CN117074769A - Chip power determining method and device - Google Patents

Chip power determining method and device Download PDF

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Publication number
CN117074769A
CN117074769A CN202310927970.5A CN202310927970A CN117074769A CN 117074769 A CN117074769 A CN 117074769A CN 202310927970 A CN202310927970 A CN 202310927970A CN 117074769 A CN117074769 A CN 117074769A
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China
Prior art keywords
chip
vehicle
temperature
integrated machine
power
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CN202310927970.5A
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Inventor
王珩
王宁
夏云龙
孙永刚
曹斌
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Neusoft Reach Automotive Technology Shenyang Co Ltd
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Neusoft Reach Automotive Technology Shenyang Co Ltd
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Priority to CN202310927970.5A priority Critical patent/CN117074769A/en
Publication of CN117074769A publication Critical patent/CN117074769A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R21/00—Arrangements for measuring electric power or power factor
    • G01R21/06—Arrangements for measuring electric power or power factor by measuring current and voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

The application discloses a chip power determining method and device, wherein the method comprises the following steps: carrying out thermal test on the vehicle-mounted integrated machine to obtain the total power of all chips in the vehicle-mounted integrated machine and the first temperature corresponding to each chip; acquiring the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell; based on the total power of all chips in the vehicle-mounted integrated machine, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted integrated machine, carrying out thermal simulation on the vehicle-mounted integrated machine to obtain a second temperature corresponding to each chip in the vehicle-mounted integrated machine; the actual power of each chip is determined based on the first temperature corresponding to each chip and the second temperature corresponding to each chip. According to the application, the thermal test and the thermal simulation of the vehicle-mounted integrated machine are combined, the test environment of the thermal simulation is consistent with that of the thermal test, so that the thermal simulation precision of the vehicle-mounted integrated machine is improved, and meanwhile, the accurate chip power is obtained, thereby reducing the design risk of the vehicle-mounted integrated machine.

Description

Chip power determining method and device
Technical Field
The application relates to the technical field of testing, in particular to a method and a device for determining chip power.
Background
At present, the application scene of the vehicle-mounted integrated machine is gradually wide, and the chip power in the vehicle-mounted integrated machine is determined mainly through simulation test on the vehicle-mounted integrated machine.
However, because the vehicle-mounted integrated machine can only adopt a natural heat dissipation mode, under the condition of natural heat dissipation, the test environment of the simulation test of the vehicle-mounted integrated machine cannot be attached to the actual environment, so that the simulation precision of the vehicle-mounted integrated machine is low, and the accuracy of chip power is further reduced.
Disclosure of Invention
The application mainly aims to provide a chip power determining method and device, which are used for solving the problem that the accuracy of determining the chip power by using a method in related technology is low.
In order to achieve the above object, in a first aspect, the present application provides a chip power determining method, including:
carrying out thermal test on the vehicle-mounted integrated machine to obtain the total power of all chips in the vehicle-mounted integrated machine and the first temperature corresponding to each chip;
acquiring the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell;
based on the total power of all chips in the vehicle-mounted integrated machine, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted integrated machine, carrying out thermal simulation on the vehicle-mounted integrated machine to obtain a second temperature corresponding to each chip in the vehicle-mounted integrated machine;
The actual power of each chip is determined based on the first temperature corresponding to each chip and the second temperature corresponding to each chip.
In one possible implementation manner, performing a thermal test on the vehicle-mounted integrated machine, to obtain total power of all chips in the vehicle-mounted integrated machine and a first temperature corresponding to each chip, including:
establishing a thermal test environment of the vehicle-mounted integrated machine, and performing thermal test on the vehicle-mounted integrated machine through the thermal test environment, wherein the vehicle-mounted integrated machine in the thermal test environment is arranged in the incubator, and the vehicle-mounted integrated machine is connected with an external direct current source;
if the temperature of the incubator reaches a first preset temperature, reading a current and voltage value of an external direct current source and a first temperature corresponding to each chip in the vehicle-mounted integrated machine;
and (3) carrying out product operation on the current and voltage values of the direct current source to obtain the total power of all chips in the vehicle-mounted integrated machine.
In one possible implementation, obtaining the actual wind speed of the incubator includes:
establishing a thermal test environment of the resistor, and performing thermal test on the resistor through the thermal test environment, wherein the resistor in the thermal test environment is arranged in the incubator and is connected with an external direct current source;
if the temperature of the incubator reaches the second preset temperature, reading the current and voltage values of an external direct current source and the first actual temperature of the resistor;
Establishing a first simulation model of the resistor, and simulating the resistor based on the current and voltage values of an external direct current source based on parameters of the incubator to obtain a first simulation temperature of the resistor;
if the first actual temperature of the resistor and the first simulation temperature of the resistor meet a first preset threshold value, the actual wind speed of the incubator is read.
In one possible implementation, obtaining the actual emissivity of the vehicle-mounted all-in-one housing includes:
establishing a thermal test environment of the vehicle-mounted integrated machine, and performing thermal test on the vehicle-mounted integrated machine through the thermal test environment, wherein a resistor and the vehicle-mounted integrated machine in the thermal test environment are arranged in a temperature box, the resistor is arranged on an upper shell of the vehicle-mounted integrated machine, and the resistor is connected with an external direct current source;
if the temperature of the incubator reaches a third preset temperature, reading the current and voltage values of an external direct current source and the second actual temperature of the resistor;
establishing a second simulation model of the resistor, and simulating the resistor based on the current and voltage values of an external direct current source and the preset emissivity of the vehicle-mounted integrated machine shell to obtain a second simulation temperature of the resistor;
and if the second actual temperature of the resistor and the second simulation temperature of the resistor meet a second preset threshold, reading the actual emissivity of the shell of the vehicle-mounted all-in-one machine.
In one possible implementation manner, based on the total power of all the chips in the vehicle-mounted integrated machine, the actual wind speed of the incubator and the actual emissivity of the housing of the vehicle-mounted integrated machine, performing thermal simulation on the vehicle-mounted integrated machine, and obtaining a second temperature corresponding to each chip in the vehicle-mounted integrated machine, including:
calculating initial power of each chip based on total power and preset total power of all chips in the vehicle-mounted integrated machine;
and carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted all-in-one machine shell, and reading the second temperature corresponding to each chip in the vehicle-mounted all-in-one machine.
In one possible implementation manner, calculating the initial power of each chip based on the total power of all chips in the vehicle-mounted integrated machine and the preset total power includes:
calculating the ratio of the total power of all chips in the vehicle-mounted integrated machine to the preset total power to obtain a power coefficient;
and carrying out product calculation on the power coefficient and preset power of each chip to obtain initial power of each chip.
In one possible implementation, determining the actual power of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip includes:
Calculating the temperature error of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip;
the actual power of each chip is determined based on the temperature error of each chip.
In one possible implementation, calculating the temperature error of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip includes:
and the first temperature corresponding to each chip and the second temperature corresponding to each chip are subjected to difference to obtain the temperature error of each chip.
In one possible implementation, determining the actual power of each chip based on the temperature error of each chip includes:
if chips with temperature errors larger than preset errors exist, the initial power of the chips is adjusted under the condition that the total power of all the chips is unchanged;
returning to the step of performing thermal simulation on the vehicle-mounted integrated machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell, and reading the second temperature corresponding to each chip in the vehicle-mounted integrated machine until the temperature errors of all the chips are smaller than or equal to preset errors;
and acquiring the target power of each chip when the temperature errors of all the chips are smaller than or equal to the preset errors, and taking the target power of each chip as the actual power of each chip.
In a second aspect, an embodiment of the present invention provides a chip power determining apparatus, including:
the thermal test module is used for carrying out thermal test on the vehicle-mounted integrated machine and obtaining the total power of all chips in the vehicle-mounted integrated machine and the first temperature corresponding to each chip;
the acquisition module is used for acquiring the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell;
the thermal simulation module is used for carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the total power of all the chips in the vehicle-mounted all-in-one machine, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted all-in-one machine, and obtaining a second temperature corresponding to each chip in the vehicle-mounted all-in-one machine;
and the power determining module is used for determining the actual power of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip.
In a third aspect, an embodiment of the present invention provides a terminal, including a memory, a processor, and a computer program stored in the memory and executable on the processor, where the processor implements the steps of any of the above chip power determining methods when the computer program is executed.
In a fourth aspect, embodiments of the present invention provide a computer readable storage medium storing a computer program which, when executed by a processor, performs the steps of any of the chip power determining methods described above.
The embodiment of the application provides a method and a device for determining chip power, wherein the method comprises the following steps: the method comprises the steps of firstly carrying out thermal test on the vehicle-mounted all-in-one machine, obtaining total power of all chips in the vehicle-mounted all-in-one machine and first temperatures corresponding to all the chips, then obtaining actual wind speed of an incubator and actual emissivity of a shell of the vehicle-mounted all-in-one machine, then carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the total power of all the chips in the vehicle-mounted all-in-one machine, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted all-in-one machine, obtaining second temperatures corresponding to all the chips in the vehicle-mounted all-in-one machine, and finally determining the actual power of all the chips based on the first temperatures corresponding to all the chips and the second temperatures corresponding to all the chips. According to the application, the thermal test and the thermal simulation of the vehicle-mounted integrated machine are combined, the test environment of the thermal simulation is consistent with that of the thermal test, so that the thermal simulation precision of the vehicle-mounted integrated machine is improved, and meanwhile, the accurate chip power is obtained, thereby reducing the design risk of the vehicle-mounted integrated machine.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application, are incorporated in and constitute a part of this specification. The drawings and their description are illustrative of the application and are not to be construed as unduly limiting the application. In the drawings:
Fig. 1 is a flowchart of an implementation of a method for determining chip power according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a chip power determining device according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a terminal according to an embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terms "first," "second," "third," "fourth" and the like in the description and in the claims and in the above drawings, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein.
It should be understood that, in various embodiments of the present invention, the sequence number of each process does not mean that the execution sequence of each process should be determined by its functions and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.
It should be understood that in the present invention, "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements that are expressly listed or inherent to such process, method, article, or apparatus.
It should be understood that in the present invention, "plurality" means two or more. "and/or" is merely an association relationship describing an association object, and means that three relationships may exist, for example, and/or B may mean: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. "comprising A, B and C", "comprising A, B, C" means that all three of A, B, C comprise, "comprising A, B or C" means that one of the three comprises A, B, C, and "comprising A, B and/or C" means that any 1 or any 2 or 3 of the three comprises A, B, C.
It should be understood that in the present invention, "B corresponding to a", "a corresponding to B", or "B corresponding to a" means that B is associated with a, from which B can be determined. Determining B from a does not mean determining B from a alone, but may also determine B from a and/or other information. The matching of A and B is that the similarity of A and B is larger than or equal to a preset threshold value.
As used herein, "if" may be interpreted as "at … …" or "at … …" or "in response to a determination" or "in response to detection" depending on the context.
The technical scheme of the invention is described in detail below by specific examples. The following embodiments may be combined with each other, and some embodiments may not be repeated for the same or similar concepts or processes.
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the following description will be made by way of specific embodiments with reference to the accompanying drawings.
In one embodiment, as shown in fig. 1, a chip power determining method is provided, which includes the following steps:
step S101: and carrying out thermal test on the vehicle-mounted integrated machine to obtain the total power of all chips in the vehicle-mounted integrated machine and the first temperature corresponding to each chip.
The method comprises the steps of performing thermal test on the vehicle-mounted all-in-one machine, obtaining total power of all chips in the vehicle-mounted all-in-one machine and first temperatures corresponding to all the chips, building a thermal test environment of the vehicle-mounted all-in-one machine, performing thermal test on the vehicle-mounted all-in-one machine through the thermal test environment, reading current and voltage values of an external direct current source and the first temperatures corresponding to all the chips in the vehicle-mounted all-in-one machine if the temperature of an incubator reaches the first preset temperature, and performing product operation on the current and voltage values of the direct current source to obtain total power of all the chips in the vehicle-mounted all-in-one machine. The first preset temperature is set according to specific conditions, and is not particularly limited herein.
Wherein, in the thermal test environment, the on-vehicle all-in-one sets up in the incubator inside, and on-vehicle all-in-one connects outside direct current source. In addition, as the first temperature corresponding to each chip in the vehicle-mounted integrated machine needs to be obtained, a temperature sensor such as a thermocouple is further arranged at the position corresponding to each chip, so that the first temperature corresponding to each chip is obtained in real time in the thermal test process.
The external direct current source connected to the vehicle-mounted integrated machine is not inside the incubator.
When the vehicle-mounted integrated machine is subjected to thermal test, the temperature of the incubator needs to be set, and the temperature of the incubator is generally 0-100 ℃, preferably 80 ℃.
After a thermal test environment of the vehicle-mounted integrated machine is established, all functions of the integrated machine are started, the temperature of the temperature box is checked in real time, and when the temperature of the temperature box reaches a first preset temperature, the temperature corresponding to each chip, the current and the voltage value of the direct current source can be read through the thermocouple. Wherein the total power of all chips is the product of the current and voltage values of the direct current source.
Step S102: and acquiring the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell.
The method comprises the steps of obtaining the actual wind speed of an incubator, firstly establishing a thermal test environment of the resistor, carrying out thermal test on the resistor through the thermal test environment, reading current and voltage values of an external direct current source and the first actual temperature of the resistor if the temperature of the incubator reaches a second preset temperature, then establishing a first simulation model of the resistor, simulating the resistor based on parameters of the incubator, obtaining the first simulation temperature of the resistor, and reading the actual wind speed of the incubator if the first actual temperature of the resistor and the first simulation temperature of the resistor meet a first preset threshold value. Wherein the parameters of the incubator comprise at least a second preset temperature reached by the resistor during the thermal test.
The resistor is required to be arranged inside the incubator in the thermal test environment of the resistor, and the resistor is connected with an external direct current source. In addition, the external direct current source is not arranged inside the incubator, and a temperature sensor for reading the temperature of the resistor, such as a thermocouple, is arranged on the resistor.
When the resistor is thermally tested through the thermal test environment, the temperature of the temperature box is checked in real time, and when the temperature of the temperature box reaches the second preset temperature, the current and voltage values of an external direct current source and the first actual temperature (namely the numerical value displayed in the thermocouple) of the resistor can be directly read.
Then, a first simulation model of the resistor needs to be built according to the thermal test environment of the resistor, that is, the environment of the first simulation model is consistent with the thermal test environment of the resistor. Specifically, the calculation domain of the first simulation model is set according to the size of the incubator in the thermal test environment, an opening is established at the position corresponding to the calculation domain according to the position of the air outlet of the incubator, the resistor inputs fixed power, namely, the fixed power is given according to the product of the current and the voltage of the resistor in the thermal test, the temperature (the second preset temperature) of the incubator, the opening air speed and the like are set.
After setting the environment of the first simulation model, the simulation is started, and then the first simulation temperature of the resistor can be obtained. If the first actual temperature of the resistor and the first simulation temperature of the resistor meet a first preset threshold value, the actual wind speed of the incubator is read. That is, when the first actual temperature is close to the first simulation temperature, the wind speed of the incubator directly read in the simulation environment is the actual wind speed of the incubator. The first preset threshold is relatively smaller, and is set according to specific situations, and is not specifically limited herein.
Acquiring the actual emissivity of the shell of the vehicle-mounted all-in-one machine, firstly establishing a thermal test environment of the vehicle-mounted all-in-one machine, carrying out thermal test on the vehicle-mounted all-in-one machine through the thermal test environment, if the temperature of the incubator reaches a third preset temperature, reading the current and voltage values of an external direct current source and the second actual temperature of the resistor, then establishing a second simulation model of the resistor, simulating the resistor based on the parameters of the incubator, the current and voltage values of the external direct current source and the preset emissivity of the shell of the vehicle-mounted all-in-one machine, obtaining the second simulation temperature of the resistor, and if the second actual temperature of the resistor and the second simulation temperature of the resistor meet a second preset threshold value, reading the actual emissivity of the shell of the vehicle-mounted all-in-one machine. Wherein the parameters of the incubator comprise at least a third preset temperature.
Wherein, resistance and on-vehicle all-in-one set up in the incubator inside in the thermal test environment, and the resistance sets up in the epitheca of on-vehicle all-in-one, optionally, the resistance is hugged closely with the epitheca of on-vehicle all-in-one to and the outside direct current source is connected to the resistance. In addition, the external direct current source is not arranged inside the incubator, and a temperature sensor for reading the temperature of the resistor, such as a thermocouple, is arranged on the resistor.
When the resistor is thermally tested through the thermal test environment, the temperature of the incubator is checked in real time, and when the temperature of the incubator reaches a third preset temperature, the current and voltage values of an external direct current source and the second actual temperature of the resistor (namely, the value displayed in the thermocouple) can be directly read. The third preset temperature may be set according to practical situations, and is not specifically limited herein.
A second simulation model of the resistor is then created based on the thermal test environment of the resistor, i.e. the environment of the second simulation model is kept consistent with the thermal test environment of the resistor. Specifically, the calculation domain of the second simulation model is set according to the size of the incubator in the thermal test environment, an opening is established at the corresponding position of the calculation domain according to the position of the air outlet of the incubator, the resistor inputs fixed power, namely, the product of current and voltage of the resistor in the thermal test is given, the opening wind speed is set, the temperature of the incubator (third preset temperature) and the preset radiance of different shells (including upper shells and lower shells) of the vehicle-mounted all-in-one machine are set, and the like.
After setting the environment of the second simulation model, the simulation is started, and then the second simulation temperature of the resistor can be obtained. And if the second actual temperature of the resistor and the second simulation temperature of the resistor meet a second preset threshold, reading the actual emissivity of the shell of the vehicle-mounted all-in-one machine. That is, when the second actual temperature is close to the second simulation temperature, the emissivity of the vehicle-mounted integrated machine shell directly read in the simulation environment is the actual emissivity of the vehicle-mounted integrated machine shell. The second preset threshold is relatively smaller, and is set according to the specific situation, and is not specifically limited herein.
Step S103: and carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the total power of all the chips in the vehicle-mounted all-in-one machine, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted all-in-one machine, and obtaining the second temperature corresponding to each chip in the vehicle-mounted all-in-one machine.
Based on the total power of all chips in the vehicle-mounted all-in-one machine, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted all-in-one machine shell, performing thermal simulation on the vehicle-mounted all-in-one machine to obtain the second temperature corresponding to each chip in the vehicle-mounted all-in-one machine, calculating the initial power of each chip based on the total power of all chips in the vehicle-mounted all-in-one machine and the preset total power, and then performing thermal simulation on the vehicle-mounted all-in-one machine to read the second temperature corresponding to each chip in the vehicle-mounted all-in-one machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted all-in-one machine shell.
Through the embodiment, after the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted integrated machine are obtained, the initial power of each chip is calculated based on the total power of all chips in the vehicle-mounted integrated machine and the preset total power, so that the vehicle-mounted integrated machine can be subjected to thermal simulation.
The method comprises the steps of calculating initial power of each chip based on total power and preset total power of all chips in the vehicle-mounted all-in-one machine, calculating the ratio of the total power of all the chips in the vehicle-mounted all-in-one machine to the preset total power to obtain a power coefficient, and then performing product calculation on the power coefficient and the preset power of each chip to obtain the initial power of each chip.
The preset total power of all the chips is the total power of all the chips recorded in the power consumption table. The preset power of each chip refers to the maximum power of each chip recorded in the power consumption meter. The total power of all the chips and the preset power of each chip can be directly obtained by means of table lookup and the like.
In the above embodiment, the total power P1 of all the chips in the vehicle-mounted integrated machine has been calculated, and the ratio of the total power P1 of all the chips in the vehicle-mounted integrated machine to the preset total power P2 is directly calculated to obtain the power coefficient n=p1/P2. And then, carrying out product calculation on the power coefficient and the preset power of each chip to obtain the initial power of each chip, wherein if three chips are respectively P3, P4 and P5, the initial powers of the three chips are respectively nP3, nP4 and nP5.
After the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted integrated machine are obtained, the vehicle-mounted integrated machine can be subjected to thermal simulation. The thermal simulation of the vehicle-mounted integrated machine needs to be conducted into simulation software by a simulation model of the vehicle-mounted integrated machine, then simulation parameters are set, for example, a calculation domain is set according to the size of an incubator, materials of the vehicle-mounted integrated machine are set according to actual conditions, the actual wind speed of the incubator and the actual emissivity of a shell are set according to the numerical values obtained by the embodiment, initial power of each chip is set according to the calculated numerical values, and the like.
After the simulation parameters are set, the vehicle-mounted integrated machine can be subjected to thermal simulation, and the second temperature corresponding to each chip in the vehicle-mounted integrated machine can be directly read in simulation software.
Step S104: the actual power of each chip is determined based on the first temperature corresponding to each chip and the second temperature corresponding to each chip.
The actual power of each chip is determined based on the first temperature corresponding to each chip and the second temperature corresponding to each chip, the temperature error of each chip is calculated based on the first temperature corresponding to each chip and the second temperature corresponding to each chip, and then the actual power of each chip is determined based on the temperature error of each chip.
And calculating the temperature error of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip, wherein the temperature error of each chip is mainly obtained by taking the difference between the first temperature corresponding to each chip and the second temperature corresponding to each chip.
The three chips are arranged, the first temperatures corresponding to the three chips are T1, T2 and T3 respectively, the second temperatures corresponding to the three chips are T4, T5 and T6 respectively, and then the first temperatures corresponding to the three chips and the second temperatures corresponding to the three chips can be subjected to difference, so that the temperature errors of the three chips can be respectively a=T1-T4, b=T2-T5 and c=T3-T6.
After calculating the temperature errors of the chips, determining the actual power of the chips based on the temperature errors of the chips, specifically, if the chips with the temperature errors larger than the preset errors exist, adjusting the initial power of the chips under the condition that the total power of all the chips is unchanged, returning to the step of carrying out thermal simulation on the vehicle-mounted integrated machine based on the initial power of the chips, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted integrated machine, reading the second temperature corresponding to the chips in the vehicle-mounted integrated machine until the temperature errors of all the chips are smaller than or equal to the preset errors, and then obtaining the target power of the chips when the temperature errors of all the chips are smaller than or equal to the preset errors, and taking the target power of the chips as the actual power of the chips.
Based on the above embodiment, the initial powers of the three chips are nP3, nP4 and nP5, the temperature errors corresponding to the three chips are a=2%, b=3% and c=6%, respectively, and the preset error is 5%, so that the temperature error of the third chip is greater than the preset error, and the initial power of the third chip needs to be adjusted from nP5 to nP6 under the condition that the total power of all the chips is unchanged. And returning to the step of carrying out thermal simulation on the vehicle-mounted integrated machine based on the initial power of the three chips, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell, reading the second temperatures corresponding to the three chips in the vehicle-mounted integrated machine, and then recalculating the temperature errors of the three chips until the temperature errors of the three chips are smaller than or equal to preset errors.
And when the temperature errors of the three chips are smaller than or equal to the preset errors, the target powers of the three chips are respectively nP3, nP4 and nP6, and finally the target powers of the three chips are taken as the actual powers of the three chips, that is, the actual powers of the three chips are respectively nP3, nP4 and nP6.
The embodiment of the invention provides a chip power determining method, which comprises the following steps: the method comprises the steps of firstly carrying out thermal test on the vehicle-mounted all-in-one machine, obtaining total power of all chips in the vehicle-mounted all-in-one machine and first temperatures corresponding to all the chips, then obtaining actual wind speed of an incubator and actual emissivity of a shell of the vehicle-mounted all-in-one machine, then carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the total power of all the chips in the vehicle-mounted all-in-one machine, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted all-in-one machine, obtaining second temperatures corresponding to all the chips in the vehicle-mounted all-in-one machine, and finally determining the actual power of all the chips based on the first temperatures corresponding to all the chips and the second temperatures corresponding to all the chips. According to the invention, the thermal test and the thermal simulation of the vehicle-mounted integrated machine are combined, the test environment of the thermal simulation is consistent with that of the thermal test, so that the thermal simulation precision of the vehicle-mounted integrated machine is improved, and meanwhile, the accurate chip power is obtained, thereby reducing the design risk of the vehicle-mounted integrated machine.
It should be understood that the sequence number of each step in the foregoing embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic, and should not limit the implementation process of the embodiment of the present invention.
The following are device embodiments of the invention, for details not described in detail therein, reference may be made to the corresponding method embodiments described above.
Fig. 2 shows a schematic structural diagram of a chip power determining device according to an embodiment of the present invention, and for convenience of explanation, only a portion related to the embodiment of the present invention is shown, and the chip power determining device includes a thermal test module 201, an acquisition module 202, a thermal simulation module 203, and a power determining module 204, which are specifically as follows:
the thermal test module 201 is configured to perform a thermal test on the vehicle-mounted integrated machine, and obtain total power of all chips in the vehicle-mounted integrated machine and a first temperature corresponding to each chip;
the acquisition module 202 is used for acquiring the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell;
the thermal simulation module 203 is configured to perform thermal simulation on the vehicle-mounted integrated machine based on the total power of all the chips in the vehicle-mounted integrated machine, the actual wind speed of the incubator, and the actual emissivity of the housing of the vehicle-mounted integrated machine, and obtain a second temperature corresponding to each chip in the vehicle-mounted integrated machine;
The power determining module 204 is configured to determine an actual power of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip.
In one possible implementation manner, the thermal test module 201 is further configured to establish a thermal test environment of the vehicle-mounted integrated machine, and perform a thermal test on the vehicle-mounted integrated machine through the thermal test environment, where the vehicle-mounted integrated machine in the thermal test environment is disposed inside the incubator, and the vehicle-mounted integrated machine is connected to an external direct current source;
if the temperature of the incubator reaches a first preset temperature, reading a current and voltage value of an external direct current source and a first temperature corresponding to each chip in the vehicle-mounted integrated machine;
and (3) carrying out product operation on the current and voltage values of the direct current source to obtain the total power of all chips in the vehicle-mounted integrated machine.
In one possible implementation manner, the obtaining module 202 is further configured to establish a thermal testing environment for the resistor, and perform a thermal test on the resistor through the thermal testing environment, where the resistor is disposed inside the incubator and the resistor is connected to an external dc source;
if the temperature of the incubator reaches the second preset temperature, reading the current and voltage values of an external direct current source and the first actual temperature of the resistor;
Establishing a first simulation model of the resistor, and simulating the resistor based on the current and voltage values of an external direct current source based on parameters of the incubator to obtain a first simulation temperature of the resistor;
if the first actual temperature of the resistor and the first simulation temperature of the resistor meet a first preset threshold value, the actual wind speed of the incubator is read.
In one possible implementation manner, the obtaining module 202 is further configured to establish a thermal test environment of the vehicle-mounted integrated machine, and perform a thermal test on the vehicle-mounted integrated machine through the thermal test environment, where a resistor and the vehicle-mounted integrated machine in the thermal test environment are disposed inside the incubator, the resistor is disposed on an upper shell of the vehicle-mounted integrated machine, and the resistor is connected to an external direct current source;
if the temperature of the incubator reaches a third preset temperature, reading the current and voltage values of an external direct current source and the second actual temperature of the resistor;
establishing a second simulation model of the resistor, and simulating the resistor based on the current and voltage values of an external direct current source and the preset emissivity of the vehicle-mounted integrated machine shell to obtain a second simulation temperature of the resistor;
and if the second actual temperature of the resistor and the second simulation temperature of the resistor meet a second preset threshold, reading the actual emissivity of the shell of the vehicle-mounted all-in-one machine.
In a possible implementation manner, the thermal simulation module 203 is further configured to calculate an initial power of each chip based on a total power of all chips in the vehicle-mounted integrated machine and a preset total power;
and carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted all-in-one machine shell, and reading the second temperature corresponding to each chip in the vehicle-mounted all-in-one machine.
In a possible implementation manner, the thermal simulation module 203 is further configured to calculate a ratio of a total power of all chips in the vehicle-mounted integrated machine to a preset total power, so as to obtain a power coefficient;
and carrying out product calculation on the power coefficient and preset power of each chip to obtain initial power of each chip.
In one possible implementation, the power determining module 204 is further configured to calculate a temperature error of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip;
the actual power of each chip is determined based on the temperature error of each chip.
In one possible implementation, the power determining module 204 is further configured to obtain a temperature error of each chip by differentiating the first temperature corresponding to each chip and the second temperature corresponding to each chip.
In one possible implementation manner, the power determining module 204 is further configured to adjust the initial power of the chips if there are chips with a temperature error greater than a preset error, and the total power of all the chips is unchanged;
returning to the step of performing thermal simulation on the vehicle-mounted integrated machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell, and reading the second temperature corresponding to each chip in the vehicle-mounted integrated machine until the temperature errors of all the chips are smaller than or equal to preset errors;
and acquiring the target power of each chip when the temperature errors of all the chips are smaller than or equal to the preset errors, and taking the target power of each chip as the actual power of each chip.
The embodiment of the invention provides a chip power determining device, which is particularly used for: the method comprises the steps of firstly carrying out thermal test on the vehicle-mounted all-in-one machine, obtaining total power of all chips in the vehicle-mounted all-in-one machine and first temperatures corresponding to all the chips, then obtaining actual wind speed of an incubator and actual emissivity of a shell of the vehicle-mounted all-in-one machine, then carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the total power of all the chips in the vehicle-mounted all-in-one machine, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted all-in-one machine, obtaining second temperatures corresponding to all the chips in the vehicle-mounted all-in-one machine, and finally determining the actual power of all the chips based on the first temperatures corresponding to all the chips and the second temperatures corresponding to all the chips. According to the invention, the thermal test and the thermal simulation of the vehicle-mounted integrated machine are combined, the test environment of the thermal simulation is consistent with that of the thermal test, so that the thermal simulation precision of the vehicle-mounted integrated machine is improved, and meanwhile, the accurate chip power is obtained, thereby reducing the design risk of the vehicle-mounted integrated machine. .
Fig. 3 is a schematic diagram of a terminal according to an embodiment of the present invention. As shown in fig. 3, the terminal 3 of this embodiment includes: a processor 301, a memory 302 and a computer program 303 stored in the memory 302 and executable on the processor 301. The steps of the various chip power determination method embodiments described above, such as steps 101-104 shown in fig. 1, are implemented when the processor 301 executes the computer program 303. Alternatively, the processor 301, when executing the computer program 303, performs the functions of the modules/units of the various chip power determining device embodiments described above, such as the functions of the modules/units 201-204 shown in fig. 2.
The present invention also provides a readable storage medium having a computer program stored therein, which when executed by a processor is configured to implement the chip power determining method provided in the above various embodiments, including:
carrying out thermal test on the vehicle-mounted integrated machine to obtain the total power of all chips in the vehicle-mounted integrated machine and the first temperature corresponding to each chip;
acquiring the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell;
based on the total power of all chips in the vehicle-mounted integrated machine, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted integrated machine, carrying out thermal simulation on the vehicle-mounted integrated machine to obtain a second temperature corresponding to each chip in the vehicle-mounted integrated machine;
The actual power of each chip is determined based on the first temperature corresponding to each chip and the second temperature corresponding to each chip.
In one possible implementation manner, performing a thermal test on the vehicle-mounted integrated machine, to obtain total power of all chips in the vehicle-mounted integrated machine and a first temperature corresponding to each chip, including:
establishing a thermal test environment of the vehicle-mounted integrated machine, and performing thermal test on the vehicle-mounted integrated machine through the thermal test environment, wherein the vehicle-mounted integrated machine in the thermal test environment is arranged in the incubator, and the vehicle-mounted integrated machine is connected with an external direct current source;
if the temperature of the incubator reaches a first preset temperature, reading a current and voltage value of an external direct current source and a first temperature corresponding to each chip in the vehicle-mounted integrated machine;
and (3) carrying out product operation on the current and voltage values of the direct current source to obtain the total power of all chips in the vehicle-mounted integrated machine.
In one possible implementation, obtaining the actual wind speed of the incubator includes:
establishing a thermal test environment of the resistor, and performing thermal test on the resistor through the thermal test environment, wherein the resistor in the thermal test environment is arranged in the incubator and is connected with an external direct current source;
if the temperature of the incubator reaches the second preset temperature, reading the current and voltage values of an external direct current source and the first actual temperature of the resistor;
Establishing a first simulation model of the resistor, and simulating the resistor based on the current and voltage values of an external direct current source based on parameters of the incubator to obtain a first simulation temperature of the resistor;
if the first actual temperature of the resistor and the first simulation temperature of the resistor meet a first preset threshold value, the actual wind speed of the incubator is read.
In one possible implementation, obtaining the actual emissivity of the vehicle-mounted all-in-one housing includes:
establishing a thermal test environment of the vehicle-mounted integrated machine, and performing thermal test on the vehicle-mounted integrated machine through the thermal test environment, wherein a resistor and the vehicle-mounted integrated machine in the thermal test environment are arranged in a temperature box, the resistor is arranged on an upper shell of the vehicle-mounted integrated machine, and the resistor is connected with an external direct current source;
if the temperature of the incubator reaches a third preset temperature, reading the current and voltage values of an external direct current source and the second actual temperature of the resistor;
establishing a second simulation model of the resistor, and simulating the resistor based on the current and voltage values of an external direct current source and the preset emissivity of the vehicle-mounted integrated machine shell to obtain a second simulation temperature of the resistor;
and if the second actual temperature of the resistor and the second simulation temperature of the resistor meet a second preset threshold, reading the actual emissivity of the shell of the vehicle-mounted all-in-one machine.
In one possible implementation manner, based on the total power of all the chips in the vehicle-mounted integrated machine, the actual wind speed of the incubator and the actual emissivity of the housing of the vehicle-mounted integrated machine, performing thermal simulation on the vehicle-mounted integrated machine, and obtaining a second temperature corresponding to each chip in the vehicle-mounted integrated machine, including:
calculating initial power of each chip based on total power and preset total power of all chips in the vehicle-mounted integrated machine;
and carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted all-in-one machine shell, and reading the second temperature corresponding to each chip in the vehicle-mounted all-in-one machine.
In one possible implementation manner, calculating the initial power of each chip based on the total power of all chips in the vehicle-mounted integrated machine and the preset total power includes:
calculating the ratio of the total power of all chips in the vehicle-mounted integrated machine to the preset total power to obtain a power coefficient;
and carrying out product calculation on the power coefficient and preset power of each chip to obtain initial power of each chip.
In one possible implementation, determining the actual power of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip includes:
Calculating the temperature error of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip;
the actual power of each chip is determined based on the temperature error of each chip.
In one possible implementation, calculating the temperature error of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip includes:
and the first temperature corresponding to each chip and the second temperature corresponding to each chip are subjected to difference to obtain the temperature error of each chip.
In one possible implementation, determining the actual power of each chip based on the temperature error of each chip includes:
if chips with temperature errors larger than preset errors exist, the initial power of the chips is adjusted under the condition that the total power of all the chips is unchanged;
returning to the step of performing thermal simulation on the vehicle-mounted integrated machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell, and reading the second temperature corresponding to each chip in the vehicle-mounted integrated machine until the temperature errors of all the chips are smaller than or equal to preset errors;
and acquiring the target power of each chip when the temperature errors of all the chips are smaller than or equal to the preset errors, and taking the target power of each chip as the actual power of each chip.
The readable storage medium may be a computer storage medium or a communication medium. Communication media includes any medium that facilitates transfer of a computer program from one place to another. Computer storage media can be any available media that can be accessed by a general purpose or special purpose computer. For example, a readable storage medium is coupled to the processor such that the processor can read information from, and write information to, the readable storage medium. In the alternative, the readable storage medium may be integral to the processor. The processor and the readable storage medium may reside in an application specific integrated circuit (Application Specific Integrated Circuits, ASIC). In addition, the ASIC may reside in a user device. The processor and the readable storage medium may reside as discrete components in a communication device. The readable storage medium may be read-only memory (ROM), random-access memory (RAM), CD-ROMs, magnetic tape, floppy disk, optical data storage device, etc.
The present invention also provides a program product comprising execution instructions stored in a readable storage medium. At least one processor of the device may read the execution instructions from the readable storage medium, the execution instructions being executed by the at least one processor to cause the device to implement a chip power determination method provided by the various embodiments described above, comprising:
Carrying out thermal test on the vehicle-mounted integrated machine to obtain the total power of all chips in the vehicle-mounted integrated machine and the first temperature corresponding to each chip;
acquiring the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell;
based on the total power of all chips in the vehicle-mounted integrated machine, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted integrated machine, carrying out thermal simulation on the vehicle-mounted integrated machine to obtain a second temperature corresponding to each chip in the vehicle-mounted integrated machine;
the actual power of each chip is determined based on the first temperature corresponding to each chip and the second temperature corresponding to each chip.
In one possible implementation manner, performing a thermal test on the vehicle-mounted integrated machine, to obtain total power of all chips in the vehicle-mounted integrated machine and a first temperature corresponding to each chip, including:
establishing a thermal test environment of the vehicle-mounted integrated machine, and performing thermal test on the vehicle-mounted integrated machine through the thermal test environment, wherein the vehicle-mounted integrated machine in the thermal test environment is arranged in the incubator, and the vehicle-mounted integrated machine is connected with an external direct current source;
if the temperature of the incubator reaches a first preset temperature, reading a current and voltage value of an external direct current source and a first temperature corresponding to each chip in the vehicle-mounted integrated machine;
And (3) carrying out product operation on the current and voltage values of the direct current source to obtain the total power of all chips in the vehicle-mounted integrated machine.
In one possible implementation, obtaining the actual wind speed of the incubator includes:
establishing a thermal test environment of the resistor, and performing thermal test on the resistor through the thermal test environment, wherein the resistor in the thermal test environment is arranged in the incubator and is connected with an external direct current source;
if the temperature of the incubator reaches the second preset temperature, reading the current and voltage values of an external direct current source and the first actual temperature of the resistor;
establishing a first simulation model of the resistor, and simulating the resistor based on the current and voltage values of an external direct current source based on parameters of the incubator to obtain a first simulation temperature of the resistor;
if the first actual temperature of the resistor and the first simulation temperature of the resistor meet a first preset threshold value, the actual wind speed of the incubator is read.
In one possible implementation, obtaining the actual emissivity of the vehicle-mounted all-in-one housing includes:
establishing a thermal test environment of the vehicle-mounted integrated machine, and performing thermal test on the vehicle-mounted integrated machine through the thermal test environment, wherein a resistor and the vehicle-mounted integrated machine in the thermal test environment are arranged in a temperature box, the resistor is arranged on an upper shell of the vehicle-mounted integrated machine, and the resistor is connected with an external direct current source;
If the temperature of the incubator reaches a third preset temperature, reading the current and voltage values of an external direct current source and the second actual temperature of the resistor;
establishing a second simulation model of the resistor, and simulating the resistor based on the current and voltage values of an external direct current source and the preset emissivity of the vehicle-mounted integrated machine shell to obtain a second simulation temperature of the resistor;
and if the second actual temperature of the resistor and the second simulation temperature of the resistor meet a second preset threshold, reading the actual emissivity of the shell of the vehicle-mounted all-in-one machine.
In one possible implementation manner, based on the total power of all the chips in the vehicle-mounted integrated machine, the actual wind speed of the incubator and the actual emissivity of the housing of the vehicle-mounted integrated machine, performing thermal simulation on the vehicle-mounted integrated machine, and obtaining a second temperature corresponding to each chip in the vehicle-mounted integrated machine, including:
calculating initial power of each chip based on total power and preset total power of all chips in the vehicle-mounted integrated machine;
and carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted all-in-one machine shell, and reading the second temperature corresponding to each chip in the vehicle-mounted all-in-one machine.
In one possible implementation manner, calculating the initial power of each chip based on the total power of all chips in the vehicle-mounted integrated machine and the preset total power includes:
calculating the ratio of the total power of all chips in the vehicle-mounted integrated machine to the preset total power to obtain a power coefficient;
and carrying out product calculation on the power coefficient and preset power of each chip to obtain initial power of each chip.
In one possible implementation, determining the actual power of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip includes:
calculating the temperature error of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip;
the actual power of each chip is determined based on the temperature error of each chip.
In one possible implementation, calculating the temperature error of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip includes:
and the first temperature corresponding to each chip and the second temperature corresponding to each chip are subjected to difference to obtain the temperature error of each chip.
In one possible implementation, determining the actual power of each chip based on the temperature error of each chip includes:
If chips with temperature errors larger than preset errors exist, the initial power of the chips is adjusted under the condition that the total power of all the chips is unchanged;
returning to the step of performing thermal simulation on the vehicle-mounted integrated machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell, and reading the second temperature corresponding to each chip in the vehicle-mounted integrated machine until the temperature errors of all the chips are smaller than or equal to preset errors;
and acquiring the target power of each chip when the temperature errors of all the chips are smaller than or equal to the preset errors, and taking the target power of each chip as the actual power of each chip.
In the above described embodiments of the apparatus, it is understood that the processor may be a central processing unit (Central Processing Unit, CPU), but may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), etc. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like. The steps of a method disclosed in connection with the present invention may be embodied directly in a hardware processor for execution, or in a combination of hardware and software modules in a processor for execution.
The above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention, and are intended to be included in the scope of the present invention.

Claims (10)

1. A method for determining chip power, comprising:
carrying out thermal test on the vehicle-mounted integrated machine to obtain the total power of all chips in the vehicle-mounted integrated machine and the first temperature corresponding to each chip;
acquiring the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell;
based on the total power of all chips in the vehicle-mounted all-in-one machine, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted all-in-one machine shell, performing thermal simulation on the vehicle-mounted all-in-one machine to obtain a second temperature corresponding to each chip in the vehicle-mounted all-in-one machine;
and determining the actual power of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip.
2. The method for determining the power of chips according to claim 1, wherein the performing a thermal test on the on-board integrated machine to obtain the total power of all chips in the on-board integrated machine and the first temperature corresponding to each chip includes:
establishing a thermal test environment of the vehicle-mounted integrated machine, and performing thermal test on the vehicle-mounted integrated machine through the thermal test environment, wherein the vehicle-mounted integrated machine in the thermal test environment is arranged in a temperature box, and the vehicle-mounted integrated machine is connected with an external direct current source;
if the temperature of the temperature box reaches a first preset temperature, reading a current and voltage value of the external direct current source and a first temperature corresponding to each chip in the vehicle-mounted integrated machine;
and performing product operation on the current and voltage values of the direct current source to obtain the total power of all chips in the vehicle-mounted all-in-one machine.
3. The chip power determination method of claim 1, wherein the obtaining the actual wind speed of the incubator comprises:
establishing a thermal test environment of a resistor, and performing thermal test on the resistor through the thermal test environment, wherein the resistor in the thermal test environment is arranged in an incubator and is connected with an external direct current source;
If the temperature of the incubator reaches a second preset temperature, reading the current and voltage values of the external direct current source and the first actual temperature of the resistor;
establishing a first simulation model of the resistor, and simulating the resistor based on the current and voltage values of the external direct current source based on the parameters of the incubator to obtain a first simulation temperature of the resistor;
and if the first actual temperature of the resistor and the first simulation temperature of the resistor meet a first preset threshold value, reading the actual wind speed of the incubator.
4. The method for determining the power of the chip according to claim 1, wherein the step of obtaining the actual emissivity of the housing of the vehicle-mounted integrated machine comprises the steps of:
establishing a thermal test environment of a vehicle-mounted integrated machine, and performing thermal test on the vehicle-mounted integrated machine through the thermal test environment, wherein a resistor and the vehicle-mounted integrated machine in the thermal test environment are arranged in a temperature box, the resistor is arranged on an upper shell of the vehicle-mounted integrated machine, and the resistor is connected with an external direct current source;
if the temperature of the incubator reaches a third preset temperature, reading the current and voltage values of the external direct current source and the second actual temperature of the resistor;
Establishing a second simulation model of the resistor, and simulating the resistor based on the current and voltage values of the external direct current source and the preset emissivity of the shell of the vehicle-mounted integrated machine to obtain a second simulation temperature of the resistor;
and if the second actual temperature of the resistor and the second simulation temperature of the resistor meet a second preset threshold, reading the actual emissivity of the shell of the vehicle-mounted integrated machine.
5. The method for determining the chip power according to claim 1, wherein the performing thermal simulation on the on-board integrated machine based on the total power of all the chips in the on-board integrated machine, the actual wind speed of the incubator, and the actual emissivity of the on-board integrated machine housing to obtain the second temperature corresponding to each chip in the on-board integrated machine includes:
calculating initial power of each chip based on total power and preset total power of all chips in the vehicle-mounted integrated machine;
and carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the housing of the vehicle-mounted all-in-one machine, and reading the second temperature corresponding to each chip in the vehicle-mounted all-in-one machine.
6. The method for determining the chip power according to claim 5, wherein calculating the initial power of each chip based on the total power of all chips in the vehicle-mounted integrated machine and the preset total power comprises:
calculating the ratio of the total power of all chips in the vehicle-mounted integrated machine to the preset total power to obtain a power coefficient;
and carrying out product calculation on the power coefficient and preset power of each chip to obtain initial power of each chip.
7. The chip power determining method according to claim 1, wherein the determining the actual power of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip comprises:
calculating the temperature error of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip;
the actual power of each chip is determined based on the temperature error of the chip.
8. The chip power determining method according to claim 7, wherein calculating the temperature error of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip comprises:
And carrying out difference between the first temperature corresponding to each chip and the second temperature corresponding to each chip to obtain the temperature error of each chip.
9. The chip power determining method as claimed in claim 7, wherein said determining the actual power of each chip based on the temperature error of each chip comprises:
if chips with temperature errors larger than preset errors exist, adjusting initial power of the chips under the condition that total power of all the chips is unchanged;
returning to the step of performing thermal simulation on the vehicle-mounted integrated machine based on the initial power of each chip, the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell, and reading the second temperature corresponding to each chip in the vehicle-mounted integrated machine until the temperature errors of all the chips are smaller than or equal to preset errors;
and acquiring the target power of each chip when the temperature errors of all the chips are smaller than or equal to preset errors, and taking the target power of each chip as the actual power of each chip.
10. A chip power determining apparatus, comprising:
the thermal test module is used for carrying out thermal test on the vehicle-mounted integrated machine and acquiring the total power of all chips in the vehicle-mounted integrated machine and the first temperature corresponding to each chip;
The acquisition module is used for acquiring the actual wind speed of the incubator and the actual emissivity of the vehicle-mounted integrated machine shell;
the thermal simulation module is used for carrying out thermal simulation on the vehicle-mounted all-in-one machine based on the total power of all the chips in the vehicle-mounted all-in-one machine, the actual wind speed of the incubator and the actual emissivity of the shell of the vehicle-mounted all-in-one machine, and obtaining a second temperature corresponding to each chip in the vehicle-mounted all-in-one machine;
and the power determining module is used for determining the actual power of each chip based on the first temperature corresponding to each chip and the second temperature corresponding to each chip.
CN202310927970.5A 2023-07-26 2023-07-26 Chip power determining method and device Pending CN117074769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310927970.5A CN117074769A (en) 2023-07-26 2023-07-26 Chip power determining method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310927970.5A CN117074769A (en) 2023-07-26 2023-07-26 Chip power determining method and device

Publications (1)

Publication Number Publication Date
CN117074769A true CN117074769A (en) 2023-11-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310927970.5A Pending CN117074769A (en) 2023-07-26 2023-07-26 Chip power determining method and device

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Country Link
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