CN117133693A - Substrate carrier and coating equipment - Google Patents
Substrate carrier and coating equipment Download PDFInfo
- Publication number
- CN117133693A CN117133693A CN202311397417.1A CN202311397417A CN117133693A CN 117133693 A CN117133693 A CN 117133693A CN 202311397417 A CN202311397417 A CN 202311397417A CN 117133693 A CN117133693 A CN 117133693A
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- China
- Prior art keywords
- support
- quartz tube
- carrier
- supporting part
- end plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 title claims abstract description 5
- 239000011248 coating agent Substances 0.000 title abstract description 5
- 238000000576 coating method Methods 0.000 title abstract description 5
- 239000010453 quartz Substances 0.000 claims abstract description 90
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 90
- 238000009792 diffusion process Methods 0.000 claims description 16
- 238000005192 partition Methods 0.000 claims description 16
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 230000002035 prolonged effect Effects 0.000 abstract description 5
- 239000000725 suspension Substances 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 14
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000012050 conventional carrier Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229940095676 wafer product Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to a substrate carrier and coating equipment, the carrier includes: a boat body; a first support part mounted at one end of the boat body in a first direction; the second supporting part and the first supporting part are arranged at the same end of the boat body in the first direction, and the second supporting part and the first supporting part are arranged at intervals along the second direction; and the third supporting part is arranged at the other end of the boat body in the first direction, and in the second direction, the third supporting part is positioned between the first supporting part and the second supporting part. According to the carrier, the first supporting part, the second supporting part and the third supporting part which are in the shape of the Chinese character 'pin' are arranged, so that the first supporting part, the second supporting part and the third supporting part can be in contact with the inner wall of the quartz tube, the phenomenon that one or more supporting parts cannot be in suspension with the quartz tube is avoided, and the pressure born by the first supporting part, the second supporting part and the third supporting part is basically consistent, so that the service life of the carrier is prolonged.
Description
Technical Field
The application relates to the technical field of photovoltaic production equipment, in particular to a substrate carrier and coating equipment.
Background
In the preparation process of the solar cell, the silicon wafer needs to be subjected to working procedures such as texturing, diffusion, etching, coating and printing in sequence. The diffusion process is a core process in the preparation process of the solar cell, namely, a silicon wafer is put into a quartz tube in a diffusion furnace by taking a quartz boat as a carrier, and nitrogen, oxygen and a diffusion source are introduced into the diffusion furnace at a certain temperature so as to diffuse and deposit a junction on the surface of the silicon wafer.
In the diffusion process, the deformation of the quartz boat is an important factor causing the breakage of the silicon wafer or the card. Particularly, for a quartz boat used for high-temperature boron diffusion equipment, the process temperature reaches 1050 ℃, the annealing strain temperature of the quartz boat is close to that of a high-purity quartz material, after a plurality of rounds of high-temperature diffusion processes, the silicon wafer cannot be placed in a tooth slot due to high-temperature creep deformation accumulated by the quartz boat, the silicon wafer is warped and even cracked due to the tooth slot position with serious deformation and deviation, and therefore the qualification rate of a process silicon wafer product is reduced and the fragmentation rate is increased. In order to ensure normal production of equipment, the current common practice in the industry is to replace the deformed quartz boat offline, and as the deformation period of the quartz boat is fast, the continuous service life is short (about 4 months), the manufacturing cost is expensive, and the production and operation costs are greatly increased by frequently replacing new quartz boats.
The conventional quartz boat cannot be in contact with the inner wall of the quartz tube due to manufacturing errors or assembly errors, one or more boat feet are suspended, the suspended boat feet are limited due to the fact that the inner wall of the quartz tube is not provided, and creep speed of the suspended boat feet is faster than that of other boat feet in a long-term high-temperature diffusion process, so that the quartz boat is easier to deform.
Disclosure of Invention
Based on the above, it is necessary to provide a carrier and a plating apparatus for solving the problem that the legs of the quartz boat cannot be fully contacted with the inner wall of the quartz tube.
A carrier, comprising:
a boat body;
a first support part mounted at one end of the boat body in a first direction;
the second supporting part and the first supporting part are arranged at the same end of the boat body at intervals along a second direction, and the second direction intersects with the first direction;
and the third supporting part is arranged at the other end of the boat body in the first direction, and in the second direction, the third supporting part is positioned between the first supporting part and the second supporting part.
In one embodiment, the first support portion has a first contact surface for abutting against an inner wall of the quartz tube, the second support portion has a second contact surface for abutting against the inner wall of the quartz tube, and the third support portion has a third contact surface for abutting against the inner wall of the quartz tube.
In one embodiment, at least one of the first contact surface, the second contact surface, and the third contact surface is a cambered surface.
In one embodiment, the arc of the arc surface is consistent with the arc of the inner wall of the quartz tube.
In one embodiment, the boat body comprises a first end plate, a second end plate and two side plates, wherein the first end plate and the second end plate are arranged at intervals along the first direction, two ends of each side plate are respectively connected with the first end plate and the second end plate, and the two side plates are arranged at intervals along the second direction;
the first end plate is provided with the first supporting part and the second supporting part, and the second end plate is provided with the third supporting part.
In one embodiment, the first end plate is provided with a first supporting groove, and the first supporting groove is located between the first supporting portion and the second supporting portion.
In one embodiment, the boat body further comprises a partition plate, two ends of the partition plate are respectively connected with the two side plates and located between the first end plate and the second end plate, and a second supporting groove is formed in the partition plate.
In one embodiment, the spacer is disposed adjacent the second end plate.
The diffusion furnace comprises a quartz tube and the carrier, wherein the first supporting part, the second supporting part and the third supporting part are abutted against the inner wall of the quartz tube.
In one embodiment, the diffusion furnace further comprises a paddle rod, and the paddle rod penetrates through the first supporting groove and the second supporting groove of the carrier.
According to the carrier, the first supporting part, the second supporting part and the third supporting part which are in the shape of the Chinese character 'pin' are arranged, so that the first supporting part, the second supporting part and the third supporting part can be in contact with the inner wall of the quartz tube, the phenomenon that one or more supporting parts cannot be in suspension with the quartz tube is avoided, and the pressure born by the first supporting part, the second supporting part and the third supporting part is basically consistent, so that the service life of the carrier is prolonged. Moreover, the carrier is supported on the inner wall of the quartz tube through the three points at the bottom of the boat body through the first support part, the second support part and the third support part in the shape of the Chinese character 'pin', and the suspended support part does not exist, so that the three-point support is more stable, and even if the carrier is subjected to external vibration, the carrier is not easy to shake, and the stability of silicon wafer processing is ensured.
Drawings
Fig. 1 is a schematic structural diagram of a carrier according to some embodiments of the application.
Fig. 2 is a schematic view of the carrier in the quartz tube according to the embodiment of fig. 1.
FIG. 3 is a schematic view of the carrier in the quartz tube according to the embodiment of FIG. 2 from another perspective.
Fig. 4 is a schematic structural diagram of the embodiment of fig. 1 in which the paddle is supported by a carrier.
Reference numerals illustrate:
a boat body 10; a first end plate 11; a second end plate 12; a side plate 13; a first support groove 14; a first support surface 15; a second support groove 16; a second support surface 17; a partition 18;
a first support portion 20; a first contact surface 21;
a second supporting portion 30; second contact surface 31
A third supporting portion 40; a third contact surface 41;
a quartz tube 50; a paddle lever 51;
a first direction X; a second direction Y.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.
Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.
Referring to fig. 1 and 2, fig. 1 shows a schematic structural diagram of a carrier according to an embodiment of the present application, and fig. 2 shows a schematic structural diagram of the carrier according to the embodiment of fig. 1 when the carrier is in a quartz tube, where the carrier according to an embodiment of the present application includes a boat 10, the boat 10 is used for carrying silicon wafers, and after the silicon wafers are placed in the boat 10, the carrier needs to be placed in the quartz tube 50 to perform surface diffusion deposition on the silicon wafers.
In order to enable the carrier to be stably held in the quartz tube 50, the carrier further includes a first support 20, a second support 30, and a third support 40 for supporting the boat 10, the first support 20, the second support 30, and the third support 40 are all disposed at the bottom of the boat 10, and the first support 20 and the second support 30 are all mounted on the same end of the boat 10 in the first direction X, and the first support 20 and the second support 30 are arranged at intervals along a second direction Y intersecting the first direction X, and the third support 40 is mounted on the other end of the boat 10 in the first direction X, and in the second direction Y, the third support 40 is located between the first support 20 and the second support 30.
That is, the first support part 20, the second support part 30 and the third support part 40 are arranged in a delta shape at the bottom of the boat body 10, when the boat body 10 is placed in the quartz tube 50 along the first direction X, the first support part 20, the second support part 30 and the third support part 40 are all in contact with the inner wall of the quartz tube 50, and the first support part 20 and the second support part 30 are abutted with the two arc ends of the bottom of the quartz tube 50 due to the circular cross section of the inner wall of the quartz tube 50, and the third support part 40 is in contact with the portion of the inner wall of the quartz tube 50 near the bottom.
The traditional carrier adopts four supporting parts, because the inner wall section of the quartz tube 50 is circular, the carrier adopting four supporting parts can have three supporting parts to contact with the inner wall of the quartz tube 50, and the other supporting part is in a suspended state, so that the creep speed of the suspended supporting part can be faster than that of other supporting parts, and the carrier is easier to deform.
The first, second and third supporting portions 20, 30 and 40 are in a delta shape, so that the first, second and third supporting portions 20, 30 and 40 can be in contact with the inner wall of the quartz tube 50, and the phenomenon that one or more supporting portions cannot be in suspension when in contact with the quartz tube 50 does not exist, so that the pressures received by the first, second and third supporting portions 20, 30 and 40 are basically consistent, and the service life of the carrier is prolonged.
Further, in the conventional carrier using four support portions, since only three support portions are in contact with the inner wall of the quartz tube 50, the other support portion is in a suspended state, if the carrier is subjected to external vibration, the carrier is caused to shake at the suspended support portion to affect the processing of the silicon wafer.
And through first supporting part 20, second supporting part 30 and third supporting part 40 of article font, support on the inner wall of quartz capsule 50 through the three-point at the bottom of the boat body 10, there is not unsettled supporting part to the three-point supports more stably, even receives outside vibrations, the carrier also is difficult to produce and rocks, has guaranteed the stability of silicon chip processing.
According to the carrier, the first support portion 20, the second support portion 30 and the third support portion 40 are in the delta shape, so that the first support portion 20, the second support portion 30 and the third support portion 40 can be in contact with the inner wall of the quartz tube 50, the phenomenon that one or more support portions cannot be in suspension when being in contact with the quartz tube 50 does not exist, and the pressures received by the first support portion 20, the second support portion 30 and the third support portion 40 are basically consistent, so that the service life of the carrier is prolonged. Moreover, the carrier is supported on the inner wall of the quartz tube 50 at the bottom of the boat body 10 through the three points by the first support part 20, the second support part 30 and the third support part 40 in the shape of a Chinese character 'pin', and the suspended support part is not present, so that the three-point support is more stable, and the carrier is not easy to shake even if being subjected to external vibration, thereby ensuring the stability of silicon wafer processing.
In an actual use process, the first support portion 20, the second support portion 30 and the third support portion 40 may be formed by using a conventional carrier to set boat legs, or may be formed by using a part of the structure of the boat 10, for example, two outer walls of the boat 10 in the second direction are in contact with the inner wall of the quartz chamber 50, and portions of the two outer walls of the boat 10 are used to support the boat 10, and portions of the two outer walls of the boat 10 in contact with the inner wall of the quartz chamber 50 are used as the first support portion 20 and the second support portion 30, and the third support portion 40.
In some embodiments of the present application, referring to fig. 3, the first support part 20 has a first contact surface 21 for abutting against the inner wall of the quartz tube 50, the second support part 30 has a second contact surface 31 for abutting against the inner wall of the quartz tube 50, the first contact surface 21 and the second contact surface 31 are symmetrically arranged along a symmetry plane passing through the central axis of the boat body 10 and passing through the axis of the quartz tube 50, so that the weight of the boat body 10 at one end in the first direction X can be equally divided on the first support part 20 and the second support part 30 and transferred to the inner wall of the quartz tube 50 through the first contact surface 21 and the second contact surface 31, thereby ensuring the stability of the boat body 10.
Further, the third supporting portion 40 has a third contact surface 41 for abutting against the inner wall of the quartz tube 50, and the above-mentioned symmetry surface passes through the third contact surface 41, that is, the third supporting portion 40 is disposed at the middle of the boat body 10 in the second direction Y, so that the weight of the other end of the boat body 10 in the first direction X can be applied on the bottom of the inner wall of the quartz tube 50 through the third supporting portion 40, and forms a three-point support for the boat body 10 in cooperation with the first supporting portion 20 and the second supporting portion 30, ensuring the stability of the boat body 10.
In some embodiments, the first contact surface 21 and the second contact surface 31 are arc surfaces, and since the inner wall of the quartz tube 50 is also arc surface, the first contact surface 21 and the second contact surface 31 are also arc surfaces, so that the contact area between the first support portion 20 and the second support portion 30 and the inner wall of the quartz tube 50 can be increased to increase the contact stability between the first support portion 20 and the second support portion 30 and the inner wall of the quartz tube 50.
Further, the third contact surface 41 is also an arc surface, so as to increase the contact area between the third support portion 40 and the inner wall of the quartz tube 50 in an arc surface manner, thereby increasing the contact stability between the third support portion 40 and the inner wall of the quartz tube 50.
In particular, in some embodiments, when the first contact surface 21 and the second contact surface 31 are cambered surfaces, the radians of the first contact surface 21 and the second contact surface 31 may be set to be consistent with the radian of the inner wall of the quartz tube 50, that is, the first contact surface 21 and the second contact surface 31 are parallel to each other with respect to the inner wall of the quartz tube 50, so that the first contact surface 21 and the second contact surface 31 can completely contact with each other with respect to the inner wall of the quartz tube 50, thereby further improving the contact stability of the first support portion 20 and the second support portion 30 with respect to the inner wall of the quartz tube 50.
Further, when the third contact surface 41 is a cambered surface, the radian of the third contact surface 41 may be set to be identical to the radian of the inner wall of the quartz tube 50, that is, the third contact surface 41 and the inner wall of the quartz tube 50 are parallel to each other, so that the third contact surface 41 can be completely in contact with the inner wall of the quartz tube 50, further improving the contact stability of the third support portion 40 and the inner wall of the quartz tube 50.
It should be noted that, in other embodiments, one or more of the first contact surface 21, the second contact surface 31, and the third contact surface 41 may also be planar, so that the first support portion 20, the second support portion 30, and the third support portion 40 form at least one support point on the inner wall of the quartz tube 50. In the practical use process, the shapes of the first contact surface 21, the second contact surface 31 and the third contact surface 41 can be selected according to the practical process requirements, so that the first support portion 20, the second support portion 30 and the third support portion 40 form three support points, or one support point and two support surfaces, or two support points and one support surface and other support modes on the inner wall of the quartz tube 50.
In some embodiments of the present application, the boat body 10 includes a first end plate 11, a second end plate 12, and two side plates 13, the first end plate 11 and the second end plate 12 are arranged at intervals along the first direction X, two ends of each side plate 13 are respectively connected to the first end plate 11 and the second end plate 12, and the two side plates 13 are arranged at intervals along the second direction Y. The first end plate 11, the second end plate 12, the first end plate 11 and the second end plate 12 are mutually surrounded to form a containing space for containing silicon wafers.
Wherein the first end plate 11 is provided with a first supporting portion 20 and a second supporting portion 30, the first supporting portion 20 and the second supporting portion 30 are respectively disposed at the bottom of the first end plate 11 and are respectively disposed at two ends of the second end plate 12 in the second direction Y, that is, the first supporting portion 20 and the second supporting portion 30 are respectively disposed at two corners of the bottom of the first end plate 11. The second end plate 12 is provided with a third supporting portion 40, and the third supporting portion 40 is protruded in the middle of the second end plate 12 in the second direction Y, wherein the length of the third supporting portion 40 is slightly longer than the lengths of the first supporting portion 20 and the second supporting portion 30 because the third supporting portion 40 needs to be in contact with the bottom of the inner wall of the quartz tube 50.
In actual use, referring to fig. 4, the carrier needs to enter the interior of the quartz tube 50 from one end of the quartz tube 50 and finally be placed in the interior of the quartz tube 50, and in order to feed the carrier into the interior of the quartz tube 50, the carrier needs to be lifted by the paddle 51 by using the paddle 51 so as to be driven by the paddle 51 to extend into the interior of the quartz tube 50 together, thereby placing the carrier into the quartz tube 50.
In order to enable the paddle 51 to lift the carrier, in some embodiments, a first support slot 14 is formed on the first end plate 11, the first support slot 14 is located between the first support portion 20 and the second support portion 30, and the paddle 51 can extend into the bottom of the boat 10 through the first end to lift the boat 10, so as to drive the boat 10 to move together.
In some embodiments, the boat body 10 further includes a partition 18, and both ends of the partition 18 are connected to the two side plates 13, respectively, and located between the first end plate 11 and the second end plate 12, so that the connection between the two side plates 13 is reinforced by the partition 18, thereby reinforcing the strength of the entire boat body 10.
The second supporting groove 16 is formed on the partition 18, and after the paddle rod 51 passes through the first supporting groove 14, the paddle rod 51 can continue to move until the paddle rod 51 passes through the second supporting groove 16, and the paddle rod 51 can lift the carrier together through the first supporting groove 14 and the second supporting groove 16 and move the carrier.
In an actual use process, the bottom of the first supporting groove 14 is provided with a first supporting surface 15 for abutting against the paddle rod 51, the bottom of the second supporting groove 16 is provided with a second supporting surface 17 for abutting against the paddle rod 51, and when the paddle rod 51 is arranged in the first supporting groove 14 and the second supporting groove 16 in a penetrating manner, the first supporting surface 15 and the second supporting surface 17 are abutted against the paddle rod 51, so that the paddle rod 51 can lift the carrier through the first supporting surface 15 and the second supporting surface 17.
In order to make the paddle 51 more stable when lifting the carrier, the partition 18 is disposed close to the second end plate 12, so that the weight of the carrier can be uniformly distributed to both the partition 18 and the first end plate 11, if the partition 18 is too close to the first end plate 11, most of the weight of the boat 10 will be distributed to the partition 18, and damage to the partition 18 will easily occur.
The embodiment of the application further provides a diffusion furnace, which comprises a quartz tube 50 and the carrier in any embodiment, wherein the first support part 20, the second support part 30 and the third support part 40 are all abutted against the inner wall of the quartz tube 50, and the first support part 20, the second support part 30 and the third support part 40 which are in a delta shape can be mutually contacted with the inner wall of the quartz tube 50 through the first support part 20, the second support part 30 and the third support part 40, so that the phenomenon that one or more support parts cannot be contacted with the quartz tube 50 and are suspended is avoided, and the pressure born by the first support part 20, the second support part 30 and the third support part 40 is basically consistent, and the service life of the carrier is prolonged.
Further, through the first supporting part 20, the second supporting part 30 and the third supporting part 40 of the delta shape, the bottom of the boat body 10 is supported on the inner wall of the quartz tube 50 through three points, no suspended supporting part exists, the three-point support is more stable, and even if the boat is subjected to external vibration, the carrier is not easy to shake, so that the stability of silicon wafer processing is ensured.
In some embodiments of the present application, the diffusion furnace further comprises a paddle 51, the paddle 51 is inserted into the first support slot 14 and the second support slot 16 of the carrier, the bottom of the first support slot 14 has a first support surface 15 for abutting against the paddle 51, the bottom of the second support slot 16 has a second support surface 17 for abutting against the paddle 51, and when the paddle 51 is inserted into the first support slot 14 and the second support slot 16, the first support surface 15 and the second support surface 17 abut against the paddle 51, so that the paddle 51 can lift the carrier through the first support surface 15 and the second support surface 17 to drive the carrier to extend into the interior of the quartz tube 50 together through the paddle 51, thereby placing the carrier into the quartz tube 50.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (10)
1. A substrate carrier, the carrier comprising:
a boat body (10);
a first support part (20) mounted on one end of the boat body (10) in a first direction (X);
a second support part (30) mounted on the same end of the boat body (10) in the first direction (X) as the first support part (20), the second support part (30) being arranged at intervals along a second direction (Y) intersecting the first direction (X) with the first support part (20);
and a third support portion (40) mounted on the other end of the boat body (10) in the first direction (X), and in the second direction (Y), the third support portion (40) being located between the first support portion (20) and the second support portion (30).
2. The carrier according to claim 1, wherein the first support portion (20) has a first contact surface (21) for abutting against an inner wall of a quartz tube (50), the second support portion (30) has a second contact surface (31) for abutting against an inner wall of the quartz tube (50), and the third support portion (40) has a third contact surface (41) for abutting against an inner wall of the quartz tube (50).
3. The carrier according to claim 2, wherein at least one of the first contact surface (21), the second contact surface (31) and the third contact surface (41) is a cambered surface.
4. A carrier according to claim 3, characterized in that the arc of the arc surface coincides with the arc of the inner wall of the quartz tube (50).
5. The carrier according to claim 1, wherein the boat body (10) comprises a first end plate (11), a second end plate (12) and two side plates (13), the first end plate (11) and the second end plate (12) are arranged at intervals along the first direction (X), two ends of each side plate (13) are respectively connected with the first end plate (11) and the second end plate (12), and two side plates (13) are arranged at intervals along the second direction (Y);
the first end plate (11) is provided with the first supporting portion (20) and the second supporting portion (30), and the second end plate (12) is provided with the third supporting portion (40).
6. The carrier according to claim 5, wherein the first end plate (11) is provided with a first support groove (14), and the first support groove (14) is located between the first support portion (20) and the second support portion (30).
7. The carrier according to claim 5, wherein the boat body (10) further comprises a partition plate (18), two ends of the partition plate (18) are respectively connected with the two side plates (13) and are located between the first end plate (11) and the second end plate (12), and a second supporting groove (16) is formed in the partition plate (18).
8. The vehicle according to claim 7, characterized in that the spacer (18) is arranged close to the second end plate (12).
9. A diffusion furnace comprising a quartz tube (50) and a carrier according to any of claims 1-8, wherein the first support (20), the second support (30) and the third support (40) are all in abutment with the inner wall of the quartz tube (50).
10. The diffusion furnace according to claim 9, further comprising a paddle rod (51), the paddle rod (51) being threaded through the first support slot (14) and the second support slot (16) of the carrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311397417.1A CN117133693B (en) | 2023-10-26 | 2023-10-26 | Substrate carrier and coating equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311397417.1A CN117133693B (en) | 2023-10-26 | 2023-10-26 | Substrate carrier and coating equipment |
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| CN117133693A true CN117133693A (en) | 2023-11-28 |
| CN117133693B CN117133693B (en) | 2024-01-30 |
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| CN202311397417.1A Active CN117133693B (en) | 2023-10-26 | 2023-10-26 | Substrate carrier and coating equipment |
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| JPH07307303A (en) * | 1994-05-10 | 1995-11-21 | Sony Corp | Jig for correction of parallelism of fork |
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| Publication number | Publication date |
|---|---|
| CN117133693B (en) | 2024-01-30 |
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