CN117013981A - Package structure of radio frequency module - Google Patents
Package structure of radio frequency module Download PDFInfo
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- CN117013981A CN117013981A CN202310794535.XA CN202310794535A CN117013981A CN 117013981 A CN117013981 A CN 117013981A CN 202310794535 A CN202310794535 A CN 202310794535A CN 117013981 A CN117013981 A CN 117013981A
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- radio frequency
- carrier plate
- frequency module
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- 239000004033 plastic Substances 0.000 claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 claims abstract description 28
- 238000002955 isolation Methods 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims description 19
- 239000004642 Polyimide Substances 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 abstract description 12
- 239000005022 packaging material Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 20
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 238000003698 laser cutting Methods 0.000 description 10
- 238000003475 lamination Methods 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 238000001771 vacuum deposition Methods 0.000 description 5
- 238000012858 packaging process Methods 0.000 description 4
- 239000007888 film coating Substances 0.000 description 3
- 238000009501 film coating Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000009504 vacuum film coating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention discloses a packaging structure of a radio frequency module, which comprises a carrier plate, a chip module, an isolating film and a plastic sealing layer, wherein the chip module is arranged on the carrier plate; the chip module comprises a filter chip and at least one chip to be filled, wherein the bottoms of the filter chip and the chip to be filled are respectively provided with a first gap and a second gap with the surface of the carrier plate, the first gap is surrounded by the isolation film to form a closed cavity, the isolation film is provided with a plurality of gaps communicated with the second gap, and the second gap is filled by the plastic sealing layer through the gaps. According to the invention, the plastic packaging material in the required area is filled through the notch of the hollow structure, so that the requirement of integrated packaging of the filter chip and other chips is met, and the reliability is improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor packaging, and particularly relates to a packaging structure of a radio frequency module.
Background
In order to meet the requirement of high packaging integration, the filter chip and other types of chips/components are required to be placed into the same packaging body for packaging, so that the application terminal with light weight and thinness is realized. The Surface Acoustic Wave (SAW) filter operates on the principle that an input IDT receives a voltage signal to cause a piezoelectric material to generate mechanical pressure and propagate along a surface in the form of an acoustic wave, while the amplitude of the acoustic wave in the vertical direction rapidly fades, and an output IDT receives an acoustic wave in the horizontal direction and converts the acoustic wave into an electrical signal. Therefore, other substances cannot be contacted on the surface (i.e. the functional area) of the IDT, so that enough cavities are ensured to work normally. And other types of chips need to be completely filled with plastic packaging materials so as to ensure the reliability of the chips.
The existing integrated packaging mode of the radio frequency front end module is that firstly, an isolating film is adopted to carry out film coating to realize a cavity structure of a filter chip, and then plastic packaging of plastic packaging materials is carried out to isolate the influence of external environment and impurities on a chip circuit. Other types of chips are covered by the isolating film, the bottom of the chip also forms a cavity, and in the subsequent plastic packaging process, the plastic packaging material cannot fill the bottom of the other types of chips, so that the reliability of the module is affected.
Disclosure of Invention
The invention provides a packaging structure of a radio frequency module aiming at the defects existing in the prior art.
In order to achieve the above object, the technical scheme of the present invention is as follows:
the packaging structure of the radio frequency module comprises a carrier plate, a chip module, an isolating film and a plastic sealing layer, wherein the chip module is arranged on the carrier plate, the isolating film is covered on the surfaces of the carrier plate and the chip module, and the plastic sealing layer is arranged on the isolating film and covers the carrier plate and the chip module; the chip module comprises a filter chip and at least one chip to be filled, wherein the filter chip is provided with a functional surface facing the carrier plate, and a first gap is arranged between the functional surface and the carrier plate; the chip to be filled is provided with a lower surface facing the carrier plate, and a second gap is arranged between the lower surface and the carrier plate; the isolation film encloses the first gap to form a closed cavity, the isolation film is provided with at least two gaps communicated with the second gap, and the plastic layer fills the second gap through the gaps.
Optionally, the at least two notches are located on two adjacent sides, two opposite sides or multiple sides of the chip to be filled.
Optionally, the chip to be filled is disposed adjacent to the filter chip and has a nearest side near the filter chip, and the notch is opened outside the nearest side.
Optionally, the filter device comprises at least two filter chips, wherein the two filter chips are located on different sides of the chip to be filled, the two filter chips and the chip to be filled are respectively provided with a first distance and a second distance, the second distance is greater than the first distance, and the notch is arranged on one side with the second distance.
Optionally, the plurality of notches are located at the outer side of the bottom of the chip to be filled, and are distributed at intervals around the chip to be filled.
Optionally, the gaps are 40-60 μm apart.
Optionally, the length of the notch does not exceed the side length of the chip to be filled.
Optionally, the width of the notch is 20-40 μm.
Optionally, the notch is formed by laser spot cutting.
Optionally, the barrier film is attached to the surfaces of the carrier plate and the chip module, and the notch is located at a position where the barrier film extends outwards by an L1 distance from the edge of the top surface of the chip to be filled, where the thickness of the chip to be filled is less than L1 < (the thickness of the chip to be filled+the height of the second gap).
Optionally, the release film is an epoxy resin, polyimide, thermoplastic resin, or thermosetting resin film.
Optionally, the thickness of the isolating film is 10-50 μm.
Optionally, the carrier plate is provided with a connection circuit, and the filter chip is connected with the connection circuit of the carrier plate through a first bump arranged at the bottom, and the first gap is formed; the chip to be filled is connected with the connecting circuit of the carrier plate through a second bump arranged at the bottom, and the second gap is formed.
Optionally, the chip to be filled includes other functional chips and/or passive devices.
A communication device is provided with the packaging structure of the radio frequency module.
The beneficial effects of the invention are as follows:
1. the gap at the bottom of the filter chip is sealed by the isolating film to form a cavity and is completely isolated from the subsequent plastic sealing layer, the gap at the bottom of the chip to be filled is filled with plastic sealing materials in a required area through the notch of the hollow structure, the requirement of integrated packaging of the filter chip and other chips is met, the reliability is improved, the isolating film is still of an integrated structure, stable combination is realized, the sealing effect of the cavity and the coating effect of the chip are ensured,
2. the spot cutting mode is adopted, so that a heat affected zone on the dry film is small, smaller chip spacing, higher product density and integration level can be realized, no requirement is required for chip arrangement, the applicable range is wide, the production efficiency is improved, and the product cost is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a carrier board in embodiment 1;
fig. 2 is a schematic diagram of a combination structure of a carrier and a chip module in embodiment 1;
FIG. 3 is a schematic diagram of the pre-coating film structure of example 1;
fig. 4 is a schematic diagram of the structure of embodiment 1 after peeling the protective layer;
FIG. 5 is a schematic diagram of the laser spot cutting process of example 1;
FIG. 6 is a top view of the structure obtained after laser spot cutting in example 1;
FIG. 7 is a schematic structural diagram (sectional view in the direction a-a' in FIG. 6) of the secondary coating film of the embodiment 1;
FIG. 8 is another schematic structural view (sectional view in the direction b-b' in FIG. 6) of the secondary coating film of example 1;
fig. 9 is a schematic diagram of a package structure of a radio frequency module of embodiment 1;
fig. 10 is a schematic diagram of a combination structure of a carrier and a chip module in embodiment 2;
fig. 11 is a schematic structural view of a pre-coating film of example 2;
fig. 12 is a schematic diagram of the structure after peeling off the protective layer in embodiment 2;
FIG. 13 is a schematic view of the laser cutting process of example 2;
fig. 14 is a schematic view of the structure after the secondary coating of embodiment 2;
fig. 15 is a plan view of the structure after the secondary coating of example 2;
fig. 16 is a schematic diagram of a package structure of a radio frequency module according to embodiment 2;
FIG. 17 is a schematic diagram of the laser cutting process of example 3;
fig. 18 is a schematic diagram of a package structure of a radio frequency module in embodiment 3;
FIG. 19 is a schematic top view of a laser cutting process of embodiment 4;
fig. 20 is a schematic top view of another laser cutting process of example 4.
Detailed Description
The invention is further explained below with reference to the drawings and specific embodiments. The drawings of the present invention are merely schematic to facilitate understanding of the present invention, and specific proportions thereof may be adjusted according to design requirements. The definition of the context of the relative elements and the front/back of the figures described herein should be understood by those skilled in the art to refer to the relative positions of the elements and thus all the elements may be reversed to represent the same elements, which are all within the scope of the present disclosure.
Example 1
The following describes the packaging method of the rf module of embodiment 1 with reference to fig. 1 to 9.
Referring to fig. 1, a carrier plate 1 is provided. The carrier board 1 has connection lines for achieving line connection, rerouting and line extraction, and may be, for example, a multilayer PCB board, a glass-based, ceramic-based package substrate, or the like. According to the layout of the chip module, a solder mask layer 12 is arranged in a non-layout area of the surface of the carrier plate 1.
Referring to fig. 2, the combination of a chip module including a saw filter chip 2 and other chips with a carrier board 1 is realized using a surface mount technology. Other chips include other functional chips, such as switch chips, low Noise Amplifier (LNA) chips, etc., and/or passive devices; passive devices are for example capacitors, resistors, inductors, etc. The other chips include chips to be filled, and in this embodiment, a chip to be filled 3A is taken as an example. The acoustic surface filter chip 2 and the chip to be filled 3A are arranged on the carrier plate 1 and are respectively connected with the carrier plate 1 in a bonding way through the first lug 21/the second lug 31 at the bottom, and the functional area of the acoustic surface filter chip 2 is coplanar with the first lug 21. A first gap 2a with the height of the first bump 21 is formed between the surface of the carrier plate 1 and the surface of the acoustic surface filter chip 2, and the first gap 2a enables the functional area of the acoustic surface filter chip 2 not to be contacted with the surface of the carrier plate; the chip 3A to be filled has a second gap 3A with the height of the second bump 31 between the surface of the carrier 1. Due to the difference of the size and the structure of the chips, the heights of the bumps of different chips are the same, partially the same or different.
Referring to fig. 3, a pre-coating is performed. The dry film 4 is used as an isolating film to cover the carrier plate 1, namely the acoustic surface filter chip 2 and the chip 3A to be filled, which cover the surface of the carrier plate 1. The dry film 4 is an epoxy resin, polyimide, thermoplastic resin or thermosetting resin film, and has a thickness ranging from 10 to 50 μm, for example, 20 μm, 30 μm, 40 μm or any value therebetween. The surface of the dry film facing away from the chip is provided with a protective layer 41 before pre-lamination. After the two are pre-coated together, the dry film 4 is lapped on the top surface of each chip, and a natural falling state under gravity is presented between adjacent chips or between the chips and the surface of the carrier plate.
Referring to fig. 4, the protective layer 41 is peeled off.
Referring to fig. 5 and 6, a laser spot-cutting process is used to spot-cut the dry film 4 around the periphery of the chip 3A to be filled to form a plurality of discrete gaps 4a. The cutting position is designed on the premise that the notch 4a is communicated with the second gap 3a after the vacuum coating is stretched. The notches 4a are preferably arranged at equal intervals around the top surface of the chip 3A to be filled, so as to form a hollowed-out structure on the integrated dry film. For example, for a dry film thickness of 20 μm, an ultraviolet 355 nanosecond laser with a power of 15-30W is used, the focal length of the laser is adjusted to a preset height position for spot cutting and the laser is moved around the periphery of the chip 3A to be filled by the level of the light spot.
Referring to fig. 7 to 8, the secondary coating is performed by a vacuum coating process, the pressure of the coating is 0.9 to 1.0MPa, the temperature is 100 to 110 ℃, and the pressurizing time is 45 to 60 seconds. In the film coating process, under the action of vacuumizing and pressure, the dry film 4 is stretched and attached to the surfaces of the acoustic surface filter chip 2, the chip 3A to be filled and the carrier plate 1, so that a closed cavity V is formed at the first gap 2a of the first bump 21; for the chip 3A to be filled, the absorbed notch 4a is located at the second gap 3A of the second bump 31 to form a hollow structure, so that a space between the second gap 3A between the chip 3A to be filled and the surface of the substrate 1 and the external space of the dry film 4 has a window communicated with each other, wherein the width d1 of the notch 4a is about 20-40um, and the interval d2 is about 40-60um. Specifically, the thickness of the chip 3A to be filled is h 1 The height of the second bump 31 is h 2 The notch is positioned at a distance L which is the distance that the dry film 4 extends outwards from the edge of the top surface of the chip 3A to be filled 1 H is then 1 ＜L 1 ＜(h 1 +h 2 )。
Referring to fig. 9, the molding is performed to form a molding layer 5. In the plastic packaging process, the second gap 3A between the chip 3A to be filled and the surface of the substrate 1 is filled with the plastic packaging material through the notch 4a, so that the reliability of the device is improved. The sealed cavity V is reserved due to the sealing and blocking effects of the dry film 4, and the bottom surface of the acoustic surface filter chip 2 has a functional area, which is located in the sealed cavity V to ensure the normal operation thereof.
The obtained packaging structure of the radio frequency module comprises a carrier plate 1, one or more acoustic surface filter chips 2, one or more other chips (exemplified by a chip to be filled 3A), a dry film 4 and a plastic sealing layer 5. The non-layout area on the surface of the carrier plate 1 is provided with a solder mask layer 12, the sound meter filter chip 2 and other chips comprising the chip 3A to be filled are arranged on the carrier plate 1, and the sound meter filter chip 2 and the other chips comprising the chip 3A to be filled are respectively connected with the carrier plate 1 through the first bump 21/the second bump 31 at the bottom, wherein the surface of the sound meter filter chip 2 and the surface of the carrier plate 1 are provided with a first gap 2a with the height of the first bump 21, and the surface of the chip 3A to be filled and the surface of the carrier plate 1 are provided with a second gap 3A with the height of the second bump 31. The dry film 4 covers the surface of the sound surface filter chip 2, other chips including the chip 3A to be filled and the surface of the carrier plate 1, a closed cavity V corresponding to the first gap 2a is formed between the dry film 4 and the sound surface filter chip 2 and between the dry film 4 and the carrier plate 1, a plurality of gaps 4a are formed at the positions, corresponding to the second gaps 3A, of the dry film 4, the carrier plate 1, the sound surface filter chip 2 and other chips including the chip 3A to be filled are covered by the plastic layer 5, the cavity V is isolated from the plastic layer 5 by the dry film 4, and plastic sealing materials are filled into the second gaps 3A of the chip 3A to be filled and the surface of the carrier plate 1 through the gaps 4a.
For a plurality of other chips which have gaps with the surface of the carrier plate 1 and need to be subjected to plastic packaging cladding, the mode can be adopted, and a hollowed-out structure is formed on the periphery of the required chips so as to realize the filling of the subsequent plastic packaging layers.
In the embodiment, on one hand, the film is pre-coated and then laser cutting is performed, and the laser position is adjusted to the preset height position of the film, and the film is not attached to the surface of the carrier plate and the side wall of the chip between adjacent chips or between the chip and the surface of the carrier plate, so that the damage of the laser cutting to the surface of the carrier plate and the side wall of the chip is avoided; on the other hand, by adopting a laser spot cutting mode, the heat affected area of spot cutting on the dry film is smaller, smaller chip spacing, higher product density and integration level can be realized, no requirement is required for chip arrangement, the applicable range is wide, the production efficiency is improved, and the product cost is reduced; on the other hand, the plastic packaging material in the required area is filled through the notch of the hollow structure, the dry film is still of an integrated structure, stable combination is achieved, and the sealing effect of the cavity and the coating effect of the chip are ensured.
Example 2
The following describes the packaging method of the rf module of embodiment 2 with reference to fig. 10 to 15.
Referring to fig. 10, a carrier board 1 is provided, a non-layout area of the surface of the carrier board 1 is provided with a solder mask layer 12, and the combination of the saw filter chip 2 and other chips with the carrier board 1 is realized by using a surface mounting technology. The other chips of the present embodiment are exemplified by LNA chips or switch chips as the chip to be filled 3B and the passive device 3C. The sound meter filter chip 2 is connected with the carrier plate 1 through a first bump 21 at the bottom in a bonding way and is provided with a first gap 2B, the chip 3B to be filled is connected with the surface of the carrier plate 1 through a second bump 32 and is provided with a second gap 3B, and the chip 3B to be filled is arranged between the passive device 3C and the sound meter filter chip 2.
Step 3, referring to fig. 11, pre-coating is performed. The dry film 4 is coated on the carrier plate 1, namely the acoustic surface filter chip 2, the chip to be filled 3B and the passive device 3C, which are coated on the surface of the carrier plate 1. The surface of the dry film 4 facing away from the chip is provided with a protective layer 41. After pre-coating, the dry film 4 is lapped on the top surface of each chip, and a natural falling state under gravity is presented between adjacent chips.
Step 4, referring to fig. 12, the protective layer 41 is peeled off.
Step 5, referring to fig. 13, a laser cutting process is adopted to cut the dry film 4 covering the chip 3B to be filled, and the cutting position meets the following two conditions: 1. the second gap 3b is communicated with the outside after the vacuum coating film is stretched; 2, after the vacuum coating film is stretched, the first gap 2b of the adjacent acoustic surface filter chip 2 forms a closed cavity. Considering the chip structure, the distance between chips, and the like, the dicing position may be based on the edge of the top surface of the chip 3B to be filled, and the first length of the isolation film may be moved toward the inside of the top surface or the second length of the isolation film may be moved toward the outside to satisfy the above conditions. In this embodiment, the first length of the isolation film is moved inward of the top surface, i.e., the cutting position is located on the top surface of the chip 3B to be filled.
In this embodiment, a laser wire cutting method is adopted to cut the dry film 4 around the chip 3B to be filled, for example, for a dry film with a thickness of 20 μm, an ultraviolet 355 nanosecond laser with a power of 15-30W is adopted, and the laser is adjusted to a preset height position to perform horizontal moving wire cutting, so that the dry film covered on the top surface of the chip 3B to be filled is separated from other parts at the second gap 3B.
Referring to fig. 14, the vacuum lamination process is used for the secondary lamination, the pressure of the lamination is 0.9-1.0 MPa, the temperature is 100-110 ℃, and the pressurizing time is 45-60 s. In the film coating process, under the action of vacuumizing and pressure, the dry film 4 stretches and is closely attached to the surface of each structure, the second gap 3b is communicated with the outside due to the disconnection of the dry film, and the first gap 2b forms a closed cavity V. A top view thereof is shown in fig. 15. The above-mentioned cut isolation film 4 is separated to form a first portion 4a and a second portion 4B, the cut edge of the first portion 4a is located on the top surface of the chip 3B to be filled, and the above-mentioned first length is designed such that the cut edge of the second portion 4B is located on the surface of the carrier plate between the chip 3B to be filled and the adjacent chip after vacuum lamination. The embodiment is particularly suitable for the situation that the chip to be filled has a smaller distance or a smaller height difference from the adjacent chip, so that the adjacent devices have a smaller length of dry film after pre-coating, and when the adjacent chip is the acoustic surface filter chip 2, the cavity formation of the adjacent chip can be ensured.
Wherein the distance between the top surface of the chip 3B to be filled and the carrier plate is H 1 The distance between the top surface of the filter chip 2 and the carrier plate is H 2 The distance between the chip 3B to be filled and the filter chip 2 is D 1 Then need to satisfy D 1 ：(D 1 +H 1 +H 2 ) 1 or more: 5. the second part 4B extends for a length D on the surface of the carrier plate 1 near the chip 3B to be filled 2 ，D 2 Not less than 20 μm and D 2 ＜D 1 。
Referring to fig. 16, plastic sealing is performed to form a plastic sealing layer 5. In the plastic packaging process, the second gap 3b is filled with the plastic packaging material, and the sealed cavity V is reserved due to the sealing and blocking effects of the dry film 4.
In the obtained packaging structure of the radio frequency module, the dry film covered on the top surface of the chip 3B to be filled is separated from the dry films of other parts at the second gap 3B, and the plastic packaging material is filled in the second gap 3B. The dry film covering the top surface of the chip 3B to be filled may cover a part of the area, the whole area, or extend from the top surface down to cover the side wall of the chip 3B to be filled.
In this embodiment, adjust the laser position and cut to the preset high position that the membrane is located, laser focus need not to adjust, and is lower to the precision requirement, easier operation. When a plurality of other devices needing to be filled with plastic packaging materials are arranged in the module, the dry films covered by the other devices can be cut by referring to the process, and after the cutting is finished, vacuum plastic packaging is performed.
Example 3
Referring to fig. 17, embodiment 3 is different from embodiment 2 in that, when the laser dicing is performed, the dicing site is designed such that the edge of the top surface of the chip 3B to be filled is moved to the outside by the second length of the spacer film, that is, the dicing site is located at the side surface of the chip 3B to be filled. Referring to fig. 18, the above-mentioned cut isolation film 4 is separated to form a first portion 4c and a second portion 4d, and the above-mentioned second length is designed such that the cut edge of the first portion 4c is located on the side wall of the chip 3B to be filled after vacuum coating to avoid the influence on the second gap 3B. The embodiment is particularly suitable for the situation that the chip to be filled has a larger distance or a larger height difference from the adjacent chip, so that the dry film 4 with a larger length between the adjacent devices after pre-coating.
Also, the relationship described in example 2 is satisfied between the chip height and the distance.
Example 4
In the method for packaging a radio frequency module of embodiment 4, the steps in the previous stage refer to the steps in fig. 1 to 4 of embodiment 1.
Referring to fig. 19, at the time of the laser cutting process, the dry film 4 to be filled in the periphery of the chip 3A is cut to form two notches 4b. In this embodiment, the chip 3A to be filled has a square structure, and two adjacent sides of the chip are provided with the filter chip 2, so that the two notches 4b may be located on the other two sides where no filter chip is provided to avoid the influence on the package of the filter chip. Referring to fig. 20, in another embodiment, the distance between two adjacent filter chips 2 on two sides and the chip 3A to be filled is the first distance D 3 And a second distance D 4 ，D 4 ＞D 3 Two notches 4b are arranged on opposite sides, one notch 4b is arranged on one side with a second distance D4, more ideal plastic package material bottom filling effect can be obtained through arrangement of two opposite sides of the notch, and the notch is far away from the filter chip as far as possible in structural design so as to avoid influence on the packaging of the filter chip. Rear part (S)The vacuum lamination and plastic packaging process are described in example 1.
The laser cutting process used in this embodiment may be point cutting or wire cutting, and the length of the single notch does not exceed, for example, a side length of the square chip structure. More than two notches can be arranged according to the requirement, so that the notch is in a hollow structure after vacuum film coating.
The above embodiments are described by taking a laser cutting process as an example, and other precise cutting techniques such as ion cutting techniques may be employed.
The packaging method and the packaging structure can be applied to the packaging of the radio frequency module of the acoustic surface filter and finally applied to communication equipment. Along with the development of the rf front-end module and the demand of the application terminal for the light and thin application, the corresponding package integration level is higher and higher. The radio frequency front end module with high integration level needs to put different chips/components in the same package body, solves the problems of large size and high cost of the existing CSP, WLP and other device packaging modes, and promotes the application of the radio frequency module.
The above embodiment is only used for further illustrating a packaging structure of a radio frequency module according to the present invention, but the present invention is not limited to the embodiment, and any simple modification, equivalent variation and modification of the above embodiment according to the technical substance of the present invention falls within the scope of the technical solution of the present invention.
Claims (15)
1. The utility model provides a packaging structure of radio frequency module which characterized in that: the chip module is arranged on the carrier plate, the isolation film is covered on the surfaces of the carrier plate and the chip module, and the plastic layer is arranged on the isolation film and covers the carrier plate and the chip module; the chip module comprises a filter chip and at least one chip to be filled, wherein the filter chip is provided with a functional surface facing the carrier plate, and a first gap is arranged between the functional surface and the carrier plate; the chip to be filled is provided with a lower surface facing the carrier plate, and a second gap is arranged between the lower surface and the carrier plate; the isolation film encloses the first gap to form a closed cavity, the isolation film is provided with at least two gaps communicated with the second gap, and the plastic layer fills the second gap through the gaps.
2. The package structure of a radio frequency module according to claim 1, wherein: the at least two notches are positioned on two adjacent sides, two opposite sides or multiple sides of the chip to be filled.
3. The package structure of a radio frequency module according to claim 2, wherein: the chip to be filled is arranged adjacent to the filter chip and is provided with a nearest side close to the filter chip, and the notch is arranged outside the nearest side.
4. The package structure of a radio frequency module according to claim 2, wherein: the filter chip is positioned on different sides of the chip to be filled, the filter chip and the chip to be filled are respectively provided with a first distance and a second distance, the second distance is larger than the first distance, and the notch is arranged on one side with the second distance.
5. The package structure of a radio frequency module according to claim 1, wherein: the notches are positioned on the outer side of the bottom of the chip to be filled and are distributed at intervals around the chip to be filled.
6. The package structure of a radio frequency module according to claim 5, wherein: the gap interval is 40-60 μm.
7. The package structure of a radio frequency module according to claim 1, wherein: the length of the notch does not exceed the side length of the chip to be filled.
8. The package structure of a radio frequency module according to claim 7, wherein: the width of the notch is 20-40 mu m.
9. The package structure of a radio frequency module according to claim 5, wherein: the notch is formed by laser spot cutting.
10. The package structure of a radio frequency module according to claim 1, wherein: the isolation film is attached to the surfaces of the carrier plate and the chip module, the notch is located at the position where the isolation film extends outwards by L1 distance from the edge of the top surface of the chip to be filled, and the thickness of the chip to be filled is less than L1 < (the thickness of the chip to be filled+the height of the second gap).
11. The package structure of a radio frequency module according to claim 1, wherein: the release film is an epoxy resin, polyimide, thermoplastic resin, or thermosetting resin film.
12. The package structure of a radio frequency module according to claim 1, wherein: the thickness of the isolating film is 10-50 mu m.
13. The package structure of a radio frequency module according to claim 1, wherein: the filter chip is connected with the connecting circuit of the carrier plate through a first bump arranged at the bottom, and the first gap is formed; the chip to be filled is connected with the connecting circuit of the carrier plate through a second bump arranged at the bottom, and the second gap is formed.
14. The package structure of a radio frequency module according to claim 1, wherein: the chip to be filled comprises other functional chips and/or passive devices.
15. A communication device, characterized by: a package structure having a radio frequency module as claimed in any one of claims 1 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310794535.XA CN117013981A (en) | 2023-06-30 | 2023-06-30 | Package structure of radio frequency module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310794535.XA CN117013981A (en) | 2023-06-30 | 2023-06-30 | Package structure of radio frequency module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117013981A true CN117013981A (en) | 2023-11-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310794535.XA Pending CN117013981A (en) | 2023-06-30 | 2023-06-30 | Package structure of radio frequency module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117013981A (en) |
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2023
- 2023-06-30 CN CN202310794535.XA patent/CN117013981A/en active Pending
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