CN114635052B - TiCN-doped wear-resistant tungsten copper composite material and preparation method thereof - Google Patents

TiCN-doped wear-resistant tungsten copper composite material and preparation method thereof Download PDF

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CN114635052B
CN114635052B CN202011486871.0A CN202011486871A CN114635052B CN 114635052 B CN114635052 B CN 114635052B CN 202011486871 A CN202011486871 A CN 202011486871A CN 114635052 B CN114635052 B CN 114635052B
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powder
tungsten
copper
ticn
doped
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CN114635052A (en
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黄友庭
查元飞
李巍
陈文哲
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Fujian University of Technology
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Fujian University of Technology
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/05Mixtures of metal powder with non-metallic powder
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • C22C1/045Alloys based on refractory metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C27/00Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04Alloys based on tungsten or molybdenum
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C32/00Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
    • C22C32/0089Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with other, not previously mentioned inorganic compounds as the main non-metallic constituent, e.g. sulfides, glass

Abstract

The invention discloses a preparation method of a TiCN-doped wear-resistant tungsten copper composite material, which comprises the steps of respectively weighing tungsten powder, copper-plated tungsten powder, nickel powder and TiCN powder according to a proportion, then filling the tungsten powder, the copper-plated tungsten powder, the nickel powder and the TiCN powder into a sealing tank for mechanical mixing to obtain composite powder with uniform components, filling the composite powder into a mould for hot-pressing sintering, and taking out the mould after cooling to room temperature to obtain the TiCN-doped wear-resistant tungsten copper composite material. According to the invention, tungsten powder, nickel powder, copper powder and TiCN-doped powder are adopted to prepare the tungsten-copper alloy by hot-press sintering, and TiCN hard particles are dispersed in a copper phase after sintering, so that the wear resistance of the tungsten-copper alloy can be remarkably improved, and the service life of the tungsten-copper alloy is prolonged.

Description

TiCN-doped wear-resistant tungsten copper composite material and preparation method thereof
Technical Field
The invention relates to a TiCN-doped wear-resistant tungsten copper composite material and a preparation method thereof, and belongs to the technical field of metal composite materials.
Background
The tungsten-copper composite material is mainly W, cu and is an insoluble high-specific-gravity pseudoalloy. Because it has the outstanding properties of both W and Cu, such as: high temperature resistance, arc ablation resistance, free cutting, high strength, high specific gravity, good electric and thermal conductivity, and sweat cooling characteristics, and is used as electric contact materials, electronic packaging materials and heat sink materials in a large number. The method has wide application in the fields of metallurgy, military, aerospace and other industries (guide rail materials of electromagnetic cannons, nose cones of rocket engine nozzles and the like) and the like. In recent years, tungsten copper composite materials have been increasingly used in other fields due to their special properties. Such as electrical materials on high-speed rails, guide materials, guide rails for television lines, etc. The guide piece has a special working environment, and the working condition that the temperature reaches thousands of DEG C puts high requirements on the high temperature resistance of the material. On the other hand, the guide member and the binding member move relatively when in operation, so that the guide member needs to have a lower friction coefficient and higher wear resistance. However, most of the research on tungsten-copper alloy at present is focused on mechanical properties.
The traditional tungsten-copper alloy has poor wear resistance, and has short service life when used as a wear-resistant piece, and influences the service condition of a contact piece. According to the national standard, the hardness of the CuW80 alloy is 220HB, and the compactness is 95.7%. If the defect of the tungsten-copper alloy can be overcome by utilizing the hard third phase, the wear resistance of the tungsten-copper alloy is improved, and the tungsten-copper alloy is expected to be applied to the service in certain extreme environments.
The tungsten-copper alloy is a convenient and effective way to add the third phase if the improvement effect on the performance is not obvious by the preparation process because of the special structure of the tungsten-copper alloy and the factors such as the obvious reduction of the strength of the tungsten matrix along with the temperature rise.
Disclosure of Invention
The invention provides a tungsten-copper composite material with high wear resistance and a preparation method thereof in order to further improve the wear resistance of the tungsten-copper composite material. The tungsten-copper composite material improves the wear resistance of tungsten-copper alloy and prolongs the service life, so that the tungsten-copper composite material can be suitable for more occasions.
In order to achieve the above purpose, the following technical scheme is adopted:
the preparation method of the TiCN-doped wear-resistant tungsten copper composite material comprises the following steps:
respectively weighing tungsten powder, copper powder or copper-plated tungsten powder, nickel powder and TiCN powder according to a proportion, and then filling the tungsten powder, the copper-plated tungsten powder, the nickel powder and the TiCN powder into a sealing tank for mechanical mixing to obtain composite powder with uniform components;
and (3) filling the composite powder obtained in the step (1) into a mould for hot-pressing sintering, and taking out the mould after cooling to room temperature to obtain the TiCN-doped wear-resistant tungsten-copper composite material.
Further, the particle sizes of the tungsten powder, the copper powder, the nickel powder and the TiCN powder are respectively as follows: copper powder 10-15 μm, tungsten powder 10-15 μm, nickel powder 10-15 μm, tiCN powder 10-15 μm.
Further, in the step (1), the mass ratio of copper, tungsten, nickel and TiCN is: 20-30:70-80:0.1-1:0.6-2 percent, wherein the copper content of the copper-plated tungsten powder is 2.0-20.0 percent by weight. The invention can prepare tungsten-copper alloy by adopting copper powder and tungsten powder only. The copper-plated tungsten powder can also be used for preparing the alloy, but the copper element content does not necessarily meet the requirement when the copper-plated tungsten powder is used for preparing the alloy, and copper powder is needed to be added for supplementing.
Further, the mechanical mixing in the step (1) is specifically mechanical mixing for 12-20 hours by adopting a planetary ball mill at a rotating speed of 100-150 r/min.
Further, the die in the step (2) is a graphite die with an inner hole phi of 24 mm.
Further, the hot pressing sintering temperature in the step (2) is 1100-1300 ℃, the time is 2 hours, and the pressure is 30-60 Mpa.
Further, hydrogen is introduced in the hot pressing sintering process in the step (2) for protection, so that Cu in the composite material is prevented from volatilizing in vacuum.
The beneficial effects are that: according to the invention, by adding TiCN in a proper proportion during sintering of the tungsten-copper alloy, tiCN hard particles are dispersed in the copper phase after sintering, so that the wear resistance of the tungsten-copper alloy can be remarkably improved, and the service life of the tungsten-copper alloy is prolonged.
Drawings
FIG. 1 is a metallographic structure diagram of TiCN doped tungsten-copper alloy before and after: (a) undoped TiCN, (b) doped TiCN (c) doped TiCN (copper-plated tungsten powder).
Detailed Description
Example 1
A W80Cu20 alloy doped with 1.5wt% TiCN was prepared.
And step 1, weighing the powder.
The mass ratio of the copper powder to the tungsten powder to the nickel powder to the TiCN powder is 20:80:0.5:1.5 weighing. The particle size of the selected powder is: copper powder 10-15 μm, tungsten powder 10-15 μm, nickel powder 10-15 μm, tiCN powder 10-15 μm.
And 2, mechanically mixing powder.
And mixing all the powder with a planetary ball mill for 10 hours at a rotating speed of 150r/min to obtain uniformly mixed composite powder.
And step 3, hot-pressing sintering.
Then 40g of the powder was charged into a graphite mold having an inner hole of 24mm, and sintered in a hot press furnace. The sintering temperature is 1200 ℃, the sintering pressure is 40Mpa, the heat preservation time is 2h, and hydrogen is introduced for protection in the heat preservation stage. And (5) after the furnace temperature is reduced to the room temperature, taking out the die to obtain the TiCN doped tungsten copper composite material.
Example 2
A W80Cu20 alloy doped with 1.5wt% TiCN was prepared (copper-plated tungsten powder was used).
And step 1, weighing the powder.
Copper-plated tungsten powder having a Cu content of 15wt.% was used. The particle size of the selected powder is as follows: copper powder 10-15 μm, nickel powder 10-15 μm and TiCN powder 10-15 μm. According to 3.9:94.1:0.5:1.5 The mass ratio of (copper powder, copper-clad tungsten powder, nickel powder and TiCN powder) is measured.
And 2, mechanically mixing powder.
And mixing all the powder with a planetary ball mill for 10 hours at a rotating speed of 150r/min to obtain uniformly mixed composite powder.
And step 3, hot-pressing sintering.
Then 40g of the powder was charged into a graphite mold having an inner hole of 24mm, and sintered in a hot press furnace. The sintering temperature is 1200 ℃, the sintering pressure is 40Mpa, the heat preservation time is 2h, and hydrogen is introduced for protection in the heat preservation stage. And (5) after the furnace temperature is reduced to the room temperature, taking out the die to obtain the TiCN doped tungsten copper composite material.
The traditional tungsten-copper alloy has poor wear resistance, and has shorter service life when used as a wear-resistant piece, and influences the service condition of a contact piece. The TiCN-doped tungsten-copper alloy is prepared, and the wear resistance of the tungsten-copper alloy is improved.
TABLE 1 comparison of TiCN doped front-rear W80Cu20 alloy Performance
Fig. 1 is a microstructure photograph of a tungsten-copper alloy before and after TiCN doping, and it can be seen that the tungsten-copper alloy after TiCN doping has a more compact microstructure. The normal temperature friction and wear test is carried out on the tungsten-copper alloy before and after TiCN doping under the condition of 10N loading, 4.4mm radius and 30min friction time, and the performance pair is shown in a table 1. It can be seen that the hardness, the compactness and the wear resistance of the TiCN doped tungsten-copper alloy are all improved. Compared with the tungsten-copper alloy without TiCN, the tungsten-copper alloy doped with TiCN and prepared by copper plating tungsten powder has 28 percent of hardness, 1.7 percent of compactness, 46 percent of wear rate reduction and obvious improvement of wear resistance and antifriction performance. In addition, the copper-plated tungsten powder can improve the alloy performance, because the copper-plated tungsten powder reduces direct contact among W particles during sintering, the distribution uniformity of the W particles is increased, the agglomeration and arch bridge effect of the W particles are avoided, high density can be obtained, and the hardness and the wear resistance are improved.
The foregoing description is only illustrative of the preferred embodiments of the present invention, and all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (4)

1. A TiCN doped wear-resistant tungsten copper composite material is characterized in that: the preparation method of the composite material comprises the following steps:
(1) Weighing is performed according to one of the following conditions: a. the mass ratio of the copper powder to the tungsten powder to the nickel powder to the TiCN powder is 20:80:0.5:1.5 weighing the powder; b. copper-plated tungsten powder with the Cu content of 15wt.% is used, and the mass ratio of copper powder to copper-plated tungsten powder to nickel powder to TiCN powder is 3.9:94.1:0.5:1.5 weighing the powder; then placing the mixture into a sealed tank for mechanical mixing to obtain composite powder with uniform components;
(2) Filling the composite powder obtained in the step (1) into a mould for hot-pressing sintering, and taking out the mould after cooling to room temperature to obtain the TiCN-doped wear-resistant tungsten-copper composite material;
the hot-pressed sintering temperature in the step (2) is 1100-1300 ℃, the time is 2h, and the pressure is 30-60 MPa; and (3) introducing hydrogen for protection in the hot-pressing sintering process in the step (2).
2. The TiCN doped wear resistant tungsten copper composite according to claim 1, wherein: the particle sizes of the tungsten powder, the copper powder, the nickel powder and the TiCN powder are respectively as follows: copper powder 10-15 μm, tungsten powder 10-15 μm, nickel powder 10-15 μm, tiCN powder 10-15 μm.
3. The TiCN doped wear resistant tungsten copper composite according to claim 1, wherein: the mechanical mixing in the step (1) is specifically mechanical mixing for 10 hours at a rotating speed of 150r/min by adopting a planetary ball mill.
4. The TiCN doped wear resistant tungsten copper composite according to claim 1, wherein: and (3) the die in the step (2) is a graphite die with an inner hole phi of 24 mm.
CN202011486871.0A 2020-12-16 2020-12-16 TiCN-doped wear-resistant tungsten copper composite material and preparation method thereof Active CN114635052B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB744145A (en) * 1952-03-05 1956-02-01 Richard Schier Electrical contacts and process for making same
CN101515513A (en) * 2009-03-30 2009-08-26 西安理工大学 Method for preparing TiC/CuW alloy contact material
CN101667498A (en) * 2009-10-13 2010-03-10 昆明理工大学 Preparation method of W-Cu electrical contact
CN103589884A (en) * 2013-11-25 2014-02-19 武汉理工大学 Low-temperature preparation method of high-performance tungsten copper composite material
CN111763843A (en) * 2020-08-24 2020-10-13 合肥工业大学 Preparation method of multi-element doped high-specific gravity tungsten copper nickel alloy and prepared high-specific gravity tungsten copper nickel alloy

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB744145A (en) * 1952-03-05 1956-02-01 Richard Schier Electrical contacts and process for making same
CN101515513A (en) * 2009-03-30 2009-08-26 西安理工大学 Method for preparing TiC/CuW alloy contact material
CN101667498A (en) * 2009-10-13 2010-03-10 昆明理工大学 Preparation method of W-Cu electrical contact
CN103589884A (en) * 2013-11-25 2014-02-19 武汉理工大学 Low-temperature preparation method of high-performance tungsten copper composite material
CN111763843A (en) * 2020-08-24 2020-10-13 合肥工业大学 Preparation method of multi-element doped high-specific gravity tungsten copper nickel alloy and prepared high-specific gravity tungsten copper nickel alloy

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