CN117096078A - Silicon wafer loading and unloading method and loading and unloading system of reaction boat - Google Patents

Silicon wafer loading and unloading method and loading and unloading system of reaction boat Download PDF

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Publication number
CN117096078A
CN117096078A CN202311113501.6A CN202311113501A CN117096078A CN 117096078 A CN117096078 A CN 117096078A CN 202311113501 A CN202311113501 A CN 202311113501A CN 117096078 A CN117096078 A CN 117096078A
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China
Prior art keywords
slot
operation position
controlling
basket
mechanical arm
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CN202311113501.6A
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Chinese (zh)
Inventor
海宣
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Trina Solar Suqian Photoelectric Co ltd
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Trina Solar Suqian Photoelectric Co ltd
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Priority to CN202311113501.6A priority Critical patent/CN117096078A/en
Publication of CN117096078A publication Critical patent/CN117096078A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a silicon wafer loading and unloading method and a silicon wafer loading and unloading system of a reaction boat. The silicon wafer loading and unloading method of the reaction boat comprises the following steps: controlling the mechanical arm to sequentially load and unload each groove group of the reaction boat until all groove groups in the reaction boat are loaded with untreated silicon wafers; wherein, the loading and unloading operation to each slot group includes: the method comprises the steps that all slots of a slot group are controlled to sequentially move to a first operation position, and a mechanical arm is controlled to unload all the slots moved to the first operation position to be empty slots, wherein the first operation position is configured as a position for the mechanical arm to load and unload the reaction boat; and controlling each empty slot to sequentially move to the first operation position, and controlling the mechanical arm to load unprocessed chips on each empty slot which moves to the first operation position. The silicon wafer loading and unloading method and the loading and unloading system of the reaction boat have higher loading and unloading efficiency.

Description

Silicon wafer loading and unloading method and loading and unloading system of reaction boat
Technical Field
The invention relates to the technical field of solar cells, in particular to a silicon wafer loading and unloading method and system of a reaction boat.
Background
In the production process of the solar cell, the process of automatically loading and unloading the silicon wafer by the quartz boat is usually completed by matching a mechanical arm. In specific implementation, the quartz boat may have a plurality of slots for storing silicon wafer groups, and here, taking the quartz boat having 8 slots as an example for explanation, the loading and unloading actions of the mechanical arm on the 8 slots may be divided into 8 action cycles, and each action cycle may include: and moving the first groove position of the quartz boat to an operation position where the mechanical arm can carry out loading and unloading operations, controlling the mechanical arm to unload the silicon wafers in the first groove position to an empty basket in a loading and unloading area, and loading unprocessed silicon wafers in a feeding basket to the first groove position of the quartz boat. After the mechanical arm finishes executing 1 action cycle, before executing the next round of action cycle, the mechanical arm needs to wait for the next slot to drive the silicon wafer to move to the operation position above the operation position, and then load and unload the next slot, and in the process, the mechanical arm can consume a certain time to wait between each action cycle, so that the silicon wafer loading and unloading efficiency of the quartz boat is lower.
Disclosure of Invention
Accordingly, there is a need for a method and a system for loading and unloading silicon wafers from a reaction boat with high loading and unloading efficiency.
The first aspect of the embodiment of the present application provides a method for loading and unloading silicon wafers from a reaction boat, the reaction boat including at least two slot groups sequentially arranged along a first direction, each slot group including at least two slots sequentially adjacent arranged along the first direction, the method for loading and unloading silicon wafers from a reaction boat comprising:
controlling the mechanical arm to sequentially load and unload each groove group of the reaction boat until all groove groups in the reaction boat are loaded with untreated silicon wafers; wherein, the loading and unloading operation to each slot group includes:
the method comprises the steps that all slots of a slot group are controlled to sequentially move to a first operation position, and a mechanical arm is controlled to unload all the slots moved to the first operation position to be empty slots, wherein the first operation position is configured as a position for the mechanical arm to load and unload the reaction boat;
and controlling each empty slot to sequentially move to the first operation position, and controlling the mechanical arm to load unprocessed chips on each empty slot which moves to the first operation position.
In one embodiment, the number of the slots in the slot group is two, and the two slots are respectively defined as a first slot and a second slot;
The step of controlling each slot of the slot group to sequentially move to the first operation position and controlling the mechanical arm to unload each slot moved to the first operation position into an empty slot specifically comprises the following steps:
controlling the first slot position to move to a first operation position, and controlling the mechanical arm to unload the processed silicon wafers in the first slot position to a first basket; after all the processed silicon wafers in the first slot position are separated from the first slot position and before the mechanical arm returns to the first operation position, controlling the second slot position to move to the first operation position;
and the mechanical arm is controlled to unload the processed silicon wafers in the second slot position to the second basket, and the empty first slot position is controlled to move to the first operation position after all the processed silicon wafers in the second slot position are separated from the second slot position and before the mechanical arm returns to the first operation position.
In one embodiment, after all of the processed silicon wafers in the first slot have been removed from the first slot and before the robot arm returns to the first operating position, the step of controlling the second slot to move to the first operating position comprises:
after the processed silicon wafer in the first slot is separated from the first slot and before the processed silicon wafer is inserted into the first basket, the second slot is controlled to move to the first operation position.
In one embodiment, the step of controlling the robotic arm to load unprocessed chips for each of the empty slots moved to the first operational position comprises:
after the first empty slot position is controlled to move to the first operation position, the control mechanical arm loads untreated silicon chips carried in the third basket to the first empty slot position which moves to the first operation position, and before the control mechanical arm loads untreated silicon chips carried in the fourth basket to the second slot position, the control mechanical arm controls the second slot position to move to the first operation position;
and the control mechanical arm loads untreated silicon chips carried in the fourth basket to an empty second slot position which moves to the first operation position.
In one embodiment, after all of the processed silicon wafers in the second slot are removed from the second slot and before the robot arm returns to the first operating position, the step of controlling the empty first slot to move to the first operating position comprises:
after the processed silicon wafer is inserted into the second basket, and before the mechanical arm unloads the unprocessed silicon wafer from the third basket, the first slot position is controlled to move to the first operation position.
In one embodiment, before the control arm loads the unprocessed silicon wafers carried in the fourth basket into the second slot, the step of controlling the second slot to move to the first operational position comprises:
After the untreated silicon wafers carried in the third basket are loaded to the first slot position, the control mechanical arm is controlled to move the second slot position to the first operation position before unloading the untreated silicon wafers from the fourth basket.
In one embodiment, a second lifting mechanism is correspondingly arranged at a second groove position of the groove group;
after the second slot position is controlled to move to the first operation position and before the control mechanical arm loads untreated silicon chips carried in the fourth basket to the second slot position, the method further comprises the following steps:
controlling a second lifting mechanism in the second groove to ascend;
the step of controlling the mechanical arm to load the untreated silicon wafer carried in the fourth basket to the second slot position comprises the following steps:
and controlling the mechanical arm to load the untreated silicon wafer onto the second lifting mechanism and controlling the second lifting mechanism to descend so as to load the untreated silicon wafer onto the second groove position.
In one embodiment, a first lifting mechanism and a second lifting mechanism are respectively arranged at a first slot position and a second slot position of the slot group correspondingly;
after controlling the second slot to move to the first operation position and before the mechanical arm returns to the first operation position, the method further comprises:
and controlling the second lifting mechanism to jack up the processed silicon wafers in the second groove position so as to enable the mechanical arm to unload the processed silicon wafers in the second groove position to the second basket.
In one embodiment, after the first slot position in the control space is moved to the first operation position and before the mechanical arm returns to the first operation position, the method further includes:
controlling a first lifting mechanism in the first slot to ascend;
the step of controlling the mechanical arm to load untreated silicon wafers carried in the third basket to the empty first slot position moved to the first operation position comprises the following steps:
and controlling the mechanical arm to load the untreated silicon chips carried in the third basket onto the first lifting mechanism, and controlling the first lifting mechanism to descend so as to load the untreated silicon chips to the first groove.
In one embodiment, between two adjacent loading and unloading operations, the robotic arm waits for a preset period of time in the first operational position.
In one embodiment, before the control mechanical arm unloads the processed silicon wafer in the first slot to the first basket of flowers, the control mechanical arm further comprises:
the first basket in no-load is controlled to move to a second operation position, wherein the second operation position is different from the first operation position and is configured as a position for loading and unloading the chips by the mechanical arm;
the control mechanical arm further comprises the following steps of:
and controlling the first basket loaded with the processed silicon wafers to move out of the second operation position, and controlling the third basket set loaded with the unprocessed chips to move to the second operation position.
In one embodiment, the step of controlling the robotic arm to unload the processed silicon wafer in the second slot to the second basket further comprises:
the second basket in no-load is controlled to move to a third operation position, wherein the third operation position and the second operation position are different from the first operation position and are configured to be used for loading and unloading the chips by the mechanical arm;
the step of unloading the processed silicon wafer in the second slot position to the second basket of flowers by the control mechanical arm further comprises the following steps:
and controlling the second basket edge loaded with the processed silicon wafers to move out of the third operation position, and controlling the fourth basket group loaded with the unprocessed chips to move to the third operation position.
In one embodiment, during the step of controlling the first basket of flowers loaded with processed silicon wafers to move out of the second operation position and controlling the third basket of flowers loaded with unprocessed chips to move to the second operation position, the step of controlling the mechanical arm to unload the processed silicon wafers in the second slot position to the second basket of flowers is performed simultaneously.
In one embodiment, during the step of controlling the second basket edge loaded with the processed silicon wafers to move out of the third operation position and controlling the fourth basket group loaded with the unprocessed silicon wafers to move to the third operation position, the step of controlling the mechanical arm to load the unprocessed silicon wafers loaded in the third basket to the first slot position is performed simultaneously.
A second aspect of the embodiment of the present application provides a silicon wafer handling system for a reaction boat, including:
a mechanical arm;
the reaction boat bearing assembly is used for bearing the reaction boat and provided with a first operation position, and the first operation position is configured as a position for the mechanical arm to load and unload the reaction boat; and
and the controller is used for executing the silicon wafer loading and unloading method of the reaction boat.
The silicon wafer loading and unloading method and the loading and unloading system of the reaction boat have the beneficial effects that:
at least one slot group can be included in the reaction boat, for the loading and unloading process of one slot group, assuming that the slot group has n slots, the process of unloading a slot group by a mechanical arm in the related art comprises: unloading and loading the wafer from the first slot, waiting for the mechanical arm, unloading and loading the wafer from the second slot, waiting for the mechanical arm, unloading and loading the wafer from the nth slot by … …. At least n times of waiting processes of the mechanical arm are needed in the process. In the application, for one slot group, each slot of the slot group is controlled to sequentially move to a first operation position, the mechanical arm is controlled to unload each slot moved to the first operation position into an empty slot, each empty slot is controlled to sequentially move to the first operation position, and the mechanical arm is controlled to load the unprocessed chips for each empty slot moved to the first operation position. The manipulator can continuously execute the continuous sheet loading action of each slot after continuously executing the sheet unloading action of each slot, and the manipulator does not need to wait in the loading and unloading process of each slot included in one slot group. In other words, in the method of the present application, the waiting time of the mechanical arm can be omitted for each slot group, so that when all slot groups, for example, m slot groups, are completely loaded, the waiting time of the mechanical arm can be omitted for at least mn times, which greatly improves the silicon wafer loading and unloading efficiency of the reaction boat.
Drawings
FIG. 1 is a schematic view of a reaction boat and a mechanical arm in a method for loading and unloading silicon wafers from the reaction boat according to an embodiment of the present application;
FIG. 2 is a schematic structural view of a reaction boat;
FIG. 3 is a schematic flow chart of handling operations in a method for handling silicon wafers of a reaction boat according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a silicon wafer handling system of a reaction boat according to an embodiment of the present application.
Reference numerals illustrate:
100. a loading and unloading device; 10. a basket providing assembly; 20. a reaction boat carrying assembly; 30. a mechanical arm;
51. a first basket of flowers; 52. a second basket of flowers; 53. a third basket of flowers; 54. a fourth basket of flowers; 60. a reaction boat; 61. a slot group; 611. a first slot; 612. a second slot; 70. a controller;
200. a silicon wafer loading and unloading system of the reaction boat;
F. the moving direction of the reaction boat; A. a first operational position; B. a second operational position; C. and a third operating position.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
The method for loading and unloading the silicon wafer of the reaction boat according to the embodiment of the application is described below with reference to the accompanying drawings.
Fig. 1 is a schematic structural view of a reaction boat and a mechanical arm in a silicon wafer loading and unloading method of a reaction boat according to an embodiment of the present application, fig. 2 is a schematic structural view of a reaction boat, fig. 3 is a schematic flow chart of loading and unloading operations in a silicon wafer loading and unloading method of a reaction boat according to an embodiment of the present application, and fig. 4 is a schematic structural view of a silicon wafer loading and unloading system of a reaction boat according to an embodiment of the present application.
Referring to fig. 1 and 4, the embodiment of the present application uses a silicon wafer handling system 200 of a reaction boat to handle silicon wafers from and to a reaction boat 60.
The silicon wafer handling system 200 of the reaction boat includes: the reaction boat carrier assembly 20, the robot arm 30, and the controller 70.
In addition, the wafer handling system 200 of the reaction boat may also include a basket providing assembly 10.
The reaction boat 60 includes at least two slot groups 61 sequentially arranged along the first direction F, each slot group 61 includes at least two slots sequentially adjacently arranged along the first direction F, each slot is used for storing silicon wafers.
Of course, in fig. 1 and 2, the number of the slot groups 61 is four, and the number of the slots included in each slot group 61 is two, which are illustrated as examples, in practice, the number of the slot groups 61 and the number of the slots may be set to be other as needed, and in the case that the number is other, the loading and unloading methods are similar to those described in detail herein.
In the case where the number of slots is two, two slots may be defined as a first slot 611 and a second slot 612, respectively. The first direction F may be, for example, a moving direction of the reaction boat 60.
The basket providing assembly 10 is used for carrying and transporting baskets, and the reaction boat carrying assembly 20 is used for carrying the reaction boat 60, moving the reaction boat 60 along the first direction F, and performing operations such as jacking, slicing and the like on silicon wafers in the groove group 61 in the reaction boat 60. The reaction boat carrier assembly 20 is provided with a first operation position a, wherein the first operation position a is a position configured for the mechanical arm 30 to load and unload the reaction boat 60, that is, when the reaction boat 60 is moved to move the slot group 61 to the first operation position a, the mechanical arm 30 can load and unload the silicon wafer to and from the slot group 61 located at the first operation position a.
The controller 70 is used to perform a silicon wafer loading and unloading method of the reaction boat described below.
Referring to fig. 3, a method for loading and unloading a silicon wafer of a reaction boat according to an embodiment of the present application includes:
the control mechanical arm 30 sequentially loads and unloads each groove group 61 of the reaction boat 60 until all groove groups 61 in the reaction boat 60 are loaded with untreated silicon wafers; the loading and unloading operation performed on each slot group 61 includes:
s10, controlling each slot position of a slot group to sequentially move to a first operation position, and controlling a mechanical arm to unload each slot position moved to the first operation position into an empty slot position;
s20, controlling each empty slot to sequentially move to the first operation position, and controlling the mechanical arm to load unprocessed chips on each empty slot moved to the first operation position.
For the loading and unloading process of one slot group 61, it is assumed that the slot group 61 has n (n is a natural number) slots.
The process of unloading a slot group by a mechanical arm in the related art comprises the following steps: unloading and loading the wafer from the first slot, waiting for the mechanical arm, unloading and loading the wafer from the second slot, waiting for the mechanical arm, unloading and loading the wafer from the nth slot by … …. In the process, the mechanical arm needs to wait for the next slot to move to the operation position of the mechanical arm to descend into the next slot for unloading the chips because the mechanical arm needs to lift after loading chips into the previous slot. At least n times of mechanical arm waiting processes are needed in the process.
In the application, the slots of the slot group 61 are controlled to sequentially move to the first operation position A, and the mechanical arm 30 is controlled to unload the slots moving to the first operation position A into empty slots; the respective empty slots are sequentially moved to the first operation position a, and the robot arm 30 is controlled to load unprocessed chips on the respective empty slots moved to the first operation position a.
In the wafer unloading process, each slot of the slot group 61 is sequentially moved to the first operation position a, the mechanical arm 30 sequentially performs wafer unloading operation, the time period from the moment when the processed chip is driven to completely leave the previous slot to the moment when the mechanical arm 30 returns to the first operation position a can be utilized, so that the next slot can be moved to the first operation position a, in other words, the movement operation of the next slot to the first operation position a can be performed after the mechanical arm 30 of the previous slot carries all processed silicon wafers to leave the previous slot, when the mechanical arm 30 returns to the first operation position a, the next slot can be moved to the first operation position a, the mechanical arm 30 can directly perform wafer unloading operation, and in the wafer unloading process of two adjacent slots, the mechanical arm 30 always does not need to wait.
In the wafer loading process, each empty slot of the control slot group 61 sequentially moves to the first operation position a, the mechanical arm 30 sequentially performs wafer loading operation, and the same reason holds that the movement operation of controlling the next slot to the first operation position a is possibly performed in the process of taking an unprocessed silicon wafer by the mechanical arm 30 after the wafer loading operation of the previous slot is finished, when the standby mechanical arm 30 returns to the first operation position a with the unprocessed silicon wafer, the next empty slot has moved to the first operation position a, so that the mechanical arm 30 can directly perform wafer loading operation, and in the wafer loading process of two adjacent slots, the mechanical arm 30 always does not need to wait.
In this way, the robot arm 30 can continuously perform the unloading operation of each slot and then continuously perform the loading operation of each slot, and the robot arm 30 does not need to wait during the loading and unloading operation of each slot included in one slot group 61.
In other words, in the method of the embodiment of the present application, the waiting time of the mechanical arm 30 can be omitted for each slot group 61, so that when all the slot groups 61, for example, m (natural number) slot groups 61 are completely loaded, the waiting time of the mechanical arm 30 can be omitted for at least mn times, which greatly improves the silicon wafer loading and unloading efficiency of the reaction boat 60.
Further, with continued reference to FIG. 1, corresponding to the case where the slotted bit set 61 of the present application includes a first slot 611 and a second slot 612, the basket may include a first basket 51, a second basket 52, a third basket 53, a fourth basket 54. The first basket 51, the second basket 52, the third basket 53, and the fourth basket 54 are all disposed on the basket providing assembly 10.
In step S10, the step of controlling each slot of the slot group 61 to sequentially move to the first operation position a and controlling the mechanical arm 30 to unload each slot moved to the first operation position a to an empty slot specifically includes:
controlling the first groove position 611 to move to the first operation position A, and controlling the mechanical arm 30 to unload the processed silicon wafers in the first groove position 611 to the first basket 51; after all the processed silicon wafers in the first slot 611 are separated from the first slot 611 and before the mechanical arm 30 returns to the first operation position a, the second slot 612 is controlled to move to the first operation position a;
The control arm 30 unloads the processed silicon wafers in the second slot 612 to the second basket 52, and after all the processed silicon wafers in the second slot 612 are separated from the second slot 612 and before the arm 30 returns to the first operation position a, the control arm controls the empty first slot 611 to move to the first operation position a.
In this way, during unloading the processed silicon wafer in the first slot 611, the second slot 612 can be moved to the first operation position a, and after the processed silicon wafer in the first slot 611 is unloaded, the mechanical arm 30 can directly unload the wafer in the second slot 612 without waiting.
Here, the operation of controlling the first slot 611 to move to the first operation position a and the operation of controlling the second slot 612 to move to the first operation position a may be achieved by controlling the reaction boat carrier assembly 20 and driving the reaction boat to reciprocate along the first direction F by the reaction boat carrier assembly 20.
Further, after all the processed silicon wafers in the first slot 611 are separated from the first slot 611 and before the robot arm 30 returns to the first operation position a, the step of controlling the second slot 612 to move to the first operation position a includes:
after the last batch of processed silicon wafers in the first bin 611 (assuming the silicon wafers in the first bin are batch unloaded) exits the first bin 611 and before the last batch of processed silicon wafers is inserted into the first basket 51, the second bin 612 is controlled to move to the first operational position a. That is, the movement of the second slot 612 is performed before the mechanical arm 30 drives the last batch of processed silicon wafers to be inserted into the first basket 51, so that the mechanical arm 30 can be ensured to reliably move to the first operation position a before returning to the first operation position a, and waiting of the mechanical arm 30 is avoided.
In the embodiment of the present application, the step of controlling the mechanical arm 30 to load the unprocessed chips on each empty slot moving to the first operation position a includes:
after the control of the empty first slot 611 to the first operating position a, the control arm 30 loads the unprocessed silicon wafer carried in the third basket 53 to the empty first slot 611 to the first operating position a, and moves the second slot 612 to the first operating position a before the control arm 30 loads the unprocessed silicon wafer carried in the fourth basket 54 to the second slot 612. And controls the robot arm 30 to load unprocessed silicon wafers carried in the fourth basket 54 into the empty second slot 612 that is moved to the first operational position a.
Further, after all the processed silicon wafers in the second slot 612 are separated from the second slot 612 and before the mechanical arm 30 returns to the first operation position a, the step of controlling the empty first slot 611 to move to the first operation position a includes:
after the processed silicon wafer is inserted into the second basket 52 and before the robot arm 30 unloads the unprocessed silicon wafer from the third basket 53, the first slot 611 is controlled to move to the first operational position a. This ensures that the first slot 611 has been moved to the first operating position a by the time the robotic arm 30 grips an unprocessed silicon wafer in the third basket 53.
Further, before the control arm 30 loads the unprocessed silicon wafers carried in the fourth basket 54 into the second slot position 612, the step of moving the second slot position 612 to the first operation position a includes:
after loading the unprocessed silicon wafers carried in the third basket 53 into the first slot 611, the control arm 30 controls the second slot 612 to move to the first operating position a before unloading the unprocessed silicon wafers from the fourth basket 54. This ensures that the second slot 612 can be moved to the first operational position a before the robot arm 30 carries the unprocessed silicon wafers in the fourth basket 54 to the first operational position a.
In the embodiment of the present application, the positions of the first slot 611 and the second slot 612 of the corresponding slot group 61 of the reaction boat carrier assembly are respectively provided with a first lifting mechanism and a second lifting mechanism (not shown).
After controlling the second slot 612 to move to the first operation position a and before controlling the mechanical arm 30 to load the unprocessed silicon wafers carried in the fourth basket 54 into the second slot 612, the method further comprises:
the second lifting mechanism in the second slot 612 is controlled to rise.
The step of controlling the robotic arm 30 to load the unprocessed silicon wafers carried in the fourth basket 54 into the second slots 612 includes:
The control robot 30 loads an unprocessed silicon wafer onto the second lift mechanism and controls the second lift mechanism to descend to load an unprocessed silicon wafer into the second slot 612. Thus, during the loading process, the second lifting mechanism may be controlled to load unprocessed chips into the second slot 612.
Further, after controlling the second slot 612 to move to the first operation position a and before the mechanical arm 30 returns to the first operation position a, the method further comprises:
the second lifting mechanism is controlled to jack up the processed silicon wafers in the second slot 612 for the mechanical arm 30 to unload the processed silicon wafers in the second slot 612 to the second basket 52.
Further, after the first slot 611 in the control space is moved to the first operation position a, and before the mechanical arm 30 returns to the first operation position a, the method further includes:
the first lifting mechanism in the first slot 611 is controlled to lift.
The step of controlling the robot arm 30 to load the unprocessed silicon wafers carried in the third basket 53 to the empty first slots 611 moved to the first operation position a includes:
the control robot 30 loads the unprocessed silicon wafer carried in the third basket 53 onto the first elevating mechanism and controls the first elevating mechanism to descend to load the unprocessed silicon wafer into the first slot 611.
Of course, after performing one loading and unloading operation on one slot group 61 as described above, the robot arm 30 needs to wait for a preset period of time before performing the next loading and unloading operation, specifically, between two adjacent loading and unloading operations, the robot arm 30 waits for a preset period of time in the first operation position a.
It will be appreciated that the empty first basket 51 also needs to be moved to a predetermined position prior to the first loading and unloading operation. For example a second operating bit B. The second operation position B is different from the first operation position a, and is configured as a position where the mechanical arm 30 can load and unload a chip. The second operation position B is a position of the basket providing assembly 10, and the basket providing assembly 10 further includes a third operation position C, which is different from the first operation position a and is configured as a position for loading and unloading the mechanical arm 30.
In particular, before the control mechanical arm 30 unloads the processed silicon wafer in the first slot 611 to the first basket 51, the method further includes:
the first basket 51, which is controlled to be unloaded, is moved to the second operating position B.
The control mechanical arm 30 further comprises, after unloading the processed silicon wafer in the first slot 611 to the first basket 51:
the first basket 51 loaded with processed silicon wafers is controlled to move out of the second operating position B, and the third basket 53 set loaded with unprocessed chips is controlled to move to the second operating position B. The movement of the first basket 51 and the third basket 53 is accomplished by controlling the basket providing assembly 10, i.e., the basket providing assembly 10 actuates the first basket 51 and the third basket 53.
At this time, the first basket 51 may be transported away from the reaction boat 60 in the first direction F, for example, by the basket providing assembly 10. The third basket 53 may be moved, for example, in a vertical direction from below the first basket 51 to the second operating position B.
Further, the step of controlling the robot 30 to unload the processed silicon wafer in the second slot 612 to the second basket 52 further comprises:
controlling the empty second basket 52 to move to the third operative position C;
the step of controlling the robotic arm 30 to unload the processed silicon wafer in the second slot 612 to the second basket 52 further comprises:
the second basket 52 loaded with processed wafers is controlled to move out of the third operating position C and the fourth set of baskets 54 loaded with unprocessed chips is controlled to move into the third operating position C.
At this time, the second basket 52 may be transported away from the reaction boat 60 in the first direction F, for example. The fourth basket 54 may be moved, for example, in a vertical direction from below the second basket 52 to the third operative position C. The movement of the second basket 52 and the fourth basket 54 is accomplished by controlling the basket providing assembly 10 such that the basket providing assembly 10 actuates the second basket 52 and the fourth basket 54.
In the embodiment of the present application, in the process of performing the step of controlling the first basket 51 loaded with the processed silicon wafer to move out of the second operation position B and controlling the third basket 53 set loaded with the unprocessed silicon wafer to move to the second operation position B, the step of controlling the mechanical arm 30 to unload the processed silicon wafer in the second slot position 612 to the second basket 52 is performed simultaneously.
Further, in the process of performing the step of controlling the second basket 52 loaded with processed silicon wafers to move out of the third operation position C and controlling the fourth basket 54 set loaded with unprocessed silicon wafers to move to the third operation position C, the step of controlling the robot arm 30 to load unprocessed silicon wafers carried in the third basket 53 to the first slot 611 is performed simultaneously.
The method for loading and unloading the silicon wafer of the reaction boat according to the embodiment of the application will be described with reference to a specific example.
The method comprises the following steps:
step one: referring to fig. 1, the first basket 51 is controlled to move to the second operating position B in advance, and the second basket 52 is controlled to move to the third operating position C. And controls the first slot 611 in the target slot set 61 to move to the first operational position a. The first lifting mechanism is controlled to jack up the processed silicon wafers in the first groove position 611, and the mechanical arm 30 is controlled to unload the processed silicon wafers jacked up in the first groove position 611 to the first basket of flowers 51.
Of course, the silicon wafer in the first slot 611 may be unloaded twice, at this time, the first lifting mechanism is controlled to jack up half of the processed silicon wafers in the first slot 611, the mechanical arm 30 is controlled to unload half of the processed silicon wafers jacked up in the first slot 611 to the first basket 51, and in the process of unloading, the first lifting mechanism may be controlled to jack up the other half of the processed silicon wafers. Next, the control arm 30 returns to the first operation position a to unload the other half of the lifted processed silicon wafer to the first basket 51. Thus, the unloading operation of the first slot 611 is completed. After the first basket 51 is fully filled with the processed silicon wafers, the first basket 51 is moved out of the second operation position B in a direction away from the reaction boat 60, and the third basket 53 carrying the unprocessed silicon wafers is moved to the second operation position B.
In the process of unloading the other half of the processed silicon wafers to the first basket 51 by the mechanical arm 30, before the mechanical arm 30 does not reach the first basket 51, the second groove 612 is controlled to move to the first operation position A, and the second lifting device is controlled to jack up the half of the processed silicon wafers in the second groove 612. The mechanical arm 30 is controlled to unload half of the processed silicon wafers in the second slot 612 to the second basket 52, and in the process of being inserted into the second basket 52, the second lifting device is controlled to jack up the other half of the processed silicon wafers in the second slot 612, and the mechanical arm 30 is controlled to unload the other half of the processed silicon wafers to the second basket 52. The unloading operation of the first slot 611 and the second slot 612 is completed. After the second basket 52 is fully loaded with processed silicon wafers, the second basket 52 is moved out of the third operating position C in a direction away from the reaction boat 60, and the fourth basket 54 carrying unprocessed silicon wafers is moved to the third operating position C.
Step two: during the movement of the robotic arm 30 to the third basket 53, the empty first slot 611 is controlled to move to the first operational position a and the first lift mechanism is controlled to raise. The mechanical arm 30 is controlled to unload half of the unprocessed chips in the third flower basket 53 into the first lifting mechanism in the first slot 611, and the first lifting mechanism descends to drive the unprocessed chips to enter the first slot 611. In the first lifting mechanism for controlling the mechanical arm 30 to discharge the other half of the unprocessed chips in the third basket 53 to the first lifting mechanism in the first slot 611 (at this time, the first lifting mechanism is lifted and does not affect the half of the unprocessed chips placed in the first slot 611), specifically, in the process that the mechanical arm 30 moves to the first slot 611 with the other half of the unprocessed chips, the first lifting mechanism is controlled to lift, the mechanical arm 30 is controlled to discharge the other half of the unprocessed chips in the third basket 53 to the first lifting mechanism in the first slot 611, and the first lifting mechanism is lifted to drive the other half of the unprocessed chips to enter the first slot 611.
The mechanical arm 30 is controlled to move towards the fourth basket 54 and pick up half of the unprocessed chips in the fourth basket 54, in this process, the first slot 611 is controlled to move out of the first operation position a, the second slot 612 is controlled to move to the first operation position a, and the second lifting mechanism is caused to lift. The control mechanical arm 30 unloads half of the unprocessed chips in the fourth basket 54 into the lifted second lifting mechanism of the second slot position 612, and the second lifting mechanism descends to drive half of the unprocessed chips into the second slot position 612. The control mechanical arm 30 unloads the other half of the unprocessed chips in the fourth basket 54 into the second lifting mechanism lifted again in the second slot 612 (at this time, the lifting of the second lifting mechanism does not affect the half of the unprocessed chips already placed in the second slot 612), and the second lifting mechanism descends to drive the other half of the unprocessed chips into the second slot 612. Thus, the mounting operation of the first slot 611 and the second slot 612 is completed.
After the mechanical arm 30 leaves from the second slot position 612, waiting for a preset period of time above the first operation position a, continuing to repeat the first step and the second step, and sequentially loading and unloading each slot group 61 in the reaction boat 60 until all the slot groups 61 are loaded and unloaded.
It will be appreciated that after this loading and unloading operation is completed, the unloaded third basket 53 and fourth basket 54 correspond to the unloaded first basket 51 and second basket 52, respectively, in the loading and unloading operation for the next pocket set 61.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.

Claims (15)

1. A method for loading and unloading silicon wafers from a reaction boat, the reaction boat comprising at least two slot groups sequentially arranged along a first direction, each slot group comprising at least two slots sequentially adjacently arranged along the first direction, the method comprising:
controlling a mechanical arm to sequentially load and unload each groove group of the reaction boat until all the groove groups in the reaction boat are loaded with untreated silicon wafers; wherein the loading and unloading operations for each of the slot sets include:
controlling each slot position of the slot group to sequentially move to a first operation position, and controlling a mechanical arm to unload each slot position moved to the first operation position to be the empty slot position, wherein the first operation position is configured as a position for loading and unloading the reaction boat by the mechanical arm;
and controlling each empty slot to sequentially move to the first operation position, and controlling the mechanical arm to load the unprocessed chips to each empty slot moved to the first operation position.
2. The method for loading and unloading silicon wafers to and from a reaction boat according to claim 1, wherein the number of slots in the group of slots is two, and two slots are defined as a first slot and a second slot, respectively;
The step of controlling each slot of the slot group to sequentially move to a first operation position and controlling the mechanical arm to unload each slot moved to the first operation position to be an empty slot specifically includes:
controlling the first slot position to move to a first operation position, and controlling the mechanical arm to unload the processed silicon chips in the first slot position to a first flower basket; controlling the second groove to move to the first operation position after all the processed silicon wafers in the first groove are separated from the first groove and before the mechanical arm returns to the first operation position;
and unloading the processed silicon wafers in the second slot position to a second flower basket by the control mechanical arm, and controlling the empty first slot to move to the first operation position after all the processed silicon wafers in the second slot position are separated from the second slot position and before the mechanical arm returns to the first operation position.
3. The method of loading and unloading silicon wafers from a reaction boat according to claim 2, wherein the step of controlling the movement of the second bath to the first operation position after all the processed silicon wafers in the first bath are separated from the first bath and before the robot arm is returned to the first operation position comprises:
And after the processed silicon chip in the first slot position is separated from the first slot position and before the processed silicon chip is inserted into the first basket, controlling the second slot position to move to the first operation position.
4. The method of loading and unloading silicon wafers to and from a reaction boat according to claim 2, wherein the step of controlling the robot arm to load unprocessed chips into each of the slots that are empty and moved to the first operation position comprises:
after the first groove which is empty is controlled to move to the first operation position, the mechanical arm is controlled to load untreated silicon chips carried in a third flower basket to the first groove which is empty and moves to the first operation position, and before the mechanical arm is controlled to load untreated silicon chips carried in the fourth flower basket to the second groove, the second groove is controlled to move to the first operation position;
and controlling the mechanical arm to load untreated silicon chips carried in a fourth flower basket to the second groove position which is empty and moves to the first operation position.
5. The method of loading and unloading silicon wafers from a reaction boat according to claim 4, wherein the step of controlling the first slot displacement to the first operation position after all the processed silicon wafers in the second slot are separated from the second slot and before the robot arm is returned to the first operation position comprises:
After the processed silicon wafer is inserted into the second basket, and before the mechanical arm unloads the unprocessed silicon wafer from the third basket, the first slot is controlled to move to the first operation position.
6. The method of loading and unloading silicon wafers from and to a reaction boat of claim 4, wherein the step of controlling the second pod to move to the first operating position before controlling the robot arm to load the unprocessed silicon wafers carried in the fourth basket to the second pod comprises:
and after the untreated silicon chips carried in the third basket are loaded to the first slot position, controlling the mechanical arm to move the second slot to the first operation position before unloading the untreated silicon chips from the fourth basket.
7. The method for loading and unloading silicon wafers to and from a reaction boat according to claim 6, wherein the second slot of the slot group is provided with a second elevating mechanism;
after the second groove is controlled to move to the first operation position, and before the mechanical arm is controlled to load the untreated silicon chips carried in the fourth basket to the second groove, the method further comprises:
Controlling the second lifting mechanism in the second slot to ascend;
the step of controlling the mechanical arm to load the untreated silicon wafer carried in the fourth basket to the second slot position comprises the following steps:
and controlling the mechanical arm to load the unprocessed silicon wafers onto the second lifting mechanism, and controlling the second lifting mechanism to descend so as to load the unprocessed silicon wafers onto the second groove position.
8. The method for loading and unloading silicon wafers to and from a reaction boat according to any one of claims 4 to 6, wherein the first slot and the second slot of the slot group are provided with a first elevating mechanism and a second elevating mechanism, respectively;
the controlling the second slot to move to the first operation position and before the mechanical arm returns to the first operation position further includes:
and controlling the second lifting mechanism to jack up the processed silicon wafers in the second slot position so that the mechanical arm can unload the processed silicon wafers in the second slot position to the second basket.
9. The method of loading and unloading a silicon wafer on a reaction boat according to claim 8, further comprising, after the first slot displacement in the control empty position is moved to the first operation position, and before the robot arm is returned to the first operation position:
Controlling the first lifting mechanism in the first slot to ascend;
the step of controlling the mechanical arm to load untreated silicon chips carried in a third basket to the first slot position which is empty and moves to the first operation position comprises the following steps:
and controlling the mechanical arm to load untreated silicon chips carried in the third flower basket onto the first lifting mechanism, and controlling the first lifting mechanism to descend so as to load the untreated silicon chips onto the first groove.
10. The method of loading and unloading silicon wafers to and from a reaction boat according to any one of claims 1 to 6, wherein between two adjacent loading and unloading operations, the robot arm waits for a predetermined period of time at the first operation position.
11. The method of any one of claims 3-6, wherein the controlling the robotic arm to unload the processed silicon wafers in the first slot to the first basket further comprises:
controlling the first basket to move to a second operation position which is different from the first operation position and is configured to be used for loading and unloading the mechanical arm;
the control of the mechanical arm to unload the processed silicon wafer in the first slot position to the first basket further comprises:
And controlling the first basket loaded with the processed silicon wafers to move out of the second operation position, and controlling the third basket set loaded with the unprocessed chips to move to the second operation position.
12. The method of claim 11, wherein the step of controlling the robotic arm to unload the processed silicon wafers in the second slot to the second basket further comprises:
controlling the second basket to move to the third operation position, wherein the third operation position and the second operation position are different from the first operation position and are configured to be used for loading and unloading the mechanical arm;
the step of unloading the processed silicon chips in the second slot position to the second basket of flowers by the control mechanical arm further comprises the following steps:
and controlling the second basket edge loaded with the processed silicon wafers to move out of the third operation position, and controlling the fourth basket group loaded with the unprocessed chips to move to the third operation position.
13. The method of loading and unloading silicon wafers to and from a reaction boat according to claim 12, wherein the step of controlling the robot arm to unload the processed silicon wafers in the second slot position to the second basket is performed simultaneously with the step of controlling the first basket, which is loaded with processed silicon wafers, to move out of the second operation position and controlling the third basket, which is loaded with unprocessed silicon wafers, to move to the second operation position.
14. The method of loading and unloading silicon wafers to and from a reaction boat according to claim 13, wherein the step of controlling the robot arm to load unprocessed silicon wafers carried in a third basket to the first slot is performed simultaneously with the step of controlling the second basket edge loaded with processed silicon wafers to move out of the third operation position and controlling the fourth basket group loaded with unprocessed silicon wafers to move to the third operation position.
15. A silicon wafer handling system for a reaction boat, comprising:
a mechanical arm;
the reaction boat bearing assembly is used for bearing the reaction boat and is provided with a first operation position, and the first operation position is configured as a position for the mechanical arm to load and unload the reaction boat; and
a controller for performing the silicon wafer handling method of the reaction boat of any one of claims 1 to 14.
CN202311113501.6A 2023-08-30 2023-08-30 Silicon wafer loading and unloading method and loading and unloading system of reaction boat Pending CN117096078A (en)

Priority Applications (1)

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CN202311113501.6A CN117096078A (en) 2023-08-30 2023-08-30 Silicon wafer loading and unloading method and loading and unloading system of reaction boat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311113501.6A CN117096078A (en) 2023-08-30 2023-08-30 Silicon wafer loading and unloading method and loading and unloading system of reaction boat

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Publication Number Publication Date
CN117096078A true CN117096078A (en) 2023-11-21

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