CN116994972A - Method for testing thickness of metal layer in production of packaging carrier plate - Google Patents
Method for testing thickness of metal layer in production of packaging carrier plate Download PDFInfo
- Publication number
- CN116994972A CN116994972A CN202310823699.0A CN202310823699A CN116994972A CN 116994972 A CN116994972 A CN 116994972A CN 202310823699 A CN202310823699 A CN 202310823699A CN 116994972 A CN116994972 A CN 116994972A
- Authority
- CN
- China
- Prior art keywords
- metal layer
- thickness
- test block
- metal
- coating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 55
- 239000002184 metal Substances 0.000 title claims abstract description 54
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052802 copper Inorganic materials 0.000 claims abstract description 47
- 239000010949 copper Substances 0.000 claims abstract description 47
- 239000011248 coating agent Substances 0.000 claims abstract description 31
- 238000000576 coating method Methods 0.000 claims abstract description 31
- 238000005259 measurement Methods 0.000 claims abstract description 24
- 238000009713 electroplating Methods 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 3
- 230000006378 damage Effects 0.000 abstract description 9
- 238000013461 design Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 230000001066 destructive effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004441 surface measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
The invention discloses a method for testing the thickness of a metal layer in the production of a packaging carrier plate, which comprises the steps of selecting the position of a test block for thickness measurement on the surface of the packaging carrier plate before preparing the metal layer, and marking the position; coating a film on the surface of the metal bottom layer of the test block partially; preparing a metal layer on the surface of the packaging carrier plate with the test block, wherein the position, covered by the coating film, of the test block cannot be plated with metal, and the position, not covered by the coating film, is plated with a metal column to form a metal layer; tearing off the coating, and measuring the part of the metal layer higher than the metal bottom layer by using the 3D profile to form a height difference, namely the thickness of the metal layer. The invention improves the accuracy of copper thickness measurement, solves the problems of large measurement size, position limitation, physical destruction and the like of the test block, and can be widely applied to the field of IC packaging carrier plates.
Description
Technical Field
The invention relates to the field of IC packaging carrier plates, in particular to a method for testing the thickness of a metal layer in the production of packaging carrier plates. And more particularly, to a method for measuring copper thickness, which adopts a 3D profile measuring device for measurement, and has the advantages of accurate measurement, reduced measurement size, no damage, environmental protection.
Background
At present, two main methods for measuring the copper thickness of the IC package carrier plate in the rising process are: copper thickness measuring instrument and slicing method. Adopt traditional copper thickness measuring apparatu test accuracy not high and the measurement position has the restriction, and the flexibility is low, represents in: 1. the probe and the copper surface are required to be completely vertical, the process is manual operation, the probe and the copper surface cannot be completely ensured to be completely vertical, certain errors can be caused, and the errors of 2-3 mu m can be caused when the errors are serious (compared with professional slicing results); 2. the measuring position is obviously different from actual production, the minimum area of the area for measuring the copper thickness test block needs to be 20 multiplied by 20mm without holes or is away from the edge area of the board, the area with larger measuring size needs to be reserved, the limit in actual production can be reserved for an effective area of 10mm, the test block can only be designed on the board edge generally, and the limitation of the design position of the test block is larger. The precision of copper thickness measurement is higher by adopting a slicing method, the slicing precision is generally within 1 mu m, but the slicing is a destructive test, the slicing method is physically destructive in measurement, physical destruction can be caused to the plate, the later manufacturing procedure can be influenced after the slicing is performed, for example, when the plate is manufactured later and is subjected to solder resist roll coating, a plate in a measuring area is scrapped, a normal area can be due to the vacancy of a slicing sampling area, a scratch roller can be caused, the yield is reduced, and the problems of cost waste, uneconomical environmental protection and the like are caused.
Disclosure of Invention
The invention aims to overcome the defects of the background technology, and provides a method for testing the thickness of a metal layer in the production of a packaging carrier plate, so that the thickness measurement accuracy of the metal layer is improved, and the problems of large measurement size, position limitation, physical damage and the like of a test block are solved.
The invention provides a method for testing the thickness of a metal layer in the production of a packaging carrier plate, which comprises the following steps: step S1: before preparing the metal layer, selecting the position of a test block for thickness measurement on the surface of the packaging carrier plate, and marking the position; step S2: coating a film on the surface of the metal bottom layer of the test block, wherein the thickness of the film is not less than the thickness value of the metal layer to be prepared; step S3: preparing a metal layer on the surface of the packaging carrier plate with the test block, wherein the position, covered by the coating film, of the test block cannot be plated with metal, and the position, not covered by the coating film, is plated with a metal column to form a metal layer; step S4: after the preparation of the metal layer is completed, tearing off the coating, forming a height difference at the part of the metal layer higher than the metal bottom layer, and measuring the height difference by adopting 3D profile measuring equipment to obtain the thickness of the metal layer.
According to the above method, in the step S4, the 3D profile measuring device collects the image of the test block, and performs image processing on the image, thereby calculating the height difference.
According to the above method, in the step S2, the thickness of the coating is greater than the thickness of the metal layer.
According to the above method, in the step S1, the position of the test block is selected by a nine-point method or a five-point method.
In the above method, in the step S1, the size of the test block is (0.5X1) mm 2 ～(1×2)mm 2 。
According to the above method, in step S2, the coating is provided with a plurality of spaced strips.
According to the method, the metal is copper.
The preparation is electroplating, deposition or sputtering according to the method.
The method for testing the thickness of the metal layer in the production of the packaging carrier plate has the following beneficial effects:
1. because the 3D profile is adopted to measure the copper thickness by a high-precision method, the energy efficiency of high precision is achieved; the corresponding test block is designed, so that physical damage to the plate is avoided, and destructive slicing test can be completely replaced; since the 3D profile measurement has low requirement on the size of the test block, the plane size of the test block can be designed to be (0.5X1) mm 2 ～(1×2)mm 2 Compared with the traditional CMI measurement size, the size is 100-400 times smaller, the available places in the packaging carrier plate are many, the limitation of graphic design is avoided, and the position selectivity of the test block is improved; the area of the test block is small, the waste of the board surface material is reduced, and the effects of green and environment protection and cost saving are achieved.
2. Besides copper thickness, other metal layers prepared on the carrier plate in electroplating, depositing, sputtering and other modes are also applicable to the method.
Drawings
FIG. 1 is a flow chart of a method according to an embodiment of the invention;
FIG. 2 is a cross-sectional view of the package carrier structure at step S2 in FIG. 1;
FIG. 3 is a cross-sectional view of the package carrier structure at step S3 in FIG. 1;
fig. 4 is a cross-sectional view of the package carrier structure at step S4 in fig. 1.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, which should not be construed as limiting the invention.
Referring to fig. 1, the embodiment provides a method for testing copper thickness in the production of a package carrier, which is mainly applicable to a method for measuring copper thickness in a Tenting process, and includes the following steps:
step S1: before ordinary electroplating, selecting a position of a copper thickness measurement test block (coupler), wherein the size of the test block is 1 multiplied by 2mm, and the position can be marked by selecting a part except a metal pattern according to pattern requirements. Because of the small size of the test block, there are many alternatives. Here, the nine-point method or the five-point method may be used for selection.
Step S2: the bottom of the test block for measuring copper thickness is provided with a base material 1, the base material 1 is provided with a bottom copper layer 2, more than two coating films 3 are adhered to the surface of the bottom copper layer 2, the thickness of the coating films 3 is not smaller than the thickness value of the electroplated copper layer 4 required by a customer, and in the optimal embodiment, the thickness of the coating films 3 is larger than the thickness value of the electroplated copper layer 4 required by the customer, as shown in fig. 2.
Step S3: the normal electroplating is performed, copper cannot be plated on the test piece where the coating film 3 is covered, and copper pillars are plated on the test piece where the coating film 3 is not covered to form an electroplated copper layer 4, as shown in fig. 3.
Step S4: after electroplating, the coating film 3 is torn off, a copper thickness difference is formed between the coating film 3 and the part not covered by the coating film 3, and the copper thickness difference can be measured by using 3D profile measuring equipment (not shown in the figure), so that a copper thickness value is obtained, as shown in fig. 4. The principle of the 3D profile measuring device is: the image of the test block is scanned, then the scanned image is subjected to image processing, and the height difference is calculated according to pixels and the like.
In order to solve the problems of high copper thickness measurement accuracy, large measurement size of the test block, limitation of the position of the test block, physical damage and the like, the invention provides a measurement method by adopting 3D profile measurement equipment, and designs a corresponding copper thickness test block. The invention adopts the function of measuring depth of the 3D profile measuring equipment to measure, and focuses on designing corresponding test blocks.
The following embodiment is described by a Tenting process, wherein a coating 3 is coated on a copper sheet test block at certain intervals before electroplating, the specific number of the coating 3 can be designed according to the size of the test block, the coating 3 has no residue and no pollution, no harm to products is caused, the thickness of the coating 3 is thicker than that of a target electroplated copper layer 4, and the effects of clamping and short circuit are prevented, so that the measurement accuracy is affected, as shown in fig. 2. After the plating, copper pillars were plated out on the test piece at positions not covered with the coating film 3 to form a plated copper layer 4, as shown in fig. 3. After copper electroplating, the coating film 3 on the test block is torn off, and the difference of the copper surfaces of the electroplated copper layer 4 and the bottom copper layer 2 can be measured by using a 3D profile measuring device to obtain the copper thickness, as shown in fig. 4. The method has higher measurement accuracy, adopts a coaxial laser surface measurement system, can perform triaxial measurement and molding on the surface of the copper surface, and maintains high-accuracy energy efficiency; in addition, the whole plate surface is not damaged, and the plate can normally flow into the next manufacturing; the test block may be designed to be (1X 2) mm in size 2 Compared with the traditional CMI measurement, the size is 100 times smaller, the design flexibility of the coupling position is higher, the five-point method, the nine-point method and the like can be met, and the test block can be designed in other blank areas with the size of 1X 2mm, and the design can not influence the continuous production flow after being manufactured. The waste of the plate surface is reduced in the copper thickness measuring process, and the effects of green and environment protection and cost saving are achieved.
Compared with the existing copper thickness measuring method, the method has the advantages that the measuring accuracy is higher, the design position of the test block is more flexible, the size of the test block is smaller, and meanwhile, physical damage to the IC carrier plate is not required, so that the method has the effects of saving cost, being green and protecting environment. In the most preferred embodiment of the present embodiment, the copper thickness measurement test block is selected to be measured before the normal process of the plate reaches the electroplating, for example, the test block is marked by nine-point method or five-point method. After the step is successfully completed, the 3D profile measuring equipment can be adopted to measure the copper thickness value after the steps S2 to S4, so that the high-precision energy efficiency is maintained. The design thought of the invention completely gets rid of the traditional copper thickness measuring instrument, reduces human errors, improves the precision, has smaller design size of the test block and more flexible position design; in addition, the method does not use the traditional slicing to measure the copper thickness, avoids physical damage to the carrier plate, can continue post-manufacturing processing, increases efficiency, reduces waste and saves cost.
The technical key points or technical principles of the invention:
1. adopting 3D profile measuring equipment to measure;
2. corresponding small-size copper thick test blocks are designed.
In addition to copper thickness, the method is also suitable for thickness testing of other metal layers prepared by electroplating, deposition, sputtering and the like.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
What is not described in detail in this specification is prior art known to those skilled in the art.
Claims (8)
1. A method for testing the thickness of a metal layer in the production of a packaging carrier plate is characterized by comprising the following steps: the method comprises the following steps:
step S1: before preparing the metal layer, selecting the position of a test block for thickness measurement on the surface of the packaging carrier plate, and marking the position;
step S2: part of the surface of the metal bottom layer (2) of the test block is stuck with a coating film (3), and the thickness of the coating film (3) is not smaller than the thickness value of the metal layer (4) to be prepared;
step S3: preparing a metal layer on the surface of the packaging carrier plate with the test block, wherein the position, which is covered by the coating film (3), of the test block cannot be plated with metal, and the position, which is not covered by the coating film (3), is plated with a metal column to form a metal layer (4);
step S4: after the preparation of the metal layer is completed, the covering film (3) is torn off, the part of the metal layer (4) higher than the metal bottom layer (2) forms a height difference, and the height difference is measured by adopting 3D profile measuring equipment, namely the thickness of the metal layer.
2. The method of claim 1, wherein the metal layer thickness is measured during the manufacture of the package carrier, wherein: in the step S4, the 3D profile measuring device collects an image of the test block, and performs image processing on the image, thereby calculating the height difference.
3. The method of claim 1, wherein the metal layer thickness is measured during the manufacture of the package carrier, wherein: in the step S2, the thickness of the coating film (3) is greater than the thickness of the metal layer (4).
4. The method of claim 1, wherein the metal layer thickness is measured during the manufacture of the package carrier, wherein: in the step S1, the position of the test block is selected by a nine-point method or a five-point method.
5. The method for testing the thickness of a metal layer in the production of a package carrier according to claim 1 or 4, wherein: in the step S1, the size of the test block is (0.5X1) mm 2 ～(1×2)mm 2 。
6. The method of claim 1, wherein the metal layer thickness is measured during the manufacture of the package carrier, wherein: in the step S2, the coating film (3) is disposed at a plurality of intervals.
7. The method of claim 1, wherein the metal layer thickness is measured during the manufacture of the package carrier, wherein: the metal is copper.
8. The method for testing the thickness of a metal layer in the production of a package carrier according to claim 1 or 7, wherein: the preparation is electroplating, deposition or sputtering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310823699.0A CN116994972A (en) | 2023-07-05 | 2023-07-05 | Method for testing thickness of metal layer in production of packaging carrier plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310823699.0A CN116994972A (en) | 2023-07-05 | 2023-07-05 | Method for testing thickness of metal layer in production of packaging carrier plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116994972A true CN116994972A (en) | 2023-11-03 |
Family
ID=88522279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310823699.0A Pending CN116994972A (en) | 2023-07-05 | 2023-07-05 | Method for testing thickness of metal layer in production of packaging carrier plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116994972A (en) |
-
2023
- 2023-07-05 CN CN202310823699.0A patent/CN116994972A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101697001B (en) | Method for detecting positional deviation among layers of multilayer printed circuit board | |
| KR20210151245A (en) | Metal sheet, method for manufacturing metal sheet, and method for manufacturing vapor deposition mask using metal sheet | |
| CN102866576B (en) | Mask plate group and method for determining alignment precision range by using mask plate group | |
| CN109561605A (en) | A kind of multi-layer board presses grasping means and the preparation method of sandwich plate of harmomegathus data | |
| CN102036511A (en) | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards | |
| CN108925066B (en) | multilayer board interlayer offset detection method and detection system | |
| CN100527375C (en) | Testing wafer and testing method for edge bead removal | |
| CN103383330B (en) | The method for making of material cured Tachistoscope system, method of testing and welding resisting layer | |
| CN111642079B (en) | Screen printing method and preparation method of flexible circuit board and flexible circuit board | |
| CN110719697A (en) | PCB etching uniformity detection and adjustment method | |
| CN103697907B (en) | A kind of high-precision calibrating plate for camera parameter demarcation and preparation method thereof | |
| CN108417562A (en) | Overlay mark and its reliability verification method | |
| CN116994972A (en) | Method for testing thickness of metal layer in production of packaging carrier plate | |
| CN111721255A (en) | Flatness detection method and system | |
| CN108982178B (en) | Preparation method of galvanized steel sheet standard sample | |
| CN112188732A (en) | Manufacturing method of medical instrument detection plate | |
| CN202284948U (en) | Simple measurement device for printed circuit board (PCB) film expansion and contraction value | |
| WO2018123407A1 (en) | Glass substrate inspection method and manufacturing method | |
| CN211090107U (en) | PCB circuit board with etching homogeneity detects | |
| CN215810765U (en) | Circuit board uniformity measuring tool | |
| CN112654159A (en) | Method for automatically supplementing and correcting film | |
| CN109373965B (en) | Three-axis 60-degree strain sensor pasting device and method suitable for strain measurement | |
| CN103203976B (en) | A kind of printing Three-dimensional mask plate | |
| CN113534612B (en) | Rapid method for detecting flatness of high-precision lead frame material for etching | |
| CN219495031U (en) | Precision detection jig for target punching machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |