CN116933722B - Transmission line setting method, device, equipment and medium - Google Patents
Transmission line setting method, device, equipment and medium Download PDFInfo
- Publication number
- CN116933722B CN116933722B CN202311206599.XA CN202311206599A CN116933722B CN 116933722 B CN116933722 B CN 116933722B CN 202311206599 A CN202311206599 A CN 202311206599A CN 116933722 B CN116933722 B CN 116933722B
- Authority
- CN
- China
- Prior art keywords
- transmission line
- simulation
- transmission
- copper sheet
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005540 biological transmission Effects 0.000 title claims abstract description 656
- 238000000034 method Methods 0.000 title claims abstract description 72
- 238000004088 simulation Methods 0.000 claims abstract description 273
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 225
- 229910052802 copper Inorganic materials 0.000 claims abstract description 225
- 239000010949 copper Substances 0.000 claims abstract description 225
- 238000004806 packaging method and process Methods 0.000 claims abstract description 48
- 238000010586 diagram Methods 0.000 claims description 28
- 238000004590 computer program Methods 0.000 claims description 15
- 238000004364 calculation method Methods 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 4
- 230000001052 transient effect Effects 0.000 claims description 3
- 230000001934 delay Effects 0.000 abstract 1
- 238000004891 communication Methods 0.000 description 5
- 238000004422 calculation algorithm Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/36—Circuit design at the analogue level
- G06F30/367—Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
- G06F2115/12—Printed circuit boards [PCB] or multi-chip modules [MCM]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Evolutionary Computation (AREA)
- Geometry (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Networks & Wireless Communication (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
The application discloses a transmission line setting method, a device, equipment and a medium, relating to the field of transmission lines, wherein the method comprises the following steps: creating a first simulation transmission line and a second simulation transmission line in a ball grid array packaging area of a printed circuit board, equating the transmission delay of copper sheets caused by each target copper sheet to be a target transmission line with corresponding length based on the first simulation transmission line without adding target copper sheets and the second simulation transmission line with added target copper sheets, and enabling the lengths of the actual transmission lines corresponding to any two simulation transmission lines to be equal to the sum of the lengths of the total virtual transmission lines of all corresponding target copper sheets respectively by adding transmission lines in a conventional wiring area, wherein the delays of any two simulation transmission lines are equal to each other by the length equality.
Description
Technical Field
The present application relates to the field of transmission lines, and in particular, to a method, an apparatus, a device, and a medium for setting a transmission line.
Background
Currently, CPU (Central Processing Unit) BGA (ball grid array package) area pin distribution is relatively dense, routing space is limited, and DDR (Double Data Rate) signals are typically routed from CPU BGA area with line width pitches of 3.5mil-4mil-3.5 mil. Along with the improvement of the DDR signal rate, a higher requirement is provided for the signal integrity, in order to solve the problem of discontinuous impedance caused by inconsistent wiring line width of the DDR signal ball grid array packaging area and the conventional wiring area, a tab (copper sheet) adding mode is provided, the wiring impedance can be reduced by adding tab, and the impedance consistency of the conventional wiring area and the ball grid array packaging area is realized. In addition, in the actual working process, DQ (Bi-directional Data) Data signals (Bi-directional Data Strobe, bi-directional Data control pin) signals (DQ strobe clock signals) need to be referenced, and control command address signals need to be referenced clock signals.
On the basis, as the transmission rate of the transmission line added with the copper sheet is different from that of the transmission line without the copper sheet, the inconsistent or even large difference of the lengths of the fine lines (3.5 mil-4mil-3.5mil line width and line distance) of the signals with equal lengths in the same group of the ball grid array packaging area can cause the bad processing of the delay of the DDR signals. The current mainstream design method is to realize the delay equal length treatment by deleting the number of copper sheets, but the copper sheets are not added in a plurality of fine line areas, so that the impedance of the whole link is discontinuous, and the signal quality is affected.
In summary, how to complete the delay equal length processing under the condition of ensuring the continuous impedance is a current urgent issue.
Disclosure of Invention
In view of the above, the present application provides a transmission line setting method, device, equipment and medium, capable of completing delay equal length processing under the condition of ensuring continuous impedance, and the specific scheme is as follows:
in a first aspect, the present application discloses a transmission line setting method, including:
creating a first dummy transmission line and a second dummy transmission line in a ball grid array package region of the printed circuit board diagram; the first simulation transmission lines are not added with target copper sheets, the second simulation transmission lines comprise all simulation transmission lines capable of adding the target copper sheets in the ball grid array packaging area, and the target copper sheets are added on all the second simulation transmission lines;
Calculating the copper sheet transmission delay corresponding to each target copper sheet based on the scattering parameters of the first simulation transmission line and the second simulation transmission line;
the target copper sheet is equivalent to a target transmission line with a corresponding length based on the copper sheet transmission delay, when transmission line setting is carried out on any two simulation transmission lines which pass through the ball grid array packaging area and are added with the target copper sheet on the ball grid array packaging area, total virtual transmission line lengths corresponding to the two simulation transmission lines respectively are calculated based on the lengths of the target transmission lines and the number of the target copper sheets respectively, and the sum of the total virtual transmission line lengths and the actual transmission line lengths is calculated to obtain the total transmission line lengths respectively;
and adding a transmission line positioned on a conventional wiring area for one simulation transmission line with a shorter total transmission line length in the two simulation transmission lines, so that the total transmission line length of the simulation transmission line after the addition is the same as the total transmission line length of the other simulation transmission line.
Optionally, the calculating, based on the scattering parameters of the first and second simulation transmission lines, a copper sheet transmission delay corresponding to each target copper sheet includes:
Performing high-frequency structure simulation on the first simulation transmission line and the second simulation transmission line;
and carrying out transmission line delay simulation analysis based on the scattering parameters of the first simulation transmission line and the second simulation transmission line obtained in the high-frequency structure simulation process so as to calculate and obtain the copper sheet transmission delay corresponding to each target copper sheet.
Optionally, the performing transmission line delay simulation analysis based on the scattering parameters of the first simulation transmission line and the second simulation transmission line obtained in the high-frequency structure simulation process to calculate and obtain a copper sheet transmission delay corresponding to each target copper sheet includes:
and constructing a transient simulation schematic diagram based on scattering parameters of the first simulation transmission line and the second simulation transmission line obtained in the high-frequency structure simulation process, and performing transmission line time delay simulation analysis to calculate and obtain the copper sheet transmission time delay corresponding to each target copper sheet.
Optionally, the lengths of the first simulation transmission line and the second simulation transmission line are both reference lengths.
Optionally, the calculating, based on the scattering parameters of the first and second simulation transmission lines, a copper sheet transmission delay corresponding to each target copper sheet includes:
Performing transmission line delay simulation analysis based on scattering parameters of the first simulation transmission line and the second simulation transmission line to obtain a first transmission time of the first simulation transmission line and a delay difference value between the first simulation transmission line and the second simulation transmission line;
and calculating to obtain the copper sheet transmission delay corresponding to each target copper sheet based on the number of the target copper sheets in the second simulation transmission line and the delay difference value.
Optionally, the equating the target copper sheet to a target transmission line with a corresponding length based on the copper sheet transmission delay includes:
and calculating the transmission speed corresponding to the first simulation transmission line according to the transmission time and the reference length, and equating the target copper sheet to a target transmission line with a corresponding length based on the copper sheet transmission delay and the transmission speed.
Optionally, the length of the first simulation transmission line is a first length; the length of the second simulation transmission line is a second length.
Optionally, the calculating, based on the scattering parameters of the first and second simulation transmission lines, a copper sheet transmission delay corresponding to each target copper sheet includes:
Performing transmission line delay simulation analysis based on scattering parameters of the first simulation transmission line and the second simulation transmission line to obtain transmission time of the first simulation transmission line and a delay difference value between the first simulation transmission line and the second simulation transmission line;
the length difference value of the first length and the second length is equivalent to the corresponding length difference value transmission delay;
and calculating the copper sheet transmission delay corresponding to each target copper sheet according to the length difference transmission delay, the number of the target copper sheets in the second simulation transmission line and the delay difference.
Optionally, the equating the length difference between the first length and the second length to a corresponding length difference transmission delay includes:
calculating the transmission speed corresponding to the first simulation transmission line according to the transmission time and the first length;
and equating the length difference value of the first length and the second length to the corresponding length difference value transmission delay based on the transmission speed.
Optionally, the equating the target copper sheet to a target transmission line with a corresponding length based on the copper sheet transmission delay includes:
and equating the target copper sheet to a target transmission line with a corresponding length based on the copper sheet transmission delay and the transmission speed.
Optionally, the target size of the target copper sheet is any size that enables the target impedance corresponding to the second simulation transmission line to be located in a preset range.
Optionally, the preset range is a difference between a preset impedance and ten percent of the preset impedance to a sum of the preset impedance and ten percent of the preset impedance.
Optionally, the widths of the transmission lines corresponding to the ball grid array packaging region and the conventional routing region are different.
Optionally, the width of the transmission line of the ball grid array package region is a fixed line width.
Optionally, before creating the first dummy transmission line and the second dummy transmission line in the ball grid array package region of the printed circuit board diagram, the method further includes:
designing a printed circuit board pattern laminate;
a transmission line width of the conventional routing area is determined based on the printed circuit board pattern stack.
Optionally, the determining the transmission line width of the conventional routing area based on the printed circuit board diagram lamination includes:
and determining the preset impedance based on the printed circuit board diagram lamination, and determining the transmission line width of the conventional routing area based on the preset impedance.
Optionally, the two emulation transmission lines are each formed by a transmission line of the ball grid array package region and a transmission line of the normal routing region.
In a second aspect, the present application discloses a transmission line setting device, comprising:
a simulated transmission line creation module for creating a first simulated transmission line and a second simulated transmission line in a ball grid array package region of a printed circuit board diagram; the first simulation transmission lines are not added with target copper sheets, the second simulation transmission lines comprise all simulation transmission lines capable of adding the target copper sheets in the ball grid array packaging area, and the target copper sheets are added on all the second simulation transmission lines;
the copper sheet transmission delay calculation module is used for calculating the copper sheet transmission delay corresponding to each target copper sheet based on the scattering parameters of the first simulation transmission line and the second simulation transmission line;
the time delay and length equivalent module is used for equivalent the target copper sheet into a target transmission line with a corresponding length based on the copper sheet transmission time delay;
a total transmission line length calculation module, configured to calculate total virtual transmission line lengths corresponding to the two simulated transmission lines respectively based on the lengths of the target transmission lines and the number of the target copper sheets when the transmission line is set for any two simulated transmission lines that pass through the ball grid array packaging area and to which the target copper sheets have been added on the ball grid array packaging area, and calculate the sum of the total virtual transmission line lengths and the actual transmission line lengths to obtain the total transmission line lengths;
And the transmission line setting module is used for adding a transmission line positioned on a conventional wiring area to one of the two simulation transmission lines, which is shorter in total transmission line length, so that the total transmission line length of the simulation transmission line after the addition is the same as the total transmission line length of the other simulation transmission line.
In a third aspect, the present application discloses an electronic device, comprising:
a memory for storing a computer program;
and a processor for executing the computer program to implement the transmission line setting method disclosed above.
In a fourth aspect, the present application discloses a computer readable storage medium for storing a computer program; wherein the computer program, when executed by a processor, implements the transmission line setting method disclosed previously.
It can be seen that the present application creates a first dummy transmission line and a second dummy transmission line in the ball grid array package region of the printed circuit board diagram; the first simulation transmission lines are not added with target copper sheets, the second simulation transmission lines comprise all simulation transmission lines capable of adding the target copper sheets in the ball grid array packaging area, and the target copper sheets are added on all the second simulation transmission lines; calculating the copper sheet transmission delay corresponding to each target copper sheet based on the scattering parameters of the first simulation transmission line and the second simulation transmission line; the target copper sheet is equivalent to a target transmission line with a corresponding length based on the copper sheet transmission delay, when transmission line setting is carried out on any two simulation transmission lines which pass through the ball grid array packaging area and are added with the target copper sheet on the ball grid array packaging area, total virtual transmission line lengths corresponding to the two simulation transmission lines respectively are calculated based on the lengths of the target transmission lines and the number of the target copper sheets respectively, and the sum of the total virtual transmission line lengths and the actual transmission line lengths is calculated to obtain the total transmission line lengths respectively; and adding a transmission line positioned on a conventional wiring area for one simulation transmission line with a shorter total transmission line length in the two simulation transmission lines, so that the total transmission line length of the simulation transmission line after the addition is the same as the total transmission line length of the other simulation transmission line. Therefore, the application equates the copper sheet transmission delay caused by each target copper sheet to the target transmission line with corresponding length, and the total virtual transmission line length and the actual transmission line length of all the target copper sheets corresponding to any two simulation transmission lines are equal by adding the transmission lines in the conventional wiring area, so that the length equal delay is further equal; in addition, when the copper sheet transmission delay is calculated, the target copper sheets are added on all the second simulation transmission lines, namely, the target copper sheets are added at the positions where the second simulation transmission lines can add the target copper sheets, so that the method is applicable to any two simulation transmission lines which add the target copper sheets on the ball grid array packaging area, the adding condition of the target copper sheets is not changed, and certain impedance is kept; in addition, any two simulation transmission lines are transmission lines with the target copper sheet added on the ball grid array packaging area, so that the impedance continuity between the link ball grid array packaging area and the conventional wiring area can be ensured.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a transmission line setting method disclosed in the present application;
FIG. 2 is a schematic diagram of a second simulation transmission line according to the present disclosure;
FIG. 3 is a schematic diagram of an impedance curve according to the present disclosure;
fig. 4 is a flowchart of a specific transmission line setting method disclosed in the present application;
fig. 5 is a flowchart of a specific transmission line setting method disclosed in the present application;
fig. 6 is a schematic structural diagram of a transmission line setting device according to the present application;
fig. 7 is a block diagram of an electronic device according to the present disclosure.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Because the transmission rate of the transmission line added with the copper sheet is different from that of the transmission line without the copper sheet, the inconsistent or even large difference of the lengths of the fine lines (3.5 mil-4mil-3.5mil line width line spacing) of the signals with equal lengths in the same group of the ball grid array packaging area can cause the bad processing of the delay equal lengths of the DDR signals. The current mainstream design method is to realize the delay equal length treatment by deleting the number of copper sheets, but the copper sheets are not added in a plurality of fine line areas, so that the impedance of the whole link is discontinuous, and the signal quality is affected.
Therefore, the embodiment of the application provides a transmission line setting scheme which can finish delay equal length processing under the condition of ensuring continuous impedance.
The embodiment of the application discloses a transmission line setting method, which is shown in fig. 1 and comprises the following steps:
step S11: creating a first dummy transmission line and a second dummy transmission line in a ball grid array package region of the printed circuit board diagram; and the first simulation transmission lines are not added with target copper sheets, the second simulation transmission lines comprise all simulation transmission lines capable of adding the target copper sheets in the ball grid array packaging area, and the target copper sheets are added on all the second simulation transmission lines.
In this embodiment, the widths of the transmission lines corresponding to the ball grid array package region and the conventional routing region are different. The transmission line width of the ball grid array package region is typically 3.5 mils (mils are length units), i.e., a fixed line width; the transmission line width of the conventional wiring area needs to be calculated; the transmission line width of the conventional routing area is different in different cases.
In this embodiment, the calculation of the transmission line width of the specific conventional routing area is as follows, and before the first dummy transmission line and the second dummy transmission line are created in the ball grid array package area of the printed circuit board diagram, the method further includes: designing a printed circuit board pattern laminate; a transmission line width of the conventional routing area is determined based on the printed circuit board pattern stack.
In this embodiment, the determining the transmission line width of the conventional routing area based on the printed circuit board diagram stack includes: and determining the preset impedance based on the printed circuit board diagram lamination, and determining the transmission line width of the conventional routing area based on the preset impedance.
It should be noted that, when determining the transmission line width of the conventional routing area, it is necessary to ensure that the impedance corresponding to the transmission line constructed by using the transmission line width of the conventional routing area is between the difference between the preset impedance and ten percent of the preset impedance and the sum of the preset impedance and ten percent of the preset impedance.
In the embodiment of the application, the target copper sheet may be a trapezoidal copper sheet.
Referring to fig. 2, a specific schematic diagram of the second simulation transmission line is shown; wherein the trapezoid part is a target copper sheet, and the wave part is a simulation transmission line; it should be noted that, the target size of the target copper sheet is any size that enables the target impedance corresponding to the second simulation transmission line to be within a preset range; the preset range is a sum of a preset impedance and ten percent of the preset impedance and a preset impedance. It should be noted that, in fig. 4, the target size of each target copper sheet is specifically: the trapezoid has an upper side of 8.5mil, a lower side of 10mil, and a height of 6mil, and the distance between adjacent trapezoids in the middle portion of fig. 2 is 4mil.
Step S12: and calculating the copper sheet transmission delay corresponding to each target copper sheet based on the scattering parameters of the first simulation transmission line and the second simulation transmission line.
In this embodiment, the calculating, based on the scattering parameters of the first and second simulation transmission lines, a copper sheet transmission delay corresponding to each target copper sheet includes: performing high-frequency structure simulation on the first simulation transmission line and the second simulation transmission line; and carrying out transmission line delay simulation analysis based on the scattering parameters of the first simulation transmission line and the second simulation transmission line obtained in the high-frequency structure simulation process so as to calculate and obtain the copper sheet transmission delay corresponding to each target copper sheet. Specifically, the first simulation transmission line and the second simulation transmission line are led into HFSS (high frequency structure simulation) software to perform high frequency structure simulation to obtain a TDR (Time Domain Reflectometer ) impedance curve of the transmission line, whether the impedance corresponding to each simulation transmission line is in a preset range can be further observed through the impedance curve, if so, the next step is continued, and if not, the line width or the copper sheet size needs to be modified according to the actual situation.
As described with reference to fig. 3, an impedance curve is shown; the impedance curve is specifically obtained by introducing three simulation transmission lines with consistent lengths into HFSS software for simulation, wherein the first simulation transmission line is a simulation transmission line (namely, a first simulation transmission line) with a line width of 3.5mil and without adding a target copper sheet, the second simulation transmission line is a simulation transmission line (namely, a second simulation transmission line) with a line width of 3.5mil and with an added area with a target copper sheet, and the third simulation transmission line is a simulation transmission line (namely, a third simulation transmission line) with a line width corresponding to the conventional wiring area and without adding a target copper sheet; in fig. 3, the vertical axis represents impedance, the horizontal axis represents time, the impedance curve corresponding to "3.5mil trace no tab" represents the impedance curve of the first simulation transmission line, the impedance curve corresponding to "3.5mil trace with tab" represents the impedance curve of the second simulation transmission line, and the normal line width represents the impedance curve of the third simulation transmission line; as can be seen from fig. 3, at 0.258ns, the impedance of the first dummy transmission line is about 51.4 ohms (ohm is the unit of impedance), the impedance of the second dummy transmission line is optimized to 44.8 ohms, the impedance of the third dummy transmission line is about 43.6 ohms, and the target impedance is 45 ohms. It can be speculated that the addition of the copper sheet can reduce the impedance by 6.6 ohms, so that the continuous impedance between the ball grid array packaging area and the conventional wiring area can be well realized in the actual DDR PCB design, the reflection is reduced, and the DDR signal quality is improved. It should be noted that the impedance curves in the figure are both near 50 ohms on the front and back sides, since 50 ohms are added before and after the three transmission lines.
In this embodiment, the performing transmission line delay simulation analysis to calculate a copper sheet transmission delay corresponding to each target copper sheet based on the scattering parameters of the first simulation transmission line and the second simulation transmission line obtained in the high-frequency structure simulation process includes: and constructing a transient simulation schematic diagram based on scattering parameters of the first simulation transmission line and the second simulation transmission line obtained in the high-frequency structure simulation process, and performing transmission line time delay simulation analysis to calculate and obtain the copper sheet transmission time delay corresponding to each target copper sheet. It should be noted that, when the transmission line time delay simulation analysis is performed, the scattering parameters of the first simulation transmission line and the second simulation transmission line obtained in the high-frequency structure simulation process are required to be used, and are not the impedance curve situation finally obtained by the high-frequency structure simulation.
Step S13: and when any two simulation transmission lines which pass through the ball grid array packaging area and are added with the target copper sheets on the ball grid array packaging area are subjected to transmission line setting, calculating total virtual transmission line lengths corresponding to the two simulation transmission lines respectively based on the lengths of the target transmission lines and the number of the target copper sheets respectively, and calculating the sum of the total virtual transmission line lengths and the actual transmission line lengths to obtain the total transmission line lengths respectively.
In this embodiment, the two dummy transmission lines are each formed by a transmission line of the ball grid array package region and a transmission line of the normal routing region, that is, the two dummy transmission lines are each formed by a transmission line of a transmission line width of the normal routing region and a transmission line of a transmission line width of the ball grid array package region.
It should be noted that the two dummy transmission lines may not be all formed by the transmission line of the ball grid array package region and the transmission line of the conventional routing region, and in a specific embodiment, the two dummy transmission lines may be the transmission line of the ball grid array package region or the transmission line of the conventional routing region separately. In another specific embodiment, the two simulation transmission lines may be formed by the transmission line of the ball grid array package region and the transmission line of the conventional routing region, and the other transmission line is separately the transmission line of the ball grid array package region or the transmission line of the conventional routing region.
Step S14: and adding a transmission line positioned on a conventional wiring area for one simulation transmission line with a shorter total transmission line length in the two simulation transmission lines, so that the total transmission line length of the simulation transmission line after the addition is the same as the total transmission line length of the other simulation transmission line.
In this embodiment, the target copper sheet is equivalent to a transmission line with a corresponding length based on time delay, so that the total transmission line length is the same by adding the transmission lines located on the conventional routing area, and the two simulation transmission lines have the same transmission time delay, and the two simulation transmission lines do not need to have the same transmission time delay by changing the number of the target copper sheets, so that the continuity of link impedance is ensured.
The application has the beneficial effects that the transmission delay of the copper sheet caused by each target copper sheet is equivalent to the target transmission line with corresponding length, and the total virtual transmission line length and the actual transmission line length of all the target copper sheets respectively corresponding to any two simulation transmission lines are equal in a mode of adding the transmission lines in a conventional wiring area, so that the equal length delay is further equal; in addition, when the copper sheet transmission delay is calculated, the target copper sheets are added on all the second simulation transmission lines, namely, the target copper sheets are added at the positions where the second simulation transmission lines can add the target copper sheets, so that the method is applicable to any two simulation transmission lines which add the target copper sheets on the ball grid array packaging area, the adding condition of the target copper sheets is not changed, and certain impedance is kept; in addition, any two simulation transmission lines are transmission lines with the target copper sheet added on the ball grid array packaging area, so that the impedance continuity between the link ball grid array packaging area and the conventional wiring area can be ensured.
The embodiment of the application discloses a specific transmission line setting method, and compared with the previous embodiment, the technical scheme of the embodiment is further described and optimized. Referring to fig. 4, the method specifically includes:
step S21: creating a first dummy transmission line and a second dummy transmission line in a ball grid array package region of the printed circuit board diagram; the first simulation transmission lines are not added with target copper sheets, the second simulation transmission lines comprise all simulation transmission lines capable of adding the target copper sheets in the ball grid array packaging area, and the target copper sheets are added on all the second simulation transmission lines; the lengths of the first simulation transmission line and the second simulation transmission line are both reference lengths.
In this embodiment, the lengths of the first dummy transmission line and the second dummy transmission line are equal, and both are reference lengths.
Step S22: performing transmission line delay simulation analysis based on scattering parameters of the first simulation transmission line and the second simulation transmission line to obtain a first transmission time of the first simulation transmission line and a delay difference value between the first simulation transmission line and the second simulation transmission line; and calculating to obtain the copper sheet transmission delay corresponding to each target copper sheet based on the number of the target copper sheets in the second simulation transmission line and the delay difference value.
In a specific embodiment, the reference length is 1636mil, the first transmission time of the first simulation transmission line is 255.7ps, the time delay difference between the first simulation transmission line and the second simulation transmission line is 20.8ps, and the number of target copper sheets of the second simulation transmission line is 42, so that the copper sheet transmission time delay corresponding to each target copper sheet is calculated to be: 20.8/42ps.
Step S23: and calculating the transmission speed corresponding to the first simulation transmission line according to the transmission time and the reference length, and equating the target copper sheet to a target transmission line with a corresponding length based on the copper sheet transmission delay and the transmission speed.
In one embodiment, the reference length is 1636mil and the first transmission time of the first dummy transmission line is 255.7ps, then the first dummy transmission line corresponds to a transmission speed of 1636/255.7 =6.4 mil/ps, where the length of the target transmission line is 6.4mil/ps×20.8/42 ps=3.2 mil.
Step S24: when any two simulation transmission lines which pass through the ball grid array packaging area and are added with the target copper sheets on the ball grid array packaging area are subjected to transmission line setting, calculating total virtual transmission line lengths corresponding to the two simulation transmission lines respectively based on the lengths of the target transmission lines and the number of the target copper sheets, and calculating the sum of the total virtual transmission line lengths and the actual transmission line lengths to obtain the total transmission line lengths.
For more specific processing in step S24, reference may be made to the corresponding content disclosed in the foregoing embodiment, and a detailed description is omitted herein.
Step S25: and adding a transmission line positioned on a conventional wiring area for one simulation transmission line with a shorter total transmission line length in the two simulation transmission lines, so that the total transmission line length of the simulation transmission line after the addition is the same as the total transmission line length of the other simulation transmission line.
For more specific processing in step S25, reference may be made to the corresponding content disclosed in the foregoing embodiment, and a detailed description is omitted herein.
The application has the advantages that the transmission delay of the copper sheet caused by each target copper sheet is equivalent to the target transmission line with corresponding length, and the total virtual transmission line length and the actual transmission line length of all the target copper sheets corresponding to any two simulation transmission lines are equal in a mode of adding the transmission lines in a conventional wiring area, so that the length equal delay is further equal; in addition, when the copper sheet transmission delay is calculated, the target copper sheets are added on all the second simulation transmission lines, namely, the target copper sheets are added at the positions where the second simulation transmission lines can add the target copper sheets, so that the method is applicable to any two simulation transmission lines which add the target copper sheets on the ball grid array packaging area, the adding condition of the target copper sheets is not changed, and certain impedance is kept; in addition, any two simulation transmission lines are transmission lines with the target copper sheet added on the ball grid array packaging area, so that the impedance continuity between the link ball grid array packaging area and the conventional wiring area can be ensured; in addition, the lengths of the first simulation transmission line and the second simulation transmission line are equal, so that the calculation difficulty is reduced.
The embodiment of the application discloses a specific transmission line setting method, and compared with the previous embodiment, the technical scheme of the embodiment is further described and optimized. Referring to fig. 5, the method specifically includes:
step S31: creating a first dummy transmission line and a second dummy transmission line in a ball grid array package region of the printed circuit board diagram; the first simulation transmission lines are not added with target copper sheets, the second simulation transmission lines comprise all simulation transmission lines capable of adding the target copper sheets in the ball grid array packaging area, and the target copper sheets are added on all the second simulation transmission lines; the length of the first simulation transmission line is a first length; the length of the second simulation transmission line is a second length.
In this embodiment, the lengths of the first dummy transmission line and the second dummy transmission line are different.
Step S32: performing transmission line delay simulation analysis based on scattering parameters of the first simulation transmission line and the second simulation transmission line to obtain transmission time of the first simulation transmission line and a delay difference value between the first simulation transmission line and the second simulation transmission line; the length difference value of the first length and the second length is equivalent to the corresponding length difference value transmission delay; and calculating the copper sheet transmission delay corresponding to each target copper sheet according to the length difference transmission delay, the number of the target copper sheets in the second simulation transmission line and the delay difference.
In this embodiment, the equating the length difference between the first length and the second length to the corresponding length difference transmission delay includes: calculating the transmission speed corresponding to the first simulation transmission line according to the transmission time and the first length; and equating the length difference value of the first length and the second length to the corresponding length difference value transmission delay based on the transmission speed.
In this embodiment, lengths of the first and second simulation transmission lines are different, and a delay difference between the first and second simulation transmission lines due to the length of the actual transmission line, that is, a length difference transmission delay, needs to be considered.
Step S33: and equating the target copper sheet to a target transmission line with a corresponding length based on the copper sheet transmission delay and the transmission speed.
For more specific processing in step S33, reference may be made to the corresponding content disclosed in the foregoing embodiment, and a detailed description is omitted herein.
Step S34: when any two simulation transmission lines which pass through the ball grid array packaging area and are added with the target copper sheets on the ball grid array packaging area are subjected to transmission line setting, calculating total virtual transmission line lengths corresponding to the two simulation transmission lines respectively based on the lengths of the target transmission lines and the number of the target copper sheets, and calculating the sum of the total virtual transmission line lengths and the actual transmission line lengths to obtain the total transmission line lengths.
For more specific processing in step S34, reference may be made to the corresponding content disclosed in the foregoing embodiment, and a detailed description is omitted herein.
Step S35: and adding a transmission line positioned on a conventional wiring area for one simulation transmission line with a shorter total transmission line length in the two simulation transmission lines, so that the total transmission line length of the simulation transmission line after the addition is the same as the total transmission line length of the other simulation transmission line.
For more specific processing in step S35, reference may be made to the corresponding content disclosed in the foregoing embodiment, and a detailed description is omitted herein.
The application has the advantages that the transmission delay of the copper sheet caused by each target copper sheet is equivalent to the target transmission line with corresponding length, and the total virtual transmission line length and the actual transmission line length of all the target copper sheets corresponding to any two simulation transmission lines are equal in a mode of adding the transmission lines in a conventional wiring area, so that the length equal delay is further equal; in addition, when the copper sheet transmission delay is calculated, the target copper sheets are added on all the second simulation transmission lines, namely, the target copper sheets are added at the positions where the second simulation transmission lines can add the target copper sheets, so that the method is applicable to any two simulation transmission lines which add the target copper sheets on the ball grid array packaging area, the adding condition of the target copper sheets is not changed, and certain impedance is kept; in addition, any two simulation transmission lines are transmission lines with the target copper sheet added on the ball grid array packaging area, so that the impedance continuity between the link ball grid array packaging area and the conventional wiring area can be ensured; in addition, the lengths of the first simulation transmission line and the second simulation transmission line are unequal, so that the usable range of the application is enlarged.
Correspondingly, the embodiment of the application also discloses a transmission line setting device, which is shown in fig. 6, and comprises:
a dummy transmission line creation module 11 for creating a first dummy transmission line and a second dummy transmission line in a ball grid array package region of a printed circuit board diagram; the first simulation transmission lines are not added with target copper sheets, the second simulation transmission lines comprise all simulation transmission lines capable of adding the target copper sheets in the ball grid array packaging area, and the target copper sheets are added on all the second simulation transmission lines;
a copper sheet transmission delay calculation module 12, configured to calculate a copper sheet transmission delay corresponding to each target copper sheet based on scattering parameters of the first and second simulation transmission lines;
a delay and length equivalent module 13, configured to equivalent the target copper sheet to a target transmission line with a corresponding length based on the copper sheet transmission delay;
a total transmission line length calculating module 14, configured to calculate total virtual transmission line lengths corresponding to the two simulated transmission lines respectively based on the lengths of the target transmission lines and the number of the target copper sheets, and calculate the sum of the total virtual transmission line lengths and the actual transmission line lengths to obtain the total transmission line lengths when performing transmission line setting on any two simulated transmission lines that pass through the ball grid array packaging region and have the target copper sheets added to the ball grid array packaging region;
And a transmission line setting module 15, configured to add a transmission line located on a conventional routing area to one of the two simulated transmission lines, where the total transmission line length of the two simulated transmission lines is shorter, so that the total transmission line length of the simulated transmission line after the addition is the same as the total transmission line length of the other simulated transmission line.
The more specific working process of each module may refer to the corresponding content disclosed in the foregoing embodiment, and will not be described herein.
Therefore, the application equates the copper sheet transmission delay caused by each target copper sheet to the target transmission line with corresponding length, and the total virtual transmission line length and the actual transmission line length of all the target copper sheets corresponding to any two simulation transmission lines are equal by adding the transmission lines in the conventional wiring area, so that the length equal delay is further equal; in addition, when the copper sheet transmission delay is calculated, the target copper sheets are added on all the second simulation transmission lines, namely, the target copper sheets are added at the positions where the second simulation transmission lines can add the target copper sheets, so that the method is applicable to any two simulation transmission lines which add the target copper sheets on the ball grid array packaging area, the adding condition of the target copper sheets is not changed, and certain impedance is kept; in addition, any two simulation transmission lines are transmission lines with the target copper sheet added on the ball grid array packaging area, so that the link impedance can be ensured to be continuous.
Further, the embodiment of the application also provides electronic equipment. Fig. 7 is a block diagram of an electronic device 20, according to an exemplary embodiment, and is not intended to limit the scope of use of the present application in any way.
Fig. 7 is a schematic structural diagram of an electronic device 20 according to an embodiment of the present application. The electronic device 20 may specifically include: at least one processor 21, at least one memory 22, a display screen 23, an input output interface 24, a communication interface 25, a power supply 26, and a communication bus 27. Wherein the memory 22 is configured to store a computer program that is loaded and executed by the processor 21 to implement the relevant steps in the transmission line setting method disclosed in any of the foregoing embodiments. In addition, the electronic device 20 in the present embodiment may be specifically an electronic computer.
In this embodiment, the power supply 26 is used to provide an operating voltage for each hardware device on the electronic device 20; the communication interface 25 can create a data transmission channel between the electronic device 20 and an external device, and the communication protocol to be followed is any communication protocol applicable to the technical solution of the present application, which is not specifically limited herein; the input/output interface 24 is used for obtaining external input data or outputting external output data, and the specific interface type thereof may be selected according to the specific application needs, which is not limited herein.
The memory 22 may be a read-only memory, a random access memory, a magnetic disk, an optical disk, or the like, and the resources stored thereon may include the computer program 221, which may be stored in a temporary or permanent manner. The computer program 221 may further include a computer program for performing other specific works in addition to the computer program for performing the transmission line setting method performed by the electronic device 20 disclosed in any of the foregoing embodiments.
Further, the embodiment of the application also discloses a computer readable storage medium for storing a computer program; wherein the computer program, when executed by a processor, implements the transmission line setting method disclosed previously.
For specific steps of the method, reference may be made to the corresponding contents disclosed in the foregoing embodiments, and no further description is given here.
In the present disclosure, each embodiment is described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same or similar parts between the embodiments refer to each other, that is, for the device disclosed in the embodiments, since the device corresponds to the method disclosed in the embodiments, the description is relatively simple, and the relevant parts refer to the description of the method section.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software modules may be disposed in Random Access Memory (RAM), memory, read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing describes in detail a transmission line setting method, apparatus, device and storage medium, and specific examples are applied to illustrate the principles and embodiments of the present application, and the above examples are only used to help understand the method and core idea of the present application; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.
Claims (20)
1. A transmission line setting method, characterized by comprising:
creating a first dummy transmission line and a second dummy transmission line in a ball grid array package region of the printed circuit board diagram; the first simulation transmission lines are not added with target copper sheets, the second simulation transmission lines comprise all simulation transmission lines capable of adding the target copper sheets in the ball grid array packaging area, and the target copper sheets are added on all the second simulation transmission lines;
calculating the copper sheet transmission delay corresponding to each target copper sheet based on the scattering parameters of the first simulation transmission line and the second simulation transmission line;
The target copper sheet is equivalent to a target transmission line with a corresponding length based on the copper sheet transmission delay, when transmission line setting is carried out on any two simulation transmission lines which pass through the ball grid array packaging area and are added with the target copper sheet on the ball grid array packaging area, total virtual transmission line lengths corresponding to the two simulation transmission lines respectively are calculated based on the lengths of the target transmission lines and the number of the target copper sheets respectively, and the sum of the total virtual transmission line lengths and the actual transmission line lengths is calculated to obtain the total transmission line lengths respectively;
and adding a transmission line positioned on a conventional wiring area for one simulation transmission line with a shorter total transmission line length in the two simulation transmission lines, so that the total transmission line length of the simulation transmission line after the addition is the same as the total transmission line length of the other simulation transmission line.
2. The transmission line setting method according to claim 1, wherein the calculating, based on the scattering parameters of the first and second simulated transmission lines, a copper sheet transmission delay corresponding to each target copper sheet includes:
Performing high-frequency structure simulation on the first simulation transmission line and the second simulation transmission line;
and carrying out transmission line delay simulation analysis based on the scattering parameters of the first simulation transmission line and the second simulation transmission line obtained in the high-frequency structure simulation process so as to calculate and obtain the copper sheet transmission delay corresponding to each target copper sheet.
3. The transmission line setting method according to claim 2, wherein the performing transmission line delay simulation analysis based on the scattering parameters of the first simulation transmission line and the second simulation transmission line obtained in the high-frequency structure simulation process to calculate a copper sheet transmission delay corresponding to each target copper sheet includes:
and constructing a transient simulation schematic diagram based on scattering parameters of the first simulation transmission line and the second simulation transmission line obtained in the high-frequency structure simulation process, and performing transmission line time delay simulation analysis to calculate and obtain the copper sheet transmission time delay corresponding to each target copper sheet.
4. The transmission line setting method according to claim 1, wherein the lengths of the first dummy transmission line and the second dummy transmission line are both reference lengths.
5. The transmission line setting method according to claim 4, wherein the calculating, based on the scattering parameters of the first and second simulated transmission lines, a copper sheet transmission delay corresponding to each target copper sheet includes:
performing transmission line delay simulation analysis based on scattering parameters of the first simulation transmission line and the second simulation transmission line to obtain a first transmission time of the first simulation transmission line and a delay difference value between the first simulation transmission line and the second simulation transmission line;
and calculating to obtain the copper sheet transmission delay corresponding to each target copper sheet based on the number of the target copper sheets in the second simulation transmission line and the delay difference value.
6. The transmission line setting method according to claim 5, wherein the equating the target copper sheet to a target transmission line of a corresponding length based on the copper sheet transmission delay, comprises:
and calculating the transmission speed corresponding to the first simulation transmission line according to the transmission time and the reference length, and equating the target copper sheet to a target transmission line with a corresponding length based on the copper sheet transmission delay and the transmission speed.
7. The transmission line setting method according to claim 1, wherein a length of the first dummy transmission line is a first length; the length of the second simulation transmission line is a second length.
8. The transmission line setting method according to claim 7, wherein the calculating, based on the scattering parameters of the first and second simulated transmission lines, a copper sheet transmission delay corresponding to each target copper sheet includes:
performing transmission line delay simulation analysis based on scattering parameters of the first simulation transmission line and the second simulation transmission line to obtain transmission time of the first simulation transmission line and a delay difference value between the first simulation transmission line and the second simulation transmission line;
the length difference value of the first length and the second length is equivalent to the corresponding length difference value transmission delay;
and calculating the copper sheet transmission delay corresponding to each target copper sheet according to the length difference transmission delay, the number of the target copper sheets in the second simulation transmission line and the delay difference.
9. The transmission line setting method according to claim 8, wherein the equating the length difference between the first length and the second length to the corresponding length difference transmission delay includes:
Calculating the transmission speed corresponding to the first simulation transmission line according to the transmission time and the first length;
and equating the length difference value of the first length and the second length to the corresponding length difference value transmission delay based on the transmission speed.
10. The transmission line setting method according to claim 9, wherein the equating the target copper sheet to a target transmission line of a corresponding length based on the copper sheet transmission delay, comprises:
and equating the target copper sheet to a target transmission line with a corresponding length based on the copper sheet transmission delay and the transmission speed.
11. The transmission line setting method according to claim 1, wherein the target size of the target copper sheet is any size that enables the target impedance corresponding to the second dummy transmission line to be within a preset range.
12. The transmission line setting method according to claim 11, wherein the preset range is a sum of a difference between a preset impedance and ten percent of the preset impedance and the preset impedance of ten percent.
13. The transmission line setting method according to claim 12, wherein transmission line widths respectively corresponding to the ball grid array package region and the normal wiring region are different.
14. The transmission line setting method according to claim 13, wherein the transmission line width of the ball grid array package region is a fixed line width.
15. The transmission line setting method according to claim 13, wherein before creating the first dummy transmission line and the second dummy transmission line in the ball grid array package region of the printed circuit board diagram, further comprising:
designing a printed circuit board pattern laminate;
a transmission line width of the conventional routing area is determined based on the printed circuit board pattern stack.
16. The transmission line setting method according to claim 15, wherein the determining the transmission line width of the regular routing area based on the printed circuit board diagram stack includes:
and determining the preset impedance based on the printed circuit board diagram lamination, and determining the transmission line width of the conventional routing area based on the preset impedance.
17. The transmission line arrangement method according to any one of claims 1 to 16, wherein the two dummy transmission lines are each constituted by a transmission line of the ball grid array package region and a transmission line of the normal wiring region.
18. A transmission line setting device, characterized by comprising:
A simulated transmission line creation module for creating a first simulated transmission line and a second simulated transmission line in a ball grid array package region of a printed circuit board diagram; the first simulation transmission lines are not added with target copper sheets, the second simulation transmission lines comprise all simulation transmission lines capable of adding the target copper sheets in the ball grid array packaging area, and the target copper sheets are added on all the second simulation transmission lines;
the copper sheet transmission delay calculation module is used for calculating the copper sheet transmission delay corresponding to each target copper sheet based on the scattering parameters of the first simulation transmission line and the second simulation transmission line;
the time delay and length equivalent module is used for equivalent the target copper sheet into a target transmission line with a corresponding length based on the copper sheet transmission time delay;
a total transmission line length calculation module, configured to calculate total virtual transmission line lengths corresponding to the two simulated transmission lines respectively based on the lengths of the target transmission lines and the number of the target copper sheets when the transmission line is set for any two simulated transmission lines that pass through the ball grid array packaging area and to which the target copper sheets have been added on the ball grid array packaging area, and calculate the sum of the total virtual transmission line lengths and the actual transmission line lengths to obtain the total transmission line lengths;
And the transmission line setting module is used for adding a transmission line positioned on a conventional wiring area to one of the two simulation transmission lines, which is shorter in total transmission line length, so that the total transmission line length of the simulation transmission line after the addition is the same as the total transmission line length of the other simulation transmission line.
19. An electronic device, comprising:
a memory for storing a computer program;
a processor for executing the computer program to implement the transmission line setting method according to any one of claims 1 to 17.
20. A computer-readable storage medium for storing a computer program; wherein the computer program, when executed by a processor, implements the transmission line setting method according to any one of claims 1 to 17.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311206599.XA CN116933722B (en) | 2023-09-19 | 2023-09-19 | Transmission line setting method, device, equipment and medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311206599.XA CN116933722B (en) | 2023-09-19 | 2023-09-19 | Transmission line setting method, device, equipment and medium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116933722A CN116933722A (en) | 2023-10-24 |
| CN116933722B true CN116933722B (en) | 2023-12-08 |
Family
ID=88384748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311206599.XA Active CN116933722B (en) | 2023-09-19 | 2023-09-19 | Transmission line setting method, device, equipment and medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116933722B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117408219B (en) * | 2023-12-14 | 2024-03-26 | 西安智多晶微电子有限公司 | DDR signal Rtt terminal PCB board level layout wiring constraint method and electronic equipment |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1921737A (en) * | 2006-09-12 | 2007-02-28 | 华为技术有限公司 | Method for printed circuit board wiring and printed circuit board |
| CN200986972Y (en) * | 2006-12-04 | 2007-12-05 | 西安海天天线科技股份有限公司 | High gain built-in aerial |
| CN110493820A (en) * | 2019-09-24 | 2019-11-22 | 辰芯科技有限公司 | A kind of propagation delay time appraisal procedure, device, communication node and storage medium |
| CN210576438U (en) * | 2019-07-31 | 2020-05-19 | 成都电科慧安科技有限公司 | Circularly polarized array Vivaldi antenna |
| CN112069767A (en) * | 2020-08-28 | 2020-12-11 | 苏州浪潮智能科技有限公司 | Transmission line wiring length estimation method, device, equipment and medium |
| CN114126236A (en) * | 2022-01-26 | 2022-03-01 | 苏州浪潮智能科技有限公司 | Routing design method of differential transmission line and circuit board |
| WO2022138682A1 (en) * | 2020-12-25 | 2022-06-30 | ナミックス株式会社 | Copper member, conductor for printed wiring board, member for printed wiring board, printed wiring board, printed circuit board, and manufacturing methods therefor |
| WO2023024245A1 (en) * | 2021-08-25 | 2023-03-02 | 苏州浪潮智能科技有限公司 | Method and apparatus for calculating equal length of winding differential lines, and device and storage medium |
| WO2023087718A1 (en) * | 2021-11-19 | 2023-05-25 | 苏州浪潮智能科技有限公司 | Signal line routing method and apparatus, device and readable storage medium |
| CN116227417A (en) * | 2023-01-16 | 2023-06-06 | 摩尔线程智能科技(北京)有限责任公司 | Circuit board and wiring method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312665B (en) * | 2020-10-29 | 2021-11-09 | 惠州市特创电子科技股份有限公司 | Circuit board and manufacturing method thereof |
-
2023
- 2023-09-19 CN CN202311206599.XA patent/CN116933722B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1921737A (en) * | 2006-09-12 | 2007-02-28 | 华为技术有限公司 | Method for printed circuit board wiring and printed circuit board |
| CN200986972Y (en) * | 2006-12-04 | 2007-12-05 | 西安海天天线科技股份有限公司 | High gain built-in aerial |
| CN210576438U (en) * | 2019-07-31 | 2020-05-19 | 成都电科慧安科技有限公司 | Circularly polarized array Vivaldi antenna |
| CN110493820A (en) * | 2019-09-24 | 2019-11-22 | 辰芯科技有限公司 | A kind of propagation delay time appraisal procedure, device, communication node and storage medium |
| CN112069767A (en) * | 2020-08-28 | 2020-12-11 | 苏州浪潮智能科技有限公司 | Transmission line wiring length estimation method, device, equipment and medium |
| WO2022138682A1 (en) * | 2020-12-25 | 2022-06-30 | ナミックス株式会社 | Copper member, conductor for printed wiring board, member for printed wiring board, printed wiring board, printed circuit board, and manufacturing methods therefor |
| WO2023024245A1 (en) * | 2021-08-25 | 2023-03-02 | 苏州浪潮智能科技有限公司 | Method and apparatus for calculating equal length of winding differential lines, and device and storage medium |
| WO2023087718A1 (en) * | 2021-11-19 | 2023-05-25 | 苏州浪潮智能科技有限公司 | Signal line routing method and apparatus, device and readable storage medium |
| CN114126236A (en) * | 2022-01-26 | 2022-03-01 | 苏州浪潮智能科技有限公司 | Routing design method of differential transmission line and circuit board |
| CN116227417A (en) * | 2023-01-16 | 2023-06-06 | 摩尔线程智能科技(北京)有限责任公司 | Circuit board and wiring method thereof |
Non-Patent Citations (2)
| Title |
|---|
| 低功耗DDR高速信号的封装布线方案设计及信号完整性分析;秦征;尚文亚;于大全;;现代电子技术(19);全文 * |
| 基于DisplayPort标准的铜缆数据连接线特性阻抗分析;谢文;陈华;刘玉民;;电子技术(09);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116933722A (en) | 2023-10-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN116933722B (en) | Transmission line setting method, device, equipment and medium | |
| CN105307390B (en) | A kind of pcb board structure | |
| US10433422B2 (en) | High-speed printed circuit board and differential wiring method thereof | |
| US20090260860A1 (en) | Flexible printed circuit board | |
| CN109344479B (en) | Method, device, equipment and storage medium for optimizing impedance of signal line in BGA area | |
| CN111125882B (en) | PCB transmission line equal-length arrangement wiring method, device and equipment | |
| CN114126236B (en) | Routing design method of differential transmission line and circuit board | |
| CN114357932B (en) | Signal line wiring method, device, equipment and readable storage medium | |
| CN101909401A (en) | Printed circuit board structure | |
| CN106961799B (en) | A kind of high speed Rigid Flex design method | |
| CN206272947U (en) | A kind of printed circuit board (PCB) | |
| US20150371698A1 (en) | Printed circuit board, and printed wiring board | |
| JP5241371B2 (en) | Wiring display device for multilayer printed circuit board | |
| CN114254582B (en) | Differential line wiring method, differential line wiring device, electronic device, and readable storage medium | |
| CN109565925B (en) | Circuit and method for providing Electronic Bandgap (EBG) structure at memory module electrical coupling | |
| CN113939091B (en) | Impedance matching design method and device of link electrostatic impedance device and printed circuit board | |
| CN114528801A (en) | Single-board PCB routing simulation design method and device | |
| JPH06203102A (en) | Designing method for printed wiring board | |
| JP6536738B2 (en) | Printed wiring board, electronic circuit, wiring determination method and program | |
| CN218634401U (en) | Printed circuit board via hole structure and electronic device | |
| CN108990258B (en) | PCB and electronic equipment | |
| CN116341475A (en) | Topological structure, simulation method and device of DDR circuit | |
| US8669830B2 (en) | Method and device for routing over a void for high speed signal routing in electronic systems | |
| CN115859901A (en) | PCB (printed Circuit Board) routing layer changing design method and device, computer equipment and storage medium | |
| CN113286444A (en) | PCB impedance control method, device, equipment and readable storage medium |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |