CN116940101A

CN116940101A - Electronic component supply device

Info

Publication number: CN116940101A
Application number: CN202310187111.7A
Authority: CN
Inventors: 韩庆准; 尹硕晙; 李泰彬
Original assignee: Avaco Co Ltd
Current assignee: Avaco Co Ltd
Priority date: 2022-04-21
Filing date: 2023-02-21
Publication date: 2023-10-24
Also published as: KR20230149937A; KR102598074B1

Abstract

The present invention relates to an electronic component supply device, which includes: a feeding unit for feeding the electronic component to a feeding position; a magazine unit including a plurality of slots for inserting electronic components received from the supply unit, and having at least one of the plurality of slots sequentially located at the supply position; and a pick-up unit for picking up a plurality of electronic components inserted into the plurality of slots and placing the picked-up plurality of electronic components on a tray.

Description

Electronic component supply device

Technical Field

The present invention relates to an electronic component supply apparatus for supplying electronic components to subsequent equipment such as inspection equipment and mounting equipment.

Background

After the manufacturing process, the electronic component is applied to an electronic device or the like through an inspection process, a mounting process, and the like. The inspection step may be performed by inspection equipment as a step of inspecting whether or not the electronic component is operating normally, whether or not the appearance is damaged or broken, or the like. The mounting process may be performed by a chip Mounter (mount) as a process of mounting an electronic component onto a substrate using a surface mount technology (SMT; surface Mount Technology).

Recently, development and application of a multilayer chip ceramic capacitor (MLCC; multi Layer Ceramic Condensor) in an electronic component are actively underway. The multilayer chip ceramic capacitor performs an inspection process by a lamination inspection apparatus for inspecting lamination defects.

Among them, the electronic component feeding device in the related art provides electronic components such as a multilayer chip ceramic capacitor in such a manner that they are picked up and transferred one by one. Accordingly, the electronic component supplying apparatus in the related art increases the time required for supplying the electronic component such as the multilayer chip ceramic capacitor, thereby causing a delay in the inspection process of the lamination inspection equipment for inspecting the lamination defect, and thus has a problem of a decrease in production efficiency.

Disclosure of Invention

Technical problem

The present invention is directed to solving the above-described problems, and provides an electronic component supplying apparatus capable of shortening the time required for supplying an electronic component such as a multilayer chip ceramic capacitor.

Technical proposal

In order to solve the above technical problems, the present invention may include the following constitution.

The electronic component supplying apparatus of the present invention may include: a feeding unit for feeding the electronic component to a feeding position; a magazine unit including a plurality of slots for inserting electronic components received from the supply unit, and having at least one of the plurality of slots sequentially located at the supply position; and a pick-up unit for picking up a plurality of electronic components inserted into the plurality of slots and placing the picked-up plurality of electronic components on a tray.

Advantageous effects

According to the present invention, the following effects can be obtained.

In the present invention, the pick-up unit is capable of picking up and transferring a plurality of electronic components at one time. Therefore, the present invention can shorten the time required for supplying the electronic component. Accordingly, the present invention can prevent a delay from occurring in a subsequent process performed by subsequent equipment, thereby contributing to an increase in production efficiency of an electronic component that completes the subsequent process performed by the subsequent equipment.

Drawings

Fig. 1 is a schematic plan view of an electronic component supply device of the present invention.

Fig. 2 is a schematic perspective view of a supply unit and a magazine unit in the electronic component supply device of the present invention.

Fig. 3 is a schematic plan view of a supply unit and a magazine unit in the electronic component supply device of the present invention.

Fig. 4 is a schematic side view showing a state in which a plurality of electronic components supplied from the electronic component supply device of the present invention are mounted on a tray.

Fig. 5 is a conceptual diagram showing a relationship between a pitch between a plurality of electronic components mounted on a tray and a pitch between a plurality of slots formed in a cartridge part.

Fig. 6 is a schematic front view of a pickup unit in the electronic component feeding device of the present invention.

Fig. 7 is a schematic front sectional view showing a portion a in fig. 6 in an enlarged manner.

Fig. 8 is a schematic side sectional view showing a cartridge part in the electronic component supplying apparatus of the present invention according to the line I-I in fig. 3.

Reference numerals

1: electronic component supply device 2: feeding unit

3: cartridge unit 4: pick-up unit

5: mobile unit 6: sensor unit

7: magnet unit 100: tray for holding food

Detailed Description

Hereinafter, embodiments of the electronic component supplying apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

Referring to fig. 1, an electronic component supply apparatus 1 of the present invention is used for supplying electronic components 200 (hereinafter, shown in fig. 4). The electronic component 200 may be a multilayer chip ceramic capacitor (MLCC; multi Layer Ceramic Condensor). The electronic component feeding apparatus 1 of the present invention is capable of, after mounting a plurality of electronic components 200 on a tray 100, positioning the tray 100 at a position where a subsequent device (not shown) can pick up the plurality of electronic components 200 to feed the plurality of electronic components 200. The subsequent equipment may be inspection equipment such as lamination inspection equipment for inspecting lamination defects of the plurality of electronic components 200, a chip Mounter (mount) for mounting the plurality of electronic components 200 onto a substrate, or the like. The tray 100 may be implemented by an adhesive film that adheres a plurality of electronic components 200 by means of an adhesive.

The electronic component feeding device 1 of the present invention may include a feeding unit 2, a magazine unit 3, and a pickup unit 4.

Referring to fig. 1 to 3, the feeding unit 2 is configured to supply the electronic component 200 to the feeding position FP. When the electronic component 200 is located at the feed position FP, the electronic component 200 may be supported by the magazine unit 3. The feeding unit 2 may be provided to the main body 10. The supply unit 2 may supply the electronic component 200 to the supply position FP by vibration or the like.

For example, the feeding unit 2 may include a Bowl Feeder (Bowl Feeder) 21 and a linear Feeder 22.

The bowl feeder 21 is used for storing a plurality of electronic components 200. The bowl feeder 21 may include a storage tank for storing a plurality of electronic components 200 and a guide groove in a spiral shape. The bowl feeder 21 may sequentially supply the plurality of electronic components 200 stored in the storage tank to the linear feeder 22 by vibration or the like.

The linear feeder 22 is used to carry the electronic components 200 received from the bowl feeder 21 to the supply position FP. The linear feeder 22 may comprise a feed trough connected on one side to the bowl feeder 21 and on the other side to the feed position FP. The linear feeder 22 may feed the electronic components 200 to the supply position FP by conveying the electronic components 200 along the feed slot by vibration or the like. The in-line feeder 22 may supply the electronic component 200 to the supply position FP by injecting gas or the like.

Referring to fig. 1 to 3, the magazine unit 3 serves to collect electronic components 200 received from the supply unit 2 so that the pick-up unit 4 picks up a plurality of electronic components 200 at one time. The magazine unit 3 includes a plurality of slots 30 for inserting the electronic components 200 received from the supply unit 2. The magazine unit 3 enables at least one of the plurality of slots 30 to be positioned in sequence at the supply position FP. Therefore, the magazine unit 3 can support the plurality of electronic components 200 by the operation of sequentially positioning the plurality of slots 30 at the supply position FP by the magazine unit 3 and the operation of sequentially supplying the electronic components 200 to the supply position FP by the supply unit 2. In this state, the pick-up unit 4 is capable of picking up a plurality of electronic components 200 inserted in a plurality of the sockets 30 and placing the picked-up plurality of electronic components 200 on the tray 100.

Therefore, the pickup unit 4 of the electronic component feeding device 1 of the present invention can pick up and feed a plurality of electronic components 200 at one time, compared with the manner in which the electronic components 200 are fed one by one in the related art, and thus, the time required for feeding the electronic components 200 is shortened. Accordingly, the electronic component feeding apparatus 1 of the present invention can prevent a delay in the inspection process of the inspection equipment such as the lamination inspection equipment, and thus contributes to an increase in the production efficiency of the electronic component 200 for completing the inspection performed by the inspection equipment such as the lamination inspection equipment.

On the other hand, when the magazine unit 3 sequentially positions the plurality of slots 30 at the supply position FP at a time, the supply unit 2 may supply the plurality of electronic components 200 to the supply position FP at a time. In this case, one feeding unit 2 may supply a plurality of electronic components 200 to the feeding position FP, or a plurality of feeding units 2 may be provided to supply a plurality of electronic components 200 to the feeding position FP.

Referring to fig. 1 to 4, the cartridge unit 3 may include a cartridge part 31 and a moving mechanism 32.

The magazine member 31 is for supporting the electronic components 200 received from the supply unit 2. The cartridge part 31 may be formed with a plurality of the slots 30. A plurality of the slots 30 may be formed at positions spaced apart from each other. The cartridge part 31 may be configured such that a plurality of the slots 30 are directed toward the feeding unit 2 side. At this time, a side of the cartridge part 31 facing the feeding unit 2 may be formed to be opened by a plurality of the slots 30. Accordingly, the electronic component 200 supplied from the supply unit 2 can be inserted into the slot 30 at the supply position FP. A plurality of the slots 30 may penetrate the upper surface of the cartridge part 31. Therefore, the pick-up unit 4 can pick up the electronic components 200 inserted in the plurality of the slots 30. The cartridge member 31 may be coupled to the body 10. The cartridge part 31 can also be movably coupled to the body 10. At this time, the magazine member 31 is movable so that at least one of the plurality of slots 30 is sequentially positioned at the supply position FP.

Each of the slots 30 may be formed to have a size and shape corresponding to those of the electronic component 200. The area of each of the slots 30 may be substantially the same as the area of the electronic component 200, based on the first axis direction (X axis direction) and the second axis direction (Y axis direction). The first axis direction (X axis direction) and the second axis direction (Y axis direction) are axis directions perpendicular to each other on one horizontal plane. The thickness of each of the sockets 30 may be substantially the same as the thickness of the electronic component 200, based on the third axis direction (Z axis direction). The third axis direction (Z axis direction) is an axis direction perpendicular to the first axis direction (X axis direction) and the second axis direction (Y axis direction), respectively. The thickness of each of the slots 30 may be formed to be thinner than the thickness of the cartridge member 31, based on the third axis direction (Z axis direction). Accordingly, the electronic component 200 can be supported by the portions of the magazine member 31 disposed on the lower side of each of the slots 30.

The moving mechanism 32 is used to move the cartridge member 31. The moving mechanism 32 is capable of moving the cartridge member 31 in a direction in which the plurality of slots 30 are spaced apart from each other. When the plurality of slots 30 are arranged to be spaced apart from each other in the first axis direction (X-axis direction), the moving mechanism 32 can move the cartridge member 31 in the first axis direction (X-axis direction). The moving mechanism 32 may be coupled to the body 10. The moving mechanism 32 may move the moving mechanism 32 by a cylinder type using a hydraulic cylinder or a pneumatic cylinder, a belt type using a motor and a pulley, a rack-and-pinion type using a rack and a pinion, a linear motor type using a permanent magnet and a coil, or the like.

The moving mechanism 32 can move the cartridge member 31 stepwise so that the plurality of slots 30 are sequentially positioned at the supply position FP. As the moving mechanism 32 moves the cartridge member 31 stepwise, the cartridge member 31 stops when at least one of the plurality of slots 30 is located at the supply position FP, the cartridge member 31 moves when a preset reference time elapses, and thereafter, the cartridge member 31 stops when at least one of the plurality of slots 30 is located at the supply position FP, and the above operations can be repeatedly performed. This step movement is repeated until a plurality of slots 30 formed in the cartridge part 31 are each inserted into the electronic component 200. When the electronic components 200 inserted in the plurality of the slots 30 are picked up by the pickup unit 4, the moving mechanism 32 may again perform the stepping movement of the magazine member 31. In this way, the moving mechanism 32 of the electronic component feeding device 1 according to the present invention can move the magazine member 31 stepwise so that the plurality of slots 30 are sequentially positioned at the feeding position FP, thereby improving flexibility and accuracy in controlling the movement of the magazine member 31.

The moving mechanism 32 can move the cartridge member 31 stepwise by a unit distance of a pitch 30a (shown in fig. 3) at which the plurality of slots 30 are spaced apart from each other. When the plurality of slots 30 are spaced apart by the same pitch 30a in the first axial direction (X-axis direction), the moving mechanism 32 may move the magazine member 31 stepwise in the first axial direction (X-axis direction) by a unit distance of the pitch 30a at which the plurality of slots 30 are spaced apart from each other, so that the plurality of slots 30 are sequentially positioned at the supply position FP. Therefore, the moving mechanism 32 of the electronic component feeding device 1 of the present invention can repeat the operation of stopping the cartridge member 31 after moving by the unit distance, so that the plurality of slots 30 are sequentially located at the feeding position FP, and therefore, the flexibility and accuracy of the control of the movement of the cartridge member 31 can be further improved. A space 30a at which a plurality of the slots 30 are spaced apart from each other may represent a spaced distance between one end of one slot 30 and the other end of the other slot 30. At this time, the pitch 30a at which the plurality of slots 30 are spaced apart from each other may correspond to the length of the portion of the cartridge member 31 disposed between the plurality of slots 30.

On the other hand, when a plurality of electronic components 200 are placed on the tray 100 at intervals 200a of N (N is a real number greater than 0) along one line as shown in fig. 4, a plurality of the slots 30 may be arranged at intervals 30a of N along the first axis direction (X axis direction) as shown in fig. 3. That is, the pitch 200a at which the plurality of electronic components 200 are spaced apart from each other along one row on the tray 100 is the same as the pitch 30a at which the plurality of slots 30 are spaced apart from each other. Thereby, the pick-up unit 4 can pick up a plurality of electronic components 200 inserted in a plurality of the sockets 30 at one time, and then place the picked-up plurality of electronic components 200 on the tray 100 at one time. Accordingly, the electronic component feeding device 1 of the present invention can shorten the time required for the pickup unit 4 to transfer the plurality of electronic components 200 from the magazine unit 3 to the tray 100, and thus contributes to further increase the production efficiency of the electronic components 200 completing the subsequent process implemented by the subsequent equipment. A plurality of electronic components 200 may be placed on the tray 100 in a row and column configuration.

On the other hand, as shown in fig. 5, the pitch 30a at which the plurality of slots 30 are spaced apart from each other may be larger than the pitch 200a at which the plurality of electronic components 200 are spaced apart from each other along one line on the tray 100. At this time, the pick-up unit 4 may transfer a plurality of electronic components 200 to be mounted on the tray 100 along a line M (M is a natural number greater than 1) times. Specifically, the following is described.

First, each of the slots 30 may be formed to have a length 30b of L (L is a real number greater than 0) with reference to the first axis direction (X axis direction). At this time, the length 30b of each slot 30 is substantially the same as the length of each electronic component 200.

Next, when the pick-up unit 4 divides the plurality of electronic components 200, which are required to be mounted on the tray 100 in one row, into M transfers, a plurality of the slots 30 may be formed in the magazine member 31 at intervals of (mxn) +{ lx (M-1) } in the first axis direction (X axis direction) spaced apart from each other.

For example, as shown in the second row in fig. 5, when the pick-up unit 4 transfers a plurality of electronic components 200, which are required to be mounted on the tray 100 along a row, twice (m=2), a plurality of the slots 30 may be spaced apart from each other at a pitch of (2×n) +l in the first axis direction (X axis direction). That is, the value obtained by multiplying the pitch 200b of the plurality of electronic components 200 by 2 and the length 30b of the slot 30 are added to each other, and the value corresponds to the pitch 30a of the slot 30.

For example, as shown in the third row in fig. 5, when the pick-up unit 4 transfers a plurality of electronic components 200 to be mounted on the tray 100 along one row three times (m=3), a plurality of the slots 30 may be spaced apart from each other at intervals of (3×n) + (l×2) along the first axis direction (X axis direction). That is, the value obtained by multiplying the pitch 200b of the plurality of electronic components 200 by 3 and the value obtained by multiplying the length 30b of the slot 30 by 2 are added to each other, and the value corresponds to the pitch 30a of the slot 30.

As such, when the pick-up unit 4 transfers the plurality of electronic components 200 to be mounted on the tray 100 in one row M times, the plurality of slots 30 may be spaced apart from each other in the first axis direction (X axis direction) at intervals of (mxn) +{ l× (M-1) }. Accordingly, the electronic component supplying apparatus 1 of the present invention can obtain the following functional effects.

First, when the pitch 200a of the plurality of electronic components 200 spaced apart from each other along a row on the tray 100 and the pitch 30a of the plurality of slots 30 are identical to each other, the pitch 200a between the plurality of electronic components 200 may be very small due to the very small size of the electronic components 200. Since the pitch 30a of the plurality of slots 30 is very small, the length of the portion of the cartridge member 31 disposed between the plurality of slots 30 is also very small, and therefore, the durability is inevitably lowered. Therefore, when the pitch 200a of the plurality of electronic components 200 spaced from each other along one line on the tray 100 and the pitch 30a of the plurality of slots 30 spaced from each other are identical to each other, the risk of breakage of the magazine member 31 by impact is high.

To prevent this, in the electronic component feeding device 1 of the present invention, the pitch 30a at which the plurality of slots 30 are spaced apart from each other may be larger than the pitch 200a at which the plurality of electronic components 200 are spaced apart from each other in a row on the tray 100. Accordingly, the electronic component supplying apparatus 1 of the present invention can increase the length of the portion of the magazine member 31 disposed between the plurality of the slots 30 by the amount by which the pitch 30a at which the plurality of the slots 30 are spaced apart from each other increases. Accordingly, the electronic component supplying apparatus 1 of the present invention can reduce the degree to which the plurality of the slots 30 cause the durability of the cartridge member 31 to be reduced, thereby increasing the durability of the cartridge member 31, and thus can reduce the risk of damage or breakage of the cartridge member 31 by impact. Accordingly, the electronic component supplying apparatus 1 of the present invention can lengthen the maintenance cycle of the magazine member 31, thereby not only reducing the maintenance cost, but also contributing to further increase in the production efficiency of the electronic component 200 to complete the subsequent process performed by the subsequent equipment by increasing the operation rate. In addition, in the electronic component supplying apparatus 1 of the present invention, the space 30a between the plurality of the slots 30 is increased, so that the flexibility of the operation of forming the plurality of the slots 30 in the magazine member 31 can be improved.

Second, when the pitch 200a of the plurality of electronic components 200 spaced apart from each other along one row on the tray 100 is greater than the pitch 30a of the plurality of the slots 30 spaced apart from each other, the time required for inserting the plurality of electronic components 200 into all of the plurality of the slots 30 can be shortened. Accordingly, the waiting time of the pickup unit 4 waiting for the plurality of electronic components 200 to be inserted in the plurality of slots 30 can be shortened. Accordingly, even if the pick-up unit 4 is repeatedly moved M times between the magazine unit 3 and the tray 100 to place the plurality of electronic components 200 on the tray 100 in one row, the electronic component feeding apparatus 1 of the present invention can shorten the total operation time required for the pick-up unit 4 to transfer the plurality of electronic components 200 from the magazine unit 3 to the tray 100 by shortening the waiting time of the pick-up unit 4. Accordingly, the electronic component feeding apparatus 1 of the present invention can contribute to further increase the production efficiency of the electronic component 200 that completes the subsequent process performed by the subsequent equipment.

The moving mechanism 32 can reciprocate the cartridge member 31 between a first pickup position PP1 (shown in fig. 2) and a second pickup position PP2 (shown in fig. 2) with reference to the first axis direction (X axis direction). When the cartridge member 31 is located at the first pickup position PP1, a plurality of the slots 30 may be all located at one side of the supply position FP with reference to the first axis direction (X axis direction). When the cartridge member 31 is located at the second pick-up position PP2, a plurality of the slots 30 may be all located at the other side of the supply position FP with reference to the first axis direction (X axis direction). That is, the first pickup position PP1 and the second pickup position PP2 may be disposed on both sides of the supply position FP with reference to the first axis direction (X axis direction).

At this time, the moving mechanism 32 and the pickup unit 4 may operate as follows.

First, when the moving mechanism 32 moves the magazine member 31 from the first pick-up position PP1 to the second pick-up position PP2, the plurality of slots 30 all pass through the supply position FP and all of the plurality of slots 30 are inserted with the plurality of electronic components 200. The pick-up unit 4 may pick up the plurality of electronic components 200 inserted in the plurality of the sockets 30 at the second pick-up position PP2 and transfer to the tray 100. Thus, a plurality of the slots 30 will be in an unloaded state.

Next, when the moving mechanism 32 moves the magazine member 31 from the second pick-up position PP2 to the first pick-up position PP1, the plurality of slots 30 all pass through the supply position FP and all of the plurality of slots 30 are inserted with the plurality of electronic components 200. The pick-up unit 4 may pick up a plurality of electronic components 200 inserted in a plurality of the sockets 30 at the first pick-up position PP1 and transfer to the tray 100. In this way, a plurality of the slots 30 will be in an unloaded state.

In the electronic component feeding device 1 of the present invention, when the moving mechanism 32 makes the magazine member 31 reciprocate once between the first pickup position PPI and the second pickup position PP2 in a state where the plurality of the slots 30 are empty, the pickup unit 4 can pick up and transfer the electronic component 200 twice at the first pickup position PP1 and the second pickup position PP 2. Therefore, the electronic component feeding device 1 of the present invention can shorten the time required for transferring the electronic component 200 to the tray 100, and can shorten the time required for transferring the electronic component 200 to the subsequent equipment. Accordingly, the electronic component feeding apparatus 1 of the present invention can contribute to further increase the production efficiency of the electronic component 200 that completes the subsequent process performed by the subsequent equipment.

Referring to fig. 1 to 3, the cartridge unit 3 may include a support mechanism 33.

The supporting mechanism 33 is used for supporting a plurality of electronic components 200 inserted into a plurality of the slots 30. The support mechanism 33 may be disposed between the cartridge member 31 and the supply unit 2 with reference to the second axis direction (Y axis direction). At this time, the other portions of the cartridge member 31 than the portion located at the supply position FP may be arranged such that the plurality of slots 30 face the support mechanism 33. Accordingly, the supporting mechanism 33 can support the plurality of electronic components 200 inserted into the plurality of the slots 30 through the supply position FP, thereby stably maintaining the state in which the plurality of electronic components 200 are inserted into the plurality of the slots 30. Therefore, the electronic component supplying apparatus 1 of the present invention can prevent the loss of the plurality of electronic components 200 inserted into the plurality of the slots 30 by using the supporting mechanism 33. The support mechanism 33 may be fixedly provided to the main body 10. The cartridge part 31 can also be movably coupled to the support mechanism 33.

The support mechanism 33 may include a feed slot 331.

The feed groove 331 is used for inserting the feed unit 2. The supply tank 331 may be connected to the supply position FP. Accordingly, the supply unit 2 may be inserted into the supply groove 331 to supply the electronic component 200 to the supply position FP. The supply groove 331 may be formed to penetrate the support mechanism 33 with reference to the second axis direction (Y axis direction).

Referring to fig. 1 to 7, the pick-up unit 4 is used for transferring electronic components 200. The pick-up unit 4 is capable of picking up a plurality of electronic components 200 inserted in a plurality of the sockets 30 and placing the picked-up plurality of electronic components 200 on the tray 100. The pick-up unit 4 is capable of picking up a plurality of electronic components 200 inserted in a plurality of the sockets 30 at the first pick-up position PP1 and the second pick-up position PP2, respectively. The pick-up unit 4 is capable of picking up a plurality of electronic components 200 in an adsorption manner. At this time, the pickup unit 4 may be connected to an adsorption unit (not shown).

The pick-up unit 4 is movable in the first axis direction (X axis direction) and the second axis direction (Y axis direction) and conveys a plurality of electronic components 200. At this time, the pick-up unit 4 may be coupled to an arch (Gantry) 40. The arch 40 may be coupled to the body 10. The arch 40 is movable in the first axis direction (X axis direction) and the second axis direction (Y axis direction) of the pickup unit 4.

For example, as shown in fig. 1, the arch 40 may include a first frame 40a, a second frame 40b, a first drive mechanism 40c, and a second drive mechanism 40d. The first frame 40a may be configured to be parallel to the second axis direction (Y-axis direction). The second frame 40b is coupled to the first frame 40a so as to be movable in the second axis direction (Y axis direction). The pickup unit 4 is coupled to the second frame 40b so as to be movable in the first axis direction (X axis direction). The first driving mechanism 40c may be coupled to the first frame 40a to move the second frame 40b in the second axis direction (Y axis direction). The second driving mechanism 40d may be coupled to the second frame 40b to move the pickup unit 4 in the first axis direction (X axis direction). By such an arch 40, the pick-up unit 4 can be moved in the first axis direction (X axis direction) and the second axis direction (Y axis direction). The arch 40 may include a lifting mechanism 40e. The lifting mechanism 40e may be coupled to the pickup unit 4 to lift the pickup unit 4. Accordingly, the pick-up unit 4 can move in the third axis direction (Z axis direction) and pick up a plurality of electronic components 200 from the plurality of sockets 30 and place the plurality of electronic components 200 on the tray 100. The first driving mechanism 40c, the second driving mechanism 40d, and the lifting mechanism 40e may be implemented by a cylinder-pressing system using a hydraulic cylinder or a pneumatic cylinder, a belt system using a motor and a pulley, a rack-and-pinion system using a rack and a pinion, a linear motor system using a permanent magnet and a coil, or the like.

The pickup unit 4 may include a pickup main body 41, an adsorption mechanism 42, and a coupling mechanism 43.

The pick-up body 41 is coupled to the arch 40. The pickup main body 41 is coupled to the second frame 40b so as to be movable in the first axis direction (X axis direction). The pickup main body 41 is movable in the first axis direction (X axis direction) by the second driving mechanism 40 d. The pickup main body 41 is coupled to the second frame 40b, and thus, when the second frame 40b is moved in the second axis direction (Y axis direction) by the first driving mechanism 40c, the pickup main body 41 is movable in the second axis direction (Y axis direction). The pickup main body 41 is coupled to the second frame 40b so as to be movable up and down in the third axis direction (Z axis direction).

The suction mechanism 42 is used for sucking a plurality of electronic components 200. The suction mechanism 42 may be coupled to the pickup main body 41 by the coupling mechanism 43. Therefore, the suction mechanism 42 can move together with the pickup main body 41. The adsorption mechanism 42 may include a plurality of adsorption holes 421 (shown in fig. 7). The plurality of adsorption holes 421 may be connected to the adsorption unit through hoses, pipes, or the like. When the attractive force generated by the adsorption unit is transmitted to the plurality of electronic components 200 through the plurality of adsorption holes 421 in a state where the adsorption mechanism 42 is in contact with the plurality of electronic components 200, the plurality of electronic components 200 are adsorbed by the adsorption mechanism 42. Thereby, the pick-up unit 4 can pick up the plurality of electronic components 200 inserted in the plurality of the slots 30. When the suction means releases the suction force or generates the blowing force in a state where the plurality of electronic components 200 are sucked by the suction means 42, the suction of the plurality of electronic components 200 by the suction means 42 can be released. Thereby, the pick-up unit 4 can mount the picked-up plurality of electronic components 200 onto the tray 100. The suction mechanism 42 may include the same number of suction holes 421 as the plurality of slots 30 formed in the cartridge part 31.

The coupling mechanism 43 is for coupling the suction mechanism 42 to the pickup main body 41. The coupling mechanism 43 can couple the suction mechanism 42 to the pickup body 41 so that the suction mechanism 42 is lifted and lowered relative to the pickup body 41 by an external force applied to the suction mechanism 42. Therefore, when the suction mechanism 42 is applied with an external force such as a reaction force at the time when the pick-up unit 4 picks up a plurality of electronic components 200 from a plurality of the sockets 30 and at the time when the pick-up unit 4 mounts a plurality of electronic components 200 onto the tray 100, the suction mechanism 42 can be lifted up with respect to the pick-up main body 41 by the coupling mechanism 43. Accordingly, the electronic component feeding device 1 of the present invention can reduce the risk of damage or breakage of the plurality of electronic components 200 in the process in which the pick-up unit 4 picks up the plurality of electronic components 200 from the plurality of sockets 30 and mounts the plurality of electronic components on the tray 100.

The coupling mechanism 43 may include a first coupling member 431, a second coupling member 432, and a first elastic member 433.

The first coupling part 431 is coupled to the pickup main body 41. The first coupling part 431 may be coupled and fixed to the pickup main body 41. The first coupling part 431 may be formed with a coupling hole (not shown) for inserting the second coupling part 432. The coupling hole is formed to penetrate the first coupling member 431.

The second coupling member 432 is coupled to the adsorption mechanism 42. One side of the second coupling part 432 may be coupled and fixed to the adsorption mechanism 42. The other side of the second coupling member 432 is inserted into the first coupling member 431 to be liftable. The other side of the second coupling member 432 may be inserted into the coupling hole so as to be coupled to the first coupling member 431 in a liftable manner.

The first elastic member 433 is disposed between the first coupling member 431 and the adsorbing mechanism 42. The first elastic member 433 can elastically support the adsorption mechanism 42. Therefore, when the adsorption mechanism 42 is applied with an external force such as a reaction force, the adsorption mechanism 42 can rise and compress the first elastic member 433. When the external force such as the reaction force applied to the adsorption mechanism 42 is removed, the first elastic member 433 may be restored by the restoring force and the adsorption mechanism 42 may be lowered. Therefore, in the electronic component supplying apparatus 1 of the present invention, when the attraction mechanism 42 is applied with an external force such as a reaction force, the first elastic member 433 is used to buffer and absorb the external force applied to the attraction mechanism 42, so that the risk of damage or breakage of the plurality of electronic components 200 can be reduced. One side of the first elastic member 433 may support the lower surface of the first coupling member 431, and the other side may contact the upper surface of the adsorption mechanism 42. The first elastic member 433 may be implemented by a Spring (Spring).

The coupling mechanism 43 may also include a second elastic member 434. The second elastic member 434 may be disposed on the upper side of the first coupling member 431. At this time, the second coupling part 432 may be formed at an upper end thereof with a protruding part for supporting the first coupling part 431. One side of the second elastic part 434 may support the protruding part and the other side may contact with the upper surface of the first coupling part 431. The electronic component supplying apparatus 1 according to the present invention can buffer and absorb the external force applied to the suction mechanism 42 by the elastic force of the second elastic member 434, and thus, the risk of damage or breakage of the plurality of electronic components 200 can be reduced.

The pick-up unit 4 may comprise a buffer mechanism 44.

The buffer mechanism 44 is for contacting the plurality of electronic components 200. The buffer mechanism 44 may protrude from the adsorption mechanism 42. Therefore, when the buffer mechanism 44 is provided, the plurality of electronic components 200 can be in direct contact with the buffer mechanism 44, not in direct contact with the suction mechanism 42. The buffer mechanism 44 may be formed to be less rigid than the adsorption mechanism 42. Accordingly, the electronic component supplying apparatus 1 of the present invention can buffer and absorb the external force applied to the suction mechanism 42 by the buffer mechanism 44, and thus the risk of damage or breakage of the plurality of electronic components 200 can be reduced. The buffer mechanism 44 may be formed of a material that is elastically deformed according to an external force applied to the adsorption mechanism 42. For example, the buffer mechanism 44 may be formed of Rubber (Rubber).

The buffer mechanism 44 may be formed with a plurality of buffer holes 441 (shown in fig. 7). The plurality of buffer holes 441 are formed so as to penetrate the buffer mechanism 44. The plurality of buffer holes 441 may be connected to the plurality of adsorption holes 421, respectively. Therefore, the attractive force or the like generated by the adsorption unit may be transferred to the plurality of electronic components 200 through the plurality of adsorption holes 421 and the plurality of buffer holes 441. Therefore, the electronic component supplying apparatus 1 of the present invention can reduce the risk of damage or breakage of the plurality of electronic components 200 by using the buffer mechanism 44, and can smoothly transfer the plurality of electronic components 200 by using the plurality of buffer holes 441 by the pick-up unit 4.

Referring to fig. 1, the electronic component feeding apparatus 1 of the present invention may include a moving unit 5.

The moving unit 5 is used to move the tray 100. The moving unit 5 is capable of moving the tray 100 between a loading position 110 and an unloading position 120. In a state where the tray 100 is located at the loading position 110, a loading process of placing a plurality of electronic components 200 on the tray 100 can be performed. The loading process may be performed by the pick-up unit 4. In a state where the tray 100 is located at the unloading position 120, an unloading process of unloading a plurality of electronic components 200 from the tray 100 can be performed. The unloading process may be performed by the subsequent equipment. The loading position 110 and the unloading position 120 may be disposed at a location spaced apart from each other. Accordingly, the electronic component supply apparatus 1 of the present invention can reduce the degree of interference between the loading process and the unloading process, and thus can improve the stability of the loading process and the unloading process. In fig. 1, the loading position 110 and the unloading position 120 are shown to be spaced apart from each other in the first axis direction (X-axis direction), but not limited thereto, and the loading position 110 and the unloading position 120 may be spaced apart from each other in other directions. At this time, the unloading position 120 may be arranged to be spaced apart from the loading position 110 in a direction other than the direction in which the supply unit 2 is located.

The mobile unit 5 may be coupled to the body 10. The moving unit 5 may move the tray 100 by a cylinder type using a hydraulic cylinder or a pneumatic cylinder, a belt type using a motor and a pulley, a rack-and-pinion type using a rack and a pinion, a linear motor type using a permanent magnet and a coil, or the like. Although not shown, the moving unit 5 may move the mounting mechanism to which the tray 100 is mounted, thereby moving the tray 100.

Referring to fig. 1 to 8, the electronic component supplying apparatus 1 of the present invention may include a sensor unit 6 (shown in fig. 8).

The sensor unit 6 is used for sensing whether the electronic component 200 is inserted into the slot 30 located at the supply position FP or the slot 30 passing through the supply position FP. Accordingly, the electronic component supplying apparatus 1 of the present invention can confirm whether or not the process of inserting the electronic component 200 into the socket 30 at the supply position FP is normally performed by the sensor unit 6, and can confirm whether or not the electronic component 200 is detached from the socket 30 after inserting the electronic component 200 into the socket 30. Accordingly, the electronic component feeding device 1 of the present invention can improve the accuracy of the operation of the pick-up unit 4 to transfer the plurality of electronic components 200 inserted in the plurality of the sockets 30 to the tray 100.

For example, when the sensor unit 6 senses that there is no electronic component 200 in the slot 30 located at the supply position FP after the supply unit 2 supplies the electronic component 200 to the supply position FP, the electronic component supply apparatus 1 of the present invention can cause the supply unit 2 to additionally supply the electronic component 200 to the supply position FP without moving the magazine member 31. When the sensor unit 6 senses that the electronic component 200 is present in the slot 30 located at the supply position FP after the supply unit 2 supplies the electronic component 200 to the supply position FP, the electronic component supply apparatus 1 of the present invention can cause the supply unit 2 to supply the electronic component 200 to the supply position FP after moving the magazine member 31.

The sensor unit 6 may be coupled to the main body 10. The sensor unit 6 may be coupled to another structure coupled to the main body 10, and thus coupled to the main body 10 through the structure. The sensor unit 6 may be disposed at a position corresponding to the supply position FP with reference to the third axis direction (Z axis direction). At this time, the sensor unit 6 can sense whether the electronic component 200 is inserted into the slot 30 located at the supply position FP. The sensor unit 6 may be disposed at a position spaced apart from the supply position FP with reference to the first axis direction (X axis direction). At this time, the sensor unit 6 can sense whether the electronic component 200 is inserted into the slot 30 passing through the supply position FP. Thus, the electronic component feeding device 1 of the present invention can confirm whether the electronic component 200 is detached from the slot 30 during the movement of the magazine member 31 after the electronic component 200 is inserted into the feeding position FP.

The sensor unit 6 may include a luminescence sensor 61 and a light receiving sensor 62.

The luminescence sensor 61 is used for emitting sensing light to the slot 30. At this time, the cartridge unit 3 may include a plurality of sensing holes 311 (shown in fig. 8) formed in such a manner as to penetrate the cartridge member 31. Each of the slots 30 is provided with the sensing hole 311, respectively. When a plurality of the sensing holes 311 are provided, the sensor unit 6 can emit sensing light to the sensing holes 311. The luminescence sensor 61 may be disposed on the upper side of the cartridge member 31.

The light receiving sensor 62 is configured to receive the sensing light emitted from the luminescence sensor 61. The light receiving sensor 62 can detect whether or not the electronic component 200 is inserted into the slot 30 based on the light receiving amount of the sensing light emitted from the light emitting sensor 61. Specifically, the following is described.

First, when the electronic component 200 is inserted into the socket 30, the electronic component 200 is configured to shield the sensing hole 311. Therefore, the sensing light emitted from the luminescence sensor 61 is blocked by the electronic component 200 from passing through the sensing hole 311. Therefore, the light receiving sensor 62 cannot receive the sensing light emitted from the luminescence sensor 61, and thus can detect that the electronic component 200 is inserted into the slot 30.

Next, when the electronic component 200 is not inserted into the socket 30, the sensing light emitted from the light emitting sensor 61 can be transmitted to the light receiving sensor 62 through the sensing hole 311. Accordingly, the light receiving sensor 62 receives the sensing light emitted from the luminescence sensor 61, and thus can detect that the electronic component 200 is not inserted into the slot 30.

Second, when the electronic component 200 in the socket 30 is configured to be spaced apart from the normal position, the electronic component 200 may be configured to shield only a portion of the sensing hole 311. Therefore, only a portion of the sensing light emitted from the luminescence sensor 61 other than the portion blocked by the electronic component 200 can pass through the sensing hole 311. Therefore, the light quantity of the sensing light received by the light receiving sensor 62 is smaller than that when all the sensing light emitted by the light emitting sensor 61 is received, whereby it can be detected that the electronic component 200 is not normally inserted in the slot 30.

The light receiving sensor 62 may be disposed on the lower side of the cartridge member 31. Although not shown, the light receiving sensor 62 may be disposed on the upper side of the cartridge member 31, and the luminescence sensor 61 may be disposed on the lower side of the cartridge member 31.

The above description has been given of an embodiment in which the sensor unit 6 detects whether the electronic component 200 is inserted into the slot 30 using sensing light, but the present invention is not limited thereto, and the sensor unit 6 may detect whether the electronic component 200 is inserted into the slot 30 using a proximity sensor, a magnetic sensor, or the like.

Referring to fig. 1 to 8, the electronic component supplying apparatus 1 of the present invention may include a magnet unit 7 (shown in fig. 8).

The magnet unit 7 pulls the electronic component 200 toward the slot 30 using magnetic force. Accordingly, the electronic component supplying apparatus 1 of the present invention can guide the electronic components 200 supplied from the supply unit 2 to be normally inserted into the sockets 30 by using the magnet unit 7, and thus, can improve accuracy and stability of a process of inserting the electronic components 200 into the plurality of sockets 30. The Magnet unit 7 may be implemented by a Magnet (Magnet).

The magnet unit 7 may be coupled to the cartridge member 31. The magnet unit 7 may be located on the opposite side of the feed unit 2 with respect to the slot 30. The magnet unit 7 may be coupled to the main body 10. The magnet unit 7 may be coupled to another structure coupled to the main body 10, and coupled to the main body 10 through the structure.

When the electronic component feeding device 1 of the present invention includes one magnet unit 7, the magnet unit 7 may be configured to pull the electronic component 200 toward the slot 30 using a magnetic force at the feeding position FP. For a plurality of slots 30 passing through the supply position FP, a plurality of the electronic components 200 may be supported by the support mechanism 33. The electronic component supplying apparatus 1 of the present invention may include a plurality of magnet units 7. In this case, the plurality of magnet units 7 may be disposed at positions corresponding to the plurality of slots 30, respectively.

On the other hand, as shown in fig. 1, the electronic component feeding apparatus 1 of the present invention may transfer the electronic components 200 to the tray 100 using a plurality of feeding units 2, 2', a plurality of magazine units 3, 3', and a plurality of pickup units 4, 4 '. In this way, the electronic component supply apparatus 1 of the present invention can further shorten the time required for transferring the plurality of electronic components 200 to the tray 100, and thus can contribute to further increase the production efficiency of the electronic components 200 for completing the subsequent process performed by the subsequent equipment. The plurality of feed units 2, 2', the plurality of magazine units 3, 3', and the plurality of pickup units 4, 4' may be disposed on opposite sides with respect to the tray 100, respectively. For example, referring to fig. 1, the supply unit 2, the magazine unit 3, and the pickup unit 4 may be disposed on the upper side of the tray 100, and the supply unit 2', the magazine unit 3', and the pickup unit 4' may be disposed on the lower side of the tray 100.

It will be understood by those skilled in the art that the present invention described above is not limited to the embodiments and drawings described above, but various substitutions, modifications and changes can be made without departing from the technical spirit of the present invention.

Claims

1. An electronic component supply apparatus, comprising:

a feeding unit for feeding the electronic component to a feeding position;

a magazine unit including a plurality of slots for inserting electronic components received from the supply unit, and having at least one of the plurality of slots sequentially located at the supply position; and

and a pick-up unit for picking up a plurality of electronic components inserted into the plurality of slots and placing the picked-up plurality of electronic components on a tray.

2. The electronic component feeding device according to claim 1, wherein the magazine unit includes:

a cartridge member in which a plurality of the slots are formed at equal intervals in a first axial direction; and

and the moving mechanism takes the distance between the slots which are separated from each other along the first axis direction as a unit distance, so that the magazine part performs stepping movement, and the slots are sequentially positioned at the feeding position.

3. The electronic component supplying apparatus according to claim 1, wherein,

The cartridge unit includes: a cartridge member in which a plurality of the slots are formed at positions spaced apart from each other in a first axial direction; and a moving mechanism for moving the cartridge member in the first axial direction,

the moving mechanism moves the cartridge member back and forth between a first pickup position where the plurality of slots are all arranged on one side of the feeding position with reference to the first axis direction and a second pickup position where the plurality of slots are all arranged on the other side of the feeding position with reference to the first axis direction,

the pick-up unit picks up the plurality of electronic components inserted in the plurality of slots at the first pick-up position and picks up the plurality of electronic components inserted in the plurality of slots at the second pick-up position.

4. The electronic component supplying apparatus according to claim 1, wherein,

the cartridge unit includes: a cartridge member in which a plurality of the slots are formed at positions spaced apart from each other in a first axial direction,

when a plurality of electronic components are mounted on the tray in a row at intervals of N, a plurality of the slots are formed in the magazine member in the first axis direction at intervals of N, where N is a real number greater than 0.

5. The electronic component supplying apparatus according to claim 1, wherein,

each slot has a length of L based on the first axis direction, wherein L is a real number greater than 0,

the pick-up unit divides a plurality of electronic components mounted on the tray along a line into M transfers, where M is a natural number greater than 1,

when a plurality of electronic components are mounted on the tray in a row at intervals of N, a plurality of the slots are formed in the cartridge part at intervals of (mxn) +{ l× (M-1) } in the first axis direction at intervals of (mxn) +l× (M-1) } each other, where N is a real number greater than 0.

6. The electronic component supplying apparatus according to claim 1, wherein,

the electronic device comprises a sensor unit, wherein the sensor unit is used for sensing whether an electronic element is inserted into a slot positioned at the feeding position or a slot passing through the feeding position.

7. The electronic component supplying apparatus according to claim 6, wherein,

the cartridge unit includes: a cartridge member in which a plurality of the slots are formed at positions spaced apart from each other; and a plurality of sensing holes formed through the cartridge member,

The plurality of sensing holes are respectively connected with the plurality of slots in a communicating way,

the sensor unit includes: a luminescence sensor emitting sensing light to the sensing hole and a light receiving sensor for receiving the sensing light emitted from the luminescence sensor,

the light receiving sensor detects whether or not an electronic component is inserted in the slot based on the light receiving amount of the sensing light emitted from the light emitting sensor.

8. The electronic component supplying apparatus according to claim 1, wherein,

comprises at least one magnet unit for pulling the electronic component toward the slot side by magnetic force.

9. The electronic component feeding apparatus according to claim 1, wherein the pickup unit includes:

a pick-up body coupled to the arch;

an adsorption mechanism for adsorbing a plurality of electronic components; and

and a coupling mechanism for coupling the suction mechanism to the pickup main body and elevating the suction mechanism with respect to the pickup main body by an external force applied to the suction mechanism.

10. The electronic component supplying apparatus according to claim 9, wherein the joining mechanism includes:

a first coupling member coupled to the pickup body;

A second coupling member having one side coupled to the adsorption mechanism and the other side inserted into the first coupling member in a liftable manner; and

and a first elastic member disposed between the first coupling member and the second coupling member, for elastically supporting the second coupling member.

11. The electronic component supplying apparatus according to claim 1, wherein,

the pickup unit includes: an adsorption mechanism for adsorbing a plurality of electronic components; and a buffer mechanism protruding from the suction mechanism and contacting with the plurality of electronic components,

the rigidity of the buffer mechanism is smaller than that of the adsorption mechanism.

12. The electronic component supplying apparatus according to claim 1, wherein,

the electronic component mounting apparatus includes a moving unit that moves the tray between a loading position where the plurality of electronic components are mounted on the tray by the pick-up unit and an unloading position where the plurality of electronic components are unloaded from the tray.

13. The electronic component feeding device according to claim 1, wherein the magazine unit includes:

a cartridge member in which a plurality of the slots are formed at positions spaced apart from each other; and

and the supporting mechanism is used for supporting the electronic components which are inserted into the slots through the feeding positions.

14. The electronic component supplying apparatus according to claim 1, wherein,

the cartridge unit includes: a cartridge member in which a plurality of the slots are formed at positions spaced apart from each other; and a supporting mechanism disposed between the cartridge member and the feeding unit,

the support mechanism includes a feed slot for inserting the feed unit,

the feeding unit is inserted into the feeding groove to feed the electronic component to the feeding position.