CN117026187A - Ship-shaped process chamber and vacuum coating equipment with same - Google Patents

Ship-shaped process chamber and vacuum coating equipment with same Download PDF

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Publication number
CN117026187A
CN117026187A CN202311022901.6A CN202311022901A CN117026187A CN 117026187 A CN117026187 A CN 117026187A CN 202311022901 A CN202311022901 A CN 202311022901A CN 117026187 A CN117026187 A CN 117026187A
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CN
China
Prior art keywords
chamber
process chamber
boat
ion source
vacuum
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Pending
Application number
CN202311022901.6A
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Chinese (zh)
Inventor
杜鸿基
陈亮
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Beijing Weikai Technology Co ltd
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Beijing Weikai Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN202311022901.6A priority Critical patent/CN117026187A/en
Publication of CN117026187A publication Critical patent/CN117026187A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The application belongs to the technical field of vacuum coating equipment, and in particular relates to a boat-shaped process chamber for the vacuum coating equipment and the vacuum coating equipment with the chamber, wherein the boat-shaped process chamber comprises a top surface, a bottom surface, a first side surface perpendicular to the top surface and the bottom surface, a second side surface perpendicular to the top surface, and an inclined surface connecting the second side surface and the bottom surface; the ion source is installed in a semi-embedded mode, and a control line, a power line, a process air pipe and a cooling water pipe of the ion source are arranged outside the ship-shaped process chamber, namely, the part of the ion source exposed in the air. The application improves the consistency of the coating quality of the products coated by different batches of equipment, reduces the internal gassing source of the process chamber during the process, and ensures the vacuum coating of the process chamber and the purity of the coating layer of the coated products.

Description

Ship-shaped process chamber and vacuum coating equipment with same
Technical Field
The application belongs to the technical field of vacuum coating equipment. In particular to a ship-shaped process chamber and vacuum coating equipment with the chamber.
Background
The vacuum coating technique is a method of heating or sputtering a coating material such as metal or nonmetal under high vacuum conditions to deposit a solid film on a substrate.
The vacuum coating technique mainly comprises magnetron sputtering, electron beam evaporation, resistance evaporation and the like, but does not existIn either mode, a main process reaction chamber is required, etching is often required to be performed on a substrate to clean the surface before vacuum coating, the position setting of an ion source is generally set in the main process chamber, and the disadvantage of setting the ion source in the main process chamber is that the ion source is set at a certain relative position, and the radiation angle setting of the ion source can be adjusted to compensate the radiation area of a workpiece disc, so that reactive sputtering coating of a system is realized, and uniformity and stability of coating quality of different equipment can be caused to have deviation due to deviation of equipment manufacturing and angle adjustment of different batches. Next, control lines, power lines, process gas pipes and cooling water pipes of the ion source are provided in the main process chamber, and the ion source is controlled in the atmosphere (10 5 Pa) to a process vacuum (10 -4 Pa) has 9 magnitude changes or under the high temperature of vacuum chamber heating, the control line, the power line, the process gas pipe and the cooling water pipe of the ion source can release some molecular substances or ionic substances or release some molecular substances per se, which affects the purity of the process environment and can indirectly lead to the purity of the film layer of the compound.
Disclosure of Invention
Aiming at the problems in the prior art, the application provides a ship-shaped process chamber and vacuum coating equipment with the chamber.
The complete technical scheme of the application comprises the following steps:
the boat-shaped process chamber comprises a top surface, a bottom surface, a first side surface perpendicular to the top surface and the bottom surface, a second side surface perpendicular to the top surface, and an inclined surface connecting the second side surface and the bottom surface, wherein the inclined surface is provided with an installation caliber for installing an ion source mechanism, and the ion source mechanism is installed on the inclined surface through the caliber; the ion source is installed in a semi-embedded mode, and a control line, a power line, a process air pipe and a cooling water pipe of the ion source are arranged outside the ship-shaped process chamber, namely, the part of the ion source exposed in the air.
Further, the height ratio of the top surface, the bottom surface and the side edges of the chamber, the weight of the ion source and the overall weight of the chamber are designed, and the side length L of the top surface 1 690mm bottomSide length L 2 535mm, chamber height H of 450mm, ion source weight w 1 40KG, process chamber weight W 2 540KG.
Further, a workpiece disc is arranged in the boat-shaped process chamber, and the radiation emitted from the center of the ion source irradiates at 2/3 of the radius of the workpiece disc taking the center of the workpiece disc as the starting point.
Further, an independent vacuum mechanism is arranged on the ship-shaped process chamber.
Further, the ship-shaped process chamber is connected with other equipment chambers through high-vacuum isolation valves, and the chambers are connected with corresponding vacuum systems through high-vacuum valves.
Further, a process chamber door is arranged in front of the boat-shaped process chamber, and an observation window is arranged on the chamber door.
Furthermore, a target gun system for coating is arranged below the boat-shaped process chamber.
Further, the vacuum coating equipment with the ship-shaped process chamber comprises a ship-shaped main process chamber and a sample introduction chamber system, wherein the sample introduction chamber system is used for conveying the workpiece to the ship-shaped main process chamber, coating the workpiece in the ship-shaped main process chamber, and conveying the workpiece back to the sample introduction chamber system for taking out after coating is finished.
Further, the sample injection chamber system is a single-chip sample injection chamber system or a multi-chip sample injection chamber system. The vacuum coating equipment comprises a ship-shaped main process chamber.
Further, the vacuum coating equipment with the ship-shaped process chambers comprises a plurality of ship-shaped main process chambers and a conveying chamber system, and a plurality of sample introduction chamber systems, wherein the plurality of sample introduction chamber systems send workpieces to the conveying chamber system, the conveying chamber system conveys the workpieces to each ship-shaped main process chamber, the ship-shaped main process chambers are used for coating the workpieces, and the workpieces are sequentially conveyed back to the conveying chamber system and the plurality of sample introduction chamber systems and taken out after coating.
And (3) carrying out vacuum coating by using the equipment.
The application has the advantages compared with the prior art that: the traditional rectangular main process chamber is designed into a ship, namely, an inclined plane is formed on the side surface of the rectangular main process chamber, the ion source is arranged in a semi-embedded mode, a control line, a power line and a process air pipe of the ion source are connected with a cooling water pipe which is exposed to the air part of the ion source, the position of the ion source and the control line of the ion source are controlled,
the wiring modes of the power line, the process air pipe, the cooling water pipe and the ion source are redesigned, the ion source is fixed (angle is not adjustable), the consistency of the quality of the coating films of equipment in different batches is enhanced, the air release source of the main process chamber is reduced, and the purity of the process environment is maintained so as to ensure the purity of the quality of the coating films. And a plurality of boat-shaped main process chambers (comprising a plurality of sample introduction chambers and capable of producing a plurality of workpieces in the same batch) are arranged in the same equipment. The batch requirement of magnetron sputtering coating is realized. The consistency of the coating quality of the products coated by different batches of equipment is ensured, the air release source in the main process chamber during the process is reduced, and the vacuum coating of the main process chamber and the purity of the film layer of the coated product are ensured.
Drawings
Fig. 1 is a schematic view of a boat-shaped process chamber structure according to the present application.
FIG. 2 is a schematic diagram of a magnetron sputtering system with a boat-type process chamber of the present application.
FIG. 3 is a schematic diagram of a multi-slice sample injection chamber system of the apparatus of the present application.
Fig. 4 is a schematic diagram of a transfer chamber system of the apparatus of the present application.
In the figure, a 1-boat type main process chamber and a 2-top surface. 3-bottom, 4-first side, 5-second side, 6-bevel, 7-ion source system, 8-workpiece tray, 9-vacuum mechanism, 10-high vacuum valve, 11-process chamber door, 12-viewing window, 13-target gun system, 14-sample cavity, 15-clamp cavity, 16-sample cavity door, 17-sample manipulator transfer mechanism, 18-clamp, 19-first interface, 20-clamp cavity door, 21-sample chamber vacuum mechanism, 22-second interface, 23-transfer manipulator mechanism, 24-transfer chamber vacuum mechanism, 25-top cover plate, 26-top cover plate starting device.
Detailed Description
The present application will be described in detail with reference to the following examples and drawings, but it should be understood that the examples and drawings are only for illustrative purposes and are not intended to limit the scope of the present application in any way. All reasonable variations and combinations that are included within the scope of the inventive concept fall within the scope of the present application.
The application discloses a ship-shaped process chamber for vacuum coating equipment, as shown in fig. 1, the ship-shaped main process chamber 1 comprises a top surface 2, a bottom surface 3, a first side surface 4 perpendicular to the top surface 2 and the bottom surface 3, a second side surface 5 perpendicular to the top surface, a bevel 6 connecting the second side surface and the bottom surface, wherein the bevel 6 is provided with a mounting caliber for mounting an ion source system 7, and the ion source system 7 is mounted on the bevel through the caliber. The semi-embedded ion source system provides ions of the reactant gas. The ion source is installed in a semi-embedded mode, and a control line, a power line, a process air pipe and a cooling water pipe of the ion source are connected to the air part of the ion source. The design mode of the application is different from the design that various wires and pipes of the ion source are arranged in the main process chamber in the prior art, because the coating material needs to be heated in the actual coating process, the temperature in the chamber is higher, various control and power wires, air pipes and water pipes are all air release sources, the materials are various materials such as high polymers and the like, and in the coating process, due to the high temperature in the chamber, part of the materials are inevitably gasified and diffused in the chamber, and part of the materials are condensed on the coating surface of a workpiece, so that the coating quality is reduced. Meanwhile, the vacuum pumping is needed for many times in the coating process of different batches. The control, power wire and gas released by the gas and water pipes also increase the time of evacuation. Therefore, the application carries out semi-embedded installation on the ion source, and the design mode that the control line, the power line, the process air pipe and the cooling water pipe of the ion source are connected with the air part of the ion source, thereby enhancing the consistency of the quality of the coating films of equipment in different batches, reducing the air release source of the main process chamber, maintaining the purity of the process environment and ensuring the purity of the quality of the coating films.
In the application, the design principle of the inclined plane 6 is to design and install the ion source according to the 2/3 place of the radius of the center of the ion source 7 to the center of the work piece disc 8 as the starting point.
On the other hand, the traditional rectangular chamber is changed into the ship-shaped process chamber with the inclined plane, and the support stability of the chamber is different from that of the traditional chamber, so that the integral chamber, the size and weight of the ion source, the angle and distance between the ion source and the workpiece disc and the weight of each part are comprehensively considered in the aspects of design of the size, the angle and the like of the inclined plane, so that the support stability of the chamber in the film plating process is ensured, and the service life of equipment is prolonged.
Among the above parameters, since the center emitted ray reaches 2/3 of the radius of the starting point of the center of the workpiece disk 8, the angle between the inclined plane and the ground, and the distance between the ion source and the workpiece disk are fixed values, specifically: the included angle between the inclined plane and the bottom surface is 120 degrees, the distance from the center point of the surface of the ion source to two points of the workpiece disc at the position 2/3 of the center of the circle is 225mm, the distance from the center point of the surface of the ion source to the position of the workpiece disc at the position 2/3 of the radius of the center of the circle is 30 degrees, and the included angle between the straight line between the two points and the horizontal direction of the workpiece disc is 30 degrees. And the installation position of the ion source on the inclined plane is as follows: the distance from the starting point of the bottom side bevel to the center of the bevel is 160 mm.
Under the limitation of the conditions, aiming at different parameters of the chamber, in the actual coating process, the height ratio of the top surface, the bottom surface and the side edges of the chamber, the weight of the ion source and the overall weight of the chamber are designed, the supporting stability of the chamber in the respective coating process is recorded, the recorded big data are analyzed, reasonable process parameters are selected from the recorded big data, and the following determination modes are selected through analysis:
wherein, I 1 Is the top side length of the chamber, l 2 Is the bottom side length of the bottom surface of the cavity, H is the height of the cavity, W 1 Weight of ion source, W 2 The value of k is a coefficient and is 9-11, preferably9.72。
According to the principle, the design is carried out by combining the actual space situation of a workshop, and the upper side L is selected 1 690mm, lower edge L 2 535mm, chamber height H of 450mm, ion source weight W 1 40KG, chamber weight W 2 540KG.
As shown in fig. 2, in order to complete the vacuum coating function, the boat-shaped process chamber of the application is also provided with a vacuum mechanism which is connected with the process chamber by a high vacuum valve 10, the front of the chamber is provided with a process chamber door 11, the chamber door is provided with an observation window 12, and the lower part of the chamber is provided with a target gun system 13 for coating.
The application also discloses magnetron sputtering coating equipment and a vacuum coating method, wherein the coating equipment comprises a boat-shaped main process chamber 1, a multi-piece sample injection chamber system and a conveying chamber system. The transfer chamber system is an optional system, the multi-chip sample injection chamber system is communicated with the transfer chamber system, and the transfer chamber system is connected with a plurality of main process chambers; or the multi-chip sample injection chamber system is directly connected with the main process chamber.
The structure of the multi-chip sample injection chamber system is shown in fig. 3, and the multi-chip sample injection chamber system comprises a sample injection chamber 14 and a clamp chamber 15 which are adjacently arranged, wherein a sample injection chamber door 16 which is opened in front of the sample injection chamber 14 is internally provided with a sample injection manipulator conveying mechanism 17, the clamp door 20 is opened, a workpiece disc is sequentially placed on a plurality of devices, the workpiece disc is taken from the plurality of devices by a manipulator and is sent to a workpiece table of a main process chamber, and the workpiece on the workpiece disc is coated. The workpiece taking process is that the manipulator takes the workpiece disc from the main process chamber to the sample feeding chamber and then transmits the workpiece disc to the multi-piece device.
Sample introduction chamber for the sample introduction chamber of multi-disc device, sample introduction chamber setting door is the manipulator of being convenient for maintain, and during the normal operation of equipment, the work piece of getting and delivering all is the opening anchor clamps door, directly takes the work piece on multi-disc device.
And has a first interface 19 communicating with other chambers (transfer chamber system or main process chamber), a clamp chamber door 20 is provided in front of the clamp chamber 15, and a multi-slice sample chamber system is provided with a separate sample chamber vacuum mechanism 21. The sample injection chamber system is isolated from the main process chamber or the transfer chamber system by a high vacuum isolation valve. And the conveying manipulator of the sample feeding chamber conveying system is used for loading the workpiece (a plurality of sample feeding chambers are connected to the main process chamber or the plurality of sample feeding chambers are connected to the main process chamber through the conveying chamber), and unloading the workpiece (the main process chamber is connected to the plurality of sample feeding chambers or the main process chamber is connected to the sample feeding chamber through the conveying chamber).
In particular, the sample injection chamber system is provided with a front door in the sample injection cavity 14 and the clamp cavity 15 respectively, so that the sample injection mechanical arm and the clamps of a plurality of workpieces are convenient to maintain, and the lower workpieces are convenient to install and acquire.
The transfer chamber system structure is shown in fig. 4, a plurality of second interfaces 22 with other chambers are arranged on the transfer chamber main body, a transfer manipulator mechanism 23 and a transfer chamber vacuum mechanism 24 are arranged on the transfer chamber main body, a top cover plate 25 in an upper opening mode is arranged above the transfer chamber main body, and the transfer chamber main body can be driven to be opened or closed by a top cover plate driving mechanism 26.
The equipment also comprises a workpiece disc rotating system, a target gun system, a process gas system and a power supply system, wherein the workpiece disc rotating system can enable the workpiece disc to uniformly rotate according to a set rotating speed, and the purpose is to enable reacted ionic substances provided by an ion source and ionized ionic substances on a target material to fully react, so that uniformity of a compound film layer is good. The process gas system provides a process gas. The target gun system provides target ions. The power supply system provides power for device use.
The sample injection chamber, the conveying chamber and the ship-shaped main process chamber are provided with independent vacuum systems, wherein the sample injection chamber is provided with a low vacuum pumping system, and the ship-shaped main process chamber is provided with a low vacuum pumping system and a high vacuum pumping system. When the main process chamber executes the coating process, the process high vacuum degree P required by the coating is required to be achieved D . Before coating, it is necessary to first confirm whether the vacuum level in the process chamber is higher than the switching vacuum level P S If it is higher than the switching vacuum degree P S Can be directly pumped to the process high vacuum degree P by using a high vacuum pumping system D Otherwise, the main process chamber needs to be pumped to the switching vacuum degree P by using a low vacuum pumping system S Then the high vacuum pumping system is used for pumping to the process high vacuum degree P D
In the prior art, a plurality of batches of film plating is carried outIn the process, after finishing a batch of coating process, sampling and sampling are carried out, and before the next batch of workpiece coating is carried out, the main process chamber needs to be pumped from the atmospheric pressure to the switching vacuum degree P by adopting a low vacuum pumping system S Then a high vacuum pumping system is adopted to pump the high vacuum degree P required by the process D This process typically takes about 30 minutes.
In the application, when a multi-batch coating process is carried out, taking a structure of a plurality of sample injection chambers and a main process chamber as an example, after finishing a batch of coating process, the vacuum degree in the main process chamber is the process high vacuum degree P D The vacuum degree in the sample injection chamber is the second vacuum degree P 2 . At the moment, the high-vacuum isolation valves of the process chamber and the sample injection chamber are opened, the workpiece is conveyed, the coated workpiece is conveyed to the sample injection chamber multi-piece device through the main process chamber, the next workpiece to be coated is conveyed to the main chamber, and the high-vacuum isolation valve is closed after conveying is finished. In the process, gas exchange occurs between the process chamber and the sample introduction chamber, and the vacuum degree in the main process chamber is reduced to be between P D And P 2 Low vacuum degree P in between 3 . From the current low vacuum P before the coating process of the next workpiece is performed 3 High vacuum P required for recovery of process D Can be reduced to 3-5 minutes or less. In a specific magnetron sputtering process, the optional parameter is P D Is 5E-6Torr, P 2 4E-2Torr, P 3 5E-4Torr.
By adopting the integral design mode and the film coating method, the time can be saved, and the production efficiency is higher. And the compound film plated by different equipment has good quality purity and consistency and smaller deviation.
When the boat-shaped main process chamber is used for magnetron sputtering coating, the ion state of the process gas supplemented by the ion source directly acts on the surface of the rotating workpiece disk, so that the gas ions supplemented by the ion source are uniformly paved on the surface of the workpiece disk, the ion state of the target material and the ion state of the process gas can fully react, compared with the condition that the ion source is arranged in the chamber, the deflation source of the main process chamber is reduced, a purer compound film layer can be obtained, and the compound film layers prepared by different equipment have smaller quality and stability differences, namely good consistency.
The above applications are only some of the embodiments of the present application. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the application.

Claims (10)

1. The ship-shaped process chamber for the vacuum coating equipment is characterized by comprising a top surface, a bottom surface, a first side surface perpendicular to the top surface and the bottom surface, a second side surface perpendicular to the top surface and an inclined surface connecting the second side surface and the bottom surface, wherein the inclined surface is provided with an installation caliber for installing an ion source mechanism, and the ion source mechanism is installed on the inclined surface through the installation caliber; the ion source is arranged in a semi-embedded mode, and a control line, a power line, a process air pipe and a cooling water pipe of the ion source are arranged outside the ship-shaped process chamber, namely, the part of the ion source exposed in the air.
2. The boat type process chamber according to claim 1, wherein the boat type process chamber is provided with a workpiece disc, and the irradiation position of the rays emitted from the center of the ion source is 2/3 of the radius of the workpiece disc with the center of the workpiece disc as the starting point.
3. The boat form process chamber of claim 1, wherein a separate vacuum mechanism is provided on the boat form process chamber.
4. The boat form process chamber of claim 1, wherein the boat form process chamber is connected to other chambers by high vacuum isolation valves, and the chambers are connected to corresponding vacuum systems by high vacuum valves.
5. The boat form process chamber of claim 1, wherein a process chamber door is provided in front of the boat form process chamber, and wherein an observation window is provided in the chamber door.
6. The boat form process chamber of claim 1, wherein a target gun system for coating is disposed below the boat form process chamber.
7. Vacuum coating equipment with a boat-shaped process chamber according to any one of claims 1-6, characterized in that the vacuum coating equipment comprises a boat-shaped main process chamber and a sample introduction chamber system, wherein the sample introduction chamber system is used for conveying a workpiece to the boat-shaped main process chamber, coating the workpiece in the boat-shaped main process chamber, and conveying the workpiece back to the sample introduction chamber system for taking out after coating.
8. The vacuum coating apparatus of claim 7, wherein the sample chamber system is a single sample chamber system or a multi-wafer sample chamber system, and the boat-shaped main process chamber is one.
9. Vacuum coating equipment with ship-shaped process chambers according to any one of claims 1-6, characterized in that the vacuum coating equipment comprises a plurality of ship-shaped main process chambers, a transfer chamber system and a multi-piece sample introduction chamber system, wherein the multi-piece sample introduction chamber system sends workpieces to the transfer chamber system, the transfer chamber system transfers the workpieces to each ship-shaped main process chamber, the ship-shaped main process chambers are used for coating the workpieces, and the workpieces are sequentially transferred back to the transfer chamber system and the multi-piece sample introduction chamber system and taken out after coating.
10. A method of vacuum coating using the apparatus according to claim 7 or 8.
CN202311022901.6A 2023-08-15 2023-08-15 Ship-shaped process chamber and vacuum coating equipment with same Pending CN117026187A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311022901.6A CN117026187A (en) 2023-08-15 2023-08-15 Ship-shaped process chamber and vacuum coating equipment with same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311022901.6A CN117026187A (en) 2023-08-15 2023-08-15 Ship-shaped process chamber and vacuum coating equipment with same

Publications (1)

Publication Number Publication Date
CN117026187A true CN117026187A (en) 2023-11-10

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ID=88625967

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311022901.6A Pending CN117026187A (en) 2023-08-15 2023-08-15 Ship-shaped process chamber and vacuum coating equipment with same

Country Status (1)

Country Link
CN (1) CN117026187A (en)

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