CN111351702B - Method for determining fracture strain of flexible substrate metal film - Google Patents

Method for determining fracture strain of flexible substrate metal film Download PDF

Info

Publication number
CN111351702B
CN111351702B CN202010194407.8A CN202010194407A CN111351702B CN 111351702 B CN111351702 B CN 111351702B CN 202010194407 A CN202010194407 A CN 202010194407A CN 111351702 B CN111351702 B CN 111351702B
Authority
CN
China
Prior art keywords
strain
curve
metal film
flexible substrate
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010194407.8A
Other languages
Chinese (zh)
Other versions
CN111351702A (en
Inventor
罗雪梅
吴绪苹
张广平
宋竹满
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Metal Research of CAS
Original Assignee
Institute of Metal Research of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Metal Research of CAS filed Critical Institute of Metal Research of CAS
Priority to CN202010194407.8A priority Critical patent/CN111351702B/en
Publication of CN111351702A publication Critical patent/CN111351702A/en
Application granted granted Critical
Publication of CN111351702B publication Critical patent/CN111351702B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02Details
    • G01N3/06Special adaptations of indicating or recording means
    • G01N3/066Special adaptations of indicating or recording means with electrical indicating or recording means
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0001Type of application of the stress
    • G01N2203/0003Steady
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014Type of force applied
    • G01N2203/0016Tensile or compressive
    • G01N2203/0017Tensile
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058Kind of property studied
    • G01N2203/006Crack, flaws, fracture or rupture
    • G01N2203/0067Fracture or rupture
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02Details not specific for a particular testing method
    • G01N2203/06Indicating or recording means; Sensing means
    • G01N2203/0617Electrical or magnetic indicating, recording or sensing means

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

The invention discloses a method for determining fracture strain of a flexible substrate metal film, and belongs to the technical field of metal film mechanical property tests. The method comprises four steps: preparing a flexible base metal film into a tensile sample, performing a tensile test on the flexible base metal film, measuring the film resistance in situ, and using a formula delta R/R0=(1+ε)m-1 initial phase of fitting the relative resistance change-strain curve, determining the strain at break of the film corresponding to a deviation of 5% of the experimental curve from the theoretical curve obtained by fitting. The invention can simply and effectively determine the fracture strain of the flexible substrate metal film. The method for determining the fracture strain of the flexible substrate metal film provided by the invention has a wide application range, and provides a new idea for evaluating the tensile property of the flexible substrate metal film.

Description

Method for determining fracture strain of flexible substrate metal film
Technical Field
The invention relates to the technical field of metal film mechanical property tests, in particular to a method for determining fracture strain of a flexible substrate metal film.
Background
Metal thin films are widely used as interconnects of microelectronic devices, and particularly in recent years, the rise of flexible electronic devices has led to the widespread attention on the electrical and mechanical properties of metal thin films on flexible substrates. Tensile properties are an important index for evaluating thin metal film interconnects. Therefore, it is important to determine the fracture strain of the flexible base metal thin film. The widely used method at present is to obtain a relative resistance change-tensile curve through a tensile test, and then deviate the experimental curve based on a formula delta R/R0=ε2The strain at 5% of the theoretical curve of +2 epsilon is determined as the breaking strain of the film. In some cases, however, the above theoretical formula does not reflect the resistance variation with strain during the stretching of the film very well, so that it is necessary to provide a more widely applicable method for determining the breaking strain of the metal film on the flexible substrate.
Disclosure of Invention
Aiming at the problem of how to determine the fracture strain of various flexible base metal films, the invention aims to provide a method for determining the fracture strain of the flexible base metal film, which has better universality compared with the existing method and provides a new technical means for evaluating the tensile property of the flexible base metal film.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a method of determining the fracture strain of a flexible base metal film, the method comprising the steps of:
(1) preparing a metal film of a flexible substrate into a tensile sample;
(2) performing a tensile test on the tensile sample prepared in the step (1), measuring the resistance value of the metal film in the tensile process, and obtaining a relative resistance change-strain curve of the film in the tensile process, namely an experimental curve;
(3) using the formula Δ R/R0=(1+ε)m-1 fitting experimental data points on the experimental curve at lower strain, the resulting fitted curve being referred to as a theoretical curve;
(4) the strain corresponding to a 5% deviation of the experimental curve from the theoretical curve was determined as the strain at break of the film.
In the step (1), the preparation process of the tensile sample comprises the following steps: firstly, preparing a metal film on a flexible substrate, and then cutting the flexible substrate with the metal film into a rectangular tensile sample.
In the step (2), the resistance measurement lead is fixed at the clamping end of the tensile sample (the lead is fixed on the metal film) by using the conductive adhesive tape, the resistance of the film is measured in situ by using a four-wire method, and a relative resistance change-strain curve is obtained.
In the step (3), the fitting process specifically includes: selecting any m value to preliminarily draw a formula delta R/R0=(1+ε)m1, adjusting the value of m to make the plotted curve substantially coincide with the experimental curve obtained in the step (2) when the strain is small (the strain in the initial stage of the experimental curve is small); then selecting experimental data points on the experimental curve which are basically consistent with the drawn curve, and further using a formula delta R/R0=(1+ε)m-1 fitting these data points accurately to obtain a theoretical curve.
In the above step (3), the formula Δ R/R0=(1+ε)mIn-1, m is pseudoSum of parameters, Δ R/R0ε is the strain for the relative resistance change.
The invention has the following advantages:
1. the invention provides a method for determining the breaking strain of a flexible substrate metal film, and perfects an evaluation method for the tensile property of the flexible substrate metal film. The method uses the formula Δ R/R0=(1+ε)m-1 fitting the initial phase of the curve of relative resistance change versus strain when the film is stretched, determining the strain at break of the film corresponding to a deviation of the experimental curve by 5% from the theoretical curve obtained by the fitting.
2. The method for determining the fracture strain of the flexible substrate metal film is simple to operate, the obtained fracture strain result can accurately and effectively reflect the fracture of the flexible substrate metal film in the stretching process, and practice proves that: the strain at break obtained by this method corresponds to the strain at which a considerable amount of microcracks are generated when the film is stretched.
3. The method for determining the fracture strain of the flexible base metal film has wide applicability, can be used for the fracture strain of various flexible base metal films with different microstructures, expands the original method into a more universal application range by introducing the fitting parameter m, and is proved by practice that: the value of m is capable of reflecting the microstructure of the metal thin film to some extent.
Drawings
FIG. 1 is a schematic representation of a stretched sample prepared in example 1.
FIG. 2 is a schematic diagram of in-situ resistance measurement.
FIG. 3 is a graph showing the relative resistance change-strain curve and the equation Δ R/R for Ti films with different thicknesses on polyimide substrates in example 10=(1+ε)m-1 of a fitted curve.
FIG. 4 shows the breaking strain of Ti films with different thicknesses of polyimide substrates in example 1.
FIG. 5 is a graph showing the relative resistance change-strain curves and the equation Δ R/R for Cu-5 at% Al thin films with different thicknesses for the polyimide substrate in example 20=(1+ε)m-1 of a fitted curve.
FIG. 6 shows the fracture strain of Cu-5 at% Al films of different thicknesses of the polyimide substrate in example 2.
Detailed Description
The invention is described in detail below with reference to the figures and examples.
Example 1
In this embodiment, to determine the fracture strain of the magnetron sputtering Ti thin film with the thickness of 50nm, 100nm, and 300nm, the flexible substrate is polyimide with a thickness of 125 μm, the specific steps are as follows:
step 1: ti films of different thicknesses were all prepared into tensile test specimens of 3mm width and 10mm gauge length (FIG. 1).
Step 2: tensile tests were performed on tensile test specimens of Ti films and the sheet resistance was measured in situ using a four-wire method (fig. 2), and the resulting relative resistance change-strain curve is shown in fig. 3.
And step 3: selecting m-2 to draw the formula delta R/R preliminarily0=(1+ε)m-1, adjusting the value of m to make the plotted curve substantially coincide with the experimental curve when the strain is small; then selecting experimental data points on the experimental curve which are basically consistent with the preliminarily drawn curve, and further using a formula delta R/R0=(1+ε)m1, determining the value of m at that time, and fitting a curve (theoretical curve) as shown in FIG. 3, the values of the fitting parameter m also being indicated in the figure.
And 4, step 4: the strain corresponding to the deviation of the experimental curve from the theoretical curve by 5% was determined as the breaking strain of the film, and the breaking strain results are shown in fig. 4.
Example 2
In this example, to determine the fracture strain of magnetron sputtering Cu-5 at% Al thin films with thicknesses of 10nm, 200nm, and 1000nm, respectively, a flexible substrate is polyimide with a thickness of 125 μm, the specific steps are as follows:
step 1: cu-5 at% Al films with different thicknesses are prepared into tensile samples with the width of 6mm and the gauge length of 10 mm.
Step 2: tensile tests were performed on Cu-5 at% Al films and the film resistance was measured in situ, and the resulting relative resistance change-strain curve is shown in fig. 5.
And step 3: selecting m-2 to draw a formula delta R/R0=(1+ε)m-1, adjusting the value of m to make the plotted curve substantially coincide with the experimental curve when the strain is small, then selecting the experimental data points on the experimental curve that substantially coincide with the plotted curve, and further using the formula Δ R/R0=(1+ε)m1, determining the value of m at that time, and fitting a curve as shown in FIG. 5, wherein the values of the fitting parameter m are also indicated.
And 4, step 4: the strain corresponding to the deviation of the experimental curve from the theoretical curve by 5% was determined as the strain at break of the film, and the strain at break results are shown in fig. 6.

Claims (3)

1. A method of determining the fracture strain of a flexible base metal film, characterized by: the method comprises the following steps:
(1) preparing a metal film of a flexible substrate into a tensile sample;
(2) performing a tensile test on the tensile sample prepared in the step (1), measuring the resistance value of the metal film in the tensile process, and obtaining a relative resistance change-strain curve of the film in the tensile process, namely an experimental curve;
(3) using the formula Δ R/R0=(1+ε)m-1 fitting experimental data points on the experimental curve at lower strain, the resulting fitted curve being referred to as a theoretical curve; the fitting process specifically comprises the following steps: selecting any m value to preliminarily draw a formula delta R/R0=(1+ε)m1, adjusting the value of m to make the plotted curve substantially coincide with the experimental curve obtained in step (2) when the strain is small; then selecting experimental data points on the experimental curve which are basically consistent with the drawn curve, and further using a formula delta R/R0=(1+ε)m-1 performing a precise fit on the data points to obtain a theoretical curve; the formula Δ R/R0=(1+ε)mIn-1, m is a fitting parameter,. DELTA.R/R0Is the relative resistance change, and epsilon is the strain;
(4) the strain corresponding to a 5% deviation of the experimental curve from the theoretical curve was determined as the strain at break of the film.
2. The method of determining the breaking strain of a flexible base metal film of claim 1, wherein: in the step (1), the preparation process of the tensile sample comprises the following steps: firstly, preparing a metal film on a flexible substrate, and then cutting the flexible substrate with the metal film into a rectangular tensile sample.
3. The method of determining the breaking strain of a flexible base metal film of claim 1, wherein: in the step (2), a resistance measurement lead is fixed at the clamping end of the tensile sample by using a conductive adhesive tape, the resistance of the film is measured in situ by using a four-wire method, and a relative resistance change-strain curve is obtained.
CN202010194407.8A 2020-03-19 2020-03-19 Method for determining fracture strain of flexible substrate metal film Active CN111351702B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010194407.8A CN111351702B (en) 2020-03-19 2020-03-19 Method for determining fracture strain of flexible substrate metal film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010194407.8A CN111351702B (en) 2020-03-19 2020-03-19 Method for determining fracture strain of flexible substrate metal film

Publications (2)

Publication Number Publication Date
CN111351702A CN111351702A (en) 2020-06-30
CN111351702B true CN111351702B (en) 2021-10-15

Family

ID=71196299

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010194407.8A Active CN111351702B (en) 2020-03-19 2020-03-19 Method for determining fracture strain of flexible substrate metal film

Country Status (1)

Country Link
CN (1) CN111351702B (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1189046A3 (en) * 2000-09-19 2003-08-06 Siemens Aktiengesellschaft Transverse force sensor insensitive for bending and twisting moments
CN1924564A (en) * 2006-09-15 2007-03-07 西安交通大学 Method for measuring several critical strain values of metal membrane in flexible substrate
CN1924563A (en) * 2006-09-15 2007-03-07 西安交通大学 Method for measuring several critical strain values of metal membrane at test current
CN101124353A (en) * 2004-09-27 2008-02-13 盖利姆企业私人有限公司 Method and apparatus for growing a group (III) metal nitride film and a group (III) metal nitride film
CN101131382A (en) * 2006-08-25 2008-02-27 中国科学院金属研究所 System and method for testing performance of thin-film material under electricity/heat/force coupling action
CN101344438A (en) * 2007-07-09 2009-01-14 株式会社神户制钢所 Temperature-measuring member, temperature-measuring device, and method for measuring temperature
CN103804753A (en) * 2013-12-20 2014-05-21 芜湖金鹰机械科技开发有限公司 Ultrathin fracture-resistant metallized film for capacitor and preparation method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1189046A3 (en) * 2000-09-19 2003-08-06 Siemens Aktiengesellschaft Transverse force sensor insensitive for bending and twisting moments
CN101124353A (en) * 2004-09-27 2008-02-13 盖利姆企业私人有限公司 Method and apparatus for growing a group (III) metal nitride film and a group (III) metal nitride film
CN101131382A (en) * 2006-08-25 2008-02-27 中国科学院金属研究所 System and method for testing performance of thin-film material under electricity/heat/force coupling action
CN1924564A (en) * 2006-09-15 2007-03-07 西安交通大学 Method for measuring several critical strain values of metal membrane in flexible substrate
CN1924563A (en) * 2006-09-15 2007-03-07 西安交通大学 Method for measuring several critical strain values of metal membrane at test current
CN101344438A (en) * 2007-07-09 2009-01-14 株式会社神户制钢所 Temperature-measuring member, temperature-measuring device, and method for measuring temperature
CN103804753A (en) * 2013-12-20 2014-05-21 芜湖金鹰机械科技开发有限公司 Ultrathin fracture-resistant metallized film for capacitor and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
尺度对金属材料电阻率影响的研究进展;张广平;《科学研究学报》;20140228;全文 *

Also Published As

Publication number Publication date
CN111351702A (en) 2020-06-30

Similar Documents

Publication Publication Date Title
CN101226163B (en) Method for measuring metallic film fatigue life on a flexible substrate
CN106403804B (en) A kind of high temperature synchroballistic thin film strain meter and preparation method thereof
CN100561210C (en) Method for measuring several critical strain values of metal membrane in flexible substrate
CN111351702B (en) Method for determining fracture strain of flexible substrate metal film
Li et al. Frequency and temperature dependence of the dielectric properties of a PCB substrate for advanced packaging applications
Preiß Fracture toughness of freestanding metallic thin films studied by bulge testing
CN112485617B (en) Method and device for evaluating insulation aging state of cable
CN104729897B (en) Non-residual stress film, preparation method thereof and application thereof in nano-indentation method
CN106643587B (en) A kind of thickness of metal film measurement method based on microwave transmission method
Medvedev A metalized-hole PCB as a strain gauge
US20190094162A1 (en) Method for testing phase transformation point of aluminum alloy
CN112432931B (en) Method for testing film coating curing degree
CN113555495A (en) Film pressure sensor and preparation method and application thereof
CN113871316A (en) Method for detecting vapor deposition defects of semiconductor device
CN113567277A (en) Metal sample fatigue crack propagation rate detection device in high-temperature environment
Liaw et al. A new transducer to monitor fatigue crack propagation
CN113740238A (en) Method for detecting uneven aging of thermosetting insulating material
Sinani et al. Adhesion evaluation of parylene AF4 to silicon and glass substrate
CN112114001A (en) CaZrO3Method for testing electrostrictive effect under high voltage
Macionczyk et al. Stress-strain curves by tensile testing of thin metallic films on thin polyimide foils: Al, AlCu, CuNi (Mn)
CN111220103A (en) Method for measuring surface treatment thickness of circuit board
CN1804606A (en) Apparatus and method for measuring fatigue crack of coated material
Carter et al. Modulus of elasticity and thermal expansion coefficient of ITO film
Patel et al. Ion beam sputtered Y2O3
Kim et al. Heat treatment effects on mechanical properties of Ni–Co alloy thin films

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant