CN117167234A - Cryopump adsorption array and cryopump - Google Patents
Cryopump adsorption array and cryopump Download PDFInfo
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- CN117167234A CN117167234A CN202311412895.5A CN202311412895A CN117167234A CN 117167234 A CN117167234 A CN 117167234A CN 202311412895 A CN202311412895 A CN 202311412895A CN 117167234 A CN117167234 A CN 117167234A
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- array
- cryopump
- adsorption sheet
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- 238000001179 sorption measurement Methods 0.000 title claims abstract description 185
- 238000012546 transfer Methods 0.000 claims abstract description 81
- 239000011159 matrix material Substances 0.000 claims abstract description 8
- 238000005086 pumping Methods 0.000 abstract description 29
- 239000001257 hydrogen Substances 0.000 abstract description 15
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 15
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 13
- 239000007789 gas Substances 0.000 description 41
- 238000012360 testing method Methods 0.000 description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000003491 array Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003463 adsorbent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002250 absorbent Substances 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 helium and the like Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Compressors, Vaccum Pumps And Other Relevant Systems (AREA)
Abstract
The application relates to a cryopump attaching matrix and a cryopump, and belongs to the field of cryopumps. Comprising the following steps: a first heat transfer member having a first end in thermal contact with the cold source and a second end extending in a first direction toward an adsorption end of the cryopump; the adsorption sheets are configured in a plurality and are all fixed at the second end of the first heat transfer element; the adsorption sheet comprises a first surface and a second surface, wherein the first surface and the second surface are the two surfaces with the largest surface area of the adsorption sheet; the plurality of adsorption sheets are annularly arranged at the adsorption end of the cryopump, the annular axis is parallel to the first direction, and the first surface of each adsorption sheet faces the second surface of the adjacent adsorption sheet; at least part of the first surfaces or the second surfaces of the adsorption sheets are provided with preset structures: at least part of the first surface or the second surface is an axial direction relative to the ring shape, and/or a radial inclined plane of the ring shape; and/or at least part of the first surface or the second surface is curved. The technical scheme of the application can solve the problem of lower pumping speed of hydrogen.
Description
Technical Field
The application relates to the field of cryopumps, in particular to a cryopump attachment array and a cryopump.
Background
In the fabrication of semiconductor devices, high vacuum, high cleanliness or low temperature environments are all required, and in these respects, semiconductor cryopumps have significant advantages.
The ion implantation process has high hydrogen pumping speed requirement on the low-temperature pump, and the adsorption array is a main component for influencing the pumping speed of the low-temperature pump. The adsorption array with the traditional tower-shaped structure has lower pumping speed on hydrogen (the liquefying temperature is lower than 20K) and cannot meet the requirement of an ion implantation process. Therefore, the structure of the adsorption array needs to be redesigned, so that the pumping speed of hydrogen can be improved.
Disclosure of Invention
Accordingly, embodiments of the present application provide a cryopump adsorption array and a cryopump for solving at least one of the problems in the background art.
In order to achieve the above purpose, the technical scheme of the application is realized as follows:
in a first aspect, an embodiment of the present application provides a cryopump attachment array, including:
a first heat transfer member having a first end in thermal contact with the cold source and a second end extending in a first direction toward an adsorption end of the cryopump; the first direction is the axial direction of the cryopump;
a plurality of adsorption sheets which are arranged and are all fixed at the second end of the first heat transfer element; the adsorption sheet comprises a first surface and a second surface, wherein the first surface and the second surface are the two surfaces with the largest surface area of the adsorption sheet; a plurality of the adsorption sheets are annularly arranged at the adsorption end of the cryopump, the axis of the annular shape is parallel to the first direction, and the first surface of each adsorption sheet faces the second surface of the adjacent adsorption sheet; at least part of the first surface or the second surface of the plurality of adsorption sheets is provided with a preset structure, and the preset structure comprises:
at least part of the first surface or the second surface is an axial direction relative to the ring shape, and/or a radial inclined plane of the ring shape;
and/or at least part of the first surface or the second surface is curved.
Optionally, the low Wen Bengxi array further comprises:
and the second heat transfer element is fixed at the second end of the first heat transfer element, and the adsorption sheet is fixed at the second end of the first heat transfer element through the second heat transfer element.
Optionally, the first heat transfer element includes:
the connecting plate extends from the cold source to the adsorption end;
the mounting plate is fixed at the end part of the connecting plate, which is close to the second end, extends along the radial direction of the ring shape, and the second heat transfer element is fixed at the radial end part of the mounting plate.
Optionally, the second heat transfer element includes four sub heat transfer elements, each of the sub heat transfer elements is mounted at the second end of the first heat transfer element, and at least a portion of the sub heat transfer elements are staggered from each other in the axial direction of the ring, and a portion of the sub heat transfer elements are staggered in the circumferential direction of the ring: each sub heat transfer element is respectively provided with a part of the adsorption sheets.
Optionally, the preset structure includes:
the first surface or the second surface is a plane inclined by 1-9 degrees relative to the axial direction of the ring shape.
Optionally, the preset structure includes:
the first surface or the second surface is an arc surface with the radius of 350-650 mm.
Optionally, the preset structure includes:
the first surface or the second surface of the first adsorption sheet close to the first end in the four sub heat transfer elements is a plane inclined by 1-9 degrees relative to the axial direction of the ring;
the first surface or the second surface of the second adsorption sheet, which is arranged in the four sub heat transfer elements and is far away from the first end, is a plane inclined by 1-9 degrees relative to the axial direction of the ring shape, and the inclination direction of the first adsorption sheet is opposite.
Optionally, the preset structure includes:
the first surface or the second surface of the first adsorption sheet close to the first end in the four sub heat transfer elements is a plane inclined by 1-9 degrees relative to the axial direction of the ring;
the first surface or the second surface of the second adsorption sheet which is arranged in the four sub heat transfer elements and is far away from the first end is an arc surface with the radius of 350-650 mm.
Optionally, the preset structure includes:
the shapes of the first surface and the second surface of the adjacent two adsorption sheets which face each other are mirror images;
and/or the shapes of the first surface and the second surface of the same adsorption sheet are symmetrical to each other.
In a second aspect, embodiments of the present application provide a cryopump including any of the cryopump attachment arrays described above.
The low Wen Bengxi array and cryopump includes: a first heat transfer member having a first end in thermal contact with the cold source and a second end extending in a first direction toward an adsorption end of the cryopump; the first direction is the axial direction of the cryopump; a plurality of adsorption sheets which are arranged and are all fixed at the second end of the first heat transfer element; the adsorption sheet comprises a first surface and a second surface, wherein the first surface and the second surface are the two surfaces with the largest surface area of the adsorption sheet; a plurality of the adsorption sheets are annularly arranged at the adsorption end of the cryopump, the axis of the annular shape is parallel to the first direction, and the first surface of each adsorption sheet faces the second surface of the adjacent adsorption sheet; at least part of the first surface or the second surface of the plurality of adsorption sheets is provided with a preset structure, and the preset structure comprises: at least part of the first surface or the second surface is an axial direction relative to the ring shape, and/or a radial inclined plane of the ring shape; and/or at least part of the first surface or the second surface is curved. It can be seen that, in the low Wen Bengxi array and the cryopump of the embodiments of the present application, the adsorption sheets are annularly arranged at the adsorption end of the cryopump, the annular axis is parallel to the first direction, and the first surface of each adsorption sheet faces the second surface of the adjacent adsorption sheet, that is, the length or width direction of the adsorption sheet extends approximately along the annular axis, the thickness direction of the adsorption sheet is the annular circumferential direction, and at least part of the first surface or the second surface of the adsorption sheets is provided with a preset structure, so that the flow resistance of the adsorption sheet to gas can be reduced, the collision probability between gas molecules and the adsorption array can be increased, and the gas pumping speed is advantageously increased. Therefore, the low Wen Bengxi array and the low-temperature pump can solve the problem of low pumping speed of hydrogen.
Additional aspects and advantages of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the application.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic diagram of an adsorption array of a "tower" structure in the related art;
FIG. 2 is a schematic diagram of an adsorption array of a cryopump according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a cryopump adsorption matrix according to an embodiment of the present application after activated carbon removal;
FIG. 4 is a schematic top view of FIG. 3;
FIG. 5 is a schematic diagram of a side view of FIG. 3;
FIG. 6 is a schematic diagram of a first heat transfer element in a cryopump adsorption array according to an embodiment of the present application;
FIG. 7 is a schematic view of the installation of a second heat transfer element and a first adsorbent sheet in a low Wen Bengxi array provided by an embodiment of the application;
FIG. 8 is a schematic view of the installation of a second heat transfer element and a second adsorbent sheet in a low Wen Bengxi array provided by an embodiment of the application;
fig. 9 is a schematic diagram of a cryopump according to an embodiment of the present application.
Reference numerals illustrate:
20. low Wen Bengxi attached array; 21. an upper left adsorption matrix; 22. a lower left adsorption matrix; 23. an upper right adsorption matrix; 24. a right lower adsorption matrix; 31. a first heat transfer member; 311. a connecting plate; 312. a mounting plate; 32. a second heat transfer member; 321. a second heat transfer member; 322. a second heat transfer member; 33. an adsorption sheet; 331. a first adsorption sheet; 332. a second adsorption sheet; 34. a radiation shield; 35. activated carbon; 40. a pump housing; 50. a cold screen; 60. a shadow mask; 70. an armored heater; 80. and a secondary cold head.
Detailed Description
In order to make the technical scheme and the beneficial effects of the application more obvious and understandable, the following detailed description is given by way of example. Wherein the drawings are not necessarily to scale, and wherein local features may be exaggerated or reduced to more clearly show details of the local features; unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
In the description of the present application, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. refer to the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely for convenience of simplifying the description of the present application, and do not indicate that the apparatus or element referred to must have a specific orientation, be constructed and operated in a specific orientation, i.e., are not to be construed as limiting the present application.
In the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as relative importance of the features indicated or the number of technical features indicated. Thus, a feature defining "first", "second" may explicitly include at least one such feature. In the description of the present application, "plurality" means at least two, for example, two, three, etc.; "plurality" means at least one, such as one, two, three, etc.; unless otherwise specifically defined.
In the present application, the terms "mounted," "connected," "secured," "disposed," and the like are to be construed broadly, unless otherwise specifically limited. For example, "connected" may be either fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, or can be communicated between two elements or the interaction relationship between the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless explicitly defined otherwise, a first feature "on", "above", "over" and "above", "below" or "under" a second feature may be that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact via an intermediary. Moreover, a first feature "above," "over" and "on" a second feature may be that the first feature is directly above or obliquely above the second feature, or simply indicates that the level of the first feature is higher than the level of the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the level of the first feature is less than the level of the second feature.
In order to provide a thorough understanding of the present application, detailed steps and detailed structures will be presented in the following description in order to explain the technical solution of the present application. Preferred embodiments of the present application are described in detail below, however, the present application may have other embodiments in addition to these detailed descriptions.
Fig. 1 is a schematic diagram of an adsorption array of a "tower-shaped" structure in the related art, and it is proved that the pumping speed of hydrogen (the liquefaction temperature is lower than 20K) is lower by using the adsorption array of the conventional "tower-shaped" structure. The inventor finds that the adsorption sheets 33 of the adsorption array with the tower-shaped structure have larger flow resistance to gas, and the collision probability of gas molecules and the adsorption array is smaller, so that the gas pumping speed is influenced.
Example 1
The embodiment of the application provides a cryopump adsorption array 20, as shown in fig. 2-5, the low Wen Bengxi array 20 includes:
a first heat transfer member 31 having a first end thermally contacting the cold source and a second end extending in a first direction toward an adsorption end of the cryopump; the first direction is the axial direction of the cryopump;
a plurality of adsorption sheets 33, each of which is fixed to the second end of the first heat transfer member 31; the adsorption sheet 33 includes a first surface and a second surface, which are two surfaces with the largest surface area of the adsorption sheet 33; a plurality of the adsorption sheets 33 are annularly arranged at the adsorption end of the cryopump, the axis of the annulus is parallel to the first direction, and the first surface of each of the adsorption sheets 33 faces the second surface of the adjacent adsorption sheet 33; at least a part of the first surface or the second surface of the plurality of adsorption sheets 33 is provided with a preset structure including:
at least part of the first surface or the second surface is an axial direction relative to the ring shape, and/or a radial inclined plane of the ring shape;
and/or at least part of the first surface or the second surface is curved.
It will be appreciated that in the cryopump, the cold source may be the refrigerator's secondary cold head 80. The adsorption end of the cryopump is the inlet end of the gas flowing into the cryopump, also referred to as the pump port. The outer surface of the adsorption end of the cryopump may be open, or may be divided by installing some spokes, for example, a baffle 60 may be installed, where the diameter of the baffle 60 is slightly larger than the diameter of the adsorption array, and when the cryopump is observed in a direction perpendicular to the pump port, the baffle 60 may completely shield the adsorption array, so that heat leakage may be reduced.
Specifically, the refrigerator may be a GM refrigerator.
The adsorption sheet 33 is used for condensing the gas into solid, thereby achieving the effect of adsorbing the gas. The first surface and the second surface may be the two largest sides of the absorbent sheet 33 and disposed opposite each other, or may be considered as one front side and one back side. The first surface and the second surface have large areas and are the main working surfaces of the adsorption sheet 33.
It will be appreciated that the adsorption sheets 33 are arranged annularly at the adsorption end of the cryopump, the axis of the annular shape is parallel to the first direction, and the first surface of each of the adsorption sheets 33 faces the second surface of the adjacent adsorption sheet 33, that is, the length or width direction of the adsorption sheet 33 extends substantially in the axial direction of the annular shape, and the thickness direction of the adsorption sheet 33 is the circumferential direction of the annular shape. In this way, the flow resistance of the adsorption sheet 33 to the gas can be reduced.
Specifically, the length direction of the adsorption sheet 33 may extend in the annular axial direction, so that the structure is more compact, and the moving path length of the gas molecules can be increased, thereby improving the collision probability with the adsorption array.
It should be noted that, the preset structure can improve the collision probability between the gas molecules and the adsorption array. For example, the collision probability of gas molecules and the adsorption array can be improved by obliquely arranging or arranging a curved surface and the like.
According to the low Wen Bengxi array 20 of the embodiment of the application, the adsorption sheets 33 are annularly arranged at the adsorption end of the low-temperature pump, the annular axis is parallel to the first direction, the first surface of each adsorption sheet 33 faces the second surface of the adjacent adsorption sheet 33, and at least part of the first surface or the second surface of the adsorption sheets 33 is provided with a preset structure, so that the flow resistance of the adsorption sheets 33 to gas can be reduced, the collision probability of gas molecules and the adsorption array can be increased, the gas pumping speed can be increased, and the problem of lower pumping speed of hydrogen can be solved.
It will be appreciated that other problems with pumping rates of gases similar to the physicochemical properties of hydrogen, such as helium and the like, can also be addressed.
Specifically, activated carbon 35 may be mounted on the surface of the adsorption sheet 33. The activated carbon 35 has higher micropore and submicron duty ratio, is more suitable as an adsorption material of a cryopump, and can further improve the pumping speed. More specifically, activated carbon 35 may be spread over the first surface and the second surface to further enhance the pumping speed.
In some embodiments, the low Wen Bengxi array 20 further comprises:
a second heat transfer member 32 fixed to the second end of the first heat transfer member 31, and the adsorption sheet 33 is fixed to the second end of the first heat transfer member 31 through the second heat transfer member 32.
In this way, the adsorption sheet 33 can be mounted well as transferring heat well. Specifically, the second heat transfer member 32 may be a circular ring shape corresponding to the annular arrangement of the adsorption sheets 33.
In some embodiments, as shown in fig. 6, the first heat transfer member 31 includes:
the connecting plate 311 extends from the cold source to the adsorption end;
a mounting plate 312 fixed to an end of the connection plate 311 near the second end, extending in a radial direction of the ring shape, and the second heat transfer member 32 is fixed to an end of the mounting plate 312 in the radial direction.
The combined shape of the connection plate 311 and the mounting plate 312 is similar to a T shape, so that heat transfer is facilitated, and the adsorption plate is also conveniently mounted. Specifically, the materials of the connecting plate 311 and the mounting plate 312 are oxygen-free copper, so that the heat transfer capability is stronger.
In some embodiments, the second heat transfer element 32 comprises four sub heat transfer elements, each of which is mounted to the second end of the first heat transfer element 31 and is at least partially offset from each other in the axial direction of the annulus and partially offset in the circumferential direction of the annulus: each of the sub heat transfer members is respectively provided with a part of the adsorption sheet 33.
Specifically, in the direction shown in fig. 2 or 3, four sub heat transfer elements may be divided into upper 2, lower 2, and upper and lower sub heat transfer elements may be offset from each other in the axial direction. The sub-heat transfer elements which are located above or below can be offset in the circumferential direction, for example two semicircular sub-heat transfer elements forming an annular shape.
In particular, the shape of the upper and lower sub heat transfer members may be different and the same shape as the upper or lower sub heat transfer members. Accordingly, depending on the shape, the upper and lower sub heat transfer members may be referred to as the second first heat transfer member 321 and the second heat transfer member 322, respectively, and the corresponding adsorption sheets 33 may be referred to as the first adsorption sheet 331 and the second adsorption sheet 332. Then, the combination of each sub heat transfer member and each adsorption sheet 33 is oriented in the direction shown in fig. 2 or 3, and the adsorption array is divided into a plurality of sub adsorption arrays, which are respectively referred to as an upper left adsorption array 21, a lower left adsorption array 22, an upper right adsorption array 23 and a lower right adsorption array 24, and the second heat transfer members of the four sub adsorption arrays are different and independent from each other.
Thus, on the one hand, the installation of the second heat transfer member 32 and the adsorption sheet 33 is facilitated; on the other hand, the shape and the mounting position of the adsorption sheet 33 at each position can be made different, and the probability of collision between the gas molecules and the adsorption array can be further improved.
Specifically, the mounting of the sub heat transfer member and the adsorption sheet 33 can be seen in fig. 7 and 8.
Specifically, the materials of the connecting plate 311 and the mounting plate 312 are oxygen-free copper, so that the heat transfer capability is stronger.
Specifically, the contact surface between the heat transfer element and the adsorption array, and the contact surface between the sub-adsorption arrays can be filled with indium sheets with the thickness of 0.1mm, so that the heat conduction capacity is enhanced, and the pumping speed is further improved.
In some embodiments, the preset structure includes:
the first surface or the second surface is a plane inclined by 1-9 degrees relative to the axial direction of the ring shape.
Compared with an axially parallel plane, the inclined plane can further improve the collision probability of gas molecules and the adsorption array. Specifically, the angle of inclination may be 3-5 degrees, and is denoted as a in the figure.
In some embodiments, the preset structure includes:
the first surface or the second surface is an arc surface with the radius of 350-650 mm.
Compared with a plane, the cambered surface not only increases the area, but also makes part of the surface incline, and can further improve the collision probability of gas molecules and the adsorption array.
In some embodiments, the preset structure includes:
the first surface or the second surface of the first adsorption sheet 331 installed near the first end among the four sub heat transfer members is a plane inclined by 1-9 degrees with respect to the axial direction of the ring shape;
the first surface or the second surface of the second adsorption sheet 332 installed at the far side from the first end among the four sub heat transfer members is a plane inclined by 1-9 degrees with respect to the axial direction of the ring shape, and is opposite to the inclination direction of the first adsorption sheet 331.
By setting the inclination directions of the first adsorption sheet 331 and the second adsorption sheet 332 to be opposite, the probability of collision of gas molecules with the adsorption array can be further improved, and the influence on the flow resistance of the gas is small. Thus, the gas pumping speed can be increased. Through experiments, compared with the adsorption array with a tower-shaped structure in the related art, the low Wen Bengxi adsorption array 20 of the embodiment of the application improves the hydrogen pumping speed by more than 80%.
Specifically, the low Wen Bengxi array 20 of embodiments of the present application provides for improved hydrogen pumping, as detailed in the test data below.
Test standard:
the test cover (the cavity evacuated by the cryopump) is designed according to the refrigerator cryopump standard JB/T11081-2011.
The pumping speed test is carried out according to the refrigerator cryopump standard JB/T11081-2011.
Test equipment:
and the ion implantation type low-temperature pump is matched with a cold head to use a 10K cold head.
Helium compressor, chiller temperature setting 22 ℃.
Recording temperature, vacuum degree, flow and time by using an industrial personal computer, and performing data calculation, analysis and storage;
and, pre-pump, high pressure gas cylinder, vacuum gauge, and flow meter, etc.
Testing ambient temperature: 26 degrees celsius.
The testing process comprises the following steps:
firstly, reducing the vacuum degree in the test cover to be within 10Pa by using a pre-pumping pump, then reducing the vacuum degree in the test cover to be 10 (-7) Pa by using a cryogenic pump, maintaining a stable state, then introducing gas such as hydrogen into the test cover by using a high-pressure gas cylinder, continuously operating the cryogenic pump, regulating the gas flow rate according to the condition, stabilizing the vacuum degree in the test cover to be 5 x 10 (-3) Pa, recording the value of a flowmeter at the moment, measuring the value in milliliters per minute (Standard Cubic Centimeter per Minute, SCCM) for a plurality of times, and taking the average value. Finally, the pumping speed in liters per second (L/S) is calculated based on the flow average.
The test results were as follows:
TABLE 1
As can be seen from table 1: the adsorption array of the embodiment of the application has the advantages that the pumping speed is improved no matter the adsorption array is nitrogen, argon and hydrogen, and particularly, the pumping speed is improved more obviously for the hydrogen which is a gas with a lower liquefaction temperature, and the pumping speed is improved by more than 80 percent. The pumping speed is obtained from the gas flow, and is well known to those skilled in the art, and will not be described in detail.
In some embodiments, the preset structure includes:
the first surface or the second surface of the first adsorption sheet 331 installed near the first end among the four sub heat transfer members is a plane inclined by 1-9 degrees with respect to the axial direction of the ring shape;
the first surface or the second surface of the second adsorption sheet 332 installed at the far side from the first end among the four sub heat transfer elements is an arc surface having a radius of 350-650 mm.
Similarly, by setting the first adsorption sheet 331 to be planar and inclined, and setting the second adsorption sheet 332 to be curved, the probability of collision of gas molecules with the adsorption array can be further improved, and the influence on the flow resistance of gas is small. Thus, the gas pumping speed can be increased. Through experiments, compared with the adsorption array with a tower-shaped structure in the related art, the low Wen Bengxi adsorption array 20 of the embodiment of the application improves the hydrogen pumping speed by more than 90%. The specific test data are similar to table 1 and are not shown otherwise.
In some embodiments, the preset structure includes:
the shapes of the first and second surfaces of the adjacent two adsorption sheets 33 facing each other are mirror images of each other;
and/or the shapes of the first surface and the second surface of the same adsorption sheet 33 are symmetrical to each other.
Thus, the shape of the adsorption sheet 33 is more abundant, and the probability of collision between the gas molecules and the adsorption array can be further improved, but the influence on the flow resistance of the gas is smaller.
Fig. 4 shows a case where the shapes of the first and second surfaces of the adjacent two of the adsorption sheets 33 facing each other are parallel, and the shapes of the first and second surfaces of the same adsorption sheet 33 are also parallel. Are mirror images of each other or are symmetrical to each other, not shown in the figures, but as will be appreciated by those skilled in the art, are practical.
Specifically, the adsorption array further comprises:
the radiation shield 34 is used for isolating the adsorption array from the armored heater 70, and avoiding the heat radiation generated by the armored heater 70 with higher temperature to the adsorption array with lower temperature, so as to cause the desorption of the adsorbed gas.
Example two
An embodiment of the present application provides a cryopump, as shown in fig. 9, including the low Wen Bengxi array 20 of the embodiment described.
According to the cryopump of the embodiment of the present application, the adsorption sheets 33 are annularly arranged at the adsorption end of the cryopump, the annular axis is parallel to the first direction, the first surface of each adsorption sheet 33 faces the second surface of the adjacent adsorption sheet 33, that is, the length or width direction of the adsorption sheet 33 extends approximately along the annular axial direction, the thickness direction of the adsorption sheet 33 is the annular circumferential direction, and at least part of the first surface or the second surface of the plurality of adsorption sheets 33 is provided with a preset structure, so that the flow resistance of the adsorption sheet 33 to gas can be reduced, the collision probability of gas molecules and the adsorption array can be increased, the gas pumping speed can be increased, and the problem of lower pumping speed to hydrogen can be solved.
Specifically, the cryopump further includes:
the pump housing 40, which accommodates the components of the cryopump, functions as a support.
A cold shield 50 for reducing heat radiation and maintaining heat loss in the pump housing 40.
The baffle 60, the baffle 60 can shelter from the adsorption matrix, reduces the heat leak.
The sheathed heater 70 heats the cryopump to release the adsorbed gas and then re-uses the gas when the amount of the adsorbed gas is excessive and the exhaust speed is low.
And a secondary cooling head 80 for cooling the adsorption plate.
It should be understood that the above examples are illustrative and are not intended to encompass all possible implementations encompassed by the claims. Various modifications and changes may be made in the above embodiments without departing from the scope of the disclosure. Likewise, the individual features of the above embodiments can also be combined arbitrarily to form further embodiments of the application which may not be explicitly described. Therefore, the above examples merely represent several embodiments of the present application and do not limit the scope of protection of the patent of the present application.
Claims (10)
1. A cryopump attachment matrix, comprising:
a first heat transfer member having a first end in thermal contact with the cold source and a second end extending in a first direction toward an adsorption end of the cryopump; the first direction is the axial direction of the cryopump;
a plurality of adsorption sheets which are arranged and are all fixed at the second end of the first heat transfer element; the adsorption sheet comprises a first surface and a second surface, wherein the first surface and the second surface are the two surfaces with the largest surface area of the adsorption sheet; a plurality of the adsorption sheets are annularly arranged at the adsorption end of the cryopump, the axis of the annular shape is parallel to the first direction, and the first surface of each adsorption sheet faces the second surface of the adjacent adsorption sheet; at least part of the first surface or the second surface of the plurality of adsorption sheets is provided with a preset structure, and the preset structure comprises:
at least part of the first surface or the second surface is an axial direction relative to the ring shape, and/or a radial inclined plane of the ring shape;
and/or at least part of the first surface or the second surface is curved.
2. The low Wen Bengxi array of claim 1, further comprising:
and the second heat transfer element is fixed at the second end of the first heat transfer element, and the adsorption sheet is fixed at the second end of the first heat transfer element through the second heat transfer element.
3. The low Wen Bengxi array of claim 2, wherein the first heat transfer element comprises:
the connecting plate extends from the cold source to the adsorption end;
the mounting plate is fixed at the end part of the connecting plate, which is close to the second end, extends along the radial direction of the ring shape, and the second heat transfer element is fixed at the radial end part of the mounting plate.
4. The array of claim 2, wherein the second heat transfer element comprises four sub heat transfer elements, each of the sub heat transfer elements being mounted to the second end of the first heat transfer element and being at least partially offset from each other in the axial direction of the annulus and partially offset in the circumferential direction of the annulus: each sub heat transfer element is respectively provided with a part of the adsorption sheets.
5. The low Wen Bengxi array of claim 1 or 2, wherein the predetermined structure comprises:
the first surface or the second surface is a plane inclined by 1-9 degrees relative to the axial direction of the ring shape.
6. The low Wen Bengxi array of claim 1 or 2, wherein the predetermined structure comprises:
the first surface or the second surface is an arc surface with the radius of 350-650 mm.
7. The low Wen Bengxi array of claim 4, wherein the predetermined structure comprises:
the first surface or the second surface of the first adsorption sheet close to the first end in the four sub heat transfer elements is a plane inclined by 1-9 degrees relative to the axial direction of the ring;
the first surface or the second surface of the second adsorption sheet, which is arranged in the four sub heat transfer elements and is far away from the first end, is a plane inclined by 1-9 degrees relative to the axial direction of the ring shape, and the inclination direction of the first adsorption sheet is opposite.
8. The low Wen Bengxi array of claim 4, wherein the predetermined structure comprises:
the first surface or the second surface of the first adsorption sheet close to the first end in the four sub heat transfer elements is a plane inclined by 1-9 degrees relative to the axial direction of the ring;
the first surface or the second surface of the second adsorption sheet which is arranged in the four sub heat transfer elements and is far away from the first end is an arc surface with the radius of 350-650 mm.
9. The low Wen Bengxi array of claim 1 or 2, wherein the predetermined structure comprises:
the shapes of the first surface and the second surface of the adjacent two adsorption sheets which face each other are mirror images;
and/or the shapes of the first surface and the second surface of the same adsorption sheet are symmetrical to each other.
10. A cryopump comprising a low Wen Bengxi array according to any one of claims 1 to 9.
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| CN117167234B (en) | 2024-02-06 |
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