CN117008650A - Gaseous oxygen control system for dynamically adjusting oxygen concentration of lead-bismuth loop - Google Patents
Gaseous oxygen control system for dynamically adjusting oxygen concentration of lead-bismuth loop Download PDFInfo
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- CN117008650A CN117008650A CN202310947870.9A CN202310947870A CN117008650A CN 117008650 A CN117008650 A CN 117008650A CN 202310947870 A CN202310947870 A CN 202310947870A CN 117008650 A CN117008650 A CN 117008650A
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- 229910052760 oxygen Inorganic materials 0.000 title claims abstract description 204
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title claims abstract description 201
- 239000001301 oxygen Substances 0.000 title claims abstract description 201
- 229910052797 bismuth Inorganic materials 0.000 title claims abstract description 59
- 239000007789 gas Substances 0.000 claims abstract description 99
- 238000005485 electric heating Methods 0.000 claims abstract description 42
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910001152 Bi alloy Inorganic materials 0.000 claims abstract description 25
- 238000002844 melting Methods 0.000 claims abstract description 24
- 230000008018 melting Effects 0.000 claims abstract description 24
- 239000000463 material Substances 0.000 claims abstract description 13
- 230000007797 corrosion Effects 0.000 claims abstract description 9
- 238000005260 corrosion Methods 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 29
- 238000012544 monitoring process Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000006213 oxygenation reaction Methods 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000872 buffer Substances 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000002826 coolant Substances 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 238000005275 alloying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D11/00—Control of flow ratio
- G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
- G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Flow Control (AREA)
Abstract
The invention discloses a gaseous oxygen control system for dynamically adjusting the oxygen concentration of a lead-bismuth loop, which belongs to the technical field of lead-based coolant of a fourth-generation nuclear reactor. The expansion tank, the electric heating element, the electromagnetic flowmeter, the electromagnetic pump and the other two electric heating elements which are connected in series are sequentially connected to form a loop; an air cooler is arranged on the electric heating element adjacent to the electromagnetic flowmeter; an oxygen sensor and a K-type thermocouple are arranged between two sides of the electromagnetic flowmeter and the two electric heating elements connected in series; the lead bismuth melting tank is connected into a loop between the electromagnetic flowmeter and the electromagnetic pump through an electric valve, is singly connected with an Ar gas tank through a needle valve, and is connected with the tail gas treatment tank through another needle valve; the tail gas treatment box is connected with the expansion box through a needle valve; expansion tanks are respectively connected with O 2 Ar gas tank, ar gas tank and H 2 and/Ar mixed gas tank is connected. The invention can accurately control the oxygen concentration in the lead-bismuth loop and inhibit or reduce the corrosion of lead-bismuth alloy to the materials in the pile.
Description
Technical Field
The invention relates to the technical field of lead-based coolant of a fourth-generation nuclear reactor, in particular to a gaseous oxygen control system for dynamically adjusting the oxygen concentration of a lead-bismuth loop.
Background
The lead-bismuth alloy has high boiling point, small volume change when the temperature in the reactor changes, normal pressure operation of the system and lower pressure bearing requirement on materials, and the remarkable advantages are that the lead-bismuth alloy can be used as a coolant to effectively improve the outlet temperature of the reactor coolant, improve the economy, reduce the damage to the materials, ensure the safety of the system and lower pressure bearing requirement on the materials. However, the problem of corrosion of the lead bismuth alloy during operation of the reactor is not negligible. The lead bismuth alloy has dissolution corrosion to structural materials or pipelines, and can have a great influence on the safe operation of the reactor. The existing solution to material corrosion is mainly to protect the material by a surface coating technology or surface alloying, and to reduce the corrosion rate by controlling the concentration of oxygen in an operating loop to generate an oxide film on the surface of the material. When the oxygen concentration in the loop is too low, the metal material can be dissolved and corroded, and when the oxygen concentration is too high, the metal oxide can be precipitated to cause pipeline blockage, so that the oxygen concentration in the loop is dynamically regulated, and the oxygen concentration is controlled in a working interval in which an oxide film is stably generated, wherein a gaseous oxygen control mode is included. Injection of H into a gaseous oxygen-controlled loop 2 /O 2 Or H 2 /H 2 The oxygen content in the O regulation loop dynamically changes the gas injection amount so as to control the formation rate of the oxide film, and has the advantages of rapid oxygen concentration regulation, simple loop structure, low maintenance cost and the like.
Disclosure of Invention
The invention aims to provide a gaseous oxygen control system for dynamically adjusting the oxygen concentration of a lead-bismuth loop, which comprises H 2 Ar mixed gas tank, first Ar gas tank, second Ar gas tank, O 2 Ar mixing gas tank, O 2 Mass flow controller, ar mass flow controller, H 2 The system comprises a mass flow controller, an expansion tank, a first oxygen sensor, a second oxygen sensor, a third oxygen sensor, a fourth oxygen sensor, a fifth oxygen sensor, a first pressure gauge, a second pressure gauge, a first liquid level gauge, a second liquid level gauge, a first K-type thermocouple, a second K-type thermocouple, a third K-type thermocouple, a fourth K-type thermocouple, a fifth K-type thermocouple, a lead bismuth melting tank, an electromagnetic pump, a first electric heating element, a second electric heating element, a third electric heating element, a fourth electric heating element, an air cooler, an electromagnetic flowmeter, a first electric valve, a second electric valve, a third electric valve, a fourth electric valve, a fifth electric valve, a sixth electric valve, a seventh electric valve, an eighth electric valve, a ninth electric valve, an exhaust gas treatment tank and a flow monitoring and control terminal;
the expansion tank, the sixth electric valve, the third electric heating element, the seventh electric valve, the electromagnetic flowmeter, the eighth electric valve, the second electric valve, the electromagnetic pump, the third electric valve, the first electric heating element, the fourth electric valve, the second electric heating element and the fifth electric valve are sequentially connected to form a loop; an air cooler is arranged on the third electric heating element; the lead bismuth melting tank is connected into a loop between the second electric valve and the eighth electric valve through the first electric valve, and a fourth electric heating element is arranged on the side wall of the lead bismuth melting tank; the lead bismuth melting tank is connected with the second Ar gas tank through one needle valve and is connected with the tail gas treatment tank through the other needle valve; the tail gas treatment box is connected with the expansion box through a needle valve; o (O) 2 Ar gas tank, first Ar gas tank, H 2 Ar gas tank is respectively connected with O 2 Mass flow controller, ar mass flow controller, H 2 The mass flow controller is connected with three paths and is connected with the expansion tank for one path; o (O) 2 Mass flow controller, ar mass flow controller, H 2 The inlet side and the outlet side of the mass flow controller are respectively provided withPlacing a needle valve; o (O) 2 Mass flow controller, ar mass flow controller, H 2 The mass flow controllers are respectively connected with a flow monitoring and controlling terminal; a first pressure gauge, a first liquid level gauge, a first oxygen sensor and a first K-type thermocouple are arranged on the lead bismuth melting tank; the second oxygen sensor and the second K-type thermocouple are arranged in the loop and are positioned between the first electric valve and the second electric valve; the third oxygen sensor and the third K-type thermocouple are arranged in a loop between the first electric heating element and the fourth electric valve; the fourth oxygen sensor and the fourth K-type thermocouple are arranged in a loop between the third electric heating element and the seventh electric valve; the fifth K-type thermocouple, the second liquid level meter and the fifth oxygen sensor are all arranged on the expansion tank, and the second pressure meter is connected with the expansion tank through a ninth electric valve.
H 2 The gas ratio in the Ar mixed gas tank is 5%H 2 ：95％Ar。
O 2 The gas ratio in the Ar mixed gas tank is 5% O 2 ：95％Ar。
O 2 The mass flow controller is an ACU analog mass flow controller, the signal output of the mass flow controller is 4-20 mA current, the flow control input is a 0-5V voltage signal, and the corresponding gas flow is 0-20 sccm.
H 2 The mass flow controller is an ACU analog mass flow controller, the signal output of the mass flow controller is 4-20 mA current, the flow control input is a 0-5V voltage signal, and the corresponding gas flow is 0-200 sccm.
The lead bismuth melting tank is a 316L stainless steel tank body.
Maximum flow of pump body of electromagnetic pump is 2m 3 And/h, the maximum pressure is 0.75MPa, three-phase alternating current is adopted, and the maximum current is 98A; the pump body is cooled by forced air, so that the maximum running temperature is 450 ℃.
The electromagnetic flowmeter is a permanent magnet flowmeter, consists of two corrosion-resistant and heat-resistant rectangular SmCo permanent magnets and two 316L material brackets for supporting the magnets, and is calibrated by a volume method.
A gaseous oxygen control method for a gaseous oxygen control system for dynamically regulating the oxygen concentration of a lead-bismuth loop comprises the steps of injecting gas into a gas inletThe fourth electric heating element heats the lead bismuth melting tank to the operating temperature of the loop to melt the lead bismuth alloy, presses the lead bismuth alloy into the loop through the second Ar gas tank and the first electric valve to operate, and then closes the first electric valve; the lead-bismuth alloy firstly passes through a third electric heating element and then flows through an electromagnetic flowmeter, and if the lead-bismuth alloy is in a non-isothermal state, an air cooler is opened to cool a pipeline at the third electric heating element; when the circuit stops running, a first electric valve is opened to recover the lead-bismuth alloy to a lead-bismuth melting tank for storage; the electromagnetic pump provides power for loop operation, the expansion tank buffers the loop volume change, is positioned at the highest position of the system, controls the liquid level height and flows out of the air outlet space, has a cross section larger than that of a loop pipeline, ensures that a gas phase and liquid lead bismuth have a large contact area in gaseous oxygen control, and prolongs the reaction time of the gas and the liquid lead bismuth; the first oxygen sensor, the second oxygen sensor, the third oxygen sensor, the fourth oxygen sensor and the fifth oxygen sensor monitor oxygen concentration, the first pressure gauge and the second pressure gauge monitor pressure to prevent overpressure or air leakage, the first liquid level gauge and the second liquid level gauge monitor the liquid level of the lead bismuth alloy, and the first K-type thermocouple, the second K-type thermocouple, the third K-type thermocouple, the fourth K-type thermocouple and the fifth K-type thermocouple monitor temperature; the flow monitoring and control terminal adjusts O according to feedback of the first oxygen sensor, the second oxygen sensor, the third oxygen sensor, the fourth oxygen sensor and the fifth oxygen sensor 2 Mass flow controller, ar mass flow controller, H 2 Opening degree of mass flow controller to control O respectively 2 Ar gas tank, first Ar gas tank, H 2 Gas supply to the Ar mixing tank.
When the feedback oxygen concentration of the first oxygen sensor, the second oxygen sensor, the third oxygen sensor, the fourth oxygen sensor and the fifth oxygen sensor in the loop is lower than the specified value of the loop, the gas flow is set through the flow monitoring and control terminal, and the signal enters O immediately 2 Mass flow controller, now O 2 The opening of a valve in the mass flow controller is increased, and the oxygen supply is increased; when the first oxygen sensor, the second oxygen sensor, the third oxygen sensor,The fourth oxygen sensor and the fifth oxygen sensor feed back that the oxygen concentration reaches the specified value in the loop, and the flow monitoring and control terminal transmits a closing signal to O 2 A mass flow controller, the opening of the internal valve of which is closed, H in the whole oxygenation process 2 The mass flow controller valve remains closed and the Ar mass flow controller valve remains open;
when the feedback oxygen concentration of the first oxygen sensor, the second oxygen sensor, the third oxygen sensor, the fourth oxygen sensor and the fifth oxygen sensor in the loop is higher than the specified value of the loop, the gas flow is set through the flow monitoring and control terminal, and the signal enters H immediately 2 Mass flow controller, now H 2 The opening of a valve in the mass flow controller is increased, and the hydrogen supply amount is increased; when the feedback oxygen concentration of the first oxygen sensor, the second oxygen sensor, the third oxygen sensor, the fourth oxygen sensor and the fifth oxygen sensor in the loop all reach the specified value in the loop, the flow monitoring and control terminal transmits a closing signal to H 2 Mass flow controller with internal valve opening closed, O in the whole oxygenation process 2 The mass flow controller valve remains closed and the Ar mass flow controller valve remains open.
The invention has the beneficial effects that:
the invention can accurately control the oxygen concentration in the lead-bismuth loop, form a layer of compact oxide film on the surface of the base material of the loop, and stably exist the oxide film by dynamically adjusting the air supply amount, thereby inhibiting or reducing the corrosion of the lead-bismuth alloy to the materials in the pile and ensuring the safe and stable operation of the lead-bismuth loop. In addition, the gas loop has the advantages of simplicity, easiness in operation, low maintenance cost, high response speed and the like.
Drawings
FIG. 1 (a) (b) is a schematic diagram of the gaseous oxygen control principle in the present invention;
FIG. 2 is a schematic diagram of a gaseous oxygen control circuit according to the present invention;
fig. 3 is a schematic diagram of an air supply circuit.
Detailed Description
The invention provides a gaseous oxygen control system for dynamically adjusting the oxygen concentration of a lead-bismuth loop, and the invention is further described below with reference to the accompanying drawings and specific embodiments.
FIG. 1 (a) (b) is a schematic diagram of the principle of gaseous oxygen control by changing the partial pressure of oxygen in the atmosphere by injecting H, according to Henry's law, the solubility of a gas in a liquid being expressed in mole fraction and the equilibrium partial pressure of the gas at a certain temperature and equilibrium state 2 Or O 2 A change in the oxygen concentration in the lead bismuth fluid is achieved, and as the partial pressure of oxygen in the atmosphere increases, the oxygen concentration in the lead bismuth fluid in the circuit increases, and vice versa.
Fig. 2 is a schematic diagram of a gaseous oxygen control circuit, in which the expansion tank 8, the sixth electric valve 186, the third electric heating element 153, the seventh electric valve 187, the electromagnetic flowmeter FM, the eighth electric valve 188, the second electric valve 182, the electromagnetic pump 14, the third electric valve 183, the first electric heating element 151, the fourth electric valve 184, the second electric heating element 152, and the fifth electric valve 185 are sequentially connected to form a circuit; the third electric heating element 153 is provided with an air cooler 16; the lead bismuth melting tank 13 is connected into a loop between the second electric valve 182 and the eighth electric valve 188 through the first electric valve 181, and a fourth electric heating element 154 is arranged on the side wall of the lead bismuth melting tank 13; the lead bismuth melting tank 13 is connected with a second Ar gas tank 22 through one needle valve and is connected with the tail gas treatment tank 19 through the other needle valve; the tail gas treatment box 19 is connected with the expansion box 8 through a needle valve; o (O) 2 Ar hybrid gas tank 3, first Ar gas tank 21, H 2 The Ar mixed gas tank 1 is respectively connected with O 2 Mass flow controller 4, ar mass flow controller 5, H 2 The mass flow controller 6 is connected with three paths and is connected with the expansion tank 8 for one path; o (O) 2 Mass flow controller 4, ar mass flow controller 5, H 2 The inlet side and the outlet side of the mass flow controller 6 are respectively provided with a needle valve; o (O) 2 Mass flow controller 4, ar mass flow controller 5, H 2 The mass flow controllers 6 are respectively connected with a flow monitoring and controlling terminal 20; the lead bismuth melting tank 13 is provided with a first pressure gauge P1, a first liquid level gauge L1, a first oxygen sensor OS1 and a first K-type thermocouple T1; the second oxygen sensor OS2 and the second K-type thermocouple T2 are arranged in the loop and are positioned between the first electric valve 181 and the second electric valve 182; a third oxygen sensor OS3,A third K-type thermocouple T3 is provided in the circuit between the first electric heating element 151 and the fourth electrically operated valve 184; a fourth oxygen sensor OS4, a fourth K-type thermocouple T4, and a third electric heating element 153 and a seventh electrically operated valve 187; the fifth K-type thermocouple T5, the second liquid level meter L2 and the fifth oxygen sensor OS5 are all arranged on the expansion tank 8, and the second pressure gauge P2 is connected with the expansion tank 8 through a ninth electric valve 189.
H 2 The gas ratio in the Ar mixing gas tank 1 is 5%H 2 ：95％Ar。O 2 The gas ratio in the Ar mixing gas tank 3 was 5% O 2 ：95％Ar。
O 2 The mass flow controller 4 is an ACU analog mass flow controller, the signal output is 4-20 mA current, the flow control input is 0-5V voltage signal, and the corresponding gas flow is 0-20 sccm. H 2 The mass flow controller 6 is an ACU analog mass flow controller, the signal output is 4-20 mA current, the flow control input is 0-5V voltage signal, and the corresponding gas flow is 0-200 sccm.
The lead bismuth melting tank 13 is a 316L stainless steel tank body.
The maximum flow rate of the pump body of the electromagnetic pump 14 is 2m 3 And/h, the maximum pressure is 0.75MPa, three-phase alternating current is adopted, and the maximum current is 98A; the pump body is cooled by forced air, so that the maximum running temperature is 450 ℃.
The electromagnetic flowmeter FM is a permanent magnet flowmeter, consists of two corrosion-resistant and heat-resistant rectangular SmCo permanent magnets and two 316L material brackets for supporting the magnets, and is calibrated by a volume method.
The gas injection port and the gas exhaust port are respectively connected with the second Ar gas tank 22 and the tail gas treatment tank 19, lead-bismuth fluid is supplied in the loop starting stage, the fourth electric heating element 154 heats the lead-bismuth melting tank 13 to the loop operating temperature to melt the lead-bismuth alloy, the lead-bismuth alloy is pressed into the loop to operate through the second Ar gas tank 22 and the first electric valve 181, and then the first electric valve 181 is closed; the lead bismuth alloy firstly passes through the third electric heating element 153 and then flows through the electromagnetic flowmeter FM, if the lead bismuth alloy is in a non-isothermal state, the air cooler 16 is opened, and a pipeline at the position of the third electric heating element 153 is cooled; when the loop stops runningThe first electric valve 181 is opened to recycle the lead-bismuth alloy to the lead-bismuth melting tank 13 for storage; the electromagnetic pump 14 provides power for loop operation, the expansion tank 8 buffers loop volume change, is positioned at the highest position of the system, controls the liquid level height and flows out of the space, has a cross section larger than that of a loop pipeline, ensures that a gas phase and liquid lead bismuth have a large contact area in gaseous oxygen control, and prolongs the reaction time of the gas and the liquid lead bismuth; the first oxygen sensor OS1, the second oxygen sensor OS2, the third oxygen sensor OS3, the fourth oxygen sensor OS4 and the fifth oxygen sensor OS5 monitor oxygen concentration, the first pressure gauge P1 and the second pressure gauge P2 monitor pressure to prevent overpressure or air leakage, the first liquid level gauge L1 and the second liquid level gauge L2 monitor lead bismuth alloy liquid level, the first K-type thermocouple T1, the second K-type thermocouple T2, the third K-type thermocouple T3, the fourth K-type thermocouple T4 and the fifth K-type thermocouple T5 monitor temperature; the flow rate monitoring and control terminal 20 adjusts O according to feedback from the first, second, third, fourth, and fifth oxygen sensors OS1, OS2, OS3, OS4, OS5 2 Mass flow controller 4, ar mass flow controller 5, H 2 The opening degree of the mass flow controller 6 to control O respectively 2 Ar hybrid gas tank 3, first Ar gas tank 21, H 2 Gas supply to the/Ar hybrid gas tank 1.
The oxygen concentration in the lead bismuth fluid is obtained through a first oxygen sensor OS1, a second oxygen sensor OS2, a third oxygen sensor OS3, a fourth oxygen sensor OS4 and a fifth oxygen sensor OS5 in the lead bismuth loop, the oxygen concentration is compared with the oxygen concentration regulated by the operating condition, the difference between the two is obtained through a flow monitoring and control terminal 20, and then the gas covering flow regulation is carried out through a mass flow controller.
The gas flow is set through the flow monitoring and control terminal 20, the opening of the internal valve can be adjusted through the mass flow controller so as to control the gas injection flow, the gas is injected into the expansion tank 8 through the needle valve, the gas injection flow direction is opposite to the lead bismuth flow direction, the gas-liquid contact area is effectively increased, and the oxygen transfer process efficiency is improved.
The exhaust gas and the tail gas treatment system treat the discharged exhaust gas to prevent the pollution to the atmosphere.
FIG. 3 is an illustration of an air supply circuitIt is intended that when the feedback oxygen concentration of the first oxygen sensor OS1, the second oxygen sensor OS2, the third oxygen sensor OS3, the fourth oxygen sensor OS4, and the fifth oxygen sensor OS5 in the loop are all lower than the specified value of the loop, the gas flow is set by the flow monitoring and control terminal 20, and the signal immediately enters O 2 Mass flow controller 4, now O 2 The opening of a valve in the mass flow controller 4 is increased, and the oxygen supply is increased; when the oxygen concentration fed back by the first oxygen sensor OS1, the second oxygen sensor OS2, the third oxygen sensor OS3, the fourth oxygen sensor OS4 and the fifth oxygen sensor OS5 in the loop reach the specified values in the loop, the flow monitoring and control terminal 20 transmits a closing signal to O 2 A mass flow controller 4, the opening of which is closed, H in the whole oxygenation process 2 The valve of the mass flow controller 6 is kept closed, and the valve of the Ar mass flow controller 5 is kept open;
when the feedback oxygen concentration of the first oxygen sensor OS1, the second oxygen sensor OS2, the third oxygen sensor OS3, the fourth oxygen sensor OS4 and the fifth oxygen sensor OS5 in the loop is higher than the specified value of the loop, the gas flow is set through the flow monitoring and control terminal 20, and the signal immediately enters H 2 Mass flow controller 6, now H 2 The opening of a valve in the mass flow controller 6 is increased, and the hydrogen supply amount is increased; when the first oxygen sensor OS1, the second oxygen sensor OS2, the third oxygen sensor OS3, the fourth oxygen sensor OS4, and the fifth oxygen sensor OS5 in the loop feed back the oxygen concentrations to reach the specified values in the loop, the flow monitoring and control terminal 20 transmits a closing signal to H 2 A mass flow controller 6, the opening of which is closed, O in the whole oxygenation process 2 The mass flow controller 4 valve remains closed and the Ar mass flow controller 5 valve remains open.
In summary, the gaseous oxygen control system for realizing dynamic regulation of the oxygen concentration of the lead-bismuth loop provided by the invention can monitor and regulate the dissolved oxygen concentration of the liquid lead-bismuth alloy coolant system on line in real time, and provides support for realizing long-term stable and safe operation of the lead-bismuth loop.
Claims (10)
1. Realize dynamic regulation plumbous bismuth return circuit oxygen concentrationA gaseous oxygen control system, characterized by comprising H 2 A Ar mixed gas tank (1), a first Ar gas tank (21), a second Ar gas tank (22), and an O gas tank 2 Ar gas tank (3), O 2 Mass flow controller (4), ar mass flow controller (5), H 2 A mass flow controller (6), an expansion tank (8), a first oxygen sensor (OS 1), a second oxygen sensor (OS 2), a third oxygen sensor (OS 3), a fourth oxygen sensor (OS 4), a fifth oxygen sensor (OS 5), a first pressure gauge (P1), a second pressure gauge (P2), a first level gauge (L1), a second level gauge (L2), a first type K thermocouple (T1), a second type K thermocouple (T2), a third type K thermocouple (T3), a fourth type K thermocouple (T4), a fifth type K thermocouple (T5), a lead bismuth melting tank (13), an electromagnetic pump (14), a first electric heating element (151), a second electric heating element (152), a third electric heating element (153), a fourth electric heating element (154), an air cooler (16), an electromagnetic Flow Meter (FM), a first electric valve (181), a second electric valve (182), a third electric valve (183), a fourth electric valve (184), a fifth electric valve (185), a sixth electric valve (186), a seventh electric valve (188), a eighth electric valve (188), a ninth electric valve (188), and a ninth electric valve (19;
the expansion tank (8), the sixth electric valve (186), the third electric heating element (153), the seventh electric valve (187), the electromagnetic Flowmeter (FM), the eighth electric valve (188), the second electric valve (182), the electromagnetic pump (14), the third electric valve (183), the first electric heating element (151), the fourth electric valve (184), the second electric heating element (152) and the fifth electric valve (185) are sequentially connected to form a loop; an air cooler (16) is arranged on the third electric heating element (153); the lead bismuth melting tank (13) is connected into a loop between the second electric valve (182) and the eighth electric valve (188) through the first electric valve (181), and a fourth electric heating element (154) is arranged on the side wall of the lead bismuth melting tank (13); the lead bismuth melting tank (13) is connected with a second Ar gas tank (22) through a needle valve and is connected with the tail gas treatment tank (19) through another needle valve; the tail gas treatment box (19) is connected with the expansion box (8) through a needle valve; o (O) 2 An Ar gas tank (3), a first Ar gas tank (21), and H 2 Ar gas tank (1) and O respectively 2 Mass flow controller (4), ar mass flow controller (5), H 2 Quality ofThe flow controller (6) is connected with three paths and is connected with the expansion tank (8) for one path; o (O) 2 Mass flow controller (4), ar mass flow controller (5), H 2 The inlet side and the outlet side of the mass flow controller (6) are respectively provided with a needle valve; o (O) 2 Mass flow controller (4), ar mass flow controller (5), H 2 The mass flow controllers (6) are respectively connected with a flow monitoring and controlling terminal (20); a first pressure gauge (P1), a first liquid level gauge (L1), a first oxygen sensor (OS 1) and a first K-type thermocouple (T1) are arranged on the lead bismuth melting tank (13); the second oxygen sensor (OS 2) and the second K-type thermocouple (T2) are arranged in the loop and are positioned between the first electric valve (181) and the second electric valve (182); a third oxygen sensor (OS 3) and a third K-type thermocouple (T3) are arranged in a loop between the first electric heating element (151) and the fourth electric valve (184); a fourth oxygen sensor (OS 4) and a fourth K-type thermocouple (T4) are provided in a circuit between the third electric heating element (153) and the seventh electric valve (187); the fifth K-type thermocouple (T5), the second liquid level meter (L2) and the fifth oxygen sensor (OS 5) are all arranged on the expansion tank (8), and the second pressure meter (P2) is connected with the expansion tank (8) through a ninth electric valve (189).
2. The gaseous oxygen control system for dynamically adjusting the oxygen concentration of a lead bismuth loop according to claim 1, wherein H 2 The gas ratio in the Ar gas tank (1) is 5%H 2 ：95％Ar。
3. The gaseous oxygen control system for dynamically adjusting the oxygen concentration of a lead bismuth circuit according to claim 1, wherein O 2 The gas ratio in the Ar mixing gas tank (3) is 5% O 2 ：95％Ar。
4. The gaseous oxygen control system for dynamically adjusting the oxygen concentration of a lead bismuth circuit according to claim 1, wherein O 2 The mass flow controller (4) is an ACU analog mass flow controller, the signal output is 4-20 mA current, the flow control input is 0-5V voltage signal, and the corresponding gas flow is 0-20 sccm.
5. The gaseous oxygen control system for dynamically adjusting the oxygen concentration of a lead bismuth loop according to claim 1, wherein H 2 The mass flow controller (6) is an ACU analog mass flow controller, the signal output is 4-20 mA current, the flow control input is 0-5V voltage signal, and the corresponding gas flow is 0-200 sccm.
6. The gaseous oxygen control system for realizing dynamic adjustment of the oxygen concentration of the lead-bismuth circuit according to claim 1, wherein the lead-bismuth melting tank (13) is a 316L stainless steel tank body.
7. The gaseous oxygen control system for dynamically adjusting the oxygen concentration of the lead-bismuth loop according to claim 1, characterized in that the maximum flow rate of the pump body of the electromagnetic pump (14) is 2m 3 And/h, the maximum pressure is 0.75MPa, three-phase alternating current is adopted, and the maximum current is 98A; the pump body is cooled by forced air, so that the maximum running temperature is 450 ℃.
8. The gaseous oxygen control system for dynamically adjusting the oxygen concentration of a lead-bismuth loop according to claim 1, wherein the electromagnetic Flowmeter (FM) is a permanent magnet flowmeter, consists of two corrosion-resistant and heat-resistant rectangular SmCo permanent magnets and two 316L material brackets for supporting the magnets, and is calibrated by a volumetric method.
9. A method for controlling gaseous oxygen of a gaseous oxygen control system for realizing dynamic regulation of the oxygen concentration of a lead-bismuth circuit according to any one of claims 1 to 8, characterized in that a gas injection port and a gas exhaust port are respectively connected with a second Ar gas tank (22) and a tail gas treatment tank (19), a lead-bismuth fluid is supplied in a circuit starting stage, a fourth electric heating element (154) heats a lead-bismuth melting tank (13) to a circuit operating temperature to melt lead-bismuth alloy, and the lead-bismuth alloy is pressed into the circuit to operate through the second Ar gas tank (22) and a first electric valve (181), and then the first electric valve (181) is closed; the lead bismuth alloy firstly passes through a third electric heating element (153) and then flows through an electromagnetic Flowmeter (FM), if the lead bismuth alloy is in a non-isothermal state, an air cooler (16) is turned on, and the position of the third electric heating element (153) is cooledA pipeline; when the circuit stops running, a first electric valve (181) is opened to recycle the lead-bismuth alloy to a lead-bismuth melting tank (13) for storage; the electromagnetic pump (14) provides power for loop operation, the expansion tank (8) buffers loop volume change, is positioned at the highest position of the system, controls the liquid level height and flows out of the air outlet space, has a cross section larger than that of a loop pipeline, ensures that a gas phase and liquid lead bismuth have a large contact area in gaseous oxygen control, and prolongs the reaction time of the gas and the liquid lead bismuth; the first oxygen sensor (OS 1), the second oxygen sensor (OS 2), the third oxygen sensor (OS 3), the fourth oxygen sensor (OS 4) and the fifth oxygen sensor (OS 5) monitor oxygen concentration, the first pressure gauge (P1) and the second pressure gauge (P2) monitor pressure to prevent overpressure or air leakage, the first liquid level gauge (L1) and the second liquid level gauge (L2) monitor lead bismuth alloy liquid level, and the first K-type thermocouple (T1), the second K-type thermocouple (T2), the third K-type thermocouple (T3), the fourth K-type thermocouple (T4) and the fifth K-type thermocouple (T5) monitor temperature; the flow monitoring and control terminal (20) adjusts O according to feedback of the first oxygen sensor (OS 1), the second oxygen sensor (OS 2), the third oxygen sensor (OS 3), the fourth oxygen sensor (OS 4) and the fifth oxygen sensor (OS 5) 2 Mass flow controller (4), ar mass flow controller (5), H 2 Opening degree of mass flow controller (6) to control O respectively 2 An Ar gas tank (3), a first Ar gas tank (21), and H 2 Gas supply to an Ar gas tank (1).
10. The method for controlling gaseous oxygen of a gaseous oxygen control system for dynamically adjusting the oxygen concentration of a lead-bismuth circuit according to claim 9, wherein when the feedback oxygen concentration of a first oxygen sensor (OS 1), a second oxygen sensor (OS 2), a third oxygen sensor (OS 3), a fourth oxygen sensor (OS 4) and a fifth oxygen sensor (OS 5) in the circuit is lower than the prescribed value of the circuit, the flow rate is set by the flow rate monitoring and control terminal (20), and the signal is immediately entered into O 2 Mass flow controller (4), at this time O 2 The opening of a valve in the mass flow controller (4) is increased, and the oxygen supply is increased; when the first oxygen sensor (OS 1), the second oxygen sensor (OS 2), the third oxygen sensor (OS 3), the fourth oxygen sensor (OS 4) and the fifth oxygen sensor (OS 5) feedback oxygen concentrations in the loop reach the specified values in the loop, the flowThe quantity monitoring and control terminal (20) transmits a shut-down signal to O 2 A mass flow controller (4) with an internal valve opening closed, H in the whole oxygenation process 2 The valve of the mass flow controller (6) is kept closed, and the valve of the Ar mass flow controller (5) is kept open;
when the feedback oxygen concentration of the first oxygen sensor (OS 1), the second oxygen sensor (OS 2), the third oxygen sensor (OS 3), the fourth oxygen sensor (OS 4) and the fifth oxygen sensor (OS 5) in the loop is higher than the specified value of the loop, the gas flow is set through the flow monitoring and control terminal (20), and the signal immediately enters H 2 Mass flow controller (6), now H 2 The opening of a valve in the mass flow controller (6) is increased, and the hydrogen supply amount is increased; when the oxygen concentration fed back by the first oxygen sensor (OS 1), the second oxygen sensor (OS 2), the third oxygen sensor (OS 3), the fourth oxygen sensor (OS 4) and the fifth oxygen sensor (OS 5) in the loop all reach the specified value in the loop, the flow monitoring and control terminal (20) transmits a closing signal to H 2 A mass flow controller (6) with an internal valve opening closed and O in the whole oxygenation process 2 The valve of the mass flow controller (4) is kept closed, and the valve of the Ar mass flow controller (5) is kept open.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310947870.9A CN117008650A (en) | 2023-07-31 | 2023-07-31 | Gaseous oxygen control system for dynamically adjusting oxygen concentration of lead-bismuth loop |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310947870.9A CN117008650A (en) | 2023-07-31 | 2023-07-31 | Gaseous oxygen control system for dynamically adjusting oxygen concentration of lead-bismuth loop |
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| CN202310947870.9A Pending CN117008650A (en) | 2023-07-31 | 2023-07-31 | Gaseous oxygen control system for dynamically adjusting oxygen concentration of lead-bismuth loop |
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