CN117102612B - Laser tin ball welding device - Google Patents
Laser tin ball welding device Download PDFInfo
- Publication number
- CN117102612B CN117102612B CN202311338310.XA CN202311338310A CN117102612B CN 117102612 B CN117102612 B CN 117102612B CN 202311338310 A CN202311338310 A CN 202311338310A CN 117102612 B CN117102612 B CN 117102612B
- Authority
- CN
- China
- Prior art keywords
- air
- assembly
- pressure
- feeding
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 78
- 238000003466 welding Methods 0.000 title claims abstract description 60
- 238000005476 soldering Methods 0.000 claims abstract description 67
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims description 71
- 238000003825 pressing Methods 0.000 claims description 20
- 238000001514 detection method Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 abstract description 7
- 238000011897 real-time detection Methods 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 238000010309 melting process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to the field of laser welding, and discloses a laser tin ball welding device which comprises a bottom plate, a welding nozzle assembly arranged on the bottom plate and a laser assembly arranged above the welding nozzle assembly; a soldering tin cavity is formed in the welding nozzle assembly, and a feeding channel and a first air hole are formed in the side wall of the welding nozzle assembly; the bottom plate is provided with a feeding assembly, the feeding assembly comprises a feeding disc capable of being driven to rotate, and the feeding disc is provided with a plurality of containing holes along the circumferential direction of the feeding disc; one side of the bottom plate is provided with an air pressure component, the air pressure component comprises an air outlet port, and the air outlet port is communicated with the first air hole through an air pipe; wherein, the air outlet port is provided with an air pressure sensor; this laser tin ball welding device is through the atmospheric pressure in the real-time detection welding tip subassembly to the going on of each step of regulation control soldering tin, use positive negative pressure control system to clear up the tin liquid residue in the soldering tin chamber way, effectively reduce the factor that influences the welding follow-up process, avoid few welding and the problem emergence of many welding, thereby improve welding quality.
Description
Technical Field
The invention relates to the technical field of laser welding, in particular to a laser tin ball welding device.
Background
The laser solder ball welding is a high-efficiency and precise soldering welding method which uses a laser beam with high energy density as a heat source to melt the solder ball so as to precisely connect applicable products. Laser soldering is one of the important aspects of electronic component (SMT) processing technology applications. The laser industry has been developing rapidly worldwide for many years, and laser solder ball welding devices and methods have been widely used successfully in precision welding of micro and small parts.
In the prior art, the laser welding equipment is used for supplying and spraying the solder balls to the appointed welding stations on the workpiece through the welding head, the solder balls are required to be melted through the laser equipment in the process, but when the conventional solder balls are melted through laser irradiation, the conventional solder balls are easy to partially remain in the spray head to cause the influence on the subsequent solder balls, so that the conditions of less welding and more welding of the welding spots are caused, and poor welding is caused.
In view of this, there is a need for an improvement in the soldering apparatus in the prior art to solve the problem of poor soldering caused by the residual tin liquid in the shower nozzle.
Disclosure of Invention
The invention aims to provide a laser tin ball welding device which solves the technical problems.
To achieve the purpose, the invention adopts the following technical scheme:
a laser solder ball welding device comprises a bottom plate, a welding nozzle assembly arranged on the bottom plate and a laser assembly arranged above the welding nozzle assembly;
a soldering tin cavity channel for spraying out a soldering tin ball is formed in the soldering tip assembly, a feeding channel and a first air hole communicated with the soldering tin cavity channel are formed in the side wall of the soldering tip assembly;
the feeding assembly is arranged on the bottom plate and comprises a feeding disc capable of being driven to rotate, a plurality of containing holes for containing tin balls are formed in the circumferential direction of the feeding disc, and only one containing hole is communicated with the feeding channel in the rotation process of the feeding disc;
one side of the bottom plate is provided with an air pressure assembly, the air pressure assembly comprises an air outlet port, and the air outlet port is communicated with the first air hole through an air pipe and is used for supplying negative pressure or positive pressure to the soldering tin cavity channel; the air outlet port is provided with an air pressure sensor, and the air pressure sensor is used for detecting the air pressure in the soldering tin cavity;
when the air pressure sensor detects that the pressure in the soldering tin cavity is stable to a first pressure threshold value, the laser component operates to melt the solder ball in the soldering tin cavity; when the pressure in the soldering tin cavity is detected to be changed between a first pressure threshold value and a second pressure threshold value, the air pressure component supplies positive pressure to the soldering tin cavity; when the pressure in the soldering tin cavity is detected to be stable to the second pressure threshold, the laser component stops running, and simultaneously, negative pressure is supplied to the soldering tin cavity and the feeding disc is driven to rotate, so that the solder balls in the accommodating holes at corresponding positions enter the soldering tin cavity.
Optionally, the bottom plate comprises a first plate body and a second plate body which are arranged at intervals up and down, and a limiting disc is arranged between the first plate body and the second plate body;
a circular groove is formed in the middle of the limiting disc, and the feeding disc is rotationally connected in the circular groove; the bottom plate and the limiting plate are provided with through holes, and the lower ends of the through holes are connected with the soldering tin cavity.
Optionally, the upper end surface of the bottom plate is provided with a pressing plate assembly, the pressing plate assembly comprises a mounting seat, the mounting seat is hinged with a pressing plate body, and one end, far away from the mounting seat, of the pressing plate body is detachably connected to the bottom plate;
the pressing plate body is provided with a window part, a lens is installed on the window part, and one end face of the lens is plugged at the upper end of the through hole.
Optionally, a guide groove is formed in the first plate body, and the guide groove is communicated with the feeding component; wherein the guide chute is arc-shaped;
guide inclined planes are formed on the two side walls of the guide chute, and the two guide inclined planes are gradually close to each other along the direction from top to bottom;
tin balls in the feeding assembly move along the guide chute, and a plurality of tin balls are distributed in an arc shape.
Optionally, the air pressure assembly comprises a pressure regulator, an air inlet port and an air outlet port are arranged on the pressure regulator, and the air inlet port is connected with an air source assembly.
Optionally, the air source assembly comprises an air compressor, an output port of the air compressor is provided with a switching valve, the switching valve is connected with a first air passage and a second air passage, and one ends of the first air passage and the second air passage are respectively connected with the air inlet port;
the first air passage is provided with a control valve and a one-way valve and is used for supplying negative pressure to the air pressure assembly;
and a control valve is arranged on the second air passage, and the second air passage is used for supplying positive pressure to the air pressure assembly.
Optionally, the laser solder ball welding device further includes a control unit, the air pressure sensor is electrically connected with the control unit, and the control unit is used for reading detection data of the air pressure sensor and controlling the operation of the laser component and the air pressure component according to the detection data.
Optionally, be provided with the backup pad on the bottom plate, install driving motor in the backup pad, driving motor's output shaft has the shaft coupling, the one end of shaft coupling with the feed tray is connected, is used for the drive the feed tray rotates.
Optionally, an adjusting platform is arranged on the supporting plate, a mounting block is arranged at the moving end of the adjusting platform, and the laser component is mounted on the mounting block.
Compared with the prior art, the invention has the following beneficial effects: during operation, the feeding assembly is used for feeding tin balls to the feeding disc, the feeding assembly drives the tin balls to rotate to the position of the feeding channel along the circumferential direction, the tin balls enter the tin soldering cavity channel along the feeding channel, and when the air pressure sensor detects that the pressure in the tin soldering cavity channel is stable to a first pressure threshold value, the laser assembly operates to melt the tin balls in the tin soldering cavity channel; in the melting process of the solder ball, the interior of the solder cavity channel changes, and when the pressure sensor detects that the pressure in the solder cavity channel changes between a first pressure threshold value and a second pressure threshold value, the air pressure component supplies positive pressure to the solder cavity channel, so that the solder liquid is sprayed out from the solder cavity channel to the processing station; when the pressure in the soldering tin cavity is detected to be stable to the second pressure threshold value, the laser component stops running, and simultaneously, negative pressure is supplied to the soldering tin cavity and the feeding disc is driven to rotate, so that the solder balls in the accommodating holes at corresponding positions enter the soldering tin cavity for the next welding period; this laser tin ball welding device is through the atmospheric pressure in the real-time detection welding tip subassembly to the going on of each step of regulation control soldering tin, use positive negative pressure control system to clear up the tin liquid residue in the soldering tin chamber way, effectively reduce the factor that influences the welding follow-up process, avoid few welding and the problem emergence of many welding, thereby improve welding quality.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art.
The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and are not intended to limit the scope of the invention, since any modification, variation in proportions, or adjustment of the size, etc. of the structures, proportions, etc. should be considered as falling within the spirit and scope of the invention, without affecting the effect or achievement of the objective.
FIG. 1 is a schematic diagram showing the overall structure of a laser solder ball bonding apparatus according to the present embodiment;
FIG. 2 is a schematic diagram showing the front view of the laser solder ball welding apparatus according to the present embodiment;
FIG. 3 is a schematic view of a part of a cross-section of a laser solder ball bonding apparatus according to the present embodiment;
FIG. 4 is a second schematic cross-sectional view of a portion of a laser solder ball bonding apparatus according to the present embodiment;
FIG. 5 is a schematic diagram of the structure of a base plate of the laser solder ball welding device according to the present embodiment;
fig. 6 is a schematic diagram of an air source assembly of the laser solder ball welding apparatus according to the present embodiment.
Illustration of: the laser welding nozzle assembly comprises a base plate 1, a welding nozzle assembly 2, a laser assembly 3, a soldering tin cavity 4, a feeding channel 5, a first air hole 6, a feeding assembly 7, a feeding disc 8, a containing hole 9, an air pressure assembly 10, an air outlet port 11, an air pipe 12, an air pressure sensor 13, a first plate 14, a second plate 15, a limit disc 16, a through hole 17, a pressing plate assembly 18, a mounting seat 19, a pressing plate body 20, a window 21, a lens 22, a guide groove 23, a guide inclined plane 24, a pressure regulator 25, an air inlet port 26, an air source assembly 27, an air compressor 28, a switching valve 29, a first air channel 30, a second air channel 31, a control valve 32, a one-way valve 33, a supporting plate 34, a driving motor 35, a coupling 36 and an adjusting platform 37.
Detailed Description
In order to make the objects, features and advantages of the present invention more comprehensible, the technical solutions in the embodiments of the present invention are described in detail below with reference to the accompanying drawings, and it is apparent that the embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. It is noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.
The technical scheme of the invention is further described below by the specific embodiments with reference to the accompanying drawings.
Referring to fig. 1 to 6, an embodiment of the present invention provides a laser solder ball welding apparatus, which includes a base plate 1, a nozzle assembly 2 disposed on the base plate 1, and a laser assembly 3 disposed above the nozzle assembly; a soldering tin cavity 4 for spraying out solder balls is formed in the soldering tip assembly 2, a feeding channel 5 and a first air hole 6 communicated with the soldering tin cavity 4 are formed in the side wall of the soldering tip assembly 2; the feeding assembly 7 is mounted on the base plate 1, the feeding assembly 7 comprises a feeding disc 8 capable of being driven to rotate, the feeding disc 8 is provided with a plurality of containing holes 9 for containing solder balls along the circumferential direction of the feeding disc 8, and only one containing hole 9 is communicated with the feeding channel 5 in the rotation process of the feeding disc 8;
an air pressure assembly 10 is arranged on one side of the bottom plate 1, the air pressure assembly 10 comprises an air outlet port 11, and the air outlet port 11 is communicated with the first air hole 6 through an air pipe 12 and is used for supplying negative pressure or positive pressure to the soldering tin cavity 4; the air outlet port 11 is provided with an air pressure sensor 13, and the air pressure sensor 13 is used for detecting the air pressure in the soldering tin cavity 4;
when the air pressure sensor 13 detects that the pressure in the soldering tin cavity 4 is stable to the first pressure threshold value, the laser component 3 operates to melt the solder ball in the soldering tin cavity 4; when detecting that the pressure in the soldering tin cavity 4 changes between the first pressure threshold value and the second pressure threshold value, the air pressure assembly 10 supplies positive pressure to the soldering tin cavity 4; when the pressure in the soldering tin cavity channel 4 is detected to be stable to the second pressure threshold value, the laser component 3 stops running, and simultaneously, negative pressure is supplied to the soldering tin cavity channel 4 and the feeding disc 8 is driven to rotate, so that the solder balls in the accommodating holes 9 at corresponding positions enter the soldering tin cavity channel 4.
In the above steps, the positive pressure or the negative pressure is supplied to the solder cavity 4, so that the control function for the internal solder ball can be achieved; when negative pressure is introduced, the solder ball is adsorbed by the solder cavity 4, and the negative pressure value is 0-1 times of atmospheric pressure; therefore, it can be understood that the first pressure threshold is between 0 and 1 times of atmospheric pressure, and the first pressure threshold is not vacuum pressure because the absolute vacuum cannot be achieved in consideration of actual conditions; when positive pressure is introduced, the soldering tin cavity channel 4 can spray molten tin liquid which is heated, and the second pressure threshold value is larger than 1 time of atmospheric pressure; setting 0< first pressure threshold < atmospheric pressure < second pressure threshold.
The working principle of the invention is as follows: during operation, the feeding assembly 7 supplies solder balls to the feeding tray 8, the feeding assembly 7 drives the solder balls to rotate to the position of the feeding channel 5 along the circumferential direction, the solder balls enter the solder cavity 4 along the feeding channel 5, and when the air pressure sensor 13 detects that the pressure in the solder cavity 4 is stable to a first pressure threshold value, the laser assembly 3 operates to melt the solder balls in the solder cavity 4; in the melting process of the solder ball, the interior of the solder cavity 4 is changed, and when the pressure sensor 13 detects that the pressure in the solder cavity 4 is changed between a first pressure threshold value and a second pressure threshold value, the air pressure assembly 10 supplies positive pressure to the solder cavity 4 so as to enable solder liquid to be sprayed out from the solder cavity 4 to a processing station; when the pressure in the soldering tin cavity 4 is detected to be stable to the second pressure threshold value, the laser assembly 3 stops running, and simultaneously negative pressure is supplied to the soldering tin cavity 4 and the feeding disc 8 is driven to rotate, so that the solder balls in the accommodating holes 9 at corresponding positions enter the soldering tin cavity 4 for the next welding period; compared with the welding equipment in the prior art, the laser solder ball welding device can adjust and control the operation of each step of soldering tin by detecting the air pressure in the welding nozzle assembly 2 in real time, and the positive and negative pressure control system is used for cleaning the solder liquid residue in the soldering tin cavity 4, so that the factors affecting the follow-up welding process are effectively reduced, the problems of less welding and more welding are avoided, and the welding quality is improved.
In this embodiment, the base plate 1 includes a first plate body 14 and a second plate body 15 that are disposed at an upper-lower interval, and a limiting disc 16 is disposed between the first plate body 14 and the second plate body 15; a circular groove is formed in the middle of the limiting disc 16, and the feeding disc 8 is rotatably connected in the circular groove; wherein, through holes 17 are formed on the bottom plate 1 and the limit disk 16, and the lower ends of the through holes 17 are connected with the soldering tin cavity 4.
It should be noted that the base plate 1 is formed by connecting two plate bodies which are arranged separately, so that the installation of the feeding plate 8 in the interior and the periodic maintenance are facilitated; meanwhile, the limiting disc 16 is arranged between the two plates, on one hand, the limiting disc 16 plays a role in limiting the rotation of the feeding disc 8, and on the other hand, plays a role in sealing a gap between the two plates, so that a closed space related to the soldering tin cavity 4 can be formed inside the bottom plate 1, and the air pressure sensor 13 can conveniently detect the air pressure inside.
The upper end face of the bottom plate 1 is provided with a pressing plate assembly 18, the pressing plate assembly 18 comprises a mounting seat 19, a pressing plate body 20 is hinged to the mounting seat 19, and one end, away from the mounting seat 19, of the pressing plate body 20 is detachably connected to the bottom plate 1; the platen body 20 is provided with a window 21, a lens 22 is mounted on the window 21, and one end surface of the lens 22 is blocked at the upper end of the through hole 17. Wherein, the fact that one end of the pressing plate body 20 is detachably connected to the bottom plate 1 means that one end of the pressing plate body 20 is in two states of being capable of being connected with the bottom plate 1 or being detached from the bottom plate 1, namely, the two states are detachably connected.
Meanwhile, since the laser component 3 needs to be arranged above the pressing plate component 18 to seal the sealed space, and laser emitted by the laser component 3 needs to act on the solder ball in the solder cavity 4, a lens 22 is arranged at the upper end of the through hole 17 for transmission of the laser, and a detachable structure is arranged at the other end of the pressing plate component 18, so that the solder cavity 4 can be opened for regular maintenance; for example, after cooling the solder in the solder channels 4, the feed channels 5 are blocked, and the platen assembly 18 can be opened to remove the solder.
In this embodiment, the first plate 14 is provided with a guide groove 23, and the guide groove 23 is communicated with the feeding component 7; wherein the guide groove 23 is arc-shaped; guide inclined planes 24 are formed on two side walls of the guide chute 23, and the two guide inclined planes 24 are gradually close to each other along the direction from top to bottom; the solder balls in the feeding assembly 7 move along the guide chute 23, and a plurality of solder balls are distributed along an arc shape; namely, the distribution of the solder balls and the containing holes 9 on the feeding tray 8 are positioned on the same circumference, so that the solder balls can drop in the corresponding containing holes 9 in sequence in the rotating process of the feeding tray 8.
In this embodiment, the air pressure assembly 10 includes a pressure regulator 25, and an air inlet port 26 and an air outlet port 11 are disposed on the pressure regulator 25, and the air inlet port 26 is connected to an air source assembly 27. As shown in connection with fig. 4, the pressure regulator 25 in this embodiment serves as an air pressure regulator to maintain the stability of the solder balls in the solder cavity 4.
Further illustrated, the air source assembly 27 includes an air compressor 28, an output port of the air compressor 28 is provided with a switching valve 29, the switching valve 29 is connected with a first air path 30 and a second air path 31, and one ends of the first air path 30 and the second air path 31 are respectively connected with the air inlet port 26; the first air passage 30 is provided with a control valve 32 and a one-way valve 33, and the first air passage 30 is used for supplying negative pressure to the air pressure assembly 10; the second air path 31 is provided with a control valve 32, and the second air path 31 is used for supplying positive pressure to the air pressure assembly 10.
It should be noted that, since the pneumatic component 10 in this solution needs to have the output capability of positive pressure and negative pressure at the same time, the origin component in this solution realizes the switching supply of positive pressure and negative pressure by integrating two air paths.
In particular, the pneumatic module 10 and the origin module in this solution have the following advantages:
1. work efficiency is improved: the positive and negative pressure supply can be realized through the air compressor 28, and the two air paths for generating positive pressure and negative pressure are integrated into one device, so that the device structure is simplified, the device cost is reduced, the operation flow is simplified, and the working efficiency is improved.
2. Enhancing the working stability: by setting the opening and closing of the control valve 32 and the check valve 33 and the operation of the switching valve 29, the switching time and the pressure of the negative pressure and the positive pressure can be accurately adjusted, so that the stability of the solder ball in the solder cavity 4 is ensured.
3. And (3) accurately controlling the air pressure: the pressure regulator 25 can accurately regulate and control the air pressure provided by the air source assembly 27, whether positive or negative, and can be finely adjusted to an ideal state according to the needs, so that the air pressure in the soldering tin cavity 4 is accurately managed, and the smoothness of the soldering process is ensured.
4. Realizing automatic control: under the control of the pressure regulator 25, the automatic switching between positive pressure and negative pressure can be realized, so that the production efficiency is improved, and the operation difficulty and the misoperation probability are effectively reduced.
Therefore, the design of the pressure regulator 25 consisting of the air source assembly 27 comprising the air compressor 28 and two independent air paths can effectively improve the technical problems of the existing laser solder ball welding device by means of fine air pressure control and operation convenience.
In this embodiment, the laser solder ball welding device further includes a control unit, where the air pressure sensor 13 is electrically connected to the control unit, and the control unit is configured to read detection data of the air pressure sensor 13, and control the operation of the laser assembly 3 and the air pressure assembly 10 according to the detection data. A display may be provided on the control unit, through which the detection data of the air pressure sensor 13 is presented to the user; after the control unit reads the detection data of the air pressure sensor 13, a corresponding control instruction is generated after the detection data is processed, so as to control the coordinated operation of each component of the laser solder ball welding.
In this embodiment, the base plate 1 is provided with a support plate 34, a driving motor 35 is mounted on the support plate 34, an output shaft of the driving motor 35 is connected with a coupling 36, and one end of the coupling is connected with the feeding tray 8 and is used for driving the feeding tray 8 to rotate.
Further, the supporting plate 34 is provided with an adjusting platform 37, a moving end of the adjusting platform 37 is provided with a mounting block, and the laser assembly 3 is mounted on the mounting block. The space installation position of the laser component 3 is adjusted through the adjusting platform 37, so that the precision of laser welding is improved.
The above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (1)
1. The laser tin ball welding device is characterized by comprising a bottom plate (1), a welding nozzle assembly (2) arranged on the bottom plate (1), and a laser assembly (3) arranged above the welding nozzle assembly (2);
a soldering tin cavity channel (4) for spraying out a soldering tin ball is formed in the soldering tip assembly (2), a feeding channel (5) and a first air hole (6) communicated with the soldering tin cavity channel (4) are formed in the side wall of the soldering tip assembly (2);
the feeding assembly (7) is arranged on the bottom plate (1), the feeding assembly (7) comprises a feeding disc (8) capable of being driven to rotate, a plurality of containing holes (9) for containing tin balls are formed in the feeding disc (8) along the circumferential direction of the feeding disc, and only one containing hole (9) is communicated with the feeding channel (5) in the rotating process of the feeding disc (8);
one side of the bottom plate (1) is provided with an air pressure assembly (10), the air pressure assembly (10) comprises an air outlet port (11), and the air outlet port (11) is communicated with the first air hole (6) through an air pipe (12) and is used for supplying negative pressure or positive pressure to the soldering tin cavity channel (4); the air outlet port (11) is provided with an air pressure sensor (13), and the air pressure sensor (13) is used for detecting the air pressure in the soldering tin cavity (4);
when the air pressure sensor (13) detects that the pressure in the soldering tin cavity channel (4) is stable to a first pressure threshold value, the laser assembly (3) operates to melt the solder balls in the soldering tin cavity channel (4); -the air pressure assembly (10) supplies positive pressure to the solder cavity (4) when the air pressure sensor (13) detects that the pressure in the solder cavity (4) varies between a first pressure threshold and a second pressure threshold; when the air pressure sensor (13) detects that the pressure in the soldering tin cavity channel (4) is stable to a second pressure threshold value, the laser assembly (3) stops running, and simultaneously, negative pressure is supplied to the soldering tin cavity channel (4) and the feeding disc (8) is driven to rotate, so that a solder ball in the accommodating hole (9) at a corresponding position enters the soldering tin cavity channel (4); 0< first pressure threshold < atmospheric pressure < second pressure threshold;
the bottom plate (1) comprises a first plate body (14) and a second plate body (15) which are arranged at intervals up and down, and a limiting disc (16) is arranged between the first plate body (14) and the second plate body (15);
a circular groove is formed in the middle of the limiting disc (16), and the feeding disc (8) is rotationally connected in the circular groove; wherein, through holes (17) are arranged on the bottom plate (1) and the limiting disc (16), and the lower ends of the through holes (17) are connected with the soldering tin cavity channels (4);
the upper end face of the bottom plate (1) is provided with a pressing plate assembly (18), the pressing plate assembly (18) comprises a mounting seat (19), a pressing plate body (20) is hinged to the mounting seat (19), and one end, away from the mounting seat (19), of the pressing plate body (20) is detachably connected to the bottom plate (1);
a window part (21) is formed in the pressing plate body (20), a lens (22) is mounted on the window part (21), and one end surface of the lens (22) is plugged at the upper end of the through hole (17);
a guide groove (23) is formed in the first plate body (14), and the guide groove (23) is communicated with the feeding assembly (7); wherein the guide chute (23) is arc-shaped;
guide inclined planes (24) are formed in the two side walls of the guide groove (23), and the two guide inclined planes (24) are gradually close to each other along the direction from top to bottom;
tin balls in the feeding assembly (7) move along the guide chute (23), and a plurality of tin balls are distributed in an arc shape along the guide chute;
the air pressure assembly (10) comprises a pressure regulator (25), an air inlet port (26) and an air outlet port (11) are arranged on the pressure regulator (25), and the air inlet port (26) is connected with an air source assembly (27);
the air source assembly (27) comprises an air compressor (28), a switching valve (29) is arranged at an output port of the air compressor (28), the switching valve (29) is connected with a first air passage (30) and a second air passage (31), and one ends of the first air passage (30) and the second air passage (31) are respectively connected with the air inlet port (26);
a control valve (32) and a one-way valve (33) are arranged on the first air passage (30), and the first air passage (30) is used for supplying negative pressure to the air pressure assembly (10);
a control valve (32) is arranged on the second air passage (31), and the second air passage (31) is used for supplying positive pressure to the air pressure assembly (10);
the device further comprises a control unit, wherein the air pressure sensor (13) is electrically connected with the control unit, and the control unit is used for reading detection data of the air pressure sensor (13) and controlling the laser assembly (3) and the air pressure assembly (10) to operate according to the detection data;
the automatic feeding device is characterized in that a supporting plate (34) is arranged on the bottom plate (1), a driving motor (35) is arranged on the supporting plate (34), an output shaft of the driving motor (35) is connected with a coupler (36), and one end of the coupler (36) is connected with the feeding disc (8) and used for driving the feeding disc (8) to rotate;
an adjusting platform (37) is arranged on the supporting plate (34), an installation block is arranged at the moving end of the adjusting platform (37), and the laser component (3) is installed on the installation block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311338310.XA CN117102612B (en) | 2023-10-17 | 2023-10-17 | Laser tin ball welding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311338310.XA CN117102612B (en) | 2023-10-17 | 2023-10-17 | Laser tin ball welding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117102612A CN117102612A (en) | 2023-11-24 |
| CN117102612B true CN117102612B (en) | 2024-01-12 |
Family
ID=88802432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311338310.XA Active CN117102612B (en) | 2023-10-17 | 2023-10-17 | Laser tin ball welding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117102612B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695055A (en) * | 2016-12-29 | 2017-05-24 | 广东飞新达智能设备股份有限公司 | Automatic solder ball welding machine |
| CN108296591A (en) * | 2017-12-26 | 2018-07-20 | 武汉凌云光电科技有限责任公司 | A kind of the automatic of tin ball bonding dissolves tin device and method |
| KR20190023271A (en) * | 2017-08-28 | 2019-03-08 | 주식회사 디에스티시스템 | Solder ball feeder |
| CN210160547U (en) * | 2019-03-23 | 2020-03-20 | 东莞市联科自动化设备有限公司 | Tin ball welding device |
| CN211952235U (en) * | 2019-12-06 | 2020-11-17 | 河南省日立信股份有限公司 | Modular combined sulfur hexafluoride recovery device |
| CN215787309U (en) * | 2021-09-17 | 2022-02-11 | 深圳塔禾激光科技有限公司 | Laser tin-spraying ball welding assembly |
| CN114700577A (en) * | 2022-05-20 | 2022-07-05 | 江苏怡鼎讯智能装备有限公司 | Tin ball laser welding device based on multi-channel conveying and using method |
-
2023
- 2023-10-17 CN CN202311338310.XA patent/CN117102612B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695055A (en) * | 2016-12-29 | 2017-05-24 | 广东飞新达智能设备股份有限公司 | Automatic solder ball welding machine |
| KR20190023271A (en) * | 2017-08-28 | 2019-03-08 | 주식회사 디에스티시스템 | Solder ball feeder |
| CN108296591A (en) * | 2017-12-26 | 2018-07-20 | 武汉凌云光电科技有限责任公司 | A kind of the automatic of tin ball bonding dissolves tin device and method |
| CN210160547U (en) * | 2019-03-23 | 2020-03-20 | 东莞市联科自动化设备有限公司 | Tin ball welding device |
| CN211952235U (en) * | 2019-12-06 | 2020-11-17 | 河南省日立信股份有限公司 | Modular combined sulfur hexafluoride recovery device |
| CN215787309U (en) * | 2021-09-17 | 2022-02-11 | 深圳塔禾激光科技有限公司 | Laser tin-spraying ball welding assembly |
| CN114700577A (en) * | 2022-05-20 | 2022-07-05 | 江苏怡鼎讯智能装备有限公司 | Tin ball laser welding device based on multi-channel conveying and using method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117102612A (en) | 2023-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102689069B (en) | A kind of automatic tin welding machine | |
| CN105904079A (en) | Wire-feeding type electron beam material-increasing manufacturing equipment and operating method thereof | |
| CN219648958U (en) | Pneumatically controlled laser cutting device | |
| KR20190023271A (en) | Solder ball feeder | |
| CN117102612B (en) | Laser tin ball welding device | |
| CN205764424U (en) | Wire feed type electron beam increases material and manufactures equipment | |
| CN210230495U (en) | Relay point gum machine | |
| CN110773870A (en) | Multi-laser coaxial wire feeding additive manufacturing equipment and wire feeding method | |
| CN117577562B (en) | Vacuum device for chip packaging | |
| CN115555722A (en) | Laser welding mechanical arm, welding robot and welding method | |
| CN112846527A (en) | Laser scribing method for photovoltaic cell processing | |
| CN113732763A (en) | Numerical control mini wheel sheet orifice chamfering machine | |
| CN114523242A (en) | Intelligent welding manipulator based on big data of thing antithetical couplet | |
| CN217122206U (en) | Welding equipment with cooling mechanism | |
| CN215964494U (en) | Dispensing equipment | |
| CN215040296U (en) | Large-scale 3D printing device capable of achieving autonomous adjustment through visual feedback system | |
| CN114227259A (en) | Laser welding and polishing all-in-one | |
| CN211102023U (en) | Solder ball conveying mechanism and laser solder ball welding device | |
| CN210148567U (en) | Screwdriver cap arranging and positioning device and screwdriver cap conveying and positioning equipment | |
| CN203689096U (en) | Control system of automatic three-dimensional motion welding head of automatic die bonder | |
| CN116944678B (en) | Welding equipment for IC chip processing | |
| CN112792457A (en) | Laser deburring device | |
| CN111487154B (en) | High-temperature erosion experimental device | |
| CN111449367B (en) | Improved laminator | |
| KR900006804B1 (en) | Adhesive coating apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |