CN114951891A

CN114951891A - Part welding device for processing semiconductor automobile inertial sensor

Info

Publication number: CN114951891A
Application number: CN202210884272.7A
Authority: CN
Inventors: 吴刚; 徐宝; 徐元
Original assignee: Suzhou Milo Weina Electronic Technology Co ltd
Current assignee: Suzhou Milo Weina Electronic Technology Co ltd
Priority date: 2022-07-26
Filing date: 2022-07-26
Publication date: 2022-08-30
Anticipated expiration: 2042-07-26
Also published as: CN114951891B

Abstract

The invention relates to the technical field of electronic component welding, in particular to a part welding device for processing a semiconductor automobile inertial sensor, which can quickly weld a circuit board and a chip and improve the welding efficiency; the automatic soldering machine comprises a chassis, wherein a main shaft is rotatably arranged on the chassis, a turntable is coaxially rotatably arranged on the main shaft, at least four groups of fixtures are uniformly arranged on the turntable, the chassis is also provided with a paste injection device and a soldering tin device, the paste injection device is used for sequentially injecting soldering tin paste to chip pins on the plurality of groups of fixtures, and the soldering tin device is used for heating the pins after the soldering tin paste is applied; wherein, install servo motor on the chassis, servo motor is used for driving the main shaft rotatory.

Description

Part welding device for processing semiconductor automobile inertial sensor

Technical Field

The invention relates to the technical field of electronic component welding, in particular to a part welding device for processing a semiconductor automobile inertial sensor.

Background

The semiconductor automobile inertial sensor is mainly used for an automobile electronic stabilizing system, a GPS auxiliary navigation system, an automobile safety airbag, vehicle attitude measurement and the like;

in the production process of the inertial sensor, a chip packaged with the optical sensor and the inertial device is required to be welded on a circuit board, the conventional welding process of the chip and the circuit board needs a professional to hold a soldering tin device with one hand, and fix the chip and the circuit board with the other hand for pin welding, so that the automation degree of the mode is low, and the welding production efficiency is influenced.

Disclosure of Invention

In order to solve the technical problems, the invention provides the part welding device for processing the semiconductor automobile inertial sensor, which can quickly weld the circuit board and the chip and improve the welding efficiency.

The invention relates to a part welding device for processing a semiconductor automobile inertial sensor, which comprises a chassis, wherein a main shaft is rotatably arranged on the chassis, a turntable is coaxially and rotatably arranged on the main shaft, at least four groups of fixtures are uniformly arranged on the turntable, a paste injection device and a soldering tin device are further arranged on the chassis, the paste injection device is used for sequentially injecting soldering tin paste to chip pins on the fixtures, and the soldering tin device is used for heating the pins after the soldering tin paste is applied; the base plate is provided with a servo motor, the servo motor is used for driving the main shaft to rotate, and the clamp comprises a clamping seat fixedly installed on the turntable and a pressing plate installed on the turntable in a lifting mode.

Furthermore, a plate groove is formed in the clamping seat, a plurality of groups of pin grooves are formed in the pressing plate in a penetrating mode and correspond to a plurality of groups of pins of the chip, and a penetrating hole used for clamping the top of the chip is formed in the pressing plate in a penetrating mode.

Furthermore, every edge of board groove all is provided with the hand buckle groove, the hand buckle groove is dark in the board groove.

Furthermore, two adjacent edges of the board slot are both communicated with mounting slots, second springs are mounted inside the mounting slots, and a first clamping board is fixedly mounted at one end of each second spring extending into the board slot and used for tightly supporting two adjacent edges of the circuit board; the other two edges of the plate groove are provided with second clamping plates in a sliding mode, the two groups of second clamping plates are provided with wedge-shaped guide blocks which penetrate through the edges of the clamping seats movably, and the edges of the pressing plates are provided with two groups of lower pressing feet corresponding to the two groups of wedge-shaped guide blocks respectively.

Furthermore, the paste injector comprises a hydraulic cylinder fixedly mounted on the chassis, the output end of the hydraulic cylinder is provided with a paste injection gun, the paste injection gun is communicated with an external soldering paste high-pressure supply pump through a guide pipe, and the output end of the paste injection gun is provided with a plurality of groups of paste outlet holes corresponding to the plurality of groups of pin grooves on the pressing plate.

Further, the tin soldering device comprises a support fixedly mounted on the chassis and a fixed shaft fixedly mounted on the support, a guide plate is fixedly mounted on the fixed shaft, a sleeve is coaxially sleeved on the fixed shaft, a supporting arm is transversely arranged on the sleeve, a connecting rod is elastically mounted on the supporting arm and moves along the edge of the guide plate under elastic pulling, a laser gun is fixedly mounted on the connecting rod, and a motor is mounted on the support and used for driving the sleeve to rotate.

Further, the end face of the lower presser foot, which is in contact with the wedge-shaped guide block, is parallel to the inclined plane of the wedge-shaped guide block.

Furthermore, the tin soldering device adopts a hot air gun which is positioned right above the turntable.

Compared with the prior art, the invention has the beneficial effects that: through manual unloading and the material loading for anchor clamps, need not to operate subsequent soldering paste and paint, heat the welding work, can accomplish the welding to chip and circuit board, can carry out the rapid welding to circuit board and chip, promote welding efficiency.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an isometric view of the structure of the present invention;

FIG. 3 is an enlarged view of the structure of the chassis;

FIG. 4 is an enlarged view of the structure of the jig;

FIG. 5 is an enlarged view of the structural connection of the lower presser foot with the wedge guide;

FIG. 6 is a cross-sectional view of the boss in structural engagement with a retainer ring;

FIG. 7 is an enlarged view of the structure of the paste injector;

FIG. 8 is an enlarged view of the structural connection of the shunt tube to the paste gun;

FIG. 9 is an enlarged view of the guide plate in structural connection with a connecting rod or the like;

FIG. 10 is an enlarged view of the structure of portion A of FIG. 4;

in the drawings, the reference numbers: 1. a chassis; 2. a main shaft; 3. a turntable; 4. a clamp; 5. a paste injection device; 6. a tin soldering device; 7. a servo motor; 8. a guide ring; 9. a protrusion; 10. a slope; 11. a card holder; 12. a plate groove; 13. pressing a plate; 14. a lead groove; 15. a connecting frame; 16. a lifting column; 17. a connecting ring; 18. a first spring; 19. mounting grooves; 20. a second spring; 21. a first clamping plate; 22. a lower presser foot; 23. a second clamping plate; 24. a wedge-shaped guide block; 25. a hand buckle slot; 26. a boss; 27. a ball groove; 28. a baffle ring; 29. a ball bearing; 30. a hydraulic cylinder; 31. a cross beam; 32. a conduit; 33. a shunt tube; 34. injecting a paste gun; 35. a paste outlet hole; 36. a fixed shaft; 37. a guide plate; 38. a sleeve; 39. a support arm; 40. a strip-shaped groove; 41. a slider; 42. a third spring; 43. a connecting rod; 44. a laser gun; 45. a motor; 46. a driving gear; 47. a driven gear.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. This embodiment is written in a progressive manner.

As shown in fig. 1 to 2, the part welding apparatus for processing the inertial sensor of the semiconductor automobile according to the present invention includes:

the device comprises a chassis 1, a main shaft 2 is rotatably mounted on the chassis 1, a rotary table 3 is coaxially rotatably mounted on the main shaft 2, at least four groups of clamps 4 are arranged on the rotary table 3 in a circumferential array by taking the axis of the rotary table as the axis, a paste injection device 5 and a soldering tin device 6 are sequentially arranged on the edge of the chassis 1 along the rotation direction of the rotary table 3, the paste injection device 5 is used for sequentially injecting soldering tin paste to chip pins on the groups of clamps 4, the soldering tin device 6 is used for heating the pins after the soldering tin paste is applied, a servo motor 7 is further mounted at the bottom of the chassis 1 and used for driving the main shaft 2 to intermittently rotate for a certain angle along the axis of the main shaft, and the rotating angle is the same as the included angle between the adjacent two groups of clamps 4 and the axis;

in the embodiment, a clamp 4 is used for fixing an inertial sensor chip on a welding position on a circuit board, pins of the chip are aligned with pins of the circuit board, then a servo motor 7 is started, the servo motor 7 drives a main shaft 2 to drive a rotary table 3 to rotate along the axis of the rotary table, and the rotary table stops for a certain time, during the stop time, a paste injector 5 coats soldering paste on welding points of the chip and the circuit board, meanwhile, a soldering tin device 6 heats and welds the pins coated with the soldering paste, the circuit board which is welded and cooled is taken down, and the circuit board which is not welded and the chip device clamp 4 are put on;

through the above arrangement, through manual loading, subsequent soldering paste smearing and heating welding work is not required to be operated, welding of the chip and the circuit board can be completed, rapid welding can be carried out on the circuit board and the chip, and welding efficiency is improved.

As a more specific embodiment of the above technical solution, as shown in fig. 4 to 5, in order to reduce the time for assembling the chip and the circuit board, the fixture 4 includes a socket 11 fixedly mounted on the turntable 3 and a pressing plate 13 liftably mounted on the turntable 3, a plate slot 12 for placing the circuit board is provided on the socket 11, a plurality of groups of pin slots 14 for containing solder paste are respectively provided through a plurality of groups of pins corresponding to the chip on the pressing plate 13, and a through hole for cutting the top of the chip is provided through the pressing plate 13;

more specifically, the thickness of the pressing plate 13 is smaller than the thickness of the chip, after the pressing plate 13 is covered on the chip, a plurality of groups of pin grooves 14 are respectively sleeved on a plurality of groups of chip pins to form a space for injecting soldering paste; the lifting of the pressing plate 13 is controlled by adopting an air cylinder; or the lifting of the pressing plate 13 is driven by adopting a mechanical structure, for example, the pressing plate 13 is provided with a connecting frame 15, a lifting column 16 movably penetrates through the rotary table 3 and extends to the lower part of the rotary table 3, the lifting column 16 is fixedly connected with the connecting frame 15, the bottom end of the lifting column 16 is provided with a connecting ring 17, the lifting column 16 is further sleeved with a first spring 18, and the first spring 18 is compressed between the connecting ring 17 and the rotary table 3; a guide ring 8 is coaxially arranged on the chassis 1, a bulge 9 is arranged at the part of the guide ring 8 positioned in the feeding area, and slopes 10 are arranged between the two sides of the bulge 9 and the end surface of the guide ring 8 for smooth transition; the bottom end of the lifting column 16 is slidably mounted on the guide ring 8 and the bulge 9;

in the embodiment, in the rotating process of the turntable 3, when the lifting column 16 rotates to the protrusion 9, the lifting column 16 drives the pressing plate 13 to move upwards for a certain distance, so that the blanking and the loading are convenient for a worker; when the lifting column 16 is arranged on the guide ring 8, the lifting column 16 drives the pressing plate 13 to descend under the action of the elastic force of the first spring 18, so that the pressing plate 13 presses the chip on the circuit board, the situation that the chip and the circuit board are displaced relatively in the processes of coating soldering paste and heating welding is prevented, and the production stability of the equipment is improved;

further, as shown in fig. 6, in order to make the lifting column 16 slide smoothly on the guide ring 8 and the protrusion 9, a universal pulley is added at the bottom end of the lifting column 16; or a boss 26 is arranged at the bottom end of the lifting column 16, a ball groove 27 is milled on the boss 26, a ball 29 is rotatably arranged in the ball groove 27 by virtue of a retaining ring 28, and then the ball 29 is contacted with the guide ring 8 and the protrusion 9; by adopting the scheme, the sliding friction between the lifting column 16 and the guide ring 8 and the protrusion 9 is converted into rolling friction, so that the friction force is reduced, and the equipment runs more smoothly under the condition that the output power of the servo motor 7 is constant;

as a more specific embodiment of the above technical solution, as shown in fig. 4 to 5, two adjacent sides of the board slot 12 are both provided with an installation slot 19 in a communication manner, a second spring 20 is installed inside the installation slot 19, and one end of the second spring 20 extending into the board slot 12 is fixedly installed with a first clamping board 21 for tightly supporting two adjacent sides of the circuit board; the other two edges of the plate groove 12 are provided with second clamping plates 23 in a sliding manner, the two groups of second clamping plates 23 are respectively provided with a wedge-shaped guide block 24 which movably penetrates through the edge of the clamping seat 11, and the edge of the pressing plate 13 is respectively provided with two groups of lower pressing feet 22 corresponding to the two groups of wedge-shaped guide blocks 24;

in this embodiment, the two groups of lower press feet 22 press the inclined surfaces of the wedge-shaped guide blocks 24 downwards in the descending process along with the rotary table 3, and the second clamping plates 23 can only move in the horizontal direction, so that the two groups of lower press feet 22 respectively push the two groups of second clamping plates 23 to synchronously move towards the inner sides of the plate grooves 12, the two groups of second clamping plates 23 tightly push the other two edges of the circuit board, and the circuit board is positioned and corrected while the pressing plate 13 presses the chip;

furthermore, under the condition of not considering the equipment cost and the control difficulty, four groups of linear cylinders are adopted to respectively and directly drive two groups of first clamping plates 21 and two groups of second clamping plates 23, so that the two groups of first clamping plates 21 and the two groups of second clamping plates 23 can position the circuit board;

through the setting, the circuit board and the chip which are not welded can be quickly and automatically positioned, manual adjustment is not needed, and the welding efficiency is greatly improved.

In one embodiment, as shown in fig. 7 to 8, the paste injector 5 includes a hydraulic cylinder 30 fixedly mounted on the chassis 1, a paste injection gun 34 is mounted at an output end of the hydraulic cylinder 30, the paste injection gun 34 is communicated with an external solder paste high-pressure supply pump through a conduit 32, and a plurality of groups of paste outlet holes 35 are respectively arranged at the output end of the paste injection gun 34 corresponding to the plurality of groups of pin slots 14 on the pressing plate 13;

in order to ensure that the soldering paste can be smoothly extruded from a plurality of groups of paste outlet holes 35 under certain pressure, the paste injection gun 34 adopts a clip-shaped mechanism, the paste injection gun 34 is hollow, and four linear cavities of the paste injection gun 34 are communicated with the output end of the guide pipe 32 by virtue of the shunt pipes 33; by reducing the internal space of the paste injection gun 34, the contact area between the solder paste and the output end face of the paste injection gun 34 is reduced, and under the condition that the pressure of the supply pump is not changed, the contact pressure between the solder paste and the output end face of the paste injection gun 34 is improved, so that the solder paste is more easily extruded into the pin slot 14 through the plurality of groups of paste outlet holes 35;

more specifically, in order to facilitate the disassembly and assembly of the paste injection gun 34 and the hydraulic cylinder 30, a cross beam 31 is arranged at the output end of the hydraulic cylinder 30, the guide pipe 32 adopts an L-shaped hard pipeline, the horizontal section of the guide pipe 32 is fixedly arranged on the cross beam 31, the vertical section of the guide pipe 32 is fixedly connected with the paste injection gun 34, four groups of discharge nozzles are arranged at the output end of the guide pipe 32, and four groups of shunt pipes 33 are communicated with the four groups of discharge nozzles through threaded sleeves;

through the arrangement, the solder paste can be conveniently injected into the plurality of groups of pin grooves 14 sleeved on the plurality of groups of chip pins, so that the tin coating time is shortened, and the welding efficiency is improved.

As an example of the above technical solution, as shown in fig. 9, the soldering device 6 includes a bracket fixedly mounted on the chassis 1 and a fixed shaft 36 fixedly mounted on the bracket, a guide plate 37 is fixedly mounted on the fixed shaft 36, a sleeve 38 is coaxially sleeved on the fixed shaft 36, a support arm 39 is transversely disposed on the sleeve 38, a link 43 is elastically mounted on the support arm 39, the link 43 moves along the edge of the guide plate 37 under elastic pulling, a laser gun 44 is fixedly mounted on the link 43, a motor 45 is mounted on the bracket, and the motor 45 is used for driving the sleeve 38 to rotate;

furthermore, the output end of the motor 45 is provided with a driving gear 46, a driven gear 47 is sleeved on the sleeve 38, the driving gear 46 is meshed with the driven gear 47, and the sleeve 38 is driven to rotate along the axis of the sleeve by adopting a gear, so that the transmission torque of the motor 45 is increased, and the sleeve 38 is driven to rotate conveniently;

in this embodiment, more specifically, a strip-shaped groove 40 is formed in the support arm 39 along the radial direction of the fixed shaft 36, a slider 41 is slidably mounted in the strip-shaped groove 40, the slider 41 is fixedly connected with a connecting rod 43, and the slider 41 is connected with the end of the strip-shaped groove 40 through a third spring 42; through the spring action of third spring 42, push up slider 41 all the time to fixed axle 36 axis direction tightly to be convenient for control connecting rod 43 pushes up tightly at the edge of deflector 37 all the time, and then control laser gun 44 along the marginal removal of square chip, and at the removal in-process, shine the heating in proper order to the leg of annotating the soldering paste, accomplish the welding.

As an example of the above technical solution, as shown in fig. 5, each edge of the plate groove 12 is provided with a hand fastening groove 25, and the hand fastening groove 25 is deeper than the plate groove 12; in this embodiment, by providing the finger-receiving hand-fastening groove 25, it is convenient for the worker to take out the circuit board inside the board groove 12 after the soldering is completed.

As an example of the above technical solution, as shown in fig. 10, an end surface of the lower press foot 22 contacting the wedge guide 24 is parallel to an inclined surface of the wedge guide 24; through the arrangement, the contact area between the lower presser foot 22 and the inclined surface of the wedge-shaped guide block 24 is increased, the local pressure of the lower presser foot 22 on the inclined surface of the wedge-shaped guide block 24 is reduced under the condition that the downward pressure of the lower presser foot 22 is unchanged, the abrasion of the lower presser foot 22 on the wedge-shaped guide block 24 is reduced as far as possible, and the service life of the equipment is ensured.

As an embodiment of the above technical solution, the soldering tin device 6 adopts a heat gun, and the heat gun is located right above the turntable 3; adopt hot-blast rifle to carry out the heating welding operation, hot-blast rifle simple structure, low cost need not to weld one by one to the leg, and the practicality is higher.

The part welding device for processing the semiconductor automobile inertial sensor in the embodiment of the application has the advantages that the installation mode, the connection mode or the arrangement mode are common mechanical modes, and the part welding device can be implemented as long as the beneficial effects of the part welding device can be achieved.

The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the technical principle of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A part welding device for processing a semiconductor automobile inertial sensor is characterized by comprising a chassis (1), wherein a main shaft (2) is rotatably mounted on the chassis (1), a turntable (3) is coaxially rotatably mounted on the main shaft (2), at least four groups of clamps (4) are uniformly arranged on the turntable (3), a paste injection device (5) and a soldering tin device (6) are further arranged on the chassis (1), the paste injection device (5) is used for sequentially injecting soldering tin paste to chip pins on a plurality of groups of clamps (4), and the soldering tin device (6) is used for heating the pins after the soldering tin paste is applied; the fixture comprises a base plate (1), a servo motor (7) is installed on the base plate (1), the servo motor (7) is used for driving a main shaft (2) to rotate, and a fixture (4) comprises a clamping seat (11) fixedly installed on a rotary plate (3) and a pressing plate (13) installed on the rotary plate (3) in a lifting mode.

2. The part welding device for processing the semiconductor automobile inertial sensor is characterized in that a plate groove (12) is formed in the clamping seat (11), a plurality of groups of pins corresponding to the chip on the pressing plate (13) are respectively provided with a plurality of groups of pin grooves (14) in a penetrating mode, and a penetrating hole used for clamping the top of the chip in a sleeve is formed in the pressing plate (13) in a penetrating mode.

3. The parts-welding device for the manufacture of inertial sensors of semiconductor automobiles according to claim 2, characterized in that each edge of the plate groove (12) is provided with a hand-fastening groove (25).

4. The part welding device for processing the semiconductor automobile inertial sensor is characterized in that two adjacent edges of the board slot (12) are communicated with each other to form a mounting slot (19), a second spring (20) is mounted inside each mounting slot (19), and a first clamping board (21) is fixedly mounted at one end, extending into the board slot (12), of each second spring (20) and used for abutting against the two adjacent edges of the circuit board;

two other edges of the plate groove (12) are respectively provided with a second clamping plate (23) in a sliding mode, two groups of wedge-shaped guide blocks (24) which penetrate through the edge of the clamping seat (11) movably are arranged on the second clamping plates (23), and two groups of lower press feet (22) are arranged on the edge of the pressing plate (13) corresponding to the two groups of wedge-shaped guide blocks (24).

5. The part welding device for processing the semiconductor automobile inertial sensor as claimed in claim 2, wherein the paste injector (5) comprises a hydraulic cylinder (30) fixedly mounted on the chassis (1), an output end of the hydraulic cylinder (30) is provided with a paste injection gun (34), the paste injection gun (34) is communicated with an external solder paste high-pressure supply pump through a conduit (32), and the output end of the paste injection gun (34) is respectively provided with a plurality of paste outlet holes (35) corresponding to the plurality of groups of pin grooves (14) on the pressing plate (13).

6. The part welding device for processing the semiconductor automobile inertial sensor according to claim 1, wherein the tin soldering device (6) comprises a bracket fixedly mounted on the chassis (1) and a fixed shaft (36) fixedly mounted on the bracket, a guide plate (37) is fixedly mounted on the fixed shaft (36), a sleeve (38) is coaxially sleeved on the fixed shaft (36), and a supporting arm (39) is transversely arranged on the sleeve (38);

connecting rod (43) are installed to the elasticity on support arm (39), connecting rod (43) draw down along deflector (37) edge removal at elasticity, fixed mounting has laser gun (44) on connecting rod (43), install motor (45) on the support, motor (45) are used for driving sleeve (38) rotatory.

7. The device for welding parts used for processing the semiconductor automobile inertia sensor is characterized in that the end surface of the lower presser foot (22) contacted with the wedge-shaped guide block (24) is parallel to the inclined surface of the wedge-shaped guide block (24).

8. The parts soldering apparatus for the manufacture of inertial sensor of semiconductor automobile according to claim 1, wherein the soldering tin device (6) employs a heat gun, and the heat gun is located directly above the turntable (3).