CN116979255B - Grounding structure and signal device - Google Patents

Grounding structure and signal device Download PDF

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Publication number
CN116979255B
CN116979255B CN202311227091.8A CN202311227091A CN116979255B CN 116979255 B CN116979255 B CN 116979255B CN 202311227091 A CN202311227091 A CN 202311227091A CN 116979255 B CN116979255 B CN 116979255B
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China
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section
dielectric layer
grounding structure
signal
grounding
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CN202311227091.8A
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CN116979255A (en
Inventor
于海洋
曹会青
伍健
李岩
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Inspur Shandong Computer Technology Co Ltd
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Inspur Shandong Computer Technology Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/48Earthing means; Earth screens; Counterpoises
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/16Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/30Resonant antennas with feed to end of elongated active element, e.g. unipole

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Abstract

The invention discloses a grounding structure and a signal device, relates to the field of signal devices, and aims to solve the problems of larger space resource occupation, lower utilization rate and higher production cost in the traditional grounding structure, wherein the grounding structure can comprise: the device comprises a wire transmission section, a grounding structure section, a balance connection section, a dielectric layer and a floor structure; the wire transmission section, the grounding structure section and the balance connection section are all arranged on the medium layer, and the wire transmission section and the grounding structure section are connected through the balance connection section; the floor structure is arranged at the bottom of the dielectric layer and is connected with the grounding structure section through the dielectric layer; the wire transmission section is used for being connected with signal equipment, and the size information and the position information of the balance connection section correspond to the working state of the signal equipment.

Description

Grounding structure and signal device
Technical Field
The present invention relates to the field of signal devices, and in particular, to a grounding structure and a signal device.
Background
The antenna is used as a signal device, and the main functional structure of the antenna is an antenna metal radiator structure, in the structure, the floor and the grounding structure are used as an indispensable non-main radiator structure, certain space resources are necessarily required to be occupied, but the antenna is not used as a main design structure in the design of the working frequency performance of the antenna, and the utilization rate is low. Further, occupation of space resources and lower utilization result in higher production costs.
Therefore, how to realize effective utilization of the grounding structure to reduce the production cost thereof is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a grounding structure which can realize effective utilization of the grounding structure and further reduce the production cost of the grounding structure; another object of the present invention is to provide a signaling device that also has the above-mentioned beneficial effects.
In a first aspect, the invention provides a grounding structure, which comprises a wire transmission section, a grounding structure section, a balance connection section, a dielectric layer and a floor structure;
the wire transmission section, the grounding structure section and the balance connection section are all arranged on the medium layer, and the wire transmission section and the grounding structure section are connected through the balance connection section;
the floor structure is arranged at the bottom of the dielectric layer and is connected with the grounding structure section through the dielectric layer;
the wire transmission section is used for being connected with signal equipment, and the size information and the position information of the balance connection section correspond to the working state of the signal equipment.
Optionally, the wire transmission section and the grounding structure section are arranged in parallel;
The balance connection section is respectively and vertically connected with the wire transmission section and the grounding structure section.
Optionally, the size information includes a length of the balanced connection section;
the position information includes a vertical connection position of the balanced connection section on the wire transfer section.
Optionally, the working state of the signal device is the working frequency of the signal device.
Optionally, the balance connection section is arranged on the medium layer in a straight line shape, or is arranged on the medium layer in a curve shape, or is arranged on the medium layer in a fold line shape.
Optionally, the balanced connection section is a rectangular metal wire having a first preset thickness.
Optionally, the wire transmission section includes a signal input end and a signal output end;
the signal input end is connected with an external input lead structure and is used for receiving an input signal sent by the external input lead structure;
the signal output end is connected with the signal equipment and is used for sending an output signal to the signal equipment.
Optionally, the input signal and the output signal are both electromagnetic wave signals.
Optionally, the wire transmission section is arranged on the medium layer in a straight line shape, or is arranged on the medium layer in a curve shape, or is arranged on the medium layer in a fold line shape.
Optionally, the wire transmission section is a rectangular metal wire having a second preset thickness.
Optionally, the grounding structure section comprises a rectangular metal wire having a third preset thickness and a periodic metal cylinder;
the rectangular metal wire is arranged on the dielectric layer;
the periodic metal cylinder vertically penetrates through the dielectric layer, the top of the periodic metal cylinder is connected with the rectangular metal wire, and the bottom of the periodic metal cylinder is connected with the floor structure.
Optionally, the rectangular metal wire is arranged on the dielectric layer in a straight line shape, or is arranged on the dielectric layer in a curve shape, or is arranged on the dielectric layer in a fold line shape.
Optionally, the periodic metal cylinders comprise a preset number of metal cylinders with the same diameter and the same height;
the metal cylinders are arranged at preset intervals.
Optionally, the height of the metal cylinder is the same as the thickness of the dielectric layer.
Optionally, the dielectric layer is a non-conductive medium with a preset dielectric coefficient.
Optionally, the dielectric layer and the floor structure are rectangular structures having the same length and the same width.
Optionally, the dielectric layer and the floor structure are both flexible materials.
Optionally, an adhesive is provided at the bottom of the floor structure for fixing the ground structure to a target location.
In a second aspect, the invention also discloses a signal device, which comprises any one of the grounding structures and the signal equipment;
the signal device is connected with a wire transmission section in the grounding structure.
Optionally, the signal device is a monopole antenna, or a dipole antenna, or other antenna.
The invention provides a grounding structure, which comprises: the device comprises a wire transmission section, a grounding structure section, a balance connection section, a dielectric layer and a floor structure; the wire transmission section, the grounding structure section and the balance connection section are all arranged on the medium layer, and the wire transmission section and the grounding structure section are connected through the balance connection section; the floor structure is arranged at the bottom of the dielectric layer and is connected with the grounding structure section through the dielectric layer; the wire transmission section is used for being connected with signal equipment, and the size information and the position information of the balance connection section correspond to the working state of the signal equipment.
The technical scheme provided by the invention has the following technical effects:
the grounding structure provided by the invention mainly comprises a wire transmission section, a grounding structure section, a balance connection section, a dielectric layer and a floor structure, wherein the wire transmission section, the grounding structure section and the balance connection section are all arranged on the dielectric layer in a tiled mode, the floor structure is overlapped at the bottom of the dielectric layer and is connected with the grounding structure section through the dielectric layer to realize grounding, so that the grounding structure in a plane form is realized, and the space occupation is effectively saved; in addition, the grounding structure can be connected with the signal equipment through the wire transmission section of the grounding structure, and the size information and the position information of the balance connection section in the grounding structure correspond to the working state of the signal equipment, so that the grounding structure can regulate and control the working state of the signal equipment by adjusting the size information and the position information of the balance connection section, and the effective utilization of the grounding structure is realized. On the basis, the production cost is further reduced by effectively saving space resources and using higher utilization rate.
In one embodiment, the grounding structure section is composed of a rectangular metal wire with a third preset thickness and a periodic metal cylinder, the rectangular metal wire is arranged on the dielectric layer, the periodic metal cylinder vertically penetrates through the dielectric layer, the top of the periodic metal cylinder is connected with the rectangular metal wire, and the bottom of the periodic metal cylinder is connected with the floor structure, so that the grounding structure section is connected with the floor structure through the dielectric layer, the rectangular metal wire and the floor structure are connected in a penetrating mode through the periodic metal cylinder, space occupation can be further saved, a small-sized grounding structure design is realized, and production cost is effectively reduced.
In one embodiment, the dielectric layer and the floor structure are designed to be made of flexible materials, the use of the flexible materials is beneficial to the grounding structure to be applicable to any non-planar (such as a curved surface) application equipment, the bonding between the grounding structure and the application equipment is realized, and further, different scene requirements can be met, and the grounding structure has higher applicability and practicability.
The invention also discloses a signal device which has the same technical effects as the signal device, and the invention is not repeated here.
Drawings
In order to more clearly illustrate the technical solutions in the prior art and the embodiments of the present invention, the following will briefly describe the drawings that need to be used in the description of the prior art and the embodiments of the present invention. Of course, the following drawings related to embodiments of the present invention are only a part of embodiments of the present invention, and it will be obvious to those skilled in the art that other drawings can be obtained from the provided drawings without any inventive effort, and the obtained other drawings also fall within the scope of the present invention.
Fig. 1 is a schematic structural diagram of a grounding structure according to the present invention;
FIG. 2 is a schematic illustration of a balanced connection section size structure according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of working frequency points for adjusting different positions of a balanced connection segment according to an embodiment of the present invention;
FIG. 4 is a top view of a first grounding structure according to an embodiment of the present invention;
FIG. 5 is a top view of a second grounding structure according to an embodiment of the present invention;
FIG. 6 is a top view of a third grounding structure according to an embodiment of the present invention;
FIG. 7 is a schematic view of a grounding structure section according to an embodiment of the present invention;
FIG. 8 is a top view of a fourth grounding structure according to an embodiment of the present invention;
fig. 9 is a schematic view of an application scenario of a grounding structure according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of an antenna grounding structure according to an embodiment of the present invention.
Description of the reference numerals: 1-a wire transmission section; 2-a ground structure section; 3-balancing connection section; 4-a dielectric layer; 5-floor construction; 6-antenna structure; 7-rectangular metal wires; 8-periodic metal cylinders; 9-signal input; 10-signal output terminal; 11-application device metal plane.
Detailed Description
The core of the invention is to provide a grounding structure which can realize the effective utilization of the grounding structure and further reduce the production cost; another core of the present invention is to provide a signaling device, which also has the above-mentioned beneficial effects.
In order to more clearly and completely describe the technical solutions in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The antenna is used as a signal device, and the main functional structure of the antenna is an antenna metal radiator structure, in the structure, the floor and the grounding structure are used as an indispensable non-main radiator structure, certain space resources are necessarily required to be occupied, but the antenna is not used as a main design structure in the design of the working frequency performance of the antenna, and the utilization rate is low. Further, occupation of space resources and lower utilization result in higher production costs.
Therefore, in order to solve the technical problems, the invention provides a grounding structure which mainly comprises a wire transmission section, a grounding structure section, a balance connection section, a dielectric layer and a floor structure, wherein the wire transmission section, the grounding structure section and the balance connection section are all arranged on the dielectric layer in a tiled mode, the floor structure is overlapped at the bottom of the dielectric layer and is connected with the grounding structure section through the dielectric layer to realize grounding, so that the planar grounding structure is realized, and the space occupation is effectively saved; in addition, the grounding structure can be connected with the signal equipment through the wire transmission section of the grounding structure, and the size information and the position information of the balance connection section in the grounding structure correspond to the working state of the signal equipment, so that the grounding structure can regulate and control the working state of the signal equipment by adjusting the size information and the position information of the balance connection section, and the effective utilization of the grounding structure is realized. On the basis, the production cost is further reduced by effectively saving space resources and using higher utilization rate.
An embodiment of the invention provides a grounding structure.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a grounding structure provided by the present invention, where the grounding structure may include a wire transmission section 1, a grounding structure section 2, a balanced connection section 3, a dielectric layer 4, and a floor structure 5;
the wire transmission section 1, the grounding structure section 2 and the balance connection section 3 are arranged on the medium layer 4, and the wire transmission section 1 and the grounding structure section 2 are connected through the balance connection section 3;
the floor structure 5 is arranged at the bottom of the dielectric layer 4 and is connected with the grounding structure section 2 through the dielectric layer 4;
the wire transmission section 1 is used for connecting signal equipment, and the size information and the position information of the balance connection section 3 correspond to the working state of the signal equipment.
As shown in fig. 1, the grounding structure, i.e. the planar grounding structure, is mainly used for connecting with signal equipment and providing grounding function for the signal equipment, wherein the signal equipment may be specifically an antenna structure. It can be understood that the design form of the grounding structure realizes the miniaturization design of the whole signal device, effectively reduces the whole size of the grounding structure, saves the space occupation and reduces the production cost. In addition, the grounding structure can be applied to a wireless communication system, particularly used in communication equipment with a metal structure, and has high flexibility.
Specifically, the grounding structure mainly comprises a wire transmission section 1, a grounding structure section 2, a balance connection section 3, a dielectric layer 4 and a floor structure 5, wherein the dielectric layer 4 and the floor structure 5 are overlapped, the dielectric layer 4 is positioned above the floor structure 5 to form a planar grounding structure, the wire transmission section 1, the grounding structure section 2 and the balance connection section 3 are arranged on the dielectric layer 4 in a tiled mode, and the connection between the wire transmission section 1 and the grounding structure section 2 is realized through the balance connection section 3 on the dielectric layer 4. Still further:
the wire transmission section 1 is a signal receiving and transmitting part of the grounding structure, can be respectively connected with the signal equipment and the external wire structure and is used for receiving an external transmission signal sent by the external wire structure and sending the external transmission signal to the signal equipment for the signal equipment to use;
the grounding structure section 2, i.e. the grounding part of the grounding structure, is used for connecting the floor structure 5 to realize the grounding function of the grounding structure;
the balance connecting section 3 is used for realizing the connection between the wire transmission section 1 and the grounding structure section 2 so as to realize the regulation and control functions of transmission signals and further realize the regulation and control functions of the working state of signal equipment;
the dielectric layer 4 essentially belongs to the wire transmission section 1, the grounding structure section 2 and the bearing structure of the balance connection section 3;
The floor structure 5 is then connected to the ground structure section 2 via the dielectric layer 4 for the purpose of grounding.
On the basis, in order to realize effective utilization of the grounding structure, the size information and the position information of the balance connecting section 3 can be further set to correspond to the working state of the signal equipment, that is, for the balance connecting section 3, the different sizes and the deployment positions of the balance connecting section correspond to the different working states of the signal equipment, so that the grounding structure can realize regulation and control design on the working state of the signal equipment by adjusting the size information and the position information of the balance connecting section 3, and effective utilization of the grounding structure is realized.
It should be noted that, regarding the above-mentioned various structures (the wire transmission section 1, the grounding structure section 2, the balance connection section 3, the dielectric layer 4, the floor structure 5), the materials used, the positions set, the sizes used, the connection modes between different structures, etc. may all be set by the technicians in a customized manner according to the actual needs, which is not limited in the embodiment of the present invention. Therefore, the schematic structural diagram shown in fig. 1 is only one example, but not the only example, of the structure provided by the embodiment of the present invention.
The ground structure provided by the embodiment of the invention mainly comprises a wire transmission section, a ground structure section, a balance connection section, a dielectric layer and a floor structure, wherein the wire transmission section, the ground structure section and the balance connection section are all arranged on the dielectric layer in a tiled mode, and the floor structure is overlapped at the bottom of the dielectric layer and is connected with the ground structure section through the dielectric layer to realize ground, so that the ground structure in a plane form is realized, and the space occupation is effectively saved; in addition, the grounding structure can be connected with the signal equipment through the wire transmission section of the grounding structure, and the size information and the position information of the balance connection section in the grounding structure correspond to the working state of the signal equipment, so that the grounding structure can regulate and control the working state of the signal equipment by adjusting the size information and the position information of the balance connection section, and the effective utilization of the grounding structure is realized. On the basis, the production cost is further reduced by effectively saving space resources and using higher utilization rate.
Based on the above embodiments:
in one embodiment of the invention, the wire transmission section 1 and the ground structure section 2 are arranged in parallel; the balance connection section 3 is respectively and vertically connected with the wire transmission section 1 and the grounding structure section 2.
The embodiment of the invention provides a deployment mode of a wire transmission section 1, a grounding structure section 2 and a balance connection section 3 on a medium layer 4, namely the wire transmission section 1 and the grounding structure section 2 are arranged on the medium layer 4 in parallel, and the balance connection section 3 is perpendicular to the wire transmission section 1 and the grounding structure section 2 to realize the connection relationship of the wire transmission section 1 and the grounding structure section 2.
It will be appreciated that the deployment described above is that shown in fig. 1. It should be noted that the above deployment manner is only one implementation manner provided by the embodiment of the present invention, and is not exclusive, and the connection between the wire transmission section 1 and the ground structure section 2 may be achieved based on the balanced connection section 3, for example, the wire transmission section 1 and the ground structure section 2 are not arranged in parallel, but are not intersected, and the balanced connection section 3 may be connected by a straight line/curve/broken line to connect the wire transmission section 1 and the ground structure section 2.
In one embodiment of the invention, the size information may include the length of the balanced connection section 3; the position information may include the vertical connection position of the balanced connection section 3 on the wire transmission section 1.
The embodiment of the invention provides a specific type of size information and position information, wherein the size information can comprise the length of the balanced connection section 3, and the position information can comprise the vertical connection position of the balanced connection section 3 on the wire transmission section 1. For example, referring to fig. 2, fig. 2 is a schematic illustration of a size structure of a balanced connection section according to an embodiment of the present invention, wherein L is a length of the balanced connection section 3, and H is a vertical connection position of the balanced connection section 3 on the wire transmission section 1. As described above, for the balanced connection section 3, the different sizes and deployment positions thereof correspond to different working states of the signal device, so that the grounding structure can regulate the working states of the signal device by adjusting the size information and the position information of the balanced connection section 3, and correspondingly, can regulate the working states of the signal device by adjusting the length L of the balanced connection section 3 and the vertical connection position H thereof on the wire transmission section 1.
In addition, the thickness of the dielectric layer 4, the length of the conductive wire transmission section 1, the length of the grounding structure section 2, the type of the connected signal equipment and the like all have different effects on the working state of the signal equipment, and these factors can be set by technicians in a self-defined manner according to actual requirements. Furthermore, the influence factors can be set uniformly in advance, so that the working state of the signal equipment can be regulated and controlled only by adjusting the length of the balance connecting section 3 and the vertical connecting position of the balance connecting section on the wire transmission section 1 in the production process.
In one embodiment of the present invention, the operating state of the signal device may be the operating frequency of the signal device.
The embodiment of the invention provides the working state, namely the working frequency, of a specific type of signal equipment. That is, the adjustment and control of the operating frequency of the signal device can be achieved by adjusting the size information and the position information of the balance link 3. The working frequency may specifically be a resonant frequency.
On this basis, referring to fig. 3 in combination with the above embodiment of the present invention, fig. 3 is a schematic diagram of operating frequency points when adjusting different positions of the balanced connection section according to the embodiment of the present invention, in this embodiment, the designed horizontal length L of the balanced connection section 3 is 5mm, and when the vertical connection positions H on the wire transmission section 1 are 1mm, 4mm, and 8mm, it can be seen that the resonant frequencies of the signal devices are 2.366GHz, 2.41GHz, and 2.47GHz, respectively. Therefore, the working frequency of the signal equipment can be regulated and controlled by adjusting the length of the balance connecting section 3 and the vertical connecting position of the balance connecting section on the wire transmission section 1.
In one embodiment of the present invention, the balanced connection 3 may be disposed on the dielectric layer 4 in a straight line shape, or disposed on the dielectric layer 4 in a curved shape, or disposed on the dielectric layer 4 in a zigzag shape.
The embodiment of the invention provides a balance connecting section 3 with several different shapes, which can be in a straight line shape, a curve shape or a fold line shape. That is, the specific shape of the balance connecting section 3 does not affect the implementation of the present technical solution, and can be set by a technician according to actual situations. For example, referring to fig. 4 and 5, fig. 4 is a top view of a first grounding structure provided in an embodiment of the present invention, in which the balance connecting section 3 is disposed on the dielectric layer 4 in a straight line shape, and fig. 5 is a top view of a second grounding structure provided in an embodiment of the present invention, in which the balance connecting section 3 is disposed on the dielectric layer 4 in a curved line shape, and the shape of the fold line is similar.
In one embodiment of the invention, the balanced connection section 3 may be a rectangular metal wire having a first preset thickness.
The embodiment of the invention provides a balanced connection section 3 of a specific material type, namely a rectangular metal wire with a first preset thickness. Correspondingly, the rectangular metal wire can be arranged on the dielectric layer 4 in a straight line shape (as shown in fig. 4), or arranged on the dielectric layer 4 in a curve shape (as shown in fig. 5), or arranged on the dielectric layer 4 in a fold line shape. The specific value of the first preset thickness does not affect implementation of the technical scheme, and the technical scheme is set by a technician according to actual requirements, so that the invention is not limited to the specific value, and the smaller the value is, the smaller the occupied space is, and the lower the production cost is.
In one embodiment of the invention, the wire transmission section 1 may include a signal input and a signal output;
the signal input end is connected with the external input lead structure and is used for receiving an input signal sent by the external input lead structure;
the signal output end is connected with the signal equipment and is used for sending output signals to the signal equipment.
In an embodiment of the invention, the wire transmission section 1 may comprise a signal input for enabling signal reception and a signal output for enabling signal transmission, as will be apparent. More specifically, the signal input end may be connected to an external input wire structure, and may be used to receive an input signal sent by the external input wire structure; the signal output may then be connected to a signal device, which may be used to send an output signal to the signal device. For example, referring to fig. 6, fig. 6 is a top view of a third grounding structure according to an embodiment of the present invention, wherein a signal input end 9 and a signal output end 10 in a wire transmission section 1 are shown in fig. 6.
In one embodiment of the invention, both the input signal and the output signal may be electromagnetic wave signals.
The embodiment of the invention provides a specific type of transmission signal (comprising an input signal and an output signal), namely an electromagnetic wave signal, which is commonly used in signal equipment.
In one embodiment of the present invention, the wire transmission section 1 may be disposed on the dielectric layer 4 in a straight line shape, or disposed on the dielectric layer 4 in a curved shape, or disposed on the dielectric layer 4 in a zigzag shape.
The embodiment of the invention provides a wire transmission section 1 with several different shapes, which can be in a straight line shape, a curve shape or a broken line shape. That is, the specific shape of the wire transmission section 1 does not affect the implementation of the present technical solution, and can be set by a technician according to actual situations. It will be appreciated that the description of the shape of the wire transmission section 1 is similar to the balanced connection section 3 described above, and the specific shape of the balanced connection section 3 in fig. 4 and 5 is shown, which is not repeated here in this embodiment.
In one embodiment of the invention, the wire transfer section 1 may be a rectangular metal wire having a second predetermined thickness.
The embodiment of the invention provides a wire transmission section 1 of a specific material type, namely a rectangular metal wire with a second preset thickness. Correspondingly, the rectangular metal wire can be arranged on the dielectric layer 4 in a straight line shape, or arranged on the dielectric layer 4 in a curve shape, or arranged on the dielectric layer 4 in a fold line shape. In addition, similar to the first preset thickness, the specific value of the second preset thickness does not affect the implementation of the technical scheme, and the technical scheme is set by a technician according to actual requirements.
In one embodiment of the present invention, please refer to fig. 7, fig. 7 is a schematic structural diagram of a grounding structure section provided in an embodiment of the present invention, wherein the grounding structure section 2 may include a rectangular metal wire 7 with a third preset thickness and a periodic metal cylinder 8;
rectangular metal wires 7 may be disposed on the dielectric layer 4;
the periodic metal cylinder 8 vertically penetrates through the dielectric layer 4, the top of the periodic metal cylinder 8 is connected to the rectangular metal wire 7, and the bottom of the periodic metal cylinder 8 is connected to the floor structure 5.
The present embodiment provides a specific type of ground structure section 2 that essentially comprises a rectangular metal wire 7 having a third preset thickness and a periodic metal cylinder 8. The rectangular metal wire 7 is similar to the wire transmission section 1 and the balance connection section 3 and is arranged on the dielectric layer 4 in a tiled manner, and the rectangular metal wire 7 has a certain thickness, namely the third preset thickness, and of course, the specific value of the third preset thickness does not affect the implementation of the technical scheme, and the technical scheme is set by a technician according to actual requirements. Furthermore, the periodic metal cylinder 8 is composed of a plurality of metal cylinders, each metal cylinder can vertically penetrate through the dielectric layer 4, the top of each metal cylinder is connected to the rectangular metal wire 7, and the bottom of each metal cylinder is connected to the floor structure 5, so that the grounding function is realized, of course, the size, the interval size and the like of each metal cylinder in the periodic metal cylinder 8 do not affect the implementation of the technical scheme, and the metal cylinders are set by technicians according to actual requirements, so that the invention is not limited.
In one embodiment of the present invention, the rectangular metal wire 7 may be disposed on the dielectric layer 4 in a straight line shape, or disposed on the dielectric layer 4 in a curved shape, or disposed on the dielectric layer 4 in a zigzag shape.
The embodiment of the invention provides rectangular metal wires 7 with different shapes, which can be in a straight line shape, a curve shape or a broken line shape. That is, the specific shape of the rectangular metal wire 7 does not affect the implementation of the present technical solution, and can be set by a technician according to the actual situation. It will be appreciated that the description of the shape of the rectangular metal wire 7 is similar to the balanced connection section 3 described above, and the specific form thereof may refer to the balanced connection section 3 in fig. 4 and 5, and this embodiment will not be repeated here.
In one embodiment of the invention, the periodic metal cylinders 8 may comprise a preset number of metal cylinders of the same diameter and of the same height; the metal cylinders are arranged at preset intervals.
The embodiment of the present invention provides a specific type of periodic metal cylinders 8, which may include a predetermined number of metal cylinders having the same diameter and the same height (i.e., each metal cylinder has the same diameter and the same height, and each metal cylinder is identical), and the metal cylinders are arranged at predetermined intervals, and of course, the arrangement form thereof follows the arrangement form of rectangular metal wires 7 on the dielectric layer 4, as shown in fig. 7. Further, referring to fig. 8, fig. 8 is a top view of a fourth grounding structure according to an embodiment of the present invention, it is obvious that the diameters of the metal cylinders 8 are the same and the intervals are equal.
It should be noted that, the specific values of the preset number, diameter, height and preset interval do not affect the implementation of the technical scheme, and the technical scheme is set by a technician according to actual requirements, which is not limited by the invention.
In one embodiment of the invention, the height of the metal cylinder is the same as the thickness of the dielectric layer 4.
In the embodiment of the invention, the height of the metal cylinder can be set to be the same as the thickness of the dielectric layer 4, namely, the metal cylinder just penetrates through the dielectric layer 4 and has no protrusion, and obviously, the design form can effectively reduce unnecessary space occupation and save space occupation resources as much as possible. In one possible implementation, the thickness of the dielectric layer 4 may be set to 0.1mm, and the height of each of the periodic metal cylinders 8 is also set to 0.1mm.
In one embodiment of the present invention, the dielectric layer 4 may be a non-conductive medium having a predetermined dielectric constant.
The embodiment of the invention provides a specific type of dielectric layer 4, which may be specifically a non-conductive medium with a preset dielectric coefficient. It will be appreciated that in the ground structure, the dielectric layer 4 serves only as a carrier structure for the conductor transmission section 1, the ground structure section 2 and the balanced connection section 3, and does not take over the signal transmission effect, so that a non-conductive medium may be selected as the dielectric layer 4. In addition, the specific value of the preset dielectric coefficient does not affect the implementation of the technical scheme, and the technical scheme is set by a technician according to actual requirements, so that the invention is not limited.
In one embodiment of the invention, the dielectric layer 4 and the floor structure 5 may be rectangular structures having the same length and the same width.
The embodiment of the invention provides a dielectric layer 4 and a floor structure 5 with specific shape structures, namely, the dielectric layer 4 and the floor structure 5 can be rectangular structures with the same length and the same width, and are in a superposition relationship, and the floor structure 5 is superposed at the bottom of the dielectric layer 4. In order to reduce the size of the grounding structure as much as possible, the length of the rectangular structure may be set to be equal to the length of the wire transmission section 1 and the balance connection section 3 (for example, the lengths of the wire transmission section 1 and the balance connection section 3 may be set to be equal to each other and respectively set on two rectangular sides parallel to each other on the rectangular structure dielectric layer 4, as shown in fig. 4 to 6 and 8, the width of the rectangular structure is set to be equal to the length of the grounding structure section 2).
In one embodiment of the invention, both the dielectric layer 4 and the floor structure 5 may be of a flexible material.
The embodiment of the invention provides a dielectric layer 4 and a floor structure 5 which are made of specific materials, namely, the dielectric layer 4 and the floor structure 5 are made of bendable materials. It can be appreciated that the use of the flexible material is conducive to the application of the grounding structure to any non-planar (e.g., curved) application device, so as to achieve the bonding between the grounding structure and the application device, and to meet different scene requirements, thereby having higher applicability and practicability.
In one embodiment of the invention, the bottom of the floor structure 5 may be provided with an adhesive for securing the ground structure to a target location.
The grounding structure provided in the embodiment of the present invention may be provided with an adhesive on the bottom of the floor structure 5, so that the grounding structure may be fixed (i.e. adhered) to a target position by the adhesive, where, of course, the target position is generally an adaptive position in the application device. Wherein the adhesive material can be glue, self-adhesive glue and other materials. Further, referring to fig. 9, fig. 9 is a schematic view of an application scenario of a grounding structure according to an embodiment of the present invention, which may be adhered to a metal plane 11 of an application device by an adhesive on the bottom of a floor structure 5.
The second embodiment of the invention provides a signal device.
In this embodiment, taking an antenna structure as an example, please refer to fig. 10, fig. 10 is a schematic structural diagram of an antenna grounding structure provided in this embodiment of the present invention, where the antenna grounding structure may include any one of the grounding structures (including a wire transmission section 1, a grounding structure section 2, a balanced connection section 3, a dielectric layer 4, a floor structure 5) and an antenna structure 6; the antenna structure 6 is connected to the wire transmission section 1 in the ground structure.
The signal device provided by the embodiment of the invention mainly comprises a wire transmission section, a grounding structure section, a balance connection section, a dielectric layer, a floor structure and a signal equipment structure, wherein the wire transmission section, the grounding structure section and the balance connection section are all arranged on the dielectric layer in a tiled mode, and the floor structure is overlapped at the bottom of the dielectric layer and is connected with the grounding structure section through the dielectric layer to realize grounding, so that the signal device in a plane form is realized, and space occupation is effectively saved; in addition, the signal device can be connected with the signal equipment through the wire transmission section, and the size information and the position information of the balance connection section correspond to the working state of the signal equipment, so that the signal device can regulate and control the working state of the signal equipment by adjusting the size information and the position information of the balance connection section, and the effective utilization of the signal device is realized. On the basis, the production cost is further reduced by effectively saving space resources and using higher utilization rate.
In one embodiment of the invention, the signal device may be a monopole antenna, or a dipole antenna, or other antenna.
The embodiments of the present invention provide several specific types of signaling devices. It should be noted that, the grounding structure provided by the present invention is suitable for any type of signal equipment, so that the specific type of signal equipment does not affect the implementation of the present technical solution.
For the description of the signal device provided in the embodiment of the present invention, reference is made to the above embodiment related to the grounding structure, and the description of the present invention is omitted herein.
The third embodiment of the invention provides an antenna grounding structure.
Referring also to fig. 10, the antenna grounding structure as shown in fig. 10 may include a wire transmission section 1, a grounding structure section 2, a balanced connection section 3, a dielectric layer 4, a floor structure 5, and an antenna structure 6.
1. The wire transmission section 1 is a metal wire positioned on the dielectric layer 4 and is used for realizing the conductive input of electromagnetic wave signal transmission, and mainly comprises a signal input end and a signal output end, wherein the signal input end is used for being connected with an external input wire structure and receiving an input signal sent by the external input wire structure (the input connection can adopt an electromagnetic wave signal connection method); the signal output end is used for connecting the antenna structure 6 and sending output signals to the antenna structure 6. And, the middle part of wire transmission section 1 connects balanced linkage section 3 and forms integrative connection with ground structure section 2 through balanced linkage section 3. In addition, the wire transmission section 1 is generally a rectangular metal wire with a certain thickness, and of course, may be a curved or zigzag structure.
2. The grounding structure section 2 is used for being connected with the floor structure 5 and realizing the grounding function of the grounding structure, and is connected with the wire transmission section 1 through the balance connection section 3, and mainly comprises a metal wire and periodic metal cylinders, wherein the metal wire is positioned on the dielectric layer 4, the periodic metal cylinders are a plurality of metal cylinders which have the same diameter, the same height and are arranged at equal intervals, and each metal cylinder is connected on the metal wire and penetrates through the dielectric layer 4 to be connected with the floor structure 5 at the lower part of the dielectric layer 4. In addition, the metal wires in the grounding structure section 2 are generally rectangular and straight structures, but of course, curved or zigzag structures are also possible, and the individual metal cylinders connected with the metal wires are arranged and distributed along the linear structure of the metal wires.
3. The balance connection section 3 is used for connecting the wire transmission section 1 and the grounding structure section 2 to realize adjustment control of electromagnetic transmission radiation, and can be a metal wire positioned on the dielectric layer 4, specifically positioned in the middle of the wire transmission section 1 and the grounding structure section 2, and connects the wire transmission section 1 and the grounding structure section 2.
4. The dielectric layer 4 is used for bearing the wire transmission section 1, the grounding structure section 2, the balance connection section 3 and the like, is a dielectric material with a certain dielectric coefficient, is usually a non-conductor medium, and is provided with the wire transmission section 1, the grounding structure section 2 and the balance connection section 3 at the upper part and the floor structure 5 at the lower part of the dielectric layer 4. It should be noted that the thickness of the dielectric layer 4 may be the same as the height of the periodic metal cylinder in the ground structure section 2, where when the thickness of the dielectric layer 4 is kept small, it may still be ensured that the signal at the signal input end in the wire transmission section 1 is conducted to the wire transmission section 1 and conducted to the antenna structure 6 via the wire transmission section 1 for radiation transmission.
5. The floor structure 5 is a ground structure part of the overall antenna ground structure.
6. The antenna structure 6 is used for realizing radiation of electromagnetic waves, and can be a metal structure with an antenna function, which is connected with the wire transmission section 1, and the connection contact position of the antenna structure 6 and the wire transmission section 1 can be any position on the wire transmission section 1, and furthermore, the antenna structure 6 can be a monopole or other linear structure antenna form of a known antenna structure.
Furthermore, the planar whole of the antenna ground structure may be curved and may be adhered to the surface of the application device.
On the basis, the method for regulating and controlling the working state of the antenna structure 6 is as follows:
it will be appreciated that the effect of the antenna ground structure on the operating frequency of the electromagnetic wave may be affected by a number of factors, such as the thickness of the dielectric layer 4, the length of the wire transmission section 1, the length of the ground structure section 2, the size and connection location of the balanced connection section 3, the antenna structure 6, etc. Under the condition that other structural factors are set uniformly, the control of the working frequency of the antenna structure 6 can be realized by defining the values of the vertical connection position and the horizontal length of the balance connection section 3.
The antenna grounding structure mainly comprises a wire transmission section, a grounding structure section, a balance connection section, a dielectric layer, a floor structure and an antenna structure, wherein the wire transmission section, the grounding structure section and the balance connection section are all arranged on the dielectric layer in a tiled mode, the floor structure is overlapped at the bottom of the dielectric layer and is connected with the grounding structure section through the dielectric layer to realize grounding, so that the antenna grounding structure in a plane form is realized, and space occupation is effectively saved; in addition, the antenna grounding structure can be connected with the antenna structure through the wire transmission section, and the size information and the position information of the balance connection section correspond to the working state of the antenna structure, so that the antenna grounding structure can regulate and control the working state of the antenna structure by adjusting the size information and the position information of the balance connection section, and the effective utilization of the antenna grounding structure is realized. On the basis, the production cost is further reduced by effectively saving space resources and using higher utilization rate.
In the description, each embodiment is described in a progressive manner, and each embodiment is mainly described by the differences from other embodiments, so that the same similar parts among the embodiments are mutually referred. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software modules may be disposed in Random Access Memory (RAM), memory, read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The technical scheme provided by the invention is described in detail. The principles and embodiments of the present invention have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present invention and its core ideas. It should be noted that it will be apparent to those skilled in the art that the present invention may be modified and practiced without departing from the spirit of the present invention.

Claims (19)

1. The grounding structure is characterized by comprising a wire transmission section, a grounding structure section, a balance connection section, a dielectric layer and a floor structure;
the wire transmission section, the grounding structure section and the balance connection section are all arranged on the medium layer, and the wire transmission section and the grounding structure section are connected through the balance connection section;
the floor structure is arranged at the bottom of the dielectric layer and is connected with the grounding structure section through the dielectric layer;
the wire transmission section is used for connecting signal equipment, and the size information and the position information of the balance connection section correspond to the working state of the signal equipment;
Wherein the ground structure section comprises a rectangular metal wire having a third preset thickness and a periodic metal cylinder; the rectangular metal wire is arranged on the dielectric layer; the periodic metal cylinder vertically penetrates through the dielectric layer, the top of the periodic metal cylinder is connected with the rectangular metal wire, and the bottom of the periodic metal cylinder is connected with the floor structure.
2. The ground structure of claim 1, wherein the wire transfer section and the ground structure section are disposed in parallel;
the balance connection section is respectively and vertically connected with the wire transmission section and the grounding structure section.
3. The ground structure of claim 2, wherein the dimensional information includes a length of the balanced connection section;
the position information includes a vertical connection position of the balanced connection section on the wire transfer section.
4. The ground structure of claim 1, wherein the operating state of the signal device is an operating frequency of the signal device.
5. The grounding structure of claim 1, wherein the balanced connection section is disposed on the dielectric layer in a straight line shape, or disposed on the dielectric layer in a curved shape, or disposed on the dielectric layer in a broken line shape.
6. The grounding structure of claim 1, wherein said balanced connection section is a rectangular metal wire having a first predetermined thickness.
7. The ground structure of claim 1, wherein the wire transfer section includes a signal input and a signal output;
the signal input end is connected with an external input lead structure and is used for receiving an input signal sent by the external input lead structure;
the signal output end is connected with the signal equipment and is used for sending an output signal to the signal equipment.
8. The grounding structure as in claim 7, wherein the input signal and the output signal are both electromagnetic wave signals.
9. The grounding structure of claim 1, wherein the wire transmission section is disposed on the dielectric layer in a straight line shape, or disposed on the dielectric layer in a curved shape, or disposed on the dielectric layer in a zigzag shape.
10. The grounding structure of claim 1, wherein said wire transfer section is a rectangular metal wire having a second predetermined thickness.
11. The grounding structure of claim 1, wherein the rectangular metal wire is disposed on the dielectric layer in a straight line shape, or disposed on the dielectric layer in a curved shape, or disposed on the dielectric layer in a zigzag shape.
12. The grounding structure of claim 1, wherein said periodic metal cylinders comprise a predetermined number of metal cylinders of the same diameter and the same height;
the metal cylinders are arranged at preset intervals.
13. The grounding structure of claim 12, wherein the height of said metal cylinder is the same as the thickness of said dielectric layer.
14. The grounding structure of claim 1, wherein said dielectric layer is a non-conductive dielectric having a predetermined dielectric constant.
15. The ground structure of claim 1, wherein the dielectric layer and the floor structure are rectangular structures having the same length and the same width.
16. The grounding structure of claim 1, wherein said dielectric layer and said floor structure are both flexible materials.
17. The grounding structure as in claim 1, wherein the floor structure bottom is provided with an adhesive for securing the grounding structure to a target location.
18. A signalling device comprising a ground structure according to any one of claims 1 to 17 and a signalling device;
The signal device is connected with a wire transmission section in the grounding structure.
19. The signaling apparatus of claim 18, wherein the signaling device is a monopole antenna, or a dipole antenna, or other antenna.
CN202311227091.8A 2023-09-22 2023-09-22 Grounding structure and signal device Active CN116979255B (en)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009044151A (en) * 2007-08-07 2009-02-26 Samsung Electro Mech Co Ltd Electromagnetic band gap structure and printed-circuit substrate
JP2011114595A (en) * 2009-11-27 2011-06-09 Kyocera Corp Connection structure of high frequency circuit and rectangular waveguide high frequency line
JP2016173917A (en) * 2015-03-17 2016-09-29 岡谷電機産業株式会社 Terminal metal fitting for terminal base
JP2017059680A (en) * 2015-09-16 2017-03-23 京セラ株式会社 Wiring board, semiconductor element package and semiconductor device
CN110534924A (en) * 2019-08-16 2019-12-03 维沃移动通信有限公司 Antenna modules and electronic equipment
CN112563737A (en) * 2020-11-02 2021-03-26 中山大学 Dual-frequency antenna comprising periodic leaky-wave structure and manufacturing method thereof
CN113540733A (en) * 2021-07-21 2021-10-22 上海交通大学 Vertical switching structure
CN116093596A (en) * 2023-01-18 2023-05-09 珠海正和微芯科技有限公司 Millimeter wave broadband package antenna

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW531074U (en) * 2002-05-29 2003-05-01 Quanta Comp Inc Wire connector

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009044151A (en) * 2007-08-07 2009-02-26 Samsung Electro Mech Co Ltd Electromagnetic band gap structure and printed-circuit substrate
JP2011114595A (en) * 2009-11-27 2011-06-09 Kyocera Corp Connection structure of high frequency circuit and rectangular waveguide high frequency line
JP2016173917A (en) * 2015-03-17 2016-09-29 岡谷電機産業株式会社 Terminal metal fitting for terminal base
JP2017059680A (en) * 2015-09-16 2017-03-23 京セラ株式会社 Wiring board, semiconductor element package and semiconductor device
CN110534924A (en) * 2019-08-16 2019-12-03 维沃移动通信有限公司 Antenna modules and electronic equipment
CN112563737A (en) * 2020-11-02 2021-03-26 中山大学 Dual-frequency antenna comprising periodic leaky-wave structure and manufacturing method thereof
CN113540733A (en) * 2021-07-21 2021-10-22 上海交通大学 Vertical switching structure
CN116093596A (en) * 2023-01-18 2023-05-09 珠海正和微芯科技有限公司 Millimeter wave broadband package antenna

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Circular Polarized Ground Radiation Antenna for Mobile Applications;Longyue Qu;IEEE Transactions on Antennas and Propagation;全文 *
Via arrays for grounding in multilayer packaging - frequency limits and design rules;T. Tischler等;IEEE MTT-S International Microwave Symposium Digest, 2003;全文 *
一种新型双层PBG微带线;张友俊, 侯继红, 李英;吉林大学学报(工学版)(第03期);全文 *
基于数据传输的小型天线系统研究;陆潇琛;廖斌;;现代电子技术(第24期);全文 *

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