CN117111707A - Heat radiation equipment capable of improving internal airflow emission of computer - Google Patents
Heat radiation equipment capable of improving internal airflow emission of computer Download PDFInfo
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- CN117111707A CN117111707A CN202311180059.9A CN202311180059A CN117111707A CN 117111707 A CN117111707 A CN 117111707A CN 202311180059 A CN202311180059 A CN 202311180059A CN 117111707 A CN117111707 A CN 117111707A
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- 230000005855 radiation Effects 0.000 title abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 49
- 238000007664 blowing Methods 0.000 claims abstract description 35
- 230000000694 effects Effects 0.000 claims abstract description 30
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 238000005057 refrigeration Methods 0.000 claims abstract description 16
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims description 94
- 238000001816 cooling Methods 0.000 claims description 25
- 239000004576 sand Substances 0.000 claims description 14
- 238000009434 installation Methods 0.000 claims description 11
- 230000002708 enhancing effect Effects 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 8
- 210000001503 joint Anatomy 0.000 claims description 7
- 238000009423 ventilation Methods 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 3
- 238000013016 damping Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 8
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 230000013011 mating Effects 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
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- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field related to computer accessories and discloses heat dissipation equipment capable of improving the air flow dissipation in a computer, which comprises a heat dissipation host, wherein the heat dissipation host comprises a shell, the shell is provided with a function carrying groove, the side of the function carrying groove is provided with a side air outlet groove, a fan through groove is arranged in an array of the function carrying groove, a heat dissipation fan is fixedly arranged in the fan through groove, a heat dissipation function module is fixedly arranged on the side of the function carrying groove, the heat dissipation function module comprises a semiconductor refrigeration plate, a metal heat conducting rod is arranged on the front side of the semiconductor refrigeration plate in an array, and a metal air deflector is rotatably arranged on the front side part of the metal heat conducting rod corresponding to the fan through groove; according to the heat radiation device capable of improving the air flow exhausting and radiating in the computer, the air flow conversion output function is matched with the internal flow guide structure, and the effects of changing the air flow blowing direction and improving the blowing and radiating range can be achieved through the continuous rotation of the air outlet plate in the air flow blowing process.
Description
Technical Field
The invention relates to the technical field of computer accessories, in particular to heat dissipation equipment capable of improving air flow dissipation in a computer.
Background
Along with development of technology, computer performance is gradually improved along with hardware upgrading, higher computational capacity is realized through the combination of high-performance hardware in the existing computer, and when the performance of the computer is improved due to hardware upgrading, the heating condition in the computer is also improved, and the existing computer heat dissipation is generally realized in a case environment by adopting modes such as air cooling and water cooling in the case, and due to the setting reasons of a main board structure, a display card fan and a carrying structure in the case, the heating problem of a main board body and the connecting ends of all functional components is serious, and the problem that performance is limited even main board or functional hardware burns out due to heat accumulation in the gaps and the connecting ends is easily caused by the fact that gaps are formed between the main board and other functional components due to the fact that conventional heat dissipation structures cannot conduct air flow dissipation.
Disclosure of Invention
The present invention is directed to a heat dissipating device for improving the airflow dissipation in a computer, which overcomes the above-mentioned drawbacks of the prior art.
The invention is realized by the following technical scheme.
The invention discloses heat radiation equipment capable of improving air flow emission in a computer, which comprises a heat radiation host, wherein the heat radiation host comprises a shell, the shell is provided with a function carrying groove, the side of the function carrying groove is provided with a side air outlet groove, an array of the function carrying groove is provided with a fan through groove, a heat radiation fan is fixedly arranged in the fan through groove, a heat radiation function module is fixedly arranged on the side of the function carrying groove, the heat radiation function module comprises a semiconductor refrigeration plate, a metal heat conducting rod is arranged on the front side of the semiconductor refrigeration plate in an array manner, the metal heat conducting rod is arranged in the side air outlet groove in a corresponding manner, a metal air deflector is rotatably arranged on the front side part of the fan through groove, the tail end of the metal heat conducting rod is extended into the side air outlet groove, the front side of the shell is fixedly provided with a front panel, the front panel is internally provided with air outlet cylinders corresponding to the number and the positions of the fan through grooves, the air outlet plate array is internally provided with an oblique air outlet groove, the front panel and the air outlet plate is provided with an air deflector structure, the front panel side panel is provided with an air deflector corresponding to the side air outlet plate surface of the side air outlet plate array is provided with the side air outlet plate and the side air outlet plate is provided with the side air outlet plate surface corresponding to the side air outlet groove.
Further technical scheme, the wind guiding structure is for the array set up in the wind groove side sand grip of air-out board back wall and corresponding array set up in the cooperation sand grip of front panel back wall.
Further technical scheme, wind groove side sand grip is the symmetry divide arrange in slant wind outlet groove both sides, adjacent constitute behind the board wind-guiding groove between the wind groove side sand grip, cooperation sand grip set up in go out the dryer with between the side blowing portion inboard end, cooperation sand grip set up the interval with wind groove side sand grip is unanimous, adjacent constitute the cooperation wind-guiding groove between the cooperation sand grip, behind the board wind-guiding groove with but the butt joint intercommunication between the cooperation wind-guiding groove.
Further technical scheme, side air duct is equipped with to side air duct inboard end, side air duct front side end is equipped with the board bottom air-out groove reaches the face air-out groove, side air duct is close to each cooperation air duct one end is equipped with the intercommunication groove, the intercommunication groove is used for the intercommunication the cooperation air duct reaches side air duct.
Further technical scheme, front panel inner wall embedding fixed mounting has drive assembly, drive assembly carries on the shell including the transmission, be equipped with the transmission groove in the transmission carries on the shell, fixed mounting has the drive motor in the transmission groove top cavity, drive motor output fixed mounting has the transmission shaft, the transmission groove in each go out dryer avris position and be equipped with board side transmission groove, go out be equipped with in the dryer with the transmission logical groove that board side transmission groove links to each other, the transmission shaft in board side transmission inslot fixed mounting has the board to move the helical gear, board side transmission groove with rotate between the transmission logical inslot and install the transmission installation axle, transmission installation axle fixed mounting with board side helical gear of board moving helical gear meshing transmission, transmission installation axle fixed mounting has the transmission rubber tyer, it is equipped with the board body outer loop to go out the aerofoil edge, the board outer loop outer wall is equipped with the transmission rubber tyer, the transmission rubber tyer with the transmission rubber tyer contacts and accessible damping transmission.
Further technical scheme, metal heat conduction rod array is equipped with the latch closure fitting piece, metal aviation baffle inside wall array is equipped with the latch closure, the latch closure rotate set up in corresponding in the latch closure fitting piece and restrict the metal aviation baffle slides about, metal aviation baffle avris outer wall is fixed to be equipped with the cooperation helical gear, the linkage pivot is installed to fan logical inslot rotation, the linkage pivot in corresponding position array fixedly be equipped with the cooperation helical gear of cooperation helical gear kneading with each other, the fixed cooperation gear that is equipped with in linkage pivot bottom, cooperation gear avris position is equipped with the cooperation recess, correspond board side transmission groove downside position is equipped with the linkage groove, linkage groove rear side with cooperation recess front side butt joint intercommunication, the transmission shaft in linkage groove part fixed mounting has the linkage gear, the linkage gear with cooperation gear meshing connection transmission.
According to a further technical scheme, guide communicating grooves are arranged on the side of the fan communicating groove in an array mode, and the metal heat conducting rod is provided with a bending section and penetrates through the tail end of the guide communicating groove to be arranged on the front side of the side air outlet groove.
Further technical scheme, face air-out inslot rotation is equipped with the aviation baffle, symmetrical fixed mounting has the fixed plate about the casing, the symmetry is equipped with screw spare around the fixed plate, screw spare passes through screw and hole structure to be fixed in quick-witted incasement portion, the casing back wall is equipped with the back plate groove, fixed mounting has the back shroud in the back plate inslot, the back shroud in function carries on the groove rear side and is equipped with the net ventilation portion in the position, the board bottom air-out groove with be equipped with the mainboard groove between the face air-out groove.
According to a further technical scheme, the heat dissipation functional module further comprises a circuit board, a control circuit, a power distribution module and a power supply module.
According to the further technical scheme, the shape of the plate bottom air outlet groove and the shape of the plate bottom air outlet groove can be set to be of a convex structure, and the plate bottom air outlet groove can be communicated with an air guide hose or a flat pipe and enables an air outlet of the air guide hose or the flat pipe to be arranged at the bottom of the main plate so as to further improve the blowing heat dissipation effect.
The invention has the beneficial effects that:
the invention can improve the radiating equipment of the internal air flow exhaust of the computer to be equipped with the high-efficient radiating and radiating structure, set up the semiconductor refrigeration board and corresponding to set up the multiunit metal heat conduction rod through the functional module of the heat dissipation, set up the cooling fan in the fan through-slot adjacent to it at the same time, thus make in the course of working of the cooling fan, the semiconductor refrigeration board can realize cooling the cooling fan after introducing the wind by the back side grid ventilation part, blow in the fan through-slot and cooperate with the cooling fan, realize the re-contact cooling to the wind through multiunit metal heat conduction rod, thus blow to main board and functional hardware by multiunit slant air outlet slot of the air outlet plate, realize the high-efficient application semiconductor refrigeration effect reach the effect of greatly reducing the air flow temperature raise the cooling function to the internal assembly;
the heat radiation equipment capable of improving the air flow emission in the computer has the air flow conversion output function, and in the air flow blowing output heat radiation process, the transmission motor is started to drive the transmission shaft to rotate, so that each group of air outlet plates rotate in the air outlet cylinder groove after gear transmission, and the air flow direction is continuously changed and the air flow output effect is carried out by the rotating function effect in the air flow process after the temperature reduction is output in cooperation with the oblique output effect of the oblique air outlet groove and the rotating function of the air outlet plates, thereby improving the air flow blowing effect in the case, enhancing the disturbance effect on the internal hot air flow and further improving the internal air flow emission efficiency;
the heat radiation device capable of improving the air flow emission in the computer is arranged by matching the air flow conversion output function with the internal flow guide structure, the effects of changing the air flow blowing direction and improving the blowing heat radiation range can be realized by continuously rotating the air outlet plate in the air flow blowing process, meanwhile, the linkage gear is driven to rotate in the transmission process of the transmission shaft, so that the metal air guide plates of all groups are driven to rotate along with the transmission of the helical gear structure by matching with the gear, when the oblique air outlet plate rotates to be in a horizontal state with the metal air guide plates, the metal air guide plates are arranged in the right front direction of the metal heat guide rods at the moment to have the largest air outlet shielding area and realize the shielding of the oblique air outlet plate from the inner side, the air guide grooves behind the plate and the matching air guide grooves are in a horizontal communication state at the moment, the front shielding effect and the blocking effect of the oblique air outlet grooves are matched, so that heat dissipation air flow is transmitted to the side air outlet grooves by the rear air guide grooves and is output outwards by the bottom air outlet grooves and the plate air outlet grooves, the gaps among the main board surface, the main board and the hardware, the gaps among the main board and the chassis and the high-speed air pressure blowing are realized, the integral air flow exhausting effect in the chassis is further greatly improved by the aid of the continuous changing air flow blowing effect, the changing shielding effect is realized by the aid of the transmission assembly, the gap blowing cooling is realized, the front blowing air flow shielding effect is reduced, and the metal air guide plate can be in a metal heat conducting rod upper side when the oblique air outlet grooves of the air guide plate are in a vertical state, so that the maximum air flow blowing function is realized on the front side range of the air outlet cylinder.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive effort for a person skilled in the art.
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a schematic overall perspective view of the present invention;
FIG. 2 is a schematic diagram of the invention in a state of installation in a chassis;
FIG. 3 is a schematic elevational view of the present invention;
FIG. 4 is a rear elevational view of the overall structure of the present invention;
fig. 5 is a schematic view of the structure of the heat dissipating host 1 of the present invention in a state in which the front panel 15 is detached;
fig. 6 is a schematic diagram of a split structure of a heat dissipating host 1 according to the present invention;
fig. 7 is a structural rear view of the front panel 15 in fig. 6;
FIG. 8 is an enlarged schematic view of the structure of FIG. 6A;
fig. 9 is an enlarged schematic view of the structure at B in fig. 6.
In the figure: 1. a heat dissipation host; 10. a function mounting groove; 11. a housing; 12. a fixing plate; 13. screw hole pieces; 15. a front panel; 16. a side air blowing part; 17. a main board groove; 18. a plate bottom air outlet groove; 19. a plate surface air outlet groove; 20. a transmission assembly; 21. an air deflector; 22. an air outlet cylinder; 23. an outer ring of the plate body; 25. an air outlet plate; 26. oblique air outlet grooves; 27. a rear plate groove; 28. a back cover plate; 29. a grid ventilation unit; 30. a heat dissipation function module; 31. a heat radiation fan; 32. a fan through groove; 34. a metal heat conducting rod; 35. a metal air deflector; 36. a side air outlet groove; 37. a drive motor; 38. a side air guide groove; 39. a communication groove; 40. a duct side protruding strip; 42. a plate rear air guide groove; 43. matching with the convex strip part; 44. an air guide groove; 45. a transmission carrying shell; 46. a transmission groove; 47. a transmission shaft; 48. a plate side transmission groove; 49. a plate-driven helical gear; 50. plate side bevel gears; 51. a transmission mounting shaft; 52. a transmission through groove; 53. a transmission rubber wheel; 54. a transmission rubber ring; 55. a linkage groove; 56. a linkage gear; 57. a mating groove; 58. a mating gear; 60. a linkage rotating shaft; 61. linkage helical gears; 62. matching with a bevel gear; 63. a snap-fit fitting; 64. a loop fastener; 70. a guide communicating groove; 80. a semiconductor refrigeration plate.
Detailed Description
The invention will now be described in detail with reference to fig. 1-9, wherein for convenience of description, the orientations described below are now defined as follows: the vertical, horizontal, front-rear directions described below are identical to the vertical, horizontal, front-rear directions of the projection relationship of fig. 1 itself.
The heat dissipation device capable of improving air flow dissipation in a computer according to the attached drawings 1-9 comprises a heat dissipation main machine 1, wherein the heat dissipation main machine 1 comprises a machine shell 11, the machine shell 11 is provided with a function carrying groove 10, the side of the function carrying groove 10 is provided with a side air outlet groove 36, an array of the function carrying groove 10 is provided with a fan through groove 32, a heat dissipation fan 31 is fixedly installed in the fan through groove 32, a heat dissipation function module 30 is fixedly installed on the side of the function carrying groove 10, the heat dissipation function module 30 comprises a semiconductor refrigeration plate 80, a metal heat conducting rod 34 is arranged on a front side refrigeration end face array of the semiconductor refrigeration plate 80, the metal heat conducting rod 34 is arranged in a part corresponding to the front side of the fan through groove 32 in a rotating manner, a metal air deflector 35 is arranged at the tail end of the metal heat conducting rod 34 and extends into the side air outlet groove 36, a front side of the machine shell 11 is fixedly provided with a front panel 15, an array of air outlet grooves 22 corresponding to the number and positions of the fan through grooves 32 are arranged in the front panel 15, an array of the air outlet grooves 25 is provided with oblique air outlet grooves 26 in the air outlet grooves 22, an array of the air outlet grooves 25 is provided with air deflector structures, the front panel 15 and the air outlet grooves 25 are provided with air deflector structures, the back surfaces 15 are provided with air deflector structures, the front panel surfaces 15 and the air deflector surfaces are provided with the air deflector surfaces 16, and the air outlet surfaces are provided with the air deflector surfaces corresponding to the side air outlet grooves 16 and the side surfaces 16 and the air outlet grooves 16 are provided with the air outlet grooves 16.
Preferably, the air guiding structure is an array of duct side raised strips 40 provided on the rear wall of the air outlet plate 25 and a corresponding array of mating raised strips 43 provided on the rear wall of the front panel 15.
Preferably, the air duct side raised strips 40 are symmetrically arranged on both sides of the inclined air outlet duct 26, the rear air duct 42 is formed between the adjacent air duct side raised strips 40, the engaging raised strips 43 are arranged between the air outlet duct 22 and the inner side end of the side air blowing portion 16, the engaging raised strips 43 are intermittently consistent with the air duct side raised strips 40, the engaging air duct 44 is formed between the adjacent engaging raised strips 43, and the rear air duct 42 and the engaging air duct 44 can be in butt joint communication.
Preferably, the side air blowing portion 16 is provided with a side air guiding groove 38 at an inner side end thereof, a plate bottom air outlet groove 18 and a plate surface air outlet groove 19 are provided at a front side end of the side air guiding groove 38, and a communicating groove 39 is provided at one end of the side air guiding groove 38 near each of the mating air guiding grooves 44, the communicating groove 39 being used for communicating the mating air guiding groove 44 and the side air guiding groove 38.
Preferably, the inner wall of the front panel 15 is embedded and fixedly provided with the transmission assembly 20, the transmission assembly 20 comprises a transmission carrying shell 45, a transmission groove 46 is arranged in the transmission carrying shell 45, a transmission motor 37 is fixedly arranged in a cavity at the top of the transmission groove 46, a transmission shaft 47 is fixedly arranged at the output end of the transmission motor 37, a plate side transmission groove 48 is arranged at the side position of each air outlet cylinder 22 in the transmission groove 46, a transmission through groove 52 connected with the plate side transmission groove 48 is arranged in the air outlet cylinder 22, a plate-moving bevel gear 49 is fixedly arranged in the plate side transmission groove 48 in the transmission shaft 47, a transmission installation shaft 51 is rotatably arranged between the plate side transmission groove 48 and the transmission through groove 52, a plate-side bevel gear 50 meshed with the plate-moving bevel gear 49 is fixedly arranged on the transmission installation shaft 51, a transmission rubber wheel 53 is fixedly arranged on the transmission installation shaft 51, a plate outer ring 23 is arranged at the edge of the air outlet plate 25, a transmission rubber ring 54 is arranged on the outer wall of the plate outer ring 23, and the transmission rubber ring 54 is contacted with the transmission rubber wheel 53 and can be transmitted through damping.
Preferably, the metal heat conducting rod 34 array is provided with a ring buckle matching piece 63, the inner side wall array of the metal air deflector 35 is provided with a ring buckle 64, the ring buckle 64 is rotatably arranged in the corresponding ring buckle matching piece 63 and limits the metal air deflector 35 to slide left and right, the outer wall of the side of the metal air deflector 35 is fixedly provided with a matching bevel gear 62, the fan through groove 32 is rotatably provided with a linkage rotating shaft 60, the linkage rotating shaft 60 is fixedly provided with a linkage bevel gear 61 which is mutually kneaded with the matching bevel gear 62 in a corresponding position array, the bottom of the linkage rotating shaft 60 is fixedly provided with a matching gear 58, the side of the matching gear 58 is provided with a matching groove 57, the lower side of the corresponding plate side transmission groove 48 is provided with a linkage groove 55, the rear side of the linkage groove 55 is in butt joint communication with the front side of the matching groove 57, the transmission shaft 47 is fixedly provided with a linkage gear 56 in a part of the linkage groove 55, and the linkage gear 56 is in meshed connection with the matching gear 58.
Preferably, the fan through groove 32 is provided with a guiding communicating groove 70 in an array at the side, and the metal heat conducting rod 34 is provided with a bending section and passes through the tail end of the guiding communicating groove 70 to be arranged at the front side of the side air outlet groove 36.
Preferably, the air deflector 21 is rotationally arranged in the board surface air outlet groove 19, the fixing board 12 is fixedly arranged on the machine shell 11 in an up-down symmetrical manner, screw hole pieces 13 are symmetrically arranged on the front and back sides of the fixing board 12, the screw hole pieces 13 are fixed in the machine box through screws and hole structures, a rear board groove 27 is formed in the rear wall of the machine shell 11, a rear cover board 28 is fixedly arranged in the rear board groove 27, a grid ventilation part 29 is arranged at the rear side of the function carrying groove 10 on the rear cover board 28, and a main board groove 17 is arranged between the board bottom air outlet groove 18 and the board surface air outlet groove 19.
Preferably, the heat dissipation function module 30 further includes a circuit board, a control circuit, a power distribution module, and a power supply module.
Preferably, the air outlet grooves 18 and 19 at the bottom of the board can be in a convex structure, and the air outlet grooves 18 at the bottom of the board can be communicated with air guide hoses or flat tubes and the air outlets of the air guide hoses or flat tubes are arranged at the bottom of the main board to further improve the blowing heat dissipation effect.
The specific application method of the invention comprises the following steps:
when the cooling device is used, the main body is fixedly arranged at the edge of a main board in a case through the fixing plate 12 and the fixing structure, the edge of the main board is embedded into the main board groove 17 according to requirements and installation conditions, so that the air outlet of the air outlet groove 18 at the bottom of the board faces the main board and the case are fixed into a gap formed by copper columns, the air outlet of the air outlet groove 19 at the surface of the board faces the surface of the main board and is in butt joint with each functional hardware, the socket of the power supply module of the cooling function module 30 is connected with a case power supply adapter circuit for supplying power, and therefore under the starting of a host, the cooling function module 30 takes power from the case power supply through the power supply module and controls the operation of each structure in the case through the control circuit and the circuit board, the semiconductor refrigerating sheet is cooled and conducted through the metal heat conducting rod 34, and meanwhile, the cooling fan 31 is started to blow and cool the main board and the hardware in the case through the side;
the invention can improve the radiating equipment of the internal air flow exhaust of the computer to be equipped with the high-efficient radiating and dispelling the structure, set up the semiconductor refrigeration board 80 and corresponding to set up the multiunit metal heat conduction rod 34 through the functional module 30 of the heat dissipation, set up the cooling fan 31 in the fan through-slot 32 adjacent to it at the same time, thus make in the course of working of the cooling fan 31, the semiconductor refrigeration board 80 can realize cooling the cooling fan 31 after introducing the wind by the back side grid ventilation part 29, blow in the fan through-slot 32 and cooperate with the cooling fan 31, realize the contacting cooling again to the wind through multiunit metal heat conduction rod 34, thus blow to motherboard and functional hardware by multiunit slant air outlet slot 26 of the air outlet plate 25, realize the high-efficient application semiconductor refrigeration effect and achieve the effect of greatly reducing the air flow temperature and raise the cooling function to the internal assembly;
the heat radiation equipment capable of improving the air flow emission in the computer has the air flow conversion output function, and in the air flow blowing output heat radiation process, the transmission motor 37 is started to drive the transmission shaft 47 to rotate, so that each group of air outlet plates 25 rotate in the air outlet cylinder 22 groove after gear transmission, and the air flow direction is continuously changed and the air flow output effect is carried out by the effect of the rotation function in the air flow output process after temperature reduction by matching with the oblique output effect of the oblique air outlet groove 26 and the rotating function of the air outlet plates 25, thereby improving the air flow blowing effect in the case and the disturbance effect on the internal hot air flow, and further improving the internal air flow emission efficiency;
the heat radiation device capable of improving the air flow emission in the computer is arranged by the air flow conversion output function matched with the internal flow guide structure, the continuous rotation of the air outlet plate 25 during the air flow blowing process not only can realize the effects of changing the air flow blowing direction and improving the blowing heat dissipation range, but also can drive the linkage gear 56 to rotate during the transmission of the transmission shaft 47, so that the metal air deflectors 35 of each group are driven to rotate along with the transmission of the helical gear structure by the matched gear 58, thereby realizing that when the inclined air outlet groove 26 rotates to be in a horizontal state with the metal air deflector 35, the metal air deflector 35 is arranged in the right front direction of the metal heat conducting rod 34 at the moment, namely, the shielding area for the air outlet is maximum, the inclined air outlet groove 26 is shielded from the inner side, the rear air guiding groove 42 and the matched air guiding groove 44 are in a horizontal communication state at the moment, and the heat radiation air flow is transmitted to the side air outlet groove 36 by the rear air guide groove 42 and the matched air guide groove 44 and is output outwards by the plate bottom air outlet groove 18 and the plate surface air outlet groove 19 by matching with the positive shielding effect of the air outlet and the blocking effect of the inclined air outlet groove 26, thereby realizing the high-speed wind pressure blowing to the surface of the main board, the gap between the main board and the hardware, the gap between the main board and the chassis, and the air flow blowing effect matched with continuous transformation further greatly improves the integral air flow exhausting effect in the chassis through the gap air flow blowing function, the transmission assembly realizes the conversion and separation to achieve the gap blowing cooling, simultaneously realizes the effect of reducing the shielding effect of positive blowing air flow, and when the inclined air outlet groove 26 of the air outlet plate 25 is in a vertical state, the metal air guide plate 35 can be in a state of minimum shielding of air flow outlet on the upper side of the metal heat conducting rod 34, so that the maximum air flow blowing function is performed on the front side range of the air outlet barrel 22.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the present invention and implement it without limiting the scope of the present invention. All equivalent changes or modifications made in accordance with the spirit of the present invention should be construed to be included in the scope of the present invention.
Claims (10)
1. The utility model provides a can improve inside air current of computer and arrange heat abstractor, includes the heat dissipation host computer, the heat dissipation host computer includes the casing, the casing is equipped with function and carries on groove, its characterized in that: the side of the function carrying groove is provided with a side air outlet groove, the function carrying groove array is provided with a fan through groove, a cooling fan is fixedly arranged in the fan through groove, the side of the function carrying groove is fixedly provided with a cooling function module, the cooling function module comprises a semiconductor refrigeration plate, the front side of the semiconductor refrigeration plate is provided with a metal heat conducting rod, the metal heat conducting rod is arranged at the front side part of the fan through groove correspondingly and is rotatably provided with a metal air deflector, the tail end of the metal heat conducting rod is extended and arranged in the side air outlet groove, the front side of the machine shell is fixedly provided with a front panel, an air outlet barrel corresponding to the number and the positions of the through grooves of the fan is arranged in the front panel, an air outlet plate is rotationally arranged in the air outlet barrel, the air outlet plate array is provided with an inclined air outlet groove, the front panel and the back of the air outlet plate are provided with air guide structures, the side array of the front panel is provided with side air blowing parts corresponding to the positions of the side air outlet grooves, and the side air blowing parts are provided with plate bottom air outlet grooves and plate surface air outlet grooves.
2. A heat sink apparatus for enhancing the dissipation of air flow within a computer as defined in claim 1, wherein: the wind guiding structure is an array of wind groove side raised strips arranged on the rear wall of the wind outlet plate and a corresponding array of matching raised strips arranged on the rear wall of the front panel.
3. A heat sink apparatus for enhancing the dissipation of air flow within a computer as defined in claim 2, wherein: the wind groove side sand grip is symmetrical distribute arrange in the slant air outlet groove both sides, adjacent constitute behind the board wind scooper between the wind groove side sand grip, the cooperation sand grip set up in between the dryer with the side blow wind portion inboard end, the cooperation sand grip set up intermittent type with wind groove side sand grip is unanimous, adjacent constitute between the cooperation sand grip and cooperate the wind scooper, behind the board wind scooper with but the butt joint intercommunication between the cooperation wind scooper.
4. A heat sink apparatus for enhancing the dissipation of air flow within a computer as defined in claim 3, wherein: the side air blowing part is characterized in that a side air guide groove is formed in the inner side end of the side air blowing part, the front side end of the side air guide groove is provided with the plate bottom air outlet groove and the plate surface air outlet groove, a communication groove is formed in one end, close to each of the matched air guide grooves, of the side air guide groove, and the communication groove is used for communicating the matched air guide groove with the side air guide groove.
5. A heat sink apparatus for enhancing the dissipation of air flow within a computer as defined in claim 1, wherein: the front panel inner wall embedding fixed mounting has drive assembly, drive assembly includes the transmission and carries on the shell, be equipped with the transmission groove in the transmission carries on the shell, fixed mounting has the drive motor in the transmission groove top cavity, drive motor output fixed mounting has the transmission shaft, the transmission groove in each go out dryer avris position and be equipped with board side transmission groove, go out be equipped with in the dryer with the transmission logical groove that board side transmission groove links to each other, the transmission shaft in board side transmission inslot fixed mounting has the board to move the helical gear, board side transmission groove with it installs the transmission installation axle to rotate between the transmission logical groove, transmission installation axle fixed mounting have with board moves helical gear meshing transmission board side bevel gear, transmission installation axle fixed mounting has the drive rubber wheel, it is equipped with the plate outer loop to go out the aerofoil edge, the outer loop outer wall of board is equipped with the drive rubber ring, the drive rubber ring with the drive rubber wheel contacts and accessible damping transmission.
6. A heat sink apparatus for enhancing the dissipation of air flow within a computer as defined in claim 5, wherein: the metal heat conducting rod array is provided with a ring buckle matching piece, the inner side wall array of the metal air guide plate is provided with a ring buckle, the ring buckle is rotationally arranged in the corresponding ring buckle matching piece and limits the metal air guide plate to slide left and right, the outer wall of the side of the metal air guide plate is fixedly provided with a matching bevel gear, a linkage rotating shaft is rotationally arranged in a through groove of the fan, the linkage rotating shaft is fixedly provided with a linkage bevel gear which is mutually kneaded with the matching bevel gear in a corresponding position array, the bottom of the linkage rotating shaft is fixedly provided with a matching gear, the side position of the matching gear is provided with a matching groove, a linkage groove is correspondingly arranged at the lower side position of the plate side transmission groove, the rear side of the linkage groove is in butt joint communication with the front side of the matching groove, and the transmission shaft is fixedly provided with a linkage gear which is in meshed connection with the matching gear.
7. A heat sink apparatus for enhancing the dissipation of air flow within a computer as defined in claim 1, wherein: the fan through groove side array is equipped with the direction intercommunication groove, the metal heat conduction pole has the bending section and passes the direction intercommunication groove end is arranged in the side air-out groove front side.
8. A heat sink apparatus for enhancing the dissipation of air flow within a computer as defined in claim 1, wherein: the face air-out inslot internal rotation is equipped with the aviation baffle, symmetrical fixed mounting has the fixed plate about the casing, the fixed plate front and back symmetry is equipped with screw spare, screw spare passes through screw and hole structure to be fixed in quick-witted incasement portion, the casing back wall is equipped with the back plate groove, fixed mounting has the back shroud in the back plate inslot, the back shroud in function carries on the groove rear side and is equipped with the net ventilation portion in the position, the board end air-out groove with be equipped with the mainboard groove between the face air-out groove.
9. A heat sink apparatus for enhancing the dissipation of air flow within a computer as defined in claim 1, wherein: the heat dissipation function module further comprises a circuit board, a control circuit, a power distribution module and a power supply module.
10. A heat sink apparatus for enhancing the dissipation of air flow within a computer as defined in claim 1, wherein: the shape of the air outlet groove at the bottom of the plate and the shape of the air outlet groove at the bottom of the plate can be set to be an outer convex structure, and the air outlet groove at the bottom of the plate can be communicated with an air guide hose or a flat pipe and the air outlet of the air outlet groove at the bottom of the plate is arranged at the bottom of the main plate to further improve the blowing heat dissipation effect.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311180059.9A CN117111707A (en) | 2023-09-13 | 2023-09-13 | Heat radiation equipment capable of improving internal airflow emission of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311180059.9A CN117111707A (en) | 2023-09-13 | 2023-09-13 | Heat radiation equipment capable of improving internal airflow emission of computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117111707A true CN117111707A (en) | 2023-11-24 |
Family
ID=88805518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311180059.9A Withdrawn CN117111707A (en) | 2023-09-13 | 2023-09-13 | Heat radiation equipment capable of improving internal airflow emission of computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117111707A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117337005A (en) * | 2023-11-10 | 2024-01-02 | 江苏鸿奥信息科技有限公司 | Edge computing gateway of building intelligent management system |
-
2023
- 2023-09-13 CN CN202311180059.9A patent/CN117111707A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117337005A (en) * | 2023-11-10 | 2024-01-02 | 江苏鸿奥信息科技有限公司 | Edge computing gateway of building intelligent management system |
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Application publication date: 20231124 |
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