CN117084617A - Endoscope tip assembly in small diameter endoscopes using a truncated trapezoidal cavity inserter to allow camera and LED to be coplanar - Google Patents

Abstract

The present invention relates to a cavity interposer having a cavity, a first bond pad disposed within a base of the cavity adapted to be coupled to a chip camera cube at a first level, the first bond pad being coupled to a second bond pad at a second level at the base of the interposer through a feedthrough; and a third bond pad adapted to be coupled to a Light Emitting Diode (LED) at a third level. The third bond pad is coupled to a fourth bond pad at the second level at the base of the interposer; and the second bond pad and the fourth bond pad are coupled to conductors of the cable, wherein the first level, the second level, and the third level are different. The endoscope optics includes a cavity interposer, an LED, and a chip camera cube electrically bonded to the first bond pad; the LED is bonded to the third bond pad; and the top of the chip camera cube and the top of the LED are at the same level.

Description

Use of truncated trapezoidal cavity inserter in small diameter endoscopes to allow camera and LED Coplanar endoscope tip assembly

Related applications

This document is a continuation-in-part of U.S. patent application 17/504,105 filed on October 18, 2021. The entire contents of the aforementioned patent applications are incorporated herein by reference.

Background technique

Endoscopes have become common in medicine, used to examine tissues or to observe and guide surgical procedures without making large incisions so that the tissues can be seen with the naked eye, and similar devices are often used to perform inspections in delicate locations on mechanical devices to avoid the need for disassembly. Typically, the distal end of the endoscope is inserted into a precise location or body, and a physician or other user views images displayed by a display device near the proximal end of the endoscope.

Endoscopes of the past typically had a camera with a lens that focused light onto the end of a coherent fiber optic bundle at the distal end of the endoscope and directed light from an external illuminator through the fiber optic cable to the end of the optical fiber bundle located at the distal end of the endoscope. On the tissue or section to be examined in front of the lens; fiber optics carry images from the distal end of the endoscope to a display device near the proximal end of the endoscope.

As electronic cameras become smaller and smaller, it is possible to place a light source such as a light emitting diode (LED) or a laser diode and the electronic camera at the distal end of the endoscope and transmit the signal from the electronic camera to the endoscope The proximal end near the display device increases the trend.

Chip-based electronic cameras have become common in cell phones and similar devices. They are formed at the wafer level by bonding the wafer of the image sensor integrated circuit to the spacer wafer and the wafer of the lens to the spacer wafer such that the lens is positioned in front of each image sensor and in conjunction with each image sensor. The sensors are spaced apart by focal length. The composite wafer is then cut into individual cameras by sawing, and the cameras are then surface mounted to the substrate.

If the LED and chip-based electronic camera are surface mounted on a single flat substrate at the distal end of the endoscope, since the LED is much thinner than the chip-based electronic camera, the camera may obscure the front of the distal end of the endoscope part of the field of view.

Contents of the invention

In one embodiment, the cavity interposer has a cavity, a first bonding pad disposed within a base of the cavity at a first level adapted to be coupled to the camera-on-a-chip cube, the first bonding pad passing through a feedthrough a second bonding pad at a second level coupled to the base of the interposer; and a third bonding pad adapted to be coupled to a light emitting diode (LED), the third bond The bonding pad is at the third level. The third bonding pad is coupled to the fourth bonding pad at the second level at the base of the interposer; and the second and fourth bonding pads are coupled to the conductors of the cable, wherein The first level, the second level and the third level are different. In an embodiment, an endoscope optical includes a cavity inserter, an LED, and a chip-type camera cube electrically bonded to a first bonding pad; the LED is bonded to a third bonding pad; and the chip-type camera cube The top of the camera cube and the top of the LED are at the same level.

Description of the drawings

In the drawings, like reference numerals in the first and second figures indicate structures having substantially the same description and function as illustrated in the first and second figures.

Figure 1A is a schematic illustration of a cross-section of a cavity interposer, a substrate that allows surface mounting of a camera with a lens at the same level as adjacent LEDs.

Figure IB is a schematic illustration of a cross-section of a cavity inserter formed from two layered portions.

FIG. 2 is a schematic diagram of an optical endoscope head unit including the cavity inserter of FIGS. 1A and 1B .

Figure 3 is a schematic cross-sectional view of an alternative embodiment of a cavity inserter showing attached LEDs.

Figure 4 is a top view of the circular optical endoscope head showing the mounted LED and camera cube.

Figure 5 is a top view of a rectangular optical endoscope head showing the mounted LED and camera cube.

6 is an end view of an endoscope incorporating the optical endoscope head portion of FIG. 4 .

7 is a schematic diagram of a cross-section of an endoscope incorporating the optical endoscope head portion of FIG. 2 or 4 .

Figure 8 is a schematic top plan view of a lumen inserter having a truncated trapezoidal shape configured for use in a small diameter endoscope.

Figure 9 is a schematic top plan view of a cavity inserter derived from Figure 8 having a rim to which a lid may be sealed or which may be filled with a transparent plastic material.

Detailed ways

Cavity interposer 100 (FIG. 1A) includes a substrate 102 having feedthrough conductors 104, 110 connecting bond pads 108, 114 suitable for ball bonding mounted light emitting diodes. to bonding pads 108, 114 adapted to be attached to the conductors of the connecting cable. The interposer 100 has a cavity 115 adapted to receive a "camera cube-on-a-chip" with bonding pads 118, 122 suitable for ball bonding to mount the camera-on-a-chip cube (as shown in Figure 2). Bond pads 118, 122 are coupled to bond pads 120, 126 at the base 125 of the cavity interposer 100 by conductive feedthroughs 116, 124, the bond pads 120, 126 being adapted to be separately attached to the connection cables. conductor. The cable may have as few as five conductors, although many embodiments, including those with fluorescent stimulation LEDs (see below), may have more than five conductors.

In one embodiment, cavity inserter 100 is assembled into endoscopic optical head assembly 200 (FIG. 2) with camera cube 202 positioned in cavity 115 and the bonding pads of camera cube 202 bonded to Bonding pads 118, 122. The optical head assembly also includes at least one light emitting diode (LED) 204 bonded to the bond pads 108 , 114 and configured to illuminate the field of view imageable by the camera cube 202 Object, in particular embodiments, LED 204 is a white light LED. The endoscope optical head assembly 200 also has a transparent protective window 205 that is sealed with a waterproof material and positioned to protect the camera cube 202 and the LED 204; in order to support the transparent protective window 205 on the camera cube 202 and the LED 204 Above, the cavity inserter may have an edge 216 in some embodiments to support a transparent protective window 205 . Camera cube 202 includes imaging lens 203 and image sensor 208, as well as a spacer (not shown in Figure 2) that provides sufficient space between imaging lens 203 and image sensor 208 to image objects within the field of view. Focus on image sensor 208. Typically, the image sensor 208 includes a color filter array 214 having a tiling pattern of color filters, such as a Bell pattern tiling pattern, including red, green and blue bandpass filters to provide full color images. The camera cube 202 is configured typically with solder bumps on its lower surface for bonding to the bonding pads 118 , 122 of the cavity interposer 100 , and in one embodiment, the camera cube 202 is ball-bonded Bonded to the bond pads 118, 122 of the cavity interposer 100. In an alternative embodiment, the bond pads of the camera cube 202 are electrically bonded to the bond pads 118, 122 of the cavity interposer 100 using a conductive silver-containing glue or anisotropic conductive film. In the endoscope optical head, bonding pads 106 , 112 , 120 , 126 on the lower surface of the cavity inserter 100 are attached to conductors 209 formed on the flexible substrate 210 to form a flexible endoscope cable 212 . In one embodiment, the top of camera cube 202 is at the same level as the top of LED 204.

In certain embodiments, the cavity interposer is assembled from two wafers of substrate material, with lower portion 164 (FIG. 1B) formed with a plurality of lower cavity interposer portions having feedthroughs 116, 124 , 160, 162 and appropriate bonding pads 120, 112, 126, and the upper portion 170 is formed with a plurality of cavity interposer portions with cavities 115 formed therein. The upper portion 170 is formed with feedthroughs 172 , 174 that are aligned with the feedthroughs 160 , 162 of the lower portion 164 to form long feedthroughs 104 , 110 that reach where the LEDs will be bonded. level (also referred to as level or height) and reaches bonding pads 108, 114 for the LEDs, while feedthrough 124 reaches bonding pads 122, 122 suitable for attaching the camera cube 202 (FIG. 2) 118. The two wafers are then bonded together so that the lower portion's feedthroughs 160, 162 are electrically connected to the upper portion's aligned feedthroughs 172, 174 and the cavity 115 is in the correct position, and the wafer is then cut to form the cavity insert device. In an alternative embodiment, the camera cube 202 and LED 204 are bonded into the cavity 115 and to the bond pads of the cavity interposer before the wafer is diced to form the optical head assembly.

In embodiments with edge 216, the edge may be formed as a third wafer and bonded to the wafer with the upper portion of the cavity inserter prior to cutting the wafer. In some of these embodiments, a transparent cover (not shown) is attached over the edge before dicing the wafer. In an alternative embodiment, instead of sealing a transparent cover over the camera cube and LED, a transparent plastic material is injected into the cavity formed by the edges and serves to cover and protect both the camera cube and LED. The clear cover and clear plastic material both serve to protect the camera cube, the LEDs, and any bonding wires present within the cavity formed by the edges.

In an embodiment, cavity inserter 100 is a multi-layer ceramic structure in which cavity 115 is formed in one or more layers before the layers are fired together. In an alternative embodiment, the cavity inserter 100 is formed from a composite material such as injection molded plastic or a printed circuit board material, in which the holes for the feedthroughs 116, 124, 104, 110 may be passed through Laser drilling is formed, and the cavity 115 can be formed by mechanical drilling; in embodiments where the cavity interposer is formed from a printed circuit board material, the cavity interposer can be formed from one or more layers of insulating material, two or three layers of conductive material and one or more layers of insulating support material are formed. Once formed, in some embodiments the holes for the feedthroughs are plated through to form the feedthroughs 116, 124, 104, 110, and in other embodiments the feedthroughs 116, 124, 104, 110 are deposited by chemical vapor deposition ( CVD) or evaporated metal deposition.

In one embodiment, flexible substrate 210 is formed from a flexible printed circuit material and is bonded except at the distal end where it is bonded to the bonding pads of the cavity interposer and at the proximal end where it is bonded to additional circuitry Outside of place, conductor 209 is covered with insulating material.

In an alternative embodiment, cavity interposer 300 (FIG. 3) is formed such that the bonding pads 302 associated with LED 304 are not directly beneath the LED (as shown in FIGS. 1 and 2), but are instead The shelf 306 is adjacent and at a higher level than the shelf 306 such that the upper surface of the LED 304 is coplanar with the upper surface of the bond pad 302 . For this embodiment, LED 304 may be wire bonded to bonding pad 302, coupled to bonding pad 302 through anisotropic conductive film 310, or coupled to bonding pad 302 through a thin flexible printed circuit, while Not a solder ball bonded LED 304. In this embodiment, the feedthrough 312 associated with the LED is longer than the feedthrough 104 associated with the LED of the embodiment of FIGS. 1 and 2 .

In the embodiment of circular interposer 400 (FIG. 4), first LED 402, optional second LED 404, optional third LED 406, and optional fourth LED 408 are located below window 205. These LEDs Located on the side of camera cube 410. In the square interposer 500 (FIG. 5) embodiment, first LED 402, optional second LED 404, optional third LED 406, and optional fourth LED 408 are also located below window 205, these LEDs are located Side of camera cube 410.

In alternative embodiments more than one LED may be present, in some embodiments at least one white light LED is provided for white light color imaging and a separate fluorescence imaging LED is provided and adapted to provide the fluorescence stimulation wavelength The fluorescent imaging LED may have a filter to block light at wavelengths that pass through the fluorescent-imaging tile of the color filter array 214 . In embodiments with fluorescent stimulation or excitation wavelength LEDs, there may be filters that block the fluorescence stimulation wavelength incorporated into the tiling pattern of the color filter array 214 and configured to reduce the fluorescence of the fluorophore of interest. Light of the emission wavelength passes, and the color filter array 214 may be spliced with a color filter splicing pattern that includes more than three filters, namely red, green, and blue filters of a traditional Bell pattern filter. Lots of filters. In certain embodiments, in addition to the red, green, and blue filters in each tiled pattern, there are color filters with passbands in the near-infrared, and color filters with one or more fluorophores in Each associated passband is one or more color filters. For example, the embodiment of Figure 5 may be assembled with two white light LEDs 402, 404 arranged on opposite sides of the camera cube 410, and two fluorescence stimulation wavelength LEDs 406, 408. In alternative embodiments, several different wavelengths of fluorescence stimulation wavelength LEDs may be present to allow detection of and discrimination between multiple fluorophores in tissue.

The endoscopic optical head assembly 200 is used as a component of an endoscope or other device that requires imaging in delicate locations, such as a borescope used to perform optical inspections of the cylinder bore of an engine or the interior of a gun barrel. Medical uses for endoscopes using optical head assemblies include colonoscopy, hysteroscopy, laparoscopy, sigmoidoscopy, and laryngoscopy. In certain embodiments, the entire endoscope optical head 800, 900, or 600 including the inserter has an outer diameter of less than 1.5 mm and is particularly suitable for use in small diameter endoscopes such as bronchoscopes, urethroscopes, and cystoscopes. uses in.

In a typical endoscopic application, endoscope end 600 (Fig. 6) includes the end of endoscope body 602, lumen inserter 400, attachment points for one or more steering wires (not shown) and an opening through the lumen 604 of the endoscope body 602 through which operating tools such as, but not limited to, electrocautery, wire loops, and cell samplers can reach the front of the endoscope optical head 600, 800, or 900. field of view. Endoscope end 600 forms the end of endoscope 700 having an endoscope body 702, a lumen inserter 400, 500, 802 or 902, an operating handle 706 (which may include controls for manipulating wires ) and a connector 708 to an electronic digital image display & processing system 710 that displays images to guide a physician or other user.

In an embodiment, the endoscope optical head is formed by fabricating a wafer of a lumen inserter that is individually formed as described with reference to Figure 1 or Figure 3, but has not been cut into individual lumen inserters. A separate diced chip-type camera is then inserted into each cavity of the cavity interposer and bonded to the bonding pads at the first level of each cavity, and the LEDs are also attached and bonded to the cavity The bonding pads on the third level of the interposer. Each bond pad of the first and third levels of the interposer is coupled by a feedthrough to a bond pad of the cavity interposer at the second level.

In embodiments without edge 216, the spacer wafer may be bonded to the cavity inserter wafer. The protective window wafer is then bonded on top of the cavity inserter or on top of the spacer wafer. The cavity interposer is then cut, typically by sawing, and the conductors of the cable are attached to the second level bonding pads of the cavity interposer.

In some embodiments, particularly suitable for use in small diameter endoscopic lenses 800 (Fig. 8), the lumen inserter 802 has a truncated isosceles trapezoidal shape. In these embodiments, the short parallel side 804 of the cavity is configured to be positioned against the curved inside of the endoscope head portion 800; the short parallel side 804 is adjacent the camera cube 806. The long parallel side 808 is configured to be positioned closer to the center of the endoscopic lens portion 800 and adjacent the camera cube 806 and two LEDs 810, 812, one LED positioned on each side of the camera cube 806 and parallel to the short Side 804 is closer to long parallel side 808. Isosceles edges 814, 816 extend at a 45 degree angle from short parallel edge 804 downwardly toward long parallel edge 808, but do not meet long parallel edge 808, and terminate at vertically truncated sides after providing space for LEDs 810, 812. Side 818, 820. Using a lumen inserter with a truncated isosceles trapezoidal shape may provide more space for the endoscope lumen 825 or other functional portions of the endoscope head portion 800 than a square inserter as illustrated in FIG. 5 .

In some embodiments of the endoscope head 900 (Fig. 9), the lumen inserter 902 has an edge 904 to which a cover (not shown) may be sealed, or the edge 904 may be filled with a clear plastic material, as previously described Described with reference to edge 216.

combination

The cavity inserter, camera cube, LEDs, and cables described in this article can be configured in a variety of ways. The configurations expected by the inventor are:

A cavity interposer, designated A, has a body configured with a cavity, a plurality of first bond pads adapted to be coupled to bond pads of a chip camera cube (CCube), a first bond pad arrangement a first bonding pad at a first level within the base of the cavity coupled to a second bonding pad at a second level at the base of the cavity interposer through a feedthrough; and

A plurality of third bonding pads adapted to be coupled to bonding pads of light emitting diodes (LEDs), the third bonding pads being arranged at a third level. The third bonding pad is coupled to the fourth bonding pad at the second level at the base of the cavity interposer through the feedthrough; and the second bonding pad and the fourth bonding pad are adapted to be coupled to The conductors of a cable in which the first, second, and third levels are different.

An endoscopic optical head, designated AA, includes a cavity inserter designated A, at least one LED, and a chip camera cube, wherein the chip camera cube is electrically bonded to a first bonding pad; the LED is bonded to a Three bonding pads; and the top of the chip camera cube and the top of the LED are at the same level.

An endoscopic optical head designated AB includes an endoscopic optical head designated AA and has a cable including a plurality of electrical conductors bonded to a second bond pad or a first Four bond pads for bonding pads.

An endoscopic optical head designated AC includes an endoscopic optical head designated AA or AB and having an LED ball bonded to a third bonding pad.

An endoscopic optical head designated AD includes an endoscopic optical head designated AA or AB and having an LED wire bonded to a third bonding pad, and wherein the third bonding pad is The top of the LED is at the same level.

An endoscopic optical head designated AE includes an endoscopic optical head designated AA, AB, AC, or AD, wherein the camera cube has a mosaic pattern that includes an infrared optical filter.

An endoscopic optical head designated AF includes an endoscopic optical head designated AA, AB, AC, AD, or AE, wherein a plurality of LEDs are present, and at least one LED is a white light LED, and at least one LED For the fluorescence stimulation wavelength LED.

A lumen inserter designated B, including a lumen inserter designated A, is in the shape of a truncated isosceles trapezoid in top plan view.

An endoscope head section designated BA, including a cavity inserter designated B, a first white light LED, a second fluorescence stimulation wavelength LED, and a chip camera cube ball bonded to the first bond bond plate.

An endoscope head portion designated BB, including a cavity inserter designated B, at least two LEDs, and a camera-on-a-chip cube, wherein: the camera-on-a-chip cube is ball bonded to a first bonding pad; and the two LEDs bonded to the third bond pad, the two LEDs on opposite sides of the camera-on-a-chip cube and closer to the parallel long sides of the cavity interposer than to the parallel short sides of the cavity interposer; and the camera-on-a-chip The top of the cube and the top of the LED are at the same level.

An endoscope head portion designated BC, including a lumen inserter designated B, BA, or BB, wherein the lumen inserter further includes an edge, and further includes protection for the camera cube selected from a transparent seal sealed to the edge A set consisting of a cover and a transparent plastic material in the space formed by the edge of the cavity inserter.

An endoscope head section designated BD, including a lumen inserter designated B, wherein the truncated isosceles trapezoidal shape of the lumen inserter includes two isosceles sides of the lumen inserter, each isosceles side extending from the lumen inserter The short parallel side extends at a 45 degree angle and terminates in the short vertical side of the cavity inserter, which extends to the long parallel side of the cavity inserter.

An endoscopic imaging system, designated C, includes an endoscope including a lumen inserter having a body configured with a lumen, the body including a plurality of first bonding pads, a plurality of first keys The bonding pads are adapted to be coupled to bonding pads of a chip camera cube (CCube), a first bonding pad being arranged within the base of the cavity at a first level, the first bonding pad being coupled via a feedthrough connected to a second pad at a second level within the base of the cavity interposer; and a plurality of third bonding pads adapted to couple to keys of a light emitting diode (LED) a bonding pad, a third bonding pad arranged at the third level; the third bonding pad is coupled to the fourth bonding pad at the third level at the base of the cavity interposer through a feedthrough ; the second bonding pad and the fourth bonding pad are adapted to be coupled to the conductor of the cable; and the first level, the second level and the third level are different; the chip-type camera cube is arranged on within the cavity and having a bonding pad electrically coupled to the cavity interposer; a light emitting diode mounted to a third bonding pad; and a cable having a second bonding pad coupled to the fourth bonding pad A first end of the pad is coupled to a second end of the connector; and the connector is electrically connected to the digital image display and processing system.

A system designated CA, including a system designated C, wherein the endoscope further includes a second LED coupled to a bonding pad of the cavity inserter, the second LED adapted to provide light at a fluorescence stimulation wavelength, and The chip camera cube has a color filter array mosaicd in a pattern that includes filters configured to block light at fluorescence stimulation wavelengths while passing light at fluorescence emission wavelengths.

Changes may be made to the methods and systems described above without departing from their scope. Therefore, it should be noted that what is contained in the above description or shown in the accompanying drawings is to be interpreted as illustrative rather than restrictive. The following claims are intended to cover all general and specific features described herein, and all statements of the scope of the present method and system which, from a linguistic perspective, may be said to fall between them. It is also contemplated that the steps of the methods may be performed in a different order than illustrated and still be within the meaning of the appended claims.

Claims (16)

1. A lumen inserter having a body configured with a lumen, the body comprising:

a plurality of first bond pads adapted to be coupled to bond pads of a chip camera cube (CCube), the first bond pads being disposed within a base of the cavity at a first level, the first bond pads being coupled to second bond pads at a second level at a base of the cavity interposer through a feedthrough; and

a plurality of third bond pads adapted to be coupled to bond pads of a Light Emitting Diode (LED), the third bond pads arranged at a third level;

the third bond pad is coupled to a fourth bond pad at the second level at the base of the cavity interposer through a feedthrough;

the second bond pad and the fourth bond pad are adapted to be coupled to a conductor of a cable; and

the first level, the second level, and the third level are different.

2. An endoscope optical head comprising the cavity inserter of claim 1, at least one LED, and a chip camera cube, wherein:

the chip camera cube is ball bonded to the first bond pad;

the LED is bonded to the third bond pad; and

the top of the chip camera cube and the top of the LED are at the same level.

3. The endoscope optical head of claim 2, further comprising:

a cable comprising a plurality of electrical conductors bonded to the bond pads of the second bond pad or the fourth bond pad.

4. An endoscope optical head as in claim 3 wherein the LED is ball bonded to the third bond pad.

5. The endoscope optical head of claim 3, wherein the LED is wire bonded to the third bond pad, and wherein the third bond pad is at the same level as the top of the LED.

6. The endoscope optical head of claim 5 wherein the chip camera cube has a stitching pattern comprising an infrared optical filter.

7. The endoscope optical head of claim 6 wherein there are a plurality of LEDs and at least one LED is a white light LED and at least one LED is a fluorescence stimulus wavelength LED.

8. The endoscope optical head of claim 4 wherein the camera cube has a stitching pattern comprising an infrared optical filter.

9. The endoscope optical head of claim 8 wherein there are a plurality of LEDs and at least one LED is a white light LED and at least one LED is a fluorescence stimulus wavelength LED.

10. The cavity inserter according to claim 1, having a truncated isosceles trapezoid shape in top plan view.

11. An endoscope head comprising the cavity interposer of claim 10, a first white LED, a second fluorescence stimulus wavelength LED, and a chip-type camera cube ball bonded to the first bond pad.

12. An endoscope optical head comprising the cavity inserter of claim 10, at least two LEDs, and a chip camera cube, wherein:

the chip camera cube is ball bonded to the first bond pad;

the two LEDs are bonded to the third bond pad, the two LEDs being on opposite sides of the chip camera cube and closer to a long parallel side of the cavity interposer than to a short parallel side of the cavity interposer; and

the top of the chip camera cube and the top of the LED are at the same level.

13. The endoscope optical head of claim 12 wherein the lumen inserter further comprises a rim and further comprising protection for the camera cube, the protection selected from the group consisting of a transparent cover sealed to the rim and a transparent plastic material in a space formed by the rim of the lumen inserter.

14. The endoscope optical head of claim 13 wherein the truncated isosceles trapezoid shape of the lumen inserter comprises two isosceles sides of the lumen inserter, each isosceles side extending at a 45 degree angle from the short parallel side of the lumen inserter and terminating in a short vertical side of the lumen inserter that extends to the long parallel side of the lumen inserter.

15. An endoscopic imaging system comprising an endoscope, the endoscope comprising:

a chip-type camera cube;

a cavity interposer having a body configured with a cavity, the body including a plurality of first bond pads coupled to bond pads of a chip camera cube (CCube), the first bond pads disposed within a base of the cavity at a first level, the first bond pads coupled to second bond pads at a second level at the base of the cavity interposer through feedthroughs; and

a plurality of third bond pads adapted to be coupled to bond pads of a Light Emitting Diode (LED), the third bond pads arranged at a third level; the third bond pad is coupled to a fourth bond pad at the second level at the base of the cavity interposer through a feedthrough; the second bond pad and the fourth bond pad are coupled to conductors of a cable; and the first level, the second level, the third level are different;

a light emitting diode mounted to the third bond pad;

the cable having a second end coupled to a connector; and

the connector is electrically connected to the digital image display and processing system.

16. The system of claim 15, wherein the endoscope further comprises a second LED coupled to a bond pad of the cavity interposer, the second LED adapted to provide light of a fluorescence stimulus wavelength, and the chip-type camera cube has a color filter array stitched in a pattern, the color filter array comprising a filter configured to block light of the fluorescence stimulus wavelength while passing light of a fluorescence emission wavelength.