the heat sink 7 can bring the heat on the lower surface of the heat sink 7 to the air around and in the whole module to the maximum extent through radiation and conduction
Specifically, the state shown in fig. 2 can be realized through assembly, after the assembly is completed, the fan assembly is located in the fan assembly, the position, right opposite to the fan assembly, of the fan assembly is provided with a heat dissipation through hole 5, and heat dissipation fins or heat dissipation fins are arranged around the fan assembly.
When the high-power LED light source 4 starts to work, the temperature sensor 10 positioned right below the LED light source 4 can monitor the temperature of the light source in real time, and a temperature threshold value is set according to the conditions of the used LED light source 4 and the like.
When the temperature value is lower than the set temperature threshold value, the fan assembly is not started, and only passive conduction heat dissipation is carried out by depending on the heat dissipation through holes 5 and the heat dissipation fins or the heat dissipation finned columns on the heat dissipater 7;
when the temperature sensor 10 detects that the temperature exceeds a set threshold value, the fan assembly is started, and active heat dissipation and passive heat dissipation are carried out simultaneously.
While particular embodiments of the present invention have been described in the foregoing specification, the present invention is not limited to the specific embodiments, and modifications and variations of the foregoing detailed description can be made by those skilled in the art without departing from the spirit and scope of the utility model.
Claims (7)
1. The utility model provides a high-efficient heat radiation structure of LED on car light circuit board for LED light source (4) to installing on circuit board (3) dispel the heat, its characterized in that: comprises a passive heat dissipation device and an active heat dissipation device,
the passive heat dissipation device comprises a plurality of heat dissipation through holes (5) and a heat radiator (7) which are formed in the circuit board (3), the heat radiator (7) is bonded with the circuit board (3) through a heat conducting adhesive layer (2), and the heat radiator (7) is arranged right opposite to the heat dissipation through holes (5);
initiative heat abstractor includes radiator fan (1) and temperature sensor (10), install under LED light source (4) temperature sensor (10) for the produced heat of real-time supervision LED light source (4), draw-in groove (11) have been seted up on the lower surface of radiator (7) among the passive heat abstractor, radiator fan (1) is installed on fan bracket, form the fan assembly, fan assembly joint is on draw-in groove (11), and radiator fan (1) is just setting up through heat dissipation hole (5), be used for increasing circulation of air efficiency.
2. The efficient heat dissipation structure for the LED on the circuit board of the vehicular lamp according to claim 1, wherein: the radiator (7) is further provided with a heat dissipation through hole (8), and the heat dissipation through hole (8) is arranged right opposite to the heat dissipation through hole (5).
3. The efficient heat dissipation structure for the LED on the circuit board of the vehicular lamp according to claim 1, wherein: the middle position of the radiator (7) is provided with a temperature sensor (10), and the temperature sensor (10) is arranged in the clamping groove (11).
4. The efficient heat dissipation structure for the LED on the circuit board of the vehicular lamp according to claim 1, wherein: the heat dissipation through holes (5) are arranged in a surrounding mode or an annular surrounding mode, and the number of turns of the heat dissipation through holes (5) is larger than 2.
5. The efficient heat dissipation structure for the LED on the circuit board of the vehicular lamp according to claim 2, wherein: the lower surface of the radiator (7) is uniformly provided with a plurality of radiating fins or radiating columns.
6. The efficient heat dissipation structure for the LED on the circuit board of the vehicular lamp according to claim 2, wherein: the heat dissipation through hole (5) and the heat dissipation through hole (8) are coaxially arranged.
7. The efficient heat dissipation structure for the LED on the circuit board of the vehicular lamp according to claim 6, wherein: and a conductive layer is also arranged on the inner wall of the heat dissipation through hole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220482902.3U CN216744185U (en) | 2022-03-08 | 2022-03-08 | Efficient heat dissipation structure of LED on car lamp circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220482902.3U CN216744185U (en) | 2022-03-08 | 2022-03-08 | Efficient heat dissipation structure of LED on car lamp circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216744185U true CN216744185U (en) | 2022-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220482902.3U Active CN216744185U (en) | 2022-03-08 | 2022-03-08 | Efficient heat dissipation structure of LED on car lamp circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216744185U (en) |
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2022
- 2022-03-08 CN CN202220482902.3U patent/CN216744185U/en active Active
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