CN117309930A - Method, device, equipment, medium and program product for estimating chip junction temperature - Google Patents
Method, device, equipment, medium and program product for estimating chip junction temperature Download PDFInfo
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- CN117309930A CN117309930A CN202311237901.8A CN202311237901A CN117309930A CN 117309930 A CN117309930 A CN 117309930A CN 202311237901 A CN202311237901 A CN 202311237901A CN 117309930 A CN117309930 A CN 117309930A
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- 238000000034 method Methods 0.000 title claims abstract description 76
- 238000012360 testing method Methods 0.000 claims abstract description 155
- 230000017525 heat dissipation Effects 0.000 claims abstract description 54
- 239000000463 material Substances 0.000 claims abstract description 22
- 230000005855 radiation Effects 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 67
- 238000001816 cooling Methods 0.000 claims description 39
- 239000000110 cooling liquid Substances 0.000 claims description 24
- 238000004590 computer program Methods 0.000 claims description 21
- 239000002826 coolant Substances 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 8
- 238000004364 calculation method Methods 0.000 claims description 7
- 230000007613 environmental effect Effects 0.000 claims description 5
- 238000004088 simulation Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 8
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- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
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- 239000003990 capacitor Substances 0.000 description 1
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- 238000009795 derivation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Abstract
The application provides a method, a device, equipment, a medium and a program product for estimating the junction temperature of a chip, which comprise the following steps: acquiring thermal test data of a controller; acquiring a thermal test environment parameter of a controller, a pipeline length of a target input pipeline and a pipeline material of the target input pipeline; according to the thermal resistance temperature of the controller and the calculated domain parameter of the controller, the controller is operated in a simulated mode to reach the thermal resistance temperature so as to obtain the shell emissivity of the controller; and according to the thermal test environment parameters, simulating the operation of the controller according to the maximum power of at least one chip in the controller to obtain chip temperature data corresponding to at least one chip, and determining the junction temperature of the chip after heat dissipation according to the shell radiation rate, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline and the thermal test data. Therefore, the estimation accuracy of the junction temperature of the chip is improved.
Description
Technical Field
The embodiment of the application relates to the technical field of computers, in particular to a method, a device, equipment, a medium and a program product for estimating the junction temperature of a chip.
Background
The controller includes a housing and electronic components enclosed within the housing, such as a PCB (Printed Circuit Board ) and chips, transistors, capacitors and inductors soldered to the PCB. Generally, a water cooling system may be provided for the controller in order to enhance the heat exchange capability of the controller.
In the related art, during the process of designing the controller, firstly, the heat dissipation condition of the water cooling system is determined according to the change condition of the water inlet temperature of the water cooling system during the heat test. Then, the heating condition of the chip in the running process of the controller and the heat dissipation condition of the water cooling system are simulated, and the junction temperature of the chip in the controller is estimated. So as to avoid the phenomenon of chip over-temperature protection in the thermal test or actual operation of the designed controller.
However, in the thermal test or in the actual operation, a certain wind speed is crossed across the surface of the controller, which may affect the surface temperature of the controller, and thus the junction temperature of the chip. Therefore, the chip junction temperature estimated according to the above-described related art is inaccurate.
Disclosure of Invention
The application provides a method, a device, equipment, a medium and a program product for estimating the junction temperature of a chip so as to improve the accuracy of estimating the junction temperature of the chip.
In a first aspect, a method for estimating a junction temperature of a chip is provided, including:
the method comprises the steps that thermal test data of a controller are obtained through thermal test of the controller in a test incubator, the controller comprises a water cooling system, and cooling liquid is connected into a target input pipeline through a target inlet on the test incubator to flow into the water cooling system;
acquiring heat dissipation related parameters of the controller, wherein the heat dissipation related parameters comprise heat test environment parameters, pipeline length of a target input pipeline and pipeline materials of the target input pipeline;
according to the thermal resistance temperature of the controller and the calculated domain parameters of the controller, the controller is simulated to be operated to reach the thermal resistance temperature, so that the shell emissivity of the controller is obtained;
according to the thermal test environment parameters, simulating to operate the controller according to the maximum power of at least one chip in the controller to obtain chip temperature data corresponding to at least one chip, and determining the junction temperature of the chip after heat dissipation according to the shell radiation rate, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline and the thermal test data;
under the condition that the controller is arranged in the test incubator and the water cooling heat dissipation system does not input cooling liquid, the temperature inside the shell of the controller is obtained through the temperature sensor to be the thermal resistance temperature of the controller in the process of carrying out thermal test on the controller.
In a second aspect, an apparatus for estimating a junction temperature of a chip is provided, including: the device comprises a first acquisition module, a second acquisition module, a shell emissivity acquisition module and a processing module;
the first acquisition module is used for acquiring thermal test data of the controller, the thermal test data are obtained by carrying out thermal test on the controller in the test incubator, the controller comprises a water cooling system, and cooling liquid is connected into a target input pipeline through a target inlet on the test incubator so as to flow into the water cooling system;
the second acquisition module is used for acquiring heat dissipation related parameters of the controller, wherein the heat dissipation related parameters comprise heat test environment parameters, pipeline length of a target input pipeline and pipeline materials of the target input pipeline;
the shell emissivity obtaining module is used for obtaining the shell emissivity of the controller by simulating the operation of the controller to reach the thermal resistance temperature according to the thermal resistance temperature of the controller and the calculation domain parameter of the controller;
the processing module is used for simulating and running the controller according to the maximum power of at least one chip in the controller according to the thermal test environment parameters to obtain chip temperature data corresponding to at least one chip, and determining the junction temperature of the chip after the chip temperature data are subjected to heat dissipation according to the shell radiation rate, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline and the thermal test data;
Under the condition that the controller is arranged in the test incubator and the water cooling heat dissipation system does not input cooling liquid, the temperature inside the shell of the controller is obtained through the temperature sensor to be the thermal resistance temperature of the controller in the process of carrying out thermal test on the controller.
In a third aspect, there is provided an electronic device comprising: a processor and a memory for storing a computer program, the processor being for invoking and running the computer program stored in the memory for performing the method as in the first aspect or in various implementations thereof.
In a fourth aspect, a computer-readable storage medium is provided for storing a computer program for causing a computer to perform the method as in the first aspect or in various implementations thereof.
In a fifth aspect, a computer program product is provided comprising computer program instructions for causing a computer to perform the method as in the first aspect or in various implementations thereof.
In a sixth aspect, a computer program is provided, the computer program causing a computer to perform the method as in the first aspect or in various implementations thereof.
Through the technical scheme provided by the application, in the process of estimating the junction temperature of the chip, the electronic equipment estimates the junction temperature of the chip according to the heating condition of the controller, the heat dissipation condition of the water cooling system, the heat dissipation condition of the shell in the controller and the invalid heat dissipation condition of the target input pipeline which does not participate in the water cooling system in the test incubator. In the process, the electronic equipment can fully consider the influence of convection heat exchange and radiation heat exchange, and the estimation accuracy of the junction temperature of the chip can be improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a first method for estimating a junction temperature of a chip according to an embodiment of the present application;
FIG. 2 is a flowchart of a second method for estimating a junction temperature of a chip according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a third method for estimating a junction temperature of a chip according to an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a fourth method for estimating a junction temperature of a chip according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a fifth method for estimating a junction temperature of a chip according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of key points of a simulated operation controller according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram of an estimation device 700 for chip junction temperature according to an embodiment of the present application;
fig. 8 is a schematic block diagram of an electronic device 800 provided by an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or server that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed or inherent to such process, method, article, or apparatus, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
As described above, in the related art, the influence of natural convection and radiation on the controller heat dissipation condition is ignored, resulting in inaccuracy of the chip junction temperature estimated by the analog controller operation.
In order to solve the technical problems, the invention concept of the application is as follows: the electronic equipment can comprehensively consider the heat dissipation condition of the controller according to the water cooling heat dissipation system, the shell heat dissipation, the air cooling heat dissipation and the ineffective heat dissipation in the test incubator, and then determine the chip junction temperature of the chip temperature data after heat dissipation according to the chip temperature data obtained by the simulated operation controller, thereby solving the problem of inaccurate estimated chip junction temperature in the related technology and improving the estimation accuracy of the chip junction temperature.
It should be noted that, the controller in the present application may be an automobile domain controller. The domain controller is the core of each functional domain of the automobile, and has the characteristics of platformization, high integration level, high performance and good compatibility. According to the division mode of the automobile functional domain, the automobile domain controller can comprise a power domain controller, a chassis domain controller, a vehicle body domain controller, a bottom cabin domain controller and an automatic driving domain controller.
After the inventive concept of the present application is introduced, the technical solution of the present application will be described in detail with reference to the accompanying drawings.
Fig. 1 is a flowchart of a method for estimating a junction temperature of a chip according to an embodiment of the present application. As shown in fig. 1, the method may include the following steps S110 to S140. The method will be described by way of example using the execution subject as an electronic device.
S110: the electronic device obtains thermal test data for the controller.
The heat test data are obtained by carrying out heat test on a controller in a test incubator, the controller comprises a water cooling system, and cooling liquid is connected into a target input pipeline through a target inlet on the test incubator and flows into the water cooling system. During the thermal testing of the controller, the controller may be operated at a maximum power usage.
In the embodiment of the application, the test incubator is used for providing a working environment for testing, and the environment temperature and the environment humidity can be set. It should be noted that, due to the limit temperature in the operating temperature range (-40 ℃,85 ℃) of the controller, it is difficult to achieve the actual operation of the controller, but in order to test whether the controller can normally operate at the limit temperature, the operating environment of the limit temperature can be provided for the controller by the test incubator.
It will be appreciated that if the chip junction temperature exceeds a certain temperature value, the chip may experience an over-temperature protection phenomenon, at which time the chip stops the full processing function or the chip stops part of the processing function. In order to avoid the phenomenon of over-temperature protection of the chip, the controller cannot work normally, so that the environment temperature in the test incubator can be set to be 85 ℃ in the process of performing thermal test on the controller. The controller can be adapted to any ambient temperature as long as no over-temperature protection phenomenon occurs at an ambient temperature of 85 ℃.
In the thermal test process, the controller is placed in the test incubator, the water outlet of the cooling circulation system is connected to the target inlet of the test incubator through a pipeline, and cooling liquid is connected to the target inlet on the test incubator through the target inlet and flows into the water cooling system, and the water cooling system is attached to the shell of the controller. The water outlet of the water cooling heat dissipation system is connected with the target outlet through the target output pipeline, and the cooling liquid is connected with the water inlet in the cooling circulation system through the target outlet through the pipeline, so that heat dissipation of the water cooling heat dissipation system of the controller in the test incubator is realized. In the cooling circulation system, circulation flow of the cooling liquid is achieved by a water pump. That is, the controller radiates heat in a convective heat transfer manner of the water cooling system.
In the thermal test process, the loads of all chips in the controller are started, the cooling liquid is connected, and thermal test data are recorded. It is understood that the controller includes at least one chip therein. Thus, the thermal test data acquired by the electronic device refers to thermal test data under the condition that the controller is loaded with full-open power.
In the embodiment of the application, the electronic device can acquire the thermal test data in real time in the process of performing the thermal test on the controller through the test incubator. The electronic device can also obtain thermal test data from a preset memory, a cloud or other electronic devices, wherein the thermal test data is obtained by thermally testing the controller through the test incubator.
In some implementations, as shown in fig. 2, in the embodiment of the present application, the step S110 may include a step S210 and a step S220.
S210: and periodically acquiring thermal test data of the controller at preset time intervals from the initial acquisition time.
S220: if the temperature difference of the inlet water temperature data corresponding to the current moment is smaller than the first preset threshold value compared with the inlet water temperature data corresponding to at least one preset time interval before the current moment, determining the current moment as the acquisition termination moment, and stopping periodically acquiring the thermal test data of the controller.
The thermal test data may include inlet water temperature data, inlet water pressure data, and dc source data, among others. The thermal test data is data acquired in a period between a start acquisition time and an end acquisition time.
The inlet water temperature data, the inlet water pressure data and the dc source data are in one-to-one correspondence in the time dimension, that is, one inlet water temperature data, one inlet water pressure data and one dc source data exist at the same time.
In general, in the process of performing a thermal test on a controller in a test incubator, the junction temperature of the chips is reduced, after a period of test time, the junction temperature variation amplitude of all the chips is small, the junction temperature variation amplitude curve is a straight line, the temperature balance is called at this time, and the test time for achieving the temperature balance is called balance time. If the chip over-temperature protection phenomenon does not occur before the temperature balance is reached, the chip over-temperature protection phenomenon does not occur after the temperature balance is reached, and therefore, the thermal test data before the temperature balance is obtained.
Based on the above, the thermal test data of the controller is periodically acquired according to a preset time interval from the initial acquisition time, if the temperature difference is smaller than the first preset threshold value compared with at least one inlet water temperature data corresponding to at least one preset time interval before the current time, the electronic device can determine the current time as the termination acquisition time, and stop periodically acquiring the thermal test data of the controller.
In this embodiment of the present application, if at least one preset time interval before the current time is a preset time interval, it is indicated that a temperature difference between two corresponding inlet water temperature data is smaller than a first preset threshold value at a time corresponding to the current time and one preset time interval before the current time. If at least one preset time interval before the current time is N preset time intervals, the fact that the current time and the time corresponding to the N preset time intervals before the current time are all smaller than a first preset threshold is indicated.
For example, the current time may be 60 seconds, and the preset time interval may be 5 seconds, then the temperature differences between the three inlet water temperature data corresponding to 55 seconds, 50 seconds, and 45 seconds and the inlet water temperature data corresponding to 60 seconds are all less than the first preset threshold. The first preset threshold may be a preset value for a person, for example, may be 0.5 degrees celsius.
It will be appreciated that the greater the number of at least one preset time interval, the more reliable the determined equilibrium time. However, in practical applications, the thermal test efficiency requirement of the controller, the storage space requirement of the thermal test data, and the acquisition speed requirement of the thermal test data need to be considered, so the electronic device may specifically set the number of at least one preset time interval to be a fixed value such as 10 seconds, 15 seconds, or 20 seconds.
It should be noted that, the larger the value of the inlet water pressure data is, the faster the flow rate of the cooling liquid in the water cooling heat dissipation system is, that is, the more heat is exchanged by the convection heat exchange mode, that is, the faster the heat dissipation speed is. It will also be appreciated that if the controller is a domain controller of an automobile, the water pump that provides coolant to the controller also needs to boost the coolant to the battery, and therefore, during thermal testing of the controller, it is also desirable to balance the range of water pressure that the water pump can provide with the heat dissipation requirements of the controller.
Thus, the thermal test data acquired by the electronic equipment can not only correspond to all balance time, but also balance the thermal test efficiency requirement, the storage space requirement and the acquisition speed requirement.
S120: and acquiring heat dissipation related parameters of the controller.
The heat dissipation related parameters comprise a thermal test environment parameter, a pipeline length of the target input pipeline and pipeline materials of the target input pipeline. In the embodiment of the application, after the cooling liquid enters the test incubator, the cooling liquid flows in the target input pipeline before entering the water cooling system of the controller. During this flow, the coolant will also absorb the temperature in the test incubator due to the higher temperature in the test incubator. In order to obtain the heat dissipation situation of the controller, the heat dissipation situation of the test incubator in the target input pipeline needs to be considered.
It can be understood that when the cooling liquid enters the test incubator through the target inlet, the inlet water temperature data is different at different times, and the temperature of the cooling liquid in the target input pipeline in the test incubator is also different at different times, so when the controller is simulated to operate in the embodiment of the application, the temperature of the cooling liquid in the target inlet cannot be directly taken as the temperature of the cooling liquid of the water cooling heat dissipation system of the controller by considering the change of the temperature of the cooling liquid in the target input pipeline.
In the embodiment of the application, the heat dissipation condition of the test incubator in the target input pipeline is related to the ambient temperature of the test incubator, the pipeline length of the target input pipeline and the pipeline material of the target input pipeline. Wherein, the pipeline materials are different, and the emissivity of the target input pipeline is also different. Illustratively, the material of the target inlet line is rubber and the emissivity is 0.9.
In embodiments of the present application, the thermal test environment parameters include the incubator dimensions, the number of vents, and the vent dimensions of the test incubators. The ventilation opening is arranged in the test incubator, so that the radiation heat exchange radiating mode of the controller in actual operation is simulated in the thermal test environment of the test incubator.
By way of example, the incubator may be 500mm by 500mm, the number of vents may be 24, and the vent may be circular with a radius of 2.5 mm.
It should be noted that the number of the vents and the size of the vents are obtained by actual measurement, and the positions of the vents may be moved to both side surfaces of the test incubator for the convenience of calculation.
S130: and according to the thermal resistance temperature of the controller and the calculated domain parameters of the controller, the thermal resistance temperature is achieved by simulating the operation of the controller so as to obtain the shell emissivity of the controller.
Under the condition that the controller is arranged in the test incubator and the water cooling heat dissipation system does not input cooling liquid, the temperature inside the shell of the controller is obtained through the temperature sensor to be the thermal resistance temperature of the controller in the process of carrying out thermal test on the controller. It will be appreciated that the electronic device may record the thermal test power of the controller.
Typically, the default housing is an insulated housing during the process of estimating the chip junction temperature.
The housing emissivity is used to indicate the heat dissipation rate of the controller housing. In the operation process of the simulation controller, radiation heat exchange is considered through the shell, so that the actual operation condition of the controller can be better simulated, and the accuracy of the obtained simulation operation result (chip junction temperature) is improved.
In some implementations, as shown in fig. 3, in the embodiment of the present application, the step S130 may include steps S310 to S340.
S310: and simulating to operate the controller according to the calculated domain parameters of the controller and the first emissivity so as to acquire a first temperature corresponding to the first emissivity.
S320: if the first temperature is smaller than the thermal resistance temperature, and the absolute value of the difference between the thermal resistance temperature and the first temperature is larger than a second preset threshold, updating the first emissivity according to a first preset rule, and according to the calculated domain parameters of the controller and the updated first emissivity, simulating to operate the controller to obtain the first temperature corresponding to the first emissivity, wherein the updated first emissivity is larger than the first emissivity.
S330: if the first temperature is greater than the thermal resistance temperature and the absolute value of the difference between the first temperature and the thermal resistance temperature is greater than a second preset threshold, updating the first emissivity according to a second preset rule, and simulating to operate the controller according to the calculated domain parameters of the controller and the updated first emissivity to obtain the first temperature corresponding to the first emissivity, wherein the updated first emissivity is greater than the first emissivity.
S340: and if the first temperature is equal to the thermal resistance temperature or the absolute value of the difference value between the thermal resistance temperature and the first temperature is smaller than or equal to a second preset threshold value, determining the first emissivity as the shell emissivity of the controller.
In the embodiment of the application, the electronic device compares the first temperature obtained after the controller is simulated to run with the thermal resistance temperature according to the actual calculation domain parameters of the controller and the thermal test power, and sets different first radiant ratios, and then continuously adjusts the first radiant ratio according to the comparison result, so that the first temperature obtained after the controller is simulated to run is equal to the thermal resistance temperature or the absolute value of the difference value between the thermal resistance temperature and the first temperature is smaller than or equal to the second preset threshold value under the condition that the shell radiant ratio is the first radiant ratio. The second preset threshold may be a preset value for human, for example, 1 degree celsius.
For example, assuming that the first emissivity is 0.9, the first temperature obtained after the controller is simulated to operate is 100 ℃, while the thermal resistance temperature is 110 ℃, the first temperature is obtained again after the controller is simulated to operate until the obtained thermal resistance temperature is 110 ℃. The first preset rule and the second preset rule may be manually preset rules for adjusting the first emissivity so that the first temperature is equal to the thermal resistance temperature.
In general, a larger value of the first emissivity corresponds to a lower thermal resistance temperature.
Thus, the shell emissivity with higher accuracy can be obtained through fine adjustment of the first emissivity.
In some implementations, as shown in fig. 4, in the embodiment of the present application, before S130, the method for estimating the junction temperature of the chip provided in the embodiment of the present application may further include step S410.
S410: the calculated domain parameters of the controller are obtained.
Wherein the calculated domain parameters include at least one of: shell size, number of chips, coolant density, coolant specific heat, ambient temperature, and ambient altitude. The calculated domain parameters may also include turbulence equation related parameters, gravity environment parameters, and the like.
In an embodiment of the present application, the calculating the domain parameter may further include at least one of: a geometric model of the shell, a surface boundary of the geometric model and an air heat exchange model. If the geometric model is a cube model, then the cube surface is the surface boundary of the geometric model. The calculated domain parameters include data parameters within the controller. Because of the data parameters such as air, radiation and the like outside the controller, the influence on the thermal resistance temperature is small, and the consideration is not taken here.
Thus, the accuracy of the obtained shell emissivity can be improved by acquiring abundant calculation domain parameters.
S140: and according to the thermal test environment parameters, simulating the operation of the controller according to the maximum power of at least one chip in the controller to obtain chip temperature data corresponding to at least one chip, and determining the junction temperature of the chip after heat dissipation according to the shell radiation rate, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline and the thermal test data.
In the embodiment of the application, the electronic equipment simulates the running controller, and obtains transient chip temperature data through thermally testing the environmental parameters and the maximum power of the chip. Then, after the actual heat dissipation condition is considered, the chip junction temperature is obtained by combining the chip temperature data.
In some implementations, as shown in fig. 5, in another embodiment, before S140, the method for estimating a chip junction temperature provided in the embodiments of the present application may further include step S510.
S510: and calculating the analog chip power of the chip according to the direct current source data and the maximum chip power.
Wherein, the direct current source data includes: an operating current value and an operating voltage value of the controller. The maximum power of the chip refers to the maximum power MAX of the chip in the power consumption meter. The power consumption meter refers to chip related information obtained by testing a chip by a chip manufacturer, such as chip length, width, height and other dimension data, a working temperature range of the chip, chip use power, chip maximum power, chip pin specification and the like.
It should be noted that when the controller operates with the maximum power, that is, all chips in the controller operate according to the maximum power of the chips, that is, the maximum total power of the chips.
In the embodiment of the application, the electronic device calculates the total power (product of the running current value and the running voltage value) of the thermal test chip according to the direct current source data, then calculates the power ratio of the total power of the thermal test chip to the total power of the maximum chip, and then determines the product of the maximum power of the chip and the power ratio as the power of the analog chip.
Based on step S210, the specific implementation step of step S140 includes S520.
S520: and according to the thermal test environment parameters, simulating the operation of the controller according to the simulated chip power of at least one chip in the controller to obtain chip temperature data corresponding to at least one chip, and determining the junction temperature of the chip after the chip temperature data passes through the shell and the shell heat dissipation according to the shell emissivity, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline and the thermal test data.
In the embodiment of the application, the difference between the chip junction temperature determined according to the analog chip power and the chip junction temperature obtained by the controller under the condition that the working environment temperature is the same as the thermal test temperature is smaller, and the accuracy of the obtained chip junction temperature is higher.
In this embodiment of the present application, as shown in fig. 6, by adding a calculation domain environmental parameter, adding a target input pipeline parameter, determining a shell radiant ratio, and determining a simulation chip power, and according to the above four factors affecting the heat productivity, on the premise of inlet water temperature data and inlet water pressure data in a data thermal test, a controller is simulated to improve the similarity between the simulated controller and an actually measured controller, so as to improve the accuracy of the estimated chip junction temperature. In particular, increasing the computational domain environmental parameters may take into account both radiative heat transfer and convective heat transfer caused by wind velocity in the test incubator during the process of simulating the operation of the controller. The factors such as temperature change of the cooling liquid in the target input pipeline, water pressure loss and the like can be considered in the process of simulating the operation controller by increasing the target input pipeline parameters. Since different housing materials have different housing emissivity, the housing emissivity actually measured by the controller is subject to. And the actual running power of the chip is different from the maximum power of the chip in the power consumption meter, so that the actual running power of the controller is determined.
In this way, in the process of estimating the junction temperature of the chip, the electronic device can estimate the junction temperature of the chip according to the heating condition of the controller, the heat dissipation condition of the water cooling system, the heat dissipation condition of the shell in the controller, and the ineffective heat dissipation condition of the target input pipeline which does not participate in the water cooling system in the test incubator. In the process, the electronic equipment can fully consider the influence of convection heat exchange and radiation heat exchange, and the estimation accuracy of the junction temperature of the chip can be improved.
Fig. 7 is a schematic diagram of an estimation device 700 for chip junction temperature according to an embodiment of the present application. As shown in fig. 7, the apparatus 700 includes:
the first obtaining module 710 is configured to obtain thermal test data of a controller, where the thermal test data is obtained by performing a thermal test on the controller in a test incubator, the controller includes a water cooling system, and a coolant is connected to a target input pipeline through a target inlet on the test incubator and flows into the water cooling system;
the second obtaining module 720 is configured to obtain heat dissipation related parameters of the controller, where the heat dissipation related parameters include a thermal test environment parameter, a pipeline length of the target input pipeline, and a pipeline material of the target input pipeline;
the shell emissivity obtaining module 730 is configured to obtain the shell emissivity of the controller by simulating the operation of the controller to reach the thermal resistance temperature according to the thermal resistance temperature of the controller and the calculation domain parameter of the controller;
the processing module 740 is configured to simulate and operate the controller according to the thermal test environment parameter and the chip maximum power of at least one chip in the controller to obtain chip temperature data corresponding to the at least one chip, and determine a chip junction temperature of the chip temperature data after heat dissipation according to the shell emissivity, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline, and the thermal test data;
Under the condition that the controller is arranged in the test incubator and the water cooling heat dissipation system does not input cooling liquid, the temperature inside the shell of the controller is obtained through the temperature sensor to be the thermal resistance temperature of the controller in the process of carrying out thermal test on the controller.
In some implementations, the thermal test data includes inlet water temperature data, inlet water pressure data, and dc source data; the method comprises the steps of obtaining thermal test data of a controller, wherein the thermal test data are specifically used for: periodically acquiring thermal test data of the controller according to a preset time interval from the initial acquisition moment; if the temperature difference is smaller than the first preset threshold value compared with at least one inlet water temperature data corresponding to at least one preset time interval before the current moment, determining the current moment as the acquisition termination moment, stopping periodically acquiring the thermal test data of the controller, wherein the thermal test data are data in a time period between the initial acquisition moment and the termination acquisition moment.
In some implementations, the dc source data includes: an operating current value and an operating voltage value of the controller; the apparatus further comprises:
the calculating module 750 is configured to calculate an analog chip power of the chip according to the dc source data and the chip maximum power;
The processing module 740 is further configured to:
and according to the thermal test environment parameters, simulating the operation of the controller according to the simulated chip power of at least one chip in the controller to obtain chip temperature data corresponding to at least one chip, and determining the junction temperature of the chip after the chip temperature data passes through the shell and the shell heat dissipation according to the shell emissivity, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline and the thermal test data.
In some implementations, the housing emissivity derivation module 730 is specifically configured to: simulating to operate the controller according to the calculated domain parameters of the controller and the first radiance, and obtaining a first temperature corresponding to the first radiance; if the first temperature is smaller than the thermal resistance temperature, and the absolute value of the difference value between the thermal resistance temperature and the first temperature is larger than a second preset threshold value, updating the first radiance according to a first preset rule, and according to the calculated domain parameters of the controller and the updated first radiance, simulating to operate the controller to obtain the first temperature corresponding to the first radiance, wherein the updated first radiance is larger than the first radiance; if the first temperature is greater than the thermal resistance temperature and the absolute value of the difference between the first temperature and the thermal resistance temperature is greater than a second preset threshold, updating the first emissivity according to a second preset rule, and according to the calculated domain parameters of the controller and the updated first emissivity, simulating to operate the controller to obtain the first temperature corresponding to the first emissivity, wherein the updated first emissivity is greater than the first emissivity; if the first temperature is equal to the thermal resistance temperature, or the absolute value of the difference between the thermal resistance temperature and the first temperature is less than or equal to a second preset threshold, determining the first emissivity as the shell emissivity of the controller.
In some implementations, the thermal test environmental parameters include an incubator size, a number of vents, and a vent size of the test incubator.
In some implementations, the apparatus further includes:
the third obtaining module 760 is configured to obtain, before the shell emissivity obtaining module 730 obtains the shell emissivity of the controller by simulating the operation of the controller to reach the thermal resistance temperature according to the thermal resistance temperature of the controller and the calculated domain parameters of the controller, where the calculated domain parameters include at least one of the following: shell size, number of chips, coolant density, coolant specific heat, ambient temperature, and ambient altitude.
It should be understood that the embodiment of the device for estimating the junction temperature of the chip and the embodiment of the method for estimating the junction temperature of the chip may correspond to each other, and similar descriptions may refer to the embodiment of the method for estimating the junction temperature of the chip. To avoid repetition, no further description is provided here. Specifically, the apparatus 700 shown in fig. 7 may execute the above-mentioned method embodiment for estimating the junction temperature of the chip, and the foregoing and other operations and/or functions of each module in the apparatus 700 are respectively for implementing the corresponding flow in the above-mentioned method for estimating the junction temperature of the chip, which are not described herein for brevity.
The apparatus 700 of the embodiments of the present application is described above in terms of functional modules in conjunction with the accompanying drawings. It should be understood that the functional module may be implemented in hardware, or may be implemented by instructions in software, or may be implemented by a combination of hardware and software modules. Specifically, each step of the method embodiment of estimating the junction temperature of the chip in the embodiment of the present application may be completed by an integrated logic circuit of hardware in a processor and/or an instruction in a software form, and the steps of the method embodiment of estimating the junction temperature of the chip disclosed in connection with the embodiment of the present application may be directly embodied and executed by a hardware decoding processor or may be completed by a combination of hardware and software modules in the decoding processor. Alternatively, the software modules may be located in a well-established storage medium in the art such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, and the like. The storage medium is located in the memory, the processor reads the information in the memory, and the steps in the method embodiment for estimating the junction temperature of the chip are completed by combining the hardware of the processor.
Fig. 8 is a schematic block diagram of an electronic device 800 provided by an embodiment of the present application.
As shown in fig. 8, the electronic device 800 may include:
a memory 810 and a processor 820, the memory 810 being for storing a computer program and transmitting the program code to the processor 820. In other words, the processor 820 may call and run a computer program from the memory 810 to implement the methods in embodiments of the present application.
For example, the processor 820 may be configured to perform the above-described method embodiments according to instructions in the computer program.
In some embodiments of the present application, the processor 820 may include, but is not limited to:
a general purpose processor, digital signal processor (Digital Signal Processor, DSP), application specific integrated circuit (Application Specific Integrated Circuit, ASIC), field programmable gate array (Field Programmable Gate Array, FPGA) or other programmable logic device, discrete gate or transistor logic device, discrete hardware components, or the like.
In some embodiments of the present application, the memory 810 includes, but is not limited to:
volatile memory and/or nonvolatile memory. The nonvolatile Memory may be a Read-Only Memory (ROM), a Programmable ROM (PROM), an Erasable PROM (EPROM), an Electrically Erasable EPROM (EEPROM), or a flash Memory. The volatile memory may be random access memory (Random Access Memory, RAM) which acts as an external cache. By way of example, and not limitation, many forms of RAM are available, such as Static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double Data Rate SDRAM (Double Data Rate SDRAM), enhanced SDRAM (ESDRAM), synchronous Link DRAM (SLDRAM), and Direct memory bus RAM (DR RAM).
In some embodiments of the present application, the computer program may be partitioned into one or more modules that are stored in the memory 810 and executed by the processor 820 to perform the methods provided herein. The one or more modules may be a series of computer program instruction segments capable of performing the specified functions, which are used to describe the execution of the computer program in the electronic device.
As shown in fig. 8, the electronic device may further include:
a transceiver 830, the transceiver 830 being connectable to the processor 820 or the memory 810.
Processor 820 may control transceiver 830 to communicate with other devices, and in particular, may send information or data to other devices or receive information or data sent by other devices. Transceiver 830 may include a transmitter and a receiver. Transceiver 830 may further include antennas, the number of which may be one or more.
It will be appreciated that the various components in the electronic device are connected by a bus system that includes, in addition to a data bus, a power bus, a control bus, and a status signal bus.
The present application also provides a computer storage medium having stored thereon a computer program which, when executed by a computer, enables the computer to perform the method of the above-described method embodiments. Alternatively, embodiments of the present application also provide a computer program product comprising instructions which, when executed by a computer, cause the computer to perform the method of the method embodiments described above.
When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When loaded and executed on a computer, produces a flow or function in accordance with embodiments of the present application, in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, or other programmable apparatus. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by a wired (e.g., coaxial cable, fiber optic, digital subscriber line (Digital Subscriber Line, DSL)) or wireless (e.g., infrared, wireless, microwave, etc.). The computer readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that contains an integration of one or more available media. The usable medium may be a magnetic medium (e.g., a floppy Disk, a hard Disk, a magnetic tape), an optical medium (e.g., a digital video disc (Digital Video Disc, DVD)), or a semiconductor medium (e.g., a Solid State Disk (SSD)), or the like.
Those of ordinary skill in the art will appreciate that the various illustrative modules and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the several embodiments provided in this application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, and for example, the division of the modules is merely a logical function division, and there may be additional divisions when actually implemented, for example, multiple modules or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or modules, which may be in electrical, mechanical, or other forms.
The modules illustrated as separate components may or may not be physically separate, and components shown as modules may or may not be physical modules, i.e., may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. For example, functional modules in the embodiments of the present application may be integrated into one processing module, or each module may exist alone physically, or two or more modules may be integrated into one module.
The foregoing is merely a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes or substitutions are covered in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The method for estimating the junction temperature of the chip is characterized by comprising the following steps of:
the method comprises the steps of obtaining thermal test data of a controller, wherein the thermal test data are obtained by carrying out thermal test on the controller in a test incubator, the controller comprises a water cooling system, and cooling liquid is connected into a target input pipeline through a target inlet on the test incubator so as to flow into the water cooling system;
Acquiring heat dissipation related parameters of the controller, wherein the heat dissipation related parameters comprise a thermal test environment parameter, a pipeline length of the target input pipeline and a pipeline material of the target input pipeline;
according to the thermal resistance temperature of the controller and the calculated domain parameter of the controller, the controller is operated in a simulated mode to reach the thermal resistance temperature, so that the shell emissivity of the controller is obtained;
according to the thermal test environment parameters, simulating and operating the controller according to the maximum power of at least one chip in the controller to obtain chip temperature data corresponding to the at least one chip; determining the junction temperature of the chip after heat dissipation according to the shell radiation rate, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline and the thermal test data;
and the temperature sensor is used for acquiring the temperature inside the shell of the controller as the thermal resistance temperature of the controller in the process of carrying out the thermal test on the controller under the condition that the controller is arranged in the test incubator and the water cooling system does not input the cooling liquid.
2. The method of claim 1, wherein the thermal test data comprises inlet water temperature data, inlet water pressure data, and dc source data; the acquiring thermal test data of the controller includes:
periodically acquiring the thermal test data of the controller at preset time intervals from the initial acquisition time;
if the temperature difference of the inlet water temperature data corresponding to the current moment is smaller than a first preset threshold value compared with at least one inlet water temperature data corresponding to at least one preset time interval before the current moment, determining the current moment as an acquisition termination moment, and stopping periodically acquiring the thermal test data of the controller, wherein the thermal test data are data in a time period between the initial acquisition moment and the termination acquisition moment.
3. The method of claim 2, wherein the dc source data comprises: the controller is configured to control an operating current value and an operating voltage value, the method further comprising:
calculating the analog chip power of the chip according to the direct current source data and the maximum chip power;
correspondingly, according to the thermal test environment parameter, according to the maximum power of at least one chip in the controller, the controller is simulated to obtain chip temperature data corresponding to the at least one chip, and according to the shell emissivity, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline and the thermal test data, the chip junction temperature after heat dissipation of the chip temperature data is determined, including:
And according to the thermal test environment parameters, according to the simulated chip power of at least one chip in the controller, simulating and operating the controller to obtain chip temperature data corresponding to the at least one chip, and according to the shell emissivity, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline and the thermal test data, determining the chip junction temperature of the chip temperature data after heat dissipation.
4. The method of claim 1, wherein said obtaining the shell emissivity of the controller by simulating the operation of the controller to reach the thermal resistance temperature according to the thermal resistance temperature of the controller and the calculated domain parameters of the controller comprises:
according to the calculated domain parameters of the controller and the first radiance, the controller is operated in a simulation mode to obtain a first temperature corresponding to the first radiance;
if the first temperature is smaller than the thermal resistance temperature and the absolute value of the difference between the thermal resistance temperature and the first temperature is larger than a second preset threshold, updating the first emissivity according to a first preset rule, and according to the calculated domain parameters of the controller and the updated first emissivity, simulating to operate the controller to obtain a first temperature corresponding to the first emissivity, wherein the updated first emissivity is larger than the first emissivity;
If the first temperature is greater than the thermal resistance temperature and the absolute value of the difference between the first temperature and the thermal resistance temperature is greater than the second preset threshold, updating the first emissivity according to a second preset rule, and according to the calculated domain parameters of the controller and the updated first emissivity, simulating to operate the controller to obtain a first temperature corresponding to the first emissivity, wherein the updated first emissivity is greater than the first emissivity;
and if the first temperature is equal to the thermal resistance temperature, or the absolute value of the difference between the thermal resistance temperature and the first temperature is smaller than or equal to the second preset threshold value, determining that the first emissivity is the shell emissivity of the controller.
5. The method of any one of claims 1-4, wherein the thermal test environmental parameters include an incubator size, a number of vents, and a vent size of the test incubator.
6. The method of any of claims 1-4, wherein the method further comprises, prior to the step of obtaining the shell emissivity of the controller by simulating operation of the controller to the thermal resistance temperature according to the thermal resistance temperature of the controller and the calculated domain parameters of the controller:
Obtaining a computational domain parameter of the controller, the computational domain parameter comprising at least one of: shell size, number of chips, coolant density, coolant specific heat, ambient temperature, and ambient altitude.
7. An apparatus for estimating a junction temperature of a chip, comprising:
the first acquisition module is used for acquiring thermal test data of the controller, wherein the thermal test data are obtained by carrying out thermal test on the controller in a test incubator, the controller comprises a water cooling system, and cooling liquid is connected into a target input pipeline through a target inlet on the test incubator so as to flow into the water cooling system;
the second acquisition module is used for acquiring heat dissipation related parameters of the controller, wherein the heat dissipation related parameters comprise a thermal test environment parameter, the pipeline length of the target input pipeline and the pipeline material of the target input pipeline;
the shell emissivity obtaining module is used for obtaining the shell emissivity of the controller by simulating and running the controller to reach the thermal resistance temperature according to the thermal resistance temperature of the controller and the calculation domain parameter of the controller;
the processing module is used for simulating and running the controller according to the thermal test environment parameters and the maximum power of at least one chip in the controller to obtain chip temperature data corresponding to the at least one chip, and determining the junction temperature of the chip after the chip temperature data are subjected to heat dissipation according to the shell radiation rate, the pipeline length of the target input pipeline, the pipeline material of the target input pipeline and the thermal test data;
And the temperature sensor is used for acquiring the temperature inside the shell of the controller as the thermal resistance temperature of the controller in the process of carrying out the thermal test on the controller under the condition that the controller is arranged in the test incubator and the water cooling system does not input the cooling liquid.
8. An electronic device, comprising:
a processor and a memory for storing a computer program, the processor being for invoking and running the computer program stored in the memory to perform the method of any of claims 1-6.
9. A computer readable storage medium storing a computer program for causing a computer to perform the method of any one of claims 1-6.
10. A computer program product comprising instructions which, when run on an electronic device, cause the electronic device to perform the method of any of claims 1-6.
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| CN117494656A (en) * | 2024-01-02 | 2024-02-02 | 北京经纬恒润科技股份有限公司 | Modeling method and device for chip junction temperature thermal resistance model |
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| CN117494656A (en) * | 2024-01-02 | 2024-02-02 | 北京经纬恒润科技股份有限公司 | Modeling method and device for chip junction temperature thermal resistance model |
| CN117494656B (en) * | 2024-01-02 | 2024-03-22 | 北京经纬恒润科技股份有限公司 | Modeling method and device for chip junction temperature thermal resistance model |
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