CN117060095A - Nested dual-frequency common-caliber phased array antenna with compact structure - Google Patents
Nested dual-frequency common-caliber phased array antenna with compact structure Download PDFInfo
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- CN117060095A CN117060095A CN202311165232.8A CN202311165232A CN117060095A CN 117060095 A CN117060095 A CN 117060095A CN 202311165232 A CN202311165232 A CN 202311165232A CN 117060095 A CN117060095 A CN 117060095A
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- 239000002184 metal Substances 0.000 claims description 20
- 230000005855 radiation Effects 0.000 claims description 17
- 230000009977 dual effect Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 7
- 238000004891 communication Methods 0.000 abstract description 2
- 230000008878 coupling Effects 0.000 abstract description 2
- 238000010168 coupling process Methods 0.000 abstract description 2
- 238000005859 coupling reaction Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 9
- 238000002955 isolation Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 6
- 238000003491 array Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention discloses a nested dual-frequency common-caliber phased array antenna with a compact structure, belongs to the technical field of antenna engineering, and adopts a multi-layer PCB structure, so that the structure is compact and convenient to integrate. By nesting the high-frequency unit and the low-frequency unit and adopting different array arrangement modes, the antennas of the two frequency bands respectively work at 4.74-5.27 GHz and 6.39-7.32 GHz, and are suitable for communication of the C-band. The structure can utilize caliber area to a greater extent, the coupling between frequency bands can be reduced by the arrangement of high-frequency and low-frequency layering, and the problem of in-band resonance during angle scanning can be solved by the low-frequency bending structure. The antenna can realize beam scanning of +/-45 degrees in the working bandwidth, and is suitable for forming a dual-frequency common-caliber phased array antenna.
Description
Technical Field
The invention belongs to the technical field of antenna engineering, and relates to a common-caliber antenna which has the characteristics of compact structure, dual polarization, dual frequency band and wide angle scanning.
Background
The common-caliber antenna integrates a plurality of antennas with different frequency bands into the same radiation aperture plane, and ensures that different antennas can work independently and do not interfere with each other through reasonable design, so that the effective load in a communication system is effectively increased, and the space utilization rate of the system is improved. The common aperture antenna can be realized in various ways, including overlapping technology, interleaving technology, hollowed-out technology, nesting technology, etc. The structure proposed by the document "Novel Dual-Broadband Planar Antenna and Its Array for 2G/3G/LTE Base Stations" is a typical common-caliber antenna based on the interleaving technology, and the structure can realize Dual-frequency operation within a larger bandwidth, but cannot scan a wave beam, so that the application of the structure in a phased array is limited.
For the common aperture antenna, the frequency ratio of the antennas with different frequency ranges is a critical parameter, and the common aperture antenna with different frequency ratios has different implementation forms and implementation difficulties. When the frequency ratio of the two frequency band antennas is smaller than 2, the antennas are small-frequency ratio common-caliber antennas, and when the antennas are applied to phased arrays, the antennas need to be subjected to beam scanning, so that the array density is high, the topological arrangement is difficult, and because the working frequencies are close, the mutual coupling influence among the antennas in different frequency bands is large, and the implementation difficulty is high.
Disclosure of Invention
Based on the background technology, the invention provides a novel common-caliber antenna which comprises three similar common-caliber antenna units. The three units are respectively based on different feed structures and unit types, the structure of the multilayer PCB is adopted, the processing is convenient, the antenna unit has the characteristics of dual-band, dual-polarization and wide-angle scanning after the antenna unit is assembled, and besides, the antenna unit is compact in structure and low in section, and can be well applied to various scenes.
The technical scheme adopted by the invention is as follows: a compact nested dual-frequency co-aperture phased array antenna, the antenna comprising: the upper surface of the middle layer PCB is provided with a double-annular radiation structure, the upper surface of the lower layer PCB is provided with a low-frequency feed unit layer, and the lower surface of the lower layer PCB is provided with a metal floor;
the high-frequency radiating unit layer arranged on the upper surface of the upper PCB comprises first high-frequency radiating units and second high-frequency radiating units, wherein the first high-frequency radiating units are arranged in a whole row, four adjacent first high-frequency radiating units are square, and a second high-frequency radiating unit is arranged at the center point of each of the four adjacent first high-frequency radiating units to form the high-frequency radiating unit layer; the first high-frequency radiating unit and the second high-frequency radiating unit are identical in structure and are symmetrical, and the two parts are included: the power supply part is used for supplying power from the lower side of the lower layer PCB through a metallized through hole, is not in contact with the metal floor, and is connected with the metal floor through the metallized through hole;
the double-ring-shaped radiation structure that intermediate layer PCB board upper surface set up includes: an inner ring and an outer ring, the inner ring being a circular ring; the whole outer ring is circular, but four outward arc-shaped bulges are arranged on the outer ring, and the spacing angle between the adjacent arc-shaped bulges is 90 degrees; the first high-frequency radiation unit is positioned corresponding to the center of the inner ring structure and is positioned inside the inner ring; the second high-frequency radiation unit is positioned in the circular ring and corresponds to the center of the outer ring; each annular structure in the inner ring and the outer ring is connected with the metal floor through a plurality of metalized through holes, and all the metalized through holes connected with the same annular structure are symmetrically distributed;
the low-frequency radiating element layer arranged on the upper surface of the lower PCB is a low-frequency feeding patch arranged in an array, the low-frequency feeding patch is rectangular, and each first high-frequency radiating element corresponds to one low-frequency feeding patch; one end of the low-frequency feed patch is fed from the lower surface of the lower-layer PCB through a metalized through hole and is not in contact with a metal floor, a feeding point corresponds to the inner part of an arc-shaped bulge of an outer ring arranged on the upper surface of the middle-layer PCB, the other end of the low-frequency feed patch points to the position, corresponding to the upper surface of the lower-layer PCB, of the center of the double-ring radiation structure, and the corresponding position of the other end is located in the inner ring.
Further, the feed part and the non-feed part of the high-frequency radiating unit in the high-frequency radiating unit layer are identical in structure and are of isosceles trapezoid structures, the upper bottoms of the two isosceles trapezoids are oppositely arranged to form a 'one' -shaped, the respective metal through holes of the feed part and the non-feed part are arranged at the upper bottom positions, and the projection of the 'one' -shaped corresponding to the lower-layer PCB is perpendicular to the low-frequency radiating patch.
Further, the feeding part of the high-frequency radiating element in the high-frequency radiating element layer is a rectangular radiating patch, the feeding point is one end of the rectangular radiating patch, the non-feeding part comprises four quarter-circle structures, the four quarter-circle structures are uniformly arranged in four directions, a cross-shaped structure is formed by middle gaps, and the cross-shaped structure consists of transverse branches and vertical branches; the rectangular radiation patch is positioned in the transverse branch of the cross-shaped structure; the projection of the rectangular radiation patch corresponding to the lower PCB is vertical to the low-frequency radiation patch; the four quarter-round structures are all connected to the metal floor by metallized through holes.
Further, the double-ring structure arranged on the upper surface of the middle-layer PCB is interchanged with the low-frequency feed unit layer arranged on the upper surface of the lower-layer PCB.
The common-caliber antenna unit adopts a multi-layer PCB structure, is easy to process, has a compact structure and is convenient to integrate. By nesting the high-frequency units and the low-frequency units and adopting different array arrangement modes, the antennas with two frequency bands are placed under the same caliber surface, and beam scanning of +/-45 degrees can be realized.
Drawings
Fig. 1 is a first structure of the common aperture antenna of the present invention. Wherein (a), (b) and (c) are respectively a 3D diagram, a side view and a top view of the first antenna structure.
Fig. 2 is a second structure of the common aperture antenna of the present invention. Wherein (a), (b) and (c) are respectively a 3D diagram, a side view and a top view of the first antenna structure.
Fig. 3 is a third structure of the common aperture antenna of the present invention. Wherein (a), (b) and (c) are respectively a 3D diagram, a side view and a top view of the first antenna structure.
Fig. 4 is a top view of an array configuration of a first structure of the common aperture antenna of the present invention.
Fig. 5 is a schematic diagram showing a voltage standing wave ratio of a high frequency unit with different scanning angles in the first antenna structure according to the present invention.
Fig. 6 is a schematic diagram showing a voltage standing wave ratio of a low frequency unit with different scanning angles in the first antenna structure according to the present invention.
Fig. 7 is a diagram of the E-plane and H-plane of the high frequency unit in the first antenna structure of the present invention at 7GHz side firing.
Fig. 8 is a diagram of the E-plane and H-plane of the low frequency unit in the first antenna structure of the present invention when radiating at 5 GHz.
Detailed Description
In this embodiment, the 3D view, side view, and top view of the first common aperture antenna structure are shown in fig. 1 (a), (b), and (c), where the antennas of the two frequency bands respectively work at 4.74-5.27 GHz and 6.39-7.32 GHz, and beam scanning with ±45° can be achieved within the operating bandwidth.
The first common-caliber antenna unit in the embodiment comprises a high-frequency bow tie type dipole, a high-frequency unit outer ring isolation structure, a low-frequency bending type coaxial structure and a low-frequency feed microstrip. The thickness of the first dielectric plate is 0.5mm, the relative dielectric constant is 3, and a high-frequency bow tie type dipole is printed on the front surface; the thickness of the second dielectric plate is 2mm, the relative dielectric constant is 3, and the front surface is printed with a metal patch with a low-frequency bending type coaxial-like structure and a circular patch with a high-frequency isolation structure; the thickness of the third dielectric plate is 5.5mm, the relative dielectric constant is 3, the front surface is printed with a microstrip feeder line of the low-frequency unit, and the back surface is printed with a metal floor. The bent coaxial-like structure and the metallized via hole of the high-frequency isolation structure are communicated with the second and third dielectric plates.
In this embodiment, the 3D view, side view, and top view of the second common aperture antenna structure are shown in fig. 2 (a), (b), and (c), respectively. The antenna structure comprises a high-frequency bow-tie type dipole, a high-frequency unit outer ring isolation structure, a low-frequency bending type coaxial-like structure and a low-frequency feed microstrip. The thickness of the first dielectric plate is 1mm, the relative dielectric constant is 3, and a high-frequency bow tie type dipole is printed on the front surface; the thickness of the second dielectric plate is 1.5mm, the relative dielectric constant is 3, and microstrip feeder lines of low-frequency units are printed on the front surface; the thickness of the third dielectric plate is 6mm, the relative dielectric constant is 3, the front surface is printed with a metal patch with a low-frequency bending type coaxial structure and a circular patch with a high-frequency isolation structure, and the back surface is printed with a metal floor. The bent coaxial-like structure and the metallization via hole of the high-frequency isolation structure are positioned on the third dielectric plate.
In this embodiment, the 3D view, side view, and top view of the third common aperture antenna structure are shown in fig. 3 (a), (b), and (c), respectively. The antenna structure comprises a high-frequency magneto dipole, a high-frequency feed microstrip, a high-frequency unit outer ring isolation structure, a low-frequency bending type coaxial structure and a low-frequency feed microstrip. The thickness of the first dielectric plate is 0.5mm, the relative dielectric constant is 3, the front surface is printed with a high-frequency magnetic electric dipole and a feed microstrip line thereof, and four quarter-round patches are grounded through metallized through holes; the thickness of the second dielectric plate is 2mm, the relative dielectric constant is 3, and the front surface is printed with a metal patch with a low-frequency bending type coaxial-like structure and a circular patch with a high-frequency isolation structure; the thickness of the third dielectric plate is 5.5mm, the relative dielectric constant is 3, the front surface is printed with a microstrip feeder line of the low-frequency unit, and the back surface is printed with a metal floor. The bent coaxial-like structure and the metallized via hole of the high-frequency isolation structure are communicated with the second and third dielectric plates.
In this embodiment, all three antenna units may form an array in a two-dimensional plane. The first common aperture antenna element array arrangement is shown in fig. 4 in a top view, and the array is composed of 41 high-frequency elements and 25 low-frequency elements.
Fig. 5 shows a schematic diagram of the voltage standing wave ratio of the high frequency unit E-plane and H-plane of the antenna at different scanning angles. When the angle is 0 ℃, the antenna can meet the voltage standing wave ratio of less than 2.5 within 6.20-7.60 GHz; when scanning at 45 degrees, the antenna can meet the requirement that the voltage standing wave ratio is smaller than 3 within 6.39-7.32 GHz.
Fig. 6 shows a schematic diagram of the voltage standing wave ratio of the low frequency unit E-plane and H-plane of the antenna at different scanning angles. When the angle is 0 ℃, the antenna can meet the voltage standing wave ratio of less than 2.5 within 4.74-5.50 GHz; when scanning at 45 degrees, the antenna can meet the requirement that the voltage standing wave ratio is smaller than 3 within 4.74-5.27 GHz.
Claims (4)
1. A compact nested dual-frequency co-aperture phased array antenna, the antenna comprising: the upper surface of the middle layer PCB is provided with a double-annular radiation structure, the upper surface of the lower layer PCB is provided with a low-frequency feed unit layer, and the lower surface of the lower layer PCB is provided with a metal floor;
the high-frequency radiating unit layer arranged on the upper surface of the upper PCB comprises first high-frequency radiating units and second high-frequency radiating units, wherein the first high-frequency radiating units are arranged in a whole row, four adjacent first high-frequency radiating units are square, and a second high-frequency radiating unit is arranged at the center point of each of the four adjacent first high-frequency radiating units to form the high-frequency radiating unit layer; the first high-frequency radiating unit and the second high-frequency radiating unit are identical in structure and are symmetrical, and the two parts are included: the power supply part is used for supplying power from the lower side of the lower layer PCB through a metallized through hole, is not in contact with the metal floor, and is connected with the metal floor through the metallized through hole;
the double-ring-shaped radiation structure that intermediate layer PCB board upper surface set up includes: an inner ring and an outer ring, the inner ring being a circular ring; the whole outer ring is circular, but four outward arc-shaped bulges are arranged on the outer ring, and the spacing angle between the adjacent arc-shaped bulges is 90 degrees; the first high-frequency radiation unit is positioned corresponding to the center of the inner ring structure and is positioned inside the inner ring; the second high-frequency radiation unit is positioned in the circular ring and corresponds to the center of the outer ring; each annular structure in the inner ring and the outer ring is connected with the metal floor through a plurality of metalized through holes, and all the metalized through holes connected with the same annular structure are symmetrically distributed;
the low-frequency radiating element layer arranged on the upper surface of the lower PCB is a low-frequency feeding patch arranged in an array, the low-frequency feeding patch is rectangular, and each first high-frequency radiating element corresponds to one low-frequency feeding patch; one end of the low-frequency feed patch is fed from the lower surface of the lower-layer PCB through a metalized through hole and is not in contact with a metal floor, a feeding point corresponds to the inner part of an arc-shaped bulge of an outer ring arranged on the upper surface of the middle-layer PCB, the other end of the low-frequency feed patch points to the position, corresponding to the upper surface of the lower-layer PCB, of the center of the double-ring radiation structure, and the corresponding position of the other end is located in the inner ring.
2. The nested dual-frequency common-caliber phased array antenna with a compact structure as claimed in claim 1, wherein the feeding part and the non-feeding part of the high-frequency radiating element in the high-frequency radiating element layer are of isosceles trapezoid structures, the upper bottoms of the two isosceles trapezoids are oppositely arranged to form a straight line, the respective metal through holes of the feeding part and the non-feeding part are arranged at the upper bottom positions, and the projection of the straight line corresponding to the lower PCB is perpendicular to the low-frequency radiating patch.
3. The nested dual-frequency common-caliber phased array antenna with a compact structure as claimed in claim 1, wherein the feeding part of the high-frequency radiating element in the high-frequency radiating element layer is a rectangular radiating patch, the feeding point is one end of the rectangular radiating patch, the non-feeding part comprises four quarter-circle structures, the four quarter-circle structures are uniformly arranged in four directions, the middle gap forms a cross-shaped structure, and the cross-shaped structure consists of transverse branches and vertical branches; the rectangular radiation patch is positioned in the transverse branch of the cross-shaped structure; the projection of the rectangular radiation patch corresponding to the lower PCB is vertical to the low-frequency radiation patch; the four quarter-round structures are all connected to the metal floor by metallized through holes.
4. A compact nested dual-band common aperture phased array antenna as claimed in any one of claims 1, 2 and 3 wherein said dual loop structure provided on said upper surface of said middle PCB is interchangeable with said low frequency feed element layer provided on said upper surface of said lower PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311165232.8A CN117060095A (en) | 2023-09-11 | 2023-09-11 | Nested dual-frequency common-caliber phased array antenna with compact structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311165232.8A CN117060095A (en) | 2023-09-11 | 2023-09-11 | Nested dual-frequency common-caliber phased array antenna with compact structure |
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| Publication Number | Publication Date |
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| CN117060095A true CN117060095A (en) | 2023-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311165232.8A Pending CN117060095A (en) | 2023-09-11 | 2023-09-11 | Nested dual-frequency common-caliber phased array antenna with compact structure |
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| Country | Link |
|---|---|
| CN (1) | CN117060095A (en) |
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- 2023-09-11 CN CN202311165232.8A patent/CN117060095A/en active Pending
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