CN117050723A - Antibacterial environment-friendly soybean protein adhesive for artificial boards - Google Patents
Antibacterial environment-friendly soybean protein adhesive for artificial boards Download PDFInfo
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- CN117050723A CN117050723A CN202311065908.6A CN202311065908A CN117050723A CN 117050723 A CN117050723 A CN 117050723A CN 202311065908 A CN202311065908 A CN 202311065908A CN 117050723 A CN117050723 A CN 117050723A
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- soybean protein
- protein adhesive
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- 239000000853 adhesive Substances 0.000 title claims abstract description 72
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 72
- 108010073771 Soybean Proteins Proteins 0.000 title claims abstract description 58
- 235000019710 soybean protein Nutrition 0.000 title claims abstract description 53
- 230000000844 anti-bacterial effect Effects 0.000 title claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 239000004952 Polyamide Substances 0.000 claims abstract description 11
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 229920002647 polyamide Polymers 0.000 claims abstract description 11
- KKHAAAOUAMONAO-UHFFFAOYSA-N 1,4-diazabicyclo[2.2.2]octane;hexahydrate Chemical compound O.O.O.O.O.O.C1CN2CCN1CC2 KKHAAAOUAMONAO-UHFFFAOYSA-N 0.000 claims abstract description 9
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims abstract description 9
- 239000004593 Epoxy Substances 0.000 claims abstract description 8
- 150000001350 alkyl halides Chemical class 0.000 claims abstract description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 8
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 8
- 239000004094 surface-active agent Substances 0.000 claims abstract description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 7
- 239000001301 oxygen Substances 0.000 claims abstract description 7
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 7
- 239000003755 preservative agent Substances 0.000 claims abstract description 7
- 230000002335 preservative effect Effects 0.000 claims abstract description 7
- 102000004190 Enzymes Human genes 0.000 claims abstract description 6
- 108090000790 Enzymes Proteins 0.000 claims abstract description 6
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002612 dispersion medium Substances 0.000 claims abstract description 6
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 6
- 239000003999 initiator Substances 0.000 claims abstract description 6
- 239000001254 oxidized starch Substances 0.000 claims abstract description 6
- 235000013808 oxidized starch Nutrition 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000843 powder Substances 0.000 claims abstract description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 229920001661 Chitosan Polymers 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 239000002105 nanoparticle Substances 0.000 claims description 5
- 229940001941 soy protein Drugs 0.000 claims description 5
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims description 3
- 230000032683 aging Effects 0.000 claims description 3
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000292 calcium oxide Substances 0.000 claims description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical group [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 2
- 230000000845 anti-microbial effect Effects 0.000 claims 2
- 239000004599 antimicrobial Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 12
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 239000002341 toxic gas Substances 0.000 abstract description 2
- 235000010469 Glycine max Nutrition 0.000 description 4
- 244000068988 Glycine max Species 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 108010082495 Dietary Plant Proteins Proteins 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- IVJISJACKSSFGE-UHFFFAOYSA-N formaldehyde;1,3,5-triazine-2,4,6-triamine Chemical compound O=C.NC1=NC(N)=NC(N)=N1 IVJISJACKSSFGE-UHFFFAOYSA-N 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- MGIYRDNGCNKGJU-UHFFFAOYSA-N isothiazolinone Chemical compound O=C1C=CSN1 MGIYRDNGCNKGJU-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical group [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 description 1
- 239000004299 sodium benzoate Substances 0.000 description 1
- 235000010234 sodium benzoate Nutrition 0.000 description 1
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical group [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J189/00—Adhesives based on proteins; Adhesives based on derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
- B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
- B27N3/002—Manufacture of substantially flat articles, e.g. boards, from particles or fibres characterised by the type of binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides an antibacterial environment-friendly soybean protein adhesive for artificial boards, which is prepared by mixing and reacting 30-45% of soybean protein powder, 40-45% of dispersion medium, 2-5% of oxidized starch, 1-3% of biological enzyme, 3-4% of initiator, 5-6% of talcum powder, 1-3% of tackifier, 1-2.5% of preservative, 1.5% of emulsifier, 0.3-0.9% of sodium dodecyl benzene sulfonate and the balance of water at the temperature of 30-45 ℃ to prepare the soybean protein adhesive, and has the following beneficial effects: the soybean protein adhesive prepared from soybean protein, a dispersion medium, oxidized starch, biological enzyme, an initiator, talcum powder, a tackifier, a preservative, an emulsifier and sodium dodecyl benzene sulfonate does not contain formaldehyde and phenol toxic gases; the waterproof effect is achieved by adding the oxygen resin and the triethylene diamine hexahydrate, so that the waterproof agent is more suitable for being used when the environment is wet; the bonding strength of the soybean protein adhesive is improved by adding metal oxide, surfactant and polyamide epoxy haloalkane resin.
Description
Technical Field
The invention belongs to the technical field of soybean protein adhesives, and particularly relates to an antibacterial environment-friendly soybean protein adhesive for artificial boards.
Background
At present, the research of soybean-based adhesives begins in 1923, and the soybean-based adhesives have been replaced once because synthetic resin adhesives using petrochemical as raw materials have better bonding performance and water resistance. In recent years, with the continuous expansion of the adhesive market, the problems of limited global petroleum resources, environmental pollution and the like gradually draw attention; the synthetic resin adhesive contains formaldehyde, phenol and other toxic substances, so that the synthetic resin adhesive can cause great harm to the environment and human health in the production, transportation and use processes. Accordingly, the adhesive industry must consider the use of renewable, environmentally friendly adhesives. Therefore, the vegetable protein adhesive which is harmless to the environment and renewable is increasingly paid attention to and favored by people. Because Soy Protein (SPI) has the characteristics of wide raw material sources, strong reproducibility, high reactivity and the like, the research of the vegetable protein adhesive is mainly focused on soy protein. Accordingly, characterization methods of some soybean-based adhesives are also generated, and better conditions are provided for fully researching and applying the soybean-based adhesives.
With the rapid development of the artificial board industry, wood adhesive consumption has increased dramatically, wherein "trialdehyde glue (urea formaldehyde
Glue, phenolic glue and melamine-formaldehyde glue) occupy 80% of the industrial adhesive for wood and artificial boards, and the three resins take formaldehyde as raw materials, so that the resin adhesive inevitably contains a certain amount of formaldehyde.
However, the viscosity of the existing soybean protein adhesive is increased, so that the difficulty of bubble overflow is increased, the higher the bubble content of the prepared adhesive is, the apparent viscosity is inevitably reduced, the antibacterial performance is not achieved in the use process, and the artificial board is damaged due to long-time use.
Therefore, in view of the defects of the actual manufacturing and implementation of the scheme, the invention is modified and improved, the spirit and the idea are well calculated, the assistance of professional knowledge and experience is adopted, and after the multi-party skillful and experimental, the invention is created, and the antibacterial environment-friendly soybean protein adhesive for the artificial board is provided for solving the problems.
Disclosure of Invention
The invention provides an antibacterial environment-friendly soybean protein adhesive for artificial boards, which solves the problems in the prior art.
The technical scheme of the invention is realized as follows:
the soybean protein adhesive is prepared by mixing the following raw materials in percentage by weight: 30-45 parts of soybean protein powder, 40-45 parts of dispersion medium, 2-5 parts of oxidized starch, 1-3 parts of biological enzyme, 3-4 parts of initiator, 5-6 parts of talcum powder, 1-3 parts of tackifier, 1-2.5 parts of preservative, 1.5 parts of emulsifier, 0.3-0.9 part of sodium dodecyl benzene sulfonate and the balance of water, and the soybean protein adhesive is prepared by fully mixing and reacting all substances through high-shear dispersion at the temperature of 30-45 ℃.
As a preferred technical scheme: adding a waterproof agent into the adhesive solution obtained in the claim 1, and stirring for 2-4 hours at 50-90 ℃ to obtain the mildew-proof and water-proof soybean protein adhesive.
As a preferred technical scheme: the waterproof agent is 10-15 percent (%) of oxygen resin and 0.5-0.9 percent (%) of triethylene diamine hexahydrate.
As a preferred technical scheme: the waterproof agent is 12 percent (%) of oxygen resin and 0.8 percent (%) of triethylene diamine hexahydrate.
As a preferred technical scheme: and 5-12 percent of surfactant is added into the soybean protein adhesive.
As a preferred technical scheme: the surfactant is sodium dodecyl sulfonate or sodium dodecyl benzene sulfonate.
As a preferred technical scheme: and adding 2-6 percent of chitosan nano particles into the soybean protein adhesive.
As a preferred technical scheme: the soybean protein adhesive is added with 4-8 percent (%) of metal oxide, wherein the metal oxide is one or more of zinc oxide, calcium oxide and magnesium oxide.
As a preferred technical scheme: the soybean protein adhesive is added with 2-6 percent (%) of polyamide epoxy haloalkane resin, wherein the polyamide epoxy haloalkane resin is polyamide epichlorohydrin resin.
The application method of the antibacterial environment-friendly soybean protein adhesive for the artificial board is characterized by comprising the following steps of:
1) Coating the soybean protein adhesive between the artificial boards, wherein the adhesive coating amount is 400-700 g/m 2 Aging for 35 minutes;
2) Then, pressing the artificial board on a press, and placing the pressed product for more than 24 hours in an environment with the temperature of 30 ℃ to obtain a bonded product;
wherein, the technological conditions of press fit are: the pressure is 1.2-1.5 Mpa, the temperature is 110-140 ℃ and the time is 0.5-1 min/mm.
After the technical scheme is adopted, the invention has the beneficial effects that:
3. the soybean protein adhesive prepared from soybean protein, a dispersion medium, oxidized starch, biological enzyme, an initiator, talcum powder, a tackifier, a preservative, an emulsifier and sodium dodecyl benzene sulfonate does not contain formaldehyde and phenol toxic gases;
4. the waterproof effect is achieved by adding the oxygen resin and the triethylene diamine hexahydrate, so that the waterproof agent is more suitable for being used when the environment is wet;
5. the adhesive strength of the soy protein adhesive is improved by adding metal oxide, surfactant and polyamide epoxy haloalkane resin;
6. the soybean protein adhesive with chitosan nanoparticles has an antibacterial function, so that the service life of the artificial board is prolonged.
Description of the embodiments
The following description of the embodiments of the present invention will clearly and fully describe the technical solutions of the embodiments of the present invention with reference to the specific descriptions thereof, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Examples
The antibacterial environment-friendly soybean protein adhesive for the artificial boards is prepared by mixing the following raw materials in percentage by weight: 30-45 parts of soybean protein powder, 40-45 parts of dispersion medium, 2-5 parts of oxidized starch, 1-3 parts of biological enzyme, 3-4 parts of initiator, 5-6 parts of talcum powder, 1-3 parts of tackifier, 1-2.5 parts of preservative, 1.5 parts of emulsifier, 0.3-0.9 part of sodium dodecyl benzene sulfonate and the balance of water, and the soybean protein adhesive is prepared by fully mixing and reacting all substances through high-shear dispersion at the temperature of 30-45 ℃.
Adding a waterproof agent into the adhesive solution, and stirring for 2-4 hours at 50-90 ℃ to obtain the mildew-proof and water-proof soybean protein adhesive, wherein the waterproof agent is 10-15 percent (%) of oxygen resin and 0.5-0.9 percent (%) of triethylene diamine hexahydrate.
5-12 percent of surfactant is added into the soybean protein adhesive, and the surfactant is sodium dodecyl sulfate or sodium dodecyl benzene sulfonate.
The preservative is sodium benzoate or isothiazolinone.
The soybean protein adhesive is added with 4-8 percent (%) of metal oxide, wherein the metal oxide is one or more of zinc oxide, calcium oxide and magnesium oxide.
The soybean protein adhesive is added with 2-6 percent (%) of polyamide epoxy haloalkane resin, wherein the polyamide epoxy haloalkane resin is polyamide epichlorohydrin resin.
Examples
The application method of the antibacterial environment-friendly soybean protein adhesive for the artificial board is characterized by comprising the following steps of:
1) Coating the soybean protein adhesive between the artificial boards, wherein the adhesive coating amount is 400-700 g/m 2 Aging for 35 minutes;
2) Then, pressing the artificial board on a press, and placing the pressed product for more than 24 hours in an environment with the temperature of 30 ℃ to obtain a bonded product;
wherein, the technological conditions of press fit are: the pressure is 1.2-1.5 Mpa, the temperature is 110-140 ℃ and the time is 0.5-1 min/mm;
examples
The waterproofing agent is epoxy resin 12 percent (%), triethylene diamine hexahydrate 0.8 percent (%), and the rest steps are the same as those of the example;
comparison experiment:
by not adding the rest of the chitosan nanoparticles as comparative group 1, which is the same as example 1, and adding 8% of the chitosan nanoparticles as comparative group 2, which is the same as example 1, the epoxy resin 25% in example one and the triethylenediamine hexahydrate 2% in example one are comparative group 3;
the foregoing is a preferred embodiment and comparative example of the present invention, and is not intended to limit the present invention, but any modification, equivalent replacement, improvement, etc. that fall within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (10)
1. An antibacterial environment-friendly soybean protein adhesive for artificial boards, which is characterized in that: the soybean protein adhesive is prepared by mixing the following raw materials in percentage by weight: 30-45 parts of soybean protein powder, 40-45 parts of dispersion medium, 2-5 parts of oxidized starch, 1-3 parts of biological enzyme, 3-4 parts of initiator, 5-6 parts of talcum powder, 1-3 parts of tackifier, 1-2.5 parts of preservative, 1.5 parts of emulsifier, 0.3-0.9 part of sodium dodecyl benzene sulfonate and the balance of water, and the soybean protein adhesive is prepared by fully mixing and reacting all substances through high-shear dispersion at the temperature of 30-45 ℃.
2. The antibacterial environment-friendly soybean protein adhesive for artificial boards according to claim 1, wherein a waterproof agent is added into the adhesive solution obtained in claim 1, and the mixture is stirred for 2-4 hours at 50-90 ℃ to obtain the mildew-proof waterproof soybean protein adhesive.
3. The antibacterial environment-friendly soybean protein adhesive for artificial boards, according to claim 2, wherein the waterproof agent is 10-15 percent (%) of oxygen resin and 0.5-0.9 percent (%) of triethylene diamine hexahydrate.
4. An antimicrobial environment-friendly soybean protein adhesive for artificial boards according to claim 3, wherein the waterproof agent is 12 percent (%) of oxygen resin and 0.8 percent (%) of triethylene diamine hexahydrate.
5. The antibacterial environment-friendly soybean protein adhesive for artificial boards, which is characterized in that 5-12 percent of surfactant is added into the soybean protein adhesive.
6. An antimicrobial and environmentally friendly soy protein adhesive for artificial boards of claim 5 wherein the surfactant is sodium dodecyl sulfate or sodium dodecyl benzene sulfonate.
7. The antibacterial environment-friendly soybean protein adhesive for artificial boards, which is characterized in that 2-6 percent of chitosan nano particles are added into the soybean protein adhesive.
8. The antibacterial environment-friendly soybean protein adhesive for artificial boards, which is characterized in that 4-8 percent (%) of metal oxide is added into the soybean protein adhesive, wherein the metal oxide is one or more of zinc oxide, calcium oxide and magnesium oxide.
9. The antibacterial environment-friendly soybean protein adhesive for artificial boards, which is disclosed in claim 1, is characterized in that 2-6 percent (%) of polyamide epoxy haloalkane resin is added into the soybean protein adhesive, and the polyamide epoxy haloalkane resin is polyamide epichlorohydrin resin.
10. The method for using the antibacterial environment-friendly soybean protein adhesive for the artificial boards according to claim 1, which is characterized by comprising the following steps:
1) Coating the soybean protein adhesive between the artificial boards, wherein the adhesive coating amount is 400-700 g/m 2 Aging for 35 minutes;
2) Then, pressing the artificial board on a press, and placing the pressed product for more than 24 hours in an environment with the temperature of 30 ℃ to obtain a bonded product;
wherein, the technological conditions of press fit are: the pressure is 1.2-1.5 Mpa, the temperature is 110-140 ℃ and the time is 0.5-1 min/mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311065908.6A CN117050723A (en) | 2023-08-23 | 2023-08-23 | Antibacterial environment-friendly soybean protein adhesive for artificial boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311065908.6A CN117050723A (en) | 2023-08-23 | 2023-08-23 | Antibacterial environment-friendly soybean protein adhesive for artificial boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117050723A true CN117050723A (en) | 2023-11-14 |
Family
ID=88653252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311065908.6A Pending CN117050723A (en) | 2023-08-23 | 2023-08-23 | Antibacterial environment-friendly soybean protein adhesive for artificial boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117050723A (en) |
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2023
- 2023-08-23 CN CN202311065908.6A patent/CN117050723A/en active Pending
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