CN117013987B - Acoustic wave filter, communication equipment and electronic equipment - Google Patents

Acoustic wave filter, communication equipment and electronic equipment Download PDF

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Publication number
CN117013987B
CN117013987B CN202211387116.6A CN202211387116A CN117013987B CN 117013987 B CN117013987 B CN 117013987B CN 202211387116 A CN202211387116 A CN 202211387116A CN 117013987 B CN117013987 B CN 117013987B
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Prior art keywords
metal pad
acoustic wave
wave filter
composite structure
substrate
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CN117013987A (en
Inventor
万晨庚
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Beijing Xinxi Semiconductor Technology Co ltd
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Beijing Xinxi Semiconductor Technology Co ltd
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02047—Treatment of substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0504—Holders; Supports for bulk acoustic wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

In an embodiment of the disclosure, an acoustic wave filter, a communication device, and an electronic device are provided, where the acoustic wave filter includes an input terminal, an output terminal, a ground terminal, and at least one resonator, and at least one of the input terminal, the output terminal, and the ground terminal includes a plurality of first composite structures, where the first composite structures include: a first metal pad; a through hole; and a second metal pad, wherein the first metal pad is electrically connected with the second metal pad via the via hole; the first metal pad is electrically connected with the at least one resonator; and the plurality of first composite structures are electrically connected to each other. By the processing scheme, the power bearing capacity of the acoustic wave filter is improved.

Description

Acoustic wave filter, communication equipment and electronic equipment
Technical Field
The disclosure relates to the technical field of communication, in particular to an acoustic wave filter, communication equipment and electronic equipment.
Background
The power handling capability of an acoustic wave filter is a very important indicator that determines whether the acoustic wave filter can be applied in high power signal transmission paths and the reliability of the signal transmission and the service life of the communication device.
The power bearing capacity of the acoustic wave filter depends on the power design of the acoustic wave filter, the power design needs to ensure that the power distribution of each resonator on the acoustic wave filter is relatively average, the impedance power density at a specific frequency is low, and the overlarge power input by a certain signal end is avoided; on the other hand, improving the heat dissipation of the acoustic wave filter is also a very important aspect for improving the power-bearing capacity, because improving the heat dissipation of the acoustic wave filter can avoid the continuous temperature rise to accelerate the deterioration of the acoustic wave filter performance, resulting in the accelerated deterioration of the acoustic wave filter.
Disclosure of Invention
In view of the foregoing, embodiments of the present disclosure provide an acoustic wave filter, a communication device, and an electronic device, which at least partially solve the problems in the prior art.
The acoustic wave filter with improved power (in other words, improved power bearing capacity) provided in the embodiments of the present disclosure, by providing the composite structure a of the "first metal pad-via-second metal pad" and controlling the distance from a specific resonator, can shorten the transmission path of the resonator heat dissipation that mainly affects the power, effectively improve the heat dissipation, thereby improving the power bearing capacity of the acoustic wave filter.
Specifically, by providing a plurality of composite structures a of "first metal pad-via-second metal pad" at least one of the plurality of ports and the plurality of composite structures a having electrical connections, the power energy density of the individual composite structures can be improved, and the power withstand capability of the acoustic wave filter can be improved. In addition, by providing at least one additional form of composite structure B around the series resonator and around a particular series resonator, the heat transfer path can be reduced, effectively improving heat dissipation, and thus further improving power bearing capacity.
In addition, by connecting the structure such as the seal ring and the grounded pad to the composite structure a and/or the composite structure B, the heat dissipation area can be further increased, and the power bearing capacity can be further improved.
Specifically, the embodiment of the disclosure provides the following technical scheme:
in a first aspect, embodiments of the present disclosure provide an acoustic wave filter comprising an input terminal, an output terminal, a ground terminal, and at least one resonator, wherein
At least one of the input, output and ground terminals includes a plurality of first composite structures including:
a first metal pad (3);
a through hole (5); and
a second metal pad (4), in which
The first metal pad (3) is electrically connected with the second metal pad (4) via the through hole (5);
the first metal pad (3) is electrically connected with the at least one resonator; and is also provided with
The plurality of first composite structures are electrically connected to each other.
According to a specific implementation of an embodiment of the disclosure, the input end includes two or more first composite structures; and/or
The ground terminal includes two or more first composite structures.
According to a specific implementation of an embodiment of the disclosure, the acoustic wave filter further comprises a first metal pad (3), and the first metal pad (3) is not electrically connected to the at least one resonator, or the first metal pad (3) is not electrically connected to all resonators
In a second aspect, embodiments of the present disclosure provide an acoustic wave filter comprising a second composite structure comprising:
a first metal pad (3);
a through hole (5); and
a second metal pad (4), in which
The first metal pad (3) is electrically connected with the second metal pad (4) via the through hole (5); and is also provided with
The first metal pad (3) is not electrically connected to the at least one resonator, or the first metal pad (3) is not electrically connected to all resonators.
According to a specific implementation manner of the embodiment of the disclosure, a distance between the second composite structure and the at least one resonator is less than or equal to 50 μm.
According to a specific implementation manner of the embodiment of the disclosure, a distance between the second composite structure and the at least one resonator is less than or equal to 15 μm.
According to a specific implementation of an embodiment of the disclosure, the at least one resonator is a series stage resonator.
According to a specific implementation of an embodiment of the disclosure, the at least one resonator is a series-stage resonator closest to the signal input.
According to a specific implementation of an embodiment of the disclosure, the acoustic wave filter further comprises a first substrate (1), a second substrate (2) and a sealing ring (6), wherein
-the first substrate (1) is used for manufacturing the at least one resonator;
the second substrate (2) is used for packaging the acoustic wave filter;
the first composite structure is used for forming electric connection at two sides of the substrate; and is also provided with
The sealing ring (6) is used for bonding of the first substrate (1) and the second substrate (2) to seal the at least one resonator between the first substrate (1) and the second substrate (2).
According to a specific implementation of an embodiment of the present disclosure, the first metal pad (3) and/or the second metal pad (4) of the first composite structure are connected with the sealing ring (6).
According to a specific implementation of an embodiment of the disclosure, the first metal pad (3) of the second composite structure is connected with the sealing ring (6).
According to a specific implementation of an embodiment of the disclosure, the grounding terminal includes the first composite structure, and the second metal pad (4) of the second composite structure is connected to a second metal pad included in the first composite structure of at least one of the grounding terminals.
According to a specific implementation of an embodiment of the present disclosure, at least one of the through holes (5) is provided to the first substrate (1).
According to a specific implementation of an embodiment of the present disclosure, at least one of the through holes (5) is provided to the second substrate (2).
According to a specific implementation of the disclosed embodiment, the through holes (5) of the first composite structure at the input end and the output end are provided to the first substrate (1), and the through holes (5) of the first composite structure at the ground end are provided to the second substrate (2).
According to a specific implementation of an embodiment of the present disclosure, the through hole (5) is made of a heat conductive material.
According to a specific implementation of an embodiment of the present disclosure, the first composite structure and/or the second composite structure does not comprise a through hole.
In a second aspect, embodiments of the present disclosure provide a communication device comprising an acoustic wave filter according to the first aspect and any implementation thereof.
In a third aspect, an embodiment of the disclosure provides an electronic device, including the communication device of the second aspect.
The acoustic wave filter in the embodiment of the disclosure includes an input terminal, an output terminal, a ground terminal, and at least one resonator, wherein at least one of the input terminal, the output terminal, and the ground terminal includes a plurality of first composite structures including: a first metal pad; a through hole; and a second metal pad, wherein the first metal pad is electrically connected with the second metal pad via the via hole; the first metal pad is electrically connected with the at least one resonator; and the plurality of first composite structures are electrically connected to each other. By the processing scheme, the power bearing capacity of the acoustic wave filter is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1a is a cross-sectional view of a prior art acoustic wave filter;
FIG. 1b is a prior art topology of an acoustic wave filter;
FIG. 1c is a physical layout structure of a prior art acoustic wave filter;
FIG. 2a is a physical layout structure of an acoustic wave filter according to an embodiment of the present disclosure;
FIG. 2b is a physical layout structure of another acoustic wave filter provided by an embodiment of the present disclosure;
FIG. 3a is a physical layout structure of another acoustic wave filter provided by an embodiment of the present disclosure;
FIG. 3b is a physical layout structure of another acoustic wave filter provided by an embodiment of the present disclosure;
FIG. 4 is a schematic diagram of a connection between a composite structure B and a seal ring according to an embodiment of the present disclosure;
fig. 5a is a schematic diagram of connection between a metal pad of a composite structure B and a metal pad of one of the grounding terminals according to an embodiment of the present disclosure;
FIG. 5b is a cross-sectional view taken along the line C2 in FIG. 5 a;
FIG. 6 is a schematic diagram of a connection between a metal pad and a seal ring in a composite structure A provided by an embodiment of the present disclosure;
FIG. 7 is a schematic view of a via arrangement in a substrate provided by an embodiment of the present disclosure; and is also provided with
Fig. 8 is a schematic view of an arrangement of through holes in a first substrate and a second substrate provided in an embodiment of the present disclosure.
In the figure, 1-substrate, 2-substrate, 3-metal pad, 4-metal pad, 5-via, 6-seal ring.
Detailed Description
Embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.
Other advantages and effects of the present disclosure will become readily apparent to those skilled in the art from the following disclosure, which describes embodiments of the present disclosure by way of specific examples. It will be apparent that the described embodiments are merely some, but not all embodiments of the present disclosure. The disclosure may be embodied or practiced in other different specific embodiments, and details within the subject specification may be modified or changed from various points of view and applications without departing from the spirit of the disclosure. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art without inventive effort, based on the embodiments in this disclosure are intended to be within the scope of this disclosure.
It is noted that various aspects of the embodiments are described below within the scope of the following claims. It should be apparent that the aspects described herein may be embodied in a wide variety of forms and that any specific structure and/or function described herein is merely illustrative. Based on the present disclosure, one skilled in the art will appreciate that one aspect described herein may be implemented independently of any other aspect, and that two or more of these aspects may be combined in various ways. For example, an apparatus may be implemented and/or a method practiced using any number of the aspects set forth herein. In addition, such apparatus may be implemented and/or such methods practiced using other structure and/or functionality in addition to one or more of the aspects set forth herein.
It should also be noted that the illustrations provided in the following embodiments merely illustrate the basic concepts of the disclosure by way of illustration, and only the components related to the disclosure are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
In addition, in the following description, specific details are provided in order to provide a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details.
First, a prior art acoustic wave filter is described with reference to fig. 1a, 1b and 1C, wherein fig. 1a is a cross-sectional view of the acoustic wave filter, which is a cross-section taken along a C1 position in fig. 1C, fig. 1b is a topology of the acoustic wave filter, and fig. 1C is a physical layout structure of the acoustic wave filter.
As shown in fig. 1a, the acoustic wave filter comprises a first substrate 1, a second substrate 2, a first metal pad 3, a second metal pad 4, a via 5, a sealing ring 6 and resonators Sh2, sh4.
The first substrate 1 is a substrate for manufacturing a resonator, and the second substrate 2 is a substrate for wafer level packaging. The substrate material may be selected from monocrystalline silicon, gallium arsenide, sapphire, quartz, silicon carbide, SOI, etc., with the preferred substrate material being monocrystalline silicon.
The metal pads (including the first metal pad 3 and the second metal pad 4) are used for electrical connection between substrates, which can be connected together by metal vias 5.
The via 5 is an opening through the substrate and is coated with a conductive material so that an electrical connection is made from the "back side" of the substrate to the "front side" of the substrate via the electrical path "first metal pad 3-via 5-second metal pad 4".
The resonator (including the Sh2 and Se4 resonator stages) comprises a sandwich structure of "electrode-piezoelectric layer-electrode", and the specific structure of the resonator can be referred to in the patent application No. 2022112859843 of the applicant of the present invention, and will not be described herein.
The sealing ring 6 is used for bonding the first substrate 1 for manufacturing the filter and the second substrate 2 for wafer level packaging, namely, the first substrate 1 and the second substrate 2 are bonded through the wafer bonding through the sealing ring 6, and meanwhile, the first metal bonding pad 3 is bonded, so that the resonator is sealed inside, and the influence of the external environment on the resonator is avoided.
Fig. 1b is a topology of an acoustic wave filter, which includes one or more input terminals IN, an output terminal OUT, and a ground terminal G (three ground terminals G1, G2, and G3 are shown IN fig. 1 b). In fig. 1b, the acoustic wave filter comprises four stages of series resonators Se1-Se4 and four stages of parallel resonators Sh1-Sh4, but it should be understood that this structure is exemplary and may comprise other numbers of series resonators and parallel resonators, and that each of the stages may comprise one or more resonators.
IN the topology shown IN fig. 1b, the input terminal IN, the output terminal OUT and the ground terminal G are all connected to a single composite structure a comprising the "first metal pad 3-via 5-second metal pad 4" structure shown IN fig. 1a, i.e. the composite structure a comprises the first metal pad 3, the via 5 and the second metal pad 4, wherein the first metal pad 3 is electrically connected to the second metal pad 4 via the via 5 and the first metal pad 3 is electrically connected to the resonator. IN other words, the input terminal IN, the output terminal OUT, and the ground terminal G are electrically connected to the composite structure a of the "first metal pad 3-via 5-second metal pad 4", thus realizing the electrical connection of the device on the "back side" of the substrate with the device on the "front side" of the substrate.
Fig. 1c is a physical layout implementation of the topology of fig. 1b, wherein the outermost side is a sealing ring 6 structure surrounding the resonator and the metal pads, wherein the curves are schematic representations of the connection of the individual structures. IN fig. 1c, the input terminal IN, the output terminal OUT, and the ground terminals G1-G3 are electrically connected to the composite structure a of the "first metal pad 3-via 5-second metal pad 4" shown IN fig. 1 a.
As can be seen from the above description, the prior art has only a composite structure a IN which a single "first metal pad 3-through hole 5-second metal pad 4" is connected to the input terminal IN, the output terminal OUT and the ground terminal G, IN which case, when a large power signal is applied, on the one hand, the large power signal has only one transmission path, the power signal is very concentrated, and part of the materials and structures of the acoustic wave filter are easily broken down, thereby damaging the acoustic wave filter. In addition, when the high-power signal is applied to the acoustic wave filter, the temperature of the acoustic wave filter can continuously rise, and if a good heat dissipation channel is not provided, the acoustic wave filter can bear high temperature for a long time, and the service life and reliability of the acoustic wave filter can be damaged or affected.
In view of this, the embodiments of the present disclosure increase the number of the composite structures a, i.e., the "first metal pad 3-through hole 5-second metal pad 4", from the standpoint of splitting the power signal of the acoustic wave filter and improving the heat dissipation, and improve the power energy density and the heat dissipation effect of the acoustic wave filter at high power by providing the composite structure B, which will be described later, and the position and connection thereof, so as to improve the power of the acoustic wave filter.
Next, an acoustic wave filter of the present disclosure is described with reference to fig. 2 a-7.
Referring first to fig. 2a, a physical layout of an acoustic wave filter of an embodiment of the present disclosure is described. The acoustic wave filter includes at least one series resonator, one parallel resonator, one input terminal IN, one output terminal OUT, and one ground terminal G, and the specific structure and connection manner thereof may be described with reference to fig. 1a to 1c, which are not repeated herein. In addition, although the acoustic wave filter is described as including at least one series resonator, one parallel resonator, the acoustic wave filter may include only one series resonator.
IN the embodiment of the present disclosure, at least one of the ports (i.e., at least one of the input terminal IN, the output terminal OUT, and the ground terminal G) includes a plurality of composite structures a of the "first metal pad 3-through hole 5-second metal pad 4", unlike the conventional composite structure a IN which one "first metal pad 3-through hole 5-second metal pad 4" is connected only at the input terminal IN, the output terminal OUT, and the ground terminal G, and these plurality of composite structures are electrically connected.
That is, the acoustic wave filter IN the embodiment of the present disclosure includes an input terminal IN, an output terminal OUT, a ground terminal G, and at least one resonator, wherein at least one of the input terminal IN, the output terminal OUT, and the ground terminal G includes a plurality of first composite structures a including a first metal pad 3; a through hole 5; and a second metal pad 4, wherein the first metal pad 3 is electrically connected with the second metal pad 4 via the via hole 5; the first metal pad 3 is electrically connected with the at least one resonator; and the plurality of first composite structures are electrically connected to each other.
It should be understood that although in the above description, the composite structure a includes the first metal pad 3, the via 5, and the second metal pad 4, wherein the first metal pad 3 is electrically connected with the second metal pad 4 via the via 5, and the first metal pad 3 is electrically connected with the resonator, the embodiment of the present disclosure is not limited thereto, but the composite structure a may include only the first metal pad 3 and/or the second metal pad 4 without including the via 5, and the first metal pad 3 is electrically connected with all resonators. More specifically, in the case of including a plurality of composite structures a, any one of the composite structures a may not include the through-hole 5 structure.
Specifically, IN the example shown IN fig. 2a, two composite structures a, a first composite structure a and a second composite structure a, are contained at the input IN, and the two composite structures a are electrically connected. In another embodiment, as shown in fig. 2b, two composite structures a, a first composite structure a and a second composite structure a, are contained at the ground terminal G3, and the two composite structures a are electrically connected. It should be understood that although a case comprising two composite structures a is shown in fig. 2a and 2b, more composite structures a may be included and both of these composite structures a are electrically connected.
For electrical connection, the first metal pads 3 in the plurality of composite structures a may be electrically connected to each other and the second metal pads 4 in the plurality of composite structures a may be electrically connected to each other, more specifically, the first metal pads 3 of the first composite structure a may be electrically connected to the first metal pads 3 of the second composite structure a and the second metal pads 4 of the first composite structure a may be electrically connected to the second metal pads 4 of the second composite structure a, thereby achieving electrical connection of the two composite structures a, and vice versa for the plurality of rechecking structures a, which is not described here again.
It should be understood that in the embodiments of the present disclosure, two or more composite structures may be included at the output terminal OUT or any one of the ground terminals G1, G2, G3. By connecting the composite structure a of two or more of the "first metal pad 3-through hole 5-second metal pad 4" to at least one of the input terminal IN, the output terminal OUT, and the ground terminal G, when a high power signal is applied, it is possible to prevent an excessive signal from damaging the acoustic wave filter by dispersing the plurality of metal pads and the plurality of through holes 5 due to the composite structure a of the plurality of the "first metal pad 3-through hole 5-second metal pad 4".
Next, referring to fig. 3a, a physical layout structure of another acoustic wave filter of an embodiment of the present disclosure is described. In the structure shown in fig. 3a, which comprises a composite structure B, the first metal pad 3 of the composite structure B is not connected to other structures (e.g. resonators) unlike the first metal pad 3 of the composite structure a which is electrically connected to other structures. That is, the composite structure B includes the first metal pad 3, the via 5, and the second metal pad 4, wherein the first metal pad 3 is electrically connected with the second metal pad 4 via the via 5, and the first metal pad 3 is not electrically connected with the resonator.
Through setting up composite construction B, the heat that the resonator produced can directly dispel away through composite construction B, avoids the heat to last accumulation, leads to the temperature to rise, damages the acoustic wave filter or influences the acoustic wave filter performance.
It should be understood that although in the above description, the composite structure B includes the first metal pad 3, the via 5, and the second metal pad 4, wherein the first metal pad 3 is electrically connected with the second metal pad 4 via the via 5, and the first metal pad 3 is not electrically connected with the resonator, the embodiment of the present disclosure is not limited thereto, but the composite structure B may include only the first metal pad 3, and the first metal pad 3 is not electrically connected with all resonators. In this way, the heat generated by the resonator can be directly dissipated through the first metal pad 3, avoiding the continuous accumulation of heat. In another embodiment, the composite structure B may contain only the first metal pad 3 and the second metal pad 4 without the via 5, and the first metal pad 3 is not electrically connected to all resonators.
Preferably, in the embodiment of the present disclosure, the distance D between the composite structure B and at least one of the series resonators is 50 μm or less, more preferably, the distance D is 15 μm or less, and in the example shown in fig. 3a, the distance D is a portion of the space between the composite structure B and the series resonator Se2 indicated by a dotted circle, that is, the distance D is the diameter of a circle that can be accommodated between the composite structure B and the series resonator. Through setting up interval D between composite construction B and the tandem resonator, can further strengthen the heat dispersion through composite construction B to avoid heat to continue to accumulate, lead to the temperature to rise, damage acoustic wave filter or influence acoustic wave filter performance.
In another embodiment, shown in fig. 3B, the composite structure B and the series-stage resonator closest to the signal input end have a spacing D (i.e. the portion of the dashed circle in fig. 3B and the resonator closest to the signal input end is Se 1), which is 50 μm or less, more preferably 15 μm or less.
It should be understood that although fig. 3a and 3B depict a distance D between the composite structure B and the series stage resonator of 50um or less, it should be understood that a distance D between the composite structure B and the parallel stage resonator of 50um or less, more preferably 15 um or less, may also be provided.
Next, with reference to fig. 4, the arrangement of the composite structure B is further described. In fig. 4, the composite structure B may be connected to the sealing ring 6, specifically, in the layer where the first metal pad 3 is located, the composite structure B and the sealing ring 6 are connected by a heat conducting metal such as copper or aluminum, so that the generated heat may be dissipated to the ground through the composite structure B, and may be dissipated to the sealing ring 6 through the substrate, so that the heat may be dissipated through the substrate, and thus, a better heat dissipation effect may be provided, and thus, a better power bearing capability may be provided.
Fig. 5a shows another arrangement of a composite structure B. In fig. 5a, the second metal pad 4 is connected to the second metal pad 4 of one of the ground terminals G, and fig. 5b shows a cross-sectional view of the connection of the second metal pad 4 to the second metal pad 4 of the ground terminal G3, wherein fig. 5b is a cross-section taken along the C2 position in fig. 5 a. As can be seen from fig. 5B, the first metal pad 3 of the composite structure B is not connected to other structures and the second metal pad 4 is connected to the second metal pad 4 of the ground terminal G3 via a thermally conductive metal such as copper, aluminum or the like. Through the connection, the heat dissipation area is larger, and the heat dissipation and power bearing capacity can be further improved. It will be appreciated that in this case, it is still possible to connect the sealing rings 6 of the composite structure B.
Next, with reference to fig. 6, the arrangement of the composite structure a is described. Wherein the first metal pad 3 of the composite structure a and the sealing ring 6 are connected. Specifically, as shown in fig. 6, the ground terminal G3 having the composite structure a therein is connected to the seal ring 6. In particular, the first metal pad 3 and/or the second metal pad 4, which may be a composite structure a, are connected with the sealing ring 6 via a thermally conductive material such as copper, aluminum, etc., so that heat may additionally pass through the sealing ring 6 and then be dissipated through the substrate.
It should be appreciated that while ground G3 is shown in fig. 6 as being connected to seal ring 6, it should be appreciated that one or more of the other ports may be connected to seal ring 6.
Next, referring to fig. 7, the arrangement of the through holes 5 is described. Unlike the prior art via 5 connecting the first metal pad 3 and the second metal pad 4 via the second substrate 2, in the presently disclosed embodiment the via 5 is provided in the first substrate 1, i.e. the via 5 connects the first metal pad 3 and the second metal pad 4 via the first substrate 1.
This is advantageous because the resonator is the most dominant source of heat generation, which can only be conducted out through the metal through holes 5, by providing through holes 5 as shown in fig. 7, the heat generated by the resonator can be conducted out through the through holes 5 on the one hand and the path is shorter; on the other hand, the first substrate 1 can also be used as a heat radiating path, so that the heat radiating capability is better, and the power bearing capability is better.
In a specific embodiment, as shown in fig. 8, at least one of the through holes 5 may be made to be connected to the first substrate 1, and at least one of the through holes 5 may be connected to the second substrate 2. More specifically, at least one signal input terminal IN or signal output terminal OUT may be made to be connected OUT at one of the substrates, at least one ground terminal G may be connected OUT at the other substrate, for example, at least one signal input terminal IN or signal output terminal OUT may be made to be connected OUT at the first substrate 1, and at least one ground terminal G may be connected OUT at the second substrate 2, or vice versa.
Therefore, the acoustic wave filter in the embodiments of the present disclosure includes at least a signal input terminal, a signal output terminal, and at least one ground terminal. At least one of the ports comprises a plurality of composite structures a of a first metal pad 3-via 5-second metal pad 4 "and the plurality of composite structures a have electrical connections, the first metal pad 3 of the composite structure a and the resonator being connected by a wire.
Furthermore, the acoustic wave filter comprises at least one "first metal pad 3-via 5-second metal pad 4" composite structure B, in which the first metal pad 3 and the other resonator are not connected. The first metal pad 3 and at least one of the series resonators in the at least one composite structure B are maintained at a distance D of 50 μm or less, more preferably 15 μm or less.
In addition, the first metal pad 3 in at least one of the composite structures B is spaced apart from the resonator closest to the signal input end by a distance D of 50 μm or less, more preferably by a distance D of 15 μm or less. The term "resonator closest to the signal input end" may be a combination of a plurality of resonators connected in series and a plurality of resonators connected in parallel, and a combination of series and parallel, where the first metal pad 3 is spaced from at least one of the resonators in the combination to satisfy the requirement of the spacing D.
In addition, the first metal pad 3 and the sealing ring 6 of the at least one composite structure B are connected together.
In addition, the second metal pad 4 of at least one composite structure B is connected to the second metal pad 4 of one or more of the ground terminals.
In addition, the first metal pad 3 and the sealing ring 6 of the at least one composite structure a are connected together.
In addition, the embodiment of the present disclosure further provides a communication device, where the communication device includes the acoustic wave filter described above with reference to fig. 2a to 8, and details thereof are not described herein.
In addition, the embodiment of the disclosure also provides electronic equipment, which includes the communication equipment as described above, and the electronic equipment can be, for example, intermediate products such as a radio frequency front end, a filtering and amplifying module, and also can be terminal products such as a mobile phone, a WIFI, an unmanned aerial vehicle, or a base station product.
Therefore, the embodiment of the disclosure provides the following technical scheme:
1. an acoustic wave filter comprises an input end, an output end, a grounding end and at least one resonator, wherein
At least one of the input, output and ground terminals includes a plurality of first composite structures including:
a first metal pad (3);
a through hole (5); and
a second metal pad (4), in which
The first metal pad (3) is electrically connected with the second metal pad (4) via the through hole (5);
the first metal pad (3) is electrically connected with the at least one resonator; and is also provided with
The plurality of first composite structures are electrically connected to each other.
2. The acoustic wave filter of 1, the input comprising two or more first composite structures; and/or
The ground terminal includes two or more first composite structures.
3. An acoustic wave filter, the acoustic wave filter comprising a second composite structure, the second composite structure comprising:
a first metal pad (3);
a through hole (5); and
a second metal pad (4), in which
The first metal pad (3) is electrically connected with the second metal pad (4) via the through hole (5); and is also provided with
The first metal pad (3) is not electrically connected to the at least one resonator, or the first metal pad (3) is not electrically connected to all resonators.
4. The acoustic wave filter according to claim 3, wherein a distance between the second composite structure and the at least one resonator is 50 μm or less.
5. The acoustic wave filter according to claim 4, wherein a distance between the second composite structure and the at least one resonator is 15 μm or less.
6. The acoustic wave filter of claim 4, the at least one resonator being a series stage resonator.
7. The acoustic wave filter of claim 4, the at least one resonator being a series stage resonator closest to the signal input.
8. The acoustic wave filter according to any of claims 1-7, further comprising a first substrate (1), a second substrate (2) and a sealing ring (6), wherein
-the first substrate (1) is used for manufacturing the at least one resonator;
the second substrate (2) is used for packaging the acoustic wave filter;
the first composite structure is used for forming electric connection at two sides of the substrate; and is also provided with
The sealing ring (6) is used for bonding of the first substrate (1) and the second substrate (2) to seal the at least one resonator between the first substrate (1) and the second substrate (2).
9. The acoustic wave filter according to claim 8, the first metal pad (3) and/or the second metal pad (4) of the first composite structure being connected to the sealing ring (6).
10. The acoustic wave filter according to claim 8, wherein the first metal pad (3) of the second composite structure is connected with the sealing ring (6).
11. The acoustic wave filter according to claim 8, wherein the ground terminal comprises the first composite structure, and wherein the second metal pads (4) of the second composite structure are connected to second metal pads comprised by the first composite structure of at least one of the ground terminals.
12. The acoustic wave filter according to claim 8, at least one of the through holes (5) being provided to the first substrate (1).
13. Acoustic wave filter according to claim 12, at least one of the through holes (5) being provided to the second substrate (2).
14. Acoustic wave filter according to claim 13, the through-holes (5) of the first composite structure at the input and the output being provided to the first substrate (1), and the through-holes (5) of the first composite structure at the ground being provided to the second substrate (2).
15. Acoustic wave filter according to any of claims 1-8, the first composite structure and/or the second composite structure not comprising a through hole (5).
16. A communication device comprising an acoustic wave filter according to 1-15.
17. An electronic device comprising the communication device of 16.
The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the disclosure are intended to be covered by the protection scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (15)

1. An acoustic wave filter comprising an input, an output, a ground, and at least one resonator, wherein
At least one of the input end and the output end comprises a plurality of first composite structures, and the first composite structures comprise:
a first metal pad (3);
a through hole (5); and
a second metal pad (4), in which
The first metal pad (3) is electrically connected with the second metal pad (4) via the through hole (5);
the first metal pad (3) is electrically connected with the at least one resonator; and is also provided with
The plurality of first composite structures are electrically connected to each other;
also included is a second composite structure comprising:
a first metal pad (3);
a through hole (5); and
a second metal pad (4), in which
The first metal pad (3) is electrically connected with the second metal pad (4) via the through hole (5); and is also provided with
The first metal bonding pad (3) is not electrically connected with all resonators;
the at least one resonator is a series stage resonator.
2. The acoustic wave filter of claim 1 wherein the input comprises two or more first composite structures; and/or
The ground terminal includes two or more first composite structures.
3. The acoustic wave filter according to claim 2, wherein the second composite structure is spaced from the at least one resonator by 50 μm or less.
4. An acoustic wave filter according to claim 3, wherein the second composite structure is spaced from the at least one resonator by 15 μm or less.
5. The acoustic wave filter of claim 2, wherein the at least one resonator is a series stage resonator closest to the signal input.
6. Acoustic wave filter according to any of claims 1-5, characterized in that the acoustic wave filter further comprises a first substrate (1), a second substrate (2) and a sealing ring (6), wherein
-the first substrate (1) is used for manufacturing the at least one resonator;
the second substrate (2) is used for packaging the acoustic wave filter;
the first composite structure is used for forming electric connection at two sides of the substrate; and is also provided with
The sealing ring (6) is used for bonding of the first substrate (1) and the second substrate (2) to seal the at least one resonator between the first substrate (1) and the second substrate (2).
7. Acoustic wave filter according to claim 6, characterized in that the first metal pad (3) and/or the second metal pad (4) of the first composite structure is connected with the sealing ring (6).
8. Acoustic wave filter according to claim 6, characterized in that the first metal pad (3) of the second composite structure is connected with the sealing ring (6).
9. Acoustic wave filter according to claim 6, characterized in that the ground terminal comprises the first composite structure and that the second metal pad (4) of the second composite structure is connected to a second metal pad comprised by the first composite structure of at least one of the ground terminals.
10. Acoustic wave filter according to claim 6, characterized in that at least one of the through holes (5) is provided to the first substrate (1).
11. Acoustic wave filter according to claim 10, characterized in that at least one of the through holes (5) is provided to the second substrate (2).
12. Acoustic wave filter according to claim 11, characterized in that the through holes (5) of the first composite structure at the input and the output are provided to the first substrate (1) and the through holes (5) of the first composite structure at the ground are provided to the second substrate (2).
13. Acoustic wave filter according to any of claims 6, characterized in that the first composite structure and/or the second composite structure does not comprise a through hole (5).
14. A communication device comprising an acoustic wave filter according to claims 1-13.
15. An electronic device comprising the communication device according to claim 14.
CN202211387116.6A 2022-11-07 2022-11-07 Acoustic wave filter, communication equipment and electronic equipment Active CN117013987B (en)

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Publication number Priority date Publication date Assignee Title
CN111342797A (en) * 2018-12-18 2020-06-26 天津大学 Piezoelectric filter and electronic device having the same
CN111464147A (en) * 2020-04-14 2020-07-28 诺思(天津)微系统有限责任公司 Filter and method for improving power capacity thereof, multiplexer and communication equipment
CN113572449A (en) * 2021-09-23 2021-10-29 深圳新声半导体有限公司 Bulk acoustic wave resonator packaging structure
CN215344516U (en) * 2021-04-21 2021-12-28 诺思(天津)微系统有限责任公司 Filter, filter device, and base station
CN216056953U (en) * 2021-09-02 2022-03-15 诺思(天津)微系统有限责任公司 Filter and electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111342797A (en) * 2018-12-18 2020-06-26 天津大学 Piezoelectric filter and electronic device having the same
CN111464147A (en) * 2020-04-14 2020-07-28 诺思(天津)微系统有限责任公司 Filter and method for improving power capacity thereof, multiplexer and communication equipment
CN215344516U (en) * 2021-04-21 2021-12-28 诺思(天津)微系统有限责任公司 Filter, filter device, and base station
CN216056953U (en) * 2021-09-02 2022-03-15 诺思(天津)微系统有限责任公司 Filter and electronic device
CN113572449A (en) * 2021-09-23 2021-10-29 深圳新声半导体有限公司 Bulk acoustic wave resonator packaging structure

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