CN116913824B - Chip substrate washing equipment and working method thereof - Google Patents
Chip substrate washing equipment and working method thereof Download PDFInfo
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- CN116913824B CN116913824B CN202311154456.9A CN202311154456A CN116913824B CN 116913824 B CN116913824 B CN 116913824B CN 202311154456 A CN202311154456 A CN 202311154456A CN 116913824 B CN116913824 B CN 116913824B
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- chip substrate
- washing
- reaction
- conveyor belt
- cover plate
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- 239000000758 substrate Substances 0.000 title claims abstract description 100
- 238000005406 washing Methods 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000006243 chemical reaction Methods 0.000 claims abstract description 56
- 238000001035 drying Methods 0.000 claims abstract description 56
- 239000007788 liquid Substances 0.000 claims abstract description 45
- 239000003814 drug Substances 0.000 claims abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 29
- 238000005507 spraying Methods 0.000 claims abstract description 12
- 239000007921 spray Substances 0.000 claims description 28
- 230000032258 transport Effects 0.000 claims description 6
- 239000013013 elastic material Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 abstract description 13
- 239000012535 impurity Substances 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 7
- 238000004891 communication Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application belongs to the technical field of electronic elements, and particularly relates to a chip substrate water washing device and a working method thereof, wherein the chip substrate water washing device comprises the following components: the device comprises a reaction device, a drying device, a conveying device and a plurality of washing devices; the water washing device is arranged between the reaction device and the drying device; the transporting device is suitable for transporting the chip substrate; the reaction device is suitable for spraying liquid medicine on the chip substrate; the washing device is suitable for washing the chip substrate sprayed with the liquid medicine; the drying device is suitable for drying the washed chip substrate; the cleaning and drying of the chip substrate are realized, impurities are prevented from remaining on the chip substrate, liquid leakage can be avoided in the reaction cleaning process, and pollution is avoided.
Description
Technical Field
The application belongs to the technical field of electronic elements, and particularly relates to chip substrate washing equipment and a working method thereof.
Background
The chip substrate can have impurity such as glue at the surface of chip substrate in the production process, remaining impurity can cause the influence to the follow-up production or the use of chip substrate, consequently, need clear up impurity on the chip substrate, the mode of adopting is at first reacted through impurity such as glue on the liquid medicine to the chip, avoid adhesion such as glue to be difficult to clear up at the chip substrate, follow-up rethread washing and the stoving completion of liquid are to the clearance of chip substrate, be provided with detachable apron for the storehouse body of reaction, the apron probably can not with the perfect cooperation of draw-in groove after dismantling the installation, lead to the gap between apron and the draw-in groove can make the leakage of liquid medicine, cause the pollution.
Therefore, a new chip substrate washing device and a working method thereof are needed to be designed based on the technical problems.
Disclosure of Invention
The application aims to provide a chip substrate water washing device and a working method thereof.
In order to solve the above technical problems, the present application provides a chip substrate washing apparatus, comprising:
the device comprises a reaction device, a drying device, a conveying device and a plurality of washing devices;
the water washing device is arranged between the reaction device and the drying device;
the transporting device is suitable for transporting the chip substrate;
the reaction device is suitable for spraying liquid medicine on the chip substrate;
the washing device is suitable for washing the chip substrate sprayed with the liquid medicine;
the drying device is suitable for drying the washed chip substrate;
the reaction device, the drying device and the plurality of washing devices are arranged on the bracket side by side, and the conveying device sequentially passes through the reaction device, each washing device and the drying device;
clamping grooves corresponding to the reaction device, the drying device and the plurality of washing devices are formed in the same outer wall of the bracket;
a plurality of vertical columns are arranged on the bracket and are arranged between two adjacent clamping grooves;
the surface of the cylinder and the opening of the clamping groove are positioned on the same plane.
Further, a plurality of threaded columns are arranged on the column body up and down, and corresponding knobs are arranged on the threaded columns;
the inner cover plate is suitable for being embedded in the corresponding clamping groove after the inner cover plate is embedded in the corresponding clamping groove, and the surface of the inner cover plate is flush with the surface of the upright post.
Further, a pair of strip-shaped holes are formed in the end face of the knob, and the two strip-shaped holes are arranged in parallel;
a first limiting ring and a second limiting ring are arranged on the inner wall of the strip-shaped hole, and the first limiting ring and the second limiting ring are arranged back and forth along the depth direction of the strip-shaped hole;
c-shaped handles are arranged in the strip-shaped holes, namely, two ends of each handle are respectively penetrated in the corresponding strip-shaped holes.
Further, a sliding block is sleeved on the handle, the sliding block is positioned in the corresponding bar-shaped hole, and the sliding block is positioned between the first limiting ring and the second limiting ring;
the end face of the handle extending from the back of the knob is provided with a second groove.
Further, the bottom surface of the second groove is connected with a moving block through a plurality of springs, and the moving block is suitable for moving in the second groove;
the movable block is provided with a connecting column, the connecting column extends out of the second groove, and one end of the connecting column extending out of the second groove is connected with an arc-shaped piece;
the arc-shaped piece is made of elastic materials;
the two ends of the arc-shaped piece are longer than the end face of the handle.
Further, the transportation device includes: a conveyor belt;
the conveyor belt sequentially passes through the reaction device, each washing device and the drying device;
the conveyor belt is arranged in a hollowed-out way;
the conveyor belt is provided with a supporting block, and the supporting block is provided with water leakage holes;
the supporting block is suitable for supporting the chip substrate;
a cover plate is arranged on the supporting block;
the cover plate is arranged on the chip substrate in a covering mode, and the cover plate is arranged in a hollowed-out mode.
Further, reaction unit, drying device and washing device all include the storehouse body, the storehouse body sets up in the support, communicates between the adjacent storehouse body, and the conveyer belt of being convenient for passes.
Further, the reaction apparatus includes: a plurality of first spray heads;
the first spray heads are arranged in the bin bodies corresponding to the reaction devices, and the first spray heads are suitable for spraying liquid medicine to the chip substrates on the conveyor belt from the top surface and the bottom surface of the conveyor belt.
Further, the water washing device includes: a plurality of second spray heads;
the second spray heads are arranged in the bin bodies corresponding to the water washing devices, and the second spray heads are suitable for spraying liquid to the chip substrates on the conveyor belt from the top surface and the bottom surface of the conveyor belt.
Further, a plurality of baffles are arranged on the support to surround the bin body.
On the other hand, the application also provides a working method of the chip substrate washing equipment, which comprises the following steps:
the transportation device transports the chip substrate to sequentially pass through the reaction device, the water washing device and the drying device;
when the chip substrate passes through the reaction device, the reaction device sprays liquid medicine to the chip substrate;
when the chip substrate passes through the washing device, the washing device sprays liquid to the chip substrate to clean the chip substrate;
when the chip substrate passes through the drying device, the drying device dries the chip substrate.
The application has the beneficial effects that the application comprises a reaction device, a drying device, a transportation device and a plurality of washing devices; the water washing device is arranged between the reaction device and the drying device; the transporting device is suitable for transporting the chip substrate; the reaction device is suitable for spraying liquid medicine on the chip substrate; the washing device is suitable for washing the chip substrate sprayed with the liquid medicine; the drying device is suitable for drying the washed chip substrate; the cleaning and drying of the chip substrate are realized, impurities are prevented from remaining on the chip substrate, liquid leakage can be avoided in the reaction cleaning process, and pollution is avoided.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and drawings.
In order to make the above objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of a chip substrate washing apparatus of the present application;
FIG. 2 is an enlarged schematic view of portion A of FIG. 1 in accordance with the present application;
FIG. 3 is a schematic view of the structure of the support block of the present application;
FIG. 4 is a schematic view of the internal structure of the present application;
FIG. 5 is a schematic diagram of a spray head of the present application;
FIG. 6 is a schematic view of the knob structure of the present application;
FIG. 7 is a schematic view of the structure of a strip-shaped hole of the present application;
FIG. 8 is a schematic view of the stop collar of the present application;
FIG. 9 is a schematic view of the structure of the grip of the present application;
fig. 10 is a schematic view of the structure of the arc member of the present application.
In the figure:
1 a reaction device and 11 a first spray head;
2 a drying device;
3, a conveying device, a 31 conveying belt, a 32 supporting block, a 33 water leakage hole and a 34 cover plate;
4, a water washing device and 41 second spray heads;
5 brackets, 51 columns, 52 threaded columns and 53 baffles;
the device comprises a 6 knob, a 61 bar-shaped hole, a 611 first limiting ring, a 612 second limiting ring, a 62 grip, a 621 sliding block, a 622 second groove, a 623 moving block, a 624 spring, a 625 connecting column, a 63 arc-shaped piece and a 64 threaded hole;
7 bin body, 71 inner cover plate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Embodiment 1 as shown in fig. 1 to 10, embodiment 1 provides a chip substrate washing apparatus, comprising: the device comprises a reaction device 1, a drying device 2, a conveying device 3 and a plurality of washing devices 4; the water washing device 4 is arranged between the reaction device 1 and the drying device 2; the transporting device 3 is adapted to transport chip substrates; the reaction device 1 is suitable for spraying liquid medicine on a chip substrate; the washing device 4 is suitable for washing the chip substrate sprayed with the liquid medicine; the drying device 2 is suitable for drying the washed chip substrate.
In the embodiment, the reaction device 1, the drying device 2 and the plurality of washing devices 4 are arranged on the bracket 5 side by side, and the conveying device 3 sequentially passes through the reaction device 1, each washing device 4 and the drying device 2; the bracket 5 can be used for fixing the reaction device 1, the drying device 2 and a plurality of washing devices 4, and the devices are integrally installed to form the finally required washing equipment.
In this embodiment, the same outer wall of the bracket 5 is provided with clamping grooves corresponding to the reaction device 1, the drying device 2 and the plurality of washing devices 4; after each device is installed inside the support 5, the clamping groove on the support 5 can be used for embedding the corresponding inner cover plate 71 on each device, the clamping groove can be communicated with the bin body 7, the communicating position can be covered through embedding of the inner cover plate 71 and the clamping groove, and leakage of liquid medicine, liquid and the like in the bin body 7 through the inner cover plate 71 and the edge of the clamping groove is avoided.
In this embodiment, the bracket 5 is provided with a plurality of vertical columns 51, and the columns 51 are disposed between two adjacent clamping grooves; the surface of the column body 51 and the opening of the clamping groove are positioned on the same plane; facilitating the compression of the inner deck 71.
In this embodiment, the column 51 is provided with a plurality of threaded columns 52 up and down, and the threaded columns 52 are provided with corresponding knobs 6; the knob 6 is provided with a threaded hole 64, and the threaded hole 64 is matched with the threaded column 52, so that the knob 6 can rotate on the threaded column 52 and gradually approaches to the surface of the column 51; the bottom surface of the knob 6 is in contact with the surface of the inner cover plate 71; the inner cover plate 71 on the reaction device 1, the drying device 2 or the water washing device 4 is suitable to be embedded in the clamping groove, the knob 6 is suitable to completely embed the inner cover plate 71 into the corresponding clamping groove through the knob 6 after the inner cover plate 71 is embedded in the corresponding clamping groove, and the surface of the inner cover plate 71 is flush with the surface of the upright post; when the bottom surface of the knob 6 is in contact with both the surface of the inner cover plate 71 and the surface of the cylinder 51, it can be judged that the inner cover plate 71 is completely inserted into the card slot, and the knob 6 presses the inner cover plate 71.
In this embodiment, a pair of strip-shaped holes 61 are formed on the end surface of the knob 6, and the two strip-shaped holes 61 are arranged in parallel; a first limiting ring 611 and a second limiting ring 612 are arranged on the inner wall of the strip-shaped hole 61, and the first limiting ring 611 and the second limiting ring 612 are arranged back and forth along the depth direction of the strip-shaped hole 61; a C-shaped grip 62 is arranged in the bar-shaped hole 61, i.e. two ends of the grip 62 are respectively arranged in the corresponding bar-shaped hole 61 in a penetrating way; the C-shaped handle 62 facilitates the simultaneous pulling or pressing of the two ends of the handle 62; the handle 62 is sleeved with a sliding block 621, the sliding block 621 is positioned in the corresponding bar-shaped hole 61, the outer wall of the sliding block 621 is contacted with the inner wall of the bar-shaped hole 61, and the sliding block 621 is positioned between the first limiting ring 611 and the second limiting ring 612; the end surface of the handle 62 extending from the back of the knob 6 is provided with a second groove 622; the sliding block 621 can move between the first limiting ring 611 and the second limiting ring 612, and the maximum movement position of the sliding block 621 can be limited through the first limiting ring 611 and the second limiting ring 612, so that the grip 62 is prevented from being separated from the bar-shaped hole 61.
In this embodiment, the bottom surface of the second groove 622 is connected to a moving block 623 through a plurality of springs 624, and the moving block 623 is adapted to move in the second groove 622; a connecting column 625 is arranged on the moving block 623, the connecting column 625 extends out of the second groove 622, and an arc-shaped piece 63 is connected to one end of the connecting column 625 extending out of the second groove 622; the projection of the arc-shaped piece 63 on the bottom surface of the knob 6 is overlapped with the strip-shaped hole 61, so that part of the arc-shaped piece 63 can be retracted into the strip-shaped hole 61; the arc-shaped member 63 is made of an elastic material; both ends of the arc-shaped member 63 are longer than the end face of the grip 62; when the inner cover plate 71 is embedded into the corresponding clamping groove, the inner cover plate 71 can be in an inclined state, so that the inner cover plate 71 cannot be completely embedded into the clamping groove, if a direct screwing button cannot press the inclined part of the inner cover plate 71 into the clamping groove, in the process of manually gradually rotating the knob 6, when the bar-shaped hole 61 rotates to a transverse state, the handle 62 can be pushed to push the arc-shaped part 63 between the two adjacent inner cover plates 71, at the moment, the arc-shaped part 63 is pushed to be in contact with the side wall of the inner cover plate 71 when the inner cover plate 71 is lifted, at the moment, the arc-shaped part 63 is pushed to be in contact with the side wall of the inner cover plate 71 when the inner cover plate 71 is pushed into the space between the two adjacent inner cover plates 71, at the moment, one end of the handle 62 is pushed out of the bar-shaped hole 61 and is stretched into the space between the two inner cover plates 71 by the extrusion of the handle 62, at the moment, the arc-shaped part 63 exceeding the end surface of the handle 62 can be bent and folded to be between the side wall of the inner cover plate 71 in a transverse state, and the arc-shaped part 63 can be pushed out of the two inner cover plates 71 when the inner cover plate 71 is pushed to be completely pushed into the space between the two inner cover plates 71, and the two arc-shaped part 71 are completely pushed into the transverse state, and the clamping plate 71 can be completely pushed into the space between the two inner cover plates 71 by the two side walls by the arc-shaped part 71, and the transverse force can be completely pushed into the clamping plate 71 when the inner cover plate 71, and the two side wall of the inner cover plate 71 is completely and completely rotates, and the inner cover plate 71 is completely in a transverse state, and the space between the two inner cover plate 71 is completely and a vertical state, and a vertical force can be completely and left in a vertical state; when the inner cover 71 is fully inserted into the card slot, at this time, the arc-shaped piece 63 is extruded to enable the moving block 623 to move towards the inside of the second groove 622, so that the spring 624 is compressed, and further, the knob 6 is given a force far away from the column 51 through the grip 62, so that self-locking is formed between the threaded hole 64 and the stud, loosening between the knob 6 and the stud caused by vibration generated in the running process of the cleaning equipment is avoided, and the compression of the knob 6 on the inner cover plate 71 is kept; the force of manually rotating the knob 6 can overcome the self-locking force so that the knob 6 can smoothly rotate; it can be judged whether or not the inclined inner cover plate 71 is pushed to be completely inserted into the card slot by a manual rotation process.
In this embodiment, the knob 6 at the upper part of the column 51 at the extreme side can push the arc-shaped member 63 between the inner cover 71 and the rim of the bracket 5 through the grip 62, and push the inclined side wall of the inner cover 71.
In this embodiment, the transporting device 3 includes: a conveyor belt 31; the conveyor belt 31 sequentially passes through the reaction device 1, each washing device 4 and the drying device 2; the conveying belt 31 is arranged in a hollowed-out manner; a supporting block 32 is arranged on the conveyor belt 31, and a water leakage hole 33 is formed in the supporting block 32; the support block 32 is adapted to support a chip substrate; a cover plate 34 is arranged on the supporting block 32; the cover plate 34 is arranged on the chip substrate in a covering manner, and the cover plate 34 is arranged in a hollowed-out manner; the hollow design on the conveyor belt 31 can prevent the liquid medicine or liquid from remaining on the conveyor belt 31 during reaction or cleaning, and prevent the conveyor belt 31 from bringing the liquid medicine and the like out of the equipment to cause pollution; the hollowed design of the water leakage hole 33 and the cover plate 34 can ensure that both sides of the chip substrate are sprayed with the liquid medicine and cleaned by the liquid; the water leakage holes 33 can avoid the accumulation of liquid medicine, liquid and the like on the supporting block 32; the cover plate 34 and the chip substrate can be fixed on the supporting block 32 in a bolt mode, so that the movement of the chip substrate in the processes of spraying liquid medicine and cleaning is avoided, and the cleaning effect is ensured; jacks can be formed in the cover plate 34 and the chip substrate, and bolts can be arranged on the supporting blocks 32.
In this embodiment, the reaction device 1, the drying device 2 and the washing device 4 each include a bin body 7, wherein the bin bodies 7 are disposed in the support 5, and adjacent bin bodies 7 are communicated with each other, so that the conveyor belt 31 can pass through; windows which are convenient for the conveyor belt 31 to pass through can be arranged between the bin bodies 7, so that the conveyor belt 31 can transport the chip substrates among the devices conveniently.
In this embodiment, the reaction apparatus 1 includes: a plurality of first spray heads 11; the first spray heads 11 are arranged in the corresponding bin bodies 7 of the reaction device 1, and the first spray heads 11 are suitable for spraying liquid medicine to the chip substrates on the conveyor belt 31 from the top surface and the bottom surface of the conveyor belt 31; the liquid medicine is sprayed to the chip substrate from two directions, so that impurities on two sides of the chip substrate can be ensured to be contacted by the liquid medicine, and the phenomenon that the impurities such as glue cannot be cleaned due to the fact that the liquid medicine is not sprayed on the impurities is avoided.
In this embodiment, the water washing apparatus 4 includes: a plurality of second spray heads 41; the second spray heads 41 are disposed in the corresponding bins 7 of the water washing device 4, and the second spray heads 41 are adapted to spray liquid from the top surface and the bottom surface of the conveyor belt 31 to the chip substrates on the conveyor belt 31 for cleaning, thereby ensuring the cleaning effect.
In this embodiment, the support 5 is provided with a plurality of baffles 53 to surround the bin 7, and the bin 7 and the inner cover 71 can be protected by the baffles 53.
In this embodiment, the drying device 2 may be provided therein with heating wires, air blowing holes, or the like for drying by heating or blowing high-temperature gas.
In this embodiment, the bottom surface of the bin body 7 may be connected with a drainage device, so that the sprayed liquid medicine and the cleaning liquid are collected separately, thereby avoiding leakage and pollution, and being convenient for recycling.
Embodiment 2, on the basis of embodiment 1, embodiment 2 further provides a working method of the chip substrate washing apparatus in embodiment 1, including: the transportation device 3 transports the chip substrate to sequentially pass through the reaction device 1, the water washing device 4 and the drying device 2; when the chip substrate passes through the reaction device 1, the reaction device 1 sprays liquid medicine to the chip substrate; when the chip substrate passes through the water washing device 4, the water washing device 4 sprays liquid to the chip substrate to wash the chip substrate; when the chip substrate passes through the drying device 2, the drying device 2 dries the chip substrate; specific working methods are described in detail in embodiment 1 and will not be repeated.
In summary, the application is provided with a reaction device 1, a drying device 2, a conveying device 3 and a plurality of washing devices 4; the water washing device 4 is arranged between the reaction device 1 and the drying device 2; the transporting device 3 is adapted to transport chip substrates; the reaction device 1 is suitable for spraying liquid medicine on a chip substrate; the washing device 4 is suitable for washing the chip substrate sprayed with the liquid medicine; the drying device 2 is suitable for drying the washed chip substrate; the cleaning and drying of the chip substrate are realized, impurities are prevented from remaining on the chip substrate, liquid leakage can be avoided in the reaction cleaning process, and pollution is avoided.
The components (components not illustrating the specific structure) selected in the present application are common standard components or components known to those skilled in the art, and the structures and principles thereof are known to those skilled in the art through technical manuals or through routine experimental methods.
In the description of embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. The above-described apparatus embodiments are merely illustrative, for example, the division of the units is merely a logical function division, and there may be other manners of division in actual implementation, and for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be through some communication interface, device or unit indirect coupling or communication connection, which may be in electrical, mechanical or other form.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.
With the above-described preferred embodiments according to the present application as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present application. The technical scope of the present application is not limited to the description, but must be determined according to the scope of claims.
Claims (9)
1. A chip substrate washing apparatus, comprising:
the device comprises a reaction device, a drying device, a conveying device and a plurality of washing devices;
the water washing device is arranged between the reaction device and the drying device;
the transporting device is suitable for transporting the chip substrate;
the reaction device is suitable for spraying liquid medicine on the chip substrate;
the washing device is suitable for washing the chip substrate sprayed with the liquid medicine;
the drying device is suitable for drying the washed chip substrate;
the reaction device, the drying device and the plurality of washing devices are arranged on the bracket side by side, and the conveying device sequentially passes through the reaction device, each washing device and the drying device;
clamping grooves corresponding to the reaction device, the drying device and the plurality of washing devices are formed in the same outer wall of the bracket;
a plurality of vertical columns are arranged on the bracket and are arranged between two adjacent clamping grooves;
the surface of the cylinder and the opening of the clamping groove are positioned on the same plane;
a plurality of threaded columns are arranged on the column body up and down, and corresponding knobs are arranged on the threaded columns;
the inner cover plate is embedded into the corresponding clamping groove through the knob after the inner cover plate is embedded into the corresponding clamping groove, and the surface of the inner cover plate is flush with the surface of the upright post;
the end face of the knob is provided with a pair of strip-shaped holes, and the two strip-shaped holes are arranged in parallel;
a first limiting ring and a second limiting ring are arranged on the inner wall of the strip-shaped hole, and the first limiting ring and the second limiting ring are arranged back and forth along the depth direction of the strip-shaped hole;
c-shaped handles are arranged in the strip-shaped holes, namely, two ends of each handle are respectively penetrated in the corresponding strip-shaped holes.
2. The chip substrate washing apparatus of claim 1, wherein:
the handle is sleeved with a sliding block, the sliding block is positioned in the corresponding bar-shaped hole, and the sliding block is positioned between the first limiting ring and the second limiting ring;
the end face of the handle extending from the back of the knob is provided with a second groove.
3. The chip substrate washing apparatus of claim 2, wherein:
the bottom surface of the second groove is connected with a moving block through a plurality of springs, and the moving block is suitable for moving in the second groove;
the movable block is provided with a connecting column, the connecting column extends out of the second groove, and one end of the connecting column extending out of the second groove is connected with an arc-shaped piece;
the arc-shaped piece is made of elastic materials;
the two ends of the arc-shaped piece are longer than the end face of the handle.
4. The chip substrate washing apparatus of claim 3, wherein:
the transportation device includes: a conveyor belt;
the conveyor belt sequentially passes through the reaction device, each washing device and the drying device;
the conveyor belt is arranged in a hollowed-out way;
the conveyor belt is provided with a supporting block, and the supporting block is provided with water leakage holes;
the supporting block is suitable for supporting the chip substrate;
a cover plate is arranged on the supporting block;
the cover plate is arranged on the chip substrate in a covering mode, and the cover plate is arranged in a hollowed-out mode.
5. The chip substrate washing apparatus of claim 4, wherein:
the reaction device, the drying device and the water washing device all comprise bin bodies, the bin bodies are arranged in the support, and the adjacent bin bodies are communicated, so that the conveyor belt can conveniently pass through.
6. The chip substrate washing apparatus of claim 5, wherein:
the reaction apparatus includes: a plurality of first spray heads;
the first spray heads are arranged in the bin bodies corresponding to the reaction devices, and the first spray heads are suitable for spraying liquid medicine to the chip substrates on the conveyor belt from the top surface and the bottom surface of the conveyor belt.
7. The chip substrate washing apparatus of claim 6, wherein:
the water washing device comprises: a plurality of second spray heads;
the second spray heads are arranged in the bin bodies corresponding to the water washing devices, and the second spray heads are suitable for spraying liquid to the chip substrates on the conveyor belt from the top surface and the bottom surface of the conveyor belt.
8. The chip substrate washing apparatus of claim 7, wherein:
the support is provided with a plurality of baffles so as to surround the bin body.
9. A method of operating the chip substrate washing apparatus of claim 1, comprising:
the transportation device transports the chip substrate to sequentially pass through the reaction device, the water washing device and the drying device;
when the chip substrate passes through the reaction device, the reaction device sprays liquid medicine to the chip substrate;
when the chip substrate passes through the washing device, the washing device sprays liquid to the chip substrate to clean the chip substrate;
when the chip substrate passes through the drying device, the drying device dries the chip substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311154456.9A CN116913824B (en) | 2023-09-08 | 2023-09-08 | Chip substrate washing equipment and working method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311154456.9A CN116913824B (en) | 2023-09-08 | 2023-09-08 | Chip substrate washing equipment and working method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116913824A CN116913824A (en) | 2023-10-20 |
| CN116913824B true CN116913824B (en) | 2023-11-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311154456.9A Active CN116913824B (en) | 2023-09-08 | 2023-09-08 | Chip substrate washing equipment and working method thereof |
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| CN (1) | CN116913824B (en) |
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| CN219560593U (en) * | 2023-03-22 | 2023-08-22 | 江西康克尔电子有限公司 | Cleaning device with drying function |
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|---|---|---|---|---|
| JP2003041399A (en) * | 2001-03-19 | 2003-02-13 | Tdk Corp | Continuous transport barrel plating equipment |
| CN110449430A (en) * | 2019-08-29 | 2019-11-15 | 广州粤研智能装备股份有限公司 | A kind of intelligent robot hopper cleaning product line and system |
| CN111921934A (en) * | 2020-08-11 | 2020-11-13 | 深圳市汤诚科技有限公司 | Based on chip is with processing production facility |
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|---|---|
| CN116913824A (en) | 2023-10-20 |
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