CN117110177A - Burn-in test system and method for thermal interface material, and electronic component inspection apparatus provided with the system - Google Patents
Burn-in test system and method for thermal interface material, and electronic component inspection apparatus provided with the system Download PDFInfo
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- CN117110177A CN117110177A CN202210534072.9A CN202210534072A CN117110177A CN 117110177 A CN117110177 A CN 117110177A CN 202210534072 A CN202210534072 A CN 202210534072A CN 117110177 A CN117110177 A CN 117110177A
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- 239000000463 material Substances 0.000 title claims abstract description 90
- 238000012360 testing method Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims description 11
- 238000007689 inspection Methods 0.000 title claims description 9
- 230000032683 aging Effects 0.000 claims abstract description 13
- 238000001514 detection method Methods 0.000 claims abstract description 7
- 238000010998 test method Methods 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims description 20
- 230000001052 transient effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 9
- 239000000523 sample Substances 0.000 description 4
- 238000004643 material aging Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012782 phase change material Substances 0.000 description 2
- 238000004154 testing of material Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000036413 temperature sense Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N17/00—Investigating resistance of materials to the weather, to corrosion, or to light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/18—Investigating or analyzing materials by the use of thermal means by investigating thermal conductivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Ecology (AREA)
- Biodiversity & Conservation Biology (AREA)
- Environmental Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a burn-in test system and a test method of a thermal interface material and an electronic component detection device with the system, wherein a controller controls a movable carrier to approach a high-temperature generation device and enables the thermal interface material on the movable carrier to contact the high-temperature generation device; the controller also controls the temperature sensor to measure the temperature of the thermal interface material; the controller compares the output temperature data of the high temperature generating device with the measured temperature data sensed by the temperature sensor. According to the invention, the thermal interface material is contacted with the high-temperature generating device, and the temperature state of the contacted thermal interface material is measured, so that the heat conduction performance of the thermal interface material is obtained, the quality and performance aging state of the thermal interface material are judged in real time, and the thermal interface material can be used as a reference basis for selecting the thermal interface material or replacing new products.
Description
Technical Field
The present invention relates to a burn-in system and method for thermal interface materials, and more particularly to an accessory system for an electronic component inspection apparatus.
Background
The electronic components must be functionally tested during the manufacturing process or before shipment to eliminate defective products. Please refer to fig. 1, which is a schematic diagram of a conventional electronic device testing apparatus; as shown, the DUT is accommodated in the die holder 92, and the upper and lower indenters 91 press against the DUT to ensure that the DUT can fully contact the contacts (not shown) in the die holder 92.
Furthermore, a temperature control unit TCU is arranged in the lower pressure head 91, which can heat or cool the chip DUT to be tested; for example, when performing high-temperature or low-temperature test, the temperature control unit TCU may start the test after the temperature of the chip DUT to be tested is raised to a specific high temperature or lowered to a specific low temperature. On the other hand, if normal temperature testing is performed, the temperature control unit TCU of the lower pressure head 91 may also perform heat removal to ensure the operation performance of the chip DUT to be tested because the chip DUT to be tested will generate heat during the testing process.
However, since both the upper surface of the chip DUT to be tested and the lower surface of the lower indenter 91 are rigid surfaces and these surfaces are rough surfaces in terms of microcosmic view, when the two surfaces are brought into contact with each other, it is impossible to completely contact and fit together, and it is inevitable that some air gaps are interposed therebetween, and the thermal conductivity of air is very small, only 0.024W/(m·k), thus resulting in a relatively large thermal contact resistance. Therefore, the conventional technology is to dispose the heat transfer interface material 93 on the lower surface of the lower ram 91, thereby filling the air gap, so that the contact thermal resistance can be reduced and the heat transfer performance can be improved.
However, after a period of use, the heat conduction performance of the heat transfer interface material 93 will decline, so as to affect the temperature control or heat removal effect, resulting in too high temperature of the chip DUT to be tested, resulting in test failure and affecting the test yield. However, there is no related mechanism in the prior art to detect the heat conduction performance of the heat transfer interface material 93, and it is usually not until the DUT to be tested is continuously judged to be defective due to high temperature, but is found when the misjudgment cause is found, and the aged heat transfer interface material 93 is replaced. However, when this occurs, not only the test yield is affected, but also the machine efficiency is affected by the downtime to inspect and replace the heat transfer interface material 93.
Disclosure of Invention
The invention mainly aims to provide a thermal interface material aging test system, a thermal interface material aging test method and electronic component detection equipment with the thermal interface material aging test system, so that performance of the thermal interface material can be monitored, the aging state of the thermal interface material can be known in advance, early warning and replacement can be performed in advance, and the detection yield and the operation efficiency of the equipment are improved.
In order to achieve the above objective, the present invention provides a burn-in test system for a thermal interface material, wherein the thermal interface material is disposed on a movable carrier, and the system mainly comprises a high temperature generating device, at least one temperature sensor and a controller; the high temperature generating device is controlled to output steady-state temperature or instantaneous temperature change as output temperature data; the temperature sensor is arranged on the movable carrier and is used for detecting temperature in a controlled manner to be used as measured temperature data; the controller is electrically connected with the movable carrier, the high-temperature generating device and the temperature sensor; wherein the controller controls the movable carrier to approach the high temperature generating device and enables the thermal interface material to contact the high temperature generating device; the controller controls the temperature sensor to sense the temperature of the thermal interface material; the controller compares the output temperature data of the high temperature generating device with the measured temperature data sensed by the temperature sensor.
According to the aging test system for the thermal interface material, the thermal interface material is contacted with the high-temperature generating device, and the temperature state of the contacted thermal interface material is measured, so that the heat conduction performance of the thermal interface material is obtained, and the quality and the performance aging state of the thermal interface material are judged in real time and used as a reference basis for selecting the thermal interface material or replacing a new product.
In order to achieve the above-mentioned purpose, the present invention provides an electronic component inspection apparatus, which mainly includes a pressing head, a high temperature generating device, at least one temperature sensor, a test seat and a controller; the pressure measuring head comprises a thermal interface material; the high-temperature generating device is controlled to output steady-state temperature or instantaneous temperature change as output temperature data; the temperature sensor is arranged on the pressure measuring head and is controlled to detect temperature to be used as measured temperature data; the test seat is used for accommodating electronic components to be tested; the controller is electrically connected with the pressure measuring head, the high temperature generating device, the temperature sensor and the test seat; the controller controls the pressure measuring head to approach the high-temperature generating device and enables the thermal interface material to contact the high-temperature generating device, and the controller controls the temperature sensor to sense the temperature of the thermal interface material; the controller compares the output temperature data of the high temperature generating device with the measured temperature data sensed by the temperature sensor.
Therefore, the electronic component detection equipment provided by the invention is provided with the detection mechanism of the ageing state of the thermal interface material, so that the heat conduction performance of the thermal interface material can be timely known, and when the performance of the thermal interface material is low, early warning can be performed in advance, so that the thermal interface material can be replaced in real time, and the detection yield and the operation efficiency of the equipment can be improved.
In order to achieve the above-mentioned object, the present invention provides a burn-in test method for thermal interface material, comprising the steps of: firstly, a controller controls the movable carrier to approach a high-temperature generating device, and enables a thermal interface material on the movable carrier to contact the high-temperature generating device; wherein, the high temperature generating device outputs steady-state temperature or instantaneous temperature change in a controlled way to be used as output temperature data; then, the controller controls a temperature sensor on the movable carrier to sense the temperature of the thermal interface material and output measured temperature data; then, the controller compares the output temperature data of the high temperature generating device with the measured temperature data sensed by the temperature sensor.
Accordingly, the aging test method of the thermal interface material provides an unprecedented method, which can quickly and effectively acquire the heat conduction performance or aging state of the thermal interface material, so as to avoid selecting the thermal interface material with poor performance and effectively avoid damaging electronic components or devices caused by the deterioration of the heat conduction performance of the thermal interface material.
Drawings
Fig. 1 is a schematic diagram of a conventional electronic component testing apparatus.
Fig. 2 is a device architecture diagram of a first embodiment of the present invention.
Fig. 3A to 3B are schematic diagrams illustrating a thermal interface material testing process according to a first embodiment of the present invention.
Fig. 4A to 4C are schematic diagrams of an electronic component testing process according to a first embodiment of the present invention.
Fig. 5 is a temperature-time variation relationship diagram of output temperature data and measured temperature data of a second embodiment of the present invention.
Fig. 6 is a schematic view of an apparatus according to a third embodiment of the present invention.
Detailed Description
Before the burn-in test system, the test method, and the electronic component inspection apparatus having the same of the present invention are described in detail in this embodiment, it should be noted that in the following description, like components will be denoted by the same reference numerals. Furthermore, the figures of the present invention are merely schematic illustrations that are not necessarily to scale, and all details are not necessarily presented in the figures.
The following embodiments are described in terms of a press testing apparatus, i.e., a press head continuously presses a workpiece to be tested (device under test, DUT) from above during a test process, so as to ensure that the workpiece to be tested can be electrically contacted with probes in a test socket completely, and the press head can also regulate and control the temperature of the workpiece to be tested or remove heat. However, it should be specifically noted that the present invention is not limited to the pressure measuring apparatus, and any apparatus or device having a requirement for measuring the aging degree of the thermal interface material may be applied to the present invention.
Referring to fig. 2, fig. 3A and fig. 3B, fig. 2 is a schematic diagram of an apparatus structure according to a first embodiment of the present invention, and fig. 3A to fig. 3B are schematic diagrams of a thermal interface material testing flow according to a first embodiment of the present invention; as shown in the figure, the apparatus of the present embodiment mainly includes a movable carrier 2, a high temperature generating device 3, a temperature sensor 4, a controller 5, a test seat 6, and a transfer shuttle 7; in this case, the movable carrier 2, in the present exemplary embodiment the pressure probe 20, is provided with a thermal interface material 1 on its lower surface, i.e. the surface for contacting the electronic component C to be tested.
Common thermal interface materials 1 include: a heat sink pad (thermal pad), a phase change material (Phase change material), a phase change metal sheet (Phase change metal alloy), a heat conductive paste (Thermal conductive adhesive), and a silicone grease (thermal grease); in the present embodiment, since the thermal interface material 1 must frequently contact the electronic component C to be tested, a phase change metal sheet, such as an indium sheet, is used. The pressure probe 20 is internally provided with a temperature sensor 4. In general, the temperature sensor 4 may be used to measure the temperature of the electronic component C to be tested, and when the degree of aging of the thermal interface material 1 is to be detected, may be used to measure the temperature of the thermal interface material 1.
In addition, a test seat 6 is disposed below the pressing head 20, and is used for accommodating the electronic component C to be tested and testing the electronic component C to be tested. The high temperature generator 3 of the present embodiment is a heater, which is disposed on the transfer shuttle 7, and the output temperature sensor 31 for detecting the real-time temperature of the high temperature generator 3 is disposed in the high temperature generator 3. In addition, the transfer shuttle 7 is controlled by the controller 5 to slidably move between the pressing head 20 and the test seat 6 or away from the pressing head 20 and the test seat 6. In addition, the transfer shuttle 7 is additionally provided with a chip holder 71 to be tested and a chip holder 72 to be tested, the chip holder 71 to be tested is used for loading the electronic component C to be tested which is not yet tested, and the chip holder 72 to be tested is used for loading the electronic component which is tested.
Referring to fig. 3A and fig. 3B, a flow of testing a thermal interface material according to a first embodiment of the present invention is described below; first, the high temperature generating device 3 is heated to a preset first steady-state temperature T1, for example, 60 ℃, before the test starts, and the first steady-state temperature T1 is used as output temperature data. At the beginning of the test, the controller 5 controls the transfer shuttle 7 to slide and move between the pressing head 20 and the controller 5, and the thermal interface material 1 below the pressing head 20 is positioned on the high temperature generating device 3. Next, the controller 5 controls the pressing head 20 to descend to approach the high temperature generating device 3, so that the thermal interface material 1 contacts the high temperature generating device 3, as shown in fig. 3B.
At this time, the controller 5 controls the temperature sensor 4 on the pressure probe 20 to temperature-sense the thermal interface material 1 and output the second steady-state temperature T2, that is, measured temperature data. Finally, after the controller 5 receives the second steady-state temperature T2, the controller 5 compares the first steady-state temperature T1 with the second steady-state temperature T2; if the difference (delta T) between the first stable temperature T1 and the second stable temperature T2 is greater than or equal to 5 ℃, the controller 5 outputs a warning signal to inform the field personnel to replace.
Because, when contacting the high temperature generating device 3, the interface material 1 with good heat conduction performance should be heated to 60 ℃ or slightly lower than 60 ℃; if the temperature difference between the two side surfaces of the thermal interface material 1 for contacting the high temperature generating device 3 and the temperature sensor 4 is too large, the thermal resistance of the thermal interface material 1 is too large, so that the thermal conduction efficiency of the thermal interface material 1 is seriously degraded, and the thermal interface material is easy to cause test failure and should be replaced.
As can be seen from the above, the present embodiment provides a quite effective and quite simple aging testing mechanism for thermal interface materials with low cost, so that the problem of influencing the testing yield due to the testing failure caused by the performance degradation of the thermal interface material 1 can be completely avoided by detecting the aging degree of the thermal interface material in advance before the equipment starts the testing; the problem that the use efficiency of the machine is affected in order to check and replace the equipment stop caused by the hot interface material 1 in the test process can be avoided.
Referring to fig. 4A to 4C, the flow chart of the electronic component testing according to the first embodiment of the invention is shown; the operation of the electronic component inspection apparatus according to the first embodiment of the present invention will be briefly described below. When the thermal interface material 1 is tested, the controller 5 judges that the thermal interface material 1 does not need to be replaced; the test of the electronic component C to be tested can be started. First, the transfer shuttle 7 is controlled by the controller 5, and is slid between the pressing head 20 and the controller 5, and the pressing head 20 descends to suck the electronic component C to be tested from the chip carrier 71 to be tested, as shown in fig. 4A.
After the pressing head 20 obtains the electronic component to be tested, the pressing head 20 is lifted, and the transfer shuttle 7 is controlled to be far away from the pressing head 20 and the test seat 6. Then, the pressing head 20 descends and the electronic component C to be tested is placed in the test seat 6, so that the test can be performed, as shown in fig. 4B. When the test is completed, the pressing head 20 is lifted with the electronic component C to be tested, and the transferring shuttle 7 is moved in again to be located between the pressing head 20 and the controller 5, and the pressing head 20 is lowered with the electronic component C to be tested and is placed into the test chip holder 72, so as to complete the whole test flow, as shown in fig. 4C.
Please refer to fig. 5, which is a temperature-time variation graph of output temperature data and measured temperature data according to a second embodiment of the present invention; in the foregoing first embodiment, the target of the comparison by the controller 5 is two steady-state temperatures, that is, the steady-state temperature of the output of the high-temperature generating device 3 is maintained at 60 ℃; and the result measured by the temperature sensor 4 is also a steady-state temperature. On the other hand, the target of the comparison by the controller 5 in the second embodiment is the instantaneous temperature change.
Further, the controller 5 controls the high temperature generating device 3 to generate a transient temperature change during a time period after the thermal interface material 1 contacts the high temperature generating device 3; for example, the controller 5 controls the input of a current spike to the high temperature generating device 3 such that the high temperature generating device 3 generates an instantaneous temperature change during the period of the time period, as shown by an output temperature profile L1 in fig. 5. On the other hand, the controller 5 controls the temperature sensor 4 to sense the temperature of the thermal interface material 1 during the same time period and outputs a measured temperature change as the measured temperature data, that is, a measured temperature curve L2 as shown in fig. 5.
However, as shown in fig. 5, in both the output temperature curve L1 and the measured temperature curve L2, there is a small drop in the slope of the temperature rise line, the slope of the temperature fall line, the highest temperature, and the like, and therefore it can be judged that the thermal interface material 1 has aged seriously and must be replaced. Accordingly, the testing method provided by the second embodiment can more clearly see various performance data of the thermal interface material 1, such as heat transfer efficiency, limiting temperature, and the like.
Please refer to fig. 6, which is a schematic diagram of an apparatus according to a third embodiment of the present invention; the main difference between the third embodiment and the second embodiment is that the transfer shuttle 7 is eliminated and the presser head 20 can move in three dimensions. Further, as shown in fig. 6, the high temperature generating device 3 may be disposed at one side of the test seat 6 or other suitable place, and when the aging degree of the thermal interface material 1 is to be tested, the pressing head 20 may be moved above the high temperature generating device 3 first, and then lowered to contact the high temperature generating device 3, so as to perform the test. On the other hand, when the electronic component is to be tested, the pressing head 20 may be moved to a tray (tray) or a temperature control platform TP to obtain the electronic component C to be tested, and then transferred to the test seat 6 for testing. In short, the invention is also applicable to a movable carrier 2 that can be moved in three dimensions.
The above-described embodiments are provided for convenience of explanation only, and the scope of the invention claimed should be construed as limited only by the claims.
[ reference numerals description ]
1 thermal interface material
2 removable carrier
3 high temperature generating device
4 temperature sensor
5 controller
6 test seat
7 transfer shuttle car
20 pressure measuring head
31 output temperature sensor
71 chip holder to be tested
72, finishing testing chip holder
91 lower pressure head
92 chip holder
93 thermal interface material
C: electronic component to be tested
DUT chip to be tested
L1 output temperature Curve
L2 measuring temperature curve
TCU (thermal control unit)
T1 first steady-state temperature
T2 second steady-state temperature
TP, temperature control platform.
Claims (10)
1. A burn-in system for a thermal interface material disposed on a movable carrier, the system comprising:
a high temperature generating device that outputs a steady-state temperature or a transient temperature change as output temperature data;
at least one temperature sensor arranged on the movable carrier, wherein the at least one temperature sensor is used for controllably detecting temperature to be used as measured temperature data; and
a controller electrically connected to the movable carrier, the high temperature generating device and the at least one temperature sensor;
wherein the controller controls the movable carrier to approach the high temperature generating device and enables the thermal interface material to contact the high temperature generating device; the controller controls the at least one temperature sensor to sense the temperature of the thermal interface material; the controller compares the output temperature data of the high temperature generating device with the measured temperature data sensed by the at least one temperature sensor.
2. The burn-in system of claim 1, wherein the controller controls the high temperature generating device to output a first steady-state temperature, the output temperature data comprising the first steady-state temperature; the at least one temperature sensor sensing a temperature of the thermal interface material as a second steady-state temperature, the measured temperature data comprising the second steady-state temperature; the controller compares the first stable temperature with the second stable temperature, and when the difference between the first stable temperature and the second stable temperature is greater than or equal to 5 ℃, the controller outputs a warning signal.
3. The burn-in system of claim 1, wherein the controller controls the high temperature generating device to generate an instantaneous temperature change during a time period after the thermal interface material contacts the high temperature generating device, the output temperature data comprising the instantaneous temperature change generated by the high temperature generating device during the time period; the measured temperature data includes measured temperature changes sensed by the at least one temperature sensor during the time period.
4. The burn-in system of claim 3, wherein the controller controls the input of the current spike to the thermal interface material to cause the thermal interface material to generate the transient temperature change during the time period after the thermal interface material contacts the thermal interface material.
5. An electronic component inspection apparatus, comprising:
a press head comprising a thermal interface material;
a high temperature generating device that outputs a steady-state temperature or a transient temperature change as output temperature data;
at least one temperature sensor arranged on the pressure measuring head, wherein the at least one temperature sensor is used for controlling the detection temperature to be used as measured temperature data;
a test socket for accommodating an electronic component to be tested; and
the controller is electrically connected with the pressure measuring head, the high-temperature generating device, the at least one temperature sensor and the test seat;
the controller controls the pressure measuring head to approach the high-temperature generating device and enables the thermal interface material to contact the high-temperature generating device, and controls the at least one temperature sensor to sense the temperature of the thermal interface material; the controller compares the output temperature data of the high temperature generating device with the measured temperature data sensed by the at least one temperature sensor.
6. The electronic component inspection apparatus according to claim 5, further comprising a transfer shuttle on which the high temperature generating device is disposed, the transfer shuttle being electrically connected to the controller and controlled to move between or away from the pressing head and the test socket.
7. The electronic component inspection apparatus according to claim 5, wherein the high temperature generating device is disposed at one side of the test socket, and the pressing head is controlled to move to selectively contact the high temperature generating device or the test socket.
8. A method of burn-in testing a thermal interface material comprising the steps of:
(A) The controller controls the movable carrier to approach the high-temperature generating device and enables the thermal interface material on the movable carrier to contact the high-temperature generating device; the high temperature generating device is controlled to output steady-state temperature or instantaneous temperature change as output temperature data;
(B) The controller controls at least one temperature sensor on the movable carrier to sense the temperature of the thermal interface material and output measured temperature data; and
(C) The controller compares the output temperature data of the high temperature generating device with the measured temperature data sensed by the at least one temperature sensor.
9. The burn-in method of claim 8, wherein in said step (a), said controller controls said high temperature generating means to output a first steady-state temperature, said output temperature data comprising said first steady-state temperature; in the step (B), the at least one temperature sensor senses that the temperature of the thermal interface material is a second steady-state temperature, the measured temperature data including the second steady-state temperature; in the step (C), the controller compares the first steady-state temperature with the second steady-state temperature, and outputs a warning signal when the difference between the first steady-state temperature and the second steady-state temperature is greater than or equal to 5 ℃.
10. The aging test method of thermal interface material according to claim 8, wherein in the step (a), the controller controls the high temperature generating device to generate an instantaneous temperature change during a time period after the thermal interface material contacts the high temperature generating device, the output temperature data including the instantaneous temperature change generated by the high temperature generating device during the time period; in the step (B), the controller controls the at least one temperature sensor to sense the temperature of the thermal interface material during the period of time and outputs a measured temperature change as the measured temperature data.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210534072.9A CN117110177A (en) | 2022-05-17 | 2022-05-17 | Burn-in test system and method for thermal interface material, and electronic component inspection apparatus provided with the system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210534072.9A CN117110177A (en) | 2022-05-17 | 2022-05-17 | Burn-in test system and method for thermal interface material, and electronic component inspection apparatus provided with the system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117110177A true CN117110177A (en) | 2023-11-24 |
Family
ID=88806144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210534072.9A Pending CN117110177A (en) | 2022-05-17 | 2022-05-17 | Burn-in test system and method for thermal interface material, and electronic component inspection apparatus provided with the system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117110177A (en) |
-
2022
- 2022-05-17 CN CN202210534072.9A patent/CN117110177A/en active Pending
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