CN116938344A - Optical module and baseband processing unit - Google Patents
Optical module and baseband processing unit Download PDFInfo
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- CN116938344A CN116938344A CN202310808396.1A CN202310808396A CN116938344A CN 116938344 A CN116938344 A CN 116938344A CN 202310808396 A CN202310808396 A CN 202310808396A CN 116938344 A CN116938344 A CN 116938344A
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- 238000012545 processing Methods 0.000 title claims abstract description 106
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- 229910052710 silicon Inorganic materials 0.000 claims description 20
- 239000010703 silicon Substances 0.000 claims description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 19
- 238000002788 crimping Methods 0.000 claims 1
- 238000004891 communication Methods 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- HEFNNWSXXWATRW-UHFFFAOYSA-N Ibuprofen Chemical compound CC(C)CC1=CC=C(C(C)C(O)=O)C=C1 HEFNNWSXXWATRW-UHFFFAOYSA-N 0.000 description 5
- 239000000835 fiber Substances 0.000 description 5
- 230000008054 signal transmission Effects 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
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- 238000013461 design Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
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Abstract
The invention relates to the technical field of optical communication and discloses an optical module and a baseband processing unit. The optical module includes: the first circuit board and the second circuit board are connected through the flexible circuit board to form a stacked structure; a housing surrounding the first circuit board, the second circuit board and the flexible circuit board; an electrical connector connected with the first circuit board and penetrating the surface of the housing to be exposed, comprising a high-speed electrical interface and a low-speed electrical interface; an optical fiber array assembly is connected with at least one of the first circuit board and the second circuit board through the surface of the shell to be exposed. In the invention, the first circuit board and the second circuit board are connected through the flexible circuit board to form a stacked structure, and the stacked structure effectively reduces the occupied area of the optical module.
Description
Technical Field
The present invention relates to the field of optical communications technologies, and in particular, to an optical module and a baseband processing unit.
Background
With the evolution of 5G, if the number of antennas and the bandwidth of an air interface are further increased, operators need to expand more ports and consume more optical fibers to deal with the scenes of a higher channel MassiveMIMO, U G frequency band to be deployed in the future, a 5G millimeter wave base station and the like, so that the difficulty of large-scale deployment of 5G is increased. By upgrading the single-channel electric port rate from 25Gbps to 50Gbps, 50% ports can be saved, and flexibility is created for further improvement of the forward bandwidth. The 50GbpsPAM4 is a technical direction of a high-speed interconnection interface of the Ethernet in the future, is a propeller for industrial upgrading of information and communication technology (InformationandCommunicationsTechnology, ICT), and has a very wide market application prospect.
However, the current single-channel 50gbps pam4 modulation SFP56 small package module already has industrialized conditions, and along with the continuous evolution of 5G, the data flow is rapidly increased, the number of side light modules of an indoor baseband processing unit (BuildingBase bandUnite, BBU) is exponentially increased, which tends to bring about the increase of the volume of the BBU side or the number of BBU machine rooms, the increase of power consumption and the increase of heat treatment difficulty. The large occupied area of the existing optical module has become a problem for restricting the development of the baseband processing unit.
The foregoing is provided merely for the purpose of facilitating understanding of the technical solutions of the present invention and is not intended to represent an admission that the foregoing is prior art.
Disclosure of Invention
The invention mainly aims to provide an optical module and a baseband processing unit, and aims to solve the technical problems that the existing optical module is large in occupied area and difficult to meet the high-performance requirement of large-scale communication deployment.
To achieve the above object, the present invention provides an optical module, including:
the circuit comprises a first circuit board, a second circuit board and a flexible circuit board electrically connected between the first circuit board and the second circuit board, wherein the first circuit board and the second circuit board are connected through the flexible circuit board to form a stacked structure;
a housing surrounding the first circuit board, the second circuit board, and the flexible circuit board;
an electrical connector connected with the first circuit board and penetrating through the surface of the housing to be exposed, comprising a high-speed electrical interface and a low-speed electrical interface;
an optical fiber array assembly is connected with at least one of the first circuit board and the second circuit board through the surface of the shell to be exposed.
In some embodiments, the first circuit board comprises: the second circuit board comprises a microcontroller circuit, a light receiving circuit and a light transmitting circuit; wherein,,
the digital signal processing circuit is respectively connected with the electric connector, the microcontroller circuit, the light receiving circuit and the light transmitting circuit;
the light receiving circuit and the light transmitting circuit are respectively connected with the optical fiber array component.
In some embodiments, the light emitting circuit comprises a silicon photonic integrated circuit and a continuous wave laser circuit; the input end of the silicon photon integrated circuit is respectively connected with the continuous wave laser circuit and the digital signal processing circuit, and the output end of the silicon photon integrated circuit is connected with the optical fiber array component;
the light receiving circuit comprises a photodiode circuit and a linear transimpedance amplifier circuit which are connected in sequence; the input end of the photodiode circuit is connected with the optical fiber array component, and the output end of the linear transimpedance amplifier circuit is connected with the digital signal processing circuit.
In some embodiments, the continuous wave laser circuit comprises at least three continuous wave lasers of different wavelengths; the wavelength of the continuous wave laser is CWDM6 standard wavelength.
In some embodiments, the optical receiving circuit and the optical transmitting circuit each comprise at least six optical signals, each optical signal rate comprising 100Gbps, and the optical module rate comprising 600Gbps.
In some embodiments, the light module further comprises a heat sink assembly located at the bottom of the housing.
In addition, in order to achieve the above objective, the present invention further provides a baseband processing unit, where the baseband processing unit includes at least one baseband processing main control chip and at least one optical module as described in the above embodiments; wherein,,
the baseband processing main control chip is electrically connected with the optical module, and the baseband processing main control chip and the optical module are positioned on the same circuit board.
In some embodiments, the baseband processing unit includes a baseband processing motherboard and a baseband processing panel sequentially arranged on the same circuit board; wherein,,
the baseband processing main control chip and the optical module are positioned on the baseband processing main board and are electrically connected with the baseband processing main board;
the baseband processing panel is provided with LC optical fiber connectors, and the optical modules are respectively connected with the LC optical fiber connectors.
In some embodiments, the electrical connector of the baseband processing motherboard is the same type as the electrical connector of the optical module, and the optical module board is connected to the baseband processing motherboard by mirror-image alignment and mutual compression of the electrical connector.
In some embodiments, the optical module is fixedly connected to the baseband processing motherboard by at least one screw.
The invention provides an optical module, comprising: the circuit comprises a first circuit board, a second circuit board and a flexible circuit board electrically connected between the first circuit board and the second circuit board, wherein the first circuit board and the second circuit board are connected through the flexible circuit board to form a stacked structure; a housing surrounding the first circuit board, the second circuit board, and the flexible circuit board; an electrical connector connected with the first circuit board and penetrating through the surface of the housing to be exposed, comprising a high-speed electrical interface and a low-speed electrical interface; an optical fiber array assembly is connected with at least one of the first circuit board and the second circuit board through the surface of the shell to be exposed. In the invention, the first circuit board and the second circuit board are connected through the flexible circuit board to form a stacked structure, and the circuit boards are stacked to effectively reduce the occupied area of the optical module and realize small package of the optical module. In addition, compared with the mode of separating the high-speed electric interface from the low-speed electric interface by the COBO standard, the high-speed electric interface and the low-speed electric interface are integrated into the electric connector, so that the optical module is further simplified, and wiring of the optical module and the BBU main board is further reduced, and the technical problems that the occupied area of the existing optical module is large, and the high-performance requirement of large-scale communication deployment is difficult to meet are solved.
Drawings
Fig. 1 is a schematic cross-sectional view of an optical module according to an embodiment of the present invention;
FIG. 2 is a schematic view illustrating the structural dimensions of an optical module according to an embodiment of the present invention;
fig. 3 is a schematic circuit module structure of an optical module according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a specific circuit structure of an optical module according to an embodiment of the present invention;
FIG. 5 is a schematic top view of an optical module according to an embodiment of the present invention;
FIG. 6 is a first schematic view of a bottom view of an optical module according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a baseband processing unit according to an embodiment of the present invention;
fig. 8 is a second schematic diagram illustrating a bottom view structure of an optical module according to an embodiment of the present invention.
Reference numerals illustrate: 100-first circuit board, 200-second circuit board, 300-flexible circuit board, 400-housing, 500-electrical connector, 600-fiber array assembly, 101-digital signal processing circuit, 201-microcontroller circuit, 202-light receiving circuit, 203-light emitting circuit, 231-silicon photonic integrated circuit, 232-continuous wave laser circuit, 221-photodiode circuit, 222-linear transimpedance amplifier circuit.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the initial stage of 5G deployment, operators generally concentrate indoor baseband processing units (BuildingBasebandUnite, BBU) to reduce the resource requirements of a machine room, thereby realizing 5G rapid large-scale deployment. However, the Centralized Radio Access Network (CRAN) has a relatively high consumption on the backbone optical fiber, and the industry correspondingly proposes wavelength division multiplexing schemes such as 6-wave CWDM, 12-wave LWDM/MWDM, 48-wave DWDM and the like based on 25Gbps so as to converge and save optical fiber resources. With the evolution of 5G, the focus of the subsequent version (Rel 17/Rel 18) will be on the frequency bands of Sub10GHz, millimeter wave, etc., and if the number of antennas and the bandwidth of the air interface are further increased, an optical module with 600Gbps and higher rate will be required to meet the requirement of the forwarding bandwidth.
In order to meet the requirements of customers on 5G front-end next-generation products, the embodiment researches that the 600G optical module products are packaged by adopting on-board optics (OnBoardOptics, OBO), and based on Digital signal processing (Digital SignalProcessing, DSP) and silicon photonic integrated circuit technology, PAM4 signal transmission with the transmission distance reaching 2-10 km is realized, the extended commercial-grade temperature application at-20-85 ℃ is supported, and the overall power consumption of the optical module is less than 12W.
In view of this, the present invention provides an optical module and a baseband processing unit.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure of an optical module according to an embodiment of the present invention.
As shown in fig. 1, the optical module includes:
the first circuit board 100, the second circuit board 200 and the flexible circuit board 300 electrically connected therebetween, wherein the first circuit board 100 and the second circuit board 200 are connected through the flexible circuit board 300 to form a stacked structure;
a housing 400 surrounding the first circuit board 100, the second circuit board 200, and the flexible circuit board 300;
an electrical connector 500 connected with the first circuit board 100 and penetrating the surface of the housing 400 to be exposed, including a high-speed electrical interface and a low-speed electrical interface;
the optical fiber array assembly 600 is connected to at least one of the first circuit board 100 and the second circuit board 200 through the surface of the housing 400 to be exposed.
In the present embodiment, the first circuit board 100 and the second circuit board 200 are printed circuit boards (PrintedCircuitBoard, PCB) and the Flexible circuit board 300 is a Flexible printed circuit board (Flexible PrintedCircuits, FPC), and in practical application, the materials of the circuit boards may be set according to specific requirements, which is not limited in this embodiment. The printed circuit board has certain rigidity, is convenient for installing some components and can be wired to connect the components to realize circuit functions. The flexible printed circuit board may be twisted, bent, and wired, and a stereoscopic line may be formed to extend to a predetermined position. The first and second circuit boards 100 and 200 may be Printed Circuit Boards (PCBs), and the flexible circuit board 300 is a flexible printed circuit board (FPC). The high-speed power consumption generated by the flexible printed circuit board wiring is smaller than that generated by the printed circuit board wiring.
Illustratively, the key to implementing high-speed small packages with the optical module proposed in this embodiment is the unique PCB layout and self-grinding of small-sized structural members. Specifically, the PCB board in the optical module adopts a rigid-flex board design, and includes two rigid boards (the first circuit board 100, the second circuit board 200) and a flexible board (the flexible circuit board 300) connecting them.
In an example, the flexible board is bent when the optical module is mounted, and two hard boards are stacked up and down in a direction perpendicular to the horizontal plane and are arranged inside the optical module. The stacked placement of the first circuit board 100 and the second circuit board 200 effectively reduces the occupied area of the optical module, and high-speed power consumption can be reduced by wiring the flexible printed circuit board. In addition, referring to fig. 2, the optical module proposed in this embodiment can realize a large rate, for example, 600Gbps signal transmission rate in an area of 40mm×39.8mm in cooperation with the use of the self-grinding structure. It will be appreciated that the specific structural dimensions 40mm x 39.8mm shown in this embodiment may be modified according to practical requirements.
It can be appreciated that the first circuit board 100 and the second circuit board 200 are stacked, and the projections of the first circuit board 100 and the second circuit board 200 on the horizontal plane are at least partially overlapped, so that the occupied area can be effectively reduced, and the size of the optical module can be further reduced. Alternatively, the projections of the first circuit board 100 and the second circuit board 200 on the horizontal plane are completely overlapped.
In one example, a housing 400 encloses the first circuit board 100, the second circuit board 200, and the flexible circuit board 300. The housing 400 is used to provide physical protection for the electronics and optics of the optical module, and the housing 400 is also used to provide a heat dissipation path for the power-consuming devices of the optical module.
In one example, an electrical connector 500 is coupled to the first circuit board 100 and passes through the surface of the housing 400 to be exposed, including a high-speed electrical interface and a low-speed electrical interface. It should be noted that, compared to the way of separating the high-speed and low-speed electrical interfaces according to the on-board optical alliance (Consortium Foron-BoardOptic, COBO) standard, the present embodiment integrates the high-speed electrical interface and the low-speed electrical interface into the electrical connector of the optical module, so as to further simplify the optical module, and in addition, the length of the PCB trace between the electrical connector of the optical module and the BBU motherboard PCB trace can be shortened, and the short trace can improve the Signal Integrity (SI) problem and reduce the noise level.
In one example, the fiber array assembly 600 is coupled to at least one of the first circuit board 100 and the second circuit board 200 through the surface of the housing 400 to be exposed. Illustratively, the optical fiber array assembly 600 is connected to the first circuit board 100, and the first circuit board 100 includes an optical receiving circuit and an optical transmitting circuit, and optical signal receiving or transmitting is realized through the optical fiber array assembly 600. It should be noted that, the fiber array assembly 600 is mounted on the circuit board, and the pigtail portion extends out through the opening of the housing 400.
The embodiment provides an optical module, including: the first circuit board 100, the second circuit board 200 and the flexible circuit board 300 electrically connected therebetween, wherein the first circuit board 100 and the second circuit board 200 are connected through the flexible circuit board 300 to form a stacked structure; a housing 400 surrounding the first circuit board 100, the second circuit board 200, and the flexible circuit board 300; an electrical connector 500 connected with the first circuit board 100 and penetrating the surface of the housing 400 to be exposed, including a high-speed electrical interface and a low-speed electrical interface; the optical fiber array assembly 600 is connected to at least one of the first circuit board 100 and the second circuit board 200 through the surface of the housing 400 to be exposed. In this embodiment, the first circuit board and the second circuit board are connected through the flexible circuit board to form a stacked structure, and the circuit board is stacked and placed to effectively reduce the occupied area of the optical module, so as to realize small package of the optical module. In addition, compared with the mode of separating the high-speed electric interface from the low-speed electric interface in the COBO standard, the embodiment integrates the high-speed electric interface and the low-speed electric interface into the electric connector, so that the optical module is further simplified, and wiring of the optical module and the BBU main board is further reduced, and the technical problems that the occupied area of the existing optical module is large, and the high-performance requirement of large-scale communication deployment is difficult to meet are solved.
In some embodiments, referring to fig. 3, the first circuit board 100 includes: the digital signal processing circuit 101, the second circuit board 200 includes a microcontroller circuit 201, a light receiving circuit 202, and a light transmitting circuit 203; wherein,,
the digital signal processing circuit 101 is connected with the electrical connector 500, the microcontroller circuit 201, the light receiving circuit 202 and the light transmitting circuit 203, respectively;
the light receiving circuit 202 and the light transmitting circuit 203 are respectively connected to the optical fiber array assembly 600.
Illustratively, the PCB board in the optical module adopts a rigid-flex board design, and includes two rigid boards (a first circuit board 100 and a second circuit board 200) and a flexible board (a flexible circuit board 300) for connecting the two rigid boards, wherein the flexible board is bent when the optical module is mounted, and the two rigid boards are stacked up and down along a direction perpendicular to a horizontal plane and are arranged inside the optical module. The first circuit board 100, the second circuit board 200 are stacked and connected by the flexible circuit board 300. The flexible circuit board 300 can adopt an FPC board, and the FPC board can simultaneously meet the transmission requirements of RF high-speed signals and DC control signals, so that the connection process links of the module PCB board and the optical device can be effectively reduced, and the size of the optical module is reduced.
It should be noted that, in the present embodiment, the first circuit board 100 includes the digital signal processing circuit 101, the second circuit board 200 includes the micro controller circuit 201, the light receiving circuit 202 and the light emitting circuit 203, and in practical application, specific circuit arrangements of the first circuit board 100 and the second circuit board 200 may be set according to specific requirements, which is not limited in this embodiment.
Specifically, the digital signal processing circuit 101 of the first circuit board 100 is connected to the electrical connector 500, the microcontroller circuit 201, the light receiving circuit 202, and the light emitting circuit 203 of the second circuit board 200, respectively, through an FPC board; the light receiving circuit 202 and the light emitting circuit 203 of the second circuit board 200 are connected to the optical fiber array assembly 600, respectively.
In some embodiments, referring to fig. 3, the light emitting circuit 203 comprises a silicon photonic integrated circuit 231 and a continuous wave laser circuit 232; wherein, the input end of the silicon photonic integrated circuit 231 is respectively connected with the continuous wave laser circuit 232 and the digital signal processing circuit 101, and the output end of the silicon photonic integrated circuit 231 is connected with the optical fiber array assembly 600;
the light receiving circuit 202 includes a photodiode circuit 221 and a linear transimpedance amplifier circuit 222 connected in sequence; wherein the input end of the photodiode circuit 221 is connected with the optical fiber array assembly 600, and the output end of the linear transimpedance amplifier circuit 222 is connected with the digital signal processing circuit 101.
In one example, in the emission direction, the electrical connector 500 is connected to a motherboard, the electrical interface circuit of the electrical connector 500 is connected to the digital signal processing circuit 101, the digital signal processing circuit 101 is connected to the silicon photonic integrated circuit 231, the continuous wave laser circuit 232 provides a light source for the silicon photonic integrated circuit 231, and the output end of the silicon photonic integrated circuit 231 is connected to the fiber array assembly 600.
Specifically, in the transmitting direction, the digital signal processing circuit 101 receives the 12×53.125gbps signal from the motherboard through the electrical interface circuit of the electrical connector 500 and converts the signal into the 6×106.25gbps signal, the continuous wave laser circuit 232 provides a light source for the silicon photonic integrated circuit, the digital signal processing circuit 101 loads the output 6×106.25gbps signal on the silicon photonic integrated circuit 231 to complete the optical signal modulation, and the silicon photonic integrated circuit 231 outputs the optical signal after the 6×106.25gbps modulation through the optical fiber array assembly 600 (FA assembly).
In another example, in the receiving direction, the fiber array assembly 600 is connected to the photodiode circuit 221, the photodiode circuit 221 is connected to the linear transimpedance amplifier circuit 222, the linear transimpedance amplifier circuit 222 is connected to the digital signal processing circuit 101, the digital signal processing circuit 101 is connected to the electrical interface circuit of the electrical connector 500, and the electrical connector 500 is connected to the motherboard.
Specifically, in the receiving direction, the photodiode circuit 221 receives the 6×106.25gbps optical signal through the optical fiber array assembly 600 (FA assembly), and converts the 6×106.25gbps optical signal into a current signal; the linear transimpedance amplifier circuit 222 receives the current signal output from the photodiode circuit 221, and converts the current signal into a voltage signal to output to the digital signal processing circuit 101; the digital signal processing circuit 101 converts the 6×106.25gbps electrical signal into a 12×53.125gbps electrical signal, and outputs the 12×53.125gbps signal to the motherboard through the electrical interface circuit of the electrical connector 500.
Illustratively, the digital signal processing circuit 101 may integrate 2: gecarbox of 1. The digital signal processing circuit 101 may convert a 12×53.125gbps signal to a 6×106.25gbps signal or a 6×106.25gbps signal to a 12×53.125gbps signal.
It should be noted that, referring to fig. 4, the second circuit board 200 may further include a microcontroller circuit, and the microcontroller circuit 201 may implement digital diagnosis and automatic optical power control (APC) by connecting a silicon photonic integrated circuit, a continuous wave laser circuit, a transimpedance amplifier circuit, and a temperature acquisition circuit (not shown). The second circuit board 200 may also include a dc power conversion circuit for providing a suitable power source for the microcontroller circuit, digital signal processing circuit, silicon photonic integrated circuit, continuous wave laser circuit, photodiode circuit, transimpedance amplifier circuit.
It should be understood that the specific circuit structures of the first circuit board 100 and the second circuit board 200 shown in fig. 4 are an example, and the present embodiment is not limited thereto.
In some embodiments, the continuous wave laser circuit 232 includes at least three continuous wave lasers of different wavelengths; the wavelength of the continuous wave laser is CWDM6 standard wavelength.
In this embodiment, the continuous wave laser circuit 232 includes at least three continuous wave lasers of different wavelengths. Illustratively, three continuous wave lasers with different wavelengths are adopted to realize six paths of optical signal modulation through light splitting, and the six paths of optical signals are output through the optical fiber array assembly 600 (FA assembly), so that the flexibility of the optical path configuration of the optical module is improved.
Specifically, as shown in fig. 5, in the optical module proposed in this embodiment, the optical receiving circuit 202 and the optical transmitting circuit 203 each have six optical signals, each with a speed of 100Gbps, and the six optical signals may be input or output through the six-channel optical fiber array assembly 600 (FA assembly), and the type of tail interface of the optical fiber array assembly 600 (FA assembly) includes, but is not limited to, a miniaturized LC connector. In this embodiment, three continuous wave lasers may be used to generate six optical signals by splitting, where the wavelengths of the three continuous wave lasers are CWDM6 standard wavelengths. Because the six optical channels are mutually independent and mutually noninterfere, the flexibility of the optical path configuration of the optical module is greatly improved. Taking the transmitting end as an example, six optical channels can be divided into two groups, two groups of CWDM6 systems are accessed, and the transmitting end can also operate in a single channel, which is not limited in this embodiment.
In one example, the CWDM6 standard wavelengths include 1271nm, 1291nm, 1311nm, 1331nm, 1351nm, and 1371nm. For example, as shown in fig. 5, a continuous wave laser having a wavelength λ1 of 1271nm, a continuous wave laser having a wavelength λ2 of 1291nm, and a continuous wave laser having a wavelength λ3 of 1311nm may be employed, wherein the continuous wave laser may have a wavelength with an accuracy range error of plus or minus 6.5 nm. In practical applications, the specific number and wavelength of the continuous wave lasers in the continuous wave laser circuit 232 may be set according to practical requirements, which is not limited in this embodiment.
In the embodiment, the optical module adopts OBO encapsulation, an LC interface, 1271, 1291, 1311, 1331, 1351 and 1371nm (the precision range of +/-6.5 nm) wavelength, the transmission distance reaches 2-10 km, the temperature application of minus 20-85 ℃ is supported, and the overall power consumption is less than 12W. The embodiment provides a small-sized packaging optical module on board, which is applied to a next generation 600GLR610kmPAM4 (4 pulse amplitude modulation) of 5G front transmission, adopts a PAM4 modulation mode, has high bandwidth, low power consumption, small packaging and high transmission rate (600 Gbps), has low cost and high reliability, is applied to an optical module of 5G front transmission, and can meet the high-performance requirement of customers on the optical module of 5G front transmission.
In some embodiments, the optical receiving circuit 202 and the optical transmitting circuit 203 each comprise at least six optical signals, each optical signal rate comprising 100Gbps, and the optical module rate comprising 600Gbps.
Illustratively, the optical module proposed by the present embodiment can achieve a high rate, for example, 600Gbps signal transmission rate, in a 40mm×39.8mm area. It will be appreciated that at presentThe main current 5G front light transmission module rate is generally 25G or 50G, and compared with the current 50G fp5G front light transmission module, the light transmission module provided in this embodiment has obvious rate/area advantages. The 50GSFP module rate/area is approximately 50/13.4 x 56.5 = 0.066Gbps/mm 2 The rate/area of the optical module proposed in this embodiment is about 600/40×39.8=0.377 Gbps/mm 2 。
Illustratively, the optical receiving circuit 202 and the optical transmitting circuit 203 in the optical module each have six optical signals, each having a rate of 100Gbps, and the six optical signals can be input or output through the six-channel optical fiber array assembly 600 (FA assembly). The digital signal processing circuit 101 may internally integrate 2: gecarbox of 1. The digital signal processing circuit 101 may convert a 12×53.125gbps signal to a 6×106.25gbps signal or a 6×106.25gbps signal to a 12×53.125gbps signal.
In this embodiment, on the premise that the electrical port rate is 50Gbps, the number of electrical ports of a single optical module is increased to 12, and conversion from 12×50Gbps electrical ports to 6×100Gbps optical port output is realized through a gecarbox function integrated in the digital signal processing circuit 101 in the optical module, so that the optical port rate reaches 600Gbps, and further the optical module realizes low power consumption, high performance, high reliability, low cost and small package.
In some embodiments, referring to fig. 6, the optical module further includes a heat dissipation assembly located at the bottom of the housing 400.
For example, in order to reduce the power consumption, the embodiment can use a low-power-consumption silicon photonic integrated circuit, increase the auxiliary heat dissipation of the heat dissipation component and reduce the power consumption of the optical module. Illustratively, as shown in fig. 6, the heat dissipating assembly may include heat dissipating fins, and the specific arrangement of the heat dissipating fins may be set according to practical situations.
It should be noted that, the power of the optical module is sensitive to the forward application, and it is generally expected that the power consumption of the 50G optical module is not more than 2W, and the normal-temperature power consumption of different optical modules is distributed between 1.5W and 2W. The speed of the optical module provided by the embodiment can reach 600G, the actual measurement normal temperature power consumption is not more than 12W, and compared with the 50G front light transmission module, the unit bit power consumption of the optical module provided by the embodiment is obviously reduced.
In addition, to achieve the above objective, this embodiment further proposes a baseband processing unit, referring to fig. 7, where the baseband processing unit includes at least one baseband processing main control chip and at least one optical module as described in the above embodiment; wherein,,
the baseband processing main control chip is electrically connected with the optical module, and the baseband processing main control chip and the optical module are positioned on the same circuit board.
It should be noted that, a panel plugging mode is generally adopted between a traditional optical module and an indoor baseband processing unit (BBU), that is, the optical module is installed on a BBU panel in a panel plugging mode, and a BBU main control chip is located on a BBU main board, a longer distance is provided between the optical module and the BBU main control chip, at this time, a longer PCB wiring is required for connecting the optical module and the BBU main control chip, the longer PCB wiring is more susceptible to noise interference, and meanwhile, a Signal Integrity (SI) problem is introduced.
As shown in fig. 7, in this embodiment, an optical module board-mounted mounting manner is adopted, and the optical module and the BBU main control chip are placed on the same circuit board, that is, the same PCB board nearby, so that the length of a PCB trace between the optical module and the BBU main control chip can be significantly shortened, and the short trace can improve the Signal Integrity (SI) problem and reduce the noise level. In addition, because the SI problem and the noise level are improved, the BBU main control chip in the baseband processing unit of the embodiment can reduce power consumption by reducing the signal output swing and reducing the signal compensation strength on the premise of not sacrificing the performance of the signal transmission system.
In this embodiment, on the premise that the electrical port rate is 50Gbps, the number of electrical ports of a single optical module is increased to 12, and conversion from 12×50Gbps electrical ports to 6×100Gbps optical port output is realized through a gecarbox function integrated in the digital signal processing circuit 101 in the optical module, so that the optical port rate reaches 600Gbps, and the optical module is further realized with low power consumption, high performance, high reliability, low cost and small package. In addition, the optical module in the above embodiment adopts an on-board mounting manner, so that the PCB routing length between the optical module and the BBU main control chip is obviously shortened, the signal quality can be optimized by shortening the electric signal transmission distance, the BBU port density of the indoor baseband processing unit is broken through, the connection reliability is increased, and the limit of the BBU panel port density can be broken through by adopting an on-board mounting manner with reference to the specifications proposed by the on-board optical alliance (Consortium foron-BoardOptic, COBO). With the flow increase, under the condition that the volume of the BBU of the indoor baseband processing unit is unchanged, the BBU side can realize 1.2T/1.8T/2.4T expansion, and the 5G high flow requirement is met.
In some embodiments, referring to fig. 7, the baseband processing unit includes a baseband processing motherboard and a baseband processing panel sequentially arranged on the same circuit board; wherein,,
the baseband processing main control chip and the optical module are positioned on the baseband processing main board and are electrically connected with the baseband processing main board;
the baseband processing panel is provided with LC optical fiber connectors, and the optical modules are respectively connected with the LC optical fiber connectors.
As shown in fig. 7, an example of laying out 2 baseband processing main control chips (BBU main control chips) and 4 600G board light-carrying modules according to the above embodiments is illustrated. In practical application, the specific number of the BBU main control chip and the optical modules and the arrangement mode of the BBU main control chip and the optical modules on the baseband processing motherboard (BBU motherboard) may be set according to practical requirements, which is not limited in this embodiment.
It should be noted that, in this embodiment, the optical module and the BBU main control chip are placed on the same circuit board, that is, the baseband processing motherboard (BBU motherboard), in a manner of mounting the optical module on the board, so that the length of the PCB trace between the optical module and the BBU main control chip can be significantly shortened, the Signal Integrity (SI) problem can be improved, and the noise level can be reduced by short trace. The 600G optical module in the above embodiment is mounted on a baseband processing motherboard (BBU motherboard), and the baseband processing panel (BBU panel) is only used for mounting a miniaturized LC connector, so that the defect of limit of the plugging density of the BBU panel can be overcome, and the bandwidth of the baseband processing unit BBU can be greatly improved under the condition of unchanged volume.
In some embodiments, the electrical connector of the baseband processing motherboard is the same type as the electrical connector of the optical module, and the optical module is connected to the baseband processing motherboard by mirror-image alignment and mutual compression through the electrical connector.
Referring to fig. 8, in the 600G board optical module according to the above embodiment, the electrical connector is located at the bottom of the housing, and includes a high-speed electrical interface and a low-speed electrical interface.
In this embodiment, the baseband processing motherboard (BBU motherboard) is provided with an electrical connector (i.e., a high-speed electrical interface and a low-speed electrical interface are integrated) of the same type as the optical module, and the electrical connector of the optical module and the electrical connector of the baseband processing motherboard (BBU motherboard) can be in mirror alignment and then be in press connection with each other, so that material selection of the optical module and the baseband processing motherboard (BBU motherboard) is simplified. It should be noted that, compared to the manner of separating the high-speed and low-speed electrical interfaces according to the optical alliance on board (consortium foron-BoardOptic, COBO) standard, the 600G board optical module integrates the high-speed electrical interface and the low-speed electrical interface into the electrical connector, so as to further simplify the PCB routing of the optical module and the baseband processing motherboard (BBU motherboard).
In some embodiments, referring to fig. 8, the optical module is fixedly connected to the baseband processing motherboard by at least one screw.
As shown in fig. 8, the baseband processing motherboard (BBU motherboard) and the optical module are fixedly connected by arranging 4 screws for example. In practical applications, the specific number of screws and the connection manner of the baseband processing motherboard (BBU motherboard) and the optical module may be set according to practical requirements, which is not limited in this embodiment.
It should be noted that, the baseband processing motherboard (BBU motherboard) and the optical module may be connected through the same type of electrical connector, and four screws may be designed for connecting the optical module with the baseband processing motherboard (BBU motherboard), so that the reliability of connection between the optical module and the baseband processing motherboard (BBU motherboard) may be greatly improved.
In addition, technical details not described in detail in the baseband processing unit of this embodiment may refer to any embodiment of the optical module provided in the present invention as described above, and will not be described herein.
It should be understood that the foregoing is illustrative only and is not limiting, and that in specific applications, those skilled in the art may set the invention as desired, and the invention is not limited thereto.
It should be noted that the specific structures described above are merely illustrative, and do not limit the scope of the present invention, and in practical application, a person skilled in the art may select part or all of them according to actual needs to achieve the purpose of the embodiment, which is not limited herein.
Furthermore, it should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The foregoing embodiment numbers of the present invention are merely for the purpose of description, and do not represent the advantages or disadvantages of the embodiments.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but rather is intended to cover any equivalents of the structures or equivalent processes disclosed herein or in the alternative, which may be employed directly or indirectly in other related arts.
Claims (10)
1. An optical module, characterized in that the optical module comprises:
the circuit comprises a first circuit board, a second circuit board and a flexible circuit board electrically connected between the first circuit board and the second circuit board, wherein the first circuit board and the second circuit board are connected through the flexible circuit board to form a stacked structure;
a housing surrounding the first circuit board, the second circuit board, and the flexible circuit board;
an electrical connector connected with the first circuit board and penetrating through the surface of the housing to be exposed, comprising a high-speed electrical interface and a low-speed electrical interface;
an optical fiber array assembly is connected with at least one of the first circuit board and the second circuit board through the surface of the shell to be exposed.
2. The optical module of claim 1, wherein the first circuit board comprises: the second circuit board comprises a microcontroller circuit, a light receiving circuit and a light transmitting circuit; wherein,,
the digital signal processing circuit is respectively connected with the electric connector, the microcontroller circuit, the light receiving circuit and the light transmitting circuit;
the light receiving circuit and the light transmitting circuit are respectively connected with the optical fiber array component.
3. The optical module of claim 2, wherein the optical emission circuitry comprises a silicon photonic integrated circuit and a continuous wave laser circuit; the input end of the silicon photon integrated circuit is respectively connected with the continuous wave laser circuit and the digital signal processing circuit, and the output end of the silicon photon integrated circuit is connected with the optical fiber array component;
the light receiving circuit comprises a photodiode circuit and a linear transimpedance amplifier circuit which are connected in sequence; the input end of the photodiode circuit is connected with the optical fiber array component, and the output end of the linear transimpedance amplifier circuit is connected with the digital signal processing circuit.
4. The optical module of claim 2 wherein the continuous wave laser circuit comprises at least three continuous wave lasers of different wavelengths; the wavelength of the continuous wave laser is CWDM6 standard wavelength.
5. The optical module of claim 2, wherein the optical receiving circuit and the optical transmitting circuit each comprise at least six optical signals, each optical signal rate comprising 100Gbps, and the optical module rate comprising 600Gbps.
6. The light module of claim 1, further comprising a heat sink assembly positioned at the bottom of the housing.
7. A baseband processing unit, characterized in that it comprises at least one baseband processing master chip and at least one optical module according to any one of claims 1 to 6; wherein,,
the baseband processing main control chip is electrically connected with the optical module, and the baseband processing main control chip and the optical module are positioned on the same circuit board.
8. The baseband processing unit according to claim 7, wherein the baseband processing unit comprises a baseband processing motherboard and a baseband processing panel sequentially arranged on the same circuit board; wherein,,
the baseband processing main control chip and the optical module are positioned on the baseband processing main board and are electrically connected with the baseband processing main board;
the baseband processing panel is provided with LC optical fiber connectors, and the optical modules are respectively connected with the LC optical fiber connectors.
9. The baseband processing unit of claim 7, wherein an electrical connector of the baseband processing motherboard is the same type as an electrical connector of the optical module, and wherein the optical module is coupled to the baseband processing motherboard by mirror-alignment crimping to each other through the electrical connector.
10. The baseband processing unit of claim 9, wherein the optical module is fixedly connected to the baseband processing motherboard by at least one screw.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310808396.1A CN116938344A (en) | 2023-07-04 | 2023-07-04 | Optical module and baseband processing unit |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310808396.1A CN116938344A (en) | 2023-07-04 | 2023-07-04 | Optical module and baseband processing unit |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114371537A (en) * | 2022-02-17 | 2022-04-19 | Nano科技(北京)有限公司 | Split type integrated packaging optical module |
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2023
- 2023-07-04 CN CN202310808396.1A patent/CN116938344A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114371537A (en) * | 2022-02-17 | 2022-04-19 | Nano科技(北京)有限公司 | Split type integrated packaging optical module |
| CN114371537B (en) * | 2022-02-17 | 2024-06-25 | Nano科技(北京)有限公司 | Split type integrated packaging optical module |
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