CN117029730A - OC bridge point gradient angle measuring method - Google Patents
OC bridge point gradient angle measuring method Download PDFInfo
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- CN117029730A CN117029730A CN202310818286.3A CN202310818286A CN117029730A CN 117029730 A CN117029730 A CN 117029730A CN 202310818286 A CN202310818286 A CN 202310818286A CN 117029730 A CN117029730 A CN 117029730A
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 230000003287 optical effect Effects 0.000 claims abstract description 51
- 239000010408 film Substances 0.000 claims abstract description 26
- 238000005259 measurement Methods 0.000 claims abstract description 23
- 230000005540 biological transmission Effects 0.000 claims abstract description 18
- 239000012788 optical film Substances 0.000 claims abstract description 11
- 238000004364 calculation method Methods 0.000 claims abstract description 6
- 238000001514 detection method Methods 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 230000035945 sensitivity Effects 0.000 claims description 13
- 229910052736 halogen Inorganic materials 0.000 claims description 9
- 150000002367 halogens Chemical class 0.000 claims description 9
- 238000005286 illumination Methods 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 238000000691 measurement method Methods 0.000 claims 7
- 239000010410 layer Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 2
- 238000012887 quadratic function Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses a measuring method of an OC bridge point gradient angle, which comprises the following steps: using optical film thickness measuring instrument to detect OC bridge point film thickness as H 0 Detecting the maximum transmitted light intensity Y corresponding to each of a plurality of standard samples by using an optical microscope 0 The method comprises the steps of carrying out a first treatment on the surface of the Using least square method to make multiple H 0 And a plurality of Y 0 Fitting and drawing a standard curve; detecting the OC bridge point film thickness of the sample to be detected as H by using the optical film thickness measuring instrument; substituting H into the standard curve to obtain the maximum transmitted light intensity Y of the sample to be detected; obtaining the width L of the bright edge of the OC bridge point of the sample to be detected by utilizing the transmission light measurement mode of the optical microscope and setting the transmission light intensity as Y; substituting L and H into an arc tangent function calculation formula to obtain the gradient angle theta of the OC bridge point of the sample to be detected. The measuring method of the OC bridge point gradient angle can rapidly detect the OC bridge point gradient angle on the premise of not damaging the sample to be detected.
Description
Technical Field
The invention relates to the technical field of touch display, in particular to a measuring method of an OC bridge point gradient angle.
Background
Currently, a bridging process (also referred to as a jumper process) is generally required for manufacturing a touch substrate, and electrostatic breakdown is easily generated at a bridging position, so that the function of a breakdown part is invalid, and the service life of the touch substrate is reduced. The prior art discloses that the problem of electrostatic breakdown can be solved by controlling the gradient angle of the OC bridge point at the bridge-erecting position within a certain range. In order to realize that the bridging process touch substrate has good static resistance, the OC bridge point gradient angle of the bridging position is a key factor which is required to be strictly controlled.
The OC bridge point size of the bridging position of the touch substrate is smaller, the size is in the micrometer level, the conventional OC bridge point gradient angle detection is realized by a method of slicing and scanning a sample to be detected, the detection method can damage the product to be detected, the detection method is only suitable for carrying out product spot inspection, and meanwhile, a scanning electron microscope for scanning is high in price, long in detection time and unfavorable for the rapid detection of a production line.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the measuring method of the OC bridge point gradient angle is provided, the OC bridge point gradient angle can be rapidly detected on the premise of not damaging a sample to be detected, and the measuring method is suitable for rapid and continuous detection requirements of a production line.
According to an embodiment of the first aspect of the invention, the measuring method of the OC bridge point gradient angle comprises the following steps:
preparing a plurality of standard samples, and detecting the OC bridge point film thickness of the standard samples to be H by using an optical film thickness measuring instrument 0 Detecting the maximum transmitted light intensity Y corresponding to each of a plurality of standard samples by using an optical microscope 0 ；
Using least square method to make multiple H 0 And a plurality of Y 0 Fitting and drawing a standard curve;
detecting the OC bridge point film thickness of the sample to be detected as H by using the optical film thickness measuring instrument;
substituting H into the standard curve to obtain the maximum transmitted light intensity Y of the sample to be detected;
obtaining the width L of the bright edge of the OC bridge point of the sample to be detected by utilizing the transmission light measurement mode of the optical microscope and setting the transmission light intensity as Y;
substituting L and H into an arc tangent function calculation formula to obtain the gradient angle theta of the OC bridge point of the sample to be detected.
The measuring method of the OC bridge point gradient angle according to the embodiment of the invention has at least the following beneficial effects: according to the measuring method of the OC bridge point gradient angle, through manufacturing a standard sample and drawing a standard curve, by matching with an optical film thickness measuring instrument and an optical microscope, the OC bridge point film thickness H of the sample to be measured and the width L of the bright edge can be rapidly obtained, the OC bridge point film thickness H of the sample to be measured and the width L of the bright edge just meet the inverse tangent function relation, the OC bridge point gradient angle of the sample to be measured is further obtained, the OC bridge point gradient angle can be rapidly detected on the premise of not damaging the sample to be measured, and the measuring method is suitable for rapid and continuous detection requirements of a production line.
According to some embodiments of the invention, the method for manufacturing a plurality of standards includes:
selecting a plurality of SiO 2-plated glass raw sheets which have the same specification and smooth and uniform surfaces as a substrate;
manufacturing a layer of OC bridge points on the substrate by utilizing a yellow light process;
and obtaining a plurality of standard samples with different OC bridge point film thicknesses by adjusting parameters of the gumming machine.
According to some embodiments of the invention, a plurality of H 0 And the gradient is gradually increased.
According to some embodiments of the invention, the magnification of the optical microscope is 200 to 1000, and the focus sensitivity of the optical microscope is 0.05mm to 0.2mm.
According to some embodiments of the invention, Y 0 The detection method of (1) comprises:
adjusting the optical microscope to a reflected light measurement mode, and focusing the optical microscope to the OC bridge point of the standard sample to have clear outline;
adjusting the optical microscope to a transmitted light measurement mode so that the OC bridge point edge of the standard sample presents a bright edge;
adjusting the light intensity of the transmitted light of the optical microscope until the width of the bright edge is maximum and clear, wherein the corresponding light intensity of the transmitted light is Y 0 。
According to some embodiments of the invention, H of the sample to be tested satisfies: h is more than or equal to 1.2um and less than or equal to 2.2um.
According to some embodiments of the invention, the OC bridge point length of the sample to be tested is less than 200um.
According to some embodiments of the invention, the OC bridge point material to be tested is acrylic resin.
According to some embodiments of the invention, the method of measuring L comprises:
adjusting the optical microscope to a transmitted light measurement mode, and setting the transmitted light intensity as Y;
and measuring the width of the bright edge of the OC bridge point edge of the sample to be measured.
According to some embodiments of the invention, the transmitted light measurement mode uses a 12V, 100W halogen lamp for transmitted illumination.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a schematic diagram of an OC bridge point film layer stack structure according to an embodiment of the present invention;
FIG. 2 is a schematic illustration of the OC bridge point film layer stack shown in FIG. 1 in a transmitted light measurement mode of an optical microscope;
FIG. 3 is a schematic view of the OC bridge point film layer stack shown in FIG. 2 at the maximum transmitted light intensity of an optical microscope;
FIG. 4 is a top view of the OC bridge point film layer stack shown in FIG. 3;
FIG. 5 is a flow chart of a method for measuring the grade angle of an OC bridge point in accordance with one embodiment of the present invention;
fig. 6 is a cross-sectional view of an OC bridge point slice of the prior art.
Reference numerals:
a substrate 100, an OC bridge site 200, and a bright edge 300.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
The touch display device has wide application and high electrostatic discharge protection requirement on products with long replacement period, such as vehicle-mounted display screens and the like. In the related art, a bridging process (also referred to as a jumper process) is generally adopted for the touch substrate, electrostatic breakdown is easy to occur at the bridging position, so that functional failure occurs at the breakdown position, and the service life of the touch substrate is low. The prior art discloses that the problem of electrostatic breakdown can be solved by controlling the gradient angle of the OC bridge point at the bridge-erecting position within a certain range. In order to realize that the bridging process touch substrate has good static resistance, the gradient angle of the OC bridge point is a key factor which is required to be strictly controlled.
The OC bridge point size of the bridging position of the touch substrate is smaller, the size is in the micrometer level, the conventional OC bridge point gradient angle detection is realized by a method of slicing and scanning a sample to be detected, the detection method can damage the product to be detected, the detection method is only suitable for carrying out product spot inspection, and meanwhile, a scanning electron microscope for scanning is high in price, long in detection time and unfavorable for the rapid detection of a production line.
Aiming at the problems existing in the prior art, the invention provides a measuring method of an OC bridge point gradient angle, which can rapidly acquire the thickness H of the OC bridge point of a sample to be measured and the width L of a bright edge by preparing a standard sample and drawing a standard curve and matching with an optical film thickness measuring instrument and an optical microscope, wherein the thickness H of the OC bridge point of the sample to be measured and the width L of the bright edge just meet the inverse tangent function relationship, so as to obtain the OC bridge point gradient angle of the sample to be measured.
Referring to fig. 6, it can be understood that, due to the smaller size of the OC bridge point, in the micron level, the measurement of the OC bridge point gradient angle often needs to perform numerical control machine tool label grabbing alignment slicing on the OC bridge point at a specific position of the product, so as to obtain a sample to be measured with about 5mm x 5mm, then scan the cross section of the sample with a Scanning Electron Microscope (SEM) to obtain a cross section picture, and finally guide the cross section picture into measurement software to measure the bridge point gradient angle a. The existing OC bridge point gradient angle measuring method has the following problems that products are scrapped due to the need of slicing the products, SEM measuring equipment is needed, however, the SEM measuring equipment is expensive and the measuring process is complex and must be completed by professionals, the equipment needs to be calibrated and maintained regularly, the detecting process damages a detection sample, the whole slicing sample preparation and measuring process at least needs to take 8 hours, the quick detection rhythm in factory production line production is not suitable, real-time monitoring of the OC bridge point gradient angle of online products cannot be met, and the method for detecting the OC bridge point gradient angle by the slices is unfavorable for field application.
Referring to fig. 1 to 5, the method for measuring the OC bridge point gradient angle provided by the embodiment of the invention comprises the following steps:
s100: making multiple standard samplesDetecting the OC bridge point film thickness of the standard sample as H by using an optical film thickness measuring instrument 0 Detecting the maximum transmitted light intensity Y corresponding to each of the plurality of standard samples by using an optical microscope 0 ；
S200: using least square method to make multiple H 0 And a plurality of Y 0 Fitting and drawing a standard curve;
s300: detecting the thickness H of the OC bridge point 200 of the sample to be detected by using an optical film thickness measuring instrument;
s400: substituting H into a standard curve to obtain the maximum transmitted light intensity Y of the sample to be detected;
s500: obtaining the width L of the bright edge 300 of the OC bridge point 200 of the sample to be detected by utilizing the transmission light measurement mode of the optical microscope and setting the transmission light intensity as the maximum transmission light intensity Y;
s600: substituting L and H into an arc tangent function calculation formula to obtain the gradient angle theta of the OC bridge point 200 of the sample to be detected.
Note that, in fig. 2, L0 represents the width of the bright edge 300 of the OC bridge point 200 when the OC bridge point film layer stack structure is in the transmission light measurement mode of the optical microscope.
The method for producing the standard sample is S1001: a plurality of SiO 2-plated glass raw sheets with the same specification and even surface are selected as a substrate 100, a layer of OC bridge points 200 are manufactured on the substrate 100 by utilizing a yellow light process, and a plurality of standard samples with different OC bridge points 200 film thicknesses are obtained by adjusting parameters of a spreading machine. The sample to be tested also typically includes a substrate 100 and an OC bridge point 200.
The maximum transmitted light intensity Y 0 The detection method of (1) is S1002: the optical microscope is adjusted to a reflected light measurement mode, the magnification is adjusted to 500, and the OC bridge point 200 to be tested is focused to the clear edge profile; the optical microscope is adjusted to a transmission light measurement mode, and the edge slope of the OC bridge point 200 to be measured presents a bright edge with a certain width due to the thin film thickness; the transmitted light intensity of the optical microscope is adjusted until the width of the bright edge is maximum and clear, and the corresponding transmitted light intensity is the maximum transmitted light intensity Y 0 。
It should be noted that a plurality of marksIn the standard sample, a plurality of corresponding H 0 And the gradient is gradually increased.
In the step of drawing the standard curve, the OC bridge point film thickness H of the standard sample was used 0 On the abscissa, the thickness H of the OC bridge point is the standard sample 0 Corresponding maximum transmitted light intensity Y 0 And drawing a standard curve by using least square fitting as an ordinate. The standard curve equation for obtaining the OC bridge point of the standard sample is Y 0 ＝4.3939H 0 2 -6.1667H 0 +4.9364，R 2 = 0.9991, where H 0 Film thickness of the OC bridge point which is a standard sample is shown as um; y is Y 0 The unit is kLux which is the maximum transmitted light intensity corresponding to the OC bridge point film thickness of the standard sample.
The method for confirming the width L of the bright edge is S5001: the optical microscope is adjusted to a reflected light measurement mode, the amplification factor is adjusted to 500, the OC bridge point 200 to be measured is focused to the edge with clear outline, the optical microscope is adjusted to a transmitted light measurement mode, the transmitted light intensity is set to be the maximum transmitted light intensity Y, at the moment, the edge of the OC bridge point 200 corresponding to the measured sample presents a bright edge with a certain width, and the width of the measured bright edge is the width L of the bright edge 300 of the OC bridge point 200 to be measured.
The magnification of the optical microscope used for measurement was 200 to 1000, and the focus sensitivity of the optical microscope was 0.05mm to 0.2mm. Specifically, the focus sensitivity indicates the distance the lens of the optical microscope moves when the fine tuning knob of the optical microscope is rotated one turn.
The arc tangent function calculation formula is θ=arctan (H/L), where θ represents the gradient angle of the OC bridge point 200 of the sample, arctan represents the arc tangent function, H represents the film thickness of the OC bridge point 200 of the sample, and L represents the width of the bright side 300 of the OC bridge point 200 of the sample.
In example 1, the test conditions of the optical microscope used for the OC bridge point of the sample to be tested and the OC bridge point of the standard sample are: the transmission illumination is a 12V100W halogen lamp, the magnification of an optical microscope is 500, and the focusing sensitivity is that the lens moves by 0.1mm when the fine tuning knob rotates for one circle.
In example 2, the test conditions of the optical microscope used for the OC bridge point 200 to be tested were: the transmission illumination is a 12V100W halogen lamp, the magnification of an optical microscope is 200, and the focusing sensitivity is that the lens moves by 0.1mm when the fine tuning knob rotates for one circle.
In example 3, the test conditions of the optical microscope used for the OC bridge point 200 to be tested are: the transmission illumination is a 12V100W halogen lamp, the magnification of an optical microscope is 1000, and the focusing sensitivity is that the lens moves by 0.1mm when the fine tuning knob rotates for one circle.
In example 4, the test conditions of the optical microscope used for the OC bridge point 200 to be tested were: the transmission illumination is a 12V100W halogen lamp, the magnification of an optical microscope is 500, and the focusing sensitivity is that the lens moves by 0.05mm when the fine tuning knob rotates for one circle.
In example 5, the test conditions of the optical microscope used for the OC bridge point 200 to be tested were: the transmission illumination is a 12V100W halogen lamp, the magnification of an optical microscope is 500, and the focusing sensitivity is that the lens moves by 0.2mm when the fine tuning knob rotates for one circle.
In comparative example 6, the test conditions of the optical microscope used for the OC bridge point 200 of the sample to be tested were: the transmission illumination is a 12V100W halogen lamp, the magnification of an optical microscope is 100, and the focusing sensitivity is that the lens moves by 0.1mm when the fine tuning knob rotates for one circle.
In comparative example 7, the test conditions of the optical microscope used for the OC bridge point 200 of the sample to be tested were: the transmission illumination is a 12V100W halogen lamp, the magnification of an optical microscope is 500, and the focusing sensitivity is that the lens moves by 0.4mm when the fine tuning knob rotates for one circle.
It should be noted that, the standard samples were prepared according to the methods of examples 1 to 5 and comparative examples 6 to 7, the OC bridge point gradient angle values of the standard samples measured according to the prior art sections were standard values, and the OC bridge point gradient angle values of the standard samples were measured according to the methods of examples 1 to 5 and comparative examples 6 to 7 were test values, 10 sets of standard samples were used in each example, 10 sets of standard samples were numbered, and the standard values, the test values, and the relative standard deviations were recorded in table 1.
The results of comparing the test values obtained by the test method of the present invention with the standard values obtained by the prior art slicing in examples 1 to 5 and comparative examples 6 to 7 are shown in Table 1.
TABLE 1
As can be seen from the data in Table 1, curve fitting is performed by using the characteristic points of the OC bridge point of the standard sample, a quadratic function relation between the OC bridge point film thickness and the maximum transmitted light intensity is established, then the film thickness of the OC bridge point 200 of the sample to be measured is accurately measured through an optical film thickness measuring instrument, the corresponding maximum transmitted light intensity is obtained by substituting the quadratic function, the corresponding maximum transmitted light intensity is adjusted through an optical microscope, the width of a bright edge is measured in a focusing manner, the slope angle actual measurement data obtained by substituting the slope angle arctangent function calculation formula are substituted, the relative deviation is within 3%, the average deviation is 1.78%, the measurement result is accurate, and the error is small.
The comparative example 6 and comparative example 7 respectively reduced the magnification and focus sensitivity with respect to example 1, and table 1 shows that the deviation of the slope angle test values detected in comparative examples 6 and 7 from the standard values is large, the accuracy of the detection results is reduced, and the relative deviation is 11.32% and 14.41% at maximum, respectively, and the deviation is large; the magnification and focus sensitivity were adjusted within specific ranges in examples 2 to 5, and the relative deviation was close to and within 3% compared with the measurement result of example 1, with less error.
The film thickness H of the sample to be measured satisfies: h is more than or equal to 1.2um and less than or equal to 2.2um. The thickness range of the OC insulating layer is 1.2 to 2.2um, the thickness of the OC insulating layer needs to be 1.2um or more, and if the thickness of the OC insulating layer is less than 1.2um, the insulating performance can be weakened due to the fact that the insulating layer is too thin, and the risk of failure of the electrostatic breakdown function of the insulating layer can be caused due to the fact that current interference between the touch functional layers is increased. On the other hand, if the thickness of the insulating layer exceeds 2.2um, a large slope is formed at the edge of the insulating layer, resulting in climbing side erosion of the functional layerAbnormal and excessive film thickness can also lead to OC material waste problems. Film thickness H of OC bridge point of Standard sample 0 Also satisfies H of 1.2um 0 ≤2.2um。
It should be noted that the length of the OC bridge point 200 of the sample to be tested is less than 200um. The OC bridge point is controlled within 200um, so that the influence on the appearance of the touch substrate 100 caused by the fact that the OC bridge point is seen by naked eyes of a user due to the oversized size of the OC bridge point can be effectively avoided. Similarly, the length of the OC bridge point of the standard sample is less than 200um.
It should be noted that the OC bridge point 200 to be tested is made of acrylic resin. The OC bridge point material is acrylic resin, has good material stability, no toxicity, no pollution and wide application, and has excellent functional reliability.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.
Claims (10)
- The measuring method of the OC bridge point gradient angle is characterized by comprising the following steps:preparing a plurality of standard samples, and detecting the OC bridge point film thickness of the standard samples to be H by using an optical film thickness measuring instrument 0 Detecting the maximum transmitted light intensity Y corresponding to each of a plurality of standard samples by using an optical microscope 0 ；Using least square method to make multiple H 0 And a plurality of Y 0 Fitting and drawing a standard curve;detecting the OC bridge point film thickness of the sample to be detected as H by using the optical film thickness measuring instrument;substituting H into the standard curve to obtain the maximum transmitted light intensity Y of the sample to be detected;obtaining the width L of the bright edge of the OC bridge point of the sample to be detected by utilizing the transmission light measurement mode of the optical microscope and setting the transmission light intensity as Y;substituting L and H into an arc tangent function calculation formula to obtain the gradient angle theta of the OC bridge point of the sample to be detected.
- 2. The OC bridge point gradient angle measurement method according to claim 1, wherein the plurality of standard sample manufacturing methods comprise:selecting a plurality of SiO 2-plated glass raw sheets which have the same specification and smooth and uniform surfaces as a substrate;manufacturing a layer of OC bridge points on the substrate by utilizing a yellow light process;and obtaining a plurality of standard samples with different OC bridge point film thicknesses by adjusting parameters of the gumming machine.
- 3. The OC bridge point gradient angle measurement method according to claim 2, wherein a plurality of H' s 0 And the gradient is gradually increased.
- 4. The method for measuring the OC bridge point slope angle of claim 1 wherein the magnification of the optical microscope is 200 to 1000 and the focusing sensitivity of the optical microscope is 0.05mm to 0.2mm.
- 5. The OC bridge point slope angle measurement method of claim 1 wherein Y 0 The detection method of (1) comprises:adjusting the optical microscope to a reflected light measurement mode, and focusing the optical microscope to the OC bridge point of the standard sample to have clear outline;adjusting the optical microscope to a transmitted light measurement mode so that the OC bridge point edge of the standard sample presents a bright edge;adjusting the light intensity of the transmitted light of the optical microscope until the width of the bright edge is maximum and clear, wherein the corresponding light intensity of the transmitted light is Y 0 。
- 6. The OC bridge point slope angle measurement method of claim 1 wherein the H of the sample to be measured satisfies: h is more than or equal to 1.2um and less than or equal to 2.2um.
- 7. The method for measuring an OC bridge point gradient angle according to claim 6, wherein the OC bridge point length of the sample to be measured is less than 200um.
- 8. The method for measuring the OC bridge point gradient angle according to claim 7, wherein the OC bridge point to be measured is made of acrylic resin.
- 9. The OC bridge point slope angle measurement method of claim 1 wherein the measurement method of L comprises:adjusting the optical microscope to a transmitted light measurement mode, and setting the transmitted light intensity as Y;and measuring the width of the bright edge of the OC bridge point edge of the sample to be measured.
- 10. The OC bridge point slope angle measurement method of claim 1 wherein the transmitted light measurement mode uses a 12V, 100W halogen lamp for transmitted illumination.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310818286.3A CN117029730A (en) | 2023-07-04 | 2023-07-04 | OC bridge point gradient angle measuring method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310818286.3A CN117029730A (en) | 2023-07-04 | 2023-07-04 | OC bridge point gradient angle measuring method |
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| CN117029730A true CN117029730A (en) | 2023-11-10 |
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| CN202310818286.3A Pending CN117029730A (en) | 2023-07-04 | 2023-07-04 | OC bridge point gradient angle measuring method |
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