CN116980049A

CN116980049A - Optical receiving assembly, manufacturing method, bidirectional optical assembly and optical network equipment

Info

Publication number: CN116980049A
Application number: CN202210432182.4A
Authority: CN
Inventors: 操日祥; 王泽林; 黄利新
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-04-22
Filing date: 2022-04-22
Publication date: 2023-10-31

Abstract

The disclosure provides an optical receiving assembly, a manufacturing method, a bidirectional optical assembly and optical network equipment, and belongs to the technical field of optical communication. The light receiving assembly includes a base, a photoelectric conversion device, and a housing. The first side of the base is fixed with the photoelectric conversion device, and the second side of the base is provided with a first bonding pad which is electrically connected with the photoelectric conversion device and is used for being electrically connected with the receiving circuit. The shell is formed by solidification, the shell comprises an encapsulation part and a lens part, the encapsulation part is fixed with the first side of the base and wraps the photoelectric conversion device, and the lens part is used for focusing the optical signal to the photoelectric conversion device. On the one hand, the light receiving component is simpler and more convenient to manufacture due to the adoption of the shell formed by curing. On the other hand, since the structure of the light receiving assembly for connecting the receiving circuit is a pad, the light receiving assembly and the receiving circuit can be electrically connected using an SMT patch process, thereby improving the mounting efficiency of the light receiving assembly.

Description

Optical receiving assembly, manufacturing method, bidirectional optical assembly and optical network equipment

Technical Field

The disclosure relates to the technical field of optical communication, and in particular relates to an optical receiving assembly, a manufacturing method, a bidirectional optical assembly and optical network equipment.

Background

An optical receiving assembly (ROSA) is an indispensable device in an optical network apparatus, for converting a received optical signal into an electrical signal and outputting the electrical signal to a peripheral receiving circuit.

The light receiving assembly in the related art generally includes a stem, a photoelectric conversion device, a metal cap, and a glass lens. The tube base is provided with a pin, and the photoelectric conversion device is fixed on the tube base and is electrically connected with the pin. The photoelectric conversion device is used for converting an optical signal into an electrical signal, and the pins are used for outputting the electrical signal to a peripheral circuit. The metal tube cap is fixed on the tube seat, and plays a role in protecting the photoelectric conversion device. The glass lens is fixed on the metal pipe cap and used for focusing the optical signals on the photoelectric conversion device.

However, in manufacturing the light receiving assembly, it is necessary to manufacture a glass lens using glass, weld the glass lens to a metal cap, and then weld the metal cap to a stem, and the manufacturing process is very complicated.

Disclosure of Invention

The present disclosure provides a light receiving assembly, a manufacturing method, a bidirectional light assembly, and an optical network device, in which a housing of the light receiving assembly is cured and formed, so that the manufacturing of the light receiving assembly is simpler and more convenient. In addition, the structure of the light receiving component for connecting the receiving circuit is a bonding pad, so that the light receiving component and the receiving circuit can be electrically connected by adopting a surface mount technology (surface mount technology, SMT) bonding process, and the mounting efficiency of the light receiving component is improved. The following describes the technical scheme provided in the present disclosure:

In a first aspect, the present disclosure provides a light receiving assembly including a base, a photoelectric conversion device, and a housing. The first side of the base is fixed with the photoelectric conversion device, the second side of the base is provided with a first bonding pad, and the first bonding pad is electrically connected with the photoelectric conversion device and is used for being electrically connected with a receiving circuit, wherein the first side and the second side are opposite to each other. The shell is formed by solidification, the shell comprises an encapsulation part and a lens part, the encapsulation part is fixed with the first side of the base and wraps the photoelectric conversion device, and the lens part is used for focusing optical signals to the photoelectric conversion device.

Wherein, the base is used for supporting and fixing the photoelectric conversion device. The base may be a printed circuit board (printed circuit board, PCB), a metal component, a ceramic component, or the like. The second side of the mount has a first pad electrically connected to the photoelectric conversion device, so that an electric signal output from the photoelectric conversion device can be output to the receiving circuit via the first pad.

The photoelectric conversion device is used for converting an optical signal into an electrical signal and outputting the electrical signal to the receiving circuit via the first pad. The present disclosure is not limited in the type of photoelectric conversion device, and for example, the photoelectric conversion device includes a photoelectric conversion unit and a transimpedance amplifier (trans-impedance amplifier, TIA). The photoelectric conversion unit is electrically connected with the transimpedance amplifier, and the transimpedance amplifier is electrically connected with the first bonding pad. The photoelectric conversion unit is used for converting the optical signal into an electric signal and outputting the electric signal to the transimpedance amplifier. The transimpedance amplifier amplifies the electrical signal and transmits the signal to the receiving circuit via the first pad. In one possible implementation, the photoelectric conversion unit is a Photodiode (PD) or an avalanche photodiode (avalanche photon diode, APD) or the like.

The shell is solidified and formed, so that the manufacturing flow of the shell is simple. In one possible implementation, the housing is integrally cured from a cured material on the base to which the photoelectric conversion device is fixed. The shell is fixedly connected with the base while being solidified and formed, the packaging part of the shell can tightly wrap the photoelectric conversion device, and a gap is not formed between the packaging part and the photoelectric conversion device. The curing formation may also be written as curing formation.

According to the technical scheme, on one hand, the shell of the light receiving component is formed by solidification, so that the manufacturing process of the shell is greatly simplified, and the light receiving component is simpler and more convenient to manufacture.

On the other hand, because the base is provided with the first bonding pad, the first bonding pad is electrically connected with the photoelectric conversion device, and therefore, when the light receiving component is electrically connected with the receiving circuit, an SMT (surface mounted technology) patch process can be adopted, and the installation efficiency of the light receiving component is improved.

In one possible implementation, the housing is integrally cured from a cured material on the base to which the photoelectric conversion device is fixed.

In one possible implementation manner, one end of the packaging part is fixed with the base, and the other end of the packaging part is integrally connected with the lens part. The lens portion is opposed to the photoelectric conversion device.

In one possible implementation, the central axis of the encapsulation portion and the central axis of the lens portion coincide.

In one possible implementation, the encapsulation includes a first encapsulation portion and a second encapsulation portion. The first packaging part is fixed with the base, and the second packaging part is integrally connected with the lens part. The outer diameter of the first encapsulation portion is greater than the outer diameter of the second encapsulation portion.

According to the technical scheme, when the light receiving assembly is connected with the seat body shell of the seat body of the bidirectional light assembly, the second packaging part stretches into the seat body shell, and ultraviolet glue is filled between the inner wall of the seat body shell and the side wall of the second packaging part. The end of the housing body may abut against the first encapsulation portion.

Since the ultraviolet glue is solidified by irradiation of ultraviolet light, the ultraviolet light can be irradiated around the light receiving assembly, and then the ultraviolet light is incident between the inner wall of the housing of the seat and the side wall of the second housing via the side part of the first housing part, so that the ultraviolet glue is solidified under irradiation of the ultraviolet light, and the second housing part and the housing of the seat are bonded together.

In one possible implementation, the first and second package portions are coaxial.

According to the technical scheme, the first packaging part and the second packaging part are coaxial, so that when the light receiving assembly and the seat body shell are fixed, whether the second packaging part and the lens part are coaxial with the seat body shell or not can be determined by observing whether the first packaging part is coaxial with the seat body shell or not.

In one possible implementation, the housing is cured from any of the following materials: resins, plastics and low temperature glass.

In one possible implementation, the lens portion has a spherical lens structure or an aspherical lens structure.

In one possible implementation, the submount further has a second pad and a third pad. The second bonding pad is positioned on the second side of the base and is used for being electrically connected with the emission driving circuit. The third bonding pad and the second bonding pad are positioned on different sides of the base, the third bonding pad is electrically connected with the second bonding pad, and the third bonding pad is used for being electrically connected with a pin of the optical transmission component.

The second bonding pad can be electrically connected with the emission driving circuit in a welding or bonding mode and the like, and the third bonding pad can be electrically connected with a pin of the optical transmission assembly in a welding or bonding mode and the like.

According to the technical scheme, the second bonding pad and the third bonding pad which are electrically connected are arranged, and the third bonding pad is used for being electrically connected with the pin of the optical transmission assembly, so that the structure of the optical transmission assembly, which is electrically connected with the emission driving circuit, is converted into the bonding pad structure by the pin structure, and the bidirectional optical assembly can be electrically connected with the peripheral circuit by adopting an SMT (surface mount technology) process, and the mounting efficiency of the bidirectional optical assembly is improved.

In one possible implementation, the first pad and the second pad are located on the same plane.

In one possible implementation, the third pad is located on the first side of the mount. That is, the second pad and the third pad are located on opposite sides of the chassis.

In one possible implementation, the base includes a first base portion and a second base portion. The first mount portion has the first pad and is fixed to the photoelectric conversion device and the housing. The second mount portion has the second pad and the third pad.

Wherein the first and second base portions may be metal components, ceramic components or PCBs.

In one possible implementation, the first side of the second base portion is convex with respect to the first side of the first base portion.

According to the technical scheme, the first side of the second base part protrudes relative to the first side of the first base part, so that when the light receiving component is applied to the bidirectional light component, the third bonding pad of the first side of the second base part is closer to the pin of the light transmitting component, and connection of the pin and the third bonding pad is facilitated.

In one possible implementation, the first base portion and the second base portion are integrally connected.

In one possible implementation manner, the base further includes a connection portion, the connection portion is cured and formed, and two sides of the connection portion are respectively connected with the first base portion and the second base portion.

According to the technical scheme, the first base part and the second base part are connected through the connecting part formed by curing, so that the sizes of the first base part and the second base part can be reduced, and the cost of the base, the light receiving component and the bidirectional light component is reduced.

In one possible implementation, the connection portion and the housing are integrally cured.

In a second aspect, the present disclosure provides a method for manufacturing a light receiving element, the method comprising: and fixing the photoelectric conversion device on a first side of the base, and electrically connecting the photoelectric conversion device with a first bonding pad on a second side of the base, wherein the first side and the second side are opposite. The mount to which the photoelectric conversion device is fixed is placed in a mold. And filling a curing material into the mold, and forming a shell after the curing material is cured, wherein the shell comprises an encapsulation part and a lens part, the encapsulation part is fixed with the first side of the base and wraps the photoelectric conversion device, and the lens part is used for focusing optical signals to the photoelectric conversion device. And (5) carrying out demolding treatment to obtain the light receiving component.

The curing material can be resin, plastic, low-temperature glass or the like. The light receiving element may be a light receiving element as defined in any one of the first aspects.

According to the technical scheme, on one hand, the base fixed with the photoelectric conversion device and the curing material are placed in the die together, and the curing material is integrally cured and formed into the shell on the base, so that the manufacturing flow of the shell and the manufacturing flow of the light receiving component are greatly simplified.

In one possible implementation, the mount has pads for external electrical connection. The demolding treatment is carried out to obtain the light receiving assembly, which comprises the following steps: and (5) carrying out demolding treatment. And exposing the bonding pads on the base to obtain the light receiving component.

The bonding pads at least comprise a first bonding pad, and can also comprise a second bonding pad and a third bonding pad.

According to the technical scheme, the base and the curing material are placed in the die together, so that after the curing material is cured, the bonding pad of the base can be wrapped, and after the bonding pad is required to be electrically connected with the peripheral circuit, the first bonding pad on the base is required to be exposed after demolding treatment is carried out.

In one possible implementation, the cured material at the pads may be removed by mechanical polishing or chemical polishing, or the like, to expose the pads.

In one possible implementation manner, the plurality of the molds are arranged on the platform, the mold is filled with a curing material, and the curing material forms a shell after curing, and the method includes: and filling the platform with a curing material, wherein the curing material flows into each mold from the platform, and the curing material is cured to form an integrated shell, and the integrated shell comprises a plurality of integrally connected shells. The demolding treatment is carried out to obtain the light receiving assembly, which comprises the following steps: and performing demolding treatment, and cutting the integrated shell into a plurality of shells to obtain a plurality of light receiving assemblies.

According to the technical scheme, through the arrangement, a plurality of light receiving assemblies can be manufactured in batches through one-time solidification, and therefore manufacturing efficiency of the light receiving assemblies is improved.

In one possible implementation manner, before the dicing the integrated housing into the plurality of housings, the manufacturing method further includes: and exposing the bonding pads on the base.

In one possible implementation, the mount includes a first mount portion having the first pad and a second mount portion having a second pad and a third pad, the second pad and the third pad being located on different sides of the second mount portion and electrically connected.

In one possible implementation manner, the fixing the photoelectric conversion device on the first side of the base and electrically connecting the photoelectric conversion device with the first pad on the second side of the base includes: the photoelectric conversion device is fixed to a first side of the first base portion and is electrically connected to a first pad of a second side of the first base portion.

In one possible implementation manner, the placing the base to which the photoelectric conversion device is fixed in a mold includes: the second mount portion and the first mount portion to which the photoelectric conversion device is fixed are placed in a mold.

In one possible implementation, the filling the mold with the curing material, where the curing material forms the shell after curing, includes: and filling a curing material into the mold, and forming the shell and the connecting part after the curing material is cured, wherein the shell is fixed with the first base part, and the connecting part is connected with the first base part and the second base part.

According to the technical scheme, the first base part and the second base part are connected together through the solidified material, so that the sizes of the first base part and the second base part can be reduced, and the cost of the base, the light receiving assembly and the bidirectional light assembly is reduced.

In a third aspect, the present disclosure provides a bidirectional optical assembly, including an optical receiving assembly, an optical transmitting assembly, and a base, where the optical receiving assembly is an optical receiving assembly according to any one of the first aspects, and the optical receiving assembly and the optical transmitting assembly are both fixed to the base.

In one possible implementation, the pin of the light transmitting component is electrically connected to the third pad of the base of the light receiving component.

According to the technical scheme, the second bonding pad and the third bonding pad which are connected are arranged on the base of the light receiving component, and the third bonding pad is electrically connected with the pin of the light sending component, so that the structure of the light sending component, which is electrically connected with the emission driving circuit, is converted into the bonding pad structure by the pin structure, and therefore, the bidirectional light component can be electrically connected with the peripheral circuit by adopting an SMT (surface mount technology) process, and the installation efficiency of the bidirectional light component is improved.

In one possible implementation, the bidirectional optical component further includes an optical transmission component mount having a second pad and a third pad, the second pad and the first pad of the mount of the optical reception component facing the same side, the second pad being for electrical connection with the emission drive circuit. The third bonding pad and the second bonding pad are positioned on different sides of the base of the optical transmission assembly, the third bonding pad is electrically connected with the second bonding pad, and a pin of the optical transmission assembly is electrically connected with the third bonding pad.

According to the technical scheme, the base of the optical transmission assembly is additionally arranged, the second bonding pad and the third bonding pad which are connected are arranged on the base of the optical transmission assembly, and the third bonding pad is electrically connected with the pin of the optical transmission assembly, so that the structure of the optical transmission assembly, which is electrically connected with the emission driving circuit, is converted into the bonding pad structure by the pin structure, and the bidirectional optical assembly can be electrically connected with the peripheral circuit by adopting the SMT (surface mount technology), and the mounting efficiency of the bidirectional optical assembly is improved.

In one possible implementation, the receiving optical path of the light receiving assembly and the transmitting optical path of the light transmitting assembly intersect. The third bonding pad and the second bonding pad are opposite in orientation, and the pin of the light transmitting component is bent towards the third bonding pad.

In one possible implementation, the light receiving path of the light receiving assembly is perpendicular to the light transmitting path of the light transmitting assembly.

In a fourth aspect, the present disclosure provides an optical network device comprising an optical receiving assembly according to any one of the first aspects or a bidirectional optical assembly according to any one of the third aspects.

The optical network device may be an optical module, an optical line terminal (optical line terminal, OLT), or an optical network unit (optical network unit, ONU), and the OLT and the ONU may include one or more optical modules.

In one possible implementation, the optical module is a small form-factor pluggable (SFP) optical module or the like.

In a fifth aspect, the present disclosure provides an optical network system, including the optical network device described above.

The optical network system may be any passive optical network (passive optical network, PON) system, for example, a gigabit passive optical network (gig-bit passive optical network, GPON) system, an ethernet passive optical network (ethernet passive optical network, EPON) system, or a 10G-bit passive optical network (10 gig-bit passive optical network,10G PON) system.

The PON system includes an OLT, an optical distribution network (optical distribution network, ODN), and ONUs, and the OLT is connected to a plurality of ONUs provided on a user side through the ODN.

Drawings

FIG. 1 is a schematic diagram of a bi-directional optical assembly in accordance with an embodiment of the present disclosure;

fig. 2 is a schematic cross-sectional view of a light receiving assembly provided by an embodiment of the present disclosure;

fig. 3 is a three-dimensional schematic diagram of a light receiving assembly provided by an embodiment of the present disclosure;

FIG. 4 is a partial schematic view of a bi-directional optical assembly provided by an embodiment of the present disclosure;

fig. 5 is a schematic cross-sectional view of a light receiving assembly provided by an embodiment of the present disclosure;

fig. 6 is a three-dimensional schematic diagram of a light receiving assembly provided by an embodiment of the present disclosure;

fig. 7 is a three-dimensional schematic diagram of a light receiving assembly provided by an embodiment of the present disclosure;

fig. 8 is a schematic cross-sectional view of a light receiving assembly provided by an embodiment of the present disclosure;

fig. 9 is a flowchart of a method for manufacturing a light receiving component according to an embodiment of the present disclosure;

FIG. 10 is a schematic view of a platform and mold provided by an embodiment of the present disclosure;

FIG. 11 is a schematic cross-sectional view of a bi-directional optical module provided by an embodiment of the present disclosure;

FIG. 12 is a three-dimensional schematic of a bi-directional optical assembly provided by an embodiment of the present disclosure;

FIG. 13 is a three-dimensional schematic of a bi-directional optical assembly provided by an embodiment of the present disclosure;

FIG. 14 is a schematic cross-sectional view of a bi-directional optical module provided by an embodiment of the present disclosure;

fig. 15 is a three-dimensional schematic diagram of a bi-directional optical assembly provided by an embodiment of the present disclosure.

Description of the drawings

1. A light receiving component, a tube seat, b, a metal tube cap, c and a glass lens;

11. a mount, 111, a first mount portion, 1111, a first pad, 112, a second mount portion, 1121, a second pad, 1122, a third pad, 113, a connection portion;

12. photoelectric conversion devices 121, photoelectric conversion units 122, transimpedance amplifiers;

13. a case 131, a package portion 1311, a first package portion 1312, a second package portion 132, and a lens portion;

2. the light transmitting assembly comprises a light transmitting assembly body, a light transmitting assembly base, a light transmitting assembly pin, a light transmitting assembly tube base, a light-to-electricity conversion device, a light transmitting assembly cap, a light transmitting assembly tube cap and a window, wherein the light transmitting assembly body comprises a light transmitting assembly body, a light transmitting assembly pin, a light transmitting assembly body, a light transmitting assembly tube base, a light transmitting assembly body, an electro-optic conversion device and a light transmitting assembly;

3. a base 31, a base housing 32, a wavelength separator 33, a filter 34, and an optical fiber connector;

4. a light transmitting assembly base;

01. and (3) a mould and 02, a platform.

Detailed Description

With the advent of the big data age, the explosion of information volume has grown, and the demands on network throughput have increased. Optical communication networks have become the mainstay of modern communication schemes by virtue of ultra-high bandwidth, low electromagnetic interference, and the like. Access networks, represented by fiber to the home, are being deployed on a large scale. The optical communication network mainly exists in the form of a passive optical network (passive optical network, PON), and the optical network equipment in the PON comprises an optical line terminal (optical line terminal, OLT) and optical network units (optical network unit, ONU), and the OLT is connected to a plurality of ONUs disposed on a user side through an optical distribution network (optical distribution network, ODN).

In an optical network device, a bi-directional optical sub-assembly (BOSA) is generally adopted to combine a transmitted optical signal and a received optical signal into one optical fiber, and one optical fiber is used for bidirectional transmission, so that the number of optical fibers is reduced, and the network cost is saved. The bidirectional optical component may also be referred to as an optical transceiver component.

As shown in fig. 1, the related art bi-directional optical assembly includes an optical receiving assembly (ROSA) 1, an optical transmitting assembly (transmitting optical sub-assembly) 2, and a housing 3.

The light receiving assembly 1 is used for receiving an optical signal, converting the optical signal into an electrical signal, and transmitting the electrical signal to a peripheral receiving circuit. The light receiving assembly 1 in the related art employs a coaxial package (TO CAN) package including a stem a, a photoelectric conversion device 12, a metal cap b, and a glass lens c. The stem a has a pin 21, and the photoelectric conversion device 12 is fixed to the stem a and electrically connected to the pin 21. The photoelectric conversion device 12 is for converting an optical signal into an electrical signal, and the pin 21 is for outputting the electrical signal to a peripheral receiving circuit. The metal cap b is fixed to the stem a to protect the photoelectric conversion device 12. A glass lens c is fixed on the metal cap b for focusing the optical signal on the photoelectric conversion device.

The optical transmitting assembly 2 is used for converting an electrical signal into an optical signal and inputting the optical signal into an optical fiber for transmission. The related art optical transmission module 2 also employs a TO CAN package including an optical transmission module socket 22, an electro-optical conversion device 23, an optical transmission module cap 24, and a window 25. The optical transmission module socket 22 has pins 21, and the electro-optical conversion device 23 is fixed to the optical transmission module socket 22 and electrically connected to the pins 21. The pin 21 is used to introduce an electric signal from a peripheral emission driving circuit and output the electric signal to the electro-optical conversion device 23. The electro-optical conversion device 23 is used to convert an electrical signal into an optical signal and transmit the optical signal to the outside. The light transmission module cap 24 is fixed to the light transmission module socket 22, and protects the electro-optical conversion device 23. A viewing window 25 is located on the optical transmission assembly cap 24 for the optical signal to pass through. The electro-optical conversion device 23 may include a Laser Diode (LD) for converting an electrical signal into an optical signal, and a Monitor PD (MPD) for monitoring the operation of the laser diode. In general, the wavelength of the optical signal received by the optical receiving unit 1 is different from the wavelength of the optical signal transmitted by the optical transmitting unit 2.

The housing 3 includes a housing case 31, a wavelength separator 32, a filter 33, and an optical fiber connector 34. The housing 31 is used for being fixed with the light receiving assembly 1 and the light transmitting assembly 2, the wavelength separator 32 is used for transmitting light with a certain wavelength, and reflecting light with other wavelengths, the filter 33 is used for filtering light with a certain wavelength, and the optical fiber connector 34 is used for receiving and transmitting optical signals.

The following describes the working principle of the bidirectional optical module:

as shown in fig. 1, the optical signal emitted from the optical transmission module 2 is incident on the wavelength separator 32, and the wavelength separator 32 transmits the optical signal so that the optical signal is emitted through the optical fiber connector 34. Meanwhile, the optical signal received through the optical fiber connector 34 is incident on the wavelength separator 32, and is reflected by the wavelength separator 32 to the filter 33, and the optical signal is filtered by the filter 3 and then is incident on the light receiving module 1.

Therefore, the bidirectional optical component realizes that the transmitted optical signal and the received optical signal are transmitted simultaneously in one optical fiber, thereby reducing the number of the optical fibers and saving the network cost.

However, the light receiving module 1, the light transmitting module 2, and the bidirectional light module in the related art have the following problems:

On the one hand, in manufacturing the light receiving module 1, it is necessary to manufacture the glass lens c first, then weld the glass lens c to the metal cap b, and then weld the metal cap b to the stem a by a special process. The manufacturing process of the light receiving element 1 is very complicated, so that the cost of the light receiving element 1 increases. In addition, in some cases, for example, as the rate of the received signal increases, the photosensitive surface (window for receiving light) of the photoelectric conversion device 12 is continuously reduced, for example, to a diameter of 16um, and then an aspheric glass lens c is required to achieve a better light receiving effect, so that the requirements of the cold working process complexity of the aspheric glass lens c are greatly increased compared with that of the spherical glass lens c, which further increases the manufacturing cost of the light receiving assembly 1.

On the other hand, when the light receiving module 1 is electrically connected to the receiving circuit, the portion of the light receiving module 1 for connecting to the receiving circuit is the pins 21, and the pins 21 need to be inserted into the signal holes corresponding to the printed circuit board (printed circuit board, PCB) where the receiving circuit is located, and since the accuracy required for aligning the signal holes is high, the alignment can be usually performed only by manual operation, and the current surface mount technology (surface mount technology, SMT) process cannot be adopted, and automation is difficult to realize, the mounting efficiency of the light receiving module 11 is low. Also, the optical transceiver module 2 has such a problem that the installation efficiency of the bi-directional optical module is also low.

The embodiments of the present disclosure provide a light receiving assembly 1, and the light receiving assembly 1 may solve at least part of the above problems, and the light receiving assembly 1 provided by the embodiments of the present disclosure is exemplified below:

the embodiment of the present disclosure provides a light receiving assembly 1, as shown in fig. 2, the light receiving assembly 1 includes a base 11, a photoelectric conversion device 12, and a housing 13. A first side of the mount 11 is fixed with the photoelectric conversion device 12, and a second side of the mount 11 has a first pad 1111, the first pad 1111 being electrically connected with the photoelectric conversion device 12 and for being electrically connected with a receiving circuit, wherein the first side and the second side are opposite. The housing 13 is cured and formed, the housing 13 includes a package portion 131 and a lens portion 132, the package portion 131 is fixed to the first side of the base 11 and wraps the photoelectric conversion device 12, and the lens portion 132 is used for focusing the optical signal to the photoelectric conversion device 12.

Wherein the base 11 is used for supporting and fixing the photoelectric conversion device 12. The connection manner of the photoelectric conversion device 12 and the base 11 is not limited in the embodiments of the present disclosure, and the photoelectric conversion device 12 may be fixed to the base 11 by glue bonding or welding. The embodiments of the present disclosure are not limited in the type of the base 11, and in some examples, the base 11 is a PCB, a metal component, a ceramic component, or the like.

The second side of the mount 11 has a first pad 1111, and the first pad 1111 is electrically connected to the photoelectric conversion device 12, so that an electric signal output from the photoelectric conversion device 12 can be output to a receiving circuit via the first pad 1111. The manner in which the photoelectric conversion device 12 is electrically connected to the first pad 1111 is not limited in the embodiments of the present disclosure, and in some examples, the first side of the base 11 further has a pad for electrically connecting to the photoelectric conversion device 12, and the photoelectric conversion device 12 is electrically connected to the pad by wire bonding, conductive adhesive bonding, soldering, or the like, and at the same time, the pad is also electrically connected to the first pad 1111.

The photoelectric conversion device 12 is configured to convert an optical signal into an electrical signal, and output the electrical signal to a receiving circuit via the first pad 1111. The embodiments of the present disclosure are not limited in the type of the photoelectric conversion device 12, and in some examples, as shown in fig. 8, the photoelectric conversion device 12 includes a photoelectric conversion unit 121 and a transimpedance amplifier (TIA) 122. The photoelectric conversion unit 121 is electrically connected to the transimpedance amplifier 122, and the transimpedance amplifier 122 is electrically connected to the first pad 1111. The photoelectric conversion unit 121 is configured to convert an optical signal into an electrical signal, and output the electrical signal to the transimpedance amplifier 122. The transimpedance amplifier 122 amplifies the electrical signal and transmits it to the receiving circuit via the first pad 1111. The embodiments of the present disclosure are not limited to the type of the photoelectric conversion unit 121, and in some examples, the photoelectric conversion unit 121 is a Photodiode (PD) or an avalanche photodiode (avalanche photon diode, APD) or the like.

The housing 13 is solidified and formed, so that the manufacturing process is simple. The embodiment of the present disclosure is not limited to the manner of curing and molding, and may be, for example, injection molding or curing with the addition of a curing agent. In some examples, the housing 13 may be integrally cured and formed on the base 11 to which the photoelectric conversion device 12 is fixed by a curing material, and at the same time of the curing and forming, the fixed connection of the housing 13 and the base 11 is also achieved, and the package portion 131 of the housing 13 may tightly wrap the photoelectric conversion device 12, with no gap between the package portion 131 and the photoelectric conversion device 12. The case 13 provided by the embodiment of the present disclosure may be regarded as equivalent to the combination of the metal tube cap b and the glass lens c in the related art.

In the light receiving assembly 1 provided in the embodiments of the present disclosure, on one hand, since the housing 13 of the light receiving assembly 1 is formed by curing, compared with the metal tube cap and the glass lens in the related art, the manufacturing process of the housing 13 is greatly simplified, and thus, the manufacturing of the light receiving assembly 1 is simpler and more convenient.

On the other hand, since the chassis 11 has the first pad 1111, the first pad 1111 is electrically connected to the photoelectric conversion device 12, the light receiving assembly 1 provided in the embodiment of the present disclosure may employ the SMT patch process when electrically connected to the receiving circuit, thereby improving the mounting efficiency of the light receiving assembly 1.

The housing 13 is illustrated in more detail below:

the material of the case 13 is not particularly limited in the embodiment of the present disclosure, and the material of the case 13 should be a cured material, and since the lens portion 132 of the case 13 needs to be capable of focusing an optical signal to the photoelectric conversion device 12, the cured material should have light transmittance so that the optical signal can be incident to the photoelectric conversion device 12 through the lens portion 132 and the package portion 131.

In addition, in the case where the case 13 is directly cured and molded from the cured material on the base 11 and the photoelectric conversion device 12, it is necessary to submerge the base 11 and the photoelectric conversion device 12 in the liquid cured material when manufacturing the light receiving module 1, and therefore, the temperature required for the cured material to maintain the liquid state should not be excessively high to prevent the high temperature from damaging the photoelectric conversion device 12 and the connection of the photoelectric conversion device 12 to the base 11, and in some examples, the temperature for the cured material to maintain the liquid state should be lower than 400 °.

In some examples, the housing 13 is formed from a resin, plastic, or low temperature glass cure.

In some examples, as shown in fig. 2 and 3, the axis of the encapsulation portion 131 and the axis of the lens portion 132 coincide, i.e., the encapsulation portion 131 and the lens portion 132 are coaxial.

Of course, due to the manufacturing process, the axis of the encapsulation portion 131 and the axis of the lens portion 132 may not coincide, and in some examples, the axis of the encapsulation portion 131 and the axis of the lens portion 132 are parallel, and in other examples, the axis of the encapsulation portion 131 and the axis of the lens portion 132 form a small angle, which may be less than 10 °, and further, the angle is less than 2 °.

In some examples, as shown in fig. 2 and 3, one end of the encapsulation part 131 is fixed to the base 11, and the other end of the encapsulation part 131 is integrally connected to the lens part 132. The lens portion 132 is opposed to the photoelectric conversion device 12.

In some examples, as shown in fig. 3, the encapsulation 131 includes a first encapsulation portion 1311 and a second encapsulation portion 1312. The first package portion 1311 is fixed to the base 11, and the second package portion 1312 is integrally connected to the lens portion 132. The outer diameter of the first encapsulation portion 1311 is larger than the outer diameter of the second encapsulation portion 1312.

As shown in fig. 4, when the light receiving assembly 1 is connected to the housing case 31, the second encapsulating portion 1312 is protruded into the inside of the housing case 31, and glue is filled between the inner wall of the housing case 31 and the side wall of the second encapsulating portion 1312 (region a in fig. 4), and the housing case 31 and the second encapsulating portion 1312 are bonded together after the glue is solidified. The end of the housing shell 31 may rest against the first encapsulation portion 1311.

In some examples, the filled glue is an ultraviolet glue, and the ultraviolet glue needs to be cured by irradiation of ultraviolet light, so after the ultraviolet glue is filled between the inner wall of the housing shell 31 and the side wall of the second package portion 1312, ultraviolet light may be irradiated around the light receiving assembly 1, and then the ultraviolet light is incident to the region a in fig. 4 (as in the arrow direction in fig. 4) through the side portion of the first package portion 1311, so that the ultraviolet glue is cured under irradiation of the ultraviolet light, and the second package portion 1312 and the housing shell 31 are bonded together.

The embodiment of the present disclosure is not limited to the form of the first encapsulation portion 1311, and in some examples, the first encapsulation portion 1311 has a cylindrical structure as shown in fig. 3, and in other examples, the first encapsulation portion 1311 may also have a prismatic structure (such as a square column structure) or the like.

The embodiments of the present disclosure are also not limited in the morphology of the second encapsulation portion 1312, in some examples, as shown in fig. 3, the second encapsulation portion 1312 has a cylindrical structure, in other examples, the second encapsulation portion 1312 has a prismatic structure (e.g., square column structure), and so on.

In some examples, as shown in fig. 3, first encapsulation portion 1311 and second encapsulation portion 1312 are coaxial, e.g., first encapsulation portion 1311 and second encapsulation portion 1312 are two cylinders that are coaxial but have different outer diameters.

In this way, when fixing the light receiving assembly 1 and the housing case 31, it can be determined whether the second package portion 1312 and the lens portion 132 are coaxial with the housing case 31 by observing whether the first package portion 1311 is coaxial with the housing case 31.

Of course, in other examples, the encapsulation 131 may not include the first encapsulation portion 1311 and the second encapsulation portion 1312 having different outer diameters, that is, the outer diameters of the encapsulation 131 may be uniform. In this case, when the light receiving module 1 and the housing case 31 are fixed, the entirety of the package 131 may be inserted into the housing case 31, and the end surface of the housing case 31 may directly abut against the base 11.

The embodiment of the present disclosure does not limit the form of the lens portion 132, and the lens portion 132 may have a spherical lens structure or an aspherical lens structure, and the specific structure may be designed according to an actual optical coupling application scenario, so as to meet the requirement of high optical coupling efficiency. For example, as the rate of the received signal increases, the photosurface of the photoelectric conversion device 12 is continuously reduced, for example, to a photosurface with a diameter of 16um, and the lens portion 132 with an aspherical lens structure is required to achieve a better light receiving effect.

The form of the lens portion 132 can be adjusted by adjusting the mold 01 for molding the housing 13, regardless of the aspherical lens structure or the spherical lens structure, and therefore, the manufacturing process of the lens is greatly simplified. This is particularly evident for the aspherical lens structure, and the cold working process employed in the related art for manufacturing an aspherical glass lens is very complicated.

The embodiment of the disclosure provides that the light receiving component 1 can be used independently or can be used together with the light transmitting component 2 and the base 3 to form a bidirectional light component.

For the scenario of use with the bi-directional optical assembly 2 and housing 3, to enable the bi-directional optical assembly to be electrically connected to peripheral circuitry using an SMT patch process, in some examples, the base 11 also has a second pad 1121 and a third pad 1122, as shown in fig. 5-7. A second pad 1121 is located on a second side of the chassis 11 for electrical connection with the emission driving circuit. The third pad 1122 and the second pad 1121 are located at different sides of the submount 11, and the third pad 1122 is electrically connected to the second pad 1121, and the third pad 1122 is used for electrically connecting to the pin 21 of the optical transmission component 2.

The process of transmitting the optical signal by the optical transmitting assembly 2 may be as follows, in which the electrical signal transmitted by the transmission driving circuit reaches the electro-optical conversion device in the optical transmitting assembly 2 via the second pad 1121, the third pad 1122, and the pin 21 in order, and drives the electro-optical conversion device to transmit the optical signal.

The second pad 1121 may be electrically connected to the emission driving circuit by soldering or bonding, etc., and the third pad 1122 may be electrically connected to the pin 21 of the optical transmission assembly 2 by soldering or bonding, etc.

According to the technical scheme provided by the embodiment of the disclosure, the second bonding pad 1121 and the third bonding pad 1122 which are electrically connected are arranged, and the third bonding pad 1122 is arranged to be electrically connected with the pin 21 of the optical transmission assembly 2, so that the structure of the optical transmission assembly 2 for being electrically connected with the emission driving circuit is converted into the second bonding pad 1121 by the pin 21, and therefore, the bidirectional optical assembly can be electrically connected with the peripheral circuit by adopting an SMT (surface mount technology), and the mounting efficiency of the bidirectional optical assembly is improved.

The position of the third pad 1122 is not limited in the embodiments of the present disclosure, the third pad 1122 may be located on any side of the chassis 11 except the second side, and after the third pad 1122 is soldered to the pin 21, the pin 21 does not prevent the second pad 1121 from being electrically connected to the emission driving circuit by the SMT chip mounting process.

In some examples, as shown in fig. 5-7, the third pad 1122 is located on a first side of the mount 11, i.e., the second and third pads 1121, 1122 are located on opposite sides of the mount 11.

In some examples, as shown in fig. 6 and 7, the base 11 includes a first base portion 111 and a second base portion 112. The first mount portion 111 has a first pad 1111 and is fixed to the photoelectric conversion device 12 and the housing 13. The second mount portion 112 has a second pad 1121 and a third pad 1122.

In some examples, as shown in fig. 6, 7, and 13, the first side of the second base portion 112 protrudes relative to the first side of the first base portion 111.

Thus, as shown in fig. 13, when the light receiving module 1 is assembled as a bi-directional light module, the third pads 1122 of the first side of the second base portion 112 are closer to the pins 21 of the light transmitting module 2, thereby facilitating electrical connection of the pins 21 with the third pads 1122.

The connection manner of the first base portion 111 and the second base portion 112 is not limited in the embodiments of the present disclosure, and in some examples, as shown in fig. 6, the first base portion 111 and the second base portion 112 are integrally connected, so that the entire base 11 is more firm.

In other examples, as shown in fig. 7, the base 11 further includes a connection portion 113, and the connection portion 113 is cured. The first base portion 111 and the second base portion 112 are connected to both sides of the connecting portion 113, respectively.

The technical solution provided by the embodiments of the present disclosure can reduce the size of the first base portion 111 and the second base portion 112 by connecting the first base portion 111 and the second base portion 112 using the connection portion 113 formed by curing, thereby reducing the cost of the base 11, the light receiving assembly 1, and the bidirectional light assembly.

In some examples, the connection portion 113 and the housing 13 are integrally cured.

For example, in manufacturing the light receiving assembly 1, the first base portion 111 and the second base portion 112 are placed in a mold 01, and a curing material (such as resin, plastic, or low-temperature glass) is filled into the mold 01. After the curing material is cured, the housing 13 is cured at the first base portion 111, and at the same time, the connection portion 113 is cured between the first base portion 111 and the second base portion 112, and the connection portion 113 bonds the first base portion 111 and the second base portion 112 together.

It should be noted that, as shown in fig. 3, the base 11 may also include only the first base portion 111 (i.e., only the first pad 1111). For this case, when the light receiving module 1 is applied to a bi-directional light module, the light transmitting module mount 4 may be separately configured for the light transmitting module 2, and the light transmitting module mount 4 has the second pad 1121 and the third pad 1122, thereby also realizing the conversion of the structure of the external connection of the light transmitting module 2 from the pin 21 to the second pad 1121.

The embodiment of the disclosure further provides a method for manufacturing the light receiving assembly 1, as shown in fig. 9, including the following steps:

step 901, fixing the photoelectric conversion device 12 on the first side of the mount 11, and electrically connecting the photoelectric conversion device 12 with the first pad 1111 on the second side of the mount 11.

Wherein the first side and the second side are opposite.

In some examples, the first side of the base 11 further has a bonding pad for electrically connecting with the photoelectric conversion device 12, and when the photoelectric conversion device 12 is fixed on the first side of the base 11, the photoelectric conversion device 12 may be fixed on the first side of the base 11 by means of glue bonding, welding or wire bonding, and is electrically connected with the bonding pad on the first side of the base 11, so that the electrical connection between the photoelectric conversion device 12 and the first bonding pad 1111 is achieved.

In step 902, the mount 11 to which the photoelectric conversion device 12 is fixed is placed in the mold 01.

In step 903, a curing material is filled into the mold 01, and the curing material is cured to form the housing 13.

The housing 13 includes a package portion 131 and a lens portion 132, wherein the package portion 131 is fixed to the first side of the base 11 and wraps the photoelectric conversion device 12, and the lens portion 132 is used for focusing the optical signal to the photoelectric conversion device 12.

The curing material can be resin, plastic, low-temperature glass and the like.

In step 904, a mold release process is performed to obtain the light receiving module 1.

The demolding process refers to taking out the base 11, the photoelectric conversion device 12, and the case 13, which are connected together, from the mold 01.

According to the technical scheme provided by the embodiment of the disclosure, on one hand, the base 11 fixed with the photoelectric conversion device 12 and the curing material are placed in the mold 01 together, and the curing material is integrally cured and formed into the shell 13 on the base 11, so that the manufacturing flow of the shell 13 and the manufacturing flow of the light receiving assembly 1 are greatly simplified.

The execution sequence of step 902 and step 903 is not limited in the embodiments of the present disclosure, and in some examples, the base 11 may be placed in the mold 01 and then the mold 01 is filled with the curing material. In other examples, the base 11 may be placed in the mold 01 after filling the mold 01 with the curing material.

Since the chassis 11 is placed in the mold 01 together with the cured material, the first pad 1111 of the chassis 11 may be covered after the cured material is cured, and since the first pad 1111 needs to be electrically connected to the receiving circuit, the first pad 1111 on the chassis 11 needs to be exposed after the demolding process is performed, so that the final light receiving assembly 1 can be obtained.

It will be appreciated that in the case where the submount 11 also has the second pad 1121 and the third pad 1122, it is also necessary to expose the second pad 1121 and the third pad 1122. That is, all pads on the chassis 11 that need to be electrically connected to the outside need to be exposed.

The manner in which the pads on the submount 11 are exposed is not limited by the disclosed embodiments, and in some examples, the cured material at the pads may be removed by mechanical polishing or chemical polishing, or the like, to expose the pads.

Of course, in other examples, the special design of the mold 01 may be adopted so that the cured material does not wrap the bonding pad after curing, and thus, the base 11 does not need to be subjected to mechanical polishing or chemical polishing.

In order to further improve the manufacturing efficiency of the light receiving assembly 1, batch manufacturing of the light receiving assembly 1 may be performed, and as shown in fig. 10, in some examples, a plurality of molds 01 may be provided, and a plurality of mounts 11 to which the photoelectric conversion devices 12 are fixed may be respectively provided in the plurality of molds 01 when the plurality of molds 01 are placed on the stage 02. When the curing material is filled, the curing material may be filled into the platform 02, and the curing material flows from the platform 02 into each mold 01, and the curing material is cured to form an integrated housing. Wherein the integrated housing comprises a plurality of integrally connected housings 13. Then, a mold release process is performed to divide the integrated housing into a plurality of housings 13, thereby obtaining a plurality of light receiving modules 1.

If the bonding pads on the base 11 need to be exposed, the integrated housing may be mechanically polished or chemically polished before being cut into the plurality of housings 13, so that the integrated housing is cut into the plurality of housings 13 after the bonding pads on the base 11 are exposed, thereby improving the manufacturing efficiency of the light receiving module 1.

In addition, in the case where the mount 11 includes two members of the first mount portion 111 and the second mount portion 112, the first mount portion 111 and the second mount portion 112 to which the photoelectric conversion device 12 is fixed may be placed together in the mold 01. Then, after the cured material is cured, not only the housing 13 but also the connection portion 113 is formed between the first base portion 111 and the second base portion 112, and the connection portion 113 connects the first base portion 111 and the second base portion 112 together.

The technical solution provided by the embodiments of the present disclosure can reduce the size of the first base portion 111 and the second base portion 112 by connecting the first base portion 111 and the second base portion 112 together by a cured material instead of integrally connecting the first base portion 111 and the second base portion 112, thereby reducing the cost of the base 11, the light receiving assembly 1, and the bi-directional light assembly.

It will be appreciated that the cost of the material required for the first and second base portions 111, 112 is higher than the cost of the cured material.

Note that, for the detailed structure of the light receiving assembly 1, reference may be made to the content of a portion of the light receiving assembly 1, and the detailed description thereof will not be repeated here.

The embodiment of the disclosure further provides a bidirectional optical component, as shown in fig. 11-15, where the bidirectional optical component includes an optical receiving component 1, an optical transmitting component 2, and a base 3, and the optical receiving component 1 and the optical transmitting component 2 are both fixed to the base 3.

The specific structures of the light receiving assembly 1, the light transmitting assembly 2 and the base 3 may be referred to as the foregoing, and will not be described herein.

As shown in fig. 11 to 13, in the case where the mount 11 of the light receiving module 1 has the second pad 1121 and the third pad 1122, the pin 21 of the light transmitting module 2 is electrically connected to the third pad 1122 of the mount 11 of the light receiving module 1.

According to the technical scheme provided by the embodiment of the disclosure, the second bonding pad 1121 and the third bonding pad 1122 which are electrically connected are arranged on the base 11 of the light receiving component 1, and the third bonding pad 1122 is electrically connected with the pin 21 of the light sending component 2, so that the structure of the light sending component 2 for being electrically connected with the emission driving circuit is converted into the second bonding pad 1121 by the pin 21, and therefore, the bidirectional light component can be electrically connected with the peripheral circuit by adopting an SMT (surface mount technology) technology, and the mounting efficiency of the bidirectional light component is improved.

As shown in fig. 14 and 15, in order to enable the bidirectional optical component to be electrically connected to the peripheral circuit using the SMT process, for the case where the mount 11 of the light receiving component 1 does not have the second and third pads 1121 and 1122, in some examples, the bidirectional optical component further includes a light transmitting component mount 4, the light transmitting component mount 4 having the second and third pads 1121 and 1122. The second pad 1121 faces the same side as the first pad 1111 of the chassis 11 of the light receiving assembly 1, and the second pad 1121 is for electrical connection with the emission driving circuit. The third pad 1122 and the second pad 1121 are located on different sides of the optical transmission component mount 4, and the third pad 1122 is electrically connected to the second pad 1121, and the pin 21 of the optical transmission component 2 is electrically connected to the third pad 1122.

According to the technical scheme provided by the embodiment of the disclosure, the optical transmission assembly base 4 is additionally arranged, the second bonding pad 1121 and the third bonding pad 1122 which are electrically connected are arranged on the optical transmission assembly base 4, and the third bonding pad 1122 is electrically connected with the pin 21 of the optical transmission assembly 2, so that the structure of the optical transmission assembly 2 which is electrically connected with the emission driving circuit is converted into the second bonding pad 1121 by the pin 21, and therefore, the bidirectional optical assembly can be electrically connected with the peripheral circuit by adopting an SMT (surface mount technology), and the installation efficiency of the bidirectional optical assembly is improved.

In some examples, as shown in fig. 11-15, the first pads 1111 and the second pads 1121 are located on the same plane. Thus, the SMT patch process is facilitated to electrically connect the bi-directional optical component to the peripheral circuitry.

The embodiment of the present disclosure does not limit the form of the bidirectional optical component, and in some examples, as shown in fig. 11 to 15, the receiving optical path of the optical receiving component 1 and the transmitting optical path of the optical transmitting component 2 intersect (e.g., are perpendicular), the third pad 1122 is opposite to the second pad 1121, and the pin 21 of the optical transmitting component 2 is bent toward the third pad 1122 and electrically connected to the third pad 1122.

When the pin 21 of the light emitting element 2 is bent toward the third pad 1122, an automated process may be used to bend the pin 21 and automatically bond the bent pin 21 and the third pad 1122 together.

In some examples, the pins 21 of the optical transmission component 2 are soldered, adhered, or wire-bonded to the third pads 1122, or the like.

The embodiment of the disclosure provides an optical network device, which comprises the optical receiving component 1 or the bidirectional optical component.

The optical network device may be an optical module, an OLT, an ONU, or the like, and one or more optical modules may be included in the OLT and the ONU.

In some examples, the optical module may be a small form-factor pluggable (SFP) optical module.

The embodiment of the disclosure also provides an optical network system, which comprises the optical network device.

The optical network system may be any PON system, for example, a gigabit passive optical network (gig-bit passive optical network, GPON) system, an ethernet passive optical network (ethernet passive optical network, EPON) system, or a 10G-bit passive optical network (10 gig-bit passive optical network,10G PON) system.

The terminology used in the description of the embodiments of the disclosure is for the purpose of describing the embodiments of the disclosure only and is not intended to be limiting of the disclosure. Unless defined otherwise, technical or scientific terms used in the embodiments of the present disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present disclosure belongs. The terms "first," "second," and the like in the description and in the claims, are not used for any order, quantity, or importance, but are used for distinguishing between different elements. Likewise, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, is intended to mean that elements or items that are present in front of "comprising" or "comprising" are included in the word "comprising" or "comprising", and equivalents thereof, without excluding other elements or items. "upper", "lower", "left", "right", etc. are used merely to denote relative positional relationships, which may also change accordingly when the absolute position of the object to be described changes. "plurality" means two or more, unless expressly defined otherwise.

The foregoing description of the preferred embodiments of the present disclosure is provided for the purpose of illustration only, and is not intended to limit the disclosure to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, alternatives, and alternatives falling within the spirit and scope of the disclosure.

Claims

1. A light receiving assembly characterized by comprising a base (11), a photoelectric conversion device (12) and a housing (13);

a first side of the base (11) is fixed with the photoelectric conversion device (12), a second side of the base (11) is provided with a first bonding pad (1111), and the first bonding pad (1111) is electrically connected with the photoelectric conversion device (12) and is used for being electrically connected with a receiving circuit, wherein the first side and the second side are opposite;

the shell (13) is formed by solidification, the shell (13) comprises a packaging part (131) and a lens part (132), the packaging part (131) is fixed with the first side of the base (11) and wraps the photoelectric conversion device (12), and the lens part (132) is used for focusing optical signals to the photoelectric conversion device (12).

2. The light receiving assembly according to claim 1, wherein the encapsulation (131) comprises a first encapsulation portion (1311) and a second encapsulation portion (1312);

the first packaging part (1311) is fixed with the base (11), and the second packaging part (1312) is integrally connected with the lens part (132);

An outer diameter of the first encapsulation portion (1311) is larger than an outer diameter of the second encapsulation portion (1312).

3. A light receiving assembly according to claim 1 or 2, wherein the housing (13) is cured from any one of the following materials: resins, plastics and low temperature glass.

4. A light receiving assembly according to any one of claims 1-3, wherein the submount (11) further has a second pad (1121) and a third pad (1122);

the second bonding pad (1121) is positioned on the second side of the base (11) and is used for being electrically connected with an emission driving circuit;

the third pad (1122) and the second pad (1121) are located on different sides of the chassis (11), and the third pad (1122) is electrically connected to the second pad (1121), and the third pad (1122) is used for electrically connecting to a pin (21) of the optical transmission component (2).

5. The light receiving assembly according to claim 4, wherein the third pad (1122) is located at a first side of the mount (11).

6. A light receiving assembly according to claim 4 or 5, wherein the base (11) comprises a first base portion (111) and a second base portion (112);

the first mount portion (111) has the first pad (1111) and is fixed to the photoelectric conversion device (12) and the housing (13);

The second mount portion (112) has the second pad (1121) and the third pad (1122).

7. A light receiving assembly according to claim 6, wherein the first side of the second base portion (112) is protruding with respect to the first side of the first base portion (111).

8. A light receiving assembly according to claim 6 or 7, wherein the first base portion (111) and the second base portion (112) are integrally connected.

9. A light receiving assembly according to claim 6 or 7, wherein the base (11) further comprises a connecting portion (113);

the connecting portion (113) is formed by solidification, and two sides of the connecting portion (113) are respectively connected with the first base portion (111) and the second base portion (112).

10. A method of fabricating a light receiving element, the method comprising:

fixing a photoelectric conversion device (12) on a first side of a base (11), and electrically connecting the photoelectric conversion device (12) with a first pad (1111) on a second side of the base (11), wherein the first side and the second side are opposite;

placing a base (11) to which the photoelectric conversion device (12) is fixed in a mold (01);

Filling a curing material into the mold (01), and forming a shell (13) after the curing material is cured, wherein the shell (13) comprises a packaging part (131) and a lens part (132), the packaging part (131) is fixed with the first side of the base (11) and wraps the photoelectric conversion device (12), and the lens part (132) is used for focusing an optical signal to the photoelectric conversion device (12);

and (5) carrying out demolding treatment to obtain the light receiving component.

11. The method of manufacturing according to claim 10, characterized in that the base (11) has pads for external electrical connection, said pads comprising at least the first pads (1111);

the demolding treatment is carried out to obtain the light receiving assembly, which comprises the following steps:

carrying out demolding treatment;

and exposing the bonding pads on the base (11) to obtain the light receiving component.

12. The method according to claim 10 or 11, wherein the number of the molds (01) is plural, and the plurality of the molds (01) are placed on a platform (02), the mold (01) is filled with a curing material, and the curing material is cured to form a housing (13), comprising:

filling the platform (02) with a curing material, and flowing the curing material from the platform (02) into each mold (01), wherein the curing material is cured to form an integrated shell, and the integrated shell comprises a plurality of integrally connected shells (13);

carrying out demolding treatment;

the integrated housing is divided into a plurality of housings (13) to obtain a plurality of light receiving modules.

13. The method of manufacturing according to any one of claims 10-12, wherein the base (11) comprises a first base portion (111) and a second base portion (112), the first base portion (111) having the first pad (1111), the second base portion (112) having a second pad (1121) and a third pad (1122), the second pad (1121) and the third pad (1122) being located on different sides of the second base portion (112) and being electrically connected;

the fixing of the photoelectric conversion device (12) on a first side of a mount (11) and the electrical connection of the photoelectric conversion device (12) with a first pad (1111) on a second side of the mount (11) includes:

fixing the photoelectric conversion device (12) on a first side of the first mount portion (111), and electrically connecting the photoelectric conversion device (12) with a first pad (1111) on a second side of the first mount portion (111);

the placing of the mount (11) to which the photoelectric conversion device (12) is fixed in a mold (01) includes:

-placing the second base portion (112) and the first base portion (111) to which the photoelectric conversion device (12) is fixed in a mold (01);

the filling of the mold (01) with a curing material, which after curing forms a housing (13), comprises:

filling a curing material into the mold (01), and forming the shell (13) and the connecting part (113) after the curing material is cured, wherein the shell (13) is fixed with the first base part (111), and the connecting part (113) is connected with the first base part (111) and the second base part (112).

14. A bi-directional optical module comprising a light receiving module (1), a light transmitting module (2) and a housing (3), the light receiving module (1) being a light receiving module according to any one of claims 1-9;

the light receiving component (1) and the light transmitting component (2) are fixed with the base body (3).

15. The bi-directional optical component according to claim 14, wherein the optical receiving component (1) is an optical receiving component according to any one of claims 1-3, the bi-directional optical component further comprising an optical transmitting component mount (4), the optical transmitting component mount (4) having a second pad (1121) and a third pad (1122);

The second bonding pad (1121) and the first bonding pad (1111) of the base (11) of the light receiving component (1) face to the same side, and the second bonding pad (1121) is used for being electrically connected with an emission driving circuit;

the third bonding pad (1122) and the second bonding pad (1121) are positioned on different sides of the light transmitting component base (4), the third bonding pad (1122) is electrically connected with the second bonding pad (1121), and the pin (21) of the light transmitting component (2) is electrically connected with the third bonding pad (1122).

16. A bi-directional optical module according to claim 14, wherein the optical receiving module (1) is an optical receiving module according to any one of claims 4-9, and the pins (21) of the optical transmitting module (2) are electrically connected to the third pads (1122) of the base (11) of the optical receiving module (1).

17. A bi-directional optical module according to claim 15 or 16, characterized in that the receive optical path of the optical receiving module (1) and the transmit optical path of the optical transmitting module (2) intersect;

the third bonding pad (1122) is opposite to the second bonding pad (1121), and the pin (21) of the light transmitting component (2) is bent toward the third bonding pad (1122).

18. An optical network device comprising an optical receiving assembly (1) according to any of claims 1-9 or a bi-directional optical assembly according to any of claims 14-17.