CN117084617A - Use of truncated trapezoidal cavity inserter in small diameter endoscopes to allow for a coplanar endoscope tip assembly of camera and LED - Google Patents

Abstract

The present invention relates to a cavity interposer having a cavity, a first bond pad disposed within a base of the cavity adapted to be coupled to a chip camera cube at a first level, the first bond pad being coupled to a second bond pad at a second level at the base of the interposer through a feedthrough; and a third bond pad adapted to be coupled to a Light Emitting Diode (LED) at a third level. The third bond pad is coupled to a fourth bond pad at the second level at the base of the interposer; and the second bond pad and the fourth bond pad are coupled to conductors of the cable, wherein the first level, the second level, and the third level are different. The endoscope optics includes a cavity interposer, an LED, and a chip camera cube electrically bonded to the first bond pad; the LED is bonded to the third bond pad; and the top of the chip camera cube and the top of the LED are at the same level.

Description

Use of truncated trapezoidal cavity inserter in small diameter endoscopes to allow for a coplanar endoscope tip assembly of camera and LED

RELATED APPLICATIONS

This document is a continuation-in-part application of U.S. patent application Ser. No. 17/504,105 filed on day 10/18 of 2021. The entire contents of the foregoing patent application are incorporated herein by reference.

Background

Endoscopes have become commonplace in medicine for examining tissues or viewing and guiding surgical procedures without making large incisions so that the tissues can be seen with the naked eye, and similar devices are commonly used for examination in the delicate locations of mechanical devices to avoid the need for disassembly. Typically, the distal end of the endoscope is inserted into a delicate location or body and a doctor or other user views the image displayed by a display device near the proximal end of the endoscope.

Past endoscopes have typically had a camera with a lens that focuses light onto the end of a coherent fiber optic bundle at the distal end of the endoscope and directs the light from an external illuminator through an optical fiber onto the tissue or portion to be examined that is in front of the lens; the optical fiber carries an image from the distal end of the endoscope to a display device near the proximal end of the endoscope.

As electronic cameras become smaller and smaller, there is an increasing trend to place light sources such as Light Emitting Diodes (LEDs) or laser diodes and electronic cameras at the distal end of an endoscope and transmit signals from the electronic cameras to a display device near the proximal end of the endoscope.

Chip-type electronic cameras have become commonplace in cell phones and similar devices. They are formed at the wafer level by: the wafer of image sensor integrated circuits is bonded to the spacer wafer and the wafer of lenses is bonded to the spacer wafer such that the lenses are positioned in front of and spaced apart from each image sensor by a focal distance. The composite wafer is then cut into individual cameras by sawing, and the camera surface is then mounted to the substrate.

If the LED and the chip-type electronic camera are surface mounted on a single planar substrate at the distal end of the endoscope, the camera may obscure a portion of the field of view in front of the distal end of the endoscope because the LED is much thinner than the chip-type electronic camera.

Disclosure of Invention

In one embodiment, the cavity interposer has a cavity, a first bond pad disposed within a base of the cavity at a first level adapted to couple to a chip camera cube, the first bond pad coupled to a second bond pad at a second level at the base of the interposer through a feedthrough; and a third bond pad adapted to be coupled to a Light Emitting Diode (LED), the third bond pad being at a third level. The third bond pad is coupled to a fourth bond pad at the second level at the base of the interposer; and the second bond pad and the fourth bond pad are coupled to conductors of the cable, wherein the first level, the second level, and the third level are different. In an embodiment, the endoscope optics (endoscope optical) includes a cavity interposer, an LED, and a chip camera cube electrically bonded to the first bond pad; the LED is bonded to the third bond pad; and the top of the chip camera cube and the top of the LED are at the same level.

Drawings

In the drawings, like reference numerals in the first and second drawings denote structures having substantially the same descriptions and functions as those illustrated in the first and second drawings.

Fig. 1A is a schematic of a cross-section of a cavity interposer, which is a substrate that allows for surface mounting of a camera with lenses at the same level as adjacent LEDs.

Fig. 1B is a schematic view of a cross-section of a lumen inserter formed of two laminar portions.

Fig. 2 is a schematic view of an optical endoscope head including the lumen inserter of fig. 1A, 1B.

Fig. 3 is a schematic cross-sectional view of an alternative embodiment of the cavity interposer, showing an attached LED.

Fig. 4 is a top view of a circular optical endoscope head showing the mounted LEDs and camera cubes.

Fig. 5 is a top view of a rectangular optical endoscope head showing the mounted LEDs and camera cubes.

Fig. 6 is an end view of an endoscope incorporating the optical endoscope head of fig. 4.

Fig. 7 is a schematic view of a cross-section of an endoscope incorporating the optical endoscope head of fig. 2 or 4.

Fig. 8 is a schematic top plan view of a lumen inserter having a truncated trapezoidal shape configured for use in a small diameter endoscope.

Fig. 9 is a schematic top plan view of the cavity inserter from fig. 8, the cavity inserter having a rim to which a cap may be sealed or which may be filled with a transparent plastic material.

Detailed Description

The cavity interposer 100 (fig. 1A) includes a substrate 102, the substrate 102 having feed-through conductors 104, 110, the feed-through conductors 104, 110 connecting bond pads 108, 114 suitable for ball-bond mounting of light emitting diodes to the bond pads 108, 114 suitable for attachment to conductors of a connection cable. The interposer 100 has a cavity 115 adapted to receive a chip-type "camera cube", the cavity 115 having bond pads 118, 122 (shown in fig. 2) adapted for ball bonding to mount the chip-type camera cube. The bond pads 118, 122 are coupled to bond pads 120, 126 at a base 125 of the cavity interposer 100 by conductive feedthroughs 116, 124, the bond pads 120, 126 being adapted for separate attachment to conductors of a connection cable. The cable may have as few as five conductors, although many embodiments, including those with fluorescent stimulation LEDs (see below), may have more than five conductors.

In one embodiment, the cavity inserter 100 is assembled into an endoscope optical head assembly 200 (fig. 2) with the camera cube 202 positioned in the cavity 115 and the bond pads of the camera cube 202 bonded to the bond pads 118, 122. The optical head assembly also includes at least one Light Emitting Diode (LED) 204, the at least one Light Emitting Diode (LED) 204 being bonded to the bond pads 108, 114 and configured to illuminate objects within a field of view that is imageable by the camera cube 202, in particular embodiments, the LED 204 is a white light LED. The endoscope optical head assembly 200 also has a transparent protective window 205, the transparent protective window 205 being sealed with a waterproof material and positioned to protect the camera cube 202 and LEDs 204; to support the transparent protection window 205 over the camera cube 202 and the LEDs 204, the cavity interposer may have an edge 216 to support the transparent protection window 205 in some embodiments. The camera cube 202 includes an imaging lens 203 and an image sensor 208, and a spacer (not shown in fig. 2) that provides sufficient space between the imaging lens 203 and the image sensor 208 to focus an image of an object within the field of view onto the image sensor 208. Typically, the image sensor 208 includes a color filter array 214, the color filter array 214 having a mosaic pattern of color filters (tiling pattern), such as a bayer pattern mosaic pattern, that includes red, green, and blue bandpass filters to provide a full color image. The camera cube 202 is configured to typically have solder bumps on its lower surface for bonding to the bond pads 118, 122 of the cavity interposer 100, and in one embodiment, the camera cube 202 is ball bonded to the bond pads 118, 122 of the cavity interposer 100. In an alternative embodiment, the bond pads of the camera cube 202 are electrically bonded to the bond pads 118, 122 of the cavity interposer 100 with an electrically conductive silver-containing glue or an anisotropically conductive film. In the endoscope optical head, bond pads 106, 112, 120, 126 of the lower surface of the cavity interposer 100 are attached to conductors 209 formed on a flexible substrate 210 to form a flexible endoscope cable 212. In one embodiment, the top of the camera cube 202 is at the same level as the top of the LEDs 204.

In a particular embodiment, the cavity interposer is assembled from two wafers of substrate material, the lower portion 164 (FIG. 1B) is formed with a plurality of lower cavity interposer portions having feedthroughs 116, 124, 160, 162 and appropriate bond pads 120, 112, 126, and the upper portion 170 is formed with a plurality of cavity interposer portions forming cavities 115 therein. The upper portion 170 is formed with feedthroughs 172, 174, the feedthroughs 172, 174 being aligned with the feedthroughs 160, 162 of the lower portion 164 to form long feedthroughs 104, 110, the long feedthroughs 104, 110 reaching the level (which may also be referred to as level or height) at which the LEDs are to be bonded, and reaching the bond pads 108, 114 for the LEDs, while the feedthroughs 124 reach the bond pads 122, 118 adapted for attachment of a camera cube 202 (fig. 2). The two wafers are then bonded together such that the lower portion of the feed throughs 160, 162 are electrically connected to the upper portion of the aligned feed throughs 172, 174 and the cavity 115 is in the correct position, and the wafers are then diced to form the cavity inserters. In an alternative embodiment, camera cube 202 and LEDs 204 are bonded into cavities 115 and to bond pads of the cavity interposer before the wafer is diced to form optical head assemblies.

In embodiments with edge 216, the edge may be formed as a third wafer and bonded to the wafer with the upper portion of the cavity interposer prior to dicing the wafer. In some of these embodiments, a transparent cover (not shown) is attached over the edge prior to dicing the wafer. In an alternative embodiment, instead of sealing a transparent cover over the camera cube and the LEDs, a transparent plastic material is injected into the cavity formed by the rim and serves to cover and protect both the camera cube and the LEDs. Both the transparent cover and the transparent plastic material serve to protect the camera cube, the LEDs and any bond wires present within the cavity formed by the rim.

In an embodiment, the cavity interposer 100 is a multilayer ceramic structure in which the cavities 115 are formed in one or more layers before the layers are fired together. In an alternative embodiment, the cavity inserter 100 is formed of a composite material such as injection molded plastic or printed circuit board material, in which alternative embodiment the holes for the feed throughs 116, 124, 104, 110 may be formed by laser drilling and the cavity 115 may be formed by mechanical drilling; in embodiments where the cavity interposer is formed of printed circuit board material, the cavity interposer may be formed of one or more layers of insulating material, two or more layers of conductive material, and one or more layers of insulating support material. Once formed, the holes for the feedthroughs are plated through in some embodiments to form the feedthroughs 116, 124, 104, 110, and in other embodiments, the feedthroughs 116, 124, 104, 110 are formed by Chemical Vapor Deposition (CVD) or evaporative metal deposition.

In one embodiment, the flexible substrate 210 is formed of a flexible printed circuit material and the conductors 209 are covered with an insulating material except where bonded to the bond pads of the cavity interposer at the distal end and where bonded to additional circuitry at the proximal end.

In an alternative embodiment, the cavity interposer 300 (fig. 3) is formed such that the bond pads 302 associated with the LEDs 304 are not directly beneath the LEDs (as shown in fig. 1 and 2), but are adjacent to the shelf 306 and at a higher level than the shelf 306 such that the upper surfaces of the LEDs 304 are coplanar with the upper surfaces of the bond pads 302. For this embodiment, the LED 304 may be wire bonded to the bond pad 302, coupled to the bond pad 302 by an anisotropic conductive film 310, or coupled to the bond pad 302 by a thin flexible printed circuit, rather than solder ball bonding the LED 304. In this embodiment, the feedthrough 312 associated with the LED is longer than the feedthrough 104 associated with the LED of the embodiment of fig. 1 and 2.

In the embodiment of the circular interposer 400 (fig. 4), a first LED 402, an optional second LED 404, an optional third LED 406, and an optional fourth LED 408 are located below the window 205, which are located at the sides of the camera cube 410. In the square interposer 500 (fig. 5) embodiment, the first LED 402, optional second LED 404, optional third LED 406, and optional fourth LED 408 are also located below the window 205, these LEDs being located at the sides of the camera cube 410.

In alternative embodiments, there may be more than one LED, in some embodiments at least one white LED is provided for white light color imaging and a separate fluorescent imaging LED is provided and adapted to provide fluorescent stimulus wavelengths, which may have filters to block light of wavelengths passing through fluorescent imaging tiles (color filter array 214). In embodiments with fluorescent stimulus or excitation wavelength LEDs, there may be filters incorporated into the stitching pattern of color filter array 214 that block fluorescent stimulus wavelengths configured to pass light of the fluorescent emission wavelengths of the fluorophores of interest, and color filter array 214 may be stitched with a color filter stitching pattern that includes more filters than three filters, namely the red, green, and blue filters of a conventional bayer pattern filter. In particular embodiments, in addition to the red, green, and blue filters in each stitching pattern, there are color filters having pass bands in the near infrared, and one or more color filters having pass bands associated with each of the one or more fluorophores. For example, the embodiment of fig. 5 may be assembled with two white LEDs 402, 404 and two fluorescence stimulus wavelength LEDs 406, 408 arranged on opposite sides of a camera cube 410. In alternative embodiments, several different wavelengths of fluorescence stimulus wavelength LEDs may be present to allow detection of multiple fluorophores in tissue and to distinguish between the multiple fluorophores.

The endoscope optical head assembly 200 is used as a component of an endoscope or other device requiring imaging in a delicate location, such as a borescope for performing optical inspection of the interior of a cylinder bore or barrel of an engine. Medical uses for endoscopes using optical head assemblies include colonoscopes, hysteroscopes, laparoscopes, sigmoidoscopes, and laryngoscopes. In certain embodiments, the entire endoscope optical head 800, 900 or 600, including the inserter, has an outer diameter of less than 1.5 millimeters, and is particularly suited for use in small diameter endoscopes, such as bronchoscopes, urethroscopes, and cystoscopes.

In a typical endoscopic application, the endoscope tip 600 (fig. 6) includes the tip of an endoscope body 602, a lumen inserter 400, attachment points for one or more steering wires (not shown), and an opening through the lumen 604 of the endoscope body 602 through which operating tools, such as but not limited to electrocauteries, wire loops, and cell samplers, can reach the field of view in front of the endoscope optical head 600, 800, or 900. Endoscope end 600 forms the end of endoscope 700, endoscope 700 having endoscope body 702, lumen inserter 400, 500, 802, or 902, operating handle 706 (which may include controls for manipulating wires), and connector 708 connected to an electronic digital image display & processing system 710, which electronic digital image display & processing system 710 displays images to guide a physician or other user.

In an embodiment, the endoscope optical head is formed by manufacturing a wafer of cavity inserters, which are individually shaped as described with reference to fig. 1 or 3, but which have not yet been cut into individual cavity inserters. Then, a separate diced chip-type camera is inserted into each cavity of the cavity interposer and bonded to the bond pads at the first level of each cavity, and the LEDs are also attached and bonded to the bond pads at the third level of the cavity interposer. Each bond pad of the first level and the third level of the interposer is coupled to a bond pad of the cavity interposer at the second level through a feedthrough.

In embodiments without edge 216, the spacer wafer may be bonded to the wafer of the cavity interposer. The wafer protecting the window is then bonded on top of the cavity interposer or on top of the spacer wafer. The cavity interposer is then cut, typically by sawing, and the conductors of the cable are attached to the second level bond pads of the cavity interposer.

In some embodiments, particularly suited for use in small diameter endoscope head 800 (fig. 8), lumen inserter 802 has a truncated isosceles trapezoid shape. In these embodiments, the short parallel side 804 of the lumen is configured to be positioned against the curved inner side of the endoscope head 800; the short parallel side 804 is adjacent to the camera cube 806. The long parallel side 808 is configured to be positioned closer to the center of the endoscope head 800 and adjacent to the camera cube 806 and two LEDs 810, 812, one LED positioned on each side of the camera cube 806 and closer to the long parallel side 808 than to the short parallel side 804. Isosceles sides 814, 816 extend downwardly from short parallel side 804 toward long parallel side 808 at a 45 degree angle, but do not meet long parallel side 808, and terminate in vertically truncated sides 818, 820 after providing room for LEDs 810, 812. The use of a truncated isosceles trapezoid shaped lumen inserter may provide more space for the endoscope lumen 825 or other functional portion of the endoscope head 800 than a square inserter as illustrated in fig. 5.

In some embodiments of the endoscope head 900 (fig. 9), the lumen inserter 902 has a rim 904, a cover (not shown) may be sealed to the rim 904, or the rim 904 may be filled with a transparent plastic material, as previously described with reference to rim 216.

Combination of two or more kinds of materials

The cavity inserters, camera cubes, LEDs, and cables described herein may be configured in a variety of ways. The inventors contemplated configurations were:

a cavity interposer designated a has a body configured with a cavity, a plurality of first bond pads adapted to be coupled to bond pads of a chip camera cube (CCube), the first bond pads disposed within a base of the cavity at a first level, the first bond pads coupled to second bond pads at a second level at the base of the cavity interposer through feedthroughs; and

a plurality of third bond pads adapted to be coupled to bond pads of a Light Emitting Diode (LED), the third bond pads disposed at a third level. The third bond pad is coupled to a fourth bond pad at the second level at the base of the cavity interposer through a feedthrough; and the second bond pad and the fourth bond pad are adapted to be coupled to a conductor of a cable, wherein the first level, the second level, and the third level are different.

An endoscope optical head designated AA includes a cavity interposer designated a, at least one LED, and a chip camera cube, wherein the chip camera cube is electrically bonded to a first bond pad; the LED is bonded to the third bond pad; and the top of the chip camera cube and the top of the LED are at the same level.

An endoscope optical head designated as AB includes an endoscope optical head designated as AA and has a cable including a plurality of electrical conductors bonded to bond pads of the second bond pad or the fourth bond pad.

An endoscope optical head designated as AC includes an endoscope optical head designated as AA or AB and has an LED ball bonded to a third bond pad.

An endoscope optical head designated AD includes an endoscope optical head designated AA or AB and has an LED wire bonded to a third bond pad, and wherein the third bond pad is at the same level as the top of the LED.

An endoscope optical head designated AE includes an endoscope optical head designated AA, AB, AC, or AD, wherein the camera cube has a stitching pattern that includes an infrared optical filter.

An endoscope optical head designated as AF includes an endoscope optical head designated as AA, AB, AC, AD or AE in which there are a plurality of LEDs, and at least one LED is a white light LED, and at least one LED is a fluorescence stimulus wavelength LED.

A cavity inserter designated B comprising a cavity inserter designated a having a truncated isosceles trapezoid shape in top plan view.

An endoscope head designated as BA includes a cavity interposer designated as B, a first white light LED, a second fluorescence stimulus wavelength LED, and a chip-type camera cube ball bonded to a first bond pad.

An endoscope head designated BB comprising a lumen inserter designated B, at least two LEDs, and a chip camera cube, wherein: a chip camera cube ball bonded to the first bond pad; two LEDs bonded to the third bond pad, the two LEDs on opposite sides of the chip camera cube and closer to the parallel long side of the cavity interposer than to the parallel short side of the cavity interposer; and the top of the chip camera cube and the top of the LED are at the same level.

An endoscope head designated BC comprising a lumen inserter designated B, BA or BB, wherein the lumen inserter further comprises a rim, and further comprising a protection for the camera cube, the protection being selected from the group consisting of a transparent cover sealed to the rim and a transparent plastic material in a space formed by the rim of the lumen inserter.

An endoscope head designated BD comprising a lumen inserter designated B, wherein the truncated isosceles trapezoid shape of the lumen inserter comprises two isosceles sides of the lumen inserter, each isosceles side extending at an angle of 45 degrees from the short parallel side of the lumen inserter and terminating in a short vertical side of the lumen inserter that extends to the long parallel side of the lumen inserter.

An endoscopic imaging system designated C includes an endoscope including a cavity inserter having a body configured with a cavity, the body including a plurality of first bond pads adapted to be coupled to bond pads of a chip camera cube (CCube), the first bond pads being disposed within a base of the cavity at a first level, the first bond pads being coupled to second bond pads within the base of the cavity inserter at a second level by feed-throughs; and a plurality of third bond pads adapted to be coupled to bond pads of a Light Emitting Diode (LED), the third bond pads disposed at a third level; the third bond pad is coupled to a fourth bond pad at a third level at the base of the cavity interposer through a feedthrough; the second bond pad and the fourth bond pad are adapted to be coupled to a conductor of a cable; and the first level, the second level, and the third level are different; a chip camera cube disposed within the cavity and having bond pads electrically coupled to the cavity interposer; a light emitting diode mounted to the third bonding pad; a cable having a first end coupled to the second bond pad and the fourth bond pad and a second end coupled to the connector; and the connector is electrically connected to the digital image display and processing system.

A system designated as CA comprising a system designated as C wherein the endoscope further comprises a second LED coupled to the bond pad of the cavity interposer, the second LED adapted to provide light of a fluorescence stimulus wavelength, and the chip camera cube has a color filter array stitched in a pattern comprising a filter configured to block light of the fluorescence stimulus wavelength while passing light of the fluorescence emission wavelength.

Variations may be made in the above methods and systems without departing from the scope thereof. It should be noted, therefore, that what is included in the above description or shown in the accompanying drawings is to be interpreted as illustrative and not in a limiting sense. The following claims are intended to cover all of the generic and specific features described herein, as well as all statements of the scope of the present methods and systems, which, as a matter of language, might be said to fall therebetween. It is also contemplated that the steps of the method may be performed in a different order than illustrated and still be within the meaning of the appended claims.

Claims (16)

1. A lumen inserter having a body configured with a lumen, the body comprising:

a plurality of first bond pads adapted to be coupled to bond pads of a chip camera cube (CCube), the first bond pads being disposed within a base of the cavity at a first level, the first bond pads being coupled to second bond pads at a second level at a base of the cavity interposer through a feedthrough; and

a plurality of third bond pads adapted to be coupled to bond pads of a Light Emitting Diode (LED), the third bond pads arranged at a third level;

the third bond pad is coupled to a fourth bond pad at the second level at the base of the cavity interposer through a feedthrough;

the second bond pad and the fourth bond pad are adapted to be coupled to a conductor of a cable; and

the first level, the second level, and the third level are different.

2. An endoscope optical head comprising the cavity inserter of claim 1, at least one LED, and a chip camera cube, wherein:

the chip camera cube is ball bonded to the first bond pad;

the LED is bonded to the third bond pad; and

the top of the chip camera cube and the top of the LED are at the same level.

3. The endoscope optical head of claim 2, further comprising:

a cable comprising a plurality of electrical conductors bonded to the bond pads of the second bond pad or the fourth bond pad.

4. An endoscope optical head as in claim 3 wherein the LED is ball bonded to the third bond pad.

5. The endoscope optical head of claim 3, wherein the LED is wire bonded to the third bond pad, and wherein the third bond pad is at the same level as the top of the LED.

6. The endoscope optical head of claim 5 wherein the chip camera cube has a stitching pattern comprising an infrared optical filter.

7. The endoscope optical head of claim 6 wherein there are a plurality of LEDs and at least one LED is a white light LED and at least one LED is a fluorescence stimulus wavelength LED.

8. The endoscope optical head of claim 4 wherein the camera cube has a stitching pattern comprising an infrared optical filter.

9. The endoscope optical head of claim 8 wherein there are a plurality of LEDs and at least one LED is a white light LED and at least one LED is a fluorescence stimulus wavelength LED.

10. The cavity inserter according to claim 1, having a truncated isosceles trapezoid shape in top plan view.

11. An endoscope head comprising the cavity interposer of claim 10, a first white LED, a second fluorescence stimulus wavelength LED, and a chip-type camera cube ball bonded to the first bond pad.

12. An endoscope optical head comprising the cavity inserter of claim 10, at least two LEDs, and a chip camera cube, wherein:

the chip camera cube is ball bonded to the first bond pad;

the two LEDs are bonded to the third bond pad, the two LEDs being on opposite sides of the chip camera cube and closer to a long parallel side of the cavity interposer than to a short parallel side of the cavity interposer; and

the top of the chip camera cube and the top of the LED are at the same level.

13. The endoscope optical head of claim 12 wherein the lumen inserter further comprises a rim and further comprising protection for the camera cube, the protection selected from the group consisting of a transparent cover sealed to the rim and a transparent plastic material in a space formed by the rim of the lumen inserter.

14. The endoscope optical head of claim 13 wherein the truncated isosceles trapezoid shape of the lumen inserter comprises two isosceles sides of the lumen inserter, each isosceles side extending at a 45 degree angle from the short parallel side of the lumen inserter and terminating in a short vertical side of the lumen inserter that extends to the long parallel side of the lumen inserter.

15. An endoscopic imaging system comprising an endoscope, the endoscope comprising:

a chip-type camera cube;

a cavity interposer having a body configured with a cavity, the body including a plurality of first bond pads coupled to bond pads of a chip camera cube (CCube), the first bond pads disposed within a base of the cavity at a first level, the first bond pads coupled to second bond pads at a second level at the base of the cavity interposer through feedthroughs; and

a plurality of third bond pads adapted to be coupled to bond pads of a Light Emitting Diode (LED), the third bond pads arranged at a third level; the third bond pad is coupled to a fourth bond pad at the second level at the base of the cavity interposer through a feedthrough; the second bond pad and the fourth bond pad are coupled to conductors of a cable; and the first level, the second level, the third level are different;

a light emitting diode mounted to the third bond pad;

the cable having a second end coupled to a connector; and

the connector is electrically connected to the digital image display and processing system.

16. The system of claim 15, wherein the endoscope further comprises a second LED coupled to a bond pad of the cavity interposer, the second LED adapted to provide light of a fluorescence stimulus wavelength, and the chip-type camera cube has a color filter array stitched in a pattern, the color filter array comprising a filter configured to block light of the fluorescence stimulus wavelength while passing light of a fluorescence emission wavelength.