CN116939955A - Circuit board assembly and electronic equipment - Google Patents

Abstract

The application discloses a circuit board assembly and electronic equipment. The circuit board assembly includes: the main body comprises a medium layer, a signal layer and a ground plane layer, wherein the signal layer comprises a first signal layer provided with components, the first signal layer is arranged on the side surface of the medium layer far away from the ground plane layer, the ground plane layer is embedded in the medium layer, and a fixing groove is formed in the side surface of the first signal layer far away from the medium layer; the shielding cover is covered on the first signal layer to form a shielding space, and the components are arranged in the shielding space; the fixed structure is arranged in the fixed groove, and at least part of the shielding cover extends into the fixed groove and is connected with the fixed structure, so that the shielding cover is fixed on the main body through the fixed structure, and the fixed structure is electrically connected with the ground plane layer.

Description

Circuit board assembly and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a circuit board assembly and electronic equipment.

Background

Along with the increase of the signal transmission frequency of the 5G terminal and the continuous increase of the realization functions, the number of chips and the layout area of the chips on the printed circuit board are also continuously increased.

In the prior art, in order to prevent the chip from working to radiate outwards and being disturbed by radiation, a metal shielding cover is generally used for shielding signals, no matter the metal shielding cover is an integral type and a split type shielding cover, the metal shielding cover is directly welded on a main board after being formed, but as the number of devices is increased, the size of the shielding cover is increased, the coplanarity requirement of a circuit board assembly main body and the shielding cover is strict, the welding difficulty of the shielding cover is improved, the reliability of the circuit board assembly is reduced, and improvement is needed.

Disclosure of Invention

The embodiment of the application provides a circuit board assembly and electronic equipment, which can solve the problems of the prior art that the size of a shielding cover is increased, the coplanarity requirement of a circuit board assembly main body and the shielding cover is high, the welding difficulty of the shielding cover is high, and the reliability of the circuit board assembly is reduced.

In a first aspect, an embodiment of the present application provides a circuit board assembly, including: the main body comprises a medium layer, a signal layer and a ground plane layer, wherein the signal layer comprises a first signal layer provided with components, the first signal layer is arranged on the side surface of the medium layer far away from the ground plane layer, the ground plane layer is embedded in the medium layer, and a fixing groove is formed in the side surface of the first signal layer far away from the medium layer; the shielding cover is covered on the first signal layer to form a shielding space, and the components are arranged in the shielding space; the fixed structure is arranged in the fixed groove, and at least part of the shielding cover extends into the fixed groove and is connected with the fixed structure, so that the shielding cover is fixed on the main body through the fixed structure, and the fixed structure is electrically connected with the ground plane layer.

In a second aspect, an embodiment of the present application provides an electronic device, including the circuit board assembly of the embodiment of the first aspect.

In this way, in the circuit board assembly and the electronic device provided by the embodiment of the application, the circuit board assembly comprises the body, the shielding cover and the fixing structure, the main body comprises the first signal layer provided with the components, the first signal layer is arranged on the side surface of the dielectric layer far away from the ground plane layer, the ground plane layer is embedded in the dielectric layer, the shielding cover is covered on the first signal layer to form a shielding space, the components are arranged in the shielding space, the fixing groove is arranged on the side surface of the first signal layer far away from the dielectric layer, the fixing structure is arranged in the fixing groove, at least part of the shielding cover extends into the fixing groove and is connected with the fixing structure, the fixing structure is electrically connected with the ground plane layer, so that the shielding cover is electrically connected with the ground plane layer through the fixing structure, the shielding cover plays a role of shielding the components, and the shielding cover is connected with the main body through the fixing structure, so that when the shielding cover is directly connected with the main body through the fixing structure, the shielding cover is in a welding mode, the coplanarity requirement of the main body and the shielding cover is high, the welding difficulty of the shielding cover is high, and the reliability of the circuit board assembly is lowered.

Therefore, in the embodiment of the application, the fixing structure and the main body are fixedly connected, the shielding cover is connected with the fixing structure, the shielding cover is connected with the main body through the fixing structure and is electrically connected with the ground plane layer, and the shielding cover is connected with the main body through the fixing structure, so that the problem that the reliability of the circuit board assembly is reduced due to high coplanarity requirement of the main body and the shielding cover and high welding difficulty of the shielding cover when the shielding cover and the main body are directly welded and connected is solved, and holes are not required to be formed on the surface of the shielding cover, thereby being beneficial to improving the integrity of the shielding cover, improving the shielding effect of the shielding cover and improving the reliability of the circuit board assembly.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are needed to be used in the embodiments of the present application will be briefly described, and it is possible for a person skilled in the art to obtain other drawings according to these drawings without inventive effort.

FIG. 1 is a schematic diagram of a circuit board assembly according to some embodiments of the present application;

FIG. 2 is a schematic diagram of a circuit board assembly according to some embodiments of the application;

fig. 3 is a schematic structural view of a fixing structure of a circuit board assembly according to some embodiments of the present application;

FIG. 4 is a schematic diagram of a circuit board assembly according to some embodiments of the application;

fig. 5 is a schematic structural diagram of a circuit board assembly according to some embodiments of the application.

Reference numerals illustrate:

100. a circuit board assembly;

110. a main body; 111. a dielectric layer; 112. a signal layer; 113. a horizon layer; 1121. a first signal layer; 1122. a second signal layer; 114. a component;

120. a shielding cover; 121. a top cover; 122. a sidewall; 1221. an extension section; 1222. bending sections;

130. a fixed structure; 131. a fixing groove; 132. a connection layer; 133. a conductive layer; 134. a first end face; 135. a second end face; 136. a clamping groove; 137. and (5) conductive colloid.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/" generally means a relationship in which the associated object is an "or" before and after.

In the description of the present application, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "middle," "rear," "left," "right," "clockwise," "counterclockwise," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a circuit board assembly according to some embodiments of the application.

In a first aspect, as shown in fig. 1, an embodiment of the present application provides a circuit board assembly 100, where the circuit board assembly 100 includes a main body 110, a shielding cover 120, and a fixing structure 130, the main body 110 includes a dielectric layer 111, a signal layer 112, and a ground plane layer 113, the signal layer 112 includes a first signal layer 1121 provided with a component 114, the first signal layer 1121 is disposed on a side surface of the dielectric layer 111 away from the ground plane layer 113, the ground plane layer 113 is embedded in the dielectric layer 111, and a fixing slot 131 is disposed on a side surface of the first signal layer 1121 facing away from the dielectric layer 111; the shielding cover 120 covers the first signal layer 1121 to form a shielding space, and the components 114 are disposed in the shielding space; the fixing structure 130 is disposed in the fixing slot 131, and at least a portion of the shielding cover 120 extends into the fixing slot 131 and is connected to the fixing structure 130, so that the shielding cover 120 is fixed to the main body 110 through the fixing structure 130, and the fixing structure 130 is electrically connected to the ground layer 113.

The circuit board assembly 100 comprises a main body 110, a shielding cover 120 and a fixing structure 130, wherein the main body 110 comprises a dielectric layer 111, a signal layer 112 and a ground plane layer 113, the dielectric layer 111 can be epoxy glass fiber cloth, a first signal layer 1121 is arranged on the surface of the dielectric layer 111, the first signal layer 1121 is a component 114 layer, a plurality of components 114 are arranged on the first signal layer 1121, the ground plane layer 113 is embedded in the dielectric layer 111, and the ground plane layer 113 is used for enabling the circuit board assembly 100 to be integrally grounded. In order to protect the component 114 and to alleviate the problem of interference between the circuit board assembly 100 and other components, a shield cover 120 is required to cover the component 114. The fixing structure 130 is fixedly connected with the main body 110, and the shielding cover 120 and the main body 110 are indirectly fixed through the fixing structure 130, so that the coplanarity requirement between the shielding cover 120 and the main body 110 is reduced, and the connection difficulty between the shielding cover 120 and the main body 110 is reduced. And the fixing structure 130 is electrically connected with the ground layer 113, so that the shield cover 120 and the fixing structure 130 can be electrically connected with the ground layer 113 when connected, thereby realizing the grounding of the shield cover 120 and improving the shielding effect of the shield cover 120.

In the circuit board assembly 100 and the electronic device provided in the embodiments of the present application, the circuit board assembly 100 includes a main body 110, a shielding cover 120, and a fixing structure 130. The main body 110 includes a first signal layer 1121 provided with a component 114, the first signal layer 1121 is disposed on a side surface of the dielectric layer 111 away from the ground plane layer 113, the ground plane layer 113 is embedded in the dielectric layer 111, the shielding cover 120 covers the first signal layer 1121 to form a shielding space, the component 114 is disposed in the shielding space, a fixing groove 131 is disposed on a side surface of the first signal layer 1121 away from the dielectric layer 111, the fixing structure 130 is disposed in the fixing groove 131, at least a portion of the shielding cover 120 extends into the fixing groove 131 and is connected to the fixing structure 130, and the fixing structure 130 is electrically connected with the ground plane layer 113. Through setting up fixed knot constructs 130 and main part 110 fixed connection in the fixed slot 131 to make shield cover 120 and fixed knot construct 130 connect, so that shield cover 120 is connected and is connected with the horizontal plane layer 113 electricity through this fixed knot construct 130 and main part 110, so that shield cover 120 plays the shielding effect to components and parts 114, and shield cover 120 is connected through fixed knot constructs 130 and main part 110, so that the coplanarity requirement height of main part 110 and shield cover 120 is improved, the welding degree of difficulty of shield cover 120 is big, lead to the problem that circuit board assembly 100 reliability descends, and need not to punch at shield cover 120 surface, help promoting shield cover 120's integrality, improve shield cover 120's shielding effect, promote circuit board assembly 100's reliability.

Optionally, one or more planarization layers 113 are embedded in the dielectric layer 111.

Optionally, the shield cover 120 is generally a more regular polygon, generally rectangular plate-like structure, for complete protection of the components 114 therein. The shielding cover 120 may be made of steel, iron, permalloy, or other materials with high magnetic permeability, and has good shielding effect and good structural strength. The specific material of the shielding cover 120 is not limited in the embodiment of the present application.

Optionally, the side wall and the top cover of the shielding cover 120 are integrally manufactured to improve the overall structural strength of the shielding cover 120; or the side wall of the shielding cover 120 and the top cover are prepared separately, the side wall encloses the shielding frame, and the top cover is a shielding cover connected to the shielding frame, thereby being beneficial to realizing the light and thin of the shielding cover 120.

Alternatively, the fixing structure 130 and the main body 110 are fixedly connected along the thickness direction of the main body 110, and the connection mode may be welding, bonding, riveting, bolting, or the like, and since the size of the fixing structure 130 is far smaller than that of the shielding cover 120, the welding difficulty between the fixing structure 130 and the main body 110 is smaller than that between the shielding cover 120 and the main body 110.

Alternatively, the fixing structure 130 and the shielding cover 120 may be connected by clamping or bonding. And the fixing structure 130 is a conductor so that the shield cover 120 and the fixing structure 130 are electrically connected. The fixed structure 130 may be directly in abutting electrical connection with the ground plane layer 113 or the fixed structure 130 may be connected to the signal layer 112, the signal layer 112 being electrically connected to the ground plane layer 113 through a ground via.

The fixing groove 131 is concavely formed from a side surface of the first signal layer 1121 facing away from the dielectric layer 111 toward the dielectric layer 111. The fixing groove 131 extends in the thickness direction of the body 110 at the first signal layer 1121, or the fixing signal layer 112 penetrates the first signal layer 1121 and extends in the dielectric layer 111, or the fixing groove 131 extends to the ground plane layer 113 with the ground plane layer 113 as a groove bottom of the fixing groove 131.

Alternatively, the depth of the fixing groove 131 is independent of the size of the fixing structure 130 in the thickness direction of the body 110, i.e., the fixing structure 130 may be completely received in the fixing groove 131, or the fixing structure 130 may be partially exposed to the fixing groove 131.

Optionally, the fixing structure 130 is completely accommodated in the fixing groove 131, and the fixing groove 131 may serve to enhance the integrity of the connection between the shielding cover 120 and the fixing structure 130, so as to help to improve the shielding effect of the shielding cover 120.

Optionally, the fixing groove 131 is a plurality of grooves spaced around the component 114, and part of the shielding cover 120 is accommodated in the grooves; or the fixing groove 131 is continuously arranged around the component 114, the shape of the opening of the fixing groove 131 is matched with that of the shielding cover 120, and the shielding cover 120 is in a rectangular cube in an exemplary manner, and then the notch of the fixing groove 131 is in a rectangular shape.

Optionally, the fixing structure 130 is welded or adhered to the bottom of the fixing groove 131 by conductive adhesive.

Optionally, when the fixing structure 130 is conductive colloid, the fixing groove 131 may serve to limit the flow of the conductive colloid, so as to reduce the risk of the conductive colloid flowing to other parts to cause the short circuit of the component 114.

Alternatively, the size of the fixing groove 131 is not particularly limited, but in order to fully utilize the space of the circuit board assembly 100, the size of the fixing groove 131 should be as small as possible, so that the fixing structure 130 can be disposed in the fixing groove 131.

The fixed structure 130 is arranged in the fixed slot 131, the fixed slot 131 plays a role in limiting and fixing the fixed structure 130, the risk that the fixed structure 130 is separated from the main body 110 under the action of external force is reduced, the shielding cover 120 extends into the fixed slot 131 and is connected with the fixed structure 130, the fixed slot 131 can play a role in enhancing the integrity of the joint of the shielding cover 120 and the fixed structure 130, the shielding effect of the shielding cover 120 is improved, and the reliability of the circuit board assembly 100 is improved.

In some embodiments, as shown in fig. 1, the fixing groove 131 extends to the ground plane layer 113, and the bottom of the fixing groove 131 is the ground plane layer 113.

The fixing groove 131 extends to the ground layer 113, the fixing structure 130 is directly and fixedly connected to the ground layer 113, and the fixing structure 130 and the ground layer 113 are connected in an adhesive mode or a welding mode.

In these embodiments, the fixing groove 131 extends to the ground plane layer 113, the bottom of the fixing groove 131 is the ground plane layer 113, the structure is simple, the fixing structure 130 is connected with the ground plane layer 113, the risk of breaking circuit between the fixing structure 130 and the ground plane layer 113 is reduced, and the reliability of the circuit board assembly 100 is improved.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a circuit board assembly according to some embodiments of the application.

In some embodiments, as shown in fig. 1 and 2, the fixing groove 131 extends into the dielectric layer 111, the bottom of the fixing groove 131 is spaced apart from the ground plane layer 113, the groove wall of the fixing groove 131 includes a first signal layer 1121 and the dielectric layer 111 stacked therealong, and the fixing structure 130 is electrically connected to the first signal layer 1121, and the signal layer 112 is electrically connected to the ground plane layer 113, so that the shield cover 120 is electrically connected to the ground plane layer 113.

Part of the fixing groove 131 may not extend to the ground plane layer 113, that is, the fixing structure 130 may not directly make electrical connection with the ground plane layer 113, under the influence of the circuit board assembly 100 or the process. However, the fixing groove 131 penetrates at least one first signal layer 1121 in the extending process, that is, the groove wall of part of the fixing groove 131 is the first signal layer 1121, the fixing structure 130 is a conductor, the fixing structure 130 can be electrically connected with the first signal layer 1121 located at the groove wall of the fixing groove 131, and the signal layer 112 can be electrically connected with the ground layer 113 through the ground via hole, so that the fixing structure 130 can be indirectly connected with the ground layer 113.

Optionally, the fixing structure 130 and the portion of the first signal layer 1121 located on the groove wall are abutted to realize that the fixing structure 130 and the first signal layer 1121 are electrically connected, or the fixing structure 130 and the portion of the first signal layer 1121 located on the groove wall are connected through a plating layer or an electrically conductive adhesive layer, so that the contact area of the fixing structure 130 and the portion of the first signal layer 1121 located on the groove wall is increased, and the connection reliability is improved.

In these embodiments, the signal layer 112 and the ground layer 113 are electrically connected, so that when the fixing groove 131 extends into the dielectric layer 111 and the fixing groove 131 cannot directly extend to the ground layer 113, the fixing structure 130 can be electrically connected to the first signal layer 1121 located on the groove wall, so that the shielding cover 120 is electrically connected through the fixing structure 130, the signal layer 112 and the ground layer 113, which improves the practicality of the circuit board assembly 100.

In some embodiments, as shown in fig. 1 and 2, the signal layer 112 further includes a second signal layer 1122, the second signal layer 1122 is embedded in the dielectric layer 111, and at least one second signal layer 1122 is located between the ground plane layer 113 and the first signal layer 1121, the fixing slot 131 penetrates through at least one second signal layer 1122, the slot wall of the fixing slot 131 includes the stacked dielectric layer 111 and the second signal layer 1122, and the fixing structure 130 is electrically connected to the second signal layer 1122.

At least one second signal layer 1122 is embedded in the dielectric layer 111 between the first signal layer 1121 and the ground plane layer 113, and the fixing groove 131 penetrates through the first signal layer 1121 and the at least one second signal layer 1122, and the fixing groove 131 and the ground plane layer 113 are arranged at intervals. The groove wall of the fixed groove 131 includes a first signal layer 1121 and a second signal layer 1122 stacked, and a portion of the fixed structure 130 and the second signal layer 1122 located at the groove wall is electrically connected, or a portion of the fixed structure 130 and the first signal layer 1121 and the second signal layer 1122 located at the groove wall is electrically connected.

Alternatively, if the fixing groove 131 penetrates the ground plane layer 113 due to the influence of the circuit board assembly 100 or the processing process, the fixing structure 130 is electrically connected to at least one of the ground plane layer 113 or the first signal layer 1121 or the second signal layer 1122 at the groove wall portion.

In these embodiments, the second signal layer 1122 is disposed between the first signal layer 1121 and the ground plane layer 113, and the fixing groove 131 penetrates at least one second signal layer 1122, so that the fixing structure 130 is electrically connected to the second signal layer 1122, and the shield cover 120 and the ground plane layer 113 are electrically connected, thereby improving the practicality of the circuit board assembly 100.

In some embodiments, as shown in fig. 1 and 2, the bottom of the fixing groove 131 is provided with a connection layer 132, and the fixing structure 130 is fixed in the fixing groove 131 through the connection layer 132.

Optionally, the connection layer 132 is a copper layer formed by copper plating at the bottom of the fixing groove 131.

In these embodiments, the bottom of the fixing groove 131 is provided with the connection layer 132, and the fixing structure 130 is welded and fixed in the fixing groove 131 through the connection layer 132, thereby improving the connection reliability of the fixing structure 130 and the fixing groove 131.

In some embodiments, as shown in fig. 1 and 2, a conductive layer 133 is disposed on at least a portion of the groove wall of the fixing groove 131, the conductive layer 133 is connected to the signal layer 112 and the connection layer 132 at both sides in the thickness direction thereof, and/or the conductive layer 133 is connected to the signal layer 112 and the fixing structure 130 at both sides in the thickness direction thereof, respectively, such that the shield cover 120 is electrically connected through the conductive layer 133 and the ground plane layer 113.

Optionally, the conductive layer 133 is a copper layer formed by copper plating and disposed on the wall of the fixing groove 131.

Optionally, the conductive layer 133 covers all the groove walls, and in the existing processing context, the difficulty of copper plating on the inner wall of the whole fixing groove 131 is lower than that of copper plating on part of the inner wall of the fixing groove 131.

Alternatively, the conductive layer 133 is connected to the conductive layer 133 through the connection layer 132, and is connected to the ground layer 113 through the conductive layer 133; or the conductive layer 133 is directly connected to the conductive layer 133 and is connected to the ground plane layer 113 through the conductive layer 133.

Alternatively, the thickness of the conductive layer 133 may be set according to actual production conditions, and the thickness of the conductive layer 133 is 10 μm as an example.

In these embodiments, the fixing structure 130 is directly electrically connected to the signal layer 112 through the conductive layer 133, or the fixing structure 130 is electrically connected to the signal layer 112 through the connection layer 132 and the conductive layer 133, so that the contact area between the fixing structure 130 and the signal layer 112 is increased, the risk of poor contact between the fixing structure 130 and the signal layer 112 is reduced, and the reliability of the circuit board assembly 100 is improved.

In some embodiments, as shown in fig. 1 and 2, the shielding cover 120 includes a top cover 121 and a side wall 122, the side wall 122 includes an extension 1221 and a bending section 1222 connected to each other, the extension 1221 is connected to the top cover 121 and extends into the fixing slot 131, the bending section 1222 is connected to an end of the extension 1221 facing away from the top cover 121 and extends away from the top cover 121, and the bending section 1222 is accommodated in the fixing structure 130.

Alternatively, the bending sections 1222 are spaced apart in the circumferential direction of the shield cover 120, or the bending sections 1222 are continued in the circumferential direction of the shield cover 120.

Optionally, the bending section 1222 and the extending section 1221 are integrally manufactured to improve the overall structural strength of the shield cover 120.

In these embodiments, the side wall 122 includes an extension section 1221 and a bending section 1222 that are connected to each other, the extension section 1221 is connected to the top cover 121 and extends into the fixing slot 131, the bending section 1222 is connected to an end of the extension section 1221 facing away from the top cover 121 and extends away from the top cover 121, and the bending section 1222 is received in the fixing structure 130, so as to improve the connection reliability of the shielding cover 120 and the fixing structure 130, reduce the risk of detachment of the shielding cover 120 and the fixing structure 130 under the action of external force, and improve the reliability of the circuit board assembly 100.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a fixing structure of a circuit board assembly according to some embodiments of the application.

In some embodiments, as shown in fig. 1 to 3, the fixing structure 130 includes a first end surface 134 and a second end surface 135 that are disposed opposite to each other along a thickness direction of the main body 110, a clamping groove 136 is disposed on the first end surface 134, and a portion of the shielding cover 120 is accommodated in the clamping groove 136, so that the shielding cover 120 and the fixing structure 130 are clamped and connected, and the second end surface 135 is connected to the main body 110.

Optionally, the securing structure 130 is a copper terminal of a board-to-board connector.

The first end face 134 is welded or adhered to the surface of the first signal layer 1121, or the first end face 134 is welded or adhered to the bottom of the fixing groove 131.

In these embodiments, the fixing structure 130 includes a first end face 134 and a second end face 135 that are disposed opposite to each other along the thickness direction of the main body 110, a clamping slot 136 is disposed on the first end face 134, and a portion of the shielding cover 120 is accommodated in the clamping slot 136, so that the shielding cover 120 and the fixing structure 130 are clamped and connected, and the clamping manner replaces the welding connection manner in the prior art, so that the connection manner of the shielding cover 120 and the main body 110 of the circuit board assembly 100 is simplified, and the fixing structure 130 and the shielding cover 120 are clamped and connected along the thickness direction of the main body 110, so that the space limitation of the fixing slot 131 is reduced, the size requirement of the side wall 122 of the shielding cover 120 is shortened, and the reliability of the circuit board assembly 100 is improved.

Referring to fig. 4 and 5, fig. 4 is a schematic structural diagram of a circuit board assembly according to some embodiments of the application; fig. 5 is a schematic structural diagram of a circuit board assembly according to some embodiments of the application.

In some embodiments, as shown in fig. 4 and 5, the fixing structure 130 is a conductive gel 137, and at least a portion of the shielding cover 120 is accommodated in the conductive gel 137.

The conductive colloid 137 is disposed on the first signal layer 1121, and the sidewall 122 of the shielding cover 120 is received in the conductive colloid 137, so that the shielding cover 120 can be adhered to the first signal layer 1121, or the conductive colloid 137 is received in the fixing groove 131, and the shielding cover 120 is adhered to the bottom of the fixing groove 131 through the conductive colloid 137.

In these embodiments, the fixing structure 130 is a conductive adhesive 137, at least a portion of the shielding cover 120 is accommodated in the conductive adhesive 137, so that the shielding cover 120 is adhered to the main body 110 of the circuit board assembly 100 through the conductive adhesive 137, so as to replace the welding connection manner in the prior art, simplify the connection manner between the shielding cover 120 and the main body 110 of the circuit board assembly 100, and improve the reliability of the circuit board assembly 100.

In a second aspect, an embodiment of the present application provides an electronic device, including the circuit board assembly of the embodiment of the first aspect.

Since the electronic device provided by the embodiment of the second aspect of the present application includes the circuit board assembly of any one of the embodiments of the first aspect, the electronic device provided by the embodiment of the second aspect of the present application has the beneficial effects of the circuit board assembly of any one of the embodiments of the first aspect, and will not be described herein.

The electronic device in the embodiment of the application includes, but is not limited to, devices with camera shooting function such as mobile phones, personal digital assistants (Personal Digital Assistant, abbreviated as PDA), tablet computers, laptop computers, televisions, automobile recorders and the like.

In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present application, and they should be included in the scope of the present application.

Claims (10)

1. A circuit board assembly, comprising:

the main body comprises a medium layer, a signal layer and a ground plane layer, wherein the signal layer comprises a first signal layer provided with components, the first signal layer is arranged on the side surface, far away from the ground plane layer, of the medium layer, the ground plane layer is embedded in the medium layer, and a fixing groove is formed in the surface, far away from the medium layer, of the first signal layer;

the shielding cover is covered on the first signal layer to form a shielding space, and the components are arranged in the shielding space;

the fixed structure is arranged in the fixed groove, at least part of the shielding cover extends into the fixed groove and is connected with the fixed structure, so that the shielding cover is fixed on the main body through the fixed structure, and the fixed structure is electrically connected with the ground plane layer.

2. The circuit board assembly of claim 1, wherein the fixing groove extends to the ground plane layer, and a bottom of the fixing groove is the ground plane layer.

3. The circuit board assembly of claim 1, wherein the fixed slot extends into the dielectric layer, a bottom of the fixed slot is spaced apart from the ground plane layer, a wall of the fixed slot includes a first signal layer and a dielectric layer stacked, the fixed structure is electrically connected to the first signal layer, and the signal layer is electrically connected to the ground plane layer to electrically connect the shield cover to the ground plane layer.

4. The circuit board assembly of claim 3, wherein the signal layers further comprise a second signal layer embedded in the dielectric layer, and at least one of the second signal layers is located between the ground plane layer and the first signal layer, the fixing slot extends through at least one of the second signal layers, a wall of the fixing slot comprises the dielectric layer and the second signal layer stacked, and the fixing structure is electrically connected to the second signal layer.

5. A circuit board assembly according to claim 3, wherein the bottom of the fixing groove is provided with a connecting layer, and the fixing structure is fixed in the fixing groove through the connecting layer.

6. The circuit board assembly according to claim 5, wherein a conductive layer is provided on at least part of the wall of the fixing groove, the conductive layer being connected to the signal layer and the connection layer on both sides in the thickness direction thereof, respectively, and/or the conductive layer being connected to the signal layer and the fixing structure on both sides in the thickness direction thereof, respectively, so that the shield cover is electrically connected through the conductive layer and the ground plane layer.

7. The circuit board assembly of claim 1, wherein the shield cover comprises a top cover and a side wall, the side wall comprising an extension segment and a bending segment connected to each other, the extension segment connected to the top cover and extending into the fixed slot, the bending segment connected to an end of the extension segment facing away from the top cover and extending away from the top cover, the bending segment received in the fixed structure.

8. The circuit board assembly according to any one of claims 1 to 7, wherein the fixing structure includes a first end surface and a second end surface which are disposed opposite to each other in a thickness direction of the main body, a clamping groove is provided on the first end surface, and a part of the shield cover is accommodated in the clamping groove so that the shield cover and the fixing structure are clamped and connected, and the second end surface is connected with the main body.

9. The circuit board assembly of any of claims 1-7, wherein the securing structure is a conductive gel, at least a portion of the shield cap being received within the conductive gel.

10. An electronic device comprising a circuit board assembly according to any one of claims 1-9.