CN117015163A - Non-contact type soft circuit board stress relief device and control method - Google Patents

Non-contact type soft circuit board stress relief device and control method Download PDF

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Publication number
CN117015163A
CN117015163A CN202311268814.9A CN202311268814A CN117015163A CN 117015163 A CN117015163 A CN 117015163A CN 202311268814 A CN202311268814 A CN 202311268814A CN 117015163 A CN117015163 A CN 117015163A
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CN
China
Prior art keywords
module
component
processed
moving
generating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311268814.9A
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Chinese (zh)
Inventor
黄峰
李来忠
卢克键
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Jiaqishi Technology Co ltd
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Suzhou Jiaqishi Technology Co ltd
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Application filed by Suzhou Jiaqishi Technology Co ltd filed Critical Suzhou Jiaqishi Technology Co ltd
Priority to CN202311268814.9A priority Critical patent/CN117015163A/en
Publication of CN117015163A publication Critical patent/CN117015163A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/26—Methods of annealing
    • C21D1/30—Stress-relieving
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/34—Methods of heating
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D11/00—Process control or regulation for heat treatments
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Child & Adolescent Psychology (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The application discloses a non-contact type soft circuit board stress relieving device and a control method. The laser loading module is provided with a first mounting plate, at least one laser generating device is mounted on the first mounting plate, an arc-shaped mounting groove is formed in the first mounting plate, a connecting piece is arranged on the arc-shaped mounting groove and can move along the grooving direction of the arc-shaped mounting groove, and the connecting piece penetrates through the first mounting plate and is connected with the laser generating device. The application uses the laser generating device to carry out stress relief processing on the component to be processed, and has the advantages of high heating temperature and accurate heating area range; and the heating range is adjustable by installing the laser generating device in the arc-shaped mounting groove and adjusting the irradiation angle.

Description

Non-contact type soft circuit board stress relief device and control method
Technical Field
The application relates to the technical field of stress relief devices, in particular to a non-contact type soft circuit board stress relief device and a control method.
Background
At present, a part of the assembly of the wearable electronic product and the wireless Bluetooth equipment needs to be bent and attached to the side, the bending angle of the flexible circuit board can generate stress during bending, the stress of the flexible circuit board needs to be released immediately, otherwise, the flexible circuit board is easy to deviate, fall off, tilt and the like after bending and attaching, the defective product rate is improved, the product assembly efficiency and the product yield are reduced, and the customer yield requirement cannot be met. The copper contact heating mode is generally adopted to perform stress relief processing on the bending area of the flexible circuit board, so that the heating area range is inaccurate, and the stress relief area heated by copper contact is not easy to change flexibly.
Disclosure of Invention
The application provides a non-contact type soft circuit board stress relieving device and a control method, which realize the adjustment of a heating range by adjusting a laser generating device at multiple angles.
According to an aspect of an embodiment of the present application, there is provided a non-contact flexible circuit board stress relieving device, including:
the device comprises a loading mechanism, a jig module and a laser loading module, wherein the jig module and the laser loading module are installed on the loading mechanism, and the jig module is used for installing a component to be processed. The laser loading module is provided with a first mounting plate, at least one laser generating device is mounted on the first mounting plate and used for irradiating and heating a target area of the component to be processed, and the target area refers to an area of the component to be processed, in which stress is needed to be removed partially. The laser generating device comprises a first mounting plate and is characterized in that an arc-shaped mounting groove is formed in the first mounting plate, a connecting piece is arranged on the arc-shaped mounting groove and can move along the grooving direction of the arc-shaped mounting groove, and the connecting piece penetrates through the first mounting plate and is connected with the laser generating device.
In a further technical scheme, an included angle between a first connecting line and a second connecting line ranges from 25 degrees to 60 degrees, the first connecting line is a connecting line between a first end point of the arc-shaped mounting groove and the component to be processed, and the second connecting line is a connecting line between a second end point of the arc-shaped mounting groove and the component to be processed.
In a further technical scheme, the connecting piece comprises a connecting part and a limiting part, the connecting part is connected with the laser generating device, and the limiting part is installed in the arc-shaped installation groove.
In a further technical scheme, the laser loading module comprises a first movable module and a second movable module, the first movable module is installed on the loading mechanism and is used for adjusting the machining point position between the laser generating device and the component to be machined. The laser generating device is installed on the second movable module, the second movable module is installed on the first movable module through a first installation seat, and the second movable module is used for adjusting the vertical distance between the laser generating device and the component to be processed.
In a further technical scheme, the laser loading module further comprises a third movable module, one end of the third movable module is connected with a sliding device and is installed on the loading mechanism through the sliding device, the other end of the third movable module is installed on the first installation seat, and the third movable module is used for adjusting the horizontal distance between the laser generating device and the component to be processed.
In a further technical scheme, the third mobile module comprises a third mobile driving device and the first mounting plate, the first mounting plate is mounted on the third mobile driving device through a sliding structure, and the second mobile module is mounted on the first mounting plate.
In a further technical scheme, the device further comprises a visual detection unit, wherein the visual detection unit is used for detecting the installation position of the component to be processed.
In a further technical scheme, the visual detection unit comprises a visual detection movement mechanism, the visual detection movement mechanism comprises a visual camera and a visual camera movement driving device, the visual camera movement driving device is installed on the loading mechanism, the visual camera is slidably installed on the visual camera movement driving device through a second mounting plate, and a visual detection point position of the visual camera and a heating point position of the laser generating device are the same.
In further technical scheme, still include the tool mobile unit, the tool mobile unit is installed on the loading mechanism, the tool mobile unit includes triaxial mobile module and triaxial module removal drive arrangement, triaxial mobile module passes through second mount pad slidable mounting and is in triaxial module removal drive arrangement is last.
In a further technical scheme, the triaxial mobile module comprises a triaxial mobile mounting seat and the jig module, and the jig module is mounted on the triaxial mobile mounting seat.
In a further technical scheme, the jig module comprises a component mounting plate to be processed, a first propping element and a second propping element, wherein a first guide element and a second guide element are arranged on the component mounting plate to be processed, the first propping element is arranged on the first guide element, the second propping element is arranged on the second guide element, and the guide direction of the first guide element is mutually perpendicular to the guide direction of the second guide element.
In a further technical scheme, the first guiding element is connected with a first tightening element, the first tightening element provides a pretightening force in the Y-axis direction for the first guiding element, the second guiding element is connected with a second tightening element, and the second tightening element provides a pretightening force in the X-axis direction for the second guiding element.
In a further technical scheme, the upper surface of the first jacking element horizontally extends to be provided with a pressing structure, and the lower surface of the pressing structure abuts against the outer wall surface of the component to be processed when the component to be processed is installed in place.
In a further technical scheme, the clamping jaw moving device further comprises a clamping jaw moving unit, wherein the clamping jaw moving unit comprises a rotary clamping jaw and a clamping jaw rotary driving device, the clamping jaw rotary driving device is fixedly installed on the loading mechanism through a third installation seat, and the clamping jaw rotary driving device is connected with the rotary clamping jaw.
In a further technical scheme, the jig module further comprises a pressure sensing element, and the pressure sensing element is installed between the triaxial mobile installation seat and the component installation plate to be processed.
According to another aspect of the embodiment of the present application, there is provided a method for controlling a stress relieving device of a non-contact flexible circuit board, the method being applied to the stress relieving device of the non-contact flexible circuit board, the method including:
s1, manually feeding the to-be-processed component onto the jig module, and moving the jig module to a pre-processing station under the condition that the to-be-processed component is installed in place;
s2, detecting whether the mounting position of the component to be processed is correct or not under the condition that the jig module moves to a pre-processing station;
s3, under the condition that the component to be processed is correctly installed at a preset position, the laser generating device moves to the preset position, and the irradiation angle of the laser generating device is adjusted through the connecting piece;
and S4, executing a command for controlling the laser generating device to emit laser to the target area under the condition that the laser generating device is detected to move to the preset position.
Compared with the prior art, the application has the beneficial effects that:
the application uses the laser generating device to carry out stress relief processing on the component to be processed, and has the advantages of high heating temperature and accurate heating area range; furthermore, the laser generating device is arranged in the arc-shaped mounting groove, the irradiation angle is adjusted, more areas needing heating and stress relief of the component to be processed are processed, and the heating range of the stress relief areas is adjustable.
Drawings
FIG. 1 is a schematic view of the overall structure of the present application;
FIG. 2 is a schematic diagram of a fixture moving unit according to the present application;
FIG. 3 is a schematic diagram of a fixture module according to the present application;
FIG. 4 is a schematic view of the structure of the first mounting plate of the present application;
FIG. 5 is a schematic view of the installation of the first and second guide elements of the present application;
FIG. 6 is a schematic view of the construction of the first and second biasing elements of the present application;
FIG. 7 is a schematic diagram of the visual inspection module of the present application;
FIG. 8 is a schematic view of the structure of the laser loading module of the present application;
fig. 9 is a schematic structural view of the jaw moving unit of the present application.
The components in the drawings are marked as follows:
1. a loading mechanism;
2. a jig moving unit; 21. a triaxial moving module; 211. the triaxial moving installation seat; 212. a component mounting plate to be processed; 213. a first guide member; 214. a second guide member; 215. a first tightening element; 2151. a compacting structure; 216. a second tightening element; 22. the triaxial module group moves the driving device; 23. a second mounting base;
3. a first mobile module; 31. a first mount;
4. a second mobile module;
5. a third mobile module; 51. a sliding device; 52. a third movement driving device; 53. a first mounting plate; 531. an arc-shaped mounting groove; 54. a laser generating device;
6. a visual detection unit; 61. a visual camera movement driving device; 62. a visual camera; 63. a second mounting plate;
7. a jaw moving unit; 71. rotating the clamping jaw; 72. a jaw rotation driving device; 73. and a third mounting seat.
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
Referring to fig. 1 to 3, the application provides a non-contact flexible circuit board stress relieving device, which comprises a loading mechanism 1, a jig module and a laser loading module, wherein the jig module and the laser loading module are installed on the loading mechanism 1, and the jig module is used for installing a component to be processed. The laser loading module is provided with a first mounting plate 53, at least one laser generating device 54 is mounted on the first mounting plate 53, the laser generating device 54 is used for irradiating and heating a target area of the component to be processed, and the target area refers to an area of the component to be processed, in which stress is needed to be removed partially.
As shown in fig. 4, the first mounting plate 53 is provided with an arc-shaped mounting groove 531, the arc-shaped mounting groove 531 is provided with a connecting piece, the connecting piece can move along the slotting direction of the arc-shaped mounting groove 531, and the connecting piece passes through the first mounting plate 53 and is connected with the laser generating device 54. According to the application, the stress on the bent flexible circuit board is removed in a laser heating mode, so that the small area of the component to be processed is accurately heated, and the range of the heating area is adjusted.
At least two arc-shaped mounting grooves 531 are formed in the first mounting plate 53 in the embodiment of the present application, the arc-shaped mounting grooves 531 are arranged on the first mounting plate 53 with a target area of the component to be processed, which needs to be stress relieved, as a center, a slotting range of the arc-shaped mounting grooves 531 is set as a setting standard, a range of the laser irradiation point of the laser generating device 54, which is movable, always falls on the outer surface of the component to be processed, and the laser generating device 54 is arranged in the arc-shaped mounting grooves 531 through a connecting piece, and since the connecting piece can slide in the arc-shaped mounting grooves 531, the angle of the laser generating device 54 can be adjusted, the heating range can be adjusted, and the heating requirement of more stress relieving areas can be met.
In one embodiment, the first mounting plate 53 is provided with an arc-shaped mounting groove 531, the arc-shaped mounting groove 531 is disposed on the first mounting plate 53 with a target area of the component to be processed, which needs to be stress relieved, as a center, the first mounting plate 53 is provided with a plurality of limiting grooves with the target area of the component to be processed, which needs to be stress relieved, as a center, and the laser generating device 54 is mounted in the limiting grooves and is mounted on the first mounting plate 53 through the connecting piece. The arrangement of the limit groove makes the installation of the laser generating device 54 more stable.
In another embodiment, two laser generating devices 54 are disposed on the first mounting plate 53, the two laser generating devices 54 are fixedly connected through a connecting rod, the length of the connecting rod is set according to the processing requirement of the processing point of the component to be processed, and each laser generating device 54 corresponds to one processing point. The number of the laser generating devices is set according to the number of the processing points, and the application does not specifically limit the number of the laser generating devices and the installation mode of the laser generating devices.
It should be noted that the specific installation mode of the laser generating device is not limited in the present application, and the installation structure of the laser generating device 54 may be adaptively adjusted according to the target area of the component to be processed, that is, the laser irradiation angle of the laser generating device 54 may be adjustable and may fall on the outer surface of the component to be processed.
Optionally, an included angle between a first connecting line and a second connecting line ranges from 25 ° to 60 °, the first connecting line is a connecting line between a first end point of the arc-shaped mounting groove 531 and the component to be processed, and the second connecting line is a connecting line between a second end point of the arc-shaped mounting groove 531 and the component to be processed. The laser generator 54 rotates in the range of 25 ° to 60 °, and can adjust more heating angles under the condition of ensuring the stability of the device, so as to perform stress relief processing on more target areas.
The included angle range is not particularly limited, and the included angle range can ensure that the laser irradiation angle of the laser generating device 54 falls on the outer surface of the component to be processed.
Optionally, the connecting member includes a connecting portion connected to the laser generating device 54 and a limiting portion mounted in the arc-shaped mounting groove 531. When the connecting piece is locked, the laser generating device 54 can be ensured to be firmly installed on the first mounting plate 53, and when the connecting piece is locked, the laser generating device 54 can be ensured to slide in the arc-shaped mounting groove 531.
In the embodiment of the application, the connecting piece is a bolt, an internal thread mounting hole is formed in the outer wall surface of the laser generating device 54, the rod part of the bolt is mounted in the internal thread mounting hole, the head part of the bolt is mounted in the arc-shaped mounting groove 531, and the bolt is screwed to limit the laser generating device 54.
In another embodiment, the connecting piece is a mounting bracket with mutually perpendicular plate surfaces, the mounting bracket is mounted on the plate surfaces in the arc-shaped mounting groove 531 to fit the arc-shaped design of the arc-shaped mounting groove 531, so that the mounting bracket can slide in the arc-shaped mounting groove 531, a buckle is further arranged on the mounting bracket, a plurality of clamping grooves are formed in the first mounting plate 53 according to different angle positions, and the buckle is buckled in the clamping grooves. The specific structure of the connector is not limited in the present application, and the connector may ensure that the laser generator 54 is slidably mounted on the first mounting plate 53.
Optionally, as shown in fig. 8, the laser loading module includes a first moving module 3 and a second moving module 4, where the first moving module 3 is installed on the loading mechanism 1, and the first moving module 3 is used to adjust a machining point position between the laser generating device 54 and the component to be machined. The moving direction of the laser generating device 54 moving between the processing points is set as the X-axis direction, and the laser generating device 54 is driven by the first moving module 3 to move in the X-axis direction, so that heating and stress relief of different laser target areas of the component to be processed are realized.
The laser generating device 54 is installed on the second moving module 4, the second moving module 4 is installed on the first moving module 3 through the first installation seat 31, and the second moving module 4 is used for adjusting the vertical distance between the laser generating device 54 and the component to be processed.
After the position of the laser generating device 54 in the X-axis direction is adjusted, if the laser irradiation point of the laser generating device 54 is not irradiated on the target area, the second moving module 4 is adjusted to adjust the position of the laser irradiation point in the vertical direction, so that the laser irradiation point is moved to the target area of the component to be processed, thereby improving the accuracy of laser processing.
Optionally, as shown in fig. 8, the laser loading module further includes a third moving module 5, one end of the third moving module 5 is connected with a sliding device 51, and is installed on the loading mechanism 1 through the sliding device 51, the other end of the third moving module 5 is installed on the first mounting seat 31, and the third moving module 5 is used for adjusting a horizontal distance between the laser generating device 54 and the component to be processed.
In the embodiment of the present application, the moving direction of the third moving module 5 is set to be the Y-axis direction, and the laser generating device 54 is driven by the third moving module 5 to move along the Y-axis direction, so that the intensity of the laser generating device 54 and the area of the heating area can be changed, and the vertical distance of the laser generating device 54 can be adjusted according to different processing requirements, thereby increasing the application flexibility of the present application and increasing the application range of the present application.
Alternatively, the third moving module 5 includes a third moving driving device 52 and the first mounting plate 53, the first mounting plate 53 is mounted on the third moving driving device 52 through a sliding structure, and the second moving module 4 is mounted on the first mounting plate 53.
In the embodiment of the present application, the first mounting plate 53 is mounted on the third movement driving device 52 to implement movement in the Y-axis direction, that is, the laser generating device 54 may be mounted on the first mounting plate 53 to implement adjustment thereof in the Y-axis direction and the vertical direction.
Optionally, the non-contact flexible circuit board stress relieving device further comprises a visual detection unit 6, wherein the visual detection unit 6 is used for detecting the installation position of the component to be processed.
In an exemplary embodiment, as shown in fig. 7, the visual detection unit 6 includes a visual detection motion mechanism including a visual camera 62 and a visual camera movement driving device 61, the visual camera movement driving device 61 is mounted on the loading mechanism 1, the visual camera 62 is slidably mounted on the visual camera movement driving device 61 through a second mounting plate 63, and a visual detection point of the visual camera 62 is the same as a heating point of the laser generating device 54.
In the embodiment of the present application, the visual detection unit 6 is configured to monitor whether the component to be processed is installed in place, and when the component to be processed is installed on the jig module, the visual camera 62 photographs the installation state of the component to be processed and sends the photographed image information back to the control center to detect whether the component to be processed is installed correctly, so that the defective rate of the product can be effectively reduced by adding the visual detection unit.
Optionally, as shown in fig. 3, the non-contact flexible circuit board destressing apparatus further includes a jig moving unit 2, the jig moving unit 2 is mounted on the loading mechanism 1, the jig moving unit 2 includes a triaxial moving module 21 and a triaxial module moving driving device 22, and the triaxial moving module 21 is slidably mounted on the triaxial module moving driving device 22 through a second mounting seat 23. The jig moving unit 2 is arranged to be of a sliding structure, so that the assembly to be processed is conveniently fed manually.
Alternatively, as shown in fig. 3, the triaxial moving module 21 includes a triaxial moving mount 211 and the jig module, and the jig module is mounted on the triaxial moving mount 211.
In the embodiment of the application, the jig module is mounted on the triaxial moving mounting seat 211 to realize the movement of the jig module in the X-axis direction, and during feeding, the triaxial moving mounting seat 211 is positioned at one end of the triaxial module moving driving device 22 to facilitate manual feeding, and after feeding, the jig module reaches a laser processing station under the control of the triaxial module moving driving device 22 to prepare for the next processing.
Optionally, as shown in fig. 3, 5 and 6, the jig module includes a component mounting board 212 to be processed, a first tightening element 215 and a second tightening element 216, where the component mounting board to be processed is provided with a first guiding element 213 and a second guiding element 214, the first tightening element 215 is installed on the first guiding element 213, the second tightening element 216 is installed on the second guiding element 214, and the guiding direction of the first guiding element 213 is perpendicular to the guiding direction of the second guiding element 214.
It should be noted that, the first guiding element 213 and the second guiding element 214 provide effective guiding tracks for the first propping element 215 and the second propping element 216 respectively according to the installation and the processing requirement of the component to be processed, and provide moving directions when the first propping element 215 and the second propping element 216 move.
Optionally, the first guiding element 213 is connected to a first tightening element 215, the first tightening element 215 provides a pre-tightening force in the Y-axis direction for the first guiding element 213, the second guiding element 214 is connected to a second tightening element 216, and the second tightening element 216 provides a pre-tightening force in the X-axis direction for the second guiding element 214.
It should be noted that, the first propping element 215 and the second propping element 216 can better limit the component to be processed, so as to ensure that the component to be processed is installed in the jig module without displacement.
Alternatively, as shown in fig. 6, the upper surface of the first tightening element 215 is horizontally extended and provided with a pressing structure 2151, and the lower surface of the pressing structure 2151 abuts against the outer wall surface of the component to be machined when the component to be machined is mounted in place.
It should be noted that, the arrangement of the pressing structure 2151 further realizes that the first pressing element 215 presses the component to be processed, so as to limit the movement of the component to be processed in the vertical direction, so that the installation of the component to be processed is more stable.
Optionally, as shown in fig. 9, the non-contact flexible circuit board stress relieving device further includes a jaw moving unit 7, where the jaw moving unit 7 includes a rotating jaw 71 and a jaw rotation driving device 72, where the jaw rotation driving device 72 is fixedly installed on the loading mechanism 1 through a third mounting seat 73, and the jaw rotation driving device 72 is connected to the rotating jaw 71.
The third mounting seat 73 is provided with a jaw forward and backward driving device, and the rotating jaw is driven by the jaw forward and backward driving device to move to the front of the jig module and be abutted to the component to be processed.
Optionally, the jig module further includes a pressure sensing element, and the pressure sensing element is installed between the triaxial moving mount 211 and the component mounting plate 212 to be processed.
It should be noted that, when the component to be processed is tightly pressed by the first pressing element 215 and the second pressing element 216, the jaw rotation driving device 72 receives an activation signal to drive the rotating jaw 71 to move forward to the front of the jig module and abut against the outer surface of the component to be processed, at this time, the pressure sensing element senses the pressure of the rotating jaw 71 abutting against the component to be processed, in this embodiment of the application, the preset pressure sensing value of the pressure sensing element is 10N, and when the pressure sensing element senses the pressure exerted by the rotating jaw 71 is greater than or equal to 10N, the rotating jaw 71 rotates 90 ° along the outer surface of the component to be processed under the action of the jaw rotation driving device 72.
The application also provides a control method of the non-contact flexible circuit board stress relieving device, which is applied to the non-contact flexible circuit board stress relieving device and comprises the following steps:
s1, manually feeding the to-be-processed component onto the jig module, and moving the jig module to a pre-processing station under the condition that the to-be-processed component is installed in place.
In this exemplary embodiment, in order to facilitate loading, the jig module is designed as a movable module. The triaxial moving driving device 22 is started before feeding, so that the jig module moves to the feeding level, and the triaxial moving driving device 22 is started again after the component to be processed is installed, so that the jig module moves to the pre-gamma station.
S2, detecting whether the mounting position of the component to be processed is correct or not under the condition that the jig module moves to the pre-processing station. It should be noted that, in the embodiment of the present application, the visual detection unit 6 obtains the installation image information of the component to be processed, and detects whether the installation position of the component to be processed is correct according to the installation image information.
In the present exemplary embodiment, after the visual inspection unit 6 confirms that the component to be machined is properly mounted, the jaw rotation driving device 72 controls the rotation jaw 71 to move and abut against the component to be machined, the pressure sensing value of the pressure sensing element provided below the component to be machined is set to 10N, and when the pressure of the rotation jaw 71 abutting against the component to be machined is 10N or more, the rotation jaw 71 rotates by 90 ° along the outer surface of the component to be machined under the action of the jaw rotation driving device 72.
And S3, under the condition that the component to be processed is correctly installed at a preset position, the laser generating device 54 moves to the preset position, and the irradiation angle of the laser generating device 54 is adjusted through the connecting piece.
In the present exemplary embodiment, after the rotating jaw 71 is rotated by 90 °, the first, second and third moving modules 3, 4 and 5 control the laser generating device 54 to move to a preset position, and after the laser generating device 54 moves to the preset position, the position of the connection member is adjusted according to the target area of the destressing process, so that the connection member is locked after the laser generating device 54 slides to an appropriate position in the arc-shaped mounting groove 531, thereby fixing the mounting angle of the laser generating device 54.
And S4, executing a command for controlling the laser generating device 54 to emit laser to the target area when the laser generating device 54 is detected to move to the preset position, so as to finish the stress relief processing of the target area.
It should be noted that, in the embodiment of the present application, the target area includes at least two sub-areas, where stress is required to be removed on the flexible circuit board, and the sub-areas are set and adjusted according to the processing requirement. The application can realize accurate processing of the independent area without contacting the product, and does not cause mechanical extrusion or mechanical stress to the component to be processed and pollution to the processed material.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

Claims (16)

1. The utility model provides a non-contact flexible circuit board destressing device which characterized in that includes:
the device comprises a loading mechanism (1), a jig module and a laser loading module, wherein the jig module and the laser loading module are arranged on the loading mechanism (1), and the jig module is used for installing a component to be processed;
the laser loading module is provided with a first mounting plate (53), at least one laser generating device (54) is mounted on the first mounting plate (53), the laser generating device (54) is used for irradiating and heating a target area of the component to be processed, and the target area refers to an area of the component to be processed, in which stress is required to be removed, partially;
be provided with arc mounting groove (531) on first mounting panel (53), be provided with the connecting piece on arc mounting groove (531), the connecting piece can follow the fluting direction of arc mounting groove (531), the connecting piece passes first mounting panel (53) with laser generator (54) are connected.
2. The non-contact Flexible Printed Circuit (FPC) destressing apparatus according to claim 1, wherein an included angle between the first connection line and the second connection line is in a range of 25 DEG to 60 DEG;
the first connecting line is a connecting line between a first end point of the arc-shaped mounting groove (531) and the component to be processed;
the second connecting line is a connecting line between the second end point of the arc-shaped mounting groove (531) and the component to be processed.
3. The non-contact flexible circuit board stress relief device according to claim 1, wherein the connecting member comprises a connecting portion and a limiting portion, the connecting portion is connected to the laser generating device (54), and the limiting portion is installed in the arc-shaped installation groove (531).
4. The non-contact flexible circuit board destressing apparatus according to claim 1, wherein the laser loading module comprises a first moving module (3) and a second moving module (4), the first moving module (3) is installed on the loading mechanism (1), and the first moving module (3) is used for adjusting a machining point position between the laser generating device (54) and the component to be machined; the laser generating device (54) is installed on the second movable module (4), the second movable module (4) is installed on the first movable module (3) through a first installation seat (31), and the second movable module (4) is used for adjusting the vertical distance between the laser generating device (54) and the component to be processed.
5. The non-contact flexible printed circuit (fpc) stress relieving device according to claim 4, wherein the laser loading module further comprises a third moving module (5), one end of the third moving module (5) is connected with a sliding device (51) and is installed on the loading mechanism (1) through the sliding device (51), the other end of the third moving module (5) is installed on the first installation seat (31), and the third moving module (5) is used for adjusting the horizontal distance between the laser generating device (54) and the component to be processed.
6. The non-contact flexible circuit board stress relieving device according to claim 5, wherein the third moving module (5) comprises a third moving driving device (52) and the first mounting plate (53), the first mounting plate (53) is mounted on the third moving driving device (52) through a sliding structure, and the second moving module (4) is mounted on the first mounting plate (53).
7. The non-contact flexible printed circuit (fpc) stress relief device according to claim 4, further comprising a visual detection unit (6), wherein the visual detection unit (6) is configured to detect an installation position of the component to be processed.
8. The non-contact flexible printed circuit (fpc) stress relief device according to claim 7, wherein the visual detection unit (6) comprises a visual detection movement mechanism, the visual detection movement mechanism comprises a visual camera (62) and a visual camera movement driving device (61), the visual camera movement driving device (61) is mounted on the loading mechanism (1), the visual camera (62) is slidably mounted on the visual camera movement driving device (61) through a second mounting plate (63), and a visual detection point of the visual camera (62) is the same as a heating point of the laser generating device (54).
9. The non-contact Flexible Printed Circuit (FPC) destressing apparatus according to claim 4, further comprising a jig moving unit (2), wherein the jig moving unit (2) is mounted on the loading mechanism (1), the jig moving unit (2) comprises a triaxial moving module (21) and a triaxial module moving driving device (22), and the triaxial moving module (21) is slidably mounted on the triaxial module moving driving device (22) through a second mounting seat (23).
10. The non-contact flexible printed circuit (fpc) stress relieving device according to claim 9, wherein the triaxial moving module (21) comprises a triaxial moving mounting base (211) and the jig module, and the jig module is mounted on the triaxial moving mounting base (211).
11. The non-contact flexible circuit board stress relief device according to claim 10, wherein the jig module comprises a component mounting plate (212) to be processed, a first propping element (215) and a second propping element (216), a first guiding element (213) and a second guiding element (214) are arranged on the component mounting plate (212) to be processed, the first propping element (215) is mounted on the first guiding element (213), the second propping element (216) is mounted on the second guiding element (214), and the guiding direction of the first guiding element (213) is mutually perpendicular to the guiding direction of the second guiding element (214).
12. The non-contact flexible circuit board stress relief device according to claim 11, wherein the first guiding element (213) is connected with a first tightening element (215), the first tightening element (215) provides a pre-tightening force in a Y-axis direction for the first guiding element (213), the second guiding element (214) is connected with a second tightening element (216), and the second tightening element (216) provides a pre-tightening force in an X-axis direction for the second guiding element (214).
13. The non-contact flexible circuit board destressing apparatus according to claim 12, wherein the upper surface of the first pressing member (215) is horizontally extended and provided with a pressing structure (2151), and the lower surface of the pressing structure (2151) abuts against the outer wall surface of the component to be processed when the component to be processed is mounted in place.
14. A non-contact flexible circuit board stress relief device according to any of claims 1-13, further comprising a jaw movement unit (7), said jaw movement unit (7) comprising a rotating jaw (71) and a jaw rotation drive means (72), said jaw rotation drive means (72) being fixedly mounted on said loading mechanism (1) by means of a third mounting seat (73), said jaw rotation drive means (72) being connected to said rotating jaw (71).
15. The non-contact flexible circuit board stress relief device of claim 11, wherein said jig module further comprises a pressure sensing element mounted between said triaxial mobile mounting base (211) and said component mounting plate (212) to be processed.
16. A control method of a non-contact flexible circuit board stress relieving device, the method being applied to the non-contact flexible circuit board stress relieving device according to claim 1, the method comprising:
s1, manually feeding the to-be-processed component onto the jig module, and moving the jig module to a pre-processing station under the condition that the to-be-processed component is installed in place;
s2, detecting whether the mounting position of the component to be processed is correct or not under the condition that the jig module moves to a pre-processing station;
s3, under the condition that the component to be processed is correctly installed at a preset position, the laser generating device moves to the preset position, and the irradiation angle of the laser generating device (54) is adjusted through the connecting piece;
and S4, executing a command for controlling the laser generating device (54) to emit laser to the target area under the condition that the laser generating device (54) is detected to move to the preset position.
CN202311268814.9A 2023-09-28 2023-09-28 Non-contact type soft circuit board stress relief device and control method Pending CN117015163A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311268814.9A CN117015163A (en) 2023-09-28 2023-09-28 Non-contact type soft circuit board stress relief device and control method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311268814.9A CN117015163A (en) 2023-09-28 2023-09-28 Non-contact type soft circuit board stress relief device and control method

Publications (1)

Publication Number Publication Date
CN117015163A true CN117015163A (en) 2023-11-07

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CN114101898A (en) * 2021-11-30 2022-03-01 西南交通大学 Laser processing device
CN216399405U (en) * 2021-12-22 2022-04-29 余姚领克汽车部件有限公司 Laser rotary mechanism and tool jig
CN115627539A (en) * 2022-10-27 2023-01-20 上海积塔半导体有限公司 SiC wafer warping repair method based on laser heating
CN219379366U (en) * 2023-03-07 2023-07-21 大族激光科技产业集团股份有限公司 Laser marking equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113618084A (en) * 2021-08-09 2021-11-09 中国航空制造技术研究院 Powder bed additive manufacturing system and powder bed additive manufacturing method
CN114101898A (en) * 2021-11-30 2022-03-01 西南交通大学 Laser processing device
CN216399405U (en) * 2021-12-22 2022-04-29 余姚领克汽车部件有限公司 Laser rotary mechanism and tool jig
CN115627539A (en) * 2022-10-27 2023-01-20 上海积塔半导体有限公司 SiC wafer warping repair method based on laser heating
CN219379366U (en) * 2023-03-07 2023-07-21 大族激光科技产业集团股份有限公司 Laser marking equipment

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