CN116963391A - Electronic circuit module and method for manufacturing the same - Google Patents
Electronic circuit module and method for manufacturing the same Download PDFInfo
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- CN116963391A CN116963391A CN202210377658.9A CN202210377658A CN116963391A CN 116963391 A CN116963391 A CN 116963391A CN 202210377658 A CN202210377658 A CN 202210377658A CN 116963391 A CN116963391 A CN 116963391A
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- circuit board
- electronic
- circuit module
- electronic circuit
- molded part
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title description 21
- 239000000463 material Substances 0.000 claims abstract description 59
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 21
- 238000005476 soldering Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to an electronic circuit module and a manufacturing method thereof, which can prevent poor connection caused by peeling caused by heat load during solder reflow soldering. The electronic circuit module (10) comprises: the electronic circuit board comprises a circuit board (11), electronic components (15 a, 15 b) mounted on the upper surface (11 b) of the circuit board (11), and a molded component (16) covering the upper surface (11 b) and the side surface (11 c) of the circuit board (11) in such a manner that the electronic components (15 a, 15 b) are embedded therein. Lower region (11 c) of side face (11 c) of circuit board (11) 1 ) Is not covered by the molded part (16) and is exposed. Thereby, formed on the end face (16 c) and the lower region (11 c) of the molded part (16) 1 ) A kind of electronic deviceThe space (S) between the two parts can function as a receiving part of the underfill material, so that even if the underfill material passes over the base part, peeling generated during solder reflow is not easily spread.
Description
Technical Field
The present invention relates to an electronic circuit module and a method for manufacturing the same, and more particularly, to an electronic circuit module capable of multiple mounting and a method for manufacturing the same.
Background
Patent document 1 discloses an electronic circuit module having a structure in which a first circuit board is mounted on a second circuit board, and then the second circuit board is mounted on a third circuit board. In the case of such multiple mounting, since solder reflow is performed when the first circuit board is mounted on the second circuit board and solder reflow is also performed when the second circuit board is mounted on the third circuit board, the first circuit board is subjected to multiple reflow.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 2020-35993
Disclosure of Invention
Technical problem to be solved by the invention
In the case of filling an underfill material between the first circuit board and the second circuit board, there is a problem that, when the underfill material reaches the upper surface of the molded part covering the first circuit board, peeling is likely to occur at the interface between the molded part covering the first circuit board and the molded part covering the second circuit board when solder reflow is performed. In addition, even when the underfill material is not used, peeling easily occurs at the interface between the lower surface (mounting surface) of the first circuit board and the molded member covering the second circuit board when solder reflow is performed.
Such peeling and spreading cause a problem of poor connection. Such a problem becomes particularly remarkable in the case of performing reflow soldering a plurality of times.
Accordingly, an object of the present invention is to provide an electronic circuit module and a method for manufacturing the same, in which connection failure is less likely to occur due to peeling caused by a heat load during solder reflow.
Technical scheme for solving technical problems
The electronic circuit module (also referred to as an electronic circuit assembly) of the present invention is characterized by comprising: a first circuit board provided with a plurality of terminal electrodes on a lower surface; an electronic component mounted on an upper surface of the first circuit board opposite to the lower surface; and a first molded part covering the upper surface of the first circuit board and a side surface connecting the upper surface and the lower surface in such a manner that the electronic part is buried therein, at least a part of a lower region on the lower surface side among the side surfaces of the first circuit board being exposed without being covered by the first molded part.
According to the present invention, since the space formed between the end surface of the first molded member and the lower region of the side surface of the first circuit board functions as the receiving portion of the underfill material, even if the underfill material passes over the base portion, peeling generated at the time of solder reflow is less likely to spread. In addition, even in the case where the underfill material is not used, since peeling easily occurs at the interface of the inner surface of the first molded member and the side surface of the first circuit board, stress can be released by peeling this portion. This can prevent the occurrence of defective connection due to peeling caused by a heat load.
In the present invention, the portion of the first molded member covering the side surface of the first circuit board may have an inner surface contacting the side surface of the first circuit board and an outer surface located on the opposite side of the inner surface, and the outer surface may protrude further toward the lower surface side of the first circuit board than the inner surface. This makes it possible to more easily house the underfill material at the upper portion. In this case, an end surface connecting the lower end portion of the outer surface and the lower end portion of the inner surface may have a tapered shape protruding toward the lower surface side of the first circuit board with distance from the side surface of the first circuit board. This makes it possible to further easily house the underfill material at the upper portion.
The electronic circuit module of the present invention may be further configured to include: a second circuit board having a first circuit board mounted on an upper surface thereof; and a second molded part covering an upper surface of the second circuit board in such a manner that the first circuit board is buried therein. This can prevent peeling at the interface between the first molded member and the second molded member, defective connection of other electronic components mounted on the second circuit board, and the like. In this case, it may be further configured to include an underfill material between the lower surface of the first circuit board and the upper surface of the second circuit board, the underfill material covering the side surface of the first circuit board exposed from the first mold member. Alternatively, the second mold member may cover a side surface of the first circuit board exposed from the first mold member.
The electronic circuit module of the present invention may further include a third circuit board on which the second circuit board is mounted. Thus, when the second circuit board is mounted on the third circuit board and solder reflow is performed, occurrence of defects in the first circuit board and the second circuit board can be prevented.
The method for manufacturing an electronic circuit module according to the present invention is characterized by comprising: a first step of preparing a first circuit board having a plurality of terminal electrodes provided on a lower surface and having electronic components mounted on an upper surface located on an opposite side of the lower surface, and adhering the lower surface of the first circuit board to a support; a second step of selectively covering a lower region on the lower surface side among the side surfaces connecting the upper surface and the lower surface of the first circuit board with a space forming material; a third step of forming a first molded part covering the upper surface and the side surfaces of the first circuit board in such a manner that the electronic part is buried therein; and a fourth step of, after removing the support and the space forming material, singulating (i.e., forming individual electronic circuit modules) by cutting the first molded member.
According to the present invention, the lower region of the side surface of the first circuit board can be exposed without being covered with the first mold member.
The method of manufacturing an electronic circuit module of the present invention may further include: a fifth step of preparing a second circuit board, and mounting a first circuit board on the upper surface of the second circuit board; and a sixth step of forming a second molded part covering the upper surface of the second circuit board in such a manner that the first circuit board is buried therein. According to the present invention, an electronic circuit module in which secondary mounting is performed can be provided. In this case, after the fifth step and before the sixth step, the method may further include a step of filling an underfill material between the lower surface of the first circuit board and the upper surface of the second circuit board. According to the present invention, even if the underfill material passes over the stub, peeling generated at the time of solder reflow is not easily spread.
The method of manufacturing an electronic circuit module of the present invention may further include: and a seventh step of preparing a third circuit board and mounting a second circuit board on the third circuit board. According to the present invention, an electronic circuit module in which three-time mounting is performed can be provided.
ADVANTAGEOUS EFFECTS OF INVENTION
As described above, according to the present invention, it is possible to provide an electronic circuit module and a method for manufacturing the same, in which connection failure is less likely to occur due to peeling caused by a thermal load during solder reflow.
Drawings
Fig. 1 is a schematic cross-sectional view for explaining the structure of an electronic circuit module 10 of a first embodiment of the present invention.
Fig. 2 is an enlarged view of the area a shown in fig. 1.
Fig. 3 is a schematic cross-sectional view for explaining the structure of an electronic circuit module 20 according to a second embodiment of the present invention.
Fig. 4 is a schematic sectional view for explaining the structure of the electronic circuit module 20a of the comparative example.
Fig. 5 is a schematic cross-sectional view for explaining the structure of an electronic circuit module 20b according to a third embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view for explaining the structure of an electronic circuit module 30 according to a fourth embodiment of the present invention.
Fig. 7 is a process diagram for explaining a method of manufacturing the electronic circuit module 10.
Fig. 8 is a process diagram for explaining a method of manufacturing the electronic circuit module 10.
Fig. 9 is a process diagram for explaining a method of manufacturing the electronic circuit module 10.
Fig. 10 is a process diagram for explaining a method of manufacturing the electronic circuit module 10.
Fig. 11 is a process diagram for explaining a method of manufacturing the electronic circuit module 10.
Fig. 12 is a process diagram for explaining a method of manufacturing the electronic circuit module 10.
Description of the reference numerals
10. 20, 20a, 20b, 30 electronic circuit modules;
11. 21, 31 circuit boards;
11a, 21a of the circuit board;
11b, 21b, 31 b;
11c sides of the circuit board;
11c 1 a lower region;
11c 2 an upper region;
12. 22, 32 wiring layers;
13. 23, 33 conducting conductors (also referred to as via conductors);
14a, 14b, 24a, 24b, 34b terminal electrodes;
15a, 15b, 25 electronic components;
16. 26 molding the part;
16a molding an inner surface of the part;
16b molding an outer surface of the part;
16c molding an end face of the part;
16d molding an upper surface of the part;
27a, 27b, 37 b;
28 underfill material;
29. 39 solder;
40 a support;
41 a heat-resistant sheet material;
42 heat resistant double sided tape;
a 50 dispenser;
51 space forming material;
s space.
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a schematic cross-sectional view for explaining the structure of an electronic circuit module 10 of a first embodiment of the present invention.
As shown in fig. 1, an electronic circuit module 10 of the first embodiment includes: a circuit board 11; electronic components 15a, 15b mounted on the upper surface 11b of the circuit board 11; and a mold member 16 covering the upper surface 11b and the side surface 11c of the circuit board 11 in such a manner that the electronic components 15a, 15b are buried therein. The circuit board 11 is a multilayer circuit board including a plurality of wiring layers 12 and a conductive conductor 13 connecting the wiring layers, and a plurality of terminal electrodes 14a, 14b are provided on a lower surface 11a and an upper surface 11b thereof, respectively. The structure and material of the circuit board 11 are not particularly limited, and may be a wiring body formed of a metal system, a ceramic system, a polymer system, or a composite material thereof. The lower surface 11a and the upper surface 11b of the circuit board 11 are principal surfaces on opposite sides to each other. The electronic components 15a and 15b mounted on the upper surface 11b of the circuit board 11 are connected to the corresponding terminal electrodes 14b by solder. The type of the electronic component is not particularly limited, and the electronic component 15a is a filter circuit or a semiconductor IC, and the electronic component 15b is a chip component such as a capacitor or an inductor, for example.
The molded part 16 covers not only the upper surface 11b but also the side surface 11c of the circuit board 11. The side face 11c of the circuit board 11 is a face connecting an end of the lower face 11a with an end of the upper face 11b, and is typically perpendicular with respect to the lower face 11a and the upper face 11 b. The molded part 16 does not cover the entire side face 11c of the circuit board 11, and does not cover the lower region 11c located on the lower face 11a side 1 Selectively covering only the upper region 11c located on the upper surface 11b side 2 . Thereby, the lower region 11c 1 Is uncovered by the molded part 16 and exposed. However, the lower region 11c not covered by the molded part 16 1 If it is too large, there is concern that reliability will be lowered, so that the lower region 11c is preferable 1 Narrower than the upper region 11c 2 More preferably the upper region 11c 2 Less than half of (a) of the total number of the components. In addition, the lower region 11c 1 The entire periphery (entire circumference) may be uncovered by the mold 16, or the upper region 11c may be formed in some portions of the side surface 11c 2 And a lower region 11c 1 Both covered by the molded part 16.
Among the molded parts 16, the circuit board is coveredThe portion of the side 11c of the circuit board 11 has an inner surface 16a that contacts the side 11c of the circuit board 11 and an outer surface 16b that is located on the opposite side of the inner surface 16 a. The inner surface 16a is substantially parallel to the outer surface 16b. The outer surface 16b protrudes further toward the lower surface 11a of the circuit board 11 than the inner surface 16 a. In the present embodiment, an end surface 16c connecting a lower end portion of the outer surface 16b and a lower end portion of the inner surface 16a has a tapered shape protruding toward the lower surface 11a side of the circuit board 11 as being away from the side surface 11c of the circuit board 11. Thereby, the end face 16c of the molded part 16 and the lower region 11c of the side face 11c of the circuit board 11 1 Forming a space S. As shown in fig. 2 (a), which is an enlarged view of the region a shown in fig. 1, the height H of the space S is preferably about 15 μm to 300 μm, and the width W of the space S is preferably about 15 μm to 250 μm. The space S functions as a storage portion for an underfill material described later.
However, the end face 16c of the molded part 16 does not necessarily have to be tapered, but may be stepped as shown in fig. 2 (b), or may be flat as shown in fig. 2 (c). When the end face 16c of the molded member 16 is stepped as shown in fig. 2 b, the space S has a more closed (biased closed) shape, and the function as the receiving portion is improved, but on the other hand, the width W of the space S is reduced, so that the capacity of the space S is reduced. In addition, when the end face 16c of the molded member 16 is flat as shown in fig. 2 (c), the capacity of the space S increases, but on the other hand, the space S has a more open (biased open) shape, and thus the function as a housing portion decreases. In view of these, as shown in fig. 1, the end face 16c of the molded member 16 is most preferably tapered (conical shape).
Fig. 3 is a schematic cross-sectional view for explaining the structure of an electronic circuit module 20 according to a second embodiment of the present invention.
The electronic circuit module 20 of the second embodiment has a structure in which the electronic circuit module 10 shown in fig. 1 is laminated on another circuit board 21. The circuit board 21 is a multilayer circuit board including a plurality of wiring layers 22 and a conductive conductor 23 connecting the wiring layers, and a plurality of terminal electrodes 24a, 24b are provided on a lower surface 21a and an upper surface 21b thereof, respectively. The lower surface 21a of the circuit board 21 is covered with a solder resist 27a except for the exposed portions of the terminal electrodes 24 a. The upper surface 21b of the circuit board 21 is covered with a solder resist 27b except for the exposed portion of the terminal electrode 24b. The electronic circuit module 10 shown in fig. 1 is mounted on the upper surface 21b of the circuit board 21. The connection of the circuit board 21 and the circuit board 11 is performed by solder 29. Other electronic components 25 may be mounted on the upper surface 21b of the circuit board 21.
The upper surface 21b of the circuit board 21 is covered with the molded member 26 in such a manner that the electronic circuit module 10 and the electronic component 25 are buried therein. In the example of fig. 3, an underfill material 28 is filled between the lower surface 11a of the circuit board 11 and the upper surface 21b of the circuit board 21. In this case, the lower region 11c of the side 11c of the circuit board 11 1 Covered by an underfill material 28. Here, the over-cut underfill material 28 overflows from the lower surface 11a of the circuit board 11 to reach the outer surface 16b of the molded member 16, but in the present embodiment, since the electronic circuit module 10 has the space S, a part of the over-cut underfill material 28 is accommodated in the space S, whereby unnecessary diffusion of the underfill material 28 can be suppressed. In particular, the underfill material 28, although covering a portion of the outer surface 16b of the molded member 16, does not reach the upper surface 16d of the molded member 16 by having the space S.
Here, as in the electronic circuit module 20a of the comparative example shown in fig. 4, when the excessive underfill material 28 reaches the upper surface 16d of the molded part 16, peeling (arrow B) of the interface of the underfill material 28 and the molded part 26 sometimes spreads (transfers) to the electronic part 25 along the upper surface 16d of the molded part 16, so that the electrically connected portion of the electronic part 25 and the circuit board 21 is broken. In the present embodiment, however, a part of the over-rest underfill material 28 is accommodated in the space S, and hence peeling as indicated by the arrow B becomes difficult to reach the upper surface 16d of the molded member 16. Therefore, even if peeling occurs at the interface between the underfill material 28 and the molded member 26, the expansion of peeling stops at the outer surface 16b of the molded member 16, and further peeling is not likely to occur.
Fig. 5 is a schematic cross-sectional view for explaining the structure of an electronic circuit module 20b according to a third embodiment of the present invention.
The electronic circuit module 20b of the third embodiment differs from the electronic circuit module 20 shown in fig. 3 in that no underfill material is used. In this case, the lower region 11c of the side 11c of the circuit board 11 1 Covered by the molded part 26. In the case where the underfill material is not used, peeling at the interface of the molded part 26 and the underfill material does not occur, but this means that there is little place where stress due to the thermal load can be released. Therefore, the stress due to thermal expansion of the solder 29 may cause peeling at the interface between the lower surface 11a of the circuit board 11 and the molded member 26, and thus there is a concern that poor connection may occur between the electronic circuit module 10, the electronic components 15a, 15b, and the circuit board 21. However, in the present embodiment, since the interface between the side surface 11c of the circuit board 11 and the molded member 16 is in a state of being easily peeled off due to the presence of the space S, the stress can be released by peeling off the portion. Since no element or electrode is present on the side surface 11c of the circuit board 11, even if the peeling occurs in this portion, the operation of the electronic circuit module 20b does not fail.
Fig. 6 is a schematic cross-sectional view for explaining the structure of an electronic circuit module 30 according to a fourth embodiment of the present invention.
The electronic circuit module 30 of the fourth embodiment has a structure in which the electronic circuit module 20 shown in fig. 3 is further laminated on another circuit board 31. The circuit board 31 is a multilayer circuit board including a plurality of wiring layers 32 and a conductive conductor 33 connecting the wiring layers, and a plurality of terminal electrodes 34b are provided on an upper surface 31b thereof. The upper surface 31b of the circuit board 31 is covered with a solder resist 37b except for the exposed portion of the terminal electrode 34b. The electronic circuit module 20 shown in fig. 3 is mounted on the upper surface 31b of the circuit board 31. The connection of the circuit board 31 and the circuit board 21 is made by solder 39. On the upper surface 31b of the circuit board 31, other electronic circuit modules and electronic components not shown may be mounted.
In the manufacturing process of the electronic circuit module 30 having such a structure, solder reflow is performed when the electronic circuit module 10 is mounted on the circuit board 21, and solder reflow is also performed when the electronic circuit module 20 is mounted on the circuit board 31. That is, a thermal load is applied to the electronic circuit module 20a plurality of times. However, in the present embodiment, since unnecessary expansion of the underfill material 28 can be suppressed as described above, the electronic circuit module 10, the electronic component 25, and the like are less likely to be connected poorly due to expansion of peeling caused by a heat load.
Next, a method for manufacturing the electronic circuit module 10 according to the first embodiment of the present invention will be described.
First, as shown in fig. 7, a plurality of circuit boards 11 on which electronic components 15a and 15b are mounted are prepared, and the lower surface 11a of the circuit board 11 is adhered to a support 40. In the example shown in fig. 7, the support 40 is composed of a heat-resistant plate 41 and a heat-resistant double-sided tape 42, and the lower surface 11a of the circuit board 11 is adhered to the heat-resistant double-sided tape 42. As the heat-resistant sheet material (heat-resistant sheet material) 41, a core material formed of resin having a thickness of about 0.3mm can be used. The heat-resistant double-sided tape 42 preferably has an adhesive strength of about 0.5 to 5N/20mm and an adhesive (paste) thickness of 15 μm or more. This is because, when the adhesive strength is too low, the circuit board 11 peels off at the time of formation of the molded member 16, and when the adhesive strength is too high, mechanical peeling becomes difficult, and when the adhesive thickness is too thin, the circuit board 11 peels off.
Next, as shown in fig. 8, by supplying a liquid space forming material 51 from the dispenser 50, the surface of the support body 40 located between the adjacent circuit boards 11 is covered with the space forming material 51. As the space forming material 51, a thermosetting resin mixture is preferably used, and a material which is in a liquid form and can be applied (coated) by the dispenser 50 and can be adjusted in viscosity by heating is more preferable. In order to facilitate the subsequent peeling, a material having a large difference in linear expansion coefficient from the molded member 16 is preferable. Thereby, the side face 11c of the circuit board 11 is covered with the space formation material 51. At this time, the entire side face 11c of the circuit board 11 is not covered with the space formation material 51, but the upper region 11c is not covered 2 Selectively covering the lower region 11c 1 . Thereafter, as shown in FIG. 9, the space-forming material is madeThe material 51 is dried and solidified. Here, since the space forming material 51 before curing is in a liquid state (liquid state), the surface of the space forming material 51 is tapered due to the surface tension.
Next, as shown in fig. 10, the molded member 16 is supplied so as to cover the plurality of circuit boards 11. As a method of supplying the molded member 16, a dispensing (dispersion) method, a printing method, a rotary molding method, a compression molding method, or the like can be used. Thus, the electronic components 15a and 15b mounted on the upper surface 11b of the circuit board 11 are embedded in the molded member 16, and the space between adjacent circuit boards 11 is filled with the molded member 16. Thereafter, as shown in fig. 11, when the support body 40 and the space formation material 51 are removed, the side 11c of the circuit board 11 becomes the upper region 11c 2 Covered by the moulded part 16 and the lower region 11c 1 Exposed state.
Then, as shown in fig. 12, by cutting the molded member 16 to be singulated (to form individual electronic circuit modules 10), a plurality of electronic circuit modules 10 shown in fig. 1 can be obtained. With such a method, by the amount of the space-forming material 51 (i.e., by adjusting the amount of the space-forming material 51), the lower region 11c exposed from the molded part 16 can be adjusted 1 Is a part of the area of the substrate. The end face 16c of the molded member 16 can be formed into a tapered shape depending on the surface tension of the space formation material 51, and the angle of the tapered shape can be adjusted by the viscosity of the space formation material 51 or the like.
The electronic circuit module 10 thus manufactured can be mounted on another circuit board 21. After the electronic circuit module 10 is mounted on another circuit board 21, the underfill material 28 is supplied and further buried by the mold member 26, so that the electronic circuit module 20 shown in fig. 3 can be configured. The electronic circuit module 20 can be further mounted on another circuit board 31. Thus, the electronic circuit module 30 shown in fig. 6 can be manufactured.
While the preferred embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the gist of the present invention, and these are naturally included in the scope of the present invention.
Claims (11)
1. An electronic circuit module, comprising:
a first circuit board provided with a plurality of terminal electrodes on a lower surface;
an electronic component mounted on an upper surface of the first circuit board opposite to the lower surface; and
a first molded part covering the upper surface of the first circuit board and a side surface connecting the upper surface and the lower surface in such a manner that the electronic part is buried therein,
at least a portion of a lower region of the side face of the first circuit board located on the lower surface side is exposed without being covered by the first molded member.
2. The electronic circuit module of claim 1, wherein:
a portion of the first molded part covering the side surface of the first circuit board, having an inner surface in contact with the side surface of the first circuit board and an outer surface on an opposite side of the inner surface,
the outer surface protrudes toward the lower surface side of the first circuit board than the inner surface.
3. An electronic circuit module as claimed in claim 2, characterized in that:
an end surface connecting a lower end portion of the outer surface and a lower end portion of the inner surface has a tapered shape protruding toward the lower surface side of the first circuit board as being away from the side surface of the first circuit board.
4. An electronic circuit module as claimed in any one of claims 1 to 3, further comprising:
a second circuit board on which the first circuit board is mounted on an upper surface; and
a second molded part covering the upper surface of the second circuit board in such a manner that the first circuit board is buried therein.
5. The electronic circuit module of claim 4, further comprising:
an underfill material between the lower surface of the first circuit board and the upper surface of the second circuit board,
the underfill material covers the side surface of the first circuit board exposed from the first molded part.
6. The electronic circuit module of claim 4, wherein:
the second molded part covers the side surface of the first circuit board exposed from the first molded part.
7. The electronic circuit module of claim 4, further comprising:
and a third circuit board on which the second circuit board is mounted.
8. A method of manufacturing an electronic circuit module, comprising:
a first step of preparing a first circuit board having a plurality of terminal electrodes provided on a lower surface and having electronic components mounted on an upper surface opposite to the lower surface, and adhering the lower surface of the first circuit board to a support;
a second step of selectively covering a lower region on the lower surface side of a side surface of the first circuit board connecting the upper surface and the lower surface with a space formation material;
a third step of forming a first molded part covering the upper surface and side surfaces of the first circuit board in such a manner that the electronic part is buried therein; and
and a fourth step of forming a single electronic circuit module by cutting the first molded member after removing the support and the space forming material.
9. The method of manufacturing an electronic circuit module according to claim 8, further comprising:
a fifth step of preparing a second circuit board, and mounting the first circuit board on an upper surface of the second circuit board; and
and a sixth step of forming a second molded member covering the upper surface of the second circuit board in such a manner that the first circuit board is buried therein.
10. The method of manufacturing an electronic circuit module according to claim 9, further comprising:
and filling an underfill material between the lower surface of the first circuit board and the upper surface of the second circuit board after the fifth step and before the sixth step.
11. The method of manufacturing an electronic circuit module according to claim 9 or 10, further comprising:
and a seventh step of preparing a third circuit board and mounting the second circuit board on the third circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210377658.9A CN116963391A (en) | 2022-04-12 | 2022-04-12 | Electronic circuit module and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210377658.9A CN116963391A (en) | 2022-04-12 | 2022-04-12 | Electronic circuit module and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116963391A true CN116963391A (en) | 2023-10-27 |
Family
ID=88441286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210377658.9A Pending CN116963391A (en) | 2022-04-12 | 2022-04-12 | Electronic circuit module and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116963391A (en) |
-
2022
- 2022-04-12 CN CN202210377658.9A patent/CN116963391A/en active Pending
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