CN117111227A

CN117111227A - Optical module

Info

Publication number: CN117111227A
Application number: CN202310790220.8A
Authority: CN
Inventors: 杨思更; 刘旭霞; 王凤来; 何鹏; 马晓磊; 赵贺
Original assignee: Hisense Broadband Multimedia Technology Co Ltd; Shandong University
Current assignee: Hisense Broadband Multimedia Technology Co Ltd; Shandong University
Priority date: 2023-06-30
Filing date: 2023-06-30
Publication date: 2023-11-24

Abstract

In an optical module provided by the present disclosure, comprising: a circuit board, the surface of which is provided with a light emitting chip and a light receiving chip; a lens assembly covering the light emitting chip and the light receiving chip; the lens assembly comprises a lens assembly body, a first optical fiber adapter and a second optical fiber adapter; the first optical fiber adapter and the second optical fiber adapter are arranged at the first end of the lens assembly body and are used for transmitting optical signals; the center of the light emitting chip is positioned between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board; the lens assembly body is provided with a first optical surface and a second optical surface; the first optical surface faces the first optical fiber adapter, the second optical surface faces the first optical surface and the light emitting chip, and the second optical surface is located between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter. The application provides an optical module with a novel COB packaging structure.

Description

Optical module

Technical Field

The disclosure relates to the technical field of optical fiber communication, and in particular relates to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of photoelectric signals, is one of key devices in optical communication equipment, and is positioned at an optical communication core position. Current packaging forms of optical modules include a coaxial (TO) package, a Chip On Board (COB) package, and the like.

In the optical module of the COB packaging structure, the light emitting chip and the light receiving chip are directly mounted on the circuit board, and the lens assembly is arranged above the light emitting chip and the light receiving chip, so that the transmission direction of the light emitting chip for emitting the light signal and the transmission direction of the light receiving chip for receiving the light signal are changed through the lens assembly, and the light emitting module for emitting the light signal and receiving the light signal is realized.

Disclosure of Invention

The embodiment of the disclosure provides an optical module for providing an optical module with a novel COB packaging structure.

In a first aspect, the present disclosure provides an optical module, comprising: a circuit board, the surface of which is provided with a light emitting chip and a light receiving chip;

the bottom of the lens component is connected with the circuit board and covers the light emitting chip and the light receiving chip; wherein:

the lens assembly includes a lens assembly body, a first fiber optic adapter, and a second fiber optic adapter; the first optical fiber adapter and the second optical fiber adapter are arranged at the first end of the lens assembly body, the first optical fiber adapter is used for transmitting and transmitting optical signals, and the second optical fiber adapter is used for transmitting and receiving optical signals;

the center of the light emitting chip is positioned between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board;

The lens assembly body is provided with a first optical surface and a second optical surface; the first optical surface faces the first optical fiber adapter, the second optical surface faces the first optical surface and the light emitting chip, and the second optical surface is located above the light emitting chip and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter.

In the optical module provided by the disclosure, the lens assembly includes a lens assembly body, a first optical fiber adapter and a second optical fiber adapter, a light emitting chip and a light receiving chip are disposed on the circuit board, and the light emitting chip is located between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board. The lens assembly body is provided with a first optical surface and a second optical surface, the first optical surface and the second optical surface are used for deflecting the emitted light signals generated by the light emitting chip for multiple times, and even if the center of the light emitting chip is not located on the projection of the optical axis of the first optical fiber adapter on the circuit board, the emitted light signals generated by the light emitting chip can be transmitted out through the first optical fiber adapter.

In a second aspect, the present disclosure provides an optical module, comprising: a circuit board, the surface of which is provided with a light emitting chip and a light receiving chip;

the center of the light receiving chip is positioned between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board;

the lens assembly body is provided with a third optical surface and a fourth optical surface, the third optical surface faces the second optical fiber adapter, the fourth optical surface faces the third optical surface and the light receiving chip, and the light receiving chip is located below the fourth optical surface and between the optical axis of the first optical fiber adapter and the optical axis of the second optical fiber adapter.

In the optical module provided by the disclosure, the lens assembly includes a lens assembly body, a first optical fiber adapter and a second optical fiber adapter, a light emitting chip and a light receiving chip are disposed on the circuit board, and the light receiving chip is located between the projection of the optical axis of the first optical fiber adapter on the circuit board and the projection of the optical axis of the second optical fiber adapter on the circuit board. The lens assembly body is provided with a third optical surface and a fourth optical surface which are used for receiving multiple deflection of the optical signals, and the optical receiving chip can receive the received optical signals input through the second optical fiber adapter even if the center of the optical receiving chip is not positioned on the projection of the optical axis of the second optical fiber adapter on the circuit board.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a partial block diagram of an optical communication system provided in accordance with some embodiments of the present disclosure;

fig. 2 is a partial block diagram of a host computer according to some embodiments of the present disclosure;

FIG. 3 is a block diagram of an optical module provided in accordance with some embodiments of the present disclosure;

FIG. 4 is an exploded view of an optical module provided in accordance with some embodiments of the present disclosure;

FIG. 5 is a schematic diagram illustrating an assembly of a lens assembly and a circuit board according to some embodiments of the present disclosure;

fig. 6 is a schematic partial structure of a circuit board according to some embodiments of the present disclosure;

FIG. 7 is an exploded view of a lens assembly and a circuit board provided in accordance with some embodiments of the present disclosure;

FIG. 8 is a schematic diagram of a lens assembly according to some embodiments of the present disclosure;

FIG. 9 is a schematic diagram II of a lens assembly according to some embodiments of the present disclosure;

FIG. 10 is a schematic diagram III of a lens assembly according to some embodiments of the present disclosure;

FIG. 11 is a schematic diagram of a lens assembly according to some embodiments of the present disclosure;

FIG. 12 is a cross-sectional view I of a lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 13 is a second cross-sectional view of a lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 14 is a schematic view of a partial structure of a lens assembly body provided in accordance with some embodiments of the present disclosure;

FIG. 15 is a sectional view of a lens assembly according to some embodiments of the present disclosure;

FIG. 16 is a second cross-sectional view of a lens assembly according to some embodiments of the present disclosure;

FIG. 17 is a sectional view of a first use state of another lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 18 is a second cross-sectional view of another lens assembly according to some embodiments of the present disclosure;

FIG. 19 is a cross-sectional view of a lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 20 is a cross-sectional view I of another lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 21 is a second cross-sectional view of another lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 22 is a perspective view of yet another lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 23 is a second perspective view of yet another lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 24 is a cross-sectional view I of yet another lens assembly provided in accordance with some examples of the present disclosure;

FIG. 25 is a third perspective view of yet another lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 26 is an enlarged view of a portion of FIG. 25 at O;

FIG. 27 is a second cross-sectional view of yet another lens assembly provided in accordance with some embodiments of the present disclosure;

fig. 28 is a partial enlarged view of P in fig. 27;

FIG. 29 is a third cross-sectional view of yet another lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 30 is a cross-sectional view fourth of yet another lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 31 is a fifth cross-sectional view of yet another lens assembly provided in accordance with some embodiments of the present disclosure;

FIG. 32 is a bottom view of yet another lens assembly use provided in accordance with some embodiments of the present disclosure;

fig. 33 is a bottom view of a second lens assembly according to still another embodiment of the present disclosure.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and specifically described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present disclosure, but not all embodiments. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

In the optical communication technology, in order to establish information transfer between information processing apparatuses, it is necessary to load information onto light, and transfer of information is realized by propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so that high-speed, long-distance and low-cost information transmission can be realized. The signal that the information processing apparatus can recognize and process is an electrical signal. Information processing devices typically include optical network terminals (Optical Network Unit, ONUs), gateways, routers, switches, handsets, computers, servers, tablets, televisions, etc., and information transmission devices typically include optical fibers, optical waveguides, etc.

The optical module can realize the mutual conversion of optical signals and electric signals between the information processing equipment and the information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; the optical module converts the first optical signal into a first electrical signal and transmits the first electrical signal to an optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Since information transmission can be performed between the plurality of information processing apparatuses by an electric signal, it is necessary that at least one of the plurality of information processing apparatuses is directly connected to the optical module, and it is unnecessary that all of the information processing apparatuses are directly connected to the optical module. Here, the information processing apparatus directly connected to the optical module is referred to as an upper computer of the optical module. In addition, the optical signal input or the optical signal output of the optical module may be referred to as an optical port, and the electrical signal input or the electrical signal output of the optical module may be referred to as an electrical port.

Fig. 1 is a partial block diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in fig. 1, the optical communication system mainly includes a remote information processing apparatus 1000, a local information processing apparatus 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

One end of the optical fiber 101 extends in the direction of the remote information processing apparatus 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through an optical port of the optical module 200. The optical signal may be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection may almost maintain the original optical power, and the optical signal may be totally reflected in the optical fiber 101 a plurality of times to transmit the optical signal from the remote information processing apparatus 1000 into the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing apparatus 1000, thereby realizing remote, low power loss information transfer.

The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected, or fixedly connected, with the optical module 200. The upper computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the operating state of the optical module 200.

The host computer 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

The upper computer 100 further includes an external electrical interface, which may access an electrical signal network. For example, the pair of external electrical interfaces includes a universal serial bus interface (Universal Serial Bus, USB) or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so as to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing apparatus 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing apparatus 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing apparatus 2000 is transmitted to the upper computer 100 through the network cable 103, the upper computer 100 generates a second electrical signal according to the third electrical signal, the second electrical signal from the upper computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and the second optical signal is transmitted to the optical fiber 101, where the second optical signal is transmitted to the remote information processing apparatus 1000 in the optical fiber 101. For example, a first optical signal from the remote information processing apparatus 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal from the first electrical signal, and the fourth electrical signal is transmitted to the local information processing apparatus 2000. The optical module is a tool for realizing the mutual conversion between the optical signal and the electric signal, and the information is not changed in the conversion process of the optical signal and the electric signal, and the coding and decoding modes of the information can be changed.

The host computer 100 includes an optical line terminal (Optical Line Terminal, OLT), an optical network device (Optical Network Terminal, ONT), a data center server, or the like in addition to the optical network terminal.

Fig. 2 is a partial block diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, fig. 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in fig. 2, the upper computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex structure such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the host computer 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 are connected by bi-directional electrical signals. Furthermore, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module provided according to some embodiments of the present disclosure, and fig. 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in fig. 3 and 4, the optical module 200 includes a housing (shell), a circuit board 300 disposed within the housing, and a lens assembly 400.

The housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 203 and 204; the outer contour of the housing generally presents a square shape.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and the cover 2011 is covered on two lower side plates 2022 of the lower housing 202 to form the housing.

In some embodiments, the lower housing 202 includes a bottom plate 2021 and two lower side plates 2022 disposed on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper housing 201 includes a cover 2011, and two upper side plates disposed on two sides of the cover 2011 and perpendicular to the cover 2011, and the two upper side plates are combined with two lower side plates 2022 to cover the upper housing 201 on the lower housing 202.

The direction in which the connection lines of the two openings 203 and 204 are located may be identical to the longitudinal direction of the optical module 200 or may be inconsistent with the longitudinal direction of the optical module 200. For example, opening 203 is located at the end of light module 200 (left end of fig. 3), and opening 204 is also located at the end of light module 200 (right end of fig. 3). Alternatively, the opening 203 is located at the end of the light module 200, while the opening 204 is located at the side of the light module 200. The opening 203 is an electrical port, from which the golden finger of the circuit board 300 extends and is inserted into an upper computer (e.g., the optical network terminal 100); the opening 204 is an optical port configured to access the optical fiber 101 such that the optical fiber 101 is connected into the optical module 200.

The assembly mode of combining the upper shell 201 and the lower shell 202 is adopted, so that the components such as the circuit board 300, the lens assembly 400 and the like are conveniently installed in the shells, and the upper shell 201 and the lower shell 202 form packaging protection for the components. In addition, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are convenient to deploy when the components such as the circuit board 300, the lens assembly 400 and the like are assembled, and the automatic production implementation is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 600 located outside the housing thereof, and the unlocking member 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

For example, the unlocking member 600 is located outside the two lower side plates 2022 of the lower housing 202, and includes an engaging member that mates with the cage 106 of the upper computer 100. When the optical module 200 is inserted into the cage 106, the optical module 200 is fixed in the cage 106 by the engaging part of the unlocking part 600; when the unlocking member 600 is pulled, the engaging member of the unlocking member 600 moves along with the unlocking member, so that the connection relationship between the engaging member and the host computer is changed, and the fixation between the optical module 200 and the host computer is released, so that the optical module 200 can be pulled out from the cage 106.

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips include, for example, lasers, photodetectors, micro-control units (Microcontroller Unit, MCU), laser driver chips, limiting amplifiers (Limiting Amplifier, LA), clock data recovery (Clock and Data Recovery, CDR) chips, power management chips, digital signal processing (Digital Signal Processing, DSP) chips.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear the electronic components and chips; the rigid circuit board may also be inserted into an electrical connector in the cage 106 of the host computer 100.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is electrically connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (such as the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to provide more pins, thereby being suitable for occasions with high pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to realize power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

In some embodiments, the lens assembly 500 is coupled to the circuit board 300 and covers over the light emitting chip and/or the light receiving chip; the lens assembly 500 has a transmission surface and a reflection surface thereon, so that the transmission direction of the transmitted light signal and/or the received light signal can be adjusted by combining the transmission surface and the reflection surface, and the transmitted light signal generated by the light emitting chip can be output from the light module, and the light signal input to the light module can be transmitted to the light receiving chip. A light emitting chip such as a laser, and a light receiving chip such as a photodetector. The lower side of the lens assembly 500 is not limited to the light emitting chip and/or the light receiving chip, and a photo-monitoring part, a driving chip, etc. may be provided.

In some embodiments, the optical module 200 includes a lens assembly 400, where the lens assembly 400 covers the light emitting chip and the light receiving chip, and is used to adjust the transmission directions of the emitted light signal and the received light signal. Of course, in some embodiments, the number of lens assemblies 400 in the optical module 200 is not limited to one, and may further include two lens assemblies 400, and a light emitting chip and/or a light receiving chip are disposed under each lens assembly 400.

In some embodiments, the lens assembly 400 is disposed at an end of the circuit board 300, such as near the entrance; some embodiments of the present disclosure are not limited to disposing the lens assembly 400 at an end portion of the circuit board 300, but the lens assembly 400 may be disposed at a middle portion of the circuit board 300.

Fig. 5 is an assembly schematic diagram of a lens assembly and a circuit board according to some embodiments of the present disclosure. In some embodiments, as shown in fig. 5, the lens assembly 400 includes a first fiber optic adapter 410, a second fiber optic adapter 420, and a lens assembly body 430. The first fiber optic adapter 410 is connected to one side of the first end of the lens assembly body 430, and the second fiber optic adapter 420 is connected to the other side of the first end of the lens assembly body 430, i.e., the first fiber optic adapter 410 and the second fiber optic adapter 420 are disposed side-by-side at the first end of the lens assembly body 430. The first and second fiber optic adapters 410 and 420, respectively, are configured to connect the optical fibers 101 to transmit optical signals to the optical fibers 101 or to transmit received optical signals to the lens assembly body 430. Illustratively, the first fiber optic adapter 410 is configured to transmit a transmit optical signal to the optical fiber 101 and the second fiber optic adapter 420 is configured to transmit a receive optical signal to the optical fiber 101. Of course, in some embodiments, one fiber optic adapter is disposed on the lens assembly 400, and two lens assemblies 400 are disposed within the optical module 200.

In some embodiments, the spacing between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420 is a preset value, such as a spacing L between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420 of 6.25mm. Even if two lens assemblies 400 are provided in the optical module 200, the distance between the optical axes of the fiber adapters on the two lens assemblies 400 should be a fixed value.

Fig. 6 is a schematic partial structure of a circuit board according to some embodiments of the present disclosure. In some embodiments, as shown in fig. 6, the top surface of the circuit board 300 is provided with a light emitting chip 310 and a light receiving chip 320, the center of the light emitting chip 310 is located on a projection line of the optical axis of the first optical fiber adapter 410 on the top surface of the circuit board 300, and the center of the light receiving chip 320 is located on a projection line of the optical axis of the second optical fiber adapter 420 on the top surface of the circuit board 300, so that a distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is a preset value. The center of the light emitting chip 310 mainly refers to the center of the effective light emitting surface, and the center of the light receiving chip 320 mainly refers to the center of the effective detection surface.

In some embodiments, the light emitting chip 310 and the light receiving chip 320 need to share a driving chip, and the length of the driving chip is smaller than the pitch L, and in order to ensure the performance of signal transmission, the wire bonding between the light emitting chip 310 and the driving chip and the wire bonding between the driving chips of the light receiving chip 320 may not be too long, if it is required to be controlled within 0.1mm, etc., thus resulting in that the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 needs to be smaller than the pitch L. In some embodiments, even if the light emitting chip 310 and the light receiving chip 320 do not share a driving chip, in order to facilitate layout setting of other devices, it is necessary to reduce the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 to be smaller than the pitch L. In order to satisfy that a distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is smaller than the interval L, a lens assembly is provided in an embodiment of the present application.

Fig. 7 is an exploded view of a lens assembly and a circuit board according to some embodiments of the present disclosure. As shown in fig. 7, the light emitting chip 310 and the light receiving chip 320 are disposed on the circuit board 300, and the distance between the center of the light emitting chip 310 and the center of the light receiving chip 320 is smaller than the interval L, and the lens assembly 400 is disposed above the light emitting chip 310 and the light receiving chip 320. Illustratively, the bottom of the lens assembly 400 is connected to the circuit board 300, and the bottom of the lens assembly 400 forms a receiving cavity with the surface of the circuit board 300, in which the light emitting chip 310 and the light receiving chip 320 are located. The lens assembly 400 not only can adjust the transmission direction in which the light emitting chip 310 emits the light signal and the light receiving chip 320 receives the light signal, but also can protect the light emitting chip 310 and the light receiving chip 320. In some embodiments, the optical axis of the first fiber optic adapter 410 is projected as a straight line M on the circuit board 300, the optical axis of the second fiber optic adapter 420 is projected as a straight line N on the circuit board 300, the distance between the straight line M and the straight line N is L, and the light emitting chip 310 and the light receiving chip 320 are located between the straight line M and the straight line N, although the center of some of the light emitting chips 310 is located on the straight line M or the center of the light receiving chip 320 is located on the straight line N.

In some embodiments, a driving chip 330 is further disposed on the circuit board 300, the driving chip 330 is disposed in a receiving cavity formed between the bottom of the lens assembly 400 and the circuit board 300, and the driving chip 330 is located at a side of the light emitting chip 310 and the light receiving chip 320 away from the light port of the light module 200. Illustratively, the driving chip 330 is disposed at a side of the light emitting chip 310 and the light receiving chip 320 away from the light port; the driving chip 330 is electrically connected to the light emitting chip 310 and the light receiving chip 320, respectively, i.e., the light emitting chip 310 and the light receiving chip 320 share the driving chip 330. Of course, in some embodiments, two driver chips are disposed on the circuit board, one driver chip is wired to the light emitting chip 310, and the other driver chip is wired to the light receiving chip 320.

Fig. 8 is a schematic structural view of a first lens assembly according to some embodiments of the present disclosure, and fig. 9 is a schematic structural view of a second lens assembly according to some embodiments of the present disclosure. As shown in fig. 8 and 9, in some embodiments, the lens assembly 400 includes a first fiber optic adapter 410, a second fiber optic adapter 420, and a lens assembly body 430. The lens assembly body 430 has a plurality of optical surfaces formed thereon for transmitting optical signals, reflecting optical signals, or the like. The first end of the lens assembly body 430 is adjacent to the optical port of the optical module 200, and the second end of the lens assembly body 430 is adjacent to the electrical port of the optical module 200.

In some embodiments, lens assembly 400 is a transparent plastic piece, and is integrally injection molded.

The first fiber optic adapter 410 is connected to one side of the first end of the lens assembly body 430, and the second fiber optic adapter 420 is connected to the other side of the first end of the lens assembly body 430, i.e., the first fiber optic adapter 410 and the second fiber optic adapter 420 are disposed side-by-side at the first end of the lens assembly body 430. The first fiber optic adapter 410 and the second fiber optic adapter 420 are hollow structures, and the first fiber optic adapter 410 and the second fiber optic adapter 420 are configured to connect the optical fibers 101 for transmitting optical signals.

In some embodiments, the first fiber optic adapter 410 and the second fiber optic adapter 420 are each internally provided with a fiber stub for improving the coupling efficiency of optical signals between the optical fiber 101 and the lens assembly body 430.

In some embodiments, the lens assembly body 430 is formed with a first recess 440 at the top, and a plurality of optical surfaces are formed at the bottom of the first recess 440. Illustratively, the first recess 440 is formed by a top surface of the lens assembly body 430 recessed toward a bottom of the lens assembly body 430. The lens assembly body 430 is formed with a first recess 440, and an optical surface is formed at the bottom of the first recess 440, so that the thickness of the lens assembly body 430 at the position where the optical surface is disposed can be adjusted by the first recess 440, and the optical surface can be conveniently processed.

In some embodiments, the bottom of the lens assembly body 430 is formed with a second recess 450, and the second recess 450 forms a receiving cavity with the surface of the circuit board 300, so that the light emitting chip 310, the light receiving chip 320, and the like are conveniently disposed under the lens assembly 400. Illustratively, the second recess 450 is formed by recessing the bottom surface of the lens assembly body 430 toward the top of the lens assembly body 430. In some embodiments, the top surface of the second recess 450 also has an optical surface formed thereon, which is primarily used to transmit optical signals, such as converging optical signals, and the like.

Fig. 10 is a schematic diagram three of a lens assembly according to some embodiments of the present disclosure, and fig. 11 is a schematic diagram four of a lens assembly according to some embodiments of the present disclosure. As shown in fig. 10 and 11, a first groove 431 is formed at the top of the lens assembly body 430, and a first optical surface 4311 is formed on a sidewall of the first groove 431. The first optical surface 4311 is positioned in the extending direction of the first fiber optic adapter 410. The first optical surface 4311 is used for reflecting the emitted light signal and changing the transmission direction of the emitted light signal. In some embodiments, the projection of the first optical face 4311 in the direction of extension of the first fiber optic adapter 410 covers the end face of the fiber stub in the first fiber optic adapter 410. Illustratively, the first optical face 4311 changes the transmission direction of the emitted light signal from the A-B direction to the C-D direction. In some embodiments, a reflective film is disposed on the first optical surface 4311 to increase the reflection efficiency of the first optical surface 4311 for the emitted light signal.

In some embodiments, the A-B direction of the lens assembly 400 is the width direction of the lens assembly 400, the C-D direction of the lens assembly 400 is the length direction of the lens assembly 400, and the E-F direction of the lens assembly 400 is the height direction of the lens assembly 400. Illustratively, the width direction of the lens assembly 400 is parallel to the width direction of the circuit board 300, the length direction of the lens assembly 400 is parallel to the length direction of the circuit board 300, the height direction of the lens assembly 400 is perpendicular to the top surface of the circuit board 300, and the first optical surface 4311 changes the transmission direction of the emitted light signal in the width and length directions of the circuit board 300.

As shown in fig. 10 and 11, the lens assembly body 430 is formed with a second groove 432 on the top, the second groove 432 being located between the optical axis of the first fiber optic adapter 410 and the optical axis of the second fiber optic adapter 420; the bottom of the second groove 432 is formed with a second optical surface 4321, and the second optical surface 4321 is used for reflecting the emitted light signal to change the transmission direction of the emitted light signal. The second optical surface 4321 is located above the light emitting chip 310, and the second optical surface 4321 changes a direction in which the light emitting chip 310 generates the light signal. In some embodiments, the projection of the second optical surface 4321 in the direction of the circuit board 300 covers the light emitting chip 310. In some embodiments, a reflective film is disposed on the second optical surface 4321 to increase the reflective efficiency of the second optical surface 4321.

In some embodiments of the present disclosure, the first optical surface 4311 and the second optical surface 4321 are combined, so that the light emitting chip 310 is disposed between the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300, and thus the emitted light signal generated by the light emitting chip 310 can be transmitted through the first optical fiber adapter 410 even if the center of the light emitting chip 310 is not on the straight line M.

As shown in fig. 10 and 11, a third groove 433 is formed at the top of the lens assembly body 430, and a third optical surface 4331 is formed on a sidewall of the third groove 433. The third optical surface 4331 is positioned in the extending direction of the second fiber optic adapter 420. The third optical surface 4331 is used for reflecting the received optical signal and changing the transmission direction of the received optical signal. In some embodiments, the projection of the third optical face 4331 in the direction of extension of the second fiber optic adapter 420 covers the end face of the fiber stub in the second fiber optic adapter 420. Illustratively, the third optical surface 4331 changes the transmission direction of the received optical signal from the C-D direction to the a-B direction, i.e., the third optical surface 4331 changes the transmission direction of the emitted optical signal in the length and width directions of the circuit board 300. In some embodiments, a reflective film is disposed on the third optical surface 4331 to increase the reflection efficiency of the third optical surface 4331 on the received optical signal.

As shown in fig. 10 and 11, the top of the lens assembly body 430 is formed with a fourth groove 434, the fourth groove 434 being located between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420; a fourth optical surface 4341 is formed on a sidewall of the fourth groove 434, and the fourth optical surface 4341 is used for reflecting the received optical signal to change the transmission direction of the received optical signal. The fourth optical surface 4341 is located above the light receiving chip 320, and the fourth optical surface 4341 reflects and transmits the received light signal to the light receiving chip 320. In some embodiments, the projection of the fourth optical surface 4341 in the direction of the circuit board 300 covers the light receiving chip 320. In some embodiments, a reflective film is disposed on the fourth optical surface 4341 to improve the reflection efficiency of the fourth optical surface 4341 on the received optical signal.

In some embodiments of the present disclosure, the third optical surface 4331 and the fourth optical surface 4341 are combined, so that the light receiving chip 320 is disposed between the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300, and thus the received light signal inputted through the second optical fiber adapter 420 can be transmitted to the light receiving chip 320 even if the center of the light receiving chip 320 is not on the straight line N.

In some embodiments, the bottom of the second groove 432 is also formed with a fifth optical surface 4322, the fifth optical surface 4322 being capable of both transmitting and reflecting the emitted light signal. The emitted light signal transmitted through the fifth optical surface 4322 is transmitted to the direction where the first optical surface 4311 is located, and the light signal reflected through the fifth optical surface 4322 is used for monitoring the emitted light power of the optical module. In some embodiments, the second optical face 4321 and the fifth optical face 4322 intersect within the second groove 432. Illustratively, a backlight detection chip is disposed on the circuit board 300, and the lens assembly 400 is disposed above the backlight detection chip, and the backlight detection chip receives the optical signal reflected by the fifth optical surface 4322 for monitoring the emitted optical power of the optical module.

In some embodiments, a sixth optical surface 4323 is further formed on a side wall of the second groove 432, and the sixth optical surface 4323 is used for transmitting the emitted light signal transmitted through the fifth optical surface 4322, so as to transmit the emitted light signal to the direction in which the first optical surface 4311 is located.

In some embodiments of the present disclosure, by providing the first groove 431, the second groove 432, the third groove 433 and the fourth groove 434 on the lens assembly body 430, it is convenient to control the thickness of each position of the lens assembly body 430, so as to facilitate the formation of the corresponding optical surface, and facilitate the processing of the optical surface.

Fig. 12 is a cross-sectional view one of a lens assembly provided in accordance with some embodiments of the present disclosure. As shown in fig. 12, the first fiber optic adapter 410 is provided with a first through hole 411, and a first fiber stub 460 is disposed in the first through hole 411. The first optical fiber ferrule 460 is used for coupling optical signals from the lens assembly body 430 into the optical fiber 101, improving the coupling efficiency of the emitted optical signals to the optical fiber 101.

In some embodiments, the lens assembly body 430 further includes a first blind hole 435, one end of the first blind hole 435 is connected to the first through hole 411, the other end of the first blind hole 435 is provided with a first lens 4351, and the first lens 4351 is used for converging the emitted light signal reflected by the first optical surface 4311 to the end surface of the first optical fiber ferrule 460.

In some embodiments, the end face of the first fiber stub 460 is angled, with the angle of the end face of the first fiber stub 460 being 4-7 °, reducing the return of optical signals reflected by the end face of the first fiber stub 460 along the transmission path of the transmitted optical signals.

Fig. 13 is a second cross-sectional view of a lens assembly provided in accordance with some embodiments of the present disclosure. As shown in fig. 13, the second fiber optic adapter 420 is provided with a second through hole 421, and a second fiber stub 470 is disposed in the second through hole 421. The second optical fiber ferrule 470 is used for coupling the optical signal from the optical fiber 101 into the lens assembly body 430, so as to improve the coupling efficiency of the received optical signal to the lens assembly body 430.

In some embodiments, the lens assembly body 430 further includes a second blind hole 436, one end of the second blind hole 436 is connected to the second through hole 421, and the other end of the second blind hole 436 is provided with a second lens 4361, where the second lens 4361 is used for collimating the received optical signal output from the end face of the second optical fiber ferrule 470 to the third optical surface 4331.

In some embodiments, the end face of the second fiber stub 470 is inclined, and the angle of inclination of the end face of the second fiber stub 470 is 4-7 °, reducing the received optical signal reflected by the third optical face 4331 from being reflected back into the transmission path of the received optical signal by the end face of the second fiber stub 470.

Fig. 14 is a schematic partial structure view of a lens assembly body according to some embodiments of the present disclosure, and fig. 15 is a sectional view of a lens assembly according to some embodiments of the present disclosure. The light emitting chip 310 and the light receiving chip 320 are disposed between the projection of the optical axis of the first optical fiber adapter 410 on the circuit board 300 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300.

As shown in fig. 14 and 15, a seventh optical surface 451 and an eighth optical surface 452 are provided on the top surface of the second recess 450. The seventh optical surface 451 is located above the light emitting chip 310, and the seventh optical surface 451 is used for transmitting the emitted light signal generated by the light emitting chip 310; the eighth optical surface 452 is located above the light receiving chip 320, and the eighth optical surface 452 is used for transmitting the received light signal, so that the received light signal is transmitted to the light receiving chip 320.

In some embodiments, a third lens 4511 is disposed on the seventh optical surface 451, and the third lens 4511 is used to collimate the emitted light signal generated by the light emitting chip 310.

In some embodiments, a fourth lens 4521 is disposed on the eighth optical surface 452, and the fourth lens 4521 is configured to converge received optical signals with the optical receiving chip 320.

In some embodiments, a fifth groove 453 is provided on the top surface of the second recess 450, and a seventh optical surface 451 and an eighth optical surface 452 are formed on the bottom surface of the fifth groove 453. The relative heights of the seventh optical surface 451 and the eighth optical surface 452, that is, the distance between the seventh optical surface 451 and the light emitting surface of the light emitting chip 310 and the distance between the eighth optical surface 452 and the light receiving surface of the light receiving chip 320 are adjusted by the fifth groove 453.

In some embodiments, the positions of the first optical surface 4311, the second optical surface 4321, the fifth optical surface 4322, and the like are adjusted to adjust the relative positions of the backlight detection chip and the light emitting chip 310, the light receiving chip 320, such as positioning the backlight detection chip on a connection line between the light emitting chip 310 and the light receiving chip 320, positioning the backlight detection chip between the light emitting chip 310 and the light receiving chip 320, or positioning the backlight detection chip on a side of the light emitting chip 310 away from the light receiving chip 320.

In some embodiments, a first backlight detecting chip 340 is further disposed under the lens assembly body 430, and a ninth optical surface 454 is further formed in the fifth groove 453, and the ninth optical surface 454 transmits an optical signal and transmits the optical signal to the first backlight detecting chip 340, and the first backlight detecting chip 340 receives the optical signal for detecting the emitted light power of the light emitting chip 310. In some examples, the first backlight detection chip 340 is located between the light emitting chip 310 and the light receiving chip 320, and the ninth optical surface 454 is located between the seventh optical surface 451 and the eighth optical surface 452.

In some embodiments, a fifth lens 4541 is disposed on the ninth optical surface 454, the fifth lens 4541 configured to focus optical signals.

In some embodiments, the ninth optical surface 454 is an inclined surface, a step surface 4324 is formed on a sidewall of the second groove 432, and the step surface 4324 is located above the ninth optical surface 454, so that the thickness of the lens assembly body 430 above the ninth optical surface 454 is adjusted by the step surface 4324, so as to ensure the formability of the ninth optical surface 454, and further facilitate the processing of the ninth optical surface 454.

Fig. 16 is a second sectional view of a lens assembly according to some embodiments of the present disclosure, and fig. 16 illustrates a transmission path of a lens assembly 400. As shown in fig. 16, the emitted light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511, transmitted to the second optical surface 4321, and reflected by the second optical surface 4321 to the fifth optical surface 4322; the emitted light signal transmitted to the fifth optical surface 4322 is partially transmitted through the fifth optical surface 4322 and partially reflected by the fifth optical surface 4322; the light emitted through the fifth optical surface 4322 is transmitted to the sixth optical surface 4323, passes through the sixth optical surface 4323 and passes through the sixth optical surface 4323, and the light emitted through the sixth optical surface 4323 is transmitted to the first optical surface 4311 and finally is reflected by the first optical surface 4311. The emitted light signals reflected by the fifth optical surface 4322 are transmitted to the ninth optical surface 454, and are converged and transmitted to the first backlight detection chip 340 through the fifth lens 4541.

As shown in fig. 16, the received optical signal is transmitted to the third optical surface 4331, reflected by the third optical surface 4331, transmitted to the fourth optical surface 4341, reflected by the fourth optical surface 4341, transmitted to the eighth optical surface 452, and converged and transmitted to the light receiving chip 320 through the fourth lens 4521.

In some embodiments of the present disclosure, with reference to the light emitting surface perpendicular to the light emitting chip 310, the inclination angle of the second optical surface 4321 is α1, the inclination angle of the fifth optical surface 4322 is α2, the inclination angle of the sixth optical surface 4323 is α3, and the inclination angle of the ninth optical surface 454 is α4. The inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, the inclination angle α3 of the sixth optical surface 4323, and the inclination angle α4 of the ninth optical surface 454 are matched with each other, and it is necessary to refer to the pitches L1 and 2 of the optical surfaces, and specific values are selected by being matched with each other. The pitch of the first backlight detecting chip 340 and the light emitting chip 310 is combined with the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α4 of the ninth optical surface 454. Accordingly, the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α4 of the ninth optical surface 454 are selected in consideration of the distance between the first backlight detection chip 340 and the light emitting chip 310.

Fig. 17 is a sectional view of another lens assembly according to some embodiments of the present disclosure. As shown in fig. 17, in some examples, a second backlight detection chip 350 is disposed on a side of the light emitting chip 310 remote from the light receiving chip 320; a tenth optical surface 455 is formed on the top surface of the second recess 450, the tenth optical surface 455 being located above the second backlight detection chip 350. The tenth optical surface 455 is for transmitting an optical signal and transmitting the optical signal to the second backlight detection chip 350; the second backlight detection chip 350 receives the light signal for detecting the emitted light power of the light emitting chip 310. Illustratively, the optical signal transmitted to the tenth optical surface 455 is refracted at the tenth optical surface 455, and the optical signal refracted by the tenth optical surface 455 is transmitted to the second backlight detection chip 350.

Fig. 18 is a second cross-sectional view of another lens assembly according to some embodiments of the present disclosure, and fig. 18 illustrates a transmission path of another lens assembly 400. As shown in fig. 18, the emitted light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511, transmitted to the second optical surface 4321, reflected by the second optical surface 4321, transmitted to the fifth optical surface 4322, and transmitted to the sixth optical surface 4323 through the fifth optical surface 4322; the light transmitted to the sixth optical surface 4323 is partially transmitted through the sixth optical surface 4323 and partially reflected by the sixth optical surface 4323; the emitted light signal transmitted through the sixth optical surface 4323 is transmitted to the first optical surface 4311, and finally reflected by the first optical surface 4311; the optical signal reflected by the sixth optical surface 4323 is transmitted to the fifth optical surface 4322 and transmitted through the fifth optical surface 4322 to the second optical surface 4321, and is reflected by the second optical surface 4321 to the tenth optical surface 455, and is transmitted through the tenth optical surface 455 to the second backlight detection chip 350.

In some embodiments of the present disclosure, the tenth optical surface 455 is inclined by an angle α5 with reference to a light-emitting surface perpendicular to the light-emitting chip 310. The inclination angle α5 of the tenth optical surface 455 needs to be selected in combination with the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α3 of the sixth optical surface 4323. The pitch of the second backlight detecting chip 350 and the light emitting chip 310 combines the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α5 of the tenth optical surface 455. Accordingly, the inclination angle α1 of the second optical surface 4321, the inclination angle α2 of the fifth optical surface 4322, and the inclination angle α5 of the tenth optical surface 455 are selected in consideration of the distance between the second backlight detection chip 350 and the light emitting chip 310.

Fig. 19 is a cross-sectional view of a lens assembly provided in accordance with some embodiments of the present disclosure, and a transmission path of a lens assembly 400 is shown in fig. 19. As shown in fig. 19, the emitted light signal is transmitted to the first optical surface 4311 through the fifth optical surface 4322, reflected by the first optical surface 4311, transmitted to the first lens 4351, converged by the first lens 4351, transmitted to the first optical fiber ferrule 460, and transmitted along the extending direction of the first optical fiber ferrule 460.

As shown in fig. 19, the received optical signal is transmitted to the second lens 4361 through the second optical fiber ferrule 470, collimated by the second lens 4361, transmitted to the third optical surface 4331, and reflected by the third optical surface 4331 to the fourth optical surface 4341.

Fig. 20 is a first cross-sectional view of another lens assembly provided in accordance with some embodiments of the present disclosure, and fig. 21 is a second cross-sectional view of another lens assembly provided in accordance with some embodiments of the present disclosure. In some embodiments, as shown in fig. 20 and 21, the center of the light receiving chip 320 is located on the projection of the optical axis of the second optical fiber adaptor 420 in the direction of the circuit board 300, a sixth groove 437 is provided above the light receiving chip 320, and an eleventh optical surface 4371 is formed in the sixth groove 437, and the eleventh optical surface 4371 is inclined in the direction of the second optical fiber adaptor 420. The received optical signal is transmitted to the eleventh optical surface 4371 through the second fiber optic adapter 420; the eleventh optical surface 4371 reflects the received light signal, changing the transmission direction of the received light signal from parallel to the circuit board 300 to perpendicular to the circuit board 300.

In some embodiments, the eleventh optical surface 4371 is located above the eighth optical surface 452, the light receiving chip 320 is located below the fourth lens 4521, and the received light signal reflected by the eleventh optical surface 4371 is transmitted to the fourth lens 4521, and then is converged and transmitted to the light receiving chip 320 by the fourth lens 4521.

In order to meet the requirement of the distance between the light emitting chip 310 and the light receiving chip 320, the position where the optical axis of the light emitting chip 310 projects onto the second optical fiber adapter 420 on the circuit board 300 is close to, that is, compared with the position where the light emitting chip 310 and the light receiving chip 320 are located between the projection of the optical axis of the first optical fiber adapter 410 and the projection of the optical axis of the second optical fiber adapter 420 on the circuit board 300, the light emitting chip 310 moves in the direction where the second optical fiber adapter 420 is located, and the second optical surface 4321 moves in the same direction.

Of course, in the embodiment of the present disclosure, the center of the light emitting chip 310 may be located near or on the optical axis of the first optical fiber adapter 410 and projected on the circuit board 300, so as to adaptively adjust the position of the optical surface and the combination of the optical surfaces on the lens assembly 400.

In some embodiments, the distance between the center of the light emitting chip 310 and the optical axis of the first optical fiber adapter 410 projected on the circuit board 300 is equal to the distance between the center of the light receiving chip 320 and the optical axis of the second optical fiber adapter 420 projected on the circuit board 300, so that the optical path length of the emitted light signal inside the light module 200 is similar to the process length of the received light signal, so as to balance the optical path length of the emitted light signal inside the light module 200 with the process length of the received light signal, and further, the tolerance of the emitted light signal transmission optical path and the received light signal transmission optical path can be coordinated.

In some embodiments, the positions of the first optical surface 4311, the second optical surface 4321, the fifth optical surface 4322, and the like are adjusted so that the backlight detection chip is not located on the connection line between the light emitting chip 310 and the light receiving chip 320, so as to facilitate the arrangement of the backlight detection chip, such as reducing the limitation of the assembly space on the selection of the backlight detection chip.

Fig. 22 is a perspective view one of yet another lens assembly provided in accordance with some embodiments of the present disclosure, fig. 23 is a perspective view two of yet another lens assembly provided in accordance with some embodiments of the present disclosure, and fig. 24 is a cross-sectional view one of yet another lens assembly provided in accordance with some examples of the present disclosure. In some embodiments, as shown in fig. 22 and 23, the bottom of the second groove 432 forms a second optical surface 4321, a fifth optical surface 4322, and a sixth optical surface 4323, the second optical surface 4321 and the fifth optical surface 4322 do not intersect within the second groove 432, i.e., the intersection of the second optical surface 4321 and the fifth optical surface 4322 is not within the second groove 432.

The second groove 432 has a first plane 4325 formed therein, the first plane 4325 is perpendicular to the optical axis of the light emitting chip 310, the second optical surface 4321 is located on one side of the first plane 4325, the fifth optical surface 4322 is located on the other side of the first plane 4325, and the second optical surface 4321 and the fifth optical surface 4322 are not symmetrical about the central axis of the first plane 4325.

Fig. 25 is a third perspective view of yet another lens assembly provided in accordance with some embodiments of the present disclosure, fig. 26 is a partial enlarged view at O in fig. 25, fig. 27 is a second cross-sectional view of yet another lens assembly provided in accordance with some embodiments of the present disclosure, and fig. 28 is a partial enlarged view at P in fig. 27. As shown in fig. 25-28, a twelfth optical surface 456 is formed on a side of the seventh optical surface 451 near the front end of the lens assembly 400, the twelfth optical surface 456 being located below the second optical surface 4321, the twelfth optical surface 456 being for refracting the transmitted light signal. Illustratively, the twelfth optical surface 456 refracts the optical signal for monitoring the optical power emitted by the light emitting chip such that the optical axis of the optical signal for monitoring the optical power emitted by the light emitting chip is offset from the optical axis of the light emitting chip 310. In some embodiments, a twelfth optical surface 456 is formed on a bottom surface of the twelfth optical surface 456.

Fig. 29 is a third cross-sectional view of yet another lens assembly provided in accordance with some embodiments of the present disclosure, fig. 30 is a fourth cross-sectional view of yet another lens assembly provided in accordance with some embodiments of the present disclosure, fig. 31 is a fifth cross-sectional view of yet another lens assembly provided in accordance with some embodiments of the present disclosure, and fig. 29-31 illustrate a transmission optical path of yet another lens assembly 400. As shown in fig. 29 and 30, the emitted light signal generated by the light emitting chip 310 is transmitted to the third lens 4511, collimated by the third lens 4511, transmitted to the second optical surface 4321, and reflected by the second optical surface 4321 to the fifth optical surface 4322; the emitted light signal transmitted to the fifth optical surface 4322 is partially transmitted through the fifth optical surface 4322 and partially reflected by the fifth optical surface 4322; the light emitted through the fifth optical surface 4322 is transmitted to the sixth optical surface 4323, passes through the sixth optical surface 4323 and passes through the sixth optical surface 4323, and the light emitted through the sixth optical surface 4323 is transmitted to the first optical surface 4311 and finally is reflected by the first optical surface 4311. The optical signal reflected by the fifth optical surface 4322 is transmitted to the second optical surface 4321, reflected by the second optical surface 4321, transmitted to the twelfth optical surface 456, and transmitted to the backlight detection chip through the twelfth optical surface 456.

As shown in fig. 29 and 31, the received optical signal is transmitted to the third optical surface 4331, reflected by the third optical surface 4331, transmitted to the fourth optical surface 4341, reflected by the fourth optical surface 4341, transmitted to the eighth optical surface 452, and converged and transmitted to the light receiving chip 320 via the fourth lens 4521.

Fig. 32 is a bottom view of yet another lens assembly use provided in accordance with some embodiments of the present disclosure. As shown in fig. 32, a third backlight detecting chip 360 is further disposed below the lens assembly 400, the third backlight detecting chip 360 is disposed on the right side of the light emitting chip 310, and the third backlight detecting chip 360 is located below the twelfth optical surface 456, and the third backlight detecting chip 360 is closer to the light port of the light module 200 than the light emitting chip 310. The third backlight detecting chip 360 is not located on the connection line between the light emitting chip 310 and the light receiving chip 320, so that the third backlight detecting chip 360 is far away from the driving chip 330, and the arrangement of the third backlight detecting chip 360 interfering with the layout of the driving chip 330 is effectively avoided, or the driving chip 330 interfering with the layout of the third backlight detecting chip 360 is effectively avoided. If the size of the third backlight detecting chip 360 is selected to be relatively larger, the third backlight detecting chip 360 is disposed at the light emitting chip 310, so that the assembly interference of the third backlight detecting chip 360 and the driving chip 330 can be avoided.

Fig. 33 is a bottom view of a second lens assembly according to still another embodiment of the present disclosure. As shown in fig. 33, in some embodiments, a fourth backlight detection chip 370 is further disposed below the lens assembly 400, the fourth backlight detection chip 370 is disposed on a diagonally opposite side of the light emitting chip 310, away from the light receiving chip 320, and the fourth backlight detection chip 370 is located below the twelfth optical surface 456, the fourth backlight detection chip 370 being closer to the light port of the light module 200 than the light emitting chip 310. The fourth backlight detection chip 370 is not located on the connection line between the light emitting chip 310 and the light receiving chip 320, so that the fourth backlight detection chip 370 is far away from the driving chip 330, and the arrangement of the fourth backlight detection chip 370 or the arrangement of the driving chip 330 interfering with the driving chip 330 is effectively avoided.

In the optical module provided in some embodiments of the present disclosure, the arrangement of the light emitting chip 310 and the light receiving chip 320 between the optical axis of the first optical fiber adapter 410 and the optical axis of the second optical fiber adapter 420 is achieved by the lens assembly 400, so that the light emitting chip 310 and the light receiving chip 320 can be brought close to each other, and so that the light emitting chip 310 and the light receiving chip 320 share the driving chip 330.

Finally, it should be noted that: the above embodiments are merely for illustrating the technical solution of the present disclosure, and are not limiting thereof; although the present disclosure has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.

Claims

1. An optical module, comprising:

a circuit board, the surface of which is provided with a light emitting chip and a light receiving chip;

2. The light module of claim 1 wherein the top of the lens assembly body is formed with a first recess, the bottom of the first recess being formed with a first groove and a second groove;

the first optical surface is formed on the side wall of the first groove, and the second optical surface is formed at the bottom of the second groove.

3. The optical module of claim 2, wherein a bottom of the second groove is further formed with a fifth optical surface, and a sixth optical surface is formed on a sidewall of the second groove; the fifth optical surface and the sixth optical surface are positioned between the first optical surface and the second optical surface, and the light signals transmitted through the fifth optical surface are transmitted to the sixth optical surface, and the light signals transmitted through the sixth optical surface are transmitted to the first optical surface.

4. The light module of claim 2 wherein a bottom of the lens assembly body is formed with a second recess, a top surface of the second recess being formed with a seventh optical surface, the seventh optical surface being located above the light emitting chip and below the second optical surface;

and a third lens is arranged on the seventh optical surface and is used for collimating the emitted light signals generated by the light emitting chip.

5. A light module as recited in claim 3, wherein a first backlight detection chip is further provided on a surface of the circuit board, the first backlight detection chip being located between the light emitting chip and the light receiving chip;

a ninth optical surface is formed at the bottom of the lens assembly body, the ninth optical surface is located above the first backlight detection chip, the fifth optical surface is further used for reflecting part of the emitted light signals, and the emitted light signals reflected by the fifth optical surface are transmitted to the ninth optical surface;

and a fifth lens is arranged on the ninth optical surface and is used for converging and emitting optical signals to the first backlight detection chip.

6. A light module as recited in claim 3, wherein a second backlight detection chip is further provided on a surface of the circuit board, the second backlight detection chip being located on a side of the light emission chip remote from the light reception chip;

A tenth optical surface is formed at the bottom of the lens assembly body, and the tenth optical surface is positioned above the second backlight detection chip;

the sixth optical surface is further configured to reflect a portion of the emitted light signal, where the emitted light signal reflected by the sixth optical surface is transmitted to the fifth optical surface and transmitted through the fifth optical surface, and the light signal transmitted through the fifth optical surface is transmitted to the second optical surface and transmitted to the tenth optical surface by being reflected by the second optical surface and transmitted to the second backlight detection chip by being transmitted through the tenth optical surface.

7. The optical module of claim 1, wherein an eleventh optical surface is formed on the lens assembly body, the eleventh optical surface facing the second fiber optic adapter and the light receiving chip.

8. An optical module, comprising:

9. The light module of claim 8 wherein the top of the lens assembly body is formed with a first recess, the bottom of the first recess being formed with a third recess and a fourth recess;

forming the third optical surface on the side wall of the third groove; a fourth optical surface is formed on a wall of the fourth groove.

10. The light module of claim 9 wherein the bottom of the lens assembly body is provided with an eighth optical surface that is above the light receiving chip and below the fourth optical surface;

And a fourth lens is arranged on the eighth optical surface, and the fourth lens converges received light signals to the light receiving chip.