CN117148231B - Test system of electronic connector based on data analysis - Google Patents
Test system of electronic connector based on data analysis Download PDFInfo
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- CN117148231B CN117148231B CN202311418920.0A CN202311418920A CN117148231B CN 117148231 B CN117148231 B CN 117148231B CN 202311418920 A CN202311418920 A CN 202311418920A CN 117148231 B CN117148231 B CN 117148231B
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- 238000012360 testing method Methods 0.000 title claims abstract description 240
- 238000007405 data analysis Methods 0.000 title claims description 11
- 230000007613 environmental effect Effects 0.000 claims abstract description 13
- 238000004458 analytical method Methods 0.000 claims description 33
- 238000004891 communication Methods 0.000 claims description 27
- 238000012544 monitoring process Methods 0.000 claims description 20
- 238000013499 data model Methods 0.000 claims description 19
- 238000003780 insertion Methods 0.000 claims description 18
- 230000037431 insertion Effects 0.000 claims description 18
- 230000001133 acceleration Effects 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- 230000002159 abnormal effect Effects 0.000 claims description 15
- 238000005259 measurement Methods 0.000 claims description 13
- 238000000605 extraction Methods 0.000 claims description 12
- 238000006073 displacement reaction Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 9
- 238000010606 normalization Methods 0.000 claims description 8
- 230000000875 corresponding effect Effects 0.000 claims description 6
- 238000004364 calculation method Methods 0.000 claims description 5
- 230000005856 abnormality Effects 0.000 claims description 3
- 238000009863 impact test Methods 0.000 claims description 3
- 230000014759 maintenance of location Effects 0.000 claims description 3
- 238000011156 evaluation Methods 0.000 abstract description 3
- 101100311460 Schizosaccharomyces pombe (strain 972 / ATCC 24843) sum2 gene Proteins 0.000 description 4
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- 238000007792 addition Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
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- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
- G01R31/68—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board
- G01R31/69—Testing of releasable connections, e.g. of terminals mounted on a printed circuit board of terminals at the end of a cable or a wire harness; of plugs; of sockets, e.g. wall sockets or power sockets in appliances
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0028—Force sensors associated with force applying means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M13/00—Testing of machine parts
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/02—Vibration-testing by means of a shake table
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/02—Vibration-testing by means of a shake table
- G01M7/025—Measuring arrangements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M7/00—Vibration-testing of structures; Shock-testing of structures
- G01M7/08—Shock-testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
Abstract
The invention relates to the technical field of electronic connectors, and is used for solving the problems that the conventional testing mode of the electronic connector cannot accurately reflect the situation in practical application, so that the electric, mechanical and environmental testing of the electronic connector is difficult to realize, the testing authenticity of the electronic connector is lower, and the quality of the electronic connector is difficult to accurately evaluate. According to the invention, the working conditions of the electronic connector in different environments are simulated, so that the test and evaluation of the electronic connector in multiple aspects are realized, the performance state of the electronic connector is accurately output, and a powerful data support is provided for manufacturers to accurately know the quality level of the electronic connector.
Description
Technical Field
The invention relates to the technical field of electronic connectors, in particular to a test system of an electronic connector based on data analysis.
Background
An electronic connector is a device or assembly for connecting and transmitting electronic signals. It is typically made of metal or alloy material with a pluggable design for connecting different components, modules or circuit boards of an electronic device. The primary function of the electronic connector is to provide a reliable and stable electrical connection to ensure transmission and communication of signals. They play a critical role in the design, manufacture and maintenance of electronic devices.
Therefore, the factory testing of the electronic connector is of great importance.
However, the existing test methods for the electronic connector are mostly dependent on specific test equipment and test environments, so that the test results may not accurately reflect the situations in practical applications, and therefore it is difficult to realize the electrical, mechanical and environmental tests for the electronic connector, the authenticity of the test for the electronic connector is low, and the quality of the electronic connector is difficult to be accurately evaluated.
In order to solve the above-mentioned defect, a technical scheme is provided.
Disclosure of Invention
The present invention is directed to a testing system for an electronic connector based on data analysis, so as to solve the above-mentioned problems of the related art.
The aim of the invention can be achieved by the following technical scheme: the test system of the electronic connector based on data analysis comprises a server, wherein the server is in communication connection with a data acquisition unit, a cloud database, an electrical measurement unit, a physical measurement unit, a ring measurement unit and a display terminal;
the data acquisition unit is used for acquiring electrical parameter data, mechanical parameter data and test temperature of the electronic connector and sending various types of information to the cloud database for storage;
the cloud database is also used for storing an electrical state judging table and a mechanical state judging table;
the electrical measurement unit is used for monitoring electrical parameter data of the electronic connector, so as to test and analyze the electrical state of the electronic connector, output an electrical test failure signal or an electrical test failure signal according to the electrical parameter data, and display and explain the electrical test state of the electronic connector through the display terminal;
the object testing unit is used for monitoring the mechanical parameter data of the electronic connector, so as to test and analyze the mechanical state of the electronic connector, output a mechanical test failure signal or a mechanical test failure signal according to the mechanical parameter data, and display and explain the mechanical test state of the electronic connector through the display terminal;
the loop test unit is used for applying a plurality of test temperatures to the gradient of the electronic connector, so as to test and analyze the environment state of the electronic connector, output an environment test failure signal or an environment test passing signal according to the test temperature, and display and explain the environment test state of the electronic connector through the display terminal.
Preferably, the monitoring of the electrical parameter data of the electronic connector specifically includes the following steps:
the conduction state among the pins arranged in the electronic connector is monitored in real time, and in the non-energized state, the resistance value between the two pins is measured by a digital multimeter tester and is recorded as R i If R is i When=0, it means that the two pins are in connection conduction state, and thus an LJ connection signal is generated, otherwise, if R i When the signal is infinite, the two pins are in a connection non-conduction state, and LJ non-communication signals are generated, wherein i is represented as a measurement logarithm, i is a positive integer, the sum of the numbers marked as LJ communication signals and LJ non-communication signals is counted and respectively marked as sum1 and sum2, sum1+ sum2 = i, the two data are substituted into a data calculation model,outputting a connection conduction index cnt of the electronic connector, wherein deltasum is expressed as a quantity reference difference value, lambda 1 is expressed as a conversion factor coefficient, and e, lambda 1 and deltasum are constants;
acquiring signal waveforms transmitted between two pins through an oscilloscope, setting reference waveforms of the signal waveforms, calculating the coincidence ratio between the signal waveforms and the reference waveforms, if the coincidence ratio is larger than a preset reference coincidence threshold value, indicating that the two pins are in a transmission conducting state, generating CS communication signals, and if the coincidence ratio is smaller than or equal to the preset reference coincidence threshold value, indicating that the two pins are in a transmission non-conducting state, generating CS non-communication signals, calculating the ratio between the sum of the number marked as CS communication signals and the sum of the number marked as CS non-communication signals, outputting the transmission conducting occupation ratio of the electronic connector, and recording the transmission conducting occupation ratio as tcr;
comprehensively analyzing the connection conduction index and the transmission conduction occupation ratio of the electronic connector according to a set data model: gfv =γ1×cnt+γ2×tcr, whereby the conduction value gfv of the electronic connector is output, wherein γ1 and γ2 are the normalization factors of the connection conduction index and the transmission conduction duty ratio, respectively, and γ1 and γ2 are natural numbers greater than 0.
Preferably, the electrical state of the electronic connector is tested and analyzed, and the specific analysis process is as follows:
the method comprises the steps of acquiring a conduction value, a contact resistance, an insulation resistance, a current and a voltage in electrical parameter data of an electronic connector in real time, calculating and analyzing various electrical parameters, and according to a set data model:the electrical state coefficient esc of the output electronic connector is thus output, wherein cr is represented by a contact resistance, sr is represented by an insulation resistance, dl is represented by a current, du is represented by a voltage, cr is represented by a reference contact resistance, sr is represented by a reference insulation resistance, dl is represented by a reference current, du is represented by a reference voltage, ρ1, ρ2 are weight factor coefficients, ρ1, ρ2 are natural numbers greater than 0;
comparing and matching the electrical state coefficients with an electrical state judgment table stored in a cloud database, thereby obtaining electrical test grades of the electronic connector, wherein each electrical state coefficient corresponds to one electrical test grade, and the electrical test grades comprise a normal electrical test grade and an abnormal electrical test grade;
counting the occupation ratio of the number of the electronic connectors outputting the abnormal electrical test grade, recording the occupation ratio as an electrical test feedback value Dzb, comparing and analyzing the electrical test feedback value Dzb with a preset electrical test threshold value, generating an electrical test failing signal if the electrical test feedback value Dzb is larger than or equal to the preset electrical test threshold value, namely, indicating that the electrical test of the batch of electronic connectors fails, otherwise, generating an electrical test passing signal if the electrical test feedback value Dzb is smaller than the preset electrical test threshold value, namely, indicating that the electrical test of the batch of electronic connectors fails.
Preferably, the monitoring of the mechanical parameter data of the electronic connector specifically includes the following steps:
the insertion and extraction force test is carried out on the electronic connector, the force value required by the electronic connector during each insertion and extraction is monitored in real time, and the force value is respectively recorded as Fb j And Fo j Wherein j represents the number of times of insertion and extraction, and j is a positive integer, wherein j=1, 2,3 … … m1, m1 is the total number of times of insertion and extraction;
the retention force value and the rotation moment value required by the insertion of the electronic connector after each insertion are obtained in real time and respectively recorded as Fk j And Fbm j And acquiring the rotation moment value required by each pulling-out of the electronic connector in real time and recording the rotation moment value as Fom j ；
Calculating and analyzing each parameter obtained in the plugging force test of the electronic connector, and according to a set data model:thereby outputting a plug-in performance value ppc of the electronic connector, wherein λ2 is represented as a conversion factor coefficient;
applying n1 vibration amplitudes of different frequencies to the electronic connector by performing vibration impact resistance test on the electronic connector, monitoring the acceleration change value of the electronic connector under each vibration amplitude in real time through an acceleration sensor, and recording the acceleration change value as abv n1 Wherein n1 is a positive integer, the acceleration variation values of the electronic connector under n1 vibration amplitudes are subjected to mean analysis, and the formula is used for:thereby outputting a vibration acceleration characteristic value at of the electronic connector;
and thereby monitor the vibration amplitude at n1 different frequenciesThe displacement variation value of the electronic connector of (2) is recorded as dx n1 And (3) carrying out mean value analysis on the displacement variation values of the electronic connector under n1 vibration amplitudes, and according to the formula:thereby outputting a vibration displacement characteristic value xt of the electronic connector;
then n2 impact forces are applied to the electronic connector, and the magnitude and duration of the impact force applied to the electronic connector during the n2 impact forces are monitored and respectively recorded as Fc n2 Sum ct n2 And substituting the two items of data into a preset data model for analysis, and according to the data model:outputting an impact characteristic value lpt of the electronic connector, wherein, xi 1 and xi 2 are normalization factors, and both xi 1 and xi 2 are constants;
calculating and analyzing various parameters acquired by the electronic connector in the vibration impact test, and according to a set data model: vpc=δ1×at+δ2×xt+δ3×lpt, thereby outputting vibration and impact resistant performance values vpc of the electronic connector, where δ1, δ2, and δ3 are weight factor coefficients of a vibration acceleration characteristic value, a vibration displacement characteristic value, and an impact characteristic value, respectively, and δ1, δ2, and δ3 are natural numbers greater than 0.
Preferably, the mechanical state of the electronic connector is subjected to test analysis, and the specific analysis process is as follows:
comprehensively analyzing the plugging energy value and the vibration-resistant and impact-resistant energy value in the mechanical parameter data of the electronic connector, and according to a set data model:outputting a mechanical performance coefficient mpc of the electronic connector, wherein mu 1 is expressed as a plug performance reference value, mu 2 is expressed as a vibration-resistant impact performance reference value, a1 and a2 are normalization factors of a plug performance value and a vibration-resistant impact performance value respectively, and a1 and a2 are natural numbers larger than 0;
comparing and matching the mechanical performance coefficients with a mechanical state judging table stored in a cloud database, thereby obtaining mechanical test grades of the electronic connector, wherein each mechanical performance coefficient corresponds to one mechanical test grade, and the mechanical test grades comprise a normal mechanical test grade and an abnormal mechanical test grade;
counting the ratio of the number of the electronic connectors outputting the abnormal mechanical test grade, recording the ratio as a physical test feedback value Wzb, comparing and analyzing the physical test feedback value Wzb with a preset physical test threshold value, generating a mechanical test failing signal if the physical test feedback value Wzb is larger than or equal to the preset physical test threshold value, namely, indicating that the mechanical test of the batch of electronic connectors fails, otherwise, generating a mechanical test passing signal if the physical test feedback value Wzb is smaller than the preset physical test threshold value, namely, indicating that the mechanical test of the batch of electronic connectors fails.
Preferably, the testing analysis is performed on the environmental state of the electronic connector, and the specific analysis process is as follows:
setting h test temperatures in a gradient way, sequentially and continuously acting the h test temperatures on the electronic connector, acquiring the initial working temperature and the final working temperature of the electronic connector under the action of each test temperature, performing differential analysis on the two items of data, and performing differential analysis according to the formula: operating temperature change value = i end operating temperature-initial operating temperature i, thereby outputting an operating temperature change value for the electronic connector for each test temperature;
setting a temperature change comparison threshold of a working temperature change value, comparing and analyzing the working temperature change value of the electronic connector under the action of each test temperature with a preset temperature change comparison threshold, generating a temperature abnormal signal if the working temperature change value is larger than the preset temperature change comparison threshold, outputting a test temperature with corresponding action, comparing and analyzing the acting test temperature with a corresponding set temperature range, and generating an environment test failed signal if the test temperature is in a set temperature range;
if the test temperature exceeds the set temperature range, the occupation ratio of the number of the electronic connectors marked as the temperature abnormality signal is called and is recorded as a loop test feedback value Hzb, the loop test feedback value Hzb is compared and analyzed with a preset loop test threshold value, if the loop test feedback value Hzb is more than or equal to the preset loop test threshold value, an environment test failed signal is generated, namely that the environment test of the batch of electronic connectors fails, otherwise, if the loop test feedback value Hzb is less than the preset loop test threshold value, an environment test failed signal is generated, namely that the environment test of the batch of electronic connectors fails.
The invention has the beneficial effects that:
according to the invention, parameters such as conduction condition, insulation, resistance, current and voltage of the electronic connector are comprehensively analyzed, so that the electrical performance state of the electronic connector is estimated, and the electronic connector is tested from the electrical level.
The method adopts a data model analysis and a data comparison analysis mode to realize the evaluation analysis of the plugging performance and the mechanical strength of the electronic connector, thereby defining the mechanical test condition of the electronic connector and ensuring that the electronic connector bears various mechanical stresses without damage under the actual use condition.
The method comprises the steps of setting a plurality of environmental conditions through gradients, sequentially applying the environmental conditions to the electronic connector, and monitoring the running performance of the electronic connector in real time, so that the performance and reliability of the electronic connector under different environmental conditions are fed back, and the environmental test of the electronic connector is realized.
The working conditions of the electronic connector in different environments are simulated, so that the electronic connector can be tested and evaluated in multiple aspects, the performance state of the electronic connector can be accurately output, and powerful data support is provided for manufacturers to accurately know the quality level of the electronic connector.
Drawings
The invention is further described below with reference to the accompanying drawings.
Fig. 1 is a system block diagram of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the invention discloses a testing system of an electronic connector based on data analysis, which comprises a server, wherein the server is in communication connection with a data acquisition unit, a cloud database, an electrical measurement unit, an object measurement unit, a ring measurement unit and a display terminal.
The data acquisition unit is used for acquiring electrical parameter data, mechanical parameter data and test temperature of the electronic connector and sending various types of information to the cloud database for storage.
The cloud database is also used for storing an electrical state determination table and a mechanical state determination table.
The electrical measurement unit is used for monitoring the electrical parameter data of the electronic connector, and the specific monitoring process is as follows:
the conduction state among the pins arranged in the electronic connector is monitored in real time, and in the non-energized state, the resistance value between the two pins is measured by a digital multimeter tester and is recorded as R i If R is i When=0, it means that the two pins are in connection conduction state, and thus an LJ connection signal is generated, otherwise, if R i When the signal is infinite, the two pins are in a connection non-conduction state, and LJ non-communication signals are generated, wherein i is represented as a measurement logarithm, i is a positive integer, the sum of the numbers marked as LJ communication signals and LJ non-communication signals is counted and respectively marked as sum1 and sum2, sum1+ sum2 = i, the two data are substituted into a data calculation model,whereby the connection conduction index cnt of the electronic connector is output, wherein deltasum is expressed as a quantity reference difference, λ1 is expressed as a conversion factor coefficient, and e, λ1, deltasum are constants,custom setting by technicians;
acquiring signal waveforms transmitted between two pins through an oscilloscope, setting reference waveforms of the signal waveforms, calculating the coincidence ratio between the signal waveforms and the reference waveforms, if the coincidence ratio is larger than a preset reference coincidence threshold value, indicating that the two pins are in a transmission conducting state, generating CS communication signals, and if the coincidence ratio is smaller than or equal to the preset reference coincidence threshold value, indicating that the two pins are in a transmission non-conducting state, generating CS non-communication signals, calculating the ratio between the sum of the number marked as CS communication signals and the sum of the number marked as CS non-communication signals, outputting the transmission conducting occupation ratio of the electronic connector, and recording the transmission conducting occupation ratio as tcr;
comprehensively analyzing the connection conduction index and the transmission conduction occupation ratio of the electronic connector according to a set data model: gfv =γ1×cnt+γ2×tcr, thereby outputting a conduction value gfv of the electronic connector, wherein γ1 and γ2 are normalization factors of a connection conduction index and a transmission conduction duty ratio, respectively, the normalization factors are used for representing coefficients for converting various data in a data model into a dimensionless form, and γ1 and γ2 are natural numbers larger than 0 and are custom-set by a technician;
the electrical state of the electronic connector is tested and analyzed, and the specific analysis process is as follows:
the method comprises the steps of acquiring a conduction value, a contact resistance, an insulation resistance, a current and a voltage in electrical parameter data of an electronic connector in real time, calculating and analyzing various electrical parameters, and according to a set data model:the electrical state factor esc of the output electronic connector is thus output, wherein cr is denoted as contact resistance, sr is denoted as insulation resistance, dl is denoted as current, du is denoted as voltage, cr is denoted as reference contact resistance, sr is denoted as reference insulation resistance, dl is denoted as reference current, du is denoted as reference voltage, ρ1, ρ2 are weight factor coefficients, ρ1, ρ2 are natural numbers greater than 0, which are custom set by the skilled person, the weight factor coefficients are used for equalizing the various dataThe duty ratio weight in formula calculation, thereby promoting the accuracy of calculation results;
comparing and matching the electrical state coefficients with an electrical state judgment table stored in a cloud database, thereby obtaining electrical test grades of the electronic connector, wherein each electrical state coefficient corresponds to one electrical test grade, and the electrical test grades comprise a normal electrical test grade and an abnormal electrical test grade;
counting the occupation ratio of the number of the electronic connectors outputting abnormal electrical test grades, recording the occupation ratio as an electrical test feedback value Dzb, comparing and analyzing the electrical test feedback value Dzb with a preset electrical test threshold value, if the electrical test feedback value Dzb is larger than or equal to the preset electrical test threshold value, generating an electrical test failed signal, namely indicating that the electrical test of the batch of electronic connectors fails, otherwise, if the electrical test feedback value Dzb is smaller than the preset electrical test threshold value, generating an electrical test passed signal, namely indicating that the electrical test of the batch of electronic connectors fails;
and displaying and describing the mechanical test state of the electronic connector through the display terminal without passing the signal or with passing the signal.
The physical measurement unit is used for monitoring the mechanical parameter data of the electronic connector, and the specific monitoring process is as follows:
the insertion and extraction force test is carried out on the electronic connector, the force value required by the electronic connector during each insertion and extraction is monitored in real time, and the force value is respectively recorded as Fb j And Fo j Wherein j represents the number of times of insertion and extraction, and j is a positive integer, wherein j=1, 2,3 … … m1, m1 is the total number of times of insertion and extraction;
the retention force value and the rotation moment value required by the insertion of the electronic connector after each insertion are obtained in real time and respectively recorded as Fk j And Fbm j And acquiring the rotation moment value required by each pulling-out of the electronic connector in real time and recording the rotation moment value as Fom j ；
Calculating and analyzing each parameter obtained in the test of the plugging force of the electronic connector, and according to the set data modelType (2):outputting a plug-in performance value ppc of the electronic connector, wherein λ2 is represented as a conversion factor coefficient which is custom set by a technician and is used for converting physical quantities of all data items into data coefficients of the same physical quantity;
applying n1 vibration amplitudes of different frequencies to the electronic connector by performing vibration impact resistance test on the electronic connector, monitoring the acceleration change value of the electronic connector under each vibration amplitude in real time through an acceleration sensor, and recording the acceleration change value as abv n1 Wherein n1 is a positive integer, the acceleration variation values of the electronic connector under n1 vibration amplitudes are subjected to mean analysis, and the formula is used for:thereby outputting a vibration acceleration characteristic value at of the electronic connector;
and thereby monitoring the displacement variation value of the electronic connector at n1 vibration amplitudes of different frequencies and recording it as dx n1 And (3) carrying out mean value analysis on the displacement variation values of the electronic connector under n1 vibration amplitudes, and according to the formula:thereby outputting a vibration displacement characteristic value xt of the electronic connector;
then n2 impact forces are applied to the electronic connector, and the magnitude and duration of the impact force applied to the electronic connector during the n2 impact forces are monitored and respectively recorded as Fc n2 Sum ct n2 And substituting the two items of data into a preset data model for analysis, and according to the data model:outputting an impact characteristic value lpt of the electronic connector, wherein, xi 1 and xi 2 are normalization factors, and xi 1 and xi 2 are constants and are self-defined by technicians;
calculating and analyzing various parameters acquired by the electronic connector in the vibration impact test, and according to a set data model: vpc=δ1×at+δ2×xt+δ3×lpt, thereby outputting a vibration and impact resistant energy value vpc of the electronic connector, where δ1, δ2, and δ3 are weight factor coefficients of a vibration acceleration feature value, a vibration displacement feature value, and an impact feature value, respectively, and δ1, δ2, and δ3 are natural numbers greater than 0, which are set by a technician in a custom manner;
mechanical testing mainly evaluates the plugging performance, durability and mechanical strength of the electronic connector;
the mechanical state of the electronic connector is tested and analyzed, and the specific analysis process is as follows:
comprehensively analyzing the plugging energy value and the vibration-resistant and impact-resistant energy value in the mechanical parameter data of the electronic connector, and according to a set data model:outputting a mechanical performance coefficient mpc of the electronic connector, wherein mu 1 is expressed as a plug performance reference value, mu 2 is expressed as a vibration-resistant impact performance reference value, a1 and a2 are normalization factors of a plug performance value and a vibration-resistant impact performance value respectively, and a1 and a2 are natural numbers larger than 0 and are custom-set by technicians;
comparing and matching the mechanical performance coefficients with a mechanical state judging table stored in a cloud database, thereby obtaining mechanical test grades of the electronic connector, wherein each mechanical performance coefficient corresponds to one mechanical test grade, and the mechanical test grades comprise a normal mechanical test grade and an abnormal mechanical test grade;
counting the ratio of the number of the electronic connectors outputting abnormal mechanical test grades, recording a physical test feedback value Wzb, comparing and analyzing the physical test feedback value Wzb with a preset physical test threshold, if the physical test feedback value Wzb is larger than or equal to the preset physical test threshold, generating a mechanical test failing signal, namely indicating that the mechanical test of the batch of electronic connectors fails, otherwise, if the physical test feedback value Wzb is smaller than the preset physical test threshold, generating a mechanical test failing signal, namely indicating that the mechanical test of the batch of electronic connectors fails;
and displaying and describing the mechanical test state of the electronic connector through the display terminal without passing the signal or with passing the signal.
The loop test unit is used for applying a plurality of test temperatures to the gradient of the electronic connector, so that the environmental state of the electronic connector is tested and analyzed, and the specific analysis process is as follows:
setting h test temperatures in a gradient way, sequentially and continuously acting the h test temperatures on the electronic connector, acquiring the initial working temperature and the final working temperature of the electronic connector under the action of each test temperature, performing differential analysis on the two items of data, and performing differential analysis according to the formula: operating temperature change value = i end operating temperature-initial operating temperature i, thereby outputting an operating temperature change value for the electronic connector for each test temperature;
setting a temperature change comparison threshold of a working temperature change value, comparing and analyzing the working temperature change value of the electronic connector under the action of each test temperature with a preset temperature change comparison threshold, generating a temperature abnormal signal if the working temperature change value is larger than the preset temperature change comparison threshold, outputting a test temperature with corresponding action, comparing and analyzing the acting test temperature with a corresponding set temperature range, and generating an environment test failed signal if the test temperature is in a set temperature range;
if the test temperature exceeds the set temperature range, the ratio of the number of the electronic connectors marked as the temperature abnormality signal is called and is recorded as a loop test feedback value Hzb, the loop test feedback value Hzb is compared and analyzed with a preset loop test threshold value, if the loop test feedback value Hzb is more than or equal to the preset loop test threshold value, an environment test failed signal is generated, namely the environment test failed signal of the batch of electronic connectors is generated, otherwise, if the loop test feedback value Hzb is less than the preset loop test threshold value, an environment test failed signal is generated, namely the environment test failed signal of the batch of electronic connectors is generated;
and displaying and explaining the output environment test failure signal or the environment test passing signal to the environment test state of the electronic connector through the display terminal.
When the invention is used, the electrical performance state of the electronic connector is evaluated by comprehensively analyzing the parameters such as the conduction condition, insulation, resistance, current, voltage and the like of the electronic connector, and the test of the electronic connector is realized from the electrical level.
The method adopts a data model analysis and a data comparison analysis mode to realize the evaluation analysis of the plugging performance and the mechanical strength of the electronic connector, thereby defining the mechanical test condition of the electronic connector and ensuring that the electronic connector bears various mechanical stresses without damage under the actual use condition.
The method comprises the steps of setting a plurality of environmental conditions through gradients, sequentially applying the environmental conditions to the electronic connector, and monitoring the running performance of the electronic connector in real time, so that the performance and reliability of the electronic connector under different environmental conditions are fed back, and the environmental test of the electronic connector is realized.
The working conditions of the electronic connector in different environments are simulated, so that the electronic connector can be tested and evaluated in multiple aspects, the performance state of the electronic connector can be accurately output, and powerful data support is provided for manufacturers to accurately know the quality level of the electronic connector.
The foregoing is merely illustrative of the structures of this invention and various modifications, additions and substitutions for those skilled in the art can be made to the described embodiments without departing from the scope of the invention or from the scope of the invention as defined in the accompanying claims.
Claims (5)
1. A test system for an electronic connector based on data analysis, comprising: the server is connected with an electrical measurement unit, an object measurement unit and a ring measurement unit in a communication way;
the electrical measurement unit is used for monitoring electrical parameter data of the electronic connector, and the specific monitoring process is as follows:
the conduction state among the pins arranged in the electronic connector is monitored in real time, and in the non-energized state, the resistance value between the two pins is measured by a digital multimeter tester and is recorded as R i If R is i When=0, it means that the two pins are in connection conduction state, and thus an LJ connection signal is generated, otherwise, if R i When the connection is infinite, the two pins are in a connection non-conduction state, LJ non-communication signals are generated, the sum of the numbers marked as the LJ communication signals and the LJ non-communication signals is counted respectively, and the two items of data are substituted into a data calculation model, so that the connection conduction index of the electronic connector is output;
acquiring signal waveforms transmitted between two pins through an oscilloscope, setting reference waveforms of the signal waveforms, calculating the coincidence ratio between the signal waveforms and the reference waveforms, if the coincidence ratio is larger than a preset reference coincidence threshold value, indicating that the two pins are in a transmission conducting state, generating CS communication signals, and if the coincidence ratio is smaller than or equal to the preset reference coincidence threshold value, indicating that the two pins are in a transmission non-conducting state, generating CS non-communication signals, calculating the ratio between the sum of the number of the CS communication signals marked as CS communication signals and the sum of the number of the CS non-communication signals marked as CS communication signals, and outputting the transmission conducting occupation ratio of the electronic connector;
comprehensively analyzing the connection conduction index and the transmission conduction duty ratio of the electronic connector, thereby outputting the conduction value of the electronic connector;
the electrical state of the electronic connector is tested and analyzed, and accordingly an electrical test fail signal or an electrical test pass signal is output;
the object testing unit is used for monitoring the mechanical parameter data of the electronic connector, so as to test and analyze the mechanical state of the electronic connector, and accordingly, a mechanical test failed signal or a mechanical test passed signal is output; the process of monitoring the mechanical parameter data of the electronic connector is as follows:
by testing the insertion and extraction force of the electronic connector and monitoring the insertion and extraction of the electronic connector each time in real timeThe required force values are respectively recorded as Fb j And Fo j Wherein j represents the number of times of insertion and extraction, and j=1, 2,3 … … m1 and m1 are the total number of times of insertion and extraction;
the retention force value and the rotation moment value required by the insertion of the electronic connector after each insertion are obtained in real time and respectively recorded as Fk j And Fbm j And acquiring the rotation moment value required by each pulling-out of the electronic connector in real time and recording the rotation moment value as Fom j ；
Calculating and analyzing each parameter obtained in the plugging force test of the electronic connector, and according to a set data model:thereby outputting a plug-in performance value ppc of the electronic connector, wherein λ2 is represented as a conversion factor coefficient for converting physical quantities of all data items into data coefficients of the same physical quantity;
applying n1 vibration amplitudes of different frequencies to the electronic connector by performing vibration impact resistance test on the electronic connector, monitoring the acceleration change value of the electronic connector under each vibration amplitude in real time through an acceleration sensor, and recording the acceleration change value as abv n1 The acceleration change values of the electronic connector under n1 vibration amplitudes are subjected to mean value analysis, and the formula is used for:thereby outputting a vibration acceleration characteristic value at of the electronic connector;
and thereby monitoring the displacement variation value of the electronic connector at n1 vibration amplitudes of different frequencies and recording it as dx n1 And (3) carrying out mean value analysis on the displacement variation values of the electronic connector under n1 vibration amplitudes, and according to the formula:thereby outputting a vibration displacement characteristic value xt of the electronic connector;
then applying impact force with n2 forces to the electronic connector,and thereby the magnitude and duration of the impact force received by the electronic connector during n2 impact forces are monitored and respectively noted as Fc n2 Sum ct n2 And substituting the two items of data into a preset data model for analysis, and according to the data model:outputting an impact characteristic value lpt of the electronic connector, wherein, xi 1 and xi 2 are normalization factors;
calculating and analyzing various parameters obtained by the electronic connector in the vibration impact test, and outputting a vibration impact resistance energy value of the electronic connector;
the loop test unit is used for applying a plurality of test temperatures to the gradient of the electronic connector, so as to perform test analysis on the environment state of the electronic connector, and accordingly, output an environment test non-passing signal or an environment test passing signal.
2. The system for testing an electronic connector based on data analysis according to claim 1, wherein the electrical state of the electronic connector is tested and analyzed by the following specific analysis process:
acquiring a conduction value, a contact resistance, an insulation resistance, a current and a voltage in the electrical parameter data of the electronic connector in real time, and calculating and analyzing various electrical parameters, so as to output an electrical state coefficient of the electronic connector;
comparing and matching the electrical state coefficients with an electrical state judgment table stored in a cloud database, thereby obtaining electrical test grades of the electronic connector, wherein each electrical state coefficient corresponds to one electrical test grade, and the electrical test grades comprise a normal electrical test grade and an abnormal electrical test grade;
counting the occupation ratio of the number of the electronic connectors outputting the abnormal electrical test grade, recording the occupation ratio as an electrical test feedback value Dzb, comparing and analyzing the electrical test feedback value Dzb with a preset electrical test threshold value, generating an electrical test failing signal if the electrical test feedback value Dzb is larger than or equal to the preset electrical test threshold value, namely, indicating that the electrical test of the batch of electronic connectors fails, otherwise, generating an electrical test passing signal if the electrical test feedback value Dzb is smaller than the preset electrical test threshold value, namely, indicating that the electrical test of the batch of electronic connectors fails.
3. The system for testing an electronic connector based on data analysis according to claim 1, wherein the server is further communicatively connected with a data acquisition unit and a cloud database; the data acquisition unit is used for acquiring electrical parameter data, mechanical parameter data and test temperature of the electronic connector and sending various types of information to the cloud database for storage; the cloud database is also used for storing an electrical state judgment table and a mechanical state judgment table.
4. The system for testing an electronic connector based on data analysis according to claim 1, wherein the mechanical state of the electronic connector is tested and analyzed by the following specific analysis process:
comprehensively analyzing the plugging energy value and the vibration-resistant and impact-resistant energy value in the mechanical parameter data of the electronic connector, thereby outputting the mechanical performance coefficient of the electronic connector;
comparing and matching the mechanical performance coefficients with a mechanical state judging table stored in a cloud database, thereby obtaining mechanical test grades of the electronic connector, wherein each mechanical performance coefficient corresponds to one mechanical test grade, and the mechanical test grades comprise a normal mechanical test grade and an abnormal mechanical test grade;
counting the ratio of the number of the electronic connectors outputting the abnormal mechanical test grade, recording the ratio as a physical test feedback value Wzb, comparing and analyzing the physical test feedback value Wzb with a preset physical test threshold value, generating a mechanical test failing signal if the physical test feedback value Wzb is larger than or equal to the preset physical test threshold value, namely, indicating that the mechanical test of the batch of electronic connectors fails, otherwise, generating a mechanical test passing signal if the physical test feedback value Wzb is smaller than the preset physical test threshold value, namely, indicating that the mechanical test of the batch of electronic connectors fails.
5. The system for testing an electronic connector based on data analysis according to claim 1, wherein the environmental state of the electronic connector is tested and analyzed by the following specific analysis process:
setting h test temperatures in a gradient way, sequentially and continuously acting the h test temperatures on the electronic connector, acquiring the initial working temperature and the final working temperature of the electronic connector under the action of each test temperature, performing differential analysis on the two items of data, and performing differential analysis according to the formula: operating temperature change value = i end operating temperature-initial operating temperature i, thereby outputting an operating temperature change value for the electronic connector for each test temperature;
setting a temperature change comparison threshold of a working temperature change value, comparing and analyzing the working temperature change value of the electronic connector under the action of each test temperature with a preset temperature change comparison threshold, generating a temperature abnormal signal if the working temperature change value is larger than the preset temperature change comparison threshold, outputting a test temperature with corresponding action, comparing and analyzing the acting test temperature with a corresponding set temperature range, and generating an environment test failed signal if the test temperature is in a set temperature range;
if the test temperature exceeds the set temperature range, the occupation ratio of the number of the electronic connectors marked as the temperature abnormality signal is called and is recorded as a loop test feedback value Hzb, the loop test feedback value Hzb is compared and analyzed with a preset loop test threshold value, if the loop test feedback value Hzb is more than or equal to the preset loop test threshold value, an environment test failed signal is generated, namely that the environment test of the batch of electronic connectors fails, otherwise, if the loop test feedback value Hzb is less than the preset loop test threshold value, an environment test failed signal is generated, namely that the environment test of the batch of electronic connectors fails.
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