CN116963381A - Process for improving surface dyne value of FPC (Flexible printed Circuit) substrate - Google Patents
Process for improving surface dyne value of FPC (Flexible printed Circuit) substrate Download PDFInfo
- Publication number
- CN116963381A CN116963381A CN202310943847.2A CN202310943847A CN116963381A CN 116963381 A CN116963381 A CN 116963381A CN 202310943847 A CN202310943847 A CN 202310943847A CN 116963381 A CN116963381 A CN 116963381A
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- CN
- China
- Prior art keywords
- semi
- substrate
- finished substrate
- fpc
- alkaline liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 15
- 239000003814 drug Substances 0.000 claims abstract description 14
- 239000002344 surface layer Substances 0.000 claims abstract description 8
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 230000003628 erosive effect Effects 0.000 claims description 3
- 108090000623 proteins and genes Proteins 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 24
- 239000004642 Polyimide Substances 0.000 abstract description 9
- 229920001721 polyimide Polymers 0.000 abstract description 9
- 239000003513 alkali Substances 0.000 abstract description 7
- 230000003746 surface roughness Effects 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000003344 environmental pollutant Substances 0.000 abstract description 3
- 230000005571 horizontal transmission Effects 0.000 abstract description 3
- 231100000719 pollutant Toxicity 0.000 abstract description 3
- 239000002904 solvent Substances 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 125000000879 imine group Chemical group 0.000 description 1
- 231100001240 inorganic pollutant Toxicity 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 108090000765 processed proteins & peptides Proteins 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/057—Shape retainable
Abstract
The invention discloses a process for improving the surface dyne value of an FPC (flexible printed circuit) substrate, which is characterized in that a semi-finished substrate to be pasted with a reinforcing plate is subjected to a horizontal groove with alkaline liquid medicine, so that the outermost surface layer of the semi-finished substrate is corroded by the alkaline liquid medicine in the horizontal groove, and an uneven interface is formed on the surface of the semi-finished substrate. The technology fully utilizes the characteristic of the alkali-resistant solvent of polyimide, and in the process, the semi-finished substrate of the reinforcing plate to be adhered passes through a horizontal alkaline groove liquid, and finally the smooth PI surface of the outermost surface layer of the semi-finished substrate is attacked and corroded by the alkaline liquid to form an uneven interface by a certain concentration of the alkaline liquid and a certain horizontal transmission rate, and the PI surface pollutants are cleaned together, so that the specific surface area of the uneven PI surface area is increased compared with that of the original material, the surface roughness of the material is obviously increased, and the PI surface dyne value can be effectively improved, thereby improving the binding force with the reinforcing plate.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a process for improving the dyne value of the surface of an FPC substrate.
Background
The flexible circuit board is made of flexible insulating base materials, has the advantages that the PCB hard circuit board does not have, can be freely bent, rolled and folded, can be randomly arranged according to space layout requirements, and can be randomly moved and stretched in a three-dimensional space, so that the integration of component assembly and wire connection is achieved, the volume and weight of an electronic product can be greatly reduced by applying the FPC, and the flexible circuit board is suitable for the requirement of the electronic product for developing towards high density, miniaturization and high reliability, therefore, the FPC is widely applied in the fields of aerospace, military, mobile communication, portable computers, wearable consumer electronics and the like, and meanwhile, the FPC also has good heat dissipation, weldability and the like.
However, the FPC has the disadvantage that the devices mounted on the FPC are single-sided, and the devices cannot be mounted on both sides of the same area due to the softness of the material of the FPC, even if the single-sided mounting device generally needs to additionally design and add a reinforcing plate (commonly referred to as a reinforcing plate in industry) on the back of the corresponding area to perform the supporting function of the local area, and the reinforcing plate material and the material of the FPC are bonded by using a thermosetting adhesive.
Because the flexible circuit board processing process flow generally needs at least more than thirty processes, even hundreds of complex process flows, the PI (PI material, namely Polyimide, is mainly a polymer containing a peptide imine structure, and is called Polyimide for short, because the PI has the conjugation effect of aromatic heterocycle, the main chain bond energy is large, intermolecular force is large, and the molecular chain presents rigidity, so that the high molecular material has excellent heat resistance, chemical stability, excellent mechanical property and electrical property, and is widely applied to the high-tech fields of aviation, aerospace, electric, microelectronic, automobile circuits and the like), after a plurality of processes, particularly high-temperature pressing or baking processes, a large amount of organic matters volatilized at high temperature are attached to the PI surface of the PI, once the excessive organic matters are deposited, the most direct expression is that the value of the PI surface of the substrate (the value of the material is the tension coefficient, the value of the PI surface of the substrate is higher, the value of the PI is more strong than the surface of the substrate, and the other glue values are lower than the value of the substrate, and the value of the PI in the FPC is more direct expression is lower than the value of the material surface of the substrate, so that the product is very poor in quality, and the product is very poor in the strength, and the poor in the strength is caused by the fact that the bonding value of the surface of the FPC is lower.
In order to solve the problems, the PI surface of FPC is usually treated by corona to increase the dyne value of PI surface in industry, and the principle of corona treatment material is to utilize high-frequency high voltage to perform corona discharge on PI surface to generate low-temperature plasma, so that free radical reaction is generated on PI surface, polymer is crosslinked, and the surface roughness of material is improved, thereby increasing the dyne value of PI surface. Because the PI surface is treated by the corona machine, organic and inorganic pollutants are removed from the surface, the surface is activated and the surface energy is increased, the dyne value of the PI surface can be obviously improved, however, over time, the additives in the material can migrate to the surface of the material to influence the corona effect, so that the interval time from the FPC after corona to the laminating reinforcing plate needs to be strictly controlled, certain trouble is brought to production and manufacture, and meanwhile, corona machine equipment needs to be independently invested to cause higher production cost. In addition, there is a PI surface treatment of FPC using a plasma flushing process of carbon tetrafluoride, but high equipment investment is required as well, and the working efficiency of the chamber type plasma flushing process is extremely low, which is not suitable for mass production process, and also has a problem of timeliness management.
Disclosure of Invention
In order to solve the technical problems, the invention provides a process for improving the dyne value of the surface of an FPC (flexible printed circuit) substrate, which is to be adhered with a reinforcing plate, the semi-finished substrate passes through a horizontal groove with alkaline liquid medicine, so that the outermost surface layer of the semi-finished substrate is corroded by the alkaline liquid medicine in the horizontal groove, and an uneven interface is formed on the surface of the semi-finished substrate.
When the semi-finished substrate passes through the horizontal alkaline bath solution, the concentration of the alkaline bath solution and the transmission rate of the semi-finished substrate are controlled so as to control the surface erosion amount of the semi-finished substrate.
Further, the alkaline liquid medicine is NaOH with the concentration of 5 percent, and the transmission rate of the semi-finished substrate is 1 to 1.5 meters/min.
According to the technical scheme, the polyimide material commonly used in the FPC is very excellent in mechanical property, heat resistance, low temperature resistance and radiation resistance, is widely applied to the field of electronic circuits as an electrical insulation material, and is a high acid resistance material, but the polyimide material has the characteristics of poor alkali resistance and hydrolysis when meeting strong alkali, so that the technology fully utilizes the characteristic of a polyimide non-alkali solvent, and in the process, a semi-finished substrate to be adhered with a reinforcing plate passes through a horizontal alkaline bath solution, and is subjected to alkaline liquid medicine with a certain concentration and a certain horizontal transmission rate, so that the PI on the outermost surface layer of the semi-finished substrate is finally attacked by the alkaline liquid medicine, after the smooth surface of the PI layer is reacted by the liquid medicine, the surface forms an uneven interface, the surface pollutant on the PI surface caused by each station in the prior process is also cleaned, the specific surface area of the uneven PI is increased simultaneously, the surface roughness of the material is obviously increased compared with the specific surface area of the original material, and the binding force effect between the PI and the reinforcing plate can be effectively improved.
Drawings
FIG. 1 is an SEM image (3000X) of the original PI surface;
fig. 2 is an SEM image (3000X) of PI surface after alkaline washing.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below.
The present embodiment provides a process for improving the dyne value of the surface of an FPC substrate, wherein a semi-finished substrate (surface effect shown in fig. 1) to be laminated with a reinforcing plate is passed through a horizontal groove having an alkaline liquid medicine, so that the outermost surface layer of the semi-finished substrate is eroded by the alkaline liquid medicine in the horizontal groove, thereby forming an uneven interface (surface effect shown in fig. 2) on the surface of the semi-finished substrate.
Wherein, when the semi-finished substrate passes through the horizontal alkaline bath solution, the concentration of the alkaline bath solution is controlled to be NaOH with 5 percent concentration, and the transmission rate of the semi-finished substrate is 1 to 1.5 meters per minute, so as to effectively realize the control of the surface erosion amount of the semi-finished substrate.
Because the polyimide material commonly used in FPC is very excellent in mechanical property, heat resistance, low temperature resistance and radiation resistance, and is widely applied to the field of electronic circuits as an electrical insulating material, but the polyimide material has the characteristics of poor alkali resistance and hydrolysis when meeting strong alkali, therefore, the technology fully utilizes the characteristics of polyimide not alkali-resistant solvent, semi-finished base materials of the reinforcing plate to be adhered are subjected to horizontal alkaline bath liquid in the process, through alkaline liquid with a certain concentration and a certain horizontal transmission rate, finally, the PI on the outermost surface layer of the semi-finished base materials is attacked and corroded by the alkaline liquid, after the smooth surface of the PI layer is subjected to the liquid reaction, the surface forms uneven interfaces, surface pollutants caused by various stations in the prior process on the surface of the PI are also cleaned together, the specific surface area of the PI is increased simultaneously compared with the specific surface area of the original material, the surface roughness of the PI is obviously increased, the surface roughness of the PI is effectively improved, the PI is not influenced by the time after the alkaline washing product, the PI surface is kept not influenced by the time, and the bonding force between the reinforcing plate and the reinforcing effect is improved.
In addition, the process can directly utilize the horizontal line body film removing line in the existing process, and the roughening effect on the surface layer of the outermost layer of PI and the dyne value of the PI surface can be improved by using NaOH with the concentration of 5% in the horizontal line body film removing line and adjusting the line speed of the conventional film removing from 3 meters/min to 1-1.5 meters/min, so that the investment of equipment is effectively saved.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to the embodiments described above will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (3)
1. A process for improving the gene value of the surface of FPC substrate is characterized in that the semi-finished substrate to be pasted with a reinforcing plate is passed through a horizontal groove with alkaline liquid medicine, so that the outermost surface layer of the semi-finished substrate is eroded by the alkaline liquid medicine in the horizontal groove, and an uneven interface is formed on the surface of the semi-finished substrate.
2. The process for increasing the surface dyne value of an FPC substrate according to claim 1, wherein the concentration of the alkaline liquid medicine and the transfer rate of the semi-finished substrate are controlled to control the amount of surface erosion of the semi-finished substrate when the semi-finished substrate passes through the horizontal alkaline bath.
3. The process for increasing the dyne value on the surface of an FPC substrate according to claim 2, wherein the alkaline liquid medicine is NaOH of 5% concentration, and the transfer rate of the semi-finished substrate is 1 to 1.5 m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310943847.2A CN116963381A (en) | 2023-07-28 | 2023-07-28 | Process for improving surface dyne value of FPC (Flexible printed Circuit) substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310943847.2A CN116963381A (en) | 2023-07-28 | 2023-07-28 | Process for improving surface dyne value of FPC (Flexible printed Circuit) substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116963381A true CN116963381A (en) | 2023-10-27 |
Family
ID=88461608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310943847.2A Pending CN116963381A (en) | 2023-07-28 | 2023-07-28 | Process for improving surface dyne value of FPC (Flexible printed Circuit) substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116963381A (en) |
-
2023
- 2023-07-28 CN CN202310943847.2A patent/CN116963381A/en active Pending
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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