CN117153663A - Excimer light source structure, manufacturing method thereof and excimer lamp - Google Patents
Excimer light source structure, manufacturing method thereof and excimer lamp Download PDFInfo
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- CN117153663A CN117153663A CN202210569979.9A CN202210569979A CN117153663A CN 117153663 A CN117153663 A CN 117153663A CN 202210569979 A CN202210569979 A CN 202210569979A CN 117153663 A CN117153663 A CN 117153663A
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- electrode
- lamp tube
- light source
- copper
- bonding pad
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims abstract description 47
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims abstract description 47
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 68
- 239000000463 material Substances 0.000 claims description 53
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 35
- 229910052710 silicon Inorganic materials 0.000 claims description 35
- 239000010703 silicon Substances 0.000 claims description 35
- 239000000377 silicon dioxide Substances 0.000 claims description 31
- 229910044991 metal oxide Inorganic materials 0.000 claims description 30
- 150000004706 metal oxides Chemical class 0.000 claims description 30
- 238000005245 sintering Methods 0.000 claims description 21
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 20
- 239000003960 organic solvent Substances 0.000 claims description 20
- 229910052782 aluminium Inorganic materials 0.000 claims description 14
- 235000012239 silicon dioxide Nutrition 0.000 claims description 14
- 239000011230 binding agent Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 239000004115 Sodium Silicate Substances 0.000 claims description 10
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 5
- -1 aluminum ions Chemical class 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- 239000007789 gas Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 239000010953 base metal Substances 0.000 description 5
- 230000005012 migration Effects 0.000 description 5
- 238000013508 migration Methods 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical group [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000004659 sterilization and disinfection Methods 0.000 description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- 206010059866 Drug resistance Diseases 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- CRCGQDIFUPCYPU-UHFFFAOYSA-N [Cl].[Kr] Chemical compound [Cl].[Kr] CRCGQDIFUPCYPU-UHFFFAOYSA-N 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J65/00—Lamps without any electrode inside the vessel; Lamps with at least one main electrode outside the vessel
- H01J65/06—Lamps in which a gas filling is excited to luminesce by radioactive material structurally associated with the lamp, e.g. inside the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/04—Electrodes; Screens; Shields
- H01J61/06—Main electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/18—Assembling together the component parts of electrode systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/32—Sealing leading-in conductors
Abstract
An excimer light source structure, a manufacturing method thereof and an excimer lamp. The excimer light source structure cover body is provided with a first chamber; the lamp tube is fixed in the first cavity; the interior of the lamp tube is filled with dischargeable gas; the first electrode and the second electrode are welded on the outer side wall of the lamp tube; the first electrode is connected with the lamp tube through a first bonding pad, and the second electrode is connected with the lamp tube through a second bonding pad; at least one of the first bonding pad and the second bonding pad is made of copper-aluminum alloy. By adopting the scheme, the occurrence of the failure condition of the interior of the excimer light source structure caused by poor welding can be reduced, and the use cost of the excimer lamp is reduced.
Description
Technical Field
The invention relates to the technical field of lamps, in particular to an excimer light source structure, a manufacturing method thereof and an excimer lamp.
Background
The ultraviolet sterilization has the characteristics of high efficiency, rapidness, thoroughness, no chemical agent, no drug resistance, no secondary pollution and the like, and is widely applied to the fields of hospitals, schools, air conditioning systems, water treatment systems, disinfection cabinets and the like.
The excimer lamp is used for generating ultraviolet rays with different wave bands, and is a common method for artificial short wave ultraviolet rays at present.
The principle of generating ultraviolet rays by the excimer lamp is as follows: in dielectric barrier discharge (Dielectric Barrier Discharge, DBD), krypton atoms are efficiently excited by electrons having an average energy of several electron volts, and these krypton atoms in an excited state collide with surrounding chlorine atoms to recombine into excited krypton-chlorine excimer. When the excited excimer transitions down to the ground state, ultraviolet light of the corresponding wavelength band (e.g., 254nm or 222 nm) is emitted.
However, the existing excimer light source structure often fails due to poor internal welding, resulting in higher usage cost of the excimer lamp.
Disclosure of Invention
The invention aims to solve the problems that: how to reduce the occurrence of failure caused by poor welding in the excimer light source structure, and reduce the use cost of the excimer lamp.
To solve the above problems, an embodiment of the present invention provides an excimer light source structure, including: a housing having a first chamber; the lamp tube is fixed in the first cavity; the interior of the lamp tube is filled with dischargeable gas; the first electrode and the second electrode are welded on the outer side wall of the lamp tube; the first electrode is connected with the lamp tube through a first bonding pad, and the second electrode is connected with the lamp tube through a second bonding pad; at least one of the first bonding pad and the second bonding pad is made of copper-aluminum alloy.
Optionally, the copper-aluminum alloy further comprises: a silicon base material; the silicon substrate comprises silicon dioxide and is used for improving the adhesiveness between the corresponding bonding pad and the lamp tube.
Optionally, the silicon substrate further comprises: diboron trioxide and sodium silicate.
Optionally, the silicon substrate further comprises: a metal oxide.
Optionally, the silicon substrate further comprises: an organic solvent.
Optionally, the silicon substrate further comprises: and (3) a binder.
Optionally, in the silicon base material, the proportion of silicon dioxide ranges from 40% to 75%, the proportion of metal oxide ranges from 20% to 55%, and the proportion of the organic solvent ranges from 5% to 10%.
Optionally, the proportion of copper in the copper-aluminum alloy ranges from 60% to 90%, and the proportion of aluminum ranges from 8% to 30%.
Optionally, the material of the lamp tube is quartz glass.
The embodiment of the invention also provides a manufacturing method of the excimer light source structure, which comprises the following steps: providing a cover body, a lamp tube, a first electrode and a second electrode, wherein the interior of the lamp tube is filled with dischargeable gas; printing the copper-aluminum alloy on the outer side wall of the lamp tube at a position for installing the first electrode and the second electrode; drying the printed copper-aluminum alloy; sintering the dried copper-aluminum alloy and the lamp tube to bond the first electrode and the second electrode with the lamp tube; and placing the lamp tube, the first electrode and the second electrode which are bonded together into the cover body.
Optionally, the sintering temperature ranges from 400 ℃ to 800 ℃.
The embodiment of the invention also provides an excimer lamp, which comprises any one of the excimer light source structures.
Compared with the prior art, the technical scheme of the embodiment of the invention has the following advantages:
by applying the scheme of the invention, as at least one of the first bonding pad and the second bonding pad is made of copper-aluminum alloy, the copper ion has low activity relative to silver ion, and is not easy to migrate in a high-temperature high-ozone high-frequency environment, thereby avoiding the loss of the metal base between the bonding pad and the electrode, reducing the early failure of the bonding pad caused by the migration of the metal base, prolonging the service life of the excimer light source structure and reducing the use cost of the excimer lamp. In addition, because aluminum ions are further included in the copper-aluminum alloy, the granularity of the aluminum ions is small, and the stress after loose sintering can be larger by changing the proportion of the aluminum ions in the copper-aluminum alloy, so that the expansion coefficient of the copper-aluminum alloy can be improved, the copper-aluminum alloy can be matched with the expansion coefficient of the lamp tube, and therefore the bonding pad cannot be peeled off from the side wall of the lamp tube in the service life.
Further, the copper-aluminum alloy further comprises a silicon base material, the silicon base material comprises silicon dioxide, and the silicon dioxide has an expansion coefficient similar to that of the lamp tube material, so that the adhesiveness between the corresponding bonding pad and the lamp tube can be further improved, the copper-aluminum alloy can better fix the bonding pad on the side wall of the lamp tube, and the bonding pad is prevented from being peeled off from the side wall of the lamp tube.
Furthermore, the silicon base material also comprises metal oxide, and the addition of the metal oxide can reduce the sintering temperature of the copper-aluminum alloy, thereby reducing the process difficulty and the cost for fixing the copper-aluminum alloy on the side wall of the lamp tube.
Drawings
FIG. 1 is a schematic side view of a lamp tube;
FIG. 2 is a top view of a lamp tube;
FIG. 3 is a schematic side view of a lamp according to an embodiment of the present invention;
FIG. 4 is a graphical comparison of pad life curves for different materials;
FIG. 5 is a flow chart of a method for fabricating an excimer light source structure according to an embodiment of the invention.
Detailed Description
Referring to fig. 1, the conventional excimer light source structure includes a lamp 11, and two electrodes, a first electrode 12 and a second electrode 13, located in the lamp. Each electrode is connected to a power source by a respective external lead. The lamp tube is filled with dischargeable gas, when the electrodes are connected with a power supply through the outer lead, an electric arc is generated between the two electrodes, and the electric arc can excite the dischargeable gas in the lamp tube to discharge.
Since the electrode is not easily connected to the outer lead, pads are generally symmetrically formed on both sides of the electrode to be electrically connected to the outer lead. Referring to fig. 2, taking the first electrode 11 as an example, bonding pads 111 may be symmetrically formed on both sides of the first electrode 11 by means of adhesion, soldering, or the like, and the bonding pads 111 are tightly connected to the first electrode 11 to conduct electricity, and the external leads are soldered to the bonding pads to energize the first electrode 11.
The inventors found that the cause of occurrence of poor welding is: the metal ions in the bonding pad material are silver ions, the activity of the silver ions is high, migration is easy to occur under the high-temperature high-ozone high-frequency environment, the base metal between the bonding pad and the electrode is lost, the bonding pad is enabled to fail early, and finally the use cost of the excimer lamp is high.
In order to solve the problems, the invention provides an excimer light source structure, in the excimer light source structure, at least one of a first bonding pad and a second bonding pad is made of copper-aluminum alloy, and compared with silver ions, the copper ions are low in activity and are not easy to migrate in a high-temperature high-ozone high-frequency environment, so that the defect of a base metal between the bonding pad and an electrode can be avoided, early failure of the bonding pad caused by the migration of the base metal is reduced, the service life of the excimer light source structure is prolonged, and the use cost of an excimer lamp is reduced. In addition, because the copper-aluminum alloy also comprises aluminum ions, the expansion coefficient of the copper-aluminum alloy can be improved by changing the proportion of the aluminum ions in the copper-aluminum alloy, so that the copper-aluminum alloy can be matched with the expansion coefficient of the lamp tube, and the bonding pad cannot be peeled off from the side wall of the lamp tube in the service life.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention briefly described above will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
The embodiment of the invention provides an excimer light source structure, which can comprise:
a housing having a first chamber;
the lamp tube is fixed in the first cavity; the interior of the lamp tube is filled with dischargeable gas;
the first electrode and the second electrode are welded on the outer side wall of the lamp tube; the first electrode is connected with the lamp tube through a first bonding pad, and the second electrode is connected with the lamp tube through a second bonding pad;
at least one of the first bonding pad and the second bonding pad is made of copper-aluminum alloy.
In a specific implementation, only the material of the first bonding pad may be copper-aluminum alloy, while the material of the second bonding pad is still silver, or only the material of the second bonding pad may be copper-aluminum alloy, while the material of the first bonding pad is still silver, or both the materials of the first bonding pad and the second bonding pad may be copper-aluminum alloy.
It can be understood that when the material of the first bonding pad or the second bonding pad is copper-aluminum alloy, the sputtering migration of silver ions can be reduced to a certain extent compared with the material of the first bonding pad and the second bonding pad, and the loss of the base metal between the bonding pad and the electrode can be improved. When the materials of the first bonding pad and the second bonding pad are copper-aluminum alloy, the sputtering migration of silver ions can be reduced to the greatest extent compared with the materials of the first bonding pad and the second bonding pad, the base metal loss between the bonding pad and the electrode is improved, and at the moment, the service life of the excimer light source structure is longest.
In a specific implementation, the first external lead is connected to the first electrode through a first pad. The second outer lead is connected to the second electrode through a second pad. In other words, the first pad is used to connect the first electrode with the first external lead, and the second pad is used to connect the second electrode with the second external lead.
For example, referring to fig. 3, the first electrode 31 may be fixed to the sidewall of the lamp tube 32 by means of adhesion, or welding. Since the first electrode 31 and the first outer lead 33 are not easily connected, the first pads 34 are symmetrically disposed on both sides of the first electrode to electrically connect with the first outer lead 33. The first bonding pad 34 is tightly connected with the first electrode 31, and the first outer lead 33 is soldered to the first bonding pad 34, thereby enabling the first electrode 31 to be energized.
FIG. 4 is a graph comparing life curves of pads of different materials. Referring to fig. 4, as the time of use varies, the residual content of metal ions in the pads of different materials correspondingly varies. Wherein the horizontal axis represents the use time, and the vertical axis represents the proportion of the residual content of metal ions in the bonding pad to the whole bonding pad. Curve 41 represents the pad life curve of silver material. Curve 42 represents the pad life curve of the silver alloy material. Curve 43 represents the pad life curve of copper material. Curve 44 represents the pad life curve of gold material. Curve 45 represents the pad life curve of the aluminum material.
As can be seen from fig. 4, the pads of silver material and silver alloy have failed within 1000 hours, while the pads of copper material, gold material and aluminum material have been effective for a period of time well exceeding 1000 hours. And the pads of copper material remain at a higher level at 4000 hours.
Thus, the lifetime of pads comprising copper is much higher than with other materials.
Since copper can only reach a micron level in particle size, and aluminum can reach a nanometer level in particle size, in the embodiment of the present invention, the material of the pad contains not only copper but also aluminum at the same time. The granularity of aluminum ions is smaller, and the stress after loose sintering can be larger by changing the proportion of the aluminum ions in the copper-aluminum alloy, so that the expansion coefficient of the copper-aluminum alloy is improved, the copper-aluminum alloy can be matched with the expansion coefficient of the lamp tube, and the bonding pad cannot be peeled off from the side wall of the lamp tube in the service life.
In an embodiment of the present invention, the proportion of copper in the copper-aluminum alloy may range from 60% to 90%, and the proportion of aluminum may range from 8% to 30%. At this time, the service life of the bonding pad can be prolonged, and the bonding pad can not be peeled off from the lamp tube in the service life.
In a specific implementation, the material of the lamp tube can be quartz glass, and of course, other materials can also be used.
In an embodiment of the invention, when the material of the lamp tube is quartz glass, a silicon base material may be further included in the copper-aluminum alloy. The main component of the silicon base material may be used to improve the adhesion between the respective bonding pad and the lamp vessel.
For example, when the material of the lamp tube is quartz glass, the silicon base material may include silicon dioxide, and since the expansion coefficients of the silicon dioxide and the quartz glass are similar, the adhesion between the corresponding bonding pad and the lamp tube may be further improved, so that the copper-aluminum alloy may better fix the bonding pad on the side wall of the lamp tube, and prevent the bonding pad from peeling off from the side wall of the lamp tube.
In a specific implementation, the sintering temperature of pure silicon dioxide is higher, usually up to 1700-1900 ℃, resulting in higher process cost and higher process difficulty, and in a specific implementation, the silicon base material can further comprise, in addition to silicon dioxide: a material that can reduce the sintering temperature. The material for lowering the sintering temperature may be various substances.
In one embodiment of the present invention, the sintering temperature-reducing material may be diboron trioxide (B 2 O 3 ) Sodium silicate (Na) 2 SiO 3 ) At least one of them. Wherein, both the diboron trioxide and the sodium silicate can loosen silicon oxygen tetrahedron in silicon dioxide, so that the sintering temperature of the silicon base material is reduced.
In another embodiment of the present invention, the material for reducing sintering temperature may further be: a metal oxide. The metal oxide may be sodium oxide, potassium oxide, calcium oxide, or the like. Because the metal oxide can loose silicon oxygen tetrahedron in the silicon dioxide, the sintering temperature of the silicon base material is reduced, thereby reducing the process difficulty.
In other embodiments, the silicon substrate may also include diboron trioxide, sodium silicate and metal oxides to more effectively reduce the sintering temperature of the silicon substrate.
In another embodiment of the present invention, the silicon base material may further include: an organic solvent. The organic solvent can be butyl anhydride acetate, diethylene glycol butyl ether acetate, diethylene glycol diethyl ether acetate, isophorone and the like. The addition of the organic solvent can dissolve other components (such as metal oxide, silicon dioxide, diboron trioxide, sodium silicate and the like) in the silicon base material into slurry.
In some embodiments, the silicon substrate may further include: and (3) a binder. The bonding agent can enable the bonding between the bonding pad and the lamp tube to be more tight. The binder may be a synthetic resin, and is not limited herein.
In a specific implementation, in the silicon-based material, the proportion range of silicon dioxide is 40% -75%, the proportion range of metal oxide is 20% -55%, and the proportion range of the organic solvent is 5% -10%.
In some embodiments, the silicon base may be comprised of silica and metal oxide.
For example, the proportion of silica may be 75% and the proportion of metal oxide may be 25%.
For another example, the proportion of silica may be 70% and the proportion of metal oxide may be 30%.
For another example, the proportion of silica may be 65% and the proportion of metal oxide may be 35%.
In some embodiments, the silicon base may be composed of silica, metal oxide, and an organic solvent.
For example, the proportion of silica may be 75%, the proportion of metal oxide may be 20%, and the proportion of organic solvent may be 5%.
For another example, the proportion of silica may be 70%, the proportion of metal oxide may be 25%, and the proportion of organic solvent may be 5%.
For another example, the proportion of silica may be 65%, the proportion of metal oxide may be 30%, and the proportion of organic solvent may be 5%.
In some embodiments, the silicon base may be composed of silica, metal oxide, organic solvent, and binder.
For example, the proportion of silica may be 70%, the proportion of metal oxide may be 20%, the proportion of organic solvent may be 5%, and the proportion of binder may be 5%.
For another example, the proportion of silica may be 70%, the proportion of metal oxide may be 2%, the proportion of organic solvent may be 5%, and the proportion of binder may be 5%.
For another example, the silica may be 65%, the metal oxide may be 28%, the organic solvent may be 5%, and the binder may be 2%.
In some embodiments, the silicon base may be composed of silica, metal oxides, organic solvents, binders, diboron trioxide, and sodium silicate.
For example, the silica may be 70%, the metal oxide may be 20%, the organic solvent may be 5%, the binder may be 3%, and the diboron trioxide and sodium silicate may be 2%.
For another example, the silica may be 70%, the metal oxide may be 2%, the organic solvent may be 5%, the binder may be 2%, and the diboron trioxide and sodium silicate may be 3%.
For another example, the silica may be 65%, the metal oxide may be 28%, the organic solvent may be 3%, the binder may be 2%, and the diboron trioxide and sodium silicate may be 2%.
Referring to fig. 5, the embodiment of the present invention further provides a method for manufacturing the excimer light source structure in the above embodiment, where the method may include the following steps:
step 51, providing a lamp tube, a first electrode and a second electrode, wherein the interior of the lamp tube is filled with a dischargeable gas.
In a specific implementation, when the first electrode and the second electrode are electrified, an arc is generated between the two electrodes, and the arc excites the dischargeable gas in the lamp tube to discharge.
And step 52, printing the copper-aluminum alloy on the outer side wall of the lamp tube at the positions for installing the first electrode and the second electrode.
In a specific implementation, the positions on the outer sidewall of the lamp tube for installing the first electrode and the second electrode may be preset, and are not particularly limited, so long as the distance between the first electrode and the second electrode is greater than or equal to the minimum safe distance between the electrodes.
And step 53, drying the printed copper-aluminum alloy.
In a specific implementation, the lamp tube printed with the copper-aluminum alloy can be put into a drying machine for drying.
And step 54, sintering the dried copper-aluminum alloy and the lamp tube to bond the first electrode and the second electrode with the lamp tube.
In specific implementation, the dried copper-aluminum alloy and the lamp tube can be placed into a sintering furnace for sintering, so that the dried copper-aluminum alloy and the lamp tube are firmly bonded together, and the electrode is conducted for electrifying.
In a specific implementation, the copper-aluminum alloy can further comprise a silicon base material. The silicon base material can only contain silicon dioxide, and at the moment, the sintering temperature is high, and the process difficulty is high.
In an embodiment, the silicon substrate may further include a metal oxide, where the metal oxide may reduce the sintering temperature, so that the sintering temperature may be reduced to 400 ℃ to 800 ℃, thereby effectively reducing the process cost and the process difficulty.
Step 55, placing the bonded lamp tube, the first electrode and the second electrode into the cover body.
In a specific implementation, the cover body is internally provided with a position capable of fixing the lamp tube, so that the adhered lamp tube, the first electrode and the second electrode can be fixed in the cover body.
According to the excimer light source structure in the embodiment of the invention, the material of the bonding pad can be arranged on round and special-shaped lamp tubes. In addition, through a large number of experimental demonstration, the bonding pad material in the embodiment of the invention can ensure that the bonding pad is not easy to fall off, deform and migrate sputtering, and the service life of the lamp tube is greatly prolonged.
The embodiment of the invention also provides an excimer lamp, which comprises any one of the excimer light source structures.
According to the DBD excimer lamp provided by the embodiment of the invention, as the pad material is copper-aluminum alloy in the excimer light source structure, the service life of the DBD excimer lamp can be effectively prolonged, and thus the use cost of the DBD excimer lamp can be effectively reduced.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (12)
1. An excimer light source structure, comprising:
a housing having a first chamber;
the lamp tube is fixed in the first cavity; the interior of the lamp tube is filled with dischargeable gas;
the first electrode and the second electrode are welded on the outer side wall of the lamp tube; the first electrode is connected with the lamp tube through a first bonding pad, and the second electrode is connected with the lamp tube through a second bonding pad;
at least one of the first bonding pad and the second bonding pad is made of copper-aluminum alloy.
2. The excimer light source structure of claim 1, wherein said copper-aluminum alloy further comprises: a silicon base material; the silicon substrate comprises silicon dioxide and is used for improving the adhesiveness between the corresponding bonding pad and the lamp tube.
3. The excimer light source structure of claim 2, wherein said silicon base further comprises: diboron trioxide and sodium silicate.
4. The excimer light source structure of claim 2 or claim 3, wherein said silicon base further comprises: a metal oxide.
5. The excimer light source structure of claim 4, wherein said silicon base further comprises: an organic solvent.
6. The excimer light source structure of claim 5, wherein said silicon base further comprises: and (3) a binder.
7. The structure of claim 6, wherein the silicon base has a silica content ranging from 40% to 75%, the metal oxide content ranging from 20% to 55%, and the organic solvent content ranging from 5% to 10%.
8. The excimer light source structure of claim 1, wherein the copper-aluminum alloy has a copper proportion in the range of 60% to 90% and aluminum in the range of 8% to 30%.
9. The excimer light source structure of claim 1, wherein said lamp tube is made of quartz glass.
10. A method of fabricating an excimer light source structure according to any one of claims 1 to 9, comprising:
providing a cover body, a lamp tube, a first electrode and a second electrode, wherein the interior of the lamp tube is filled with dischargeable gas;
printing the copper-aluminum alloy on the outer side wall of the lamp tube at a position for installing the first electrode and the second electrode;
drying the printed copper-aluminum alloy;
sintering the dried copper-aluminum alloy and the lamp tube to bond the first electrode and the second electrode with the lamp tube;
and placing the lamp tube, the first electrode and the second electrode which are bonded together into the cover body.
11. The method of claim 10, wherein the sintering is performed at a temperature in the range of 400 ℃ to 800 ℃.
12. An excimer lamp, characterized by comprising an excimer light source structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210569979.9A CN117153663A (en) | 2022-05-24 | 2022-05-24 | Excimer light source structure, manufacturing method thereof and excimer lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210569979.9A CN117153663A (en) | 2022-05-24 | 2022-05-24 | Excimer light source structure, manufacturing method thereof and excimer lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117153663A true CN117153663A (en) | 2023-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210569979.9A Pending CN117153663A (en) | 2022-05-24 | 2022-05-24 | Excimer light source structure, manufacturing method thereof and excimer lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117153663A (en) |
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2022
- 2022-05-24 CN CN202210569979.9A patent/CN117153663A/en active Pending
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