CN117028214A - Piezoelectric pump vibration substrate structure and piezoelectric micropump - Google Patents
Piezoelectric pump vibration substrate structure and piezoelectric micropump Download PDFInfo
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- CN117028214A CN117028214A CN202311109558.9A CN202311109558A CN117028214A CN 117028214 A CN117028214 A CN 117028214A CN 202311109558 A CN202311109558 A CN 202311109558A CN 117028214 A CN117028214 A CN 117028214A
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- 239000000758 substrate Substances 0.000 title claims abstract description 56
- 230000007704 transition Effects 0.000 claims abstract description 64
- 230000005489 elastic deformation Effects 0.000 claims abstract description 12
- 230000004888 barrier function Effects 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 11
- 230000003014 reinforcing effect Effects 0.000 claims description 9
- 230000002787 reinforcement Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 235000014676 Phragmites communis Nutrition 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000036772 blood pressure Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 208000024172 Cardiovascular disease Diseases 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000005802 health problem Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001141 propulsive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
- F04B43/046—Micropumps with piezoelectric drive
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Reciprocating Pumps (AREA)
Abstract
The invention discloses a piezoelectric pump vibration substrate structure and a piezoelectric micropump; the vibration substrate structure comprises an integrally formed edge fixing part, a first elastic piece, a transition connecting ring, a second elastic piece and a central vibration part which are sequentially distributed from edge to center. The transition connecting ring is in a circular ring shape; the outer circumferential edge of the transition connecting ring is arranged at intervals with the inner circumferential edge of the edge fixing part and is connected with the inner circumferential edge of the edge fixing part through a plurality of first elastic pieces. The inner circumferential edge of the transition connecting ring is arranged at intervals with the outer edge of the central vibrating part and is connected with the outer edge of the central vibrating part through a plurality of second elastic pieces. The invention provides a piezoelectric pump vibration substrate structure, wherein an inner arc elastic piece and an outer arc elastic piece which are connected by a transition connecting ring are arranged in the structure, and the inner arc elastic piece and the outer arc elastic piece are staggered for a certain angle, so that the transition connecting ring also participates in elastic deformation; thereby remarkably improving the vibration amplitude of the central vibration part and further improving the output flow of the piezoelectric micropump under the condition of hardly influencing the size of the piezoelectric micropump.
Description
Technical Field
The invention belongs to the technical field of piezoelectric gas micropumps, and particularly relates to a piezoelectric pump vibration substrate structure and a piezoelectric micropump.
Background
The piezoelectric micropump has important application prospect in the blood pressure detection field. Blood pressure detection is an important link in medical diagnosis and health monitoring, and has important significance for preventing cardiovascular diseases and other health problems. Researchers are faced with multiple challenges in exploring innovative piezoelectric micropump technology. First, the flow output is limited, and it is difficult to meet the requirements of some fields for high flow delivery. In addition, energy consumption problems still exist, high driving voltages may affect energy efficiency, and size and stability problems of micropumps need to be overcome. The problems of environmental adaptability, cost effectiveness, market demand and the like in practical applications need to be carefully treated. These complex problems require interdisciplinary collaboration and intensive research to drive the forward development of piezoelectric micropump technology for practical application in a variety of fields.
The elastic connecting piece connecting the edge fixing part and the central vibrating part on the vibrating substrate layer of the traditional piezoelectric micropump is single in structure, so that the vibration amplitude of the central vibrating part is limited, the overall performance of the micropump is limited, and the energy utilization rate of the piezoelectric micropump is reduced. In addition, the existing piezoelectric micropump structure needs to be provided with a buffer sheet between the barrier layer and the vibration substrate layer, so as to avoid the reinforcing layer in the vibration of the vibration substrate layer from directly striking the barrier layer with higher rigidity, thereby causing damage. The buffer sheet increases the overall number of layers of the piezoelectric micropump, resulting in increased seams on the piezoelectric micropump, increased thickness, and increased risk of leakage.
Disclosure of Invention
The invention aims to provide a piezoelectric pump vibration substrate structure and a piezoelectric micropump capable of realizing large flow and smaller size.
In a first aspect, the present invention provides a piezoelectric pump vibration substrate structure, which includes an integrally formed edge fixing portion, a first elastic member, a transition connecting ring, a second elastic member, and a central vibration portion, which are sequentially arranged from edge to center. The transition connecting ring is in a circular ring shape; the outer circumferential edge of the transition connecting ring is arranged at intervals with the inner circumferential edge of the edge fixing part and is connected with the inner circumferential edge of the edge fixing part through a plurality of first elastic pieces. The inner circumferential edge of the transition connecting ring is arranged at intervals with the outer edge of the central vibrating part and is connected with the outer edge of the central vibrating part through a plurality of second elastic pieces.
The first elastic piece comprises a first connecting section, a first deformation section and a second connecting section which are integrally formed. The first deformation section is arc-shaped; the first connecting section and the second connecting section are respectively arranged at opposite ends of two sides of the first deformation section. The first connecting section and the second connecting section are respectively connected with the edge fixing part and the transition connecting ring. The plurality of first elastic sections are uniformly distributed along the circumference of the transition connecting ring.
The second elastic piece comprises a third connecting section, a second deformation section and a fourth connecting section which are integrally formed. The second deformation section is arc-shaped; the third connecting section and the fourth connecting section are respectively arranged at opposite ends of two sides of the second deformation section. The third connecting section and the fourth connecting section are respectively connected with the transition connecting ring and the central vibrating section. The plurality of second elastic sections are uniformly distributed along the circumference of the transition connecting ring.
The arrangement position of each first elastic member and the arrangement position of each second elastic section are offset by an angle of 360 DEG/2 n with respect to the circumferential direction of the central vibrating portion 5.
Preferably, the edge fixing part has a sheet structure with a central hole.
Preferably, each first elastic piece corresponds to a central angle of 55-70 degrees of the transition connecting ring. Each second elastic piece corresponds to a 55-70-degree central angle of the central vibration part.
Preferably, the first deformation section is equally spaced from the edge fixing portion and the transition ring. The second deformation section is equal to the distance between the edge fixing part and the transition connecting ring.
Preferably, the length of the first connecting section and the second connecting section is 6mm-8mm, and the thickness is 0.2mm-0.4mm; the thickness of the first deformation section is 0.4mm-0.6mm. The length of the second connecting section and the second connecting section is 6mm-8mm, and the thickness is 0.2mm-0.4mm; the thickness of the second deformation section is 0.4mm-0.6mm.
Preferably, the number of the first elastic members and the second elastic members is four, but not limited to four, and may be three, five or more.
Preferably, the width (difference between inner and outer radii) of the transition ring is 0.6mm to 1.2mm, and the thickness is 0.2mm to 0.4mm.
Preferably, the piezoelectric vibrating piece is bonded and fixed to one side surface of the center vibrating portion. The piezoelectric vibrating piece is made of piezoelectric material.
Preferably, the piezoelectric pump vibration substrate structure is made of a material having a thermal expansion coefficient of 5 μm/(m·k) to 10 μm/(m·k), a Young's modulus of 190GPa to 220GPa, and a Vickers hardness of 250HV to 280 HV.
In a second aspect, the present invention provides a piezoelectric micropump, including a flow inlet layer, a barrier layer, a vibration substrate layer, an upper power supply layer, and a housing layer, which are sequentially stacked. The vibration substrate layer adopts the piezoelectric pump vibration substrate structure. An input cavity is formed between the inflow layer and the barrier layer; a transition cavity is formed between the barrier layer and the vibration substrate layer; an output cavity is formed between the vibration substrate layer and the shell layer. The center of the blocking layer is provided with a stepped through hole.
The stepped through hole on the barrier layer is in a two-stage stepped hole shape and comprises a first hole section close to the input cavity and a second hole section close to the transition cavity. The joint of the first hole section and the second hole section forms a step surface; a flaky elastic deformation structure is formed between the step surface and the side surface of the barrier layer facing the transition cavity; the thickness of the sheet-like elastic deformation structure is 40-60 mu m.
Preferably, a reinforcing layer is arranged on the side surface of the central vibrating part of the vibrating substrate layer, which faces the transition cavity; the reinforcement layer is aligned with the stepped through-holes in the barrier layer. The diameter of the first hole section on the stepped through hole is smaller than the diameter of the reinforcing layer.
The invention has the beneficial effects that:
1. the invention provides a piezoelectric pump vibration substrate structure, wherein an inner arc elastic piece and an outer arc elastic piece which are connected by a transitional connecting ring are arranged in the piezoelectric pump vibration substrate structure, so that the vibration amplitude of a central vibration part is remarkably improved, and the output flow of a piezoelectric micropump is improved under the condition that the size of the piezoelectric micropump is hardly influenced.
2. The inner arc elastic piece and the outer arc elastic piece are staggered by a certain angle, so that the transition connecting ring also participates in elastic deformation, and the vibration amplitude of the central vibration part is further improved.
3. The invention forms a flaky elastic deformation structure with the thickness of only 40-60 mu m by arranging two-stage stepped holes on the barrier layer; the sheet elastic deformation structure can present good elasticity, replaces the effect of buffer layer in the current piezoelectric micropump for the structure of piezoelectric micropump is further compactified, has reduced the loaded down with trivial details of assembly, and reduces the seepage risk of piezoelectric micropump.
Drawings
Fig. 1 is a schematic front view of embodiment 1 of the present invention.
Fig. 2 is a schematic view of the back structure of embodiment 1 of the present invention.
Fig. 3 is a simulation diagram of the vibration process according to example 1 of the present invention.
Fig. 4 is a graph showing the radial amplitude of the piezoelectric pump vibration substrate structure according to embodiment 1 of the present invention.
Fig. 5 is a schematic cross-sectional view of embodiment 2 of the present invention.
Fig. 6 is an exploded view of example 2 of the present invention.
Fig. 7 is a schematic diagram of amplitude flow rate in embodiment 2 of the present invention.
Fig. 8 is a schematic diagram of the amplitude flow rate of a piezoelectric micropump using the conventional structure 1 as a vibrating substrate structure.
Fig. 9 is a schematic diagram of the amplitude flow rate of a piezoelectric micropump using the conventional structure 2 as a vibrating substrate structure.
Detailed Description
The first embodiment of the present invention will be further described with reference to the accompanying drawings.
Example 1
As shown in fig. 1 and 2, a piezoelectric pump vibration substrate structure includes an integrally formed edge fixing portion 1, a first elastic member 2, a transition connecting ring 3, a second elastic member 4, and a central vibration portion 5, which are sequentially arranged from edge to center. The edge fixing part 1 is of a sheet-shaped structure with a central hole; the transition connecting ring 3 is in a circular shape; the outer circumferential edge of the transition connecting ring 3 is spaced 1.5 mm-2 mm from the inner circumferential edge of the edge fixing portion 1 and is connected by a plurality of first elastic members 2. The inner circumferential edge of the transition connecting ring 3 is spaced 1.5 mm-2 mm from the outer edge of the central vibrating portion 5 and is connected through a plurality of second elastic members 4.
The first elastic member 2 includes a first connecting section, a first deforming section, and a second connecting section, which are integrally formed. The first deformation section is arc-shaped; the first connecting section and the second connecting section are respectively arranged at opposite ends of two sides of the first deformation section. The first connecting section and the second connecting section are respectively connected with the edge fixing part 1 and the transition connecting ring 3. The first elastic pieces 2 are four in total; the four first elastic sections are uniformly distributed along the circumferential direction of the transition connecting ring 3. Each first elastic piece 2 corresponds to the 55-70 central angle of the transition connecting ring 3.
The first deformation section is equal to the distance between the edge fixing part 1 and the transition connecting ring 3. The lengths (the tangential dimension along the transitional connecting ring 3) of the first connecting section and the second connecting section are 6mm-8mm, and the thickness is 0.2mm-0.4mm; the thickness of the first deformation section is 0.4mm-0.6mm.
The second elastic member 4 includes a third connecting section, a second deforming section, and a fourth connecting section, which are integrally formed. The second deformation section is arc-shaped; the third connecting section and the fourth connecting section are respectively arranged at opposite ends of two sides of the second deformation section. The third connecting section and the fourth connecting section are respectively connected with the transition connecting ring 3 and the central vibrating part 5. Four second elastic members 4 are provided; the four second elastic sections are uniformly distributed along the circumferential direction of the transition connecting ring 3. Each second elastic piece 4 corresponds to a 55-60 central angle of the central vibration part 5.
The four first elastic members 2 and the four second elastic members 4 are offset by an angle of 45 ° with respect to the circumferential direction of the central vibrating portion 5; so that the connection point of the second elastic element 4 and the transition connecting ring 3 is at the middle position between the connection points of two adjacent first elastic elements 2 and the transition connecting ring 3; so that the transition ring can also be bent and deformed along with the central vibration part 5, so as to increase the vibration amplitude of the central vibration part 5.
The second deformation section is equal to the distance between the edge fixing part 1 and the transition connecting ring 3. The length (tangential dimension along the transitional coupling ring 3) of the second connecting section and the second connecting section is 6mm-8mm, and the thickness is 0.2mm-0.4mm; the thickness of the second deformation section is 0.4mm-0.6mm.
The width (difference between inner and outer radius) of the transition connecting ring 3 is 0.6 mm-1.2 mm, and the thickness is 0.2mm-0.4 mm.
A piezoelectric vibrating piece 6 is adhesively fixed to one of the side surfaces of the center vibrating portion 5. The piezoelectric vibrating reed 6 is made of a piezoelectric material, and can drive the center vibrating portion 5 to vibrate up and down. The first elastic member 2, the transition ring 3, and the second elastic member 4 are each capable of bending and deforming, and have the function of gradually amplifying the amplitude, so that the amplitude of the center vibration portion 5 can be increased, and the flow rate of the piezoelectric pump can be increased.
In some embodiments, the edge fixing portion 1 has an outer contour edge length of 10 mm-20 mm, a thickness of 50 μm-500 μm, and the material is one or more of materials including stainless steel 304, 430, 429, ni42, ni36, copper, silver, aluminum alloy, and the material having a thermal expansion coefficient of 5-10 μm/(m×k), young's modulus of 190-220GPa, and vickers hardness of 250-280 HV.
In some embodiments, the piezoelectric vibrating piece 6 employs a piezoelectric material having a diameter of 3mm-6mm and a thickness of 50 μm to 300 μm, which is high piezoelectric constant and low loss.
In some embodiments, the material of the piezoelectric vibrating piece 6 is one or more of aluminum nitride, scandium-doped aluminum nitride, zinc oxide, lithium nickelate, or lead zirconate titanate, preferably PZT4. The piezoelectric vibrating piece 6 and the center vibrating portion 5 are specifically bonded by one-component or two-component epoxy glue.
As shown in fig. 3, after the voltage is applied to the piezoelectric vibrating reed 6, the first elastic member 2, the transition connecting ring 3 and the second elastic member 4 which are arranged from outside to inside act together, so that the whole piezoelectric vibrator can be driven to vibrate up and down more accurately, the transmission efficiency can be improved, and the vibration amplitude curve of the surface diameter of the piezoelectric vibrating reed shows that the vibration amplitude is high in center and low in periphery, so that the vibration amplitude is very consistent with the design requirement of a piezoelectric micropump.
When a rectangular wave signal having a peak value of 20Vpp, a first-order resonance frequency (about 23 kHz), and a phase difference of 180 ° is applied to the piezoelectric vibrating piece 6, the amplitude curve of the piezoelectric pump vibrating substrate structure provided in the present embodiment is as shown in fig. 4.
Example 2
As shown in fig. 5 and 6, a miniaturized high-flow piezoelectric micropump includes an inflow layer 100, a barrier layer 200, a vibration substrate layer 300, an upper power supply layer 400, a case layer 500, and a reinforcing layer 600 disposed on the vibration substrate layer, which are sequentially stacked. The vibration substrate layer 300 adopts the piezoelectric pump vibration substrate structure described in embodiment 1.
An input chamber 700 is formed between the intake layer 100 and the barrier layer 200; a transition cavity 800 is formed between the barrier layer 200 and the vibration substrate layer 300; the vibration substrate layer and the case layer 500 form an output cavity 900 therebetween. The inflow layer 100 is provided with a plurality of air inlets 101; the shell layer 500 is provided with an air outlet 501; a stepped through hole 201 is provided in the center of the barrier layer. The stiffening layer 600 is disposed on the side of the vibration substrate layer facing the transition chamber 800 and aligned with the stepped through-holes 201 in the barrier layer. The piezoelectric vibrating piece 6 on the vibration substrate layer 300 is fixed to the side of the vibration substrate layer 300 facing away from the barrier layer 200.
The stepped through-hole 201 in the barrier 200 is in the shape of a two-stage stepped hole, comprising a first hole section near the input chamber 700 and a second hole section near the transition chamber 800. The diameter of the first hole section is greater than the diameter of the second hole section and less than the diameter of the reinforcement layer 600. The diameter of the second hole section is 5 mm-7 mm. The joint of the first hole section and the second hole section forms a step surface; a sheet-shaped elastic deformation structure 202 is formed between the step surface and the side surface of the barrier layer 200 facing the transition cavity 800; the thickness of the sheet-like elastic deformation structure 202 is 40 μm-60 μm (the existence of the sheet-like elastic deformation structure 202 is highlighted in the figure, the thickness is drawn to be larger, the actual thickness is far smaller than the inflow layer 100), good elasticity is presented, and the sheet-like elastic deformation structure can replace the function of a buffer layer in a conventional piezoelectric micropump.
The barrier layer 200 is prepared by etching 3 times to form the flow channel structure and the stepped through hole 201 on the barrier layer 200. The material of the barrier layer 200 is one or more of copper, silver, aluminum, and aluminum alloy.
In some embodiments, the stiffening layer 600 is integrally formed with the vibration substrate layer 300; the reinforcing layer 600 is formed by etching the edge of the side of the center vibration part 5 of the vibration substrate layer 300; the reinforcing layer 600 has a diameter of 2mm to 5mm and a height of 10 μm to 50. Mu.m.
The power supply terminals of the positive and negative electrodes are respectively disposed on the barrier layer 200 and the upper power supply layer 400 for supplying power to the piezoelectric vibrating piece 6. The upper power feeding layer 400 is provided thereon with a conductive sheet 401 connected to a vibration node of a side surface of the piezoelectric vibrating piece 6 away from the center vibration portion 5. The amplitude of vibration at the nodes is minimal.
The working principle of this embodiment is as follows:
the vibration substrate layer 300 and the reinforcement layer 600 constitute a piezoelectric vibrator, a rectangular wave signal having a peak value of 20Vpp, a first order resonant frequency (about 23 kHz), and a phase difference of 180 ° is applied to the power supply terminals of the barrier layer 200 and the upper power supply layer 400, respectively, and when the piezoelectric vibrating piece 6 receives the first half excitation signal, it drives the central vibration part 5 of the vibration substrate layer 300 to move toward the case layer 500 due to the inverse piezoelectric effect, forcing the reinforcement layer 600 to separate from the barrier layer 200, and at this time, the deformation of the vibration substrate layer 300 increases the volume of the transition chamber 800, and the external fluid is sucked into the transition chamber 800 through the air inlet hole 101, the input flow passage on the barrier layer 200, and the stepped through hole 201104. The fluid in the output chamber 900 is forced out of the ejection port creating a propulsive force. When the piezoelectric vibrating piece 6 receives the second half of the excitation signal, the central vibrating portion 5 of the vibrating substrate layer 300 is driven to move towards the barrier layer 200 due to the inverse piezoelectric effect, the reinforcing layer 600 is forced to abut against the through hole 104, so that the stepped through hole 201 is blocked, and at this time, the deformation of the vibrating substrate layer 300 reduces the volume of the transition chamber 800, and the fluid in the transition chamber 800 is input into the output chamber 900. Therefore, the periodic alternating voltage is applied to the piezoelectric vibrating piece 6, so that the fluid can be unidirectionally transferred in the cavity, and unidirectionally circulated can be continuously generated at the air outlet 501.
As shown in fig. 7, compared with the conventional piezoelectric micropump structure, the miniaturized high-flow piezoelectric micropump provided in this embodiment can greatly increase the output flow of the micropump under the condition that the amplitude is unchanged. The prior art structures 1 and 2 in fig. 7 are shown in fig. 8 and 9, respectively.
Claims (10)
1. A piezoelectric pump vibration substrate structure comprises an edge fixing part (1), a first elastic piece (2) and a central vibration part (5); the method is characterized in that: the device also comprises a transition connecting ring (3) and a second elastic piece (4); the transition connecting ring (3) is in a circular ring shape; the outer circumferential edge of the transition connecting ring (3) is arranged at intervals with the inner circumferential edge of the edge fixing part (1) and is connected with the inner circumferential edge of the edge fixing part through a plurality of first elastic pieces (2); the inner circumferential edge of the transition connecting ring (3) is arranged at intervals with the outer edge of the central vibrating part (5) and is connected with the outer edge of the central vibrating part through a plurality of second elastic pieces (4);
the first elastic piece (2) comprises a first connecting section, a first deformation section and a second connecting section which are integrally formed; the first deformation section is arc-shaped; the first connecting section and the second connecting section are respectively arranged at opposite ends of two sides of the first deformation section; the first connecting section and the second connecting section are respectively connected with the edge fixing part (1) and the transition connecting ring (3); the plurality of first elastic sections are uniformly distributed along the circumferential direction of the transition connecting ring (3);
the second elastic piece (4) comprises a third connecting section, a second deformation section and a fourth connecting section which are integrally formed; the second deformation section is arc-shaped; the third connecting section and the fourth connecting section are respectively arranged at opposite ends of two sides of the second deformation section; the third connecting section and the fourth connecting section are respectively connected with the transition connecting ring (3) and the central vibrating part (5); the plurality of second elastic sections are uniformly distributed along the circumferential direction of the transition connecting ring (3);
the arrangement position of each first elastic piece (2) and the arrangement position of each second elastic section are staggered by 360 degrees/2 n degrees relative to the circumferential direction of the central vibration part 5.
2. The piezoelectric pump vibrating substrate structure of claim 1, wherein: the edge fixing part (1) is of a sheet-shaped structure with a central hole.
3. The piezoelectric pump vibrating substrate structure of claim 1, wherein: each first elastic piece (2) corresponds to a 55-70-degree central angle of the transition connecting ring (3); each second elastic piece (4) corresponds to a central angle of 55-70 degrees of the central vibration part (5).
4. The piezoelectric pump vibrating substrate structure of claim 1, wherein: the first deformation section is equal to the distance between the edge fixing part (1) and the transition connecting ring (3); the second deformation section is equal to the distance between the edge fixing part (1) and the transition connecting ring (3).
5. The piezoelectric pump vibrating substrate structure of claim 1, wherein: the length of the first connecting section and the second connecting section is 6mm-8mm, and the thickness is 0.2mm-0.4mm; the thickness of the first deformation section is 0.4mm-0.6 mm; the length of the second connecting section and the second connecting section is 6mm-8mm, and the thickness is 0.2mm-0.4mm; the thickness of the second deformation section is 0.4mm-0.6mm.
6. The piezoelectric pump vibrating substrate structure of claim 1, wherein: the width of the transition connecting ring (3) is 0.6 mm-1.2 mm, and the thickness is 0.2mm-0.4 mm.
7. The piezoelectric pump vibrating substrate structure of claim 1, wherein: a piezoelectric vibrating piece (6) is adhered and fixed on one side surface of the central vibrating part (5); the piezoelectric vibrating piece (6) is made of piezoelectric material.
8. The piezoelectric pump vibrating substrate structure of claim 1, wherein: the piezoelectric pump vibration substrate structure adopts a material with a thermal expansion coefficient of 5 mu m/(m.k) to 10 mu m/(m.k), a Young modulus of 190GPa to 220GPa and a Vickers hardness of 250HV to 280 HV.
9. A piezoelectric micropump, characterized in that: comprises a current inflow layer (100), a barrier layer (200), a vibration substrate layer (300), an upper power supply layer (400) and a shell layer (500) which are sequentially laminated; a vibration substrate layer (300) employing the piezoelectric pump vibration substrate structure according to any one of claims 1 to 8; an input cavity (700) is formed between the inflow layer (100) and the barrier layer (200); a transition cavity (800) is formed between the barrier layer (200) and the vibration substrate layer (300); an output cavity (900) is formed between the vibration substrate layer and the shell layer (500); a stepped through hole (201) is arranged at the center of the barrier layer;
the stepped through holes (201) on the barrier layer (200) are in a two-stage stepped hole shape and comprise a first hole section close to the input cavity (700) and a second hole section close to the transition cavity (800); the joint of the first hole section and the second hole section forms a step surface; a flaky elastic deformation structure (202) is formed between the step surface and the side surface of the barrier layer (200) facing the transition cavity (800); the thickness of the sheet-like elastic deformation structure (202) is 40-60 [ mu ] m.
10. A piezoelectric micropump according to claim 9, wherein: a reinforcing layer (600) is arranged on the side surface of the central vibrating part (5) of the vibrating substrate layer, which faces the transition cavity (800); the reinforcement layer (600) is aligned with the stepped through-holes (201) in the barrier layer; the diameter of the first hole section on the stepped through hole (201) is smaller than the diameter of the reinforcing layer (600).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311109558.9A CN117028214A (en) | 2023-08-31 | 2023-08-31 | Piezoelectric pump vibration substrate structure and piezoelectric micropump |
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| CN202311109558.9A CN117028214A (en) | 2023-08-31 | 2023-08-31 | Piezoelectric pump vibration substrate structure and piezoelectric micropump |
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