CN117127047A - Contact line preparation method based on hot-pressed sintered alloy - Google Patents
Contact line preparation method based on hot-pressed sintered alloy Download PDFInfo
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- CN117127047A CN117127047A CN202311394290.8A CN202311394290A CN117127047A CN 117127047 A CN117127047 A CN 117127047A CN 202311394290 A CN202311394290 A CN 202311394290A CN 117127047 A CN117127047 A CN 117127047A
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- 239000000956 alloy Substances 0.000 title claims abstract description 72
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 68
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000005245 sintering Methods 0.000 claims abstract description 103
- 239000000463 material Substances 0.000 claims abstract description 71
- 239000002131 composite material Substances 0.000 claims abstract description 66
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000011863 silicon-based powder Substances 0.000 claims abstract description 61
- TUMAFAGZPAYNRN-UHFFFAOYSA-N [Cu].[Ni].[Cd] Chemical compound [Cu].[Ni].[Cd] TUMAFAGZPAYNRN-UHFFFAOYSA-N 0.000 claims abstract description 57
- 229910000990 Ni alloy Inorganic materials 0.000 claims abstract description 54
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 48
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 46
- 239000001301 oxygen Substances 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 29
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims abstract description 29
- -1 copper-cadmium-nickel-silicon Chemical compound 0.000 claims abstract description 23
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 claims abstract description 23
- 238000002347 injection Methods 0.000 claims abstract description 21
- 239000007924 injection Substances 0.000 claims abstract description 21
- 230000002708 enhancing effect Effects 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 15
- 238000000227 grinding Methods 0.000 claims description 67
- 239000000843 powder Substances 0.000 claims description 50
- 239000000203 mixture Substances 0.000 claims description 46
- 230000001965 increasing effect Effects 0.000 claims description 34
- 229910002804 graphite Inorganic materials 0.000 claims description 29
- 239000010439 graphite Substances 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 25
- 238000002156 mixing Methods 0.000 claims description 21
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 19
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 19
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 19
- 238000007731 hot pressing Methods 0.000 claims description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 17
- 229910052709 silver Inorganic materials 0.000 claims description 17
- 239000004332 silver Substances 0.000 claims description 17
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 16
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 16
- 239000002041 carbon nanotube Substances 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 15
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 14
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 12
- 238000005242 forging Methods 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 10
- 230000032683 aging Effects 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- 239000006104 solid solution Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 239000000243 solution Substances 0.000 claims description 3
- 238000003723 Smelting Methods 0.000 abstract description 4
- 229910052799 carbon Inorganic materials 0.000 abstract description 3
- 238000010420 art technique Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
- B22F5/12—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of wires
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/10—Alloys containing non-metals
- C22C1/1036—Alloys containing non-metals starting from a melt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0005—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with at least one oxide and at least one of carbides, nitrides, borides or silicides as the main non-metallic constituents
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
Abstract
The invention relates to the technical field of contact wires, and particularly discloses a contact wire preparation method based on hot-pressed sintered alloy, which comprises the following raw materials in parts by weight: 85-95% of copper powder, 0.5-1% of cadmium powder, 1-2% of nickel powder, 0.5-2.5% of silicon powder, and the balance of composite conductivity enhancing material. The method comprises the steps of smelting a composite conductivity-increasing material bag and copper-cadmium-nickel, improving the conductivity of the copper-cadmium-nickel alloy, reducing the friction of the alloy, reducing the carbon content in the composite conductivity-increasing material by using oxygen in a top-blown oxygen injection gun head, improving the hardness of the copper-cadmium-nickel alloy fused with the composite conductivity-increasing material, and improving the stretch resistance of the prepared copper-cadmium-nickel-silicon alloy material by fusing the copper-cadmium-nickel alloy with a silicon powder bag in a vacuum hot-press sintering furnace; the contact wire produced by hot press sintering the alloy has high conductivity, high hardness and high tensile resistance, and has low friction properties.
Description
Technical Field
The invention relates to the technical field of contact wires, in particular to a contact wire preparation method based on hot-pressed sintered alloy.
Background
The rigid contact net system is one of the power supply modes commonly adopted by urban rail transit, has the characteristics of simple structure, small installation space and the like, the rigid contact net is a railway electrification system for power supply and current collection, the special contact line is an important component part in the rigid contact net, in addition, the special contact line is manufactured through alloy forging and other processes and is used for meeting the requirements of the rigid contact net on current conduction and mechanical properties under the running condition of a high-speed train, and with the development of scientific technology, the requirements of the urban rail transit system on low cost and high performance are sharply increased, but in the process of preparing the contact line, the conductivity and mechanical properties of the alloy used cannot be ensured at the same time, and the safety and the reliability of the contact net system are affected.
Thus, the invention provides a contact wire preparation method based on hot pressed sintered alloy.
Disclosure of Invention
The invention aims to provide a contact line preparation method based on hot-pressed sintered alloy, which improves the conductivity of copper-cadmium-nickel alloy by smelting a composite conductivity-increasing material bag and copper-cadmium-nickel, reduces the friction of the alloy, simultaneously reduces the carbon content in the composite conductivity-increasing material by using oxygen in a top-blown oxygen spray gun head, improves the hardness of the copper-cadmium-nickel alloy fused with the composite conductivity-increasing material, and improves the stretching resistance of the prepared copper-cadmium-nickel-silicon alloy material by fusing with a silicon powder bag in a vacuum hot-pressed sintering furnace.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the contact wire preparation method based on the hot pressed sintered alloy comprises the following raw materials in parts by weight: 85-95% of copper powder, 0.5-1% of cadmium powder, 1-2% of nickel powder, 0.5-2.5% of silicon powder package and the balance of composite conductivity enhancing material package;
the silicon powder package comprises the components of silicon powder, silicon carbide, zirconium oxide and aluminum oxide, wherein the silicon powder package comprises the raw materials of, by weight, 83-93% of silicon powder, 4-10% of silicon carbide, 2-5% of zirconium oxide and 1-2% of aluminum oxide;
the composite conductivity increasing material package comprises the components of carbon nano tubes, graphite and silver particles, wherein the composite conductivity increasing material package comprises the raw material components in parts by weight, 5-10% of carbon nano tubes, 85-94% of graphite and the balance of silver particles.
Preferably, in the raw material components for preparing the weight percentage of the contact wire, the average particle size of copper powder is 20-30 mu m, the average particle size of cadmium powder is 5-6 mu m, and the average particle size of nickel powder is 10-15 mu m.
Preferably, in the raw material components of the silicon powder packet in weight percentage, the average grain diameter of the silicon powder is 4-5 mu m.
Preferably, in the hot-pressed sintering alloy process of the contact wire, grinding balls made of aluminum oxide and zirconium oxide materials are used for grinding copper powder, cadmium powder and nickel powder, a self-service grinder is used as a container, the grinding rotating speed is 250-300rpm, and the grinding is carried out until the average granularity of the copper powder, the cadmium powder and the nickel powder is 4-5 mu m.
Preferably, in the hot-pressed sintering alloy process of the contact wire, the mixture of the copper powder, the cadmium powder and the nickel powder with reduced granularity after grinding is sintered in a vacuum hot-pressed sintering furnace.
As a further scheme of the invention, in the hot press sintering alloy process of the contact wire, parameters of a vacuum sintering furnace are as follows: at a vacuum level of 30 in the furnace body -3 -15 -3 And (3) taking Pa as a benchmark, pressing the mixture of copper powder, cadmium powder and nickel powder to 5-10MPa, wherein the pressing time is 4-7min, heating and boosting after the pressing time is finished, heating to 950-1000 ℃, heating to 28-30MPa, and maintaining the pressure for 1-1.5h.
As a further scheme of the invention, the contact wire of the hot pressed sintered alloy comprises the following raw materials, by weight, 90-95% of copper powder, 0.5-0.8% of cadmium powder, 1-1.5% of nickel powder, 1-2.5% of silicon powder package and the balance of composite conductivity enhancing material package.
As a further scheme of the invention, the silicon powder comprises 83-93% of silicon powder, 4-10% of silicon carbide, 2-5% of zirconia and 1-2% of alumina in percentage by weight.
As a further scheme of the invention, the composite conductivity increasing material is composed of, by weight, 5-7% of carbon nanotubes, 87-90% of graphite and the balance of silver particles.
Preferably, in the hot pressed sintered alloy process of the contact wire, the specific treatment steps of the hot pressed sintered alloy of the contact wire are as follows:
step S1, grinding the copper-cadmium-nickel alloy subjected to hot-pressing sintering cooling into powder again by using an alloy grinding machine, wherein the grinding speed is 50-100rpm, and the powder granularity is 40-50 mu m;
s2, mixing copper-cadmium-nickel alloy powder with a composite conductivity increasing material bag, putting the mixture into a mold made of aluminum oxide and zirconium oxide, and introducing the mixture into a non-vacuum sintering furnace;
s3, arranging a top-blown oxygen injection gun head in the non-vacuum hot sintering furnace, wherein the oxygen flow is 20000-21000Nm in the parameter setting of the top-blown oxygen injection gun head 3 And/h, the oxygen pressure is 0.7-1MPa, and the inclination angle of the spray hole is 10-15 degrees;
s4, after sintering in a non-vacuum thermal sintering furnace for 1-2 hours, using a hydraulic forging hammer machine to forge a hammer for 10-20 minutes, and removing oxidized residues on the surface of the copper-cadmium-nickel alloy containing the composite conductivity enhancing material;
and S5, grinding the copper-cadmium-nickel alloy containing the composite conductivity-increasing material into powder by using an alloy grinding machine again, wherein the grinding speed is 50-80rpm, the granularity is 50-60 mu m, mixing the silicon powder package and the powder, placing the mixture into a graphite mold, introducing the graphite mold into a vacuum sintering furnace, and sintering the mixture by using the parameters of the vacuum sintering furnace in the step S1 to prepare the copper-cadmium-nickel-silicon alloy blank.
As a further scheme of the invention, in the processing step S5 of hot-pressing and sintering the alloy by the antenna, the manufactured copper-cadmium-nickel-silicon alloy blank is subjected to heat treatment, and the specific steps are as follows:
step Z1, carrying out solid solution treatment on a copper-cadmium-nickel-silicon alloy blank in a heating furnace, wherein the solid solution treatment temperature is 850-950 ℃, and the temperature is kept for 5-10min;
step Z2, aging treatment is carried out on the copper-cadmium-nickel-silicon alloy blank subjected to solution treatment, wherein the aging treatment temperature is 400-500 ℃, and the treatment time is 12-24 hours;
and step Z3, after aging treatment, introducing the material into a hot-pressed sintering furnace again, and performing rolling deformation treatment at 950-1000 ℃.
The beneficial technical effects of the invention are as follows: the composite conductivity enhancing material bag and the copper-cadmium-nickel are used for smelting, so that the conductivity of the copper-cadmium-nickel alloy is improved, the friction of the alloy is reduced, meanwhile, the oxygen in the top-blown oxygen spray gun head is used for reducing the carbon content in the composite conductivity enhancing material, the hardness of the copper-cadmium-nickel alloy fused with the composite conductivity enhancing material is improved, and the copper-cadmium-nickel-silicon alloy material is fused with the silicon powder bag in a vacuum hot-pressing sintering furnace, so that the tensile resistance of the manufactured copper-cadmium-nickel-silicon alloy material is improved, and therefore, the contact wire manufactured by hot-pressing sintering the alloy has high conductivity, high hardness and high tensile resistance, and meanwhile, the contact wire also has low friction performance.
None of the involved parts of the method are the same as or can be implemented using prior art techniques.
Detailed Description
The principles and features of the present invention are described below in connection with examples, which are set forth only to illustrate the present invention and not to limit the scope of the invention; all other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The contact wire preparation method based on the hot pressed sintered alloy comprises the following raw materials in parts by weight: 85-95% of copper powder, 0.5-1% of cadmium powder, 1-2% of nickel powder, 0.5-2.5% of silicon powder, and the balance of composite conductivity enhancing material.
The silicon powder package comprises, by weight, 83-93% of silicon powder, 4-10% of silicon carbide, 2-5% of zirconium oxide and 1-2% of aluminum oxide.
The composite conductivity increasing material package comprises the components of carbon nano tubes, graphite and silver particles, wherein the composite conductivity increasing material package comprises the raw material components in parts by weight, 5-10% of carbon nano tubes, 85-94% of graphite and the balance of silver particles.
The average grain diameter of copper powder is 20-30 mu m, the average grain diameter of cadmium powder is 5-6 mu m, the average grain diameter of nickel powder is 10-15 mu m, and the average grain diameter of silicon powder is 4-5 mu m.
The copper powder, the cadmium powder and the nickel powder are ground by using grinding balls made of aluminum oxide and zirconium oxide materials, a self-help grinder is used as a container, the grinding rotating speed is 250-300rpm, and the average granularity of the copper powder, the cadmium powder and the nickel powder is 4-5 mu m.
And sintering the mixture of the copper powder, the cadmium powder and the nickel powder with the particle size reduced after grinding in a vacuum hot-pressing sintering furnace.
The parameters for the vacuum sintering furnace are as follows: at a vacuum level of 30 in the furnace body -3 -15 -3 And (3) taking Pa as a benchmark, pressing the mixture of copper powder, cadmium powder and nickel powder to 5-10MPa, wherein the pressing time is 4-7min, heating and boosting after the pressing time is finished, heating to 950-1000 ℃, heating to 28-30MPa, and maintaining the pressure for 1-1.5h.
The hot pressed sintered alloy comprises 90-95% copper powder, 0.5-0.8% cadmium powder, 1-1.5% nickel powder, 1-2.5% silicon powder, and the balance composite conductivity enhancing material.
The silicon powder comprises, by weight, 83-93% of silicon powder, 4-10% of silicon carbide, 2-5% of zirconia and 1-2% of alumina.
The composite conductive material is composed of (by weight) carbon nanotubes 5-7%, graphite 87-90%, and silver particles in balance.
In the hot-pressed sintered alloy process of the contact wire, the specific contact wire hot-pressed sintered alloy comprises the following treatment steps:
step S1, grinding the copper-cadmium-nickel alloy subjected to hot-pressing sintering cooling into powder again by using an alloy grinding machine, wherein the grinding speed is 50-100rpm, and the powder granularity is 40-50 mu m;
s2, mixing copper-cadmium-nickel alloy powder with a composite conductivity increasing material bag, putting the mixture into a mold made of aluminum oxide and zirconium oxide, and introducing the mixture into a non-vacuum sintering furnace;
s3, arranging a top-blown oxygen injection gun head in the non-vacuum hot sintering furnace, wherein the oxygen flow is 20000-21000Nm in the parameter setting of the top-blown oxygen injection gun head 3 And/h, oxygen pressure is 0.7-1MPa, and spray hole is inclinedThe angle is 10-15 degrees;
s4, after sintering in a non-vacuum thermal sintering furnace for 1-2 hours, using a hydraulic forging hammer machine to forge a hammer for 10-20 minutes, and removing oxidized residues on the surface of the copper-cadmium-nickel alloy containing the composite conductivity enhancing material;
and S5, grinding the copper-cadmium-nickel alloy containing the composite conductivity-increasing material into powder by using an alloy grinding machine again, wherein the grinding speed is 50-80rpm, the granularity is 50-60 mu m, mixing the silicon powder package and the powder, placing the mixture into a graphite mold, introducing the graphite mold into a vacuum sintering furnace, and sintering the mixture by using the parameters of the vacuum sintering furnace in the step S1 to prepare the copper-cadmium-nickel-silicon alloy blank.
In the processing step S5 of hot-pressing and sintering the alloy by the antenna, the prepared copper-cadmium-nickel-silicon alloy blank is subjected to heat treatment, and the specific steps are as follows:
step Z1, carrying out solid solution treatment on a copper-cadmium-nickel-silicon alloy blank in a heating furnace, wherein the solid solution treatment temperature is 850-950 ℃, and the temperature is kept for 5-10min;
step Z2, aging treatment is carried out on the copper-cadmium-nickel-silicon alloy blank subjected to solution treatment, wherein the aging treatment temperature is 400-500 ℃, and the treatment time is 12-24 hours;
and step Z3, after aging treatment, introducing the material into a hot-pressed sintering furnace again, and performing rolling deformation treatment at 950-1000 ℃.
Preparation example
And (3) manufacturing a silicon powder bag, namely mixing silicon powder, silicon carbide, zirconium oxide and aluminum oxide, smelting by using a vacuum hot-pressing sintering furnace, and grinding and crushing by using a grinder to prepare the silicon powder bag.
The composite conductivity increasing material package comprises the components of carbon nano tubes, graphite and silver particles, wherein the carbon nano tubes, the graphite and the silver particles are mixed and smelted in a vacuum hot-pressing sintering furnace to prepare the composite conductivity increasing material.
In sample 1, 85% of copper powder, 0.5% of cadmium powder, 1% of nickel powder, 0.5% of silicon powder pack, the balance of composite conductivity increasing material pack, wherein the silicon powder pack comprises, by weight, 93% of silicon powder, 4% of silicon carbide, 2% of zirconia and 1% of alumina, and the composite conductivity increasing material pack comprises, by weight, 5% of carbon nanotubes, 85% of graphite and the balance of silver particles.
The specific contact wire hot-pressing sintered alloy comprises the following treatment steps:
1. the copper-cadmium-nickel alloy after hot-pressed sintering cooling is ground into powder again by an alloy grinding machine, the grinding speed is 75rpm, and the powder granularity is 40 mu m;
2. mixing copper-cadmium-nickel alloy powder with a composite conductivity increasing material bag, putting the mixture into a mold made of aluminum oxide and zirconium oxide, and introducing the mold into a non-vacuum sintering furnace;
3. in the non-vacuum thermal sintering furnace, a top-blown oxygen injection gun head is arranged, and in the parameter setting of the top-blown oxygen injection gun head, the oxygen flow is 20000Nm 3 And/h, the oxygen pressure is 0.7MPa, and the inclination angle of the spray hole is 12 degrees;
4. after sintering for 1h in a non-vacuum thermal sintering furnace, using a hydraulic forging hammer machine to forge the copper-cadmium-nickel alloy for 20min, and removing oxidized residues on the surface of the copper-cadmium-nickel alloy containing the composite conductivity enhancing material;
5. and (3) grinding the copper-cadmium-nickel alloy containing the composite conductivity increasing material into powder by using an alloy grinding machine, wherein the grinding speed is 80rpm, the granularity is 60 mu m, mixing a silicon powder bag with the powder, placing the mixture in a graphite mold, introducing the mixture into a vacuum sintering furnace, and sintering the mixture by using parameters of the vacuum sintering furnace in the step S1 to prepare the copper-cadmium-nickel-silicon alloy blank.
In sample 2, 87% of copper powder, 0.7% of cadmium powder, 1.2% of nickel powder, 0.7% of silicon powder pack and the balance of composite conductivity increasing material pack, wherein the silicon powder pack comprises, by weight, 92% of silicon powder, 4.6% of silicon carbide, 2.2% of zirconia, 1.2% of alumina, and the balance of silver particles, the composite conductivity increasing material pack comprises, by weight, 7% of carbon nanotubes, 86% of graphite and the balance of silver particles.
The specific contact wire hot-pressing sintered alloy comprises the following treatment steps:
1. the copper-cadmium-nickel alloy after hot-pressed sintering cooling is ground into powder again by an alloy grinding machine, the grinding speed is 75rpm, and the powder granularity is 40 mu m;
2. mixing copper-cadmium-nickel alloy powder with a composite conductivity increasing material bag, putting the mixture into a mold made of aluminum oxide and zirconium oxide, and introducing the mold into a non-vacuum sintering furnace;
3. in the non-vacuum thermal sintering furnace, a top-blown oxygen injection gun head is arranged, and in the parameter setting of the top-blown oxygen injection gun head, the oxygen flow is 20000Nm 3 And/h, the oxygen pressure is 0.7MPa, and the inclination angle of the spray hole is 12 degrees;
4. after sintering for 1h in a non-vacuum thermal sintering furnace, using a hydraulic forging hammer machine to forge the copper-cadmium-nickel alloy for 20min, and removing oxidized residues on the surface of the copper-cadmium-nickel alloy containing the composite conductivity enhancing material;
5. and (3) grinding the copper-cadmium-nickel alloy containing the composite conductivity increasing material into powder by using an alloy grinding machine, wherein the grinding speed is 80rpm, the granularity is 60 mu m, mixing a silicon powder bag with the powder, placing the mixture in a graphite mold, introducing the mixture into a vacuum sintering furnace, and sintering the mixture by using parameters of the vacuum sintering furnace in the step S1 to prepare the copper-cadmium-nickel-silicon alloy blank.
In sample 3, 88% of copper powder, 0.7% of cadmium powder, 1.3% of nickel powder, 0.8% of silicon powder pack, the balance of composite conductivity increasing material pack, wherein the silicon powder pack comprises, by weight, 91% of silicon powder, 4.5% of silicon carbide, 2.4% of zirconia, 1.1% of alumina, 8% of carbon nanotubes, 86% of graphite and the balance of silver particles.
The specific contact wire hot-pressing sintered alloy comprises the following treatment steps:
1. the copper-cadmium-nickel alloy after hot-pressed sintering cooling is ground into powder again by an alloy grinding machine, the grinding speed is 75rpm, and the powder granularity is 40 mu m;
2. mixing copper-cadmium-nickel alloy powder with a composite conductivity increasing material bag, putting the mixture into a mold made of aluminum oxide and zirconium oxide, and introducing the mold into a non-vacuum sintering furnace;
3. in the non-vacuum thermal sintering furnace, a top-blown oxygen injection gun head is arranged, and in the parameter setting of the top-blown oxygen injection gun head, the oxygen flow is 20000Nm 3 And/h, the oxygen pressure is 0.7MPa, and the inclination angle of the spray hole is 12 degrees;
4. after sintering for 1h in a non-vacuum thermal sintering furnace, using a hydraulic forging hammer machine to forge the copper-cadmium-nickel alloy for 20min, and removing oxidized residues on the surface of the copper-cadmium-nickel alloy containing the composite conductivity enhancing material;
5. and (3) grinding the copper-cadmium-nickel alloy containing the composite conductivity increasing material into powder by using an alloy grinding machine, wherein the grinding speed is 80rpm, the granularity is 60 mu m, mixing a silicon powder bag with the powder, placing the mixture in a graphite mold, introducing the mixture into a vacuum sintering furnace, and sintering the mixture by using parameters of the vacuum sintering furnace in the step S1 to prepare the copper-cadmium-nickel-silicon alloy blank.
In sample 4, 89% of copper powder, 1% of cadmium powder, 2% of nickel powder, 0.5% of silicon powder pack, the balance of composite conductivity-increasing material pack, wherein the silicon powder pack comprises, by weight, 90% of silicon powder, 6% of silicon carbide, 2% of zirconia and 2% of alumina, and the composite conductivity-increasing material pack comprises, by weight, 6% of carbon nanotubes, 94% of graphite and the balance of silver particles.
The specific contact wire hot-pressing sintered alloy comprises the following treatment steps:
1. the copper-cadmium-nickel alloy after hot-pressed sintering cooling is ground into powder again by an alloy grinding machine, the grinding speed is 75rpm, and the powder granularity is 40 mu m;
2. mixing copper-cadmium-nickel alloy powder with a composite conductivity increasing material bag, putting the mixture into a mold made of aluminum oxide and zirconium oxide, and introducing the mold into a non-vacuum sintering furnace;
3. in the non-vacuum thermal sintering furnace, a top-blown oxygen injection gun head is arranged, and in the parameter setting of the top-blown oxygen injection gun head, the oxygen flow is 20000Nm 3 And/h, the oxygen pressure is 0.7MPa, and the inclination angle of the spray hole is 12 degrees;
4. after sintering for 1h in a non-vacuum thermal sintering furnace, using a hydraulic forging hammer machine to forge the copper-cadmium-nickel alloy for 20min, and removing oxidized residues on the surface of the copper-cadmium-nickel alloy containing the composite conductivity enhancing material;
5. and (3) grinding the copper-cadmium-nickel alloy containing the composite conductivity increasing material into powder by using an alloy grinding machine, wherein the grinding speed is 80rpm, the granularity is 60 mu m, mixing a silicon powder bag with the powder, placing the mixture in a graphite mold, introducing the mixture into a vacuum sintering furnace, and sintering the mixture by using parameters of the vacuum sintering furnace in the step S1 to prepare the copper-cadmium-nickel-silicon alloy blank.
In sample 5, 92% of copper powder, 1% of cadmium powder, 2% of nickel powder, 1.5% of silicon powder pack, the balance of composite conductivity increasing material pack, wherein the silicon powder pack comprises, by weight, 92% of silicon powder, 4.6% of silicon carbide, 2.4% of zirconia, 1% of alumina, the composite conductivity increasing material pack comprises, by weight, 5% of carbon nanotubes, 85% of graphite and the balance of silver particles.
The specific contact wire hot-pressing sintered alloy comprises the following treatment steps:
1. the copper-cadmium-nickel alloy after hot-pressed sintering cooling is ground into powder again by an alloy grinding machine, the grinding speed is 75rpm, and the powder granularity is 40 mu m;
2. mixing copper-cadmium-nickel alloy powder with a composite conductivity increasing material bag, putting the mixture into a mold made of aluminum oxide and zirconium oxide, and introducing the mold into a non-vacuum sintering furnace;
3. in the non-vacuum thermal sintering furnace, a top-blown oxygen injection gun head is arranged, and in the parameter setting of the top-blown oxygen injection gun head, the oxygen flow is 20000Nm 3 And/h, the oxygen pressure is 0.7MPa, and the inclination angle of the spray hole is 12 degrees;
4. after sintering for 1h in a non-vacuum thermal sintering furnace, using a hydraulic forging hammer machine to forge the copper-cadmium-nickel alloy for 20min, and removing oxidized residues on the surface of the copper-cadmium-nickel alloy containing the composite conductivity enhancing material;
5. and (3) grinding the copper-cadmium-nickel alloy containing the composite conductivity increasing material into powder by using an alloy grinding machine, wherein the grinding speed is 80rpm, the granularity is 60 mu m, mixing a silicon powder bag with the powder, placing the mixture in a graphite mold, introducing the mixture into a vacuum sintering furnace, and sintering the mixture by using parameters of the vacuum sintering furnace in the step S1 to prepare the copper-cadmium-nickel-silicon alloy blank.
In sample 6, the copper powder was 95%, the cadmium powder was 1%, the nickel powder was 2%, and the silicon powder pack was 2%.
The specific contact wire hot-pressing sintered alloy comprises the following treatment steps:
1. the copper-cadmium-nickel alloy after hot-pressed sintering cooling is ground into powder again by an alloy grinding machine, the grinding speed is 75rpm, and the powder granularity is 40 mu m;
2. mixing copper-cadmium-nickel alloy powder with a composite conductivity increasing material bag, putting the mixture into a mold made of aluminum oxide and zirconium oxide, and introducing the mold into a non-vacuum sintering furnace;
3. in the non-vacuum thermal sintering furnace, a top-blown oxygen injection gun head is arranged, and in the parameter setting of the top-blown oxygen injection gun head, the oxygen flow is 20000Nm 3 And/h, the oxygen pressure is 0.7MPa, and the inclination angle of the spray hole is 12 degrees;
4. after sintering for 1h in a non-vacuum thermal sintering furnace, using a hydraulic forging hammer machine to forge the copper-cadmium-nickel alloy for 20min, and removing oxidized residues on the surface of the copper-cadmium-nickel alloy containing the composite conductivity enhancing material;
5. and (3) grinding the copper-cadmium-nickel alloy containing the composite conductivity increasing material into powder by using an alloy grinding machine, wherein the grinding speed is 80rpm, the granularity is 60 mu m, mixing a silicon powder bag with the powder, placing the mixture in a graphite mold, introducing the mixture into a vacuum sintering furnace, and sintering the mixture by using parameters of the vacuum sintering furnace in the step S1 to prepare the copper-cadmium-nickel-silicon alloy blank.
In sample 7, the copper powder was 95%, the cadmium powder was 1%, the nickel powder was 2%, and the silicon powder was 2%.
The specific contact wire hot-pressing sintered alloy comprises the following treatment steps:
1. the copper-cadmium-nickel alloy after hot-pressed sintering cooling is ground into powder again by an alloy grinding machine, the grinding speed is 75rpm, and the powder granularity is 40 mu m;
2. mixing copper-cadmium-nickel alloy powder with a composite conductivity increasing material bag, putting the mixture into a mold made of aluminum oxide and zirconium oxide, and introducing the mold into a non-vacuum sintering furnace;
3. in the non-vacuum thermal sintering furnace, a top-blown oxygen injection gun head is arranged, and in the parameter setting of the top-blown oxygen injection gun head, the oxygen flow is 20000Nm 3 And/h, the oxygen pressure is 0.7MPa, and the inclination angle of the spray hole is 12 degrees;
4. after sintering for 1h in a non-vacuum thermal sintering furnace, using a hydraulic forging hammer machine to forge the copper-cadmium-nickel alloy for 20min, and removing oxidized residues on the surface of the copper-cadmium-nickel alloy containing the composite conductivity enhancing material;
5. and (3) grinding the copper-cadmium-nickel alloy containing the composite conductivity increasing material into powder by using an alloy grinding machine, wherein the grinding speed is 80rpm, the granularity is 60 mu m, mixing a silicon powder bag with the powder, placing the mixture in a graphite mold, introducing the mixture into a vacuum sintering furnace, and sintering the mixture by using parameters of the vacuum sintering furnace in the step S1 to prepare the copper-cadmium-nickel-silicon alloy blank.
The tensile strength, conductivity, coefficient of friction and vickers hardness of samples 1-7 were summarized and the specific results are shown in table 1:
TABLE 1 tensile Strength, conductivity, coefficient of friction and Vickers hardness results for samples 1-7
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention.
Claims (9)
1. The contact wire preparation method based on the hot pressed sintered alloy is characterized by comprising the following raw materials in parts by weight: 85-95% of copper powder, 0.5-1% of cadmium powder, 1-2% of nickel powder, 0.5-2.5% of silicon powder package and the balance of composite conductivity enhancing material package;
the silicon powder package comprises the components of silicon powder, silicon carbide, zirconium oxide and aluminum oxide, wherein the silicon powder package comprises the raw materials of, by weight, 83-93% of silicon powder, 4-10% of silicon carbide, 2-5% of zirconium oxide and 1-2% of aluminum oxide; the composite conductivity increasing material package comprises the components of carbon nano tubes, graphite and silver particles, wherein the composite conductivity increasing material package comprises the raw material components in parts by weight, 5-10% of carbon nano tubes, 85-94% of graphite and the balance of silver particles;
the contact wire hot-pressing sintered alloy comprises the following treatment steps:
step S1, grinding the copper-cadmium-nickel alloy subjected to hot-pressing sintering cooling into powder again by using an alloy grinding machine, wherein the grinding speed is 50-100rpm, and the powder granularity is 40-50 mu m;
s2, mixing copper-cadmium-nickel alloy powder with a composite conductivity increasing material bag, putting the mixture into a mold made of aluminum oxide and zirconium oxide, and introducing the mixture into a non-vacuum sintering furnace;
step S3, in the non-vacuum hot sintering furnace, a top-blown oxygen injection gun head is arranged in the non-vacuum hot sintering furnace, and oxygen is blown from the topIn the parameter setting of the air injection gun head, the oxygen flow is 20000-21000Nm 3 And/h, the oxygen pressure is 0.7-1MPa, and the inclination angle of the spray hole is 10-15 degrees;
s4, after sintering in a non-vacuum thermal sintering furnace for 1-2 hours, using a hydraulic forging hammer machine to forge a hammer for 10-20 minutes, and removing oxidized residues on the surface of the copper-cadmium-nickel alloy containing the composite conductivity enhancing material;
and S5, grinding the copper-cadmium-nickel alloy containing the composite conductivity-increasing material into powder by using an alloy grinding machine again, wherein the grinding speed is 50-80rpm, the granularity is 50-60 mu m, mixing the silicon powder package and the powder, placing the mixture into a graphite mold, introducing the graphite mold into a vacuum sintering furnace, and sintering the mixture by using the parameters of the vacuum sintering furnace in the step S1 to prepare the copper-cadmium-nickel-silicon alloy blank.
2. The method for producing a contact wire based on a hot pressed sintered alloy according to claim 1, wherein the average particle size of copper powder is 20 to 30 μm, the average particle size of cadmium powder is 5 to 6 μm, and the average particle size of nickel powder is 10 to 15 μm in the raw material components for producing the weight percentage of the contact wire.
3. The method for preparing the contact wire based on the hot pressed sintered alloy according to claim 2, wherein the silicon powder comprises the raw material components in percentage by weight, and the average grain diameter of the silicon powder is 4-5 μm.
4. The method for preparing the contact wire based on the hot pressed sintered alloy according to claim 1, wherein in the hot pressed sintered alloy process of the contact wire, grinding balls made of aluminum oxide and zirconium oxide materials are used for grinding copper powder, cadmium powder and nickel powder, a self-service grinder is used as a container, the grinding rotating speed is 250-300rpm, and the grinding is carried out until the average granularity of the copper powder, the cadmium powder and the nickel powder is 4-5 mu m.
5. The method for producing a contact wire based on a hot pressed sintered alloy according to claim 1, wherein in the hot pressed sintered alloy process of the contact wire, a mixture of copper powder, cadmium powder and nickel powder with reduced particle size after grinding is sintered in a vacuum hot pressed sintering furnace.
6. The method for preparing a contact wire based on hot pressed sintered alloy according to claim 5, wherein parameters of a vacuum sintering furnace used in the hot pressed sintered alloy process of the contact wire are as follows: at a vacuum level of 30 in the furnace body -3 -15 - 3 And (3) taking Pa as a benchmark, pressing the mixture of copper powder, cadmium powder and nickel powder to 5-10MPa, wherein the pressing time is 4-7min, heating and boosting after the pressing time is over, heating to 950-1000 ℃, heating to 28-30MPa, and maintaining the pressure for 1-1.5h.
7. The method for preparing the contact wire based on the hot pressed sintered alloy according to claim 1, wherein the contact wire of the hot pressed sintered alloy comprises the following raw materials in parts by weight, 90-95% of copper powder, 0.5-0.8% of cadmium powder, 1-1.5% of nickel powder, 1-2.5% of silicon powder package and the balance of composite conductivity enhancing material package.
8. The method for preparing the contact wire based on the hot pressed sintered alloy according to claim 7, wherein the silicon powder pack comprises, by weight, 83-93% of silicon powder, 4-10% of silicon carbide, 2-5% of zirconia, 1-2% of alumina, 5-7% of carbon nanotubes, 87-90% of graphite and the balance of silver particles in the composite conductivity-increasing material pack.
9. The method for preparing a contact wire based on hot pressed sintered alloy according to claim 1, wherein in the processing step S5 of the contact wire hot pressed sintered alloy, the prepared copper-cadmium-nickel-silicon alloy blank is subjected to heat treatment, and the specific steps are as follows:
step Z1, carrying out solid solution treatment on a copper-cadmium-nickel-silicon alloy blank in a heating furnace, wherein the solid solution treatment temperature is 850-950 ℃, and the temperature is kept for 5-10min;
step Z2, aging treatment is carried out on the copper-cadmium-nickel-silicon alloy blank subjected to solution treatment, wherein the aging treatment temperature is 400-500 ℃, and the treatment time is 12-24 hours;
and step Z3, after aging treatment, introducing the material into a hot-pressed sintering furnace again, and performing rolling deformation treatment at 950-1000 ℃.
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