CN117040255A - Power supply device and laser device - Google Patents

Power supply device and laser device Download PDF

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Publication number
CN117040255A
CN117040255A CN202310204270.3A CN202310204270A CN117040255A CN 117040255 A CN117040255 A CN 117040255A CN 202310204270 A CN202310204270 A CN 202310204270A CN 117040255 A CN117040255 A CN 117040255A
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CN
China
Prior art keywords
frequency
power supply
circuit
voltage
resonance
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Pending
Application number
CN202310204270.3A
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Chinese (zh)
Inventor
宮嵜洸一
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Sumitomo Heavy Industries Ltd
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Sumitomo Heavy Industries Ltd
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Publication of CN117040255A publication Critical patent/CN117040255A/en
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09—Processes or apparatus for excitation, e.g. pumping
    • H01S3/097—Processes or apparatus for excitation, e.g. pumping by gas discharge of a gas laser
    • H01S3/09702—Details of the driver electronics and electric discharge circuits
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/0003—Details of control, feedback or regulation circuits
    • H02M1/0038—Circuits or arrangements for suppressing, e.g. by masking incorrect turn-on or turn-off signals, e.g. due to current spikes in current mode control
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/14—Arrangements for reducing ripples from dc input or output
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
    • H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
    • H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
    • H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
    • H02M3/1566—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators with means for compensating against rapid load changes, e.g. with auxiliary current source, with dual mode control or with inductance variation
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M5/00—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases
    • H02M5/02—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc
    • H02M5/04—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters
    • H02M5/10—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters using transformers
    • H02M5/12—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into dc by static converters using transformers for conversion of voltage or current amplitude only
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/02—Conversion of ac power input into dc power output without possibility of reversal
    • H02M7/04—Conversion of ac power input into dc power output without possibility of reversal by static converters
    • H02M7/06—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes without control electrode or semiconductor devices without control electrode
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42—Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44—Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48—Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode

Abstract

The application provides a method for controlling the flow rate of water only byThe hardware can also effectively suppress overvoltage, such as a power supply device. A power supply device (250) for driving a laser resonator including a pair of discharge electrodes is provided with: a high-frequency power supply for applying a high-frequency voltage (V) to a resonant circuit including a capacitor of a pair of discharge electrodes RF ) The method comprises the steps of carrying out a first treatment on the surface of the And a clamp circuit (600) provided between the high-frequency power supply and the resonant circuit and applying a high-frequency voltage (V RF ) Is limited to a prescribed range. The high-frequency power supply is provided with: a charging capacitor (411) that is charged by the charging circuit; an inverter (412) that converts the direct-current voltage of the charging capacitor into an alternating-current voltage; and a step-up transformer (413) for generating a high-frequency voltage (V) by step-up the AC voltage RF ) The clamp circuit includes: a transformer (620) arranged in parallel with the step-up transformer; and a rectifier circuit (630) connected to the high-frequency power supply side of the transformer and capable of charging the charging capacitor.

Description

Power supply device and laser device
The present application claims priority based on japanese patent application No. 2022-077328 filed 5/10 in 2022. The entire contents of this japanese application are incorporated by reference into the present specification.
Technical Field
The present application relates to a laser device and the like.
Background
As industrial processing tools, laser processing apparatuses have been widely used. CO is used for laser processing device 2 High-power gas lasers such as lasers. Fig. 1 is a functional block diagram of a laser processing apparatus or laser apparatus 100R. The laser device 100R includes a laser resonator 200 and a power supply 250R. The laser resonator 200 includes a pair of discharge electrodes 202 and 204, a total reflection mirror 206, and a half reflection mirror 208.
A pair of discharge electrodes 202, 204 are arranged to be filled with CO 2 And a gas chamber for laser medium gas. An electrostatic capacitance C exists between the pair of discharge electrodes 202 and 204. The electrostatic capacitance C and the inductor L (inductor element or parasitic inductor) form a capacitor having a resonance frequency F RES Is provided for the resonant circuit 210.
A power supply device 250R for driving the laser resonator 200 applies a high-frequency voltage V to the resonant circuit 210 RF . High frequency voltage V RF Frequency F of (2) RF (hereinafter, also referred to as a synchronization frequency) is set at a resonance frequency F of the resonance circuit 210 RES Is a part of the area around (a). By applying a high-frequency voltage V RF A discharge current flows between the pair of discharge electrodes 202, 204. The laser medium gas is excited by the discharge current to form a population inversion for laser oscillation or stimulated emission. Stimulated emission light from population inversion reciprocates within an optical cavity formed by the total reflection mirror 206 and the semi-reflection mirror 208 and passes through the lasing medium gas in an excited state, thereby being amplified. A part of the amplified stimulated emission light is output as power (laser light) from the half mirror 208.
The power supply device 250R includes: DC power supply 300 for generating stable DC voltage V DC The method comprises the steps of carrying out a first treatment on the surface of the And a high frequency power supply 400 for supplying a DC voltage V DC Converted into high-frequency voltage V RF And apply itApplied to the resonant circuit 210.
Patent document 1: japanese patent application laid-open No. 2019-192715
In an open state due to a connection failure of the discharge electrodes 202 and 204, or in a light load state such as when the laser light is not emitted, the capacitance C between the discharge electrodes 202 and 204 becomes extremely small, and thus the resonance frequency of the resonance circuit 210 (hereinafter, also referred to as an abnormal resonance frequency F RES ') will become very high. As a result, the frequency F is synchronized with the high-frequency power supply 400 RF Abnormal resonant frequency F with resonant circuit 210 R ES ' greater deviation occurs between (F RF ＜F RES '), an excessive high-frequency voltage V is generated on the secondary side of the step-up transformer included in the high-frequency power supply 400 RF . In addition, when the term "resonance frequency" is used in the present specification, the term "resonance frequency" refers to the resonance frequency F at normal times unless otherwise specified RES . And at the resonance frequency F at the time of going to be normal RES And abnormal resonant frequency F RES In the case of deliberate distinction, sometimes expressed as a normal resonant frequency (F RES )。
Patent document 1 discloses an overvoltage suppressing element such as a gas arrester or a varistor that temporarily suppresses an overvoltage between both ends of a resonant circuit in order to suppress an excessive high-frequency voltage applied to the resonant circuit. The overvoltage suppressing element has a limited time to withstand the overvoltage, and the protection circuit during which the abnormality is detected stops the application of the high-frequency voltage to the resonant circuit by software control. However, in addition to the problem of a short lifetime of the overvoltage suppressing element to which overvoltage is directly applied when an abnormality occurs, there is a problem that the operation of the protection circuit accompanied with software control is slow.
Disclosure of Invention
The present application has been made in view of such a situation, and an object thereof is to provide a power supply device or the like capable of effectively suppressing an overvoltage even by hardware alone.
In order to solve the above-described problems, a power supply device according to one embodiment of the present application is a power supply device for driving a laser resonator including a pair of discharge electrodes, the power supply device including: a high-frequency power supply that applies a high-frequency voltage to a resonance circuit including a capacitance of a pair of discharge electrodes; and a vibration suppressing circuit provided between the high-frequency power supply and the resonance circuit and suppressing vibration outside the resonance frequency band of the resonance circuit in the high-frequency voltage.
According to this aspect, vibration outside the normal resonance frequency can be suppressed by the vibration suppressing circuit provided between the high-frequency power supply and the resonance circuit. The excessive high-frequency voltage generated in the open state or the light load state is caused by the resonance frequency (F RES ) Abnormal resonant frequency (F) RES ') is vibrated at high frequency. In the present application, by configuring the vibration suppressing circuit by only hardware, which can suppress the high-frequency vibration of the abnormal resonance frequency outside the normal resonance frequency non-temporarily or at all times, the overvoltage can be suppressed at a higher speed than in patent document 1 accompanied by software control. The vibration suppressing circuit includes, for example, a damping circuit that selectively attenuates a current having a frequency outside the normal resonance frequency band, and a clamp circuit that limits a high-frequency voltage having a frequency outside the normal resonance frequency band to a predetermined range.
Another embodiment of the present application is a laser device. The device is provided with: a laser resonator including a pair of discharge electrodes; a high-frequency power supply that applies a high-frequency voltage to a resonance circuit including a capacitance of a pair of discharge electrodes; and a vibration suppressing circuit provided between the high-frequency power supply and the resonance circuit and suppressing vibration outside the resonance frequency band of the resonance circuit in the high-frequency voltage.
Any combination of the above components or a scheme of converting these expressions in a method, apparatus, system, recording medium, computer program, or the like is also included in the present application.
According to the present application, overvoltage can be effectively suppressed by only hardware.
Drawings
Fig. 1 is a functional block diagram of a laser device.
Fig. 2 is a functional block diagram of the laser device according to embodiment 1.
Fig. 3 shows an example of a main circuit configuration of the power supply device of fig. 2.
Fig. 4 shows a reference example of the high-frequency voltage in the case where the laser resonator is switched to the load open state in the power supply device not provided with the vibration suppression circuit.
Fig. 5 shows an example of high-frequency voltage in the case where the laser resonator is switched to the load open state in the power supply device according to embodiment 1.
Fig. 6 is a functional block diagram of the laser device according to embodiment 2.
Fig. 7 shows an example of a main circuit configuration of the power supply device of fig. 6.
Fig. 8 shows an example of the high-frequency voltage in the case where the laser resonator is switched to the load open state in the power supply device according to embodiment 2.
Fig. 9 is a functional block diagram of the laser device according to embodiment 3.
Fig. 10 shows an example of a main circuit configuration of the power supply device of fig. 9.
In the figure: 100-laser device, 200-laser resonator, 202-discharge electrode, 204-discharge electrode, 210-resonant circuit, 250-power supply device, 300-direct current power supply, 400-high frequency power supply, 410-DC-RF conversion section, 411-charging capacitor, 412-inverter, 413-step-up transformer, 420-high frequency signal generation section, 430-high frequency voltage detection section, 500-damping circuit, 510-resonant section, 520-damping resistor, 600-clamp circuit, 610-resonant section, 620-transformer, 630-rectifying circuit, 640-capacitor.
Detailed Description
Hereinafter, modes for carrying out the present application (hereinafter, also referred to as embodiments) will be described in detail with reference to the accompanying drawings. In the following description and/or drawings, the same or equivalent constituent elements, components, processes, and the like are denoted by the same reference numerals, and repetitive description thereof will be omitted. In the drawings, for the sake of simplicity of explanation, the reduced scale or shape of each portion is appropriately set, and unless otherwise specifically stated, it is not to be construed as limiting. The embodiments are examples, which are not intended to limit the scope of the application in any way. All the features and combinations described in the embodiments are not necessarily essential to the application.
Fig. 2 is a functional block diagram of a laser device 100 according to embodiment 1 of the present application. The laser device 100 includes a commercial power supply 10, a dc power supply 300, a high-frequency power supply 400, a damping circuit 500, a resonant inductor L, and a laser resonator 200. The power supply device 250 according to embodiment 1 of the present application is composed of all or a part of the dc power supply 300, the high-frequency power supply 400, and the damper circuit 500. The functional blocks of the power supply device 250 that are accompanied with software control are realized by cooperation of hardware resources such as a central processing unit, a memory, an input device, an output device, and a device connected to the computer, and software executed using the hardware resources. The above-described functional blocks may be realized by hardware resources of a single computer or may be realized by combining and dispersing hardware resources of a plurality of computers, regardless of the kind of computer or the place where the computer is installed.
The DC power supply 300 includes an AC-DC converter 310, a DC-DC converter 320, a DC bus voltage detector 330, a high-frequency voltage command calculator 340, a duty ratio determiner 350, and a PWM signal generator 360. The AC-DC converter 310 converts an AC voltage such as three-phase AC supplied from the commercial power supply 10 into a DC voltage. The DC-DC converter 320 converts the DC voltage converted by the AC-DC converter 310 into a DC voltage suitable for the laser oscillation operation of the laser device 100. The DC-DC converter 320 includes switching elements such as transistors that are switch-controlled based on the PWM (pulse width modulation: pulse Width Modulation) signal generated by the PW M signal generator 360. Hereinafter, the DC voltage converted by the DC-DC converter 320 is also referred to as a DC voltage V DC Or DC bus voltage V DC . The DC bus voltage detection unit 330 detects the DC bus voltage V generated by the DC-DC conversion unit 320 DC Feedback to the duty ratio determining section 350.
The high-frequency voltage command operation unit 340 calculates a high-frequency voltage V to be generated for the high-frequency power supply 400 from feedback of information indicating the operation and/or state of the laser resonator 200 RF And/or the dc bus voltage V that the dc power supply 300 should generate DC Is a command of (a). As information fed back from the laser resonator 200 to the high-frequency voltage command operation unit 340, for example, there is information that the laser resonator 200 oscillatesThe intensity of the laser light or the current flowing through the pair of discharge electrodes 202, 204 and/or the resonant inductor L. The duty ratio determining unit 350 determines the duty ratio based on the dc bus voltage V detected by the dc bus voltage detecting unit 330 DC And the high-frequency voltage command calculated by the high-frequency voltage command calculation unit 340 to determine the duty ratio of the PWM signal (pulse wave) to be generated by the PWM signal generation unit 360. The PWM signal generation section 360 generates a PWM signal of the duty ratio determined by the duty ratio determination section 350 to be applied to the switching element of the DC-DC conversion section 320.
The high-frequency power supply 400 includes a DC-RF conversion unit 410 and a high-frequency signal generation unit 420.DC-RF converter 410 converts DC bus voltage V generated by DC power supply 300 DC Conversion to synchronous frequency F RF High frequency voltage V of (2) RF . As shown in fig. 3 described later, the DC-RF conversion unit 410 includes: inverter 412 for converting DC bus voltage V DC Converted into alternating voltage V AC The method comprises the steps of carrying out a first treatment on the surface of the And a step-up transformer 413 for converting the AC voltage V AC Boosting to generate high-frequency voltage V RF . The high-frequency signal generating section 420 generates a high-frequency signal for switching the transistor group of the control inverter 412. The frequency of the high-frequency signal (i.e. the switching frequency F SW ) With high-frequency voltage V RF Is of the synchronous frequency F of (2) RF Substantially equal. And due to the synchronous frequency F RF Set at the normal resonant frequency F of the resonant circuit 210 RES And thus the switching frequency F SW Also set at the normal resonant frequency F RES Is a part of the area around (a). The present embodiment is suitable for the power supply device 250 operating at a high frequency, and the switching frequency F SW Frequency F of synchronization RF Normal resonant frequency F RES For example, it is preferably 100kHz or more. When the laser device 100 is a laser processing device, the power of the high-frequency power supply 400 (high-frequency voltage V RF ) Preferably 1kW or more.
A damping circuit 500 (i.e., an example of a vibration suppressing circuit of the present application) is provided between the high-frequency power supply 400 and the resonant circuit 210 (resonant inductor L) that suppresses the high-frequency voltage V generated by the high-frequency power supply 400 RF Out of the resonance frequency band of the resonant circuit 210. The "resonance band" herein means the high-frequency voltage V RF Is beneficial toIn the frequency band of the normal resonance operation of the resonant circuit 210, the typical resonance frequency band is the frequency F of the normal resonance frequency of the resonant circuit 210 RES Is a small frequency band in the center. The resonant frequency band can also be modified to be at the synchronous frequency F RF And/or switching frequency F SW Is a small frequency band in the center.
The laser resonator 200 has the same structure as in fig. 1. However, the inductor L in fig. 1 is shown as a resonant inductor L in fig. 2 outside the laser resonator 200.
Fig. 3 shows an example of a main circuit configuration of the power supply device 250 of fig. 2. The AC-DC converter 310 to which three-phase AC power is supplied from the commercial power supply 10 includes a three-phase full-wave rectifier circuit 311 (three-phase bridge rectifier circuit) composed of six diodes and a smoothing capacitor 312. The three-phase full-wave rectifying circuit 311 rectifies the input three-phase ac to convert it into a pulse current, and the smoothing capacitor 312 smoothes the pulse current to convert it into a dc voltage.
The DC-DC converter 320 includes: a transistor 321 connected between the high potential line and the low potential line; an inductor 322 provided on a high potential line of a preceding stage of the transistor 321; and a diode 323 provided on a high potential line of a subsequent stage of the transistor 321. The DC-DC converter 320 converts the DC voltage converted by the AC-DC converter 310 into a DC voltage V suitable for the laser oscillation operation of the laser resonator 200 by the switching operation of the transistor 321 in which the PW M signal from the PWM signal generator 360, not shown, is applied to the control terminal DC Or DC bus voltage V DC 。
The DC-RF conversion unit 410 in the high-frequency power supply 400 includes a charge capacitor 411, an inverter 412, and a step-up transformer 413. The charging capacitor 411, which is also called a capacitor bank, is connected between the high potential line and the low potential line at the subsequent stage of the DC-DC converter 320. Therefore, the charging capacitor 411 generates the DC bus voltage V by the DC-DC converter 320 functioning as a charging circuit DC To be charged. The dc bus voltage V appearing between the electrodes DC The charging capacitor 411 of (a) may function as the dc bus voltage detection unit 330.
Inversion methodThe capacitor 412 charges the DC voltage V between the electrodes of the capacitor 411 DC Converted into alternating voltage V A C And is applied to the primary winding 413A of the step-up transformer 413. The inverter 412 includes a pair of transistors 412A/412D capable of flowing a current through the primary coil 413A from the top down in fig. 3, and a pair of transistors 412B/412C capable of flowing a current through the primary coil 413A from the bottom up in fig. 3. The high-side transistor 412A and the low-side transistor 412B are connected in series between the high-side line and the low-side line, and the connection point thereof is connected to one end (upper end in fig. 3) of the primary coil 413A of the step-up transformer 413. Similarly, the high-side transistor 412C and the low-side transistor 412D are connected in series between the high-side line and the low-side line, and the connection point thereof is connected to the other end (lower end in fig. 3) of the primary coil 413A of the step-up transformer 413.
The unshown high-frequency signal generating unit 420 applies high-frequency signals complementary to each other to the two transistor pairs (412A/412D and 412B/412C) to generate an alternating voltage V at the primary winding 413A of the step-up transformer 413 AC . Specifically, when the high-frequency signal "420" applied to the control terminal of one set of transistor pair 412A/412D is "on", the high-frequency signal "420'" applied to the control terminal of the other set of transistor pair 412B/412C becomes "off", and a current flows through the primary coil 413A from the top toward the bottom in fig. 3. When the high-frequency signal "420'" applied to the control terminal of the other transistor pair 412B/412C is "on", the high-frequency signal "420" applied to the control terminal of the one transistor pair 412A/412D is turned "off", and a current flows from the bottom toward the top in fig. 3 through the primary coil 413A. The complementary high-frequency signals "420" and "420'" thus applied to the control terminals of the two transistor pairs, while staggered in application time from each other, have substantially equal switching frequencies F SW 。
Step-up transformer 413 outputs ac voltage V generated by inverter 412 AC Boosting to generate high-frequency voltage V RF . Specifically, the ac voltage V of the primary coil 413A AC Boosted high-frequency voltage V RF Appears in secondary winding 413B.
The damping circuit 500 as a vibration suppressing circuit is connected in parallel with the secondary coil 413B between the secondary side of the step-up transformer 413 and the resonant inductor L, and suppresses the high-frequency voltage V appearing in the secondary coil 413B RF Outside the resonance frequency band of (a) and (b). The damping circuit 500 includes: a resonance unit 510 having a resonance frequency within a resonance frequency band; and a damping resistor 520 for damping a current flowing through the resonance portion 510.
The resonance unit 510 is an LC resonance circuit including an inductor 511 and a capacitor 512 connected in parallel. The resonant frequency of the resonant portion 510 is set to be the switching frequency F with the inverter 412 SW (or a high-frequency voltage V equivalent thereto RF Is of the synchronous frequency F of (2) RF Normal resonant frequency F of resonant circuit 210 RES ) Approximately equal. At the normal resonant frequency F in the resonant circuit 210 RES In the case of normal operation, the resonance frequency F is set to the normal resonance frequency F by the action of the resonance portion 510 having the resonance frequency equivalent to the normal operation RES High-frequency voltage V in resonance frequency band as center RF Hardly flows through the damping resistor 520 of the damping circuit 500.
On the other hand, in a light load state such as an open state due to a connection failure of the discharge electrodes 202 and 204 or when the laser resonator 200 is not emitting light, the electrostatic capacitance C between the discharge electrodes 202 and 204 becomes extremely small, and thus the resonance frequency F is higher than the normal resonance frequency F RES Exceptionally high abnormal resonant frequency F RES ' abnormal vibration occurs at the high frequency voltage V RF Is a kind of medium. Fig. 4 shows a high-frequency voltage V in the case of switching the laser resonator 200 to the load open state in the power supply device 250 not provided with the damping circuit 500 RF Is described in the specification. Load open state switching in the center of the figure, "Load Released: the moment of load release ".
High-frequency voltage V before switching to normal operation before load open state RF Representing the normal resonant frequency F R ES (about 2MHz in the example of fig. 4). On the other hand, the high-frequency voltage V at the time of abnormal operation after switching to the load open state RF Abnormal resonant frequency F RES ' abnormalityAnd (5) vibrating. With high-frequency voltage V during normal operation RF In contrast, the abnormal vibration has a large amplitude and a high frequency (F RES ′＞F RE S ). The influence of such high-frequency overvoltage may also be spread to the primary side of the step-up transformer 413, and for example, overvoltage or overcurrent may be applied to a transistor of the inverter 412 constituting the high-frequency power supply 400. Therefore, there is a risk that the transistor is damaged by malfunction or surge. Further, the feedback control in the dc power supply 300 having a large time constant due to the inclusion of the LC filter (for example, the inductor 322 and the smoothing capacitor 312 in fig. 3) cannot sufficiently suppress the abnormal vibration at a high frequency associated with such abrupt load fluctuation.
In contrast, according to the power supply device 250 of the present embodiment in which the damper circuit 500 is provided, abnormal vibration after switching to the load open state can be effectively suppressed as shown in fig. 5. This is because: abnormal resonant frequency F outside of resonant frequency RES The 'abnormal vibration' passes through the damping resistor 520 after passing through the resonance part 510 of the damping circuit 500, and is consumed as joule heat. In this way, by the damper circuit 500 including the resonance portion 510, it is possible to promptly suppress only the abnormal vibration of the high frequency generated in the open circuit state or the light load state, wherein the resonance portion 510 is provided with the high frequency voltage V substantially only outside the resonance frequency band RF Frequency selectivity of the flow to damping resistor 520. In the present embodiment, the abnormal resonance frequency F outside the normal resonance frequency can be suppressed non-temporarily or always by constituting only the hardware or the passive element RES The 'dither' damping circuit 500 is capable of suppressing overvoltage at a higher speed than software control or feedback control in the dc power supply 300.
In addition, even in the case where the laser resonator 200 is operating normally, the high-frequency voltage V RF The normal resonant frequency F contained in (a) RES The higher harmonic component of (a) continuously passes through the resonance portion 510 of the damping circuit 500 and flows through the damping resistor 520. Therefore, the temperature of the damping resistor 520 may rise. In order to suppress the temperature rise, it is conceivable to enlarge the damping resistor 520, but this may lead to an increase in the size of the entire power supply device 250. Root of Chinese characterThe laser device 100 and/or the power supply device 250 according to embodiment 2 and/or embodiment 3 of the present application described below can solve the above-described problems.
Fig. 6 is a functional block diagram of laser device 100 according to embodiment 2 of the present application. The same components as those of the above embodiment are denoted by the same reference numerals, and repetitive description thereof will be omitted. The laser device 100 in fig. 6 is provided with a clamp circuit 600 instead of the damping circuit 500 of the laser device 100 in fig. 2. In fig. 6, a part of the functions of software control and feedback control in the dc power supply 300 of fig. 2 is shifted to the high-frequency power supply 400. Specifically, the same functions as those of the high-frequency voltage instruction operation unit 340 of the dc power supply 300 in fig. 2 are transferred to the high-frequency power supply 400 as the high-frequency voltage detection unit 430, the high-frequency voltage operation unit 440, the high-frequency voltage instruction operation unit 450, the control parameter determination unit 460, and the like. The dc power supply 300 in fig. 6 includes a dc bus voltage command unit 370 instead of the high-frequency voltage command operation unit 340 in fig. 2.
The DC bus voltage command unit 370 generates a DC bus voltage V to be generated by the DC-DC converter 320 DC Is a command of (a). Typically, the dc bus voltage command generated by the dc bus voltage command unit 370 is constant. The duty ratio determining unit 350 reduces the dc bus voltage V detected by the dc bus voltage detecting unit 330 DC The deviation from the constant dc bus voltage command generated by the dc bus voltage command unit 370 determines the duty ratio of the PWM signal (pulse wave) to be generated by the PWM signal generation unit 360. The PWM signal generation section 360 generates a PWM signal of the duty ratio determined by the duty ratio determination section 350 to be applied to the switching element (transistor 321) of the DC-D C conversion section 320. As described above, in the DC power supply 300 of the present embodiment, the DC bus voltage V generated by the DC-DC converter 320 is used for the DC power supply DC And the control is kept constant and easy.
The high-frequency power supply 400 includes a high-frequency voltage detection unit 430, a high-frequency voltage calculation unit 440, a high-frequency voltage command calculation unit 450, and a control parameter determination unit 460 in addition to the DC-RF conversion unit 410 and the high-frequency signal generation unit 420 in fig. 2.
The high-frequency voltage detection unit 430 detects the high-frequency voltage V generated by the DC-RF conversion unit 410 RF Feedback to the control parameter determination unit 460. Specifically, the high-frequency voltage detection unit 430 detects an ac voltage V on the primary side (primary coil 413A) of the step-up transformer 413 AC And/or the high-frequency voltage V of the secondary side (secondary coil 413B) RF . The high-frequency voltage calculation unit 440 calculates the ac voltage V detected by the high-frequency voltage detection unit 430 AC And/or high-frequency voltage V RF To calculate the high frequency voltage V generated by the DC-RF conversion unit 410 RF Feedback to the control parameter determination unit 460.
The high-frequency voltage command operation unit 450 calculates a high-frequency voltage V to be generated for the high-frequency power supply 400 from feedback of information indicating the operation and/or state of the laser resonator 200 RF Is a command of (a). As information fed back from the laser resonator 200 to the high-frequency voltage command operation section 450, there are, for example, the intensity of laser light oscillated from the laser resonator 200, and the current flowing through the pair of discharge electrodes 202 and 204 and/or the resonant inductor L.
The control parameter determining unit 460 determines the high-frequency voltage V supplied from the high-frequency voltage detecting unit 430 and/or the high-frequency voltage calculating unit 440 RF And the high-frequency voltage command calculated by the high-frequency voltage command calculation unit 450 to determine the control parameter of the high-frequency signal to be generated by the high-frequency signal generation unit 420. Examples of the control parameter include a duty ratio and/or a phase of a high-frequency signal of a pulse wave. When the control parameter determining section 460 determines or adjusts the duty ratio of the high-frequency signal, the high-frequency signal generating section 420 performs PWM control on the inverter 412 of the DC-RF converting section 410. When the control parameter determining section 460 determines or adjusts the phase of the high-frequency signal, the high-frequency signal generating section 420 performs phase shift control on the inverter 412 of the DC-RF converting section 410. As a function of the high-frequency voltage V detected by the high-frequency voltage detecting unit 430 RF The high-frequency signal generating unit 420 that generates a control signal generating unit that acts on the control signal of the inverter 412 generates a high-frequency signal (pulse wave) of the duty ratio and/or phase determined by the control parameter determining unit 460, which is applied to each transistor of the inverter 412 of the DC-RF converting unit 410.
The clamp circuit 600 (i.e.,an example of the vibration suppressing circuit of the present application) is provided between the high-frequency power supply 400 (DC-RF converting section 410) and the resonant circuit 210 (resonant inductor L), and suppresses the high-frequency voltage V generated by the high-frequency power supply 400 RF Out of the resonance frequency band of the resonant circuit 210. The specific structure and function thereof will be described later, but the clamp circuit 600 will generate a high-frequency voltage V from the high-frequency power supply 400 RF The limitation (clamping) is within a prescribed range.
Fig. 7 shows an example of a main circuit configuration of the power supply device 250 of fig. 6. The clamp circuit 600 as a vibration suppressing circuit is connected in parallel with the secondary coil 413B between the secondary side of the step-up transformer 413 and the resonant inductor L, and is connected to the charging capacitor 411 on the primary side of the step-up transformer 413 via a transformer 620 or the like. Suppressing the high-frequency voltage V appearing in the secondary coil 413B RF The clamp circuit 600 for vibration outside the resonance frequency band includes: a resonance unit 610 having a resonance frequency within a resonance frequency band; a transformer 620 disposed in parallel with the step-up transformer 413; a rectifier circuit 630 connected to the high-frequency power supply 400 side (primary side of the step-up transformer 413) of the transformer 620 and capable of charging the charging capacitor 411; and a capacitor 640 provided in parallel with the charging capacitor 411 between the rectifying circuit 630 and the charging capacitor 411.
The resonance unit 610 is an LC resonance circuit including an inductor 611 and a capacitor 612 connected in parallel. As in the case of the resonance portion 510 in fig. 3, the resonance portion 610 applies a high-frequency voltage V that is substantially only outside the resonance frequency band RF To the frequency selectivity of the clamp circuit 600. By this frequency selectivity, at the normal resonant frequency F in the resonant circuit 210 RES In the case of normal operation, the resonance frequency F is set to the normal resonance frequency F by the action of the resonance portion 610 having the resonance frequency equivalent thereto RES High-frequency voltage V in resonance frequency band as center RF Hardly flows through the clamp circuit 600. On the other hand, the high-frequency voltage V occurs in an open state due to a connection failure of the discharge electrodes 202 and 204 or in a light load state such as when the laser resonator 200 is not emitting light RF Abnormal resonant frequency F in (a) RES ' abnormal vibration is caused by the transformer 620, the rectifying circuit 630,Capacitor 640 and charging capacitor 411, etc. are suppressed rapidly. As will be described later, the transformer 620, the rectifier circuit 630, the capacitor 640, the charging capacitor 411, and the like can apply the high-frequency voltage V regardless of the frequency band RF Since the frequency selectivity is limited to a predetermined range, even if the resonance portion 610 imparting frequency selectivity is not provided, an overvoltage accompanied by abrupt load fluctuation can be effectively suppressed.
The transformer 620 is provided with a high-frequency voltage V outside the resonance frequency band supplied through the resonance portion 610 RF 1 st coil 621 on the secondary side of step-up transformer 413, and high-frequency voltage V at 1 st coil 621 RF The 2 nd coil 622 on the primary side of the step-up transformer 413 of the voltage after transformation. The transformer 620 has a transformer ratio proportional to the turns ratio N of the 1 st winding 621 and the 2 nd winding 622. The transformed high-frequency voltage V is supplied from the 2 nd coil 622 RF The rectifier circuit 630 of (a) is a two-phase full-wave rectifier circuit (a two-phase bridge rectifier circuit) composed of four diodes. The current rectified by the rectifying circuit 630 charges the capacitor 640 and the charging capacitor 411 connected in parallel. As described above, the voltage between the electrodes of the charging capacitor 411 (i.e., the dc bus voltage V DC ) Since the dc bus voltage command from the dc bus voltage command unit 370 is controlled to be constant, even if the charging capacitor 411 is instantaneously overcharged by the feedback current from the clamp circuit 600, the inter-electrode voltage rapidly drops to the constant dc bus voltage V DC 。
The clamp circuit 600 having the above-described structure is a so-called regenerative voltage clamp circuit. The condition for the clamp circuit 600 to perform the regenerating operation (the operation of feeding back the voltage and/or current from the 1 st coil 621 to the 2 nd coil 622 of the transformer 620) is based on the high-frequency voltage V appearing in the secondary coil 413B of the step-up transformer 413 RF Dc bus voltage V of feedback-destination charging capacitor 411 DC And the turns ratio N of the transformer 620 is denoted as "V RF ＞N×V DC ". That is, if the high-frequency voltage V appearing on the secondary side of the step-up transformer 413 RF The amplitude of (a) becomes larger than "N x V DC ", the clamp circuit 600 regenerates the high-frequency voltage V RF Amplitude limitation of (2)(clamping) at "NXV DC "below".
Fig. 8 shows a high-frequency voltage V when the laser resonator 200 is switched to a load open state in the power supply device 250 provided with the clamp circuit 600 RF Is an example of (a). It can be seen that: although the abnormal resonant frequency F is seen after switching to the load open state RES ' the induced minute abnormal vibration, but its amplitude is effectively suppressed by the clamp circuit 600. The reason why the amplitude of the abnormal vibration is suppressed at such a high speed is that: instead of feedback control by the dc power supply 300 including LC filters with large time constants (e.g., the inductor 322 and the smoothing capacitor 312 in fig. 7), feedback control is performed by the clamp circuit 600 and the high-frequency power supply 400 of the first-order delay system in which the main delay element is substantially only the leakage inductance of the transformer 620. In the present embodiment, the dc bus voltage V of the charging capacitor 411 at the feedback control destination DC The clamp circuit 600 having the above-described structure and function can be inserted because it is kept constant.
Here, as shown in fig. 7, by adopting a capacitor input method in which a capacitor 640 is provided in a stage (high-frequency power supply 400 side) before the rectifying circuit 630 of the clamp circuit 600, a time constant that causes a control delay can be minimized or optimized. However, the rectifier circuit 630 may be configured by another method such as a choke input method, as long as the delay of control can be allowed. In order to reduce the delay in control, it is preferable that at least a part of the semiconductor element of the clamp circuit 600 and/or the vibration suppressing circuit is formed of a wide bandgap semiconductor such as SiC or GaN that can operate at high speed. However, as long as the delay of control can be allowed, all or a part of the semiconductor elements of the clamp circuit 600 and/or the vibration suppressing circuit may be formed of a semiconductor material commonly used for Si or the like.
And normal resonant frequency F RES Unlike embodiment 1 of fig. 3, in which the harmonic component and the like continuously flow through the damping resistor 520, in this embodiment, the "V" is not satisfied regardless of the frequency RF ＞N×V DC Under the operating condition "(generation of overvoltage), a current does not substantially flow through the clamp circuit 600. Thus, inIn this embodiment, the same problem as in the temperature rise of the damping resistor 520 in embodiment 1 does not occur. In the present embodiment, the abnormal resonance frequency F outside the normal resonance frequency can be suppressed, non-temporarily or always, by only the hardware or the passive element, as in embodiment 1 RES The clamp circuit 600 of the 'dither' can suppress the overvoltage at a high speed.
Fig. 9 is a functional block diagram of a laser device 100 according to embodiment 3 of the present application. The same components as those of the above embodiment are denoted by the same reference numerals, and repetitive description thereof will be omitted. The laser device 100 in fig. 9 is different from the laser device 100 in fig. 6 in the structure of the dc power supply 300. Specifically, as shown in the main circuit configuration example of fig. 10, the AC-DC converter 310 is constituted by a three-phase PFC (Power Factor Correction: power factor correction) circuit 313 including six transistors, instead of the three-phase full-wave rectifier circuit 311 in fig. 7. Since a sufficiently large direct-current voltage can be generated by the three-phase PFC circuit 313, the DC-DC converter 320 (such as the transistor 321) shown in fig. 6 and 7 is not required, and the LC filter 380 including the smoothing capacitor 312 and the inductor 322 is disposed at the rear stage of the three-phase PFC circuit 313.
The present application has been described above with reference to the embodiments. Various modifications of the components and combinations of the processes in the illustrated embodiments are possible, and such modifications are also included in the scope of the present application, as will be apparent to those skilled in the art.
The structure, action, and function of each device or each method described in the embodiments can be realized by hardware resources or software resources, or by cooperation of hardware resources and software resources. As the hardware resources, for example, a processor, ROM, RAM, various integrated circuits can be used. As the software resource, for example, programs such as an operating system and an application program can be used.

Claims (8)

1. A power supply device for driving a laser resonator including a pair of discharge electrodes, the power supply device comprising:
a high-frequency power supply that applies a high-frequency voltage to a resonance circuit including a capacitance of the pair of discharge electrodes; a kind of electronic device with high-pressure air-conditioning system
And a vibration suppressing circuit that is provided between the high-frequency power supply and the resonance circuit and suppresses vibration outside a resonance frequency band of the resonance circuit in the high-frequency voltage.
2. The power supply device according to claim 1, wherein,
the high-frequency power supply is provided with: an inverter that converts a supplied dc voltage into an ac voltage; and a step-up transformer for generating the high-frequency voltage by step-up the AC voltage,
the vibration suppression circuit is connected between the secondary side of the step-up transformer and the resonance circuit.
3. The power supply device according to claim 1, wherein,
the vibration suppression circuit is a damping circuit, and the damping circuit includes: a resonance section having a resonance frequency within the resonance frequency band; and a damping resistor for damping a current flowing through the resonance portion.
4. The power supply device according to claim 1, wherein,
the vibration suppressing circuit is a clamp circuit for limiting the high-frequency voltage to a predetermined range.
5. The power supply device according to claim 4, wherein,
the high-frequency power supply is provided with: a charging capacitor charged by the charging circuit; an inverter that converts a direct-current voltage of the charging capacitor into an alternating-current voltage; and a step-up transformer for generating the high-frequency voltage by step-up the AC voltage,
the clamp circuit includes: the transformer is arranged in parallel with the step-up transformer; and a rectifier circuit connected to the high-frequency power supply side of the transformer and capable of charging the charging capacitor.
6. The power supply device according to claim 5, wherein,
the clamp circuit includes a capacitor that is provided in parallel with the charging capacitor between the rectifying circuit and the charging capacitor.
7. The power supply device according to claim 5, wherein,
the high-frequency power supply is provided with: a high-frequency voltage detection unit that detects the high-frequency voltage; and a control signal generation unit that generates a control signal for the inverter from the high-frequency voltage.
8. A laser device is characterized by comprising:
a laser resonator including a pair of discharge electrodes;
a high-frequency power supply that applies a high-frequency voltage to a resonance circuit including a capacitance of the pair of discharge electrodes; a kind of electronic device with high-pressure air-conditioning system
And a vibration suppressing circuit that is provided between the high-frequency power supply and the resonance circuit and suppresses vibration outside a resonance frequency band of the resonance circuit in the high-frequency voltage.
CN202310204270.3A 2022-05-10 2023-03-06 Power supply device and laser device Pending CN117040255A (en)

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JP2022077328A JP2023166674A (en) 2022-05-10 2022-05-10 Power supply device and laser device

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