CN116931689A - Heat dissipation device and computing equipment - Google Patents

Abstract

The embodiment of the disclosure provides a heat dissipating device and a computing device, wherein the heat dissipating device comprises a shell and at least one heat dissipating fan arranged in the shell, the shell comprises a first panel and a side wall arranged along the circumference of the first panel, the at least one heat dissipating fan is arranged on the first panel, a first hollow structure corresponding to the at least one heat dissipating fan is arranged on the first panel, and one side of the at least one heat dissipating fan, which is away from the first panel, is configured to face a part to be cooled. According to the technical scheme, the shell can protect the cooling fan, external dust can be reduced to enter the cooling fan, the external dust is reduced to enter the computing equipment along with the airflow, the cleaning of devices inside the computing equipment is guaranteed, and the computing efficiency of the computing equipment is improved.

Description

Heat dissipation device and computing equipment

Technical Field

The disclosure relates to the technical field of data computing, and in particular relates to a heat dissipation device and computing equipment.

Background

The rapid development of modern industrial technology has prompted the pace of automated, intelligent development of the various components of the processing equipment. A computing device is an electronic device that is used for high-speed computing, for example, to run a specific algorithm, and communicate with a remote server to obtain the corresponding electronic device. The computing device includes a plurality of heat generating components, and the excessive temperature of the heat generating components affects the computing efficiency of the computing device, so that good heat dissipation is required for the heat generating components.

Disclosure of Invention

Embodiments of the present disclosure provide a heat dissipation device and a computing device to solve or mitigate one or more technical problems in the prior art.

As an aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a heat dissipating device, including a housing and at least one heat dissipating fan installed in the housing, where the housing includes a first panel and a side wall disposed along a circumferential direction of the first panel, the at least one heat dissipating fan is disposed on the first panel, a first hollow structure corresponding to the at least one heat dissipating fan is provided on the first panel, and a side of the at least one heat dissipating fan facing away from the first panel is configured to face a component to be heat dissipated.

In some possible implementations, the number of the heat dissipating fans is at least two, and the at least two heat dissipating fans are arranged in a plurality of rows side by side in a first direction, and the first direction is a direction parallel to a direction of an air duct of the heat dissipating fans.

In some possible implementations, the number of the heat dissipating fans is at least two, and the at least two heat dissipating fans are arranged in a plurality of rows along a second direction, and the second direction is a direction perpendicular to the air duct direction of the heat dissipating fans.

In some possible implementations, the number of the heat dissipating fans is at least three, at least two heat dissipating fans are arranged in a plurality of rows side by side in a first direction, and are arranged in a plurality of rows in a second direction, wherein the first direction is a direction parallel to a direction of an air duct of the heat dissipating fans, and the second direction is a direction perpendicular to the direction of the air duct of the heat dissipating fans.

In some possible implementations, the first hollowed-out structure corresponds to a fin of the heat dissipation fan, and the first hollowed-out structure includes a plurality of first ventilation holes.

In some possible implementations, the first panel is provided with a mounting hole, and the cooling fan near the first panel is fixed to the mounting hole by a screw.

In some possible implementations, two heat dissipation fans adjacent in the first direction are fixedly connected by a screw.

In some possible implementations, the cooling fan is provided with fixing holes near an edge of the cooling fan.

In some possible implementations, the cooling fan is provided with a fixing hole, the first panel is provided with a mounting hole matched with the fixing hole, and the fixing screw sequentially passes through the mounting hole and the fixing holes of at least two rows of cooling fans arranged along a first direction to fix the at least two rows of cooling fans, and the first direction is a direction parallel to an air duct direction of the cooling fans.

As one aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a computing device including a heat generating module and a heat dissipating device of any of the embodiments of the present disclosure, the heat generating module being located within a housing of the heat dissipating device, a heat dissipating fan in the heat dissipating device being located on one side of the heat generating module.

In some possible implementations, the heat dissipating fan in the heat dissipating device is located on a first side of the heat generating module, and a side of the heat dissipating fan in the heat dissipating device facing away from the first panel faces the heat generating module.

In some possible implementations, the side wall of the heat sink is an integrally formed structure.

In some possible implementations, the computing device further includes a second panel located on a second side of the heat generating module, the second panel mounted to the side wall, the second panel defining a plurality of heat dissipating grids, the second side being opposite the first side.

In some possible implementations, the size of the heat spreading grid ranges from 4.5mm to 5.5mm.

In some possible implementations, a distance between the heat dissipating fan and the heat generating module in the heat dissipating device is 20mm to 30mm in a first direction, and the first direction is a direction parallel to a direction of an air duct of the heat dissipating fan.

In some possible implementations, the distance between the second panel and the heating module in the first direction is 0-5 mm, and the first direction is a direction parallel to the air duct direction of the cooling fan.

In some possible implementations, the heating module includes a plurality of power board assemblies arranged in parallel, and a side of the second panel facing the heating module is provided with a limiting body, and the limiting body abuts against at least one power board assembly.

In some possible implementations, the spacing body protrudes toward the heat generating module.

In some possible implementations, the number of the heat dissipating devices is two, and the two heat dissipating devices are respectively located on two opposite sides of the heat generating module along a first direction, where the first direction is a direction parallel to a wind channel direction of a heat dissipating fan in the heat dissipating device.

In some possible implementations, the heating module includes a plurality of power board assemblies arranged in parallel, each power board assembly being disposed in the housing along a first direction, the first direction being a direction parallel to a direction of an air duct of a cooling fan in the heat dissipating device.

In some possible implementations, a limiting strip is mounted on the inner side of the bottom wall and/or the top wall of the side wall, the limiting strip is arranged along the arrangement direction of the force calculating plate assemblies, the limiting strip is located between the heat dissipating device and the force calculating plate assemblies, and each force calculating plate assembly abuts against the limiting strip.

According to the technical scheme, the shell can protect the cooling fan, external dust can be reduced to enter the cooling fan, the external dust is reduced to enter the computing equipment along with the airflow, the cleaning of internal devices of the computing equipment is guaranteed, and the computing efficiency of the computing equipment is improved.

The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present application will become apparent by reference to the drawings and the following detailed description.

Drawings

In the drawings, the same reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily drawn to scale. It is appreciated that these drawings depict only some embodiments according to the disclosure and are not therefore to be considered limiting of its scope.

FIG. 1 is a schematic diagram of a computing device in the related art;

FIG. 2 is a schematic diagram of a heat dissipating device according to an embodiment of the disclosure;

FIG. 3 is an exploded view of the heat dissipating device shown in FIG. 2;

FIG. 4 is a semi-transparent schematic view of a heat sink according to an embodiment of the present disclosure after being mounted to a computing device;

FIG. 5 is a schematic diagram of a computing device according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram of another orientation of the computing device shown in FIG. 5;

FIG. 7 is a partially exploded view of a computing device in accordance with one embodiment of the present disclosure;

FIG. 8 is a schematic diagram of the internal architecture of a computing device in accordance with an embodiment of the present disclosure;

FIG. 9 is a schematic view of a heat generating module mounted within a housing in an embodiment of the disclosure;

fig. 10 is a schematic view of the stop bar of fig. 9.

Reference numerals illustrate:

10. a heat sink; 11. a housing; 111. a sidewall; 112. a first panel; 1121. a first hollow structure; 1122. a mounting hole; 12. a heat radiation fan; 22. a second panel; 221. a heat dissipation grid; 23. a limit bar; 231. a fixing part; 232. a limit part; 31. a heating module; 311. a force plate assembly; 50. and (5) fixing the screw.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present application. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

Fig. 1 is a schematic structural diagram of a computing device in the related art. As shown in fig. 1, in the related art, a cooling fan 12 is disposed outside a computing device, the cooling fan 12 is exposed, external dust easily contaminates the cooling fan 12, and reduces the cooling effect of the cooling fan 12, and the external dust easily enters the computing device along with the airflow of the cooling fan 12 to contaminate components inside the computing device, so that the cooling effect of the components inside the computing device is reduced, and the computing efficiency is affected.

Fig. 2 is a schematic structural diagram of a heat dissipating device according to an embodiment of the disclosure, fig. 3 is an exploded structural diagram of the heat dissipating device shown in fig. 2, and fig. 4 is a schematic semi-perspective diagram of the heat dissipating device according to an embodiment of the disclosure after being mounted on a computing device. As shown in fig. 2 and 3, the heat dissipating device may include a housing 11 and at least one heat dissipating fan 12, the at least one heat dissipating fan 12 being installed in the housing 11. The housing 11 may include a sidewall 111 and a first panel 112, and the sidewall 111 may be disposed along a circumferential direction of the first panel 112. The at least one cooling fan 12 is disposed on the first panel 112, such that the first panel 112 and the sidewall 111 together enclose the at least one cooling fan 12. The first panel 112 is provided with a first hollow structure 1121 corresponding to at least one cooling fan 12, and the cooling fan 12 can exchange air flow with the outside through the first hollow structure 1121. As shown in fig. 4, a side of the at least one heat dissipation fan 12 facing away from the first panel 112 is configured to face the component to be heat-dissipated, so as to dissipate heat of the component to be heat-dissipated.

According to the heat dissipation device disclosed by the embodiment of the disclosure, the shell 11 can wrap the heat dissipation fan 12, protect the heat dissipation fan 12, reduce external dust from entering the heat dissipation fan 12, prevent external staff from touching the heat dissipation fan 12 and provide safety; through the arrangement of the first hollow structure 1121, the heat dissipation fan 12 and the outside are subjected to gas exchange, so that the heat dissipation of the part to be subjected to heat dissipation is realized, and the first hollow structure 1121 can form a certain barrier to external dust, so that the external dust is reduced from entering the inside of the computing equipment along with the airflow, the cleanness of the internal devices of the computing equipment is ensured, and the operation efficiency of the computing equipment is improved; at least one side of the heat dissipation fan 12 facing away from the first panel 112 has no shielding wall, so that the heat dissipation fan 12 can sufficiently dissipate heat of the component to be heat-dissipated without affecting the heat dissipation effect.

Such heat abstractor has not only realized the heat dissipation of treating the radiating element, can reduce external dust moreover and get into radiator fan 12 inside, reduce external dust and follow the air current and get into inside the computing equipment, guaranteed the cleanness of computing equipment internal device, be favorable to improving computing equipment's calculation efficiency.

It should be noted that the material and thickness of the housing 11 may be set according to needs, and the material of the housing 11 may be metal for improving the structural stability of the heat dissipating device.

In one embodiment, as shown in fig. 3, the number of the heat dissipation fans 12 may be at least two, and at least two heat dissipation fans 12 may be arranged in a plurality of rows side by side in a first direction, and the first direction may be a direction parallel to the air duct direction of the heat dissipation fans 12. The air passages of two adjacent fans in the first direction are communicated, for example, in the direction along the first panel toward the component to be heat-dissipated, the air outlet side of the former fan of the two adjacent fans is communicated with the air inlet side of the latter fan. By the arrangement mode, the air flow in the air duct can be increased, so that the air exchange capacity between the air duct and the outside is increased, and the heat dissipation effect is improved. For example, a plurality of heat dissipation fans may be disposed on the same column, and the plurality of heat dissipation fans 12 disposed on the same column may be arranged along a second direction, which may be a direction perpendicular to the air duct direction of the heat dissipation fans. The plurality of heat dissipation fans 12 arranged on the same column can increase the heat dissipation area and further improve the heat dissipation effect.

In one embodiment, the number of the heat dissipation fans may be at least two, and the at least two heat dissipation fans are arranged in a plurality of rows along a second direction, wherein the second direction is a direction perpendicular to the air duct direction of the heat dissipation fans. In this arrangement, at least two heat dissipation fans are disposed on the plane parallel to the first panel 112, so that the heat dissipation area can be increased, and the heat dissipation effect can be further improved.

In one embodiment, the number of the heat dissipation fans is at least three, at least two heat dissipation fans are arranged in a plurality of rows in a first direction, the heat dissipation fans are arranged in a plurality of rows in a second direction, the first direction is a direction parallel to the air duct direction of the heat dissipation fans, and the second direction is a direction perpendicular to the air duct direction of the heat dissipation fans. By the arrangement mode, the air flow in the air duct can be increased, so that the air exchange capacity between the air duct and the outside is increased, and the heat dissipation effect is improved. And at least two radiating fans are arranged on the plane parallel to the first panel, so that the radiating area can be increased, and the radiating effect is further improved.

In one embodiment, the number of the heat dissipation fans 12 may be 4, and the 4 heat dissipation fans 12 may be arranged in two rows side by side in the first direction, and 2 heat dissipation fans 12 may be arranged in the same row. In the specific implementation, the number of columns of the heat dissipation fans 12 in the first direction and the number of heat dissipation fans 12 in each column may be set as needed.

In one embodiment, the number of the heat dissipation fans 12 is plural, and the plurality of heat dissipation fans 12 are arranged along the second direction, which may be a direction perpendicular to the air duct direction of the heat dissipation fans 12, that is, the plurality of heat dissipation fans 12 are arranged in a row. In such a way, the heat dissipation area is increased, and only one row of heat dissipation fans 12 is arranged between the outside and the part to be heat-dissipated, so that the length of the air duct is only the thickness of the heat dissipation fans 12, the length of the air duct is greatly reduced, the rate of gas heat exchange between the outside and the part to be heat-dissipated is improved, and the heat dissipation effect is further improved.

In one embodiment, as shown in fig. 2 and 3, the first hollowed-out structure 1121 corresponds to a fin of the heat dissipation fan 12. The first hollow structure 1121 includes a plurality of first ventilation holes. The first hollow structure 1121 of this structure allows air to circulate through the first vent holes, and the connection portion between the adjacent first vent holes can play a role of blocking dust, so as to reduce dust entering the air duct of the cooling fan 12; illustratively, the first hollow structure 1121 is disposed corresponding to the working area of the fins of the heat dissipation fan 12, so that the fins of the heat dissipation fan 12 can exchange air with the outside to the maximum extent during the working process, thereby enlarging the air flow area and further improving the heat dissipation effect.

In one embodiment, the cooling fan 12 is provided with fixing holes, which may be near the edges of the cooling fan. For example, the heat radiation fan 12 may include 4 fixing holes, and the 4 fixing holes may be respectively located at four corner edges of the heat radiation fan 12. This makes it possible to mount and fix the radiator fan 12 through the fixing hole.

In one embodiment, as shown in fig. 3 and 4, the first panel 112 is provided with mounting holes 1122, and the heat dissipation fan 12 adjacent to the first panel 112 may be fixed to the mounting holes 1122 by screws. The installation mode has simple structure and easy installation. For example, the fixing holes and the mounting holes 1122 may be fixedly connected by screws, thereby fixing the heat radiation fan 12.

In one embodiment, two heat dissipation fans 12 adjacent in the first direction may be fixedly connected by screws.

In one embodiment, the cooling fan 12 is provided with fixing holes, which may be near the edges of the cooling fan. The first panel 112 is provided with mounting holes 1122 matching the fixing holes, and the fixing screws 50 sequentially pass through the mounting holes 1122 and the fixing holes of at least two rows of the heat dissipation fans 12 arranged in the first direction to fix the at least two rows of the heat dissipation fans 12, as shown in fig. 4. The first direction is a direction parallel to the duct direction of the heat radiation fan 12. The first panel 112 may be detachably connected to the housing 11, and the removal and replacement of the heat radiation fan 12 is facilitated by mounting the heat radiation fan 12 on the first panel 112.

Fig. 5 is a schematic structural diagram of a computing device according to an embodiment of the present disclosure, fig. 6 is a schematic diagram of another direction of the computing device shown in fig. 5, fig. 7 is a schematic diagram of a partially exploded structure of the computing device according to an embodiment of the present disclosure, and fig. 8 is a schematic internal structure of the computing device according to an embodiment of the present disclosure. In one implementation, as shown in fig. 5, 6, 7, and 8, the computing device may include a heat generating module 31, and may further include a heat dissipating device 10 in any embodiment of the disclosure, where the heat generating module 31 may be located within a housing 11 of the heat dissipating device, a heat dissipating fan 12 in the heat dissipating device 10 is located on a first side of the heat generating module 31, and a side of the heat dissipating fan 12 in the heat dissipating device 10 facing away from the first panel 112 faces the heat generating module 31. It is understood that the heat generating module 31 is a module to be cooled.

According to the computing equipment in the embodiment of the disclosure, the heat dissipation device 10 provided by the embodiment of the disclosure is used for dissipating heat of the heating module 31, so that external dust can be reduced to enter the computing equipment through the heat dissipation device 10, the cleanness of internal devices of the computing equipment is ensured, and the operation efficiency of the computing equipment is improved.

In one embodiment, as shown in fig. 6 and 7, the side wall 111 of the heat sink 10 may be a one-piece molded structure, for example, the side wall 111 may be one-piece molded through a stamping process. Illustratively, the sidewall 111 may extend toward the heat generating module 31 and enclose the heat generating module 31 such that the heat generating module 31 is located within the housing 11, as shown in fig. 3 and 6. Such a housing may improve structural strength and stability of the computing device and improve assembly efficiency.

In one implementation, as shown in fig. 6 and 7, the computing device may further include a second panel 22, the second panel 22 may be located on a second side of the heat generating module 31, the second side of the heat generating module 31 being disposed opposite the first side of the heat generating module 31, that is, the second panel 22 may be located on a side of the heat generating module 31 facing away from the heat dissipating fan 12. The second panel 22 is mounted on the side wall 111, and the second panel 22 is provided with a plurality of heat dissipating grids 221. The size of the radiator grille 221 may be set according to actual needs.

In such a setting mode, the first panel 112, the cooling fan 12, the heating module 31 inside the housing 11 and the second panel 22 can form an airflow circulation channel, external cold air can enter the housing 11 through the first panel 112 and the cooling fan 12 to dissipate heat of the heating module 31, and air absorbing heat can be discharged to the outside through the second panel 22, so that a primary heat dissipation process is realized, and a good heat dissipation effect is achieved.

The second panel 22 is mounted to the side wall 111 such that the second panel 22 can support the housing 11 to provide structural strength to the housing 11. Illustratively, the material of the second panel 22 may be metal.

It is understood that the heat generating module 31 may be an electrical component, which is easily interfered by external signals. By providing the second panel 22, a part of external interference signals can be shielded, and the working stability of the heating module 31 can be improved.

Illustratively, the size of the heat dissipating grid 221 ranges from 4.5mm to 5.5mm (inclusive), that is, the size of the heat dissipating grid 221 may be any of 4.5mm to 5.5mm, for example, the size of the heat dissipating grid 221 may be 4.5mm, 5mm, or 5.5mm. The heat dissipation grid 221 of this size can ensure not only good ventilation but also good signal shielding effect of the second panel 22. The heat dissipation grid 221 may have a regular or irregular shape such as a circular shape, a hexagonal shape, etc., and the specific shape of the heat dissipation grid is not limited herein, and may be set as needed.

In one embodiment, as shown in fig. 8, a distance D between the heat dissipating fan 12 and the heating module 31 in the heat dissipating device 10 may be 20mm to 30mm (including an end point value), and the first direction is a direction parallel to the air duct direction of the heat dissipating fan 12. The distance D between the heat radiation fan 12 and the heat generation module 31 in the first direction may be any value between 20mm and 30mm, for example, 20mm, 25m, or 30mm. By arranging the interval D between the cooling fan 12 and the heating module 31, buffer can be provided for the air flow, thereby being beneficial to heat exchange of cold and hot air flow and further improving the cooling efficiency; at the same time, the heating module 31 can be prevented from directly contacting the cooling fan 12, and the service life of the cooling fan 12 can be prolonged.

In one embodiment, as shown in fig. 8, the distance between the second panel 22 and the heat generating module 31 in the first direction is 0 to 5mm (inclusive). Illustratively, the spacing of the second panel 22 from the heat generating module 31 in the first direction may be any value between 0 and 5mm, such as 0, 2mm, or 5mm. By defining the spacing between the second panel 22 and the heat generating module 31 to be 0-5 mm, the second panel 22 can properly position the heat generating module 31 in the first direction without providing other positioning members.

In one embodiment, as shown in fig. 7, the heating module 31 includes a plurality of force calculating plate assemblies 311 arranged in parallel, and a side of the second panel 22 facing the heating module 31 may be provided with a limiting body, where the limiting body and at least one force calculating plate assembly 311 are abutted against each other. Illustratively, the computing pad assembly 311 may be a hardware structure having a plurality of computing function chips disposed on a circuit board. It will be appreciated that the computing board assembly 311 may be retained within the housing by a chute, and sliding of the computing board assembly 311 within the chute may occur during transportation. By arranging the limiting body which is mutually abutted against the force calculating plate assemblies 311 on one side of the second panel 22 facing the heating module 31, the force calculating plate assemblies 311 can be better limited, and the force calculating plate assemblies 311 are prevented from sliding in the transportation process.

It should be noted that, the specific shape and position of the limiting body may be set as required, so long as the limiting body and the force calculating plate assembly 311 can abut against each other to limit. The number of the limiting bodies can be matched with the number of the power calculating plate assemblies 311, so that each limiting body can limit the corresponding power calculating plate assembly 311. The number of the limiting bodies can be one or more, and one limiting body can be abutted against at least two computing force plate assemblies 311. Illustratively, the spacing body may protrude toward the heat generating module 31 to be abutted against the heat generating module 31 to spacing it. Illustratively, the material of the limiter may include an elastic material, for example, the material of the limiter is an elastic material. For example, the end of the limiting body may be provided with an elastic member, which may abut against each other with the respective force plate assembly. The elastic member or the elastic material can avoid the problem of unable assembly caused by installation error.

In one embodiment, the limiter may be located at an upper portion, a middle portion, or a lower portion of the second panel 22 in the height direction of the computing plate assembly 311, as long as the limiter may abut against the computing plate assembly 311.

The number of the power board assemblies 311 shown in fig. 7 is 3, and in practical implementation, the number of the power board assemblies 311 may be set as required.

In one embodiment, as shown in fig. 7, each of the power board assemblies 311 is disposed in the housing 11 along a first direction, which is a direction parallel to the air duct direction of the heat dissipation fan 12. By adopting the arrangement mode, the contact area between the power board assembly 311 and the air duct of the cooling fan 12 can be increased, so that the heat dissipation area of the power board assembly 311 is increased, and the heat dissipation efficiency is improved.

Fig. 9 is a schematic diagram of a heat generating module installed in a housing according to an embodiment of the disclosure, and fig. 10 is a schematic diagram of a limit bar in fig. 9. In one embodiment, as shown in fig. 9, the inner side of the bottom wall and/or the top wall of the side wall 111 is mounted with a limit bar 23, and the limit bar 23 may be disposed along the arrangement direction of the force plate assembly 311. The limiting strips 23 are positioned between the heat dissipating device and the power calculating plate assemblies 311, and each power calculating plate assembly 311 is abutted against the limiting strip 23. With such a structure, the limiting strips 23 can limit the inner side of the force plate assembly 311, so as to prevent the force plate assembly 311 from sliding in the transportation process.

Illustratively, the stop bar 23 may be mounted on one of the bottom wall and the top wall of the side wall 111, or the stop bar 23 may be mounted on both the bottom wall and the top wall of the side wall 111.

As shown in fig. 9 and 10, the limit bar 23 may include a fixing portion 231 and a limit portion 232, and the limit bar 23 is fixed to the bottom wall and/or the top wall by the fixing portion 231. Illustratively, the limiting portion 232 may protrude from the fixing portion 231, and the limiting portion 232 is used for the computing force plate assembly 311 to abut.

In the embodiment shown in fig. 7, the heat radiation fan 12 is provided on one side of the side wall 111, and by providing the installation direction of the heat radiation fan 12, the heat radiation fan 12 can be made to blow air toward the heat generating module to radiate heat, or the heat radiation fan 12 can be made to suck out the heat generated by the heat generating module to radiate heat.

In one embodiment, the number of the heat dissipating devices 10 may be two, and the two heat dissipating devices 10 are respectively located on two opposite sides of the heat generating module 31 along a first direction, where the first direction is a direction parallel to the air duct direction of the heat dissipating fan 12 in the heat dissipating device. Illustratively, the side walls of the two heat sinks may be of unitary construction, that is, the two heat sinks share a single side wall 111. Among the two heat abstractor, the air-out side of first heat abstractor communicates with the income wind side of second heat abstractor to, one of them heat abstractor 10 can blow towards the module 31 that generates heat, and another is from the outside convulsions of module 31 that generates heat, thereby, the wind channel series connection intercommunication of two heat abstractor 20 can further improve radiating efficiency, promotes the radiating effect.

It should be noted that, the mounting structure of the first heat dissipating device and the second heat dissipating device is not limited to the above description, but may be considered that the air inlet side of the first heat dissipating device is communicated with the air outlet side of the second heat dissipating device, or the air inlet side of the first heat dissipating device is communicated with the air inlet side of the second heat dissipating device, or the air outlet side of the first heat dissipating device is communicated with the air outlet side of the second heat dissipating device.

In the description of the present specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements or interaction relationship between the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, the first feature being "above," "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is level less than the second feature.

The above disclosure provides many different embodiments, or examples, for implementing different structures of the application. The foregoing description of specific example components and arrangements has been presented to simplify the present disclosure. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that various modifications and substitutions are possible within the scope of the present application. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims (21)

1. The utility model provides a heat abstractor, its characterized in that includes the casing and install in at least one radiator fan in the casing, the casing include first panel and follow the lateral wall that the circumference of first panel set up, at least one radiator fan set up in first panel, first panel set up with at least one radiator fan corresponding first hollow out construction, at least one radiator fan deviates from one side of first panel is configured to be towards waiting the radiating member.

2. The heat dissipating device of claim 1, wherein the number of heat dissipating fans is at least two, the at least two heat dissipating fans are arranged in a plurality of rows side by side in a first direction, and the first direction is a direction parallel to a direction of an air channel of the heat dissipating fans.

3. The heat dissipating device of claim 1, wherein the number of heat dissipating fans is at least two, the at least two heat dissipating fans are arranged in a plurality of rows along a second direction, and the second direction is a direction perpendicular to a direction of an air channel of the heat dissipating fans.

4. The heat dissipating device of claim 1, wherein the number of heat dissipating fans is at least three, the at least two heat dissipating fans are arranged in a plurality of rows side by side in a first direction, the first direction being a direction parallel to a direction of an air passage of the heat dissipating fan, and the second direction being a direction perpendicular to the direction of the air passage of the heat dissipating fan.

5. The heat dissipating device of claim 1, wherein the first hollowed-out structure corresponds to a fin of the heat dissipating fan, and the first hollowed-out structure comprises a plurality of first vent holes.

6. The heat dissipating device of claim 1, wherein the first panel is provided with a mounting hole, and the heat dissipating fan adjacent to the first panel is fixed to the mounting hole by a screw.

7. The heat dissipating device of claim 2, wherein two heat dissipating fans adjacent in the first direction are fixedly connected by a screw.

8. The heat dissipating device of claim 1, wherein the heat dissipating fan is provided with a fixing hole near an edge of the heat dissipating fan.

9. The heat dissipating device according to claim 2, wherein the heat dissipating fan is provided with a fixing hole, the first panel is provided with a mounting hole matching with the fixing hole, and fixing screws sequentially penetrate through the mounting hole and the fixing holes of at least two rows of heat dissipating fans arranged along the first direction to fix the at least two rows of heat dissipating fans, and the first direction is a direction parallel to an air channel direction of the heat dissipating fans.

10. A computing device comprising a heat generating module and the heat sink of any of claims 1-9, the heat generating module being located within a housing of the heat sink, a heat dissipating fan in the heat sink being located on at least one side of the heat generating module.

11. The computing device of claim 10, wherein a cooling fan in the heat sink is located on a first side of the heat generating module, a side of the cooling fan in the heat sink facing away from the first panel facing toward the heat generating module.

12. The computing device of claim 10, wherein a sidewall of the heat sink is an integrally formed structure.

13. The computing device of claim 11, further comprising a second panel located on a second side of the heat generating module, the second panel mounted to the side wall, the second panel defining a plurality of heat dissipating grids, the second side being opposite the first side.

14. The computing device of claim 13, wherein the heat sink grid has a size ranging from 4.5mm to 5.5mm.

15. The computing device of claim 10, wherein a spacing of a cooling fan in the heat sink from the heat generating module is 20mm to 30mm in a first direction, the first direction being a direction parallel to a wind path direction of the cooling fan.

16. The computing device of claim 13, wherein a spacing of the second panel from the heat generating module is 0-5 mm in a first direction, the first direction being a direction parallel to a duct direction of the heat dissipating fan.

17. The computing device of claim 14, wherein the heat generating module comprises a plurality of power board assemblies arranged in parallel, and a side of the second panel facing the heat generating module is provided with a limiting body, and the limiting body and at least one power board assembly are abutted against each other.

18. The computing device of claim 17, wherein the retainer projects toward the heat generating module.

19. The computing device of claim 10, wherein the number of heat sinks is two, the two heat sinks being located on opposite sides of the heat generating module along a first direction, the first direction being a direction parallel to a direction of an air duct of a heat dissipating fan in the heat sink.

20. The computing device of any one of claims 10-19, wherein the heat generating module comprises a plurality of parallel arranged power board assemblies, each power board assembly disposed within the housing along a first direction, the first direction being a direction parallel to a duct direction of a cooling fan in the heat sink.

21. The computing device of claim 20, wherein a stop bar is mounted on an inner side of the bottom wall and/or the top wall of the side wall, the stop bar being disposed along an arrangement direction of the computing board assemblies, the stop bar being located between the heat sink and the computing board assemblies, each of the computing board assemblies being abutted against the stop bar.