CN102866576B - Mask plate group and method for determining alignment precision range by using mask plate group - Google Patents

Mask plate group and method for determining alignment precision range by using mask plate group Download PDF

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Publication number
CN102866576B
CN102866576B CN201210308956.9A CN201210308956A CN102866576B CN 102866576 B CN102866576 B CN 102866576B CN 201210308956 A CN201210308956 A CN 201210308956A CN 102866576 B CN102866576 B CN 102866576B
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mark
square
mask plate
alignment mark
alignment
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CN102866576A (en
Inventor
张玉虎
汪雄
王军帽
李丽丽
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei BOE Optoelectronics Technology Co Ltd
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Abstract

The invention discloses a mask plate group and a method for determining the alignment precision range by using a mask plate group. The method comprises the following steps of: transferring at least one first mark on a first mask plate to a first layer, needing to be aligned, of a display substrate to form at least one first alignment mark by exposing; transferring at least one second mark on a second mask plate to the current layer, which is required to be aligned, of the display substrate to form at least one second alignment mark corresponding to the first alignment mark by exposing, wherein the second alignment mark comprises a square; and determining the alignment precision range of current lithography according to the positions of the square of the second alignment mark, the square of the first alignment mark, and a plurality of patterns in the same shape and different sizes. By the method, the lithographic alignment precision range can be determined when a measurement coordinate system cannot be established or a measurement tool cannot measure accurately; and further, whether the lithographic alignment precision meets a standard can be judged.

Description

A kind of mask plate group and using mask plate group are determined the method for aligning accuracy scope
Technical field
The present invention relates to photoetching process, relate in particular to a kind of mask plate group and using mask plate group and determine the method for aligning accuracy scope.
Background technology
Photoetching is, by series of steps such as aligning, exposures, mask graph is transferred to for example, technological process on display panel (array base palte, color membrane substrates), conventionally need on display base plate, carry out multilayer photoetching, each layer of each layer pattern that need to carry out needing contraposition to form with guarantee between the rete of photoetching meets the requirement of craft precision, for the repeatedly photoetching of different layers, how to ensure that aligning accuracy is between layers one of key issue of photoetching process, aligning accuracy is the position alignment error that needs layer with the litho pattern of layer of contraposition on display panel.
In order to measure the photoetching aligning accuracy of two interlayers, need in testing apparatus, set up coordinate system, determine by measuring contraposition box mark whether aligning accuracy suits the requirements.But in actual production, the situation that there will be measuring equipment to measure, such as the surface of lithography layer has concavo-convex or has a contraposition box mark excalation that many levels or other reason cause or unclear, thereby cause can not be promptly and accurately to the aligning accuracy in process of producing product measurement, progress and yields that impact is produced.
Summary of the invention
The object of this invention is to provide a kind ofly in the situation that measuring equipment cannot be measured, determine the whether satisfactory mask plate group of photoetching aligning accuracy and apply this mask plate group the method for determining aligning accuracy scope.
The object of the invention is to be achieved through the following technical solutions, a kind of mask plate group, comprising:
The first mask plate of same specification and at least one second mask plate;
On described the first mask plate, be provided with at least one first mark, described the first mark comprises the pattern that is square and the interior multiple shapes centered by square center of square are identical but vary in size;
On described the second mask plate, be provided with at least one second mark, described the second mark is corresponding with the first mark on the first mask plate,, described the second mark comprises a square, the square of described the second mark is less than the square of described the first mark; And in the same coordinate system, the foursquare center of described the second mark is identical with the coordinate at the foursquare center of described the first mark.
And then a kind of method of applying above-mentioned mask plate group and determining aligning accuracy scope is provided, step is as follows:
By exposure, described at least one first mark on described the first mask plate is transferred on the ground floor that needs contraposition on display base plate and forms at least one first alignment mark, described the first alignment mark comprises the pattern that is square and the interior multiple shapes centered by square center of square are identical but vary in size;
By exposure, the second mark of described at least one the second mask plate is transferred to and on display base plate, needed the current layer of contraposition to form second alignment mark corresponding with described the first alignment mark, described the second alignment mark comprises a square;
According to the square of the square of described the second alignment mark and described the first alignment mark identical with multiple shape but vary in size the aligning accuracy scope of the current photoetching of location positioning.
The embodiment of the present invention obtains following beneficial effect: measure coordinate system or survey instrument cannot Measurement accuracy in the situation that cannot set up, can determine the scope of photoetching aligning accuracy, further can also whether meet standard to photoetching aligning accuracy and determine.
Brief description of the drawings
Figure 1A is the first mask plate schematic diagram in a kind of mask plate group of the embodiment of the present invention;
Figure 1B is the second mask plate schematic diagram in a kind of mask plate group of the embodiment of the present invention;
Fig. 2 is the first mark enlarged diagram of the embodiment of the present invention the first mask plate;
Fig. 3 is the second mark enlarged diagram of the embodiment of the present invention the second mask plate;
Fig. 4 is another embodiment of the present invention the first mask plate schematic diagram;
Fig. 5 A is another embodiment of the present invention the second mask plate schematic diagram;
Fig. 5 B is another the second mask plate schematic diagram of another embodiment of the present invention;
Fig. 5 C is another the second mask plate schematic diagram of another embodiment of the present invention;
Fig. 6 is the method flow diagram of a kind of definite aligning accuracy scope of the embodiment of the present invention;
Fig. 7 A is the enlarged diagram that in the method for a kind of definite aligning accuracy scope of the embodiment of the present invention, the second alignment mark is offset in the first alignment mark;
A kind of the second alignment mark enlarged diagram in Fig. 7 B embodiment of the present invention;
Fig. 8 is the enlarged diagram that in the another kind of method of determining aligning accuracy scope of the embodiment of the present invention, the second alignment mark is offset in the first alignment mark.
Embodiment
Below in conjunction with Figure of description, the embodiment of the present invention is elaborated.
As first technical scheme of the present invention, mask plate group, comprising:
The first mask plate of same specification and at least one second mask plate;
On the first mask plate, be provided with at least one first mark, the first mark comprises the pattern that is square and the interior multiple shapes centered by square center of square are identical but vary in size;
On the second mask plate, be provided with at least one second mark, the second mark is corresponding with the first mark on the first mask plate, and the second mark comprises a square, and the square of the second mark is less than the square of the first mark; And in the same coordinate system, the foursquare center of the second mark is identical with the coordinate at the foursquare center of the first mark.
Multiple shapes are identical but the pattern that varies in size can be concentric circles, and square and other are convenient to the pattern of contraposition.
As second technical scheme of the present invention, on the basis of first technical scheme, the multiple identical patterns centered by square center are preferably the multiple concentric circless taking square center as the center of circle.
Following drawings and Examples all describe with concentric circles, but it is similar to concentric circles to utilize other identical patterns to carry out the method for aligning accuracy, such as square, but because the second alignment mark be also square, if by equipment observe may cause identifying unclear.
The 3rd technical scheme of the present invention, on the basis of above-mentioned arbitrary technical scheme, while being provided with a plurality of the first mark, is provided with second mark corresponding with one of them position of the first mark on the first mask plate on the second mask plate.
Certainly, as first technical scheme of the present invention, can be provided with first mark on the first mask plate, the second mark on the second mask plate all carries out contraposition with this first mark; Or first have two the first marks on mask plate, second mark and a first mark contraposition on three the second mask plates, all the other two second marks and another the first mark carry out respectively contraposition, be understandable that, the second mark alignment mode on a plurality of the first marks and a plurality of the second mask plate can have various arrangement, in this not explanation one by one.
As the 4th technical scheme of the present invention, on the basis of above-mentioned arbitrary technical scheme, the multiple concentrically ringed radius of the first mark as required architectural characteristic between the rete of contraposition is determined, the wherein square inscribe of the concentric circles of radius maximum and the first mark.
Architectural characteristic between the rete in the technical program refers to that rete forms the needed aligning accuracy of pattern and determines multiple concentrically ringed radiuses, such as form via hole on array base palte time, the aligning accuracy needing requires very high, if the foursquare length of side of the first mark is 2a, being positioned at concentric circles radius tangent with it within square is a, now can multiple concentrically ringed maximum radius be set to a/4, with the aligning accuracy requirement that meets the demands strict.
As the 5th technical scheme of the present invention, on the basis of above-mentioned arbitrary technical scheme, the concentrically ringed radius of the minimum of the first mark equals the foursquare circumradius of the second mark.
As the 6th technical scheme of the present invention, on the basis of above-mentioned arbitrary technical scheme, the second mask plate has N, and the second mark on each the second mask plate is corresponding one by one with the N in diverse location the first mark on the first mask plate; Wherein, N >=1.
As the 7th technical scheme of the present invention, on the basis of above-mentioned arbitrary technical scheme, the feature of N the first mark is identical.
As the 8th technical scheme of the present invention, a kind of method of utilizing the mask plate of above-mentioned arbitrary technical scheme to determine aligning accuracy scope, by exposure, at least one first mark on the first mask plate is transferred on the ground floor that needs contraposition on display base plate and forms at least one first alignment mark, the first alignment mark comprises the pattern that is square and the interior multiple shapes centered by square center of square are identical but vary in size;
By exposure, the second mark of at least one the second mask plate is transferred to and on display base plate, needed the current layer of contraposition to form second alignment mark corresponding with the first alignment mark, the second alignment mark comprises a square;
According to the aligning accuracy scope of the current photoetching of location positioning of the square of the square of the second alignment mark and the first alignment mark and multiple identical patterns.
As the 9th technical scheme of the present invention, on the basis of the 8th technical scheme, multiple identical patterns are the multiple concentric circless taking square center as the center of circle.
As the of the present invention ten technical scheme, on the basis of the 8th or the 9th technical scheme, according to the square of the square of the second alignment mark and the first alignment mark and multiple concentrically ringed location positioning photoetching aligning accuracy scope, comprising:
Judge that the square of the second alignment mark is in the offset direction at the square center of the first alignment mark with respect to correspondence; Foursquare two limits of the square center of determining the first alignment mark corresponding on offset direction distance the second alignment mark farthest, the multiple concentrically ringed position of the first alignment mark according to two limits in correspondence, obtains the aligning accuracy scope of current photoetching.
As the of the present invention ten technical scheme, on the basis of the 9th technical scheme, further comprise:
If the square of the second alignment mark exceeds the square scope of the first corresponding alignment mark, the aligning accuracy scope of current photoetching is undesirable;
If the square of the second alignment mark does not exceed the square scope of the first corresponding alignment mark, and the aligning accuracy scope obtaining within the limits prescribed, the aligning accuracy scope of current photoetching meets the requirements.
Below in conjunction with Figure of description, the concentric circles of knowing multiple different radiis taking bag in the square of the first alignment mark is elaborated as example.
First embodiment of the invention provides a kind of mask plate group, as shown in FIG. 1A and 1B, comprising:
First mask plate 10 and at least one second mask plate 20;
On the first mask plate, be provided with at least one first mark 11, at least one first mark 11 comprises the multiple concentric circless taking square center as the center of circle in a square and square;
On at least one second mask plate 20, be provided with second mark 21 corresponding with at least one the first mark 11 position, the second mark 21 comprises a square, the square of the second mark is less than the square of at least the first mark 11, in the same coordinate system, the foursquare center of the second mark 21 is identical with the coordinate at the foursquare center of the first corresponding mark 11.
As shown in Figure 2, be the enlarged diagram of the first mark, comprise square 110, the concentric circles 111 of radius maximum and the concentric circles 112 of radius minimum; Wherein, the concentric circles 111 of radius maximum is the incircle of square 110, between the concentric circles 112 of radius minimum and the concentric circles 111 of radius maximum, also have multiple concentric circless, above multiple concentrically ringed radiuses can be determined by the Changing Pattern of setting, not illustrate one by one at this.
As shown in Figure 3, be the second mark enlarged diagram, comprise square 210.
In a preferred embodiment, the radius of the concentric circles 112 of radius minimum equals the circumradius of the square 210 of the second mark 21.
In actual production, can determine according to the region of the size of display panel and the reserved alignment mark of periphery the proportionate relationship of the length of side of square 110 of the first mark 11 and the length of side of the square 210 of the second mark 21, for example, the length of side of the square 110 of the first mark 11 is 2 times of the length of side of the square 210 of the second mark 21.
In another preferred embodiment, the second mask plate has N, and the second mark on each the second mask plate is corresponding one by one with the N in diverse location the first mark on the first mask plate; Wherein N is integer and N >=1, and further, the feature of N the first mark is identical.
Second embodiment of the invention provides a kind of mask plate group, as shown in Fig. 4, Fig. 5 A to Fig. 5 C, comprising:
The first mask plate 10, comprises the first mark 11, the first mark 12 and the first mark 13;
The second mask plate 20,30 and 40, comprises respectively the second mark 21, the second mark 31 and the second mark 41;
The first mark 11, the first mark 12 and the first mark 13 are distributed in the diverse location of the first mask plate 10, and comprise the multiple concentric circless taking square center as the center of circle in a square and square;
The second mark 21,31 and 41 is corresponding respectively with the first mark 11,12 and 13;
In the same coordinate system, the first mark 11,12 is identical with the foursquare coordinate of the second mark 21,31 and 41 respectively with 13 foursquare center.
According to the situation of practical application, the foursquare live width of the square to the first mark and concentric circles and the second mark specifies, to adapt to the needs of different photoresists or photoetching process simultaneously; Further, the square of the second mark can be designed to solid square, to more easily distinguish.
Third embodiment of the invention provides a kind of method of definite aligning accuracy scope, and as shown in Figure 6, step is as follows:
Step S101, by exposure, at least one first mark on the first mask plate is transferred on the ground floor of photoetching and forms at least one first alignment mark, at least one first alignment mark comprises the multiple concentric circless taking square center as the center of circle in a square and square.
Step S102, the current layer of the second mark of at least one the second mask plate being transferred to photoetching by exposure forms second alignment mark corresponding with at least one first alignment mark, and the second alignment mark comprises a square.
Step S103, according to the aligning accuracy scope of the square of the square of the second alignment mark and at least one the first alignment mark and the current photoetching of multiple concentrically ringed location positioning.
Wherein, according to the square of the square of the second alignment mark and at least one the first alignment mark and multiple concentrically ringed location positioning photoetching aligning accuracy scope, comprising:
Judge that the square of the second alignment mark is in the offset direction at the square center of at least one the first alignment mark with respect to correspondence; Foursquare two limits of the square center of determining at least one the first alignment mark corresponding on offset direction distance the second alignment mark farthest, the multiple concentrically ringed position of at least one the first alignment mark according to two limits in correspondence, obtains the aligning accuracy scope of current photoetching.
Further also comprise: if the square of the second alignment mark exceeds the square scope of at least one corresponding the first alignment mark, the aligning accuracy scope of current photoetching is undesirable;
If the square of the second alignment mark does not exceed the square scope of at least one corresponding the first alignment mark, and the aligning accuracy scope obtaining within the limits prescribed, the aligning accuracy scope of current photoetching meets the requirements.
The embodiment of the present invention obtains following beneficial effect: measure coordinate system or survey instrument cannot Measurement accuracy in the situation that cannot set up, can determine the scope of photoetching aligning accuracy, further can also whether meet standard to photoetching aligning accuracy and determine.
Fourth embodiment of the invention provides a kind of method of definite aligning accuracy scope, and in conjunction with Fig. 4 to Fig. 5 C, the contraposition process of a kind of mask plate group of application the present invention being carried out to photoetching is specifically described, and step is as follows:
Step 1, according to the first mask plate 10 as shown in Figure 4, forms three the first alignment marks corresponding to the first mark 11, the first mark 12 and the first mark 13 at the ground floor of the substrate that needs photoetching after exposure.
Step 2, according to the second mask plate 20,30 and 40 as shown in Figure 5 A to FIG. 5 C, forms the second alignment mark of corresponding the second mark 21,31 and 41 successively at second to four layer of substrate that needs photoetching after exposure.
Step 3, the first alignment mark obtaining according to above-mentioned steps and the second alignment mark are determined the aligning accuracy scope of every one deck contraposition.
Any one group in the first contraposition marking obtaining taking the present embodiment the first two step and the second alignment mark describes step 3 as example, as follows:
Be the enlarged diagram that the second alignment mark is offset in the first alignment mark as shown in Figure 7 A, the first alignment mark comprises the multiple concentric circless taking square center as the center of circle in a square 510 and square 510, the wherein concentric circles 511 of radius maximum, and radius is r n; The concentric circles 512 of radius minimum, radius r 0; , multiple concentrically ringed radiuses are r 0to r n(r n>r 0, n=1,2,3....).
Wherein, the radius r of the concentric circles 512 of radius minimum 0equal the circumradius of the square 610 of the second alignment mark;
The length of side of the square 510 of the first alignment mark is 2 times of the length of side of the square 610 of the second alignment mark.
Step 3 specifically comprises: the aligning accuracy scope according to the square 510 of the square 610 of the second alignment mark and the first alignment mark and the current photoetching of multiple concentrically ringed location positioning:
Method of the present invention judges aligning accuracy scope: the square 610 that judges the second alignment mark is upper right side in the offset direction at square 510 centers of the first alignment mark with respect to correspondence; The second alignment mark is considered as to a point in the situation that coincidence measurement requires, now by the concentrically ringed radius r of radius minimum 0also be considered as 0.In this enforcement, along offset direction, get the summit A at angle farthest of decentering O of the square 610 of the second alignment mark as the references object of determining aligning accuracy scope, determine that the scope of the transverse and longitudinal coordinate with respect to center O that A orders can be determined aligning accuracy scope.The horizontal ordinate of ordering with A due to the horizontal ordinate of the point on the limit a1 of square 610 is identical, therefore can be by estimating limit a1 or B point (wherein B point is the summit at an angle of the square 610) coordinate figure with respect to center O in X-direction, determine the abscissa value that A is ordered, shown in Fig. 7 A, can obtain limit a1 or B point in X-direction with respect to the coordinate figure of center O for being positioned at r n-1~r nbetween; The ordinate of ordering with A due to the ordinate of the point on the limit b1 of square 610 is identical, therefore can be by estimating limit b1 or C point (wherein C point is the summit at an angle of the square 610) coordinate figure with respect to center O in Y direction, determine the ordinate value of some A, shown in Fig. 7 A, can obtain limit b1 or C point in Y direction with respect to the coordinate figure of center O for being positioned at r n-2~r n-1between.Can obtain from above, the relative center O of A point deviation range on offset direction, the second alignment mark is offset to upper right, and aligning accuracy scope is that lateral excursion is at r n-1~r nin scope, vertical misalignment is at r n-2~r n-1in scope.
It should be noted that the square of the second alignment mark 610 depending on doing a point, be in the situation that coincidence measurement requires.Simultaneously due to by the square of the second alignment mark 610 depending on doing a point, and get in the present embodiment the summit A at angle farthest of decentering O of the square 610 of the second alignment mark as the references object of determining aligning accuracy scope, therefore, the value of actual shifts is less than the value being offset in aligning accuracy scope obtained in the present embodiment.
Square 610 for the second alignment mark has following explanation: the second alignment mark forming in the present embodiment comprises a solid square 610, concrete enforcement can be according to circumstances to square change, example as shown in Figure 7 B, get the nonoverlapping part structure of square of two identical central, different area, comprising square 710, square 711, the two not lap be 712 i.e. two part structures that facing product moment is represented, the object of this kind of square _type layout is under cost or particular surroundings, to carry out contraposition in order to save.
Above aligning accuracy scope be the present embodiment with reference to the accompanying drawings the skew of relative the first alignment mark of the second alignment mark shown in 7A obtain, aligning accuracy scope obtained above is not fixed, in actual production, can choose as required other point on the square of the second alignment mark as with reference to object, further can different aligning accuracy range criterion be set according to different reference point, so that measure by different reference point.
As described above, in the time implementing this method and in the final calculating of determining aligning accuracy scope, by the concentrically ringed radius r of radius minimum 0and the foursquare length of side of the second alignment mark is considered as 0, the square of the concentric circles of radius minimum and the second alignment mark is all considered as a point; Now can be as required in allowed band, use flexibly method of the present invention to determine aligning accuracy scope.Such as, whether the object of measuring aligning accuracy scope is just qualified in order to determine photoetching, do not need numerical range accurately, according to the embodiment of the present invention, on the second alignment mark offset direction and apart from the angle of the foursquare central point distal-most end of the first alignment mark, determine aligning accuracy scope as the point of skew, in this case, the skew obtaining and aligning accuracy value range can be greater than actual value, but we can predict, if what this was larger is worth within the limits prescribed, the aligning accuracy of so real photoetching must be qualified.
Further step three also comprises: if the square 610 of the second alignment mark exceeds the scope of the square 510 of the first corresponding alignment mark, the aligning accuracy scope of current photoetching is undesirable;
If the square 610 of the second alignment mark does not exceed square 510 scopes of the first corresponding alignment mark, and the aligning accuracy scope obtaining within the limits prescribed, the aligning accuracy scope of current photoetching meets the requirements.
Certainly, in actual production, also may there is other situation, during such as the position relative tilt of the second alignment mark and the first alignment mark and in producing, allow this situation to occur.Be illustrated in figure 8 the enlarged diagram that the second alignment mark is offset in the first alignment mark, the first alignment mark comprises the multiple concentric circless taking square center as the center of circle in a square 510 and square 510, the wherein concentric circles 511 of radius maximum, and radius is r n; The concentric circles 512 of radius minimum, radius r 0; , multiple concentrically ringed radiuses are r 0to r n(r n>r 0, n=1,2,3....).Now aligning accuracy scope is just like judging:
Because the square 810 of the second alignment mark is inclination, therefore obtain in conjunction with the point on it coordinate range that A orders according to square 810 limit a1 and b1 inappropriate, but at this, we should be noted that, in aforementioned content, point out, the square of the second alignment mark is considered as a point, because whether tilt for point unimportant.We are tentatively judging that the square 810 of the second alignment mark does not exceed after the scope of the first alignment mark, still can obtain the coordinate that A is ordered according to B point and C point coordinate.Although the value obtaining in the situation that the A point coordinate obtaining according to Fig. 8 and the square of the second alignment mark do not tilt has certain deviation, but square 810 is being considered as under the prerequisite of a point, deviation in a tolerance interval allows, and this can be depending on practical condition.Based on above basis, we obtain obtaining B point in X-direction with respect to the coordinate figure of center O for being positioned at r n-2~r n-1between; C point in Y direction with respect to the coordinate figure of center O for being positioned at r n-2~r n-1between.Can obtain from above, the relative center O of A point deviation range on offset direction, the second alignment mark is offset to upper right, and aligning accuracy scope is that lateral excursion is at r n-2~r n-1in scope, vertical misalignment is at r n-2~r n-1in scope.
Obviously,, in the time comprising other figure in the square of the first alignment mark, those skilled in the art can implement according to above embodiments of the invention, do not exemplify one by one at this.
The embodiment of the present invention obtains following beneficial effect: measure coordinate system or survey instrument cannot Measurement accuracy in the situation that cannot set up, can determine the scope of photoetching aligning accuracy, further can also whether meet standard to photoetching aligning accuracy and determine.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention the present invention.Like this, if these amendments of the present invention and within modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these changes and modification interior.

Claims (6)

1. a mask plate group, is characterized in that, comprising:
The first mask plate of same specification and at least one second mask plate;
On described the first mask plate, be provided with at least one first mark, described the first mark comprises the multiple concentric circless taking square center as the center of circle in a square and square;
On described the second mask plate, be provided with at least one second mark, described the second mark is corresponding with the first mark on described the first mask plate, and described the second mark comprises a square, and the square of described the second mark is less than the square of described the first mark; And in the same coordinate system, the foursquare center of described the second mark is identical with the coordinate at the foursquare center of described the first mark;
Wherein, described multiple concentrically ringed radiuses of described the first mark as required architectural characteristic between the rete of contraposition are determined, the square inscribe of the concentric circles of radius maximum and described the first mark, minimum concentrically ringed radius equals the foursquare circumradius of described the second mark.
2. mask plate group as claimed in claim 1, is characterized in that, while being provided with a plurality of the first mark, is provided with second mark corresponding with one of them position of described the first mark on described the second mask plate on described the first mask plate.
3. mask plate group as claimed in claim 2, is characterized in that, described the second mask plate has N, and described the second mark on each the second mask plate is corresponding one by one with individual the first mark of the N in diverse location on described the first mask plate; Wherein, N >=1.
4. mask plate group as claimed in claim 3, is characterized in that, the feature of described N the first mark is identical.
5. utilize mask plate group as claimed in claim 1 to determine a method for aligning accuracy scope, it is characterized in that, comprise the steps:
By exposure, described at least one first mark on described the first mask plate is transferred on the ground floor that needs contraposition on display base plate and forms at least one first alignment mark, described the first alignment mark comprises the multiple concentric circless taking square center as the center of circle in a square and square;
By exposure, the second mark of described at least one the second mask plate is transferred to and on display base plate, needed the current layer of contraposition to form second alignment mark corresponding with described the first alignment mark, described the second alignment mark comprises a square;
Judge that the square of described the second alignment mark is in the offset direction at the square center of described the first alignment mark with respect to correspondence; Foursquare two limits of the square center of determining on described offset direction described the first alignment mark corresponding described in distance described the second alignment mark farthest, the multiple concentrically ringed position of described the first alignment mark according to two limits in correspondence, obtains the aligning accuracy scope of current photoetching.
6. method as claimed in claim 5, is characterized in that, further comprises:
If the square of described the second alignment mark exceeds the square scope of corresponding described the first alignment mark, the aligning accuracy scope of current photoetching is undesirable;
If the square of described the second alignment mark does not exceed the square scope of corresponding described the first alignment mark, and the aligning accuracy scope obtaining within the limits prescribed, the aligning accuracy scope of current photoetching meets the requirements.
CN201210308956.9A 2012-08-27 2012-08-27 Mask plate group and method for determining alignment precision range by using mask plate group Active CN102866576B (en)

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