CN117102697B - PCB (printed circuit board) segmentation sampling device and method - Google Patents
PCB (printed circuit board) segmentation sampling device and method Download PDFInfo
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- CN117102697B CN117102697B CN202311280148.0A CN202311280148A CN117102697B CN 117102697 B CN117102697 B CN 117102697B CN 202311280148 A CN202311280148 A CN 202311280148A CN 117102697 B CN117102697 B CN 117102697B
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- 238000005070 sampling Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims abstract description 17
- 230000011218 segmentation Effects 0.000 title claims description 9
- 238000005520 cutting process Methods 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims description 15
- 239000000725 suspension Substances 0.000 claims description 8
- 230000003044 adaptive effect Effects 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 4
- 244000126211 Hericium coralloides Species 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000003698 laser cutting Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
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- Plasma & Fusion (AREA)
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Abstract
The invention discloses a PCB dividing and sampling device and a method, wherein the device comprises the following steps: laser head, industrial robot, needle saddle and self-adaptation fixture, self-adaptation fixture is including setting up four anchor clamps at the four sides of needle saddle respectively, and every anchor clamps all have the executive part of broach form, and every two anchor clamps centre gripping PCB board respectively are opposite each other on one side to make the four sides of PCB board all by the centre gripping, wherein, at least three anchor clamps can be along the direction removal of perpendicular to needle saddle, when so that each other removal direction vertically anchor clamps order remove, the terminal each other of tooth does not collide. Through the device, the staff only needs to place the PCB board in the one corner of needle type saddle roughly squarely, and self-adaptation fixture can automatic centre gripping and location PCB board, need not artifical alignment, correction and clamping to when carrying out the cutting sample to the PCB board of different specifications, need not to change the tool that corresponds, thereby improved the efficiency of taking a sample.
Description
Technical Field
The invention relates to the field of laser cutting machines, in particular to a PCB (printed circuit board) dividing and sampling device.
The invention also relates to a PCB segmentation sampling method.
Background
As the appearance of the PCB is more and more diversified, the scanning pattern and the PCB cutting path are positioned in a preview mode by conventional laser cutting, and the method is complex in operation, high in requirement on the fixture and high in production efficiency.
In the case of mass production and proofing, it is necessary to rapidly detect the quality of the inner layer of the PCB, and thus it is required to obtain a sliced PCB with high efficiency, and it is required to increase the cutting speed of the sample of the PCB.
Disclosure of Invention
The invention aims to provide a PCB dividing and sampling device and a PCB dividing and sampling method, which are used for solving the technical problem that when a laser cutting machine is used for preparing a PCB sample, a complex fixture is required to be used, and the cutting efficiency is affected.
In order to solve the technical problems, the invention specifically provides the following technical scheme:
the application provides a sampling device is cut apart to PCB, include: the device comprises a laser head, an industrial robot, a needle type supporting table and a self-adaptive clamping mechanism; the laser head is fixedly arranged on the execution part of the industrial robot and is suspended right above the needle type supporting table so as to cut a PCB board placed on the needle type supporting table by laser; the self-adaptive clamping mechanism is arranged at the side of the needle type supporting table so as to clamp and fix the PCB placed on the needle type supporting table; the needle type pallet comprises a plurality of ejector pins which are vertically arranged upwards and are distributed in a rectangular array, and the top ends of the ejector pins are located at the same height; the self-adaptive clamping mechanism comprises four sides which are respectively arranged on the needle type saddle: the width of each tooth is smaller than the gap between two adjacent thimbles, so that each tooth can horizontally move between the two adjacent thimbles to pass through the needle type supporting platform; each two clamps respectively clamp one opposite side of the PCB so that four sides of the PCB are clamped; wherein at least three jigs are movable in a direction perpendicular to the pin pallets so that the ends of each tooth do not collide with each other when the jigs, which are perpendicular to each other in the moving direction, are sequentially moved.
Further, the jig includes: the clamping device comprises a clamp seat, a clamp suspension rod and a clamping head; the fixture hanging rods are identical in number and in one-to-one correspondence with the clamping heads, one clamping head is mounted at one end of each clamping hanging rod, the other end of each clamping hanging rod is connected with the fixture seat, the fixture seat is perpendicular to the clamping hanging rods, the clamping hanging rods are distributed in a comb-tooth shape on the fixture seat, and the widths of the clamping hanging rods and the clamping heads are smaller than the gaps between the adjacent ejector pins.
Further, the clamping head includes: the bottom plate, the connecting plate, the top plate and the elastic pressing plate; the bottom plate with the roof all levels set up, connecting plate fixed connection the bottom plate with the roof, the one end of elastic pressing plate with roof fixed connection, the other end of elastic pressing plate is close to the bottom plate, the top wall of bottom plate highly with the height on top of thimble is the same.
Further, the free ends of the elastic pressing plates are bent in a direction away from the bottom plate.
Further, the self-adaptive clamping mechanism comprises four sides which are respectively arranged on the needle type saddle and are perpendicular to the needle type saddle: a first direction clamp, a second direction clamp, a third direction clamp, and a fourth direction clamp; the first direction clamp is connected with the rack through a first linear driver and is used for clamping a first edge of the PCB, and the driving direction of the first linear driver is perpendicular to the first edge; the second direction clamp is connected with the rack through a second linear driver and is used for clamping a second edge of the PCB, the first edge and the second edge are parallel to each other, and the driving direction of the second linear driver is perpendicular to the second edge; the third direction clamp is connected with the rack through a third linear driver and is used for clamping a third side of the PCB, the first side and the third side are perpendicular to each other, and the driving direction of the third linear driver is perpendicular to the third side; the fourth-direction clamp is fixedly connected with the rack and used for clamping a fourth side of the PCB, and the third side and the fourth side are parallel to each other; the third direction clamp and the second direction clamp are positioned at different heights, and the first linear driver is used for driving the first direction clamp to drive the PCB to move, so that when the second direction clamp clamps the second edge of the PCB, the clamping heads of each second direction clamp are positioned between the clamping heads of two adjacent third direction clamps.
Further, the needle type saddle comprises a rectangular box-shaped body with an opening at the top, and the thimble comprises a plurality of needles sequentially connected from top to bottom: the needle comprises a needle head, an upper needle rod and a lower needle rod, wherein the diameter of the lower needle rod is larger than that of the upper needle rod, and the lower needle rod is detachably connected with the bottom wall of the body.
Further, the PCB dividing and sampling device includes: a machine vision inspection system and/or a displacement sensor; the machine vision detection system is used for photographing the PCB placed on the pin type supporting table to obtain the edge size of the PCB; the displacement sensor is used for detecting the moving distance of the execution parts of the first linear driver and the second linear driver; and further, the method is obtained by calculation of a controller: when the first direction clamp and the second direction clamp the PCB, the first direction clamp needs to move a compensation distance when the second direction clamp avoids a moving path of the third direction clamp.
Further, force feedback sensors are mounted on the first linear driver, the second linear driver and the third linear driver, and the force feedback sensors are used for detecting acting forces fed back to execution parts of the first linear driver, the second linear driver and the third linear driver when the first direction clamp, the second direction clamp and the third direction clamp are in contact and clamp a PCB.
The present application also provides a PCB segmentation sampling method using the claimed PCB segmentation sampling device, the PCB segmentation sampling method comprising the steps of: placing the PCB on one corner of the pin type supporting table so that two sides of one corner of the PCB are respectively close to two clamps which are perpendicular to each other; two clamps with parallel moving directions respectively pass through gaps between two adjacent ejector pins from two directions to clamp two sides of the PCB; the controller judges whether the executing part of the clamp is positioned on the moving path of the rest clamp, if so, the two clamps which work previously are moved so that the two clamps avoid the moving path of the rest clamp; at least one clamp of the remaining two clamps passes through a gap between two adjacent ejector pins to clamp one side of the PCB, and the remaining side of the PCB is clamped by the other clamp.
Further, before cutting the PCB board, the following steps are performed: pre-forming auxiliary lines or auxiliary holes on the PCB, wherein the auxiliary lines or the auxiliary holes are positioned on a cutting path of a sample wafer of the PCB, and the cutting path is in the shape of a rectangular wire frame; the staff inputs the size of the rectangular wire frame in the controller, the controller searches the auxiliary wire or the auxiliary hole through the CCD camera, and a cutting path is generated; the industrial robot drives the laser head to cut the PCB along a cutting path.
Compared with the prior art, the application has the following beneficial effects:
the utility model provides a PCB cuts apart sampling device and method, through the device, the staff only needs place the PCB board in the one corner of needle saddle roughly squarely, and self-adaptation fixture can automatic centre gripping and location PCB board, need not artifical alignment, correction and clamping to when cutting the sample to the PCB board of different specifications, need not to change corresponding tool, thereby improved the efficiency of sampling.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are exemplary only and that other implementations can be obtained from the extensions of the drawings provided without inventive effort.
FIG. 1 is a perspective view of an embodiment of the present invention;
FIG. 2 is a perspective view of a laser head, an industrial robot, and a pin pallet according to an embodiment of the present invention;
FIG. 3 is a perspective view of a needle mount and an adaptive clamping mechanism, and an enlarged view of a partial structure thereof, according to an embodiment of the present invention;
FIG. 4 is a top view of a needle pallet and an adaptive clamping mechanism according to an embodiment of the present invention;
FIG. 5 is an assembly view of a clamp according to an embodiment of the present invention;
FIG. 6 is a side view of a clamp head according to an embodiment of the invention;
reference numerals in the drawings are respectively as follows:
1-a laser head; 2-an industrial robot; 3-needle pallet; 31-body; 32-thimble; 321-a needle; 322-upper needle bar; 323-lower needle bar; 4-a self-adaptive clamping mechanism; 41-a first direction clamp; 411-first linear drive; 42-a second directional clamp; 421-a second linear drive; 43-third direction clamp; 431-third linear drive; 44-fourth direction clamp; 45-a clamp seat; 46-a clamp cantilever; 47-clamping head; 471-bottom plate; 472-connecting plates; 473-a top plate; 474-elastic press plate; 5-a distance sensor; a 6-CCD camera; 7-auxiliary line.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
A PCB dividing and sampling device is provided below, please refer to FIGS. 1-4.
The PCB cuts apart sampling device includes: a laser head 1, an industrial robot 2, a needle type supporting table 3 and an adaptive clamping mechanism 4;
referring to fig. 2, a laser head 1 is fixedly installed at an execution part of an industrial robot 2 and is suspended over a pin type pallet 3 to perform laser cutting on a PCB placed on the pin type pallet 3;
referring to fig. 3 and 4, the adaptive clamping mechanism 4 is disposed beside the pin type supporting platform 3 to clamp and fix the PCB board placed on the pin type supporting platform 3;
wherein,
the pin type supporting platform 3 comprises a plurality of ejector pins 32 which are vertically arranged upwards and are distributed in a rectangular array, and the top ends of the ejector pins 32 are positioned at the same height;
the self-adaptive clamping mechanism 4 comprises four sides respectively arranged on the needle type saddle 3: four clamps, each of which has a comb-shaped executing portion, the width of each tooth is smaller than the gap between two adjacent thimbles 32, so that each tooth can horizontally move between two adjacent thimbles 32 to pass through the needle type pallet 3;
each two clamps respectively clamp one opposite side of the PCB so that four sides of the PCB are clamped;
wherein at least three jigs are movable in a direction perpendicular to the needle mount 3 so that the tips of each tooth do not collide with each other when the jigs, which are perpendicular to each other in the moving direction, are sequentially moved.
Please refer to fig. 5: the fixture comprises: a clamp seat 45, a clamp cantilever 46 and a clamp head 47;
the same and the one-to-one correspondence of the number of the clamp hanging rods 46 and the clamping heads 47 are adopted, one clamping head 47 is arranged at one end of each clamp hanging rod, the other end of each clamp hanging rod is connected with the clamp seat 45, the clamp seat 45 is perpendicular to the clamp hanging rods, the plurality of clamp hanging rods are distributed in a comb-tooth shape on the clamp seat 45, and the widths of the clamp hanging rods and the clamping heads 47 are smaller than the gap between the adjacent ejector pins 32.
The clamp seat 45 is clamped with the clamp hanging rod 46, a groove matched with the clamp hanging rod 46 in shape is formed in the clamp seat 45, and the clamp seat 45 and the clamp hanging rod 46 are connected through bolt fastening.
Please refer to fig. 6: the gripping head 47 comprises: a bottom plate 471, a connecting plate 472, a top plate 473 and an elastic pressing plate 474;
the bottom plate 471 and the top plate 473 are both arranged horizontally, the connecting plate 472 is fixedly connected with the bottom plate 471 and the top plate 473, one end of the elastic pressing plate 474 is fixedly connected with the top plate 473, the other end of the elastic pressing plate 474 is close to the bottom plate 471, and the top wall of the bottom plate 471 is the same as the top end of the ejector pin 32.
The clamping head 47 moves toward the PCB, the bottom wall of the PCB contacts the top wall of the bottom plate 471, and then the top edge of the PCB contacts the bottom wall of the elastic pressing plate 474, and as the PCB gradually goes deep into the clamping head 47, the pressure applied by the elastic pressing plate 474 on the PCB gradually increases, the friction between the PCB and the bottom plate 471 also gradually increases, and the force detected by the force feedback sensor is equal to the friction between the PCB and the bottom plate 471.
Further, in order to avoid the separation of the clamping head 47 from the PCB board, the free end of the elastic pressing plate 474 is too sharp, which results in the top surface of the PCB board being scratched: the free end of the elastic pressing plate 474 is bent in a direction away from the bottom plate 471.
The adaptive clamping mechanism 4 includes four sides respectively provided at the needle mount 3 and each perpendicular to the needle mount 3: a first direction clamp 41, a second direction clamp 42, a third direction clamp 43, and a fourth direction clamp 44;
the first direction clamp 41 is connected to the rack through a first linear driver 411, and is used for clamping a first edge of the PCB board, and the driving direction of the first linear driver 411 is perpendicular to the first edge;
the second direction clamp 42 is connected to the frame through a second linear driver 421 and is used for clamping a second side of the PCB board, the first side and the second side are parallel to each other, and a driving direction of the second linear driver 421 is perpendicular to the second side;
the third direction clamp 43 is connected to the frame through a third linear driver 431, and is used for clamping a third side of the PCB board, the first side and the third side are perpendicular to each other, and the driving direction of the third linear driver 431 is perpendicular to the third side;
the fourth direction clamp 44 is fixedly connected to the frame and is used for clamping a fourth side of the PCB board, the third side and the fourth side being parallel to each other;
the clamp hanging rods 46 of the third direction clamps 43 and the clamp hanging rods 46 of the second direction clamps 42 are located at different heights, and the first linear driver 411 is used for driving the first direction clamps 41 to drive the PCB to move, so that when the second direction clamps 42 clamp the second edge of the PCB, the clamping heads 47 of each second direction clamp 42 are located between the clamping heads 47 of two adjacent third direction clamps 43.
The PCB dividing and sampling device comprises the following operation steps:
placing the PCB board substantially squarely at a corner of the pin header 3 such that both sides of the PCB board are respectively adjacent to the second direction jig 42 and the fourth direction jig 44;
the first linear driver 411 drives the first direction clamp 41 to clamp the PCB and pushes the PCB onto the second direction clamp 42 so that the PCB is clamped by the second direction clamp 42;
the controller calculates the positions of the first and second direction clamps 41 and 42, and then activates the first and second linear drivers 411 and 421 to horizontally move the PCB such that the clamping heads 47 of the first and second direction clamps 41 and 42 avoid the moving track of the clamping heads 47 of the third direction clamps 43;
the third linear driver 431 drives the third direction gripper 43 to grip the PCB and pushes the PCB onto the fourth direction gripper 44 such that the PCB is gripped by the fourth direction gripper 44.
Through the operation steps, the steps of manual alignment, correction and clamping of the PCB are reduced, meanwhile, the step of designing a separate clamp for each specification of PCB and replacing different clamps when different PCB are cut is eliminated, and therefore the efficiency is remarkably improved.
Specifically, please refer to fig. 2:
the industrial robot 2 is a rectangular coordinate system robot of XYZ axes for driving the laser head 1 to move along a cutting path, and a Z axis for driving the laser head 1 to move vertically so that a laser beam is focused on the surface of a PCB board, so that PCB boards of different thicknesses should be used.
In order to realize the above function, the distance sensor 5 is integrated at the side of the laser head 1, and the distance sensor 5 is used for detecting the distance between the PCB and itself, and then the distance that the laser head 1 needs to move along the Z axis when the laser beam is focused on the surface of the PCB is calculated by the controller.
On the other hand:
the pin holder 3 includes a rectangular box-shaped body 31 having an open top, and the ejector pins 32 are magnetically connected to the body 31, so that the damaged ejector pins 32 can be easily replaced.
Specifically, the ejector pin 32 includes, sequentially connected from top to bottom: the needle 321, the upper needle bar 322 and the lower needle bar 323, the diameter of the lower needle bar 323 is larger than that of the upper needle bar 322, and the bottom end of the lower needle bar 323 is embedded with a magnet; the bottom wall of the body 31 is provided with iron blocks distributed in a rectangular array, and the magnets are in adsorption connection with the iron blocks, so that the ejector pins 32 are detachably connected with the body 31.
The needle 321 is spherical, and the needle 321 is made of nylon material, so that the bottom surface of the PCB is prevented from being ground by the needle 321, and the needle 321 is inserted between the needle 321 and the upper needle rod 322, so that the needle 321 is easy to replace.
In order to achieve the design requirement that the first linear driver 411 and the second linear driver 421 automatically move the first direction clamp 41 and the second direction clamp 42 to avoid the movement track of the third direction clamp 43, the following two technical solutions are available.
Scheme one:
the PCB cuts apart sampling device includes: a machine vision inspection system;
the machine vision detection system is used for photographing the PCB placed on the needle type supporting table 3, obtaining the edge size of the PCB, and further obtaining the PCB through calculation of the controller: when the first direction clamp 41 and the second direction clamp 42 clamp the PCB, the first direction clamp 41 needs to be moved by a compensation distance in order to make the second direction clamp 42 avoid the movement path of the third direction clamp 43.
The machine vision detection system comprises a CCD camera 6 arranged right above the needle type supporting table 3, and the CCD camera 6 can be integrated at the side of the laser head 1, so that the laser head 1 can execute automatic cutting operation through the guidance of the CCD camera 6.
The method for identifying and automatically cutting the plastic can be as follows:
s1, presetting the position of a sample on a PCB, and then preforming an auxiliary line 7 or an auxiliary hole on the PCB;
s2a, the auxiliary line 7 comprises at least 4 straight lines, the 4 straight lines are distributed on a virtual rectangular wire frame, the sample wafer is positioned in the rectangular wire frame, and the lines of the auxiliary line 7 can be discontinuous;
s2b, the auxiliary holes comprise at least 8 through holes, the 8 through holes are distributed on a virtual rectangular wire frame, and 2 auxiliary holes are distributed on each wire of the rectangular wire frame;
s3, a worker inputs the size of the rectangular wire frame into the controller, and the controller searches an auxiliary wire 7 or an auxiliary hole through the CCD camera 6 to find the rectangular wire frame which is consistent with the preset size and is formed by the auxiliary wire 7; or finding a rectangular wire frame formed by four wire segments of eight holes which are connected and are consistent with the preset size;
s4, taking the rectangular wire frame as a cutting path, and driving the laser head 1 by the industrial robot 2 to cut the PCB.
The method omits the step of designing a separate cutting program for each specification of PCB, thereby saving time.
Scheme II:
the PCB cuts apart sampling device includes: a displacement sensor;
the displacement sensor is installed on the first and second linear drivers 411 and 421, and is used to detect the moving distance of the execution parts of the first and second linear drivers 411 and 421, so as to calculate the size of the edge of the PCB board, and then, by the controller, calculate: when the first direction clamp 41 and the second direction clamp 42 clamp the PCB, the first direction clamp 41 needs to be moved by a compensation distance in order to make the second direction clamp 42 avoid the movement path of the third direction clamp 43.
After the size of the PCB board is obtained, naturally, the distance between the first direction jigs 41 and the second direction jigs 42 is also obtained.
And can be further deduced: when the first direction gripper 41 is located at the initial position, whether the second direction gripper 42 is located on the moving path of the third direction gripper 43.
And: how much the first direction gripper 41 needs to advance can cause the two-direction gripper to avoid the moving path of the third direction gripper 43.
Further, in order to avoid bending of the PCB caused by overlarge force of the clamp:
force feedback sensors are mounted on the first, second and third linear drivers 411, 421 and 431, respectively, and are used to detect forces fed back to the execution parts of the first, second and third linear drivers 411, 421 and 431 when the first, second and third direction jigs 41, 42 and 43 are in contact and clamp the PCB.
The force feedback sensor may adopt a tension pressure sensor, and the controller determines the time when the first linear driver 411, the second linear driver 421 and the third linear driver 431 stop working according to the feedback signal of the force feedback sensor, so as to avoid bending the PCB board caused by excessive force of the clamp.
The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, the scope of which is defined by the claims. Various modifications and equivalent arrangements of this invention will occur to those skilled in the art, and it is intended to be within the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A PCB dividing and sampling device is characterized in that,
comprising the following steps: the device comprises a laser head (1), an industrial robot (2), a needle type supporting table (3) and an adaptive clamping mechanism (4);
the laser head (1) is fixedly arranged on an executing part of the industrial robot (2) and is suspended right above the needle type supporting table (3) so as to cut a PCB (printed circuit board) placed on the needle type supporting table (3) by laser;
the self-adaptive clamping mechanism (4) is arranged at the side of the needle type supporting table (3) so as to clamp and fix the PCB placed on the needle type supporting table (3);
wherein,
the needle type supporting platform (3) comprises a plurality of thimble (32) which are vertically arranged upwards and are distributed in a rectangular array, and the top ends of the thimble (32) are located at the same height;
the self-adaptive clamping mechanism (4) comprises four sides which are respectively arranged on the needle type saddle (3): four clamps, each of which is provided with a comb-shaped executing part, wherein the width of each tooth is smaller than the gap between two adjacent thimble (32), so that each tooth can horizontally move between the two adjacent thimble (32) to pass through the needle type supporting platform (3);
each two clamps respectively clamp one opposite side of the PCB so that four sides of the PCB are clamped;
wherein at least three jigs are movable in a direction perpendicular to the needle mount (3) so that the tips of each tooth do not collide with each other when jigs perpendicular to each other in the moving direction are sequentially moved;
the clamp comprises: a clamp seat (45), a clamp suspension rod (46) and a clamping head (47);
the clamping suspension rods (46) and the clamping heads (47) are the same in number and correspond to each other one by one, one clamping head (47) is arranged at one end of each clamping suspension rod, the other end of each clamping suspension rod is connected with the clamping seat (45), the clamping seat (45) is perpendicular to the clamping suspension rods, the clamping suspension rods are distributed in a comb-tooth shape on the clamping seat (45), and the widths of the clamping suspension rods and the clamping heads (47) are smaller than the gap between the adjacent ejector pins (32);
four of the clamps are respectively perpendicular to the needle pallet (3): a first direction clamp (41), a second direction clamp (42), a third direction clamp (43) and a fourth direction clamp (44);
the first direction clamp (41) is connected with the rack through a first linear driver (411) and is used for clamping a first edge of the PCB, and the driving direction of the first linear driver (411) is perpendicular to the first edge;
the second direction clamp (42) is connected with the rack through a second linear driver (421) and is used for clamping a second edge of the PCB, the first edge and the second edge are parallel to each other, and the driving direction of the second linear driver (421) is perpendicular to the second edge;
the third direction clamp (43) is connected with the rack through a third linear driver (431) and is used for clamping a third side of the PCB, the first side and the third side are perpendicular to each other, and the driving direction of the third linear driver (431) is perpendicular to the third side;
the fourth direction clamp (44) is fixedly connected with the rack and used for clamping a fourth side of the PCB, and the third side and the fourth side are parallel to each other;
the fixture hanging rods (46) of the third-direction fixtures (43) and the fixture hanging rods (46) of the second-direction fixtures (42) are located at different heights, and the first linear driver (411) is used for driving the first-direction fixtures (41) to drive the PCB to move, so that when the second-direction fixtures (42) clamp the second edges of the PCB, clamping heads (47) of each second-direction fixture (42) are located between the adjacent two clamping heads (47) of the third-direction fixtures (43).
2. A PCB dividing and sampling device according to claim 1, wherein,
the clamping head (47) comprises: a bottom plate (471), a connecting plate (472), a top plate (473) and an elastic pressing plate (474);
the bottom plate (471) and the top plate (473) are both horizontally arranged, the connecting plate (472) is fixedly connected with the bottom plate (471) and the top plate (473), one end of the elastic pressing plate (474) is fixedly connected with the top plate (473), the other end of the elastic pressing plate (474) is close to the bottom plate (471), and the top wall of the bottom plate (471) is the same as the top end of the ejector pin (32).
3. A PCB dividing and sampling device according to claim 2, wherein,
the free end of the elastic pressing plate (474) is bent away from the bottom plate (471).
4. A PCB dividing and sampling device according to claim 1, wherein,
the needle type saddle (3) comprises a rectangular box-shaped body (31) with an opening at the top, and the thimble (32) comprises a plurality of needles sequentially connected from top to bottom: needle (321), upper needle bar (322) and lower needle bar (323), the diameter of lower needle bar (323) is greater than the diameter of upper needle bar (322), lower needle bar (323) and the diapire of body (31) are detachably connected.
5. A PCB dividing and sampling device according to claim 1, wherein,
the PCB cuts apart sampling device includes: a machine vision inspection system and/or a displacement sensor;
the machine vision detection system is used for photographing the PCB placed on the needle type supporting table (3) to obtain the edge size of the PCB;
the displacement sensor is used for detecting the moving distance of the execution parts of the first linear driver (411) and the second linear driver (421);
and further, the method is obtained by calculation of a controller: when the first direction clamp (41) and the second direction clamp (42) clamp the PCB, the first direction clamp (41) needs to move a compensation distance when the second direction clamp (42) is enabled to avoid the moving path of the third direction clamp (43).
6. A PCB dividing and sampling device according to claim 1, wherein,
force feedback sensors are mounted on the first linear driver (411), the second linear driver (421) and the third linear driver (431), and the force feedback sensors are used for detecting acting forces fed back to execution parts of the first linear driver (411), the second linear driver (421) and the third linear driver (431) when the first direction clamp (41), the second direction clamp (42) and the third direction clamp (43) are in contact with and clamp a PCB.
7. A PCB dividing and sampling method is characterized in that,
the PCB segmentation sampling method using the PCB segmentation sampling device of any one of claims 1-6, the PCB segmentation sampling method comprising the steps of:
placing the PCB on one corner of the pin type supporting table (3) so that two sides of one corner of the PCB are respectively close to two clamps which are perpendicular to each other;
two clamps with parallel moving directions respectively pass through gaps between two adjacent ejector pins (32) from two directions to clamp two sides of a PCB;
the controller judges whether the executing part of the clamp is positioned on the moving path of the rest clamp, if so, the two clamps which work previously are moved so that the two clamps avoid the moving path of the rest clamp;
at least one of the remaining two clamps one side of the PCB board through a gap between two adjacent ejector pins (32), and the remaining side of the PCB board is clamped by the other clamp.
8. The method of claim 7, wherein,
before cutting the PCB board, the following steps are performed:
pre-forming auxiliary wires (7) or auxiliary holes on the PCB, wherein the auxiliary wires (7) or the auxiliary holes are positioned on a cutting path of a sample wafer of the PCB, and the cutting path is in the shape of a rectangular wire frame;
the staff inputs the size of the rectangular wire frame in a controller, the controller searches the auxiliary wire (7) or the auxiliary hole through a CCD camera (6), and a cutting path is generated;
the industrial robot (2) drives the laser head (1) to cut the PCB along a cutting path.
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| JP7270216B2 (en) * | 2019-08-23 | 2023-05-10 | パナソニックＩｐマネジメント株式会社 | LASER PROCESSING DEVICE, LASER PROCESSING METHOD, AND CORRECTION DATA GENERATION METHOD |
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| CN208276370U (en) * | 2018-04-26 | 2018-12-25 | 成都飞机工业（集团）有限责任公司 | A kind of drawer type thick cable end insulating layer jig for laser cutting |
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