CN117153741A - Integrated wafer cleaning and drying equipment - Google Patents
Integrated wafer cleaning and drying equipment Download PDFInfo
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- CN117153741A CN117153741A CN202311433854.4A CN202311433854A CN117153741A CN 117153741 A CN117153741 A CN 117153741A CN 202311433854 A CN202311433854 A CN 202311433854A CN 117153741 A CN117153741 A CN 117153741A
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- Prior art keywords
- tank body
- cleaning
- connecting rod
- wafer cleaning
- mounting frame
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- 238000004140 cleaning Methods 0.000 title claims abstract description 190
- 238000001035 drying Methods 0.000 title claims abstract description 63
- 235000012431 wafers Nutrition 0.000 claims abstract description 150
- 239000007788 liquid Substances 0.000 claims abstract description 75
- 238000002347 injection Methods 0.000 claims abstract description 31
- 239000007924 injection Substances 0.000 claims abstract description 31
- 239000007789 gas Substances 0.000 claims description 46
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 23
- 238000009434 installation Methods 0.000 claims description 18
- 230000001105 regulatory effect Effects 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 13
- 238000005406 washing Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 230000000087 stabilizing effect Effects 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 230000001276 controlling effect Effects 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000012634 fragment Substances 0.000 abstract description 2
- 239000007921 spray Substances 0.000 abstract 1
- 239000003814 drug Substances 0.000 description 21
- 230000006872 improvement Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005507 spraying Methods 0.000 description 5
- 238000002791 soaking Methods 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 2
- 238000010981 drying operation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 organic matters Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides an integrated wafer cleaning and drying device, which comprises: the cleaning tank comprises a cleaning tank body and a drying assembly, wherein the drying assembly comprises a cover body and an air injection assembly, a wafer cleaning basket is arranged in the cleaning tank body, the cover body is arranged above a notch of the cleaning tank body, the air injection assembly is connected to one side of the cover body facing the interior of the cleaning tank body, and the air injection assembly sprays drying gas to a plurality of wafers arranged in the wafer cleaning basket; the side wall of the cover body is connected with a driving assembly, a linkage assembly is arranged between the cover body and the wafer cleaning basket, the driving assembly pulls the cover body to be buckled at the notch of the cleaning tank body, and the linkage assembly lifts one side of the length direction of the wafer cleaning basket so that an included angle is formed between connecting lines at the circle centers of a plurality of wafers arranged in the wafer cleaning basket and the length direction of the cleaning tank body. The invention is used for solving the problems of lower wafer drying efficiency caused by wafer fragments and smaller contact area with drying gas due to the surface tension of cleaning liquid in the integrated wafer cleaning and drying equipment in the prior art.
Description
Technical Field
The invention relates to the field of semiconductor cleaning equipment, in particular to integrated wafer cleaning and drying equipment.
Background
During the processing of each wafer, the wafer is in contact with various contaminants such as organic matters, particles, metal impurities and the like, so that the contaminants adhere to the wafer, and therefore the wafer needs to be cleaned. In the prior art, a tank type soaking mode is generally adopted for cleaning a large number of wafers, namely, cleaning liquid medicine is injected into a cleaning tank, the wafer basket is used for placing the large number of wafers into the cleaning tank and immersing the wafers in the cleaning liquid medicine, the effect of cleaning the wafers is achieved after a period of soaking, and finally, the cleaned wafers are lifted out of the cleaning liquid medicine.
The conventional groove type wafer cleaning equipment is characterized in that the wafer which is immersed in the cleaning liquid medicine vertically and directly is lifted from the liquid medicine, and the wafer is fragile in texture because the thickness range of the wafer is 0.5 mm-0.7 mm, and when the wafer which is vertically immersed in the cleaning liquid medicine is lifted, the wafer edge is damaged because of the influence of the surface tension of the cleaning liquid.
Meanwhile, wafer cleaning liquid medicine represented by deionized water can remain on the surface of a wafer to generate water marks, the wafer lifted from the cleaning liquid medicine is required to be dried by adopting drying gas to avoid the generation of the water marks, the contact area between the radial direction of the existing wafer and the drying gas in a mode parallel to the height direction is limited, and the drying gas needs to flow a longer path to achieve the purpose of drying the wafer, so that the problem of lower wafer drying efficiency is solved.
In view of this, there is a need for an improved integrated wafer cleaning and drying apparatus in the prior art that addresses the above-described problems.
Disclosure of Invention
The invention aims to disclose integrated wafer cleaning and drying equipment, which is used for solving the problems of lower wafer drying efficiency caused by wafer fragments and smaller contact area with drying gas due to surface tension of cleaning liquid in the integrated wafer cleaning and drying equipment in the prior art.
In order to achieve the above object, the present invention provides an integrated wafer cleaning and drying apparatus, comprising: the cleaning tank comprises a cleaning tank body and a drying assembly, wherein the drying assembly comprises a cover body and an air injection assembly, at least one wafer cleaning basket for placing a plurality of wafers in parallel is arranged in the cleaning tank body, the cover body is arranged above a notch of the cleaning tank body, the air injection assembly is connected to one side of the cover body, which faces the interior of the cleaning tank body, and the air injection assembly injects drying gas to a plurality of wafers arranged in the wafer cleaning basket;
the cleaning device is characterized in that one side of the cover body, far away from the drying component, is connected with the driving component, a linkage component is arranged between the cover body and the wafer cleaning basket, the driving component pulls the cover body to be buckled at the notch of the cleaning tank body in the air injection state of the wafer cleaning basket, and the linkage component lifts one side of the length direction of the wafer cleaning basket so that a plurality of connecting lines at the circle centers of the wafers arranged in the wafer cleaning basket and the length direction of the cleaning tank body form included angles.
As a further improvement of the invention, the driving assembly comprises a mounting seat, a driving device and a driving piece, wherein the mounting seat is fixedly connected to the outer side wall of the cleaning tank body, the driving device is provided with a driving cylinder with a piston rod, the top end of the piston rod of the driving device is hinged with the driving piece, the driving piece is vertically fixed with the side wall of the cover body, and one end of the driving device far away from the piston rod is hinged with the mounting seat;
the linkage assembly comprises a driving block, a connecting rod assembly and a mounting frame, a wafer cleaning basket is detachably connected in the mounting frame, the connecting rod assembly comprises a first connecting rod and a second connecting rod, the bottom surface of the driving block is provided with a wedge-shaped surface, one end of the first connecting rod is connected with a driving wheel sliding along the wedge-shaped surface, one end of the first connecting rod, far away from the driving wheel, is hinged with the top end of the second connecting rod, and the midpoint of the first connecting rod is rotationally connected with the groove wall of the cleaning groove body;
the side wall of mounting bracket length direction is connected with the washing tank body rotation, mounting bracket length direction keep away from with washing tank body rotation tie point department vertical fixation atress pole, atress pole and second connecting rod keep away from first connecting rod one end and rotate to be connected, drive arrangement's piston rod is retracted to be driven the in-process of lid lock to the notch department of washing tank body, the drive piece moves down along with the lid the wedge promotes the drive wheel moves down, the second connecting rod drives the mounting bracket is close to atress pole tie point one side lifts up.
As a further improvement of the invention, the mounting frame comprises a first mounting frame and a second mounting frame, the positions, away from each other, of the first mounting frame and the second mounting frame in the length direction are respectively and rotatably connected with the cleaning tank body, and the first mounting frame and the second mounting frame are respectively and detachably connected with a wafer cleaning basket;
the stress rod is formed on the side wall of the first installation frame, one side of the first installation frame, which is close to the second installation frame, is fixedly connected with the force application block, the second installation frame is connected with the stress block which is embedded with the top surface of the bottom surface force application block, and the second connecting rod drives the first installation frame to be close to one side of the connecting point of the stress rod when being lifted, the top surface of the force application block applies force to the force application block so that one side, which is connected with the force application block, of the second installation frame is lifted.
As a further improvement of the invention, the air injection assembly comprises a mixed air flow plate and a nitrogen pipeline, wherein the mixed air flow plate is arranged parallel to the plane where the notch of the cleaning tank body is positioned, a mixed air flow channel is arranged in the mixed air flow plate, and a plurality of air injection holes communicated with the mixed air flow channel are uniformly distributed on one side of the mixed air flow plate, which faces the cleaning tank body;
the nitrogen gas pipeline includes two communicating pipe bodies and is not less than two air jet pipe bodies, the air jet pipe bodies are parallel to the length direction setting of lid, two communicating pipe bodies respectively with a plurality of air jet pipe body both ends intercommunication, communicating pipe body's top surface rigid coupling in the lower surface of mixing the air current board, air jet pipe body towards a plurality of air nozzles of washing tank body one side equipartition, the lateral wall of lid connect a plurality of to mixing the air current passageway and communicating pipe body air feed inlet nozzle.
As a further improvement of the invention, the bottom wall of the cleaning tank body is penetrated with a liquid inlet device, the liquid inlet device comprises a liquid inlet pipe and a liquid inlet main body, the liquid inlet pipe penetrates through the bottom wall of the cleaning tank body and then is connected with the liquid inlet main body, and a plurality of liquid inlet holes are uniformly distributed on the liquid inlet main body.
As a further improvement of the invention, the cleaning tank body comprises an outer tank body and an inner tank body fixed on the inner side of the outer tank body, wherein the liquid inlet pipe sequentially penetrates through the outer tank body and the bottom of the inner tank body and then is connected with a liquid inlet main body arranged in the inner tank body, the bottom of the outer tank body is connected with a liquid outlet pipe, the bottom of the inner tank body is communicated with a pressure stabilizing device, and the pressure stabilizing device penetrates out from the bottom of the outer tank body.
As a further improvement of the invention, the outer tank body is surrounded by four mounting plates, the inner tank body comprises a first overflow plate and a second overflow plate, the bottom ends of the first overflow plate and the second overflow plate are connected with each other, the first overflow plate and the second overflow plate are parallel to each other, two sides of the first overflow plate and the second overflow plate, which are vertical to the length direction, are respectively fixedly connected to one mounting plate, and a plurality of overflow tanks are respectively and uniformly distributed on the top surfaces of the first overflow plate and the second overflow plate;
the first mounting frame, the second mounting frame, the first connecting rod and the second connecting rod are all arranged on one side, close to each other, of the first overflow plate and the second overflow plate, the first connecting rod, the second connecting rod and the stress rod are symmetrically arranged in two groups, and the two sides of the length direction of the first connecting rod, the two sides of the length direction of the first mounting frame and the two sides of the length direction of the second mounting frame are respectively connected with the first overflow plate and the second overflow plate in a rotating mode.
As a further improvement of the invention, the pressure stabilizing device comprises an adjusting pipe body and a piston part connected in the adjusting pipe body in a sliding way, the top end of the adjusting pipe body is vertically communicated with the joint of the bottom of the first overflow plate and the bottom of the second overflow plate, the bottom of the adjusting pipe body penetrates out of the outer groove body and forms an air pressure adjusting port, and the opening of the air pressure adjusting port is controlled and adjusted through the sliding of the piston part in the adjusting pipe body so as to balance the pressure of the cleaning tank body and the outside atmosphere.
As a further improvement of the invention, the mixed air flow channel is formed on one side of the mixed air flow plate far away from the communicating pipe body, one side of the mixed air flow plate far away from the communicating pipe body is attached and fixed with the sealing plate, one side of the sealing plate far away from the mixed air flow plate is vertically fixed with a plurality of connecting frames, and the sealing plate is fixedly connected with the lower surface of the top wall of the cover body through the connecting frames.
As a further improvement of the invention, a supporting frame is fixedly connected between the first overflow plate and the second overflow plate, the supporting frame comprises a plurality of supporting plates vertically fixed between the first overflow plate and the second overflow plate and two supporting rods parallelly arranged at the tops of the plurality of supporting plates, the upper surfaces of the supporting rods form a yielding groove for the movement of the stress rod, and the first installation frame and the second installation frame are respectively connected with the two supporting rods in a rotating way.
Compared with the prior art, the invention has the beneficial effects that: firstly, the cleaning liquid is introduced into the cleaning tank body to perform normal cleaning operation on the wafer, and after the cleaning operation is completed, the wafer is dried through a drying assembly consisting of a cover body and an air injection assembly. Before the drying operation is carried out, the cleaning liquid medicine in the cleaning tank body is discharged, compared with the mode that the whole wafer cleaning basket is lifted by the liquid level of the wafer cleaning liquid in the vertical state in the prior art, the problem that the wafer edge is broken due to the liquid level tension of the cleaning liquid medicine is effectively avoided, and before the drying operation is carried out, the cooperation of the driving assembly, the cover body and the linkage assembly can enable an included angle to be formed between a connecting line between circle centers of a plurality of wafers which are arranged in parallel in the wafer cleaning basket in the cleaning tank body and the length direction of the cleaning tank body, so that the contact area between the wafers and dry gas sprayed out by the air spraying assembly connected in the cover body is effectively increased, and the drying efficiency of the wafers is effectively improved.
Secondly, through the drive assembly who constitutes by mount pad, drive arrangement and driving piece, lift control lid and the drive piece that links to each other one side lift and descend through the lift control lid of drive arrangement's piston rod, lift and decline that the linkage assembly that constitutes through drive piece, link assembly and mounting bracket is close to atress pole one side of wafer cleaning basket, when the piston rod drive lid and driving piece are connected one side and descend to the notch department of lock in the washing tank body, first connecting rod and second connecting rod linkage are lifted in order to drive mounting bracket connection atress pole one side, thereby reach and make the contained angle between the length direction of connecting wire and the washing tank body between the centre of a circle of wafer in a plurality of same wafer cleaning baskets, and then effectively increase the area of contact of wafer and dry gas, thereby improve the drying efficiency of wafer.
Finally, the mounting bracket includes first mounting bracket and second mounting bracket, and a wafer washs the basket with the second mounting bracket is connected respectively to first mounting bracket, 25 wafers can be placed side by side in current general wafer washs the basket usually, consequently, first mounting bracket and second mounting bracket can wash simultaneously and install 50 wafers, compare in holding the washing tank body of single wafer washs the basket and make wafer washs and drying efficiency double, simultaneously through the setting of application of force piece and atress piece, after the connecting rod assembly drives first mounting bracket and lifts up, the atress piece that the second mounting bracket is connected receives the lifting force that it is close to first mounting bracket one side and lifts up simultaneously that the application of force piece was exerted, so that connect the wafer that places in the wafer washs the basket in second mounting bracket and drying gas's area can also effectively increase, wafer in the wafer washbasket that connects in keeping first mounting bracket and the second mounting bracket can dry with basic unanimous speed.
Drawings
FIG. 1 is a schematic view of the overall structure of a washing and drying apparatus embodying the present invention;
FIG. 2 is a schematic view of the cross-section of FIG. 1 taken along the direction F-F;
FIG. 3 is an exploded view showing the cooperating relationship of the linkage assembly with the inner and outer tanks removed;
FIG. 4 is an enlarged view of portion A of FIG. 3;
FIG. 5 is an enlarged view of portion B of FIG. 3;
FIG. 6 is a schematic view of the cross section along the direction G-G of FIG. 1;
FIG. 7 is a schematic view of a structure for embodying a drying module in the present invention;
FIG. 8 is a schematic diagram of the explosion state of the mixed gas flow plate and nitrogen pipeline in the present invention;
FIG. 9 is an enlarged view of portion C of FIG. 6;
fig. 10 is an enlarged view of a portion D in fig. 7.
Detailed Description
The present invention will be described in detail below with reference to the embodiments shown in the drawings, but it should be understood that the embodiments are not limited to the present invention, and functional, method, or structural equivalents and alternatives according to the embodiments are within the scope of protection of the present invention by those skilled in the art.
Referring to fig. 1 to 10, an integrated wafer cleaning and drying apparatus is disclosed, which comprises a cleaning tank body 1 and a drying assembly 2, wherein a wafer cleaning basket 3 with a plurality of wafers 31 arranged in parallel is placed in the cleaning tank body 1, and the wafers arranged in the wafer cleaning basket 3 in batch are soaked and cleaned by injecting cleaning liquid into the cleaning tank body 1. After the soaking and cleaning of the wafer 3 are completed, the cleaning liquid in the cleaning tank body 1 is discharged, the driving component 4 controls the cover body 21 forming a part of the drying component 2 to lift and descend, so that an included angle is formed between the length direction of the wafer cleaning basket 3 and the length direction of the cleaning tank body 1 by the cover body 21, namely, an included angle is formed between a connecting line between the circle centers of a plurality of wafers 31 arranged in the wafer cleaning basket 3 in parallel and the length direction of the cleaning tank body 1, so that a larger contact area is formed between the gas sprayed by the gas spraying component 22 forming the other part of the drying component 2 and the wafer 31, and the drying efficiency of the wafer 31 is effectively improved.
Referring to fig. 1 to 10, in the present embodiment, an integrated wafer cleaning and drying apparatus (hereinafter referred to as a cleaning and drying apparatus) includes: the cleaning tank comprises a cleaning tank body 1 and a drying assembly 2, wherein the drying assembly 2 comprises a cover body 21 and an air injection assembly 22, at least one wafer cleaning basket 3 for placing a plurality of wafers 31 in parallel is arranged in the cleaning tank body 1, the cover body 21 is arranged above a notch of the cleaning tank body 1, the air injection assembly 22 is connected to one side of the cover body 21 facing the inside of the cleaning tank body 1, and the air injection assembly 22 injects drying gas to the plurality of wafers 31 arranged in the wafer cleaning basket 31; the cover body 21 is far away from the air injection assembly 22 and one side of the cover body is connected with the driving assembly 4, the linkage assembly 5 is arranged between the cover body 21 and the wafer cleaning basket 3, the driving assembly 4 pulls the cover body 21 to be buckled at the notch of the cleaning tank body when the air injection assembly 22 injects air towards the wafer cleaning basket 3, and the linkage assembly 5 lifts one side of the length direction of the wafer cleaning basket 3 so that a plurality of connecting lines at the circle centers of the wafers 31 arranged in the wafer cleaning basket 3 and the length direction of the cleaning tank body 1 form an included angle.
Referring to fig. 2 to 5, and fig. 9, the driving assembly 4 includes a mounting seat 41, a driving device 42 and a driving member 43, the mounting seat 41 is fixedly connected to the outer side wall of the cleaning tank body 1, the driving device 42 is provided as a driving cylinder with a piston rod, the top end of the piston rod of the driving device 42 is hinged with the driving member 43, the driving member 43 is vertically fixed with the side wall of the cover body 21, and one end of the driving device 42 far away from the piston rod is hinged with the mounting seat 41; the linkage assembly 5 comprises a driving block 51, a connecting rod assembly 52 and a mounting frame 53, wherein the mounting frame 53 is internally and detachably connected with a wafer cleaning basket 3, the connecting rod assembly 52 comprises a first connecting rod 521 and a second connecting rod 522, the bottom surface of the driving block 51 is provided with a wedge-shaped surface 511, one end of the first connecting rod 521 is connected with a driving wheel 5211 sliding along the wedge-shaped surface 511, one end of the first connecting rod 521, far away from the driving wheel 5211, is hinged with the top end of the second connecting rod 522, and the midpoint of the first connecting rod 521 is rotationally connected with the groove wall of the cleaning groove body 1; the side wall of the length direction of the mounting frame 53 is rotationally connected with the cleaning tank body 1, the length direction of the mounting frame 53 is far away from the position of a rotational connection point of the cleaning tank body 1, a stress rod 531 is vertically fixed, the stress rod 531 is rotationally connected with one end of a second connecting rod 522, which is far away from the first connecting rod 521, a piston rod of the driving device 42 retracts to drive the cover body 21 to be buckled to a notch of the cleaning tank body 1, the driving block 51 moves downwards along with the cover body 21, the wedge-shaped surface 511 pushes the driving wheel 5211 to move downwards, and the second connecting rod 522 drives the mounting frame 53 to lift up near one side of the connection point of the stress rod 531.
Referring to fig. 2 to 5, in this embodiment, the mounting frame 53 is formed by a first mounting frame 532 and a second mounting frame 533, and the stress rod 531 is specifically mounted on a side wall of the first mounting frame 532, taking the mounting frame 53 only including the first mounting frame 532 as an example, in a process that the driving device 42 pulls the cover 21 to descend to be buckled to the cleaning tank body 1, the driving block 51 fixedly connected to the inner side of the top wall of the cover 21 descends along with the cover 21, the wedge-shaped surface 511 formed on the bottom surface of the driving block 51 applies a downward pushing force to the driving wheel 5211 in a process that the driving block 511 descends along with the cover 21, so that the driving wheel 5211 slides obliquely downwards along a forming direction of the wedge-shaped surface 511, one end of the first connecting rod 521 connected with the driving wheel 5211 rotates along with the driving wheel 5211, and one end of the connecting rod 521 connected with the second connecting rod 522 lifts along with a rotation connection point of the first connecting rod 521 and the cleaning tank body 1, so as to drive the second connecting rod 522 ascend along with the whole and the second connecting rod 522 rotates the stress rod 531 connected with the first mounting frame 532 to one side of the first mounting frame, and the first mounting frame 532 is lifted along with the rotation connection point of the first connecting point, and the first connecting rod 532 is far away from the stress rod 531.
In this embodiment, when the wafer 31 is in a soaking and cleaning state in the cleaning tank body 1, the length directions of the first mounting frame 532 and the second mounting frame 533 are both parallel to the length direction of the cleaning tank body 1, at this time, the diameter directions of the plurality of wafers 31 arranged in parallel in the wafer cleaning basket 3 are consistent with the height direction of the cleaning tank body 1, so as to increase the contact area between the wafer 31 and the drying gas sprayed by the air spraying component 22, thereby increasing the drying rate of the wafer 31, and the first mounting frame 532 is rotated to a state having a certain included angle with the horizontal plane through the above-mentioned actuation process, because the first mounting frame 532 is detachably connected with the wafer cleaning basket 3, the wafers arranged in parallel in the wafer cleaning basket 3 can be inclined along with the direction change of the first mounting frame 532, and compared with the wafers 31 arranged in the cleaning tank body 1 in a vertical state, the vertical projection area of the wafer 31 inclined along with the movement of the first mounting frame 532 is larger, namely, the vertical projection area of the wafer 31 inclined along with the movement of the first mounting frame 532 is in direct contact with the drying gas sprayed by the air spraying component 22, thereby effectively increasing the drying efficiency of the wafer 31.
Further, in order to achieve the purpose of cleaning and drying more wafers 31 simultaneously, the mounting frame 53 in this embodiment includes a first mounting frame 532 and a second mounting frame 533, and the first mounting frame 532 and the second mounting frame 533 are detachably connected to a wafer cleaning basket 3, and the length directions of the first mounting frame 532 and the second mounting frame 533 are parallel to the 1 length direction of the cleaning tank body in the cleaning process. In order to increase the direct contact area between the wafers 31 and the dry gas in the two wafer cleaning baskets 3 at the same time, the first mounting frame 532 is fixedly connected with the force applying block 5321 near the second mounting frame 533, the second mounting frame 533 is connected with the force applying block 5322 embedded with the top surface of the force applying block 5321, and the positions, far away from each other, of the length direction of the first mounting frame 532 and the second mounting frame 533 are respectively rotationally connected with the cleaning tank body 1, in this embodiment, the force applying rod 531 is formed on the side wall of the first mounting frame 532, so that in the process that the driving device 42 drives the cover body 21 to be fastened at the notch of the cleaning tank body 1, the movement process that the linkage assembly 5 drives the first mounting frame 532 to incline is consistent with the above description, and in the process that the linkage assembly 5 drives the first mounting frame 532 to move from the horizontal state to the inclined state through the force applying rod 531, the top surface of the force applying block 5321 is applied to the force applying block 5322 so that the second mounting frame 533 is connected with the force applying block 5322.
Referring to fig. 6 to 10, the air injection assembly 22 includes a mixed air flow plate 221 and a nitrogen pipe 222, the mixed air flow plate 221 is parallel to the plane of the notch of the cleaning tank body 1, a mixed air flow channel 2211 is formed in the mixed air flow plate 221, and a plurality of air injection holes 2212 communicated with the mixed air flow channel 2211 are uniformly distributed on one side of the mixed air flow plate 221 towards the cleaning tank body 1; the nitrogen gas pipeline 222 includes two communicating pipe bodies 2221 and not less than two gas injection pipe bodies 2222, the gas injection pipe bodies 2222 are parallel to the length direction setting of the lid 21, two communicating pipe bodies 2221 communicate with a plurality of gas injection pipe bodies 2222 both ends respectively, the top surface rigid coupling of communicating pipe bodies 2221 is in the lower surface of mixed gas flow plate 221, a plurality of gas injection nozzles 2223 of gas injection pipe bodies 2222 equipartition towards washing tank body 1 one side. It should be noted that, in this embodiment, the number of the air nozzles 2222 is four, the air nozzles 2223 communicated with the two air nozzles 2222 distributed in the middle are vertically disposed downward, and the air nozzles 2223 communicated with the air nozzles 2222 distributed on two sides are all disposed obliquely toward the directions of the first mounting frame 532 and the second mounting frame 533.
Referring to fig. 2 and fig. 6 to 10, a mixed gas flow passage 2211 is formed at a side of the mixed gas flow plate 221 remote from the communicating tube 2221, a sealing plate 23 is fixedly attached to the side of the mixed gas flow plate 221 remote from the communicating tube 2221, a plurality of connection frames 24 are vertically fixed to the side of the sealing plate 23 remote from the mixed gas flow plate 221, and the sealing plate 23 is fixedly connected to the lower surface of the top wall of the cover 21 through the connection frames 24. The side wall of the cover 21 is connected with a plurality of air inlet nozzles 211 for supplying air to the mixed air flow channel 2211 and the communicating pipe body 2221, the sealing plate 23 is located between a plurality of connecting frames 24 and is respectively provided with a plurality of connecting pipelines (not shown), wherein one end of at least one connecting pipeline (not shown) is connected with the air inlet nozzle 211, the other end sequentially passes through the sealing plate 23 and the mixed air flow plate 221 and then is communicated with the communicating pipe body 2221, one end of another connecting pipeline (not shown) is connected with the air inlet nozzle 211, and the other end passes through the sealing plate 23 and then is communicated with the mixed air flow channel 2211. The gas introduced into the mixed gas flow passage 2211 through the gas inlet nozzle 211 is a mixed gas of nitrogen and IPA vapor, and the gas introduced into the communicating tube 2221 through the gas inlet nozzle 211 is hot nitrogen.
After the cleaning solution in the cleaning tank body 1 is discharged, part of the cleaning solution remains on the surface of the wafer 31 to form droplets, if the wafer 31 is directly dried, deionized water with certain corrosiveness is taken as the cleaning solution, the deionized water droplets remaining on the surface of the wafer 31 react with the surface of the wafer 31 in the drying process to cause water marks, and in the embodiment, the problem of water marks caused by the droplets remaining on the surface of the wafer 31 is solved by IPA steam. The mixed gas of the IPA vapor and the nitrogen is introduced into the mixed gas flow channel 2211 through the gas inlet nozzle 211 and the connecting pipe (not shown), the surface tension of the liquid drops can be effectively reduced by introducing the IPA vapor into the liquid drop surface, so that the liquid drops fall from the surface of the wafer 31, and the hot nitrogen introduced into the communicating pipe 2221 through the gas inlet nozzle 211 and the connecting pipe (not shown) flows through each gas injection pipe 2222 and is sprayed out of the gas injection nozzles 2223 distributed on each gas injection pipe 2222 and arranged towards the first mounting frame 532 and the second mounting frame 533, so as to achieve the purpose of drying the wafer 31.
Referring to fig. 2 to 6 and 9, the bottom wall of the cleaning tank body 1 is penetrated by a liquid inlet device 11, the liquid inlet device 11 comprises a liquid inlet pipe 111 and a liquid inlet main body 112, the liquid inlet pipe 111 penetrates through the bottom wall of the cleaning tank body 1 and then is connected with the liquid inlet main body 112, and a plurality of liquid inlet holes 113 are uniformly distributed in the liquid inlet main body 112. The cleaning tank body 1 comprises an outer tank body 13 and an inner tank body 12 fixed on the inner side of the outer tank body 13, wherein a liquid inlet pipe 111 sequentially penetrates through the outer tank body 13 and the bottom of the inner tank body 12 and then is connected with a liquid inlet main body 112 arranged in the inner tank body 12, the bottom of the outer tank body 13 is connected with a liquid outlet pipe 131, the bottom of the inner tank body 12 is communicated with a pressure stabilizing device 121, and the pressure stabilizing device 121 penetrates out from the bottom of the outer tank body 13.
Referring to fig. 6 and 9, the outer tank 13 is surrounded by four mounting plates 132, the inner tank 12 includes a first overflow plate 122 and a second overflow plate 123 connected at the bottom end, the first overflow plate 122 and the second overflow plate 123 are parallel to each other, two sides of the first overflow plate 122 and the second overflow plate 123 perpendicular to the length direction are respectively fixedly connected to the inner wall of one mounting plate 132, and a plurality of overflow grooves 124 are uniformly arranged on the top surfaces of the first overflow plate 122 and the second overflow plate 123 respectively; the first mounting frame 532, the second mounting frame 533, the first connecting rod 521 and the second connecting rod 522 are all arranged on one side, close to each other, of the first overflow plate 122 and the second overflow plate 123, the first connecting rod 521, the second connecting rod 522 and the stress rod 531 are all symmetrically arranged in two groups, and two sides in the length direction of the first connecting rod 521, the first mounting frame 532 and the second mounting frame 533 are respectively connected with the first overflow plate 122 and the second overflow plate 123 in a rotating mode. The support frame 14 is fixedly connected between the first overflow plate 122 and the second overflow plate 123, the support frame 14 comprises a plurality of support plates 141 vertically fixed between the first overflow plate 122 and the second overflow plate 123, and two support rods 142 parallelly installed at the tops of the support plates 141, a yielding groove 143 for the movement of a stress rod 531 is formed on the upper surface of each support rod 142, and two sides of the length direction of the first installation frame 532 and the second installation frame 533 are respectively connected with the two support rods 142 in a rotating mode.
Referring to fig. 2, the pressure stabilizing device 121 includes a regulating tube 1211 and a piston portion 1212 slidingly connected to the inside of the regulating tube 1211, wherein the top end of the regulating tube 1211 is vertically connected to the connection between the first overflow plate 122 and the bottom of the second overflow plate 123, the bottom of the regulating tube 1211 is penetrated out of the outer groove 13 and forms an air pressure regulating opening 12111, and the opening of the air pressure regulating opening 12111 is regulated by the sliding of the piston portion 1212 inside the regulating tube 1211 to balance the pressure between the cleaning tank body 1 and the outside atmosphere. It should be noted that the mounting plate 132 remote from the driving unit 4 is connected to a drain pipe (not shown) which communicates with the inner tank 12.
The cleaning liquid medicine is introduced into the liquid inlet main body 112 through the liquid inlet pipe 111, the cleaning liquid medicine is injected into the inner tank body 12 surrounded by the first overflow plate 122, the second overflow plate 123 and the two mounting plates 132 through the plurality of liquid inlet holes 113 formed in the liquid inlet main body 112, the cleaning liquid medicine in the inner tank body 12 reaches a certain depth, the cleaning liquid medicine can be soaked and cleaned on the wafers 31 in the two wafer cleaning baskets 3 placed on the first mounting frame 532 and the second mounting frame 533, at the moment, one side of the cover body 21 far away from the driving assembly 4 is lapped at the notch of the outer tank body 13, the piston rod of the driving device 42 stretches out to push the driving piece 43 to drive the joint of the cover body 21 to tilt and form a gap with the outer tank body 13, at the moment, the length directions of the first mounting frame 532 and the second mounting frame 533 are parallel to the length directions of the first overflow plate 122 and the second overflow plate 123, and the cleaning liquid medicine is not injected into the inner tank body 12 through the liquid inlet pipe 111 and the liquid medicine is not stopped in order to keep the cleaning cleanliness in the inner tank body 12, when the cleaning liquid medicine in the inner tank body 12 is larger than the volume of the inner tank body 12, the liquid medicine in the overflow body 12 is not stopped, the liquid medicine can flow out of the outer tank body 13 through the first overflow plate 122 and the overflow plate 124 through the first overflow plate 122 and the overflow plate 13 when the liquid medicine in the overflow body 13 is stopped.
After the wafer 31 is cleaned, a liquid drain pipe (not shown) is opened, the cleaning liquid medicine in the inner tank body 12 is discharged through the liquid drain pipe (not shown), the piston rod of the driving device 42 is retracted to enable the cover body 21 to be buckled to the top of the outer tank body 13, and further the first mounting frame 532 and the second mounting frame 533 are in the inclined state, and the specific operation process of the driving assembly 4 and the linkage assembly 5 is described in the foregoing, which is not repeated herein, and at this time, the mixed gas of the IPA vapor and the nitrogen gas and the hot nitrogen gas are sprayed to the wafer 31 through the air spraying assembly 22. After the cover 21 is fastened, the pressure inside the cleaning tank body 1 is changed as the mixed gas of the IPA vapor and the nitrogen gas and the hot nitrogen gas enter the cleaning tank body 1, and the pressure stabilizing device 121 is connected to the bottom of the inner tank body 12 in order to keep the pressure inside the cleaning tank body 1 stable. The pressure stabilizing device 121 specifically comprises an adjusting tube 1211 and a piston 1212, wherein the top end of the adjusting tube 1211 is vertically fixed to the bottom of the inner tank 12, the bottom end of the adjusting tube 1211 extends out from the bottom of the outer tank 13, and the side wall of the adjusting tube 1211 extending out from the outer tank 13 forms an air pressure adjusting opening 12111. The piston portion 1212 includes an adjusting rod (not labeled), a piston head 1214, a piston post 1215, and an adjusting block 1216, wherein the adjusting rod (not labeled) is centrally fixed at the bottom of the adjusting tube 1211, a piston cavity 1213 is centrally formed in the adjusting rod (not labeled), an air hole (not labeled) is centrally formed in the bottom of the adjusting rod (not labeled) and is communicated with the adjusting cavity, the piston head 1214 is disposed in the piston cavity 1213 and slidingly cooperates with the piston cavity 1213, the bottom end of the piston post 1215 is disposed in the piston cavity 1213 and is fixed with the midpoint of the top wall of the piston head 1214, the top end of the piston post 1215 passes out from the top end of the adjusting rod (not labeled) and is connected with the adjusting block 1216, the adjusting block 1216 is made of elastic material such as rubber, and the adjusting block 1216 abuts against the inner wall of the adjusting tube 1211. When the inner tank 12 is in a cleaning state of the wafer 31, the adjusting block 1216 is positioned at the top of the adjusting pipe 1211 near the position communicated with the inner tank 12, and the air pressure adjusting port 12111 is completely positioned below the adjusting block 1216, so that the tightness of the inner tank 12 is maintained to avoid liquid leakage. After the cleaning liquid in the inner tank 12 is discharged, the air hole (not labeled) is used for exhausting air to enable the piston head 1214 to be pressed down to the bottom end of the piston cavity 1213, at the moment, the adjusting block 1216 moves down to the state shown in fig. 2 in the adjusting pipe 1211, at the moment, the inner tank 12 is communicated with the external air pressure through the air pressure adjusting port 12111, and therefore the purpose of balancing the external atmospheric pressure and the air pressure in the cleaning tank body 1 is achieved.
In this embodiment, the wafer cleaning basket 3 is detachably mounted in the first mounting frame 532 and the second mounting frame 533 as shown in fig. 2, so as to place and take out the wafer cleaning basket 3. The support frame 14 that comprises backup pad 141 and bracing piece 142, parallel rigid coupling is in first can play effectual reinforcement effect in the backup pad 141 between first overflow plate 122 and the second overflow plate 123 at first, and rethread bracing piece 142 rigid coupling forms the frame construction between a plurality of backup pads 141 and further improves holistic stability, and two bracing pieces 142 can play simultaneously and first mounting bracket 532 and the effect of second mounting bracket 533 swivelling joint, for first mounting bracket 532 and second mounting bracket 533 direct with first overflow plate 122 and the mode of second overflow plate 123 swivelling joint, make the connection distance effectively shorten, further improve holistic structural stability. Since the driving block 51, the link assembly 52 and the force receiving rod 531 are all arranged in two groups in the present embodiment, a stable driving force is applied to two sides of the first mounting frame 532, so as to keep the movement process of the wafer 31 from the vertical state to the inclined state in the inner tank 12 more stable.
The above list of detailed descriptions is only specific to practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the spirit of the present invention should be included in the scope of the present invention.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (10)
1. An integrated wafer cleaning and drying apparatus, comprising: the cleaning tank comprises a cleaning tank body and a drying assembly, wherein the drying assembly comprises a cover body and an air injection assembly, at least one wafer cleaning basket for placing a plurality of wafers in parallel is arranged in the cleaning tank body, the cover body is arranged above a notch of the cleaning tank body, the air injection assembly is connected to one side of the cover body, which faces the interior of the cleaning tank body, and the air injection assembly injects drying gas to a plurality of wafers arranged in the wafer cleaning basket;
the cleaning device is characterized in that one side of the cover body, far away from the drying component, is connected with the driving component, a linkage component is arranged between the cover body and the wafer cleaning basket, the driving component pulls the cover body to be buckled at the notch of the cleaning tank body in the air injection state of the wafer cleaning basket, and the linkage component lifts one side of the length direction of the wafer cleaning basket so that a plurality of connecting lines at the circle centers of the wafers arranged in the wafer cleaning basket and the length direction of the cleaning tank body form included angles.
2. The integrated wafer cleaning and drying device according to claim 1, wherein the driving assembly comprises a mounting seat, a driving device and a driving piece, the mounting seat is fixedly connected to the outer side wall of the cleaning tank body, the driving device is provided with a driving cylinder with a piston rod, the top end of the piston rod of the driving device is hinged with the driving piece, the driving piece is vertically fixed with the side wall of the cover body, and one end of the driving device far away from the piston rod is hinged with the mounting seat;
the linkage assembly comprises a driving block, a connecting rod assembly and a mounting frame, a wafer cleaning basket is detachably connected in the mounting frame, the connecting rod assembly comprises a first connecting rod and a second connecting rod, the bottom surface of the driving block is provided with a wedge-shaped surface, one end of the first connecting rod is connected with a driving wheel sliding along the wedge-shaped surface, one end of the first connecting rod, far away from the driving wheel, is hinged with the top end of the second connecting rod, and the midpoint of the first connecting rod is rotationally connected with the groove wall of the cleaning groove body;
the side wall of mounting bracket length direction is connected with the washing tank body rotation, mounting bracket length direction keep away from with washing tank body rotation tie point department vertical fixation atress pole, atress pole and second connecting rod keep away from first connecting rod one end and rotate to be connected, drive arrangement's piston rod is retracted to be driven the in-process of lid lock to the notch department of washing tank body, the drive piece moves down along with the lid the wedge promotes the drive wheel moves down, the second connecting rod drives the mounting bracket is close to atress pole tie point one side lifts up.
3. The integrated wafer cleaning and drying device according to claim 2, wherein the mounting frame comprises a first mounting frame and a second mounting frame, the positions, away from each other in the length direction, of the first mounting frame and the second mounting frame are respectively and rotatably connected with the cleaning tank body, and the first mounting frame and the second mounting frame are respectively and detachably connected with a wafer cleaning basket;
the stress rod is formed on the side wall of the first installation frame, one side of the first installation frame, which is close to the second installation frame, is fixedly connected with the force application block, the second installation frame is connected with the stress block which is embedded with the top surface of the bottom surface force application block, and the second connecting rod drives the first installation frame to be close to one side of the connecting point of the stress rod when being lifted, the top surface of the force application block applies force to the force application block so that one side, which is connected with the force application block, of the second installation frame is lifted.
4. The integrated wafer cleaning and drying device according to claim 3, wherein the air injection assembly comprises a mixed air flow plate and a nitrogen pipeline, the mixed air flow plate is arranged parallel to a plane where a notch of the cleaning tank body is located, a mixed air flow channel is formed in the mixed air flow plate, and a plurality of air injection holes communicated with the mixed air flow channel are uniformly distributed on one side of the mixed air flow plate, which faces the cleaning tank body;
the nitrogen gas pipeline includes two communicating pipe bodies and is not less than two air jet pipe bodies, the air jet pipe bodies are parallel to the length direction setting of lid, two communicating pipe bodies respectively with a plurality of air jet pipe body both ends intercommunication, communicating pipe body's top surface rigid coupling in the lower surface of mixing the air current board, air jet pipe body towards a plurality of air nozzles of washing tank body one side equipartition, the lateral wall of lid connect a plurality of to mixing the air current passageway and communicating pipe body air feed inlet nozzle.
5. The integrated wafer cleaning and drying device according to claim 3, wherein the bottom wall of the cleaning tank body is provided with a liquid inlet device in a penetrating manner, the liquid inlet device comprises a liquid inlet pipe and a liquid inlet main body, the liquid inlet pipe penetrates through the bottom wall of the cleaning tank body and then is connected with the liquid inlet main body, and the liquid inlet main body is uniformly provided with a plurality of liquid inlet holes.
6. The integrated wafer cleaning and drying apparatus according to claim 5, wherein the cleaning tank body comprises an outer tank body and an inner tank body fixed on the inner side of the outer tank body, the liquid inlet pipe sequentially penetrates through the outer tank body and the bottom of the inner tank body and then is connected with the liquid inlet main body arranged in the inner tank body, the bottom of the outer tank body is connected with the liquid outlet pipe, the bottom of the inner tank body is communicated with the pressure stabilizing device, and the pressure stabilizing device penetrates out from the bottom of the outer tank body.
7. The integrated wafer cleaning and drying device according to claim 6, wherein the outer tank body is surrounded by four mounting plates, the inner tank body comprises a first overflow plate and a second overflow plate, the bottom ends of the first overflow plate and the second overflow plate are connected with each other in parallel, two sides of the first overflow plate and the second overflow plate perpendicular to the length direction are respectively fixedly connected to one mounting plate, and a plurality of overflow tanks are uniformly distributed on the top surfaces of the first overflow plate and the second overflow plate respectively;
the first mounting frame, the second mounting frame, the first connecting rod and the second connecting rod are all arranged on one side, close to each other, of the first overflow plate and the second overflow plate, the first connecting rod, the second connecting rod and the stress rod are symmetrically arranged in two groups, and the two sides of the length direction of the first connecting rod, the two sides of the length direction of the first mounting frame and the two sides of the length direction of the second mounting frame are respectively connected with the first overflow plate and the second overflow plate in a rotating mode.
8. The integrated wafer cleaning and drying device according to claim 7, wherein the pressure stabilizing device comprises a regulating pipe body and a piston part connected in the regulating pipe body in a sliding manner, the top end of the regulating pipe body is vertically communicated with the bottom connection part of the first overflow plate and the second overflow plate, the bottom of the regulating pipe body penetrates out of the outer groove body and forms an air pressure regulating port, and the opening of the air pressure regulating port is regulated by controlling the sliding of the piston part in the regulating pipe body so as to balance the cleaning tank body and the external atmospheric pressure.
9. The integrated wafer cleaning and drying apparatus according to claim 4, wherein the mixed gas flow channel is formed on a side of the mixed gas flow plate away from the communicating pipe body, the mixed gas flow plate is attached to and fixed to a sealing plate on a side of the mixed gas flow plate away from the communicating pipe body, the sealing plate is vertically fixed to a plurality of connecting frames on a side of the sealing plate away from the mixed gas flow plate, and the sealing plate is fixedly connected to a lower surface of a top wall of the cover body through the connecting frames.
10. The integrated wafer cleaning and drying device according to claim 8, wherein a supporting frame is fixedly connected between the first overflow plate and the second overflow plate, the supporting frame comprises a plurality of supporting plates vertically fixed between the first overflow plate and the second overflow plate, and two supporting rods parallelly installed at the tops of the plurality of supporting plates, a yielding groove for enabling the force rod to move is formed on the upper surface of each supporting rod, and the first installation frame and the second installation frame are respectively connected with the two supporting rods in a rotating mode.
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| CN202311433854.4A CN117153741B (en) | 2023-11-01 | 2023-11-01 | Integrated wafer cleaning and drying equipment |
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| CN202311433854.4A CN117153741B (en) | 2023-11-01 | 2023-11-01 | Integrated wafer cleaning and drying equipment |
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| US20060162748A1 (en) * | 2005-01-25 | 2006-07-27 | Lee Jong-Jae | Wafer guide and semiconductor wafer drying apparatus using the same |
| CN108831848A (en) * | 2018-06-25 | 2018-11-16 | 扬州思普尔科技有限公司 | A kind of semiconductor crystal wafer cleaning and drying device |
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| CN117153741B (en) | 2024-01-30 |
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Address after: 215000, No. 889 Zhonghua Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region after: China Address before: Room 3, 299 Yuyang Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: Suzhou Zhicheng Semiconductor Technology Co.,Ltd. Country or region before: China |