CN116908653A - Chip test equipment - Google Patents

Chip test equipment Download PDF

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Publication number
CN116908653A
CN116908653A CN202310910285.1A CN202310910285A CN116908653A CN 116908653 A CN116908653 A CN 116908653A CN 202310910285 A CN202310910285 A CN 202310910285A CN 116908653 A CN116908653 A CN 116908653A
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CN
China
Prior art keywords
seat
magnetic
probe
guide rail
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310910285.1A
Other languages
Chinese (zh)
Inventor
张华�
薛银飞
王文艺
李家桐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Feiguang Technology Co ltd
Shanghai Filai Testing Technology Co ltd
Original Assignee
Wuxi Feiguang Technology Co ltd
Shanghai Filai Testing Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Feiguang Technology Co ltd, Shanghai Filai Testing Technology Co ltd filed Critical Wuxi Feiguang Technology Co ltd
Priority to CN202310910285.1A priority Critical patent/CN116908653A/en
Publication of CN116908653A publication Critical patent/CN116908653A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0425Test clips, e.g. for IC's
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/286External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The invention discloses chip testing equipment, which comprises a probe device and a driving device, wherein the probe device comprises a support panel, a probe seat and a probe, the probe is connected to the probe seat, the probe seat is connected to the support panel, the support panel is connected to the driving end of the driving device, and the driving device drives the probe to puncture a chip through the support panel and the probe seat; the probe device further comprises a magnetic coupling seat, the magnetic coupling seat comprises a male magnetic seat and a female magnetic seat which are mutually attracted, a magnetic attraction hole is formed in the magnetic attraction surface of the female magnetic seat, a plurality of magnetic suction heads matched with the magnetic attraction hole are arranged on the magnetic attraction surface of the male magnetic seat, each magnetic attraction hole corresponds to one magnetic suction head, one of the male magnetic seat and the female magnetic seat is connected with the support panel, and the other magnetic suction head is detachably connected with the probe seat. The invention reduces the difficulty of replacing the probe seat through the magnetic coupling seat, and ensures the installation precision of the probe seat. The chip testing equipment can realize full-automatic and high-precision testing of the chip.

Description

Chip test equipment
Technical Field
The present invention relates to the field of chip testing, and more particularly, to a chip testing apparatus.
Background
The chip test equipment powers up the chip and tests the electrical performance of the chip. The chip testing equipment comprises a probe device, wherein the probe device comprises a driving device, a support panel, a probe seat and a probe. The probe is installed on the probe seat, and the probe seat is installed on the support panel, and the support panel is driven by drive arrangement and carries the probe and reciprocate, and after the probe touched anodal and negative pole on the chip, external power source can pass through the probe and supply power to the chip to the realization is to the power on of chip.
Different types of chips need to be matched to probe holders of different sizes. And thus requires the mounting of a matching probe mount when testing different chips. In the prior art, the probe holders are usually connected to the support panel by screws, and if the probe holders are to be replaced, an operator needs to be located near the probe device first, then unscrew the screws one by one to detach the old probe holder, and screw the screws one by one after installing the new probe holder. Because the operating personnel is near the probe device, the probe seat is directly dismounted or mounted on the support panel, and the operation space is limited, so that the replacement difficulty is increased. And the installation accuracy of the new probe holder cannot be ensured.
Therefore, how to reduce the difficulty of replacing the probe holder and ensure the mounting accuracy of the probe holder is a critical problem to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to reduce the difficulty of replacing the probe seat and ensure the installation precision of the probe seat. In order to achieve the above purpose, the present invention provides the following technical solutions:
the chip testing equipment comprises a probe device and a driving device, wherein the probe device comprises a support panel, a probe seat and a probe, the probe is connected to the probe seat, the probe seat is connected to the support panel, the support panel is connected to the driving end of the driving device, and the driving device drives the probe to puncture a chip through the support panel and the probe seat;
the probe device further comprises a magnetic coupling seat, wherein the magnetic coupling seat comprises a male magnetic seat and a female magnetic seat which are mutually attracted, a magnetic attraction hole is formed in a magnetic attraction surface of the female magnetic seat, a plurality of magnetic suction heads matched with the magnetic attraction hole are arranged on the magnetic attraction surface of the male magnetic seat, each magnetic attraction hole corresponds to one magnetic suction head, one of the male magnetic seat and the female magnetic seat is connected with the support panel, and the other magnetic suction head is detachably connected with the probe seat.
Preferably, the number of the magnetic holes is three, wherein two magnetic holes are distributed at two corners of the magnetic attraction surface of the master magnetic seat, and the other magnetic hole is arranged at the center of the side part of the magnetic attraction surface of the master magnetic seat, which is opposite to the two corners.
Preferably, the male magnetic seat is mounted on the support panel, the female magnetic seat is detachably connected with the probe seat, a concave arc portion is arranged on the side portion of the male magnetic seat in the front-rear direction, and a space which is favorable for human hand entering is formed at the concave arc portion when the female magnetic seat and the male magnetic seat are mutually attracted.
Preferably, the probe seat comprises a seat plate and a connecting plate, wherein the connecting plate is vertically connected to one side of the seat plate, the connecting plate is connected with the master magnetic seat, the probe is installed below the seat plate, a circuit board is installed on the upper surface of the seat plate, the top of the probe is abutted to a connector on the circuit board, and the connector is connected with an external power supply through a wire harness.
Preferably, the fixture is provided with two rows of chip clamping grooves in the front-back direction, and the probes are two groups which are arranged front-back;
the public magnetic seat is installed through sidespin angle modulation axle on the support panel, sidespin angle modulation axle includes modulation axle, modulation piece, guide rail piece, supporting shoe, the guide rail piece is fixed on the support panel, the guide rail piece has the arc guide rail that extends along fore-and-aft direction in the horizontal plane, modulation piece sliding fit in on the arc guide rail, the modulation axle is arranged along fore-and-aft direction, just modulation axle screw thread fit in the modulation piece.
Preferably, the chip test apparatus further comprises: the device comprises a clamp, an upper and lower charging tray device, a sucker device, a carrier device and an optical measuring device, wherein the driving device is a triaxial driving device, the sucker device is arranged on the support panel, and the sucker device is used for adsorbing the clamp;
the upper and lower tray devices and the carrying platform device are sequentially arranged on the front side of the triaxial driving device along the left and right axial directions of the triaxial driving device; the material trays in the upper and lower material tray devices can move along the front and back directions, and the carrying platforms are arranged along the left and right directions; the sucker device can transfer the clamp on the tray to the carrying platform device; the fixture is provided with a plurality of chip clamping grooves along the left-right direction, the optical measuring device comprises an optical measuring assembly and a left-right translation device, and the left-right translation device drives the optical measuring assembly to move along the left-right direction.
Preferably, the sucker device comprises a sucker, a sucker fixing plate and a sucker air cylinder, wherein the sucker air cylinder is arranged on the support panel, the sucker fixing plate is connected with a piston of the sucker air cylinder, and the sucker is arranged on the sucker fixing plate;
The clamp comprises a clamp body and a cover plate, wherein the cover plate is locked at the middle position of the clamp body, the cover plate can be adsorbed by the sucking disc, and the sucking disc is distributed left and right.
Preferably, the chip testing device further comprises a positioning camera device, the positioning camera device comprises a positioning camera and a camera fixing piece, the positioning camera is fixed on the support panel through the camera fixing piece, after the chuck adsorbs and places the clamp on the carrying platform device, the positioning camera obtains the position information of all chips on the clamp and sends the position information to a controller of the triaxial driving device, and the controller controls triaxial movement of the triaxial driving device according to the position information so that the probe pins each chip on the clamp in sequence.
Preferably, the carrying platform device comprises a carrying platform, a heating plate is arranged on the carrying platform, a heat conducting block is arranged on the heating plate, the heat conducting block covers the heating plate, two clamp positioning pins are arranged on the heat conducting block along the left-right direction, and pin holes matched with the clamp positioning pins are formed in the clamp.
Preferably, the heating plate is a TEC plate, and the carrier is provided with a clamping groove for clamping the TEC plate; the inside rivers passageway that is provided with of microscope carrier, rivers in the rivers passageway are used for absorbing the heat at TEC back.
Preferably, the carrying platform is connected to a bottom plate, and an angle modulation knob is arranged at the left end or the right end of the carrying platform, and is connected with the bottom plate, and is arranged along the front-back direction;
the base plate is provided with a plurality of bolt holes, and a plurality of bolt holes are respectively arranged on the front side and the rear side of the carrying platform.
Preferably, the upper and lower tray device comprises a mounting base, a guide rail tray fixing plate, a tray fixing plate switching block and a handle;
the guide rail is arranged on the mounting base, the guide rail extends along the front-back direction, the guide rail tray fixing plate is slidably arranged on the guide rail, the upper surface of the guide rail tray fixing plate is connected with the tray fixing plate switching block, the upper surface of the tray fixing plate switching block is connected with the tray, and the front end of the guide rail tray fixing plate is provided with the handle.
Preferably, the guide rail comprises a first guide rail and a second guide rail which are arranged up and down, the second guide rail is connected to the mounting base, a second sliding block is slidably matched on the second guide rail, the first guide rail is connected to the second guide rail through the second sliding block, a first sliding block is slidably matched on the first guide rail, and the first sliding block is connected with the guide rail tray fixing plate.
Preferably, a front limiting block is arranged at the front end of the second guide rail, a rear limiting block is arranged at the rear end of the second guide rail, the rear limiting block is a magnetic block, and the magnetic block can adsorb the tray;
the rear end that is close to the installation base is provided with lock dish cylinder and lock dish pothook, the piston of lock dish cylinder is vertical up to be arranged, lock dish pothook connect in the top of piston, the rear end of lock dish pothook articulate in on the installation base lock dish cylinder drive when lock dish pothook upwards rotates, lock dish pothook can with the cooperation of the front edge portion of guide rail charging tray fixed plate prevents guide rail charging tray fixed plate moves forward.
Preferably, the optical measurement assembly comprises an optical assembly mounting plate, a detection camera, an optical measurement integrating sphere and an optical measurement coupler, wherein the detection camera, the optical measurement integrating sphere and the optical measurement coupler are arranged on the optical assembly mounting plate and are arranged along the left-right direction, and the optical assembly mounting plate is connected to the moving end of the left-right translation device;
the detection camera is used for detecting the contact condition of the probe and the chip; the optical measurement integrating sphere is used for measuring the light intensity of the chip, and the optical measurement coupler is used for detecting the wavelength of the light of the chip.
Preferably, the optical assembly mounting plate is further provided with an integrating sphere front-rear modulation knob and an integrating sphere fixing lock, the optical measurement integrating sphere is connected with the integrating sphere front-rear modulation knob, and the integrating sphere fixing lock is used for locking the integrating sphere front-rear modulation knob;
the optical component mounting plate is further provided with an optical measurement upper and lower shaft, the optical measurement upper and lower shaft can move up and down, and the optical measurement coupler is connected to the optical measurement upper and lower shaft.
From the technical scheme, the following can be seen: if the probe holder is to be replaced, only the male magnetic holder and the female magnetic holder need to be separated. If the male magnetic seat is connected with the support panel, the female magnetic seat is detachably connected with the probe seat. When the probe seat is replaced, the female magnetic seat is pulled out from the male magnetic seat, and only the attraction force between the female magnetic seat and the male magnetic seat is overcome when the female magnetic seat is pulled out. After the mother magnetic base is pulled down, the probe base is detached from the mother magnetic base, and then a new probe base is installed on the mother magnetic base. Because the female magnetic seat is pulled down from the male magnetic seat and then the probe seat is disassembled or assembled from the female magnetic seat, the disassembly and the assembly of the probe seat have sufficient operation space, thereby reducing the replacement difficulty of the probe seat.
And after the probe seat is replaced, the female magnetic seat is re-adsorbed on the male magnetic seat. The magnetic attraction surface of the master magnetic seat is provided with a plurality of magnetic attraction holes, the magnetic attraction surface of the public magnetic seat is correspondingly provided with a plurality of magnetic attraction heads, and when the master magnetic seat is attracted to the public magnetic seat, the magnetic attraction heads on the public magnetic seat are ensured to enter the magnetic attraction holes on the master magnetic seat, so that the installation accuracy of the master magnetic seat and the public magnetic seat can be ensured. In addition, in the process of disassembling and assembling the probe seat from the mother magnetic seat, the position of the male magnetic seat is not changed, so that the probe seat has higher installation accuracy as long as the mother magnetic seat and the male magnetic seat have higher installation accuracy. The invention reduces the difficulty of replacing the probe seat through the magnetic coupling seat, and ensures the installation precision of the probe seat.
Drawings
In order to more clearly illustrate the solution of the embodiments of the present invention, the following description will briefly explain the drawings needed to be used in the embodiments, it being evident that the drawings in the following description are only some embodiments of the present invention and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of a probe device, a positioning camera device, and a chuck device according to an embodiment of the present invention;
FIG. 2 is an exploded view of a probe apparatus according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a male magnetic seat and a female magnetic seat according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a male magnetic seat and a female magnetic seat according to another embodiment of the present invention;
FIG. 5 is a schematic diagram of a side-turning angle modulation axis according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of an overall structure of a chip test apparatus according to an embodiment of the present invention;
FIG. 7 is an exploded view of a stage assembly according to an embodiment of the present invention;
fig. 8 is a schematic diagram of an overall structure of a stage device according to an embodiment of the present invention;
FIG. 9 is a schematic view of the overall structure of a fixture according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of the overall structure of an upper and lower tray device according to an embodiment of the present invention;
FIG. 11 is an exploded view of an upper and lower tray apparatus according to an embodiment of the present invention;
FIG. 12 is a schematic diagram of an optical measurement device according to an embodiment of the present invention;
fig. 13 is a schematic overall structure of a triaxial driving device according to an embodiment of the present invention.
Wherein 1 is a probe device, 11 is a probe seat, 12 is a probe, 13 is a magnetic coupling seat, 14 is a lateral rotation angle modulation shaft, 15 is a support panel, 131 is a master magnetic seat, 132 is a common magnetic seat, 133 is a magnetic attraction hole, 134 is a magnetic suction head, 135 is a concave arc part, 111 is a seat plate, 112 is a connecting plate, 141 is a modulation block, 142 is a modulation shaft, 143 is a guide rail block, 144 is a support block, and 16 is a circuit board;
2 is a sucker device, 21 is a sucker, 22 is a sucker fixing plate, and 23 is a sucker cylinder;
3 is a positioning camera device, 31 is a camera fixing piece and 32 is a positioning camera;
4 is an upper and lower tray device, 41 is a tray, 42 is a guide rail tray fixing plate, 43 is a tray locking hook, 44 is a handle, 45 is a mounting base, 461 is a first guide rail, 462 is a second guide rail, 47 is a front limiting block, 48 is a magnetic attraction block, and 49 is a tray locking cylinder;
5 is a carrier device, 51 is a carrier, 52 is a heat conducting block, 53 is a fixture locating pin, 54 is a TEC sheet, 55 is a bottom plate, 56 is an angle modulation knob, and 57 is a bolt hole;
6 is an optical testing device, 61 is a detection camera, 62 is an optical measurement integrating sphere, 63 is an optical measurement coupler, 64 is an optical component mounting plate, 65 is an optical measurement upper and lower shaft, and 66 is a left-right translation device;
7 is a triaxial driving device, 71 is a left supporting block, 72 is a right supporting block, 73 is a Y-direction movement axis, 74 is a Y-direction slide rail, 75 is an X-direction slide rail mounting plate, 76 is an X-direction movement axis, and 77 is a Z-direction movement axis;
8 is a clamp, 81 is a pin hole, 82 is a cover plate, 83 is a chip clamping groove, and 84 is a spring.
Detailed Description
The invention discloses chip testing equipment which is used for reducing the difficulty of replacing a probe seat, ensuring the mounting precision of the probe seat and realizing the full-automatic test of chips.
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, the terms "upper", "lower", "left", "right", "front", "rear", and the like are used for convenience of description and simplicity of operation only, and do not denote or imply that the apparatus or elements in question must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or overhang, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
Please refer to fig. 1-5: the invention discloses chip testing equipment which comprises a probe device 1 and a driving device. The probe apparatus 1 specifically includes a support panel 15, a probe holder 11, and probes 12. The probe 12 is connected to the probe seat 11, the probe seat 11 is connected to the support panel 15, the support panel 15 is connected to the driving end of the driving device, and the driving device drives the probe 12 to act through the support panel 15 and the probe seat 11 so as to puncture the chip. The probe device 1 further comprises a magnetic coupling seat 13, wherein the magnetic coupling seat 13 comprises a male magnetic seat 132 and a female magnetic seat 131 which are mutually attracted. The magnetic attraction surface of the female magnetic seat 131 is provided with a magnetic attraction hole 133, and the magnetic attraction surface of the male magnetic seat 132 is provided with a magnetic suction head 134 matched with the magnetic attraction hole 133. The number of the magnetic attraction holes 133 is plural, each magnetic attraction hole 133 corresponds to one magnetic attraction head 134, one of the male magnetic seat 132 and the female magnetic seat 131 is connected with the support panel 15, and the other is detachably connected with the probe seat 11.
If the probe holder 11 is to be replaced, it is only necessary to separate the male magnetic holder 132 and the female magnetic holder 131. If the male magnetic base 132 is connected to the support panel 15, the female magnetic base 131 is detachably connected to the probe base 11. When the probe seat 11 is replaced, the female magnetic seat 131 is pulled out from the male magnetic seat 132, and only the attraction force between the female magnetic seat 131 and the male magnetic seat 132 needs to be overcome when the female magnetic seat 131 is pulled out. After the mother magnet holder 131 is pulled out, the probe holder 11 is detached from the mother magnet holder 131, and then a new probe holder 11 is mounted on the mother magnet holder 131. Because the probe seat 11 is detached or installed from the female magnetic seat 131 after the female magnetic seat 131 is pulled out from the male magnetic seat 132, the detachment and installation of the probe seat 11 have sufficient operation space, thereby reducing the replacement difficulty of the probe seat 11.
After the probe holder 11 is replaced, the female magnetic holder 131 is re-attached to the male magnetic holder 132. The magnetic attraction surface of the master magnetic seat 131 is provided with a plurality of magnetic attraction holes 133, the magnetic attraction surface of the male magnetic seat 132 is correspondingly provided with a plurality of magnetic attraction heads 134, and when the master magnetic seat 131 is attracted to the male magnetic seat 132, the magnetic attraction heads 134 on the male magnetic seat 132 are ensured to enter the magnetic attraction holes 133 on the master magnetic seat 131, so that the installation precision of the master magnetic seat 131 and the male magnetic seat 132 can be ensured. In addition, the position of the male magnetic seat 132 is not changed in the process of assembling and disassembling the probe seat 11 from the female magnetic seat 131, so that the probe seat 11 has higher installation accuracy as long as the female magnetic seat 131 and the male magnetic seat 132 have higher installation accuracy. The invention not only reduces the difficulty of replacing the probe seat 11, but also ensures the installation precision of the probe seat 11 through the magnetic coupling seat 13.
The male magnetic seat 132 and the female magnetic seat 131 are perpendicular to the support panel 15. In order to facilitate the operator to pull the female magnetic base 131 off the male magnetic base 132, the present invention provides a concave arc portion 135 at the side portion of the male magnetic base 132 in the front-rear direction. When the female magnetic base 131 is attracted to the male magnetic base 132, a space is formed at the concave arc portion 135 into which a human hand is inserted to grasp the female magnetic base 131 to pull the female magnetic base 131 from the male magnetic base 132.
In order to further improve the installation accuracy of the female magnetic base 131 and the male magnetic base 132, the present invention makes the following design: three magnetic attraction holes 133 are provided on the magnetic attraction surface of the master magnetic seat 131, wherein two magnetic attraction holes 133 are distributed at two corners of the magnetic attraction surface of the master magnetic seat 131, and a third magnetic attraction hole 133 is provided at the center of the side of the magnetic attraction surface of the master magnetic seat 131 opposite to the two corners. The three magnetic attraction holes 133 form a triangular arrangement. Three magnetic heads 134 are correspondingly arranged on the male magnetic seat 132. The matching of the three magnetic heads 134 and the three magnetic attraction holes 133 can effectively ensure the mounting accuracy of the male magnetic base 132 and the female magnetic base 131.
Four first magnetic attraction pieces are arranged on the magnetic attraction surface of the mother magnetic seat 131, four second magnetic attraction pieces are arranged on the magnetic attraction surface of the male magnetic seat 132, and each first magnetic attraction piece is attracted with one second magnetic attraction piece. In addition, the adsorption of the three magnetic heads 134 and the three magnetic adsorption holes 133 can strongly ensure the firmness of the adsorption of the male magnetic seat 132 and the female magnetic seat 131, thereby ensuring the firmness of the probe 12.
The probe holder 11 specifically includes a seat plate 111 and a connection plate 112, and the connection plate 112 is vertically connected to one side of the seat plate 111. The connection plate 112 is connected to the female magnetic base 131 by a screw. The probe 12 is mounted below the seat plate 111, and a wiring board 16 is mounted on the upper surface of the seat plate 111. The top of the probe 12 abuts a connector on the wiring board 16, which is connected to an external power source by a wire harness. The connection plate 112 is connected to one side of the seat plate 111 to provide a space for mounting the wiring board 16 and the wire harness.
The clamp 8 has two rows of chip clamping grooves 83 in the front-rear direction, namely a front row of chip clamping grooves and a rear row of chip clamping grooves. After the chips are clamped, a front row of chips and a back row of chips are formed. The front row chips are in one-to-one correspondence with the back row chips. The front and rear groups of probes 12 are arranged below the probe seat 11, the front probes are used for abutting the chips in the front row on the clamp 8, and the rear probes are used for abutting the chips in the rear row on the clamp 8.
The invention also provides a side rotation angle modulation shaft 14, and the male magnetic seat 132 is arranged on the support panel 15 through the side rotation angle modulation shaft 14. The side rotation angle modulation axis comprises a modulation axis 142, a modulation block 141, a guide rail block 143 and a support block 144. The guide rail block 143 is fixed on the support panel 15, the guide rail block 143 has an arc guide rail extending in the front-rear direction in the horizontal plane, the modulation block 141 is slidably fitted on the arc guide rail, the support block 144 is connected below the modulation block 141, and the male magnetic seat 132 is connected to the support block 144. The modulation shaft 142 is arranged in the front-rear direction, and the modulation shaft 142 is screw-fitted into the modulation block 141.
The modulation shaft 142 is screwed to push the modulation block 141 to rotate in the horizontal plane along the guide rail block 143 so as to drive the probe seat 11 to rotate in the horizontal plane, thereby ensuring that the front probe and the rear probe are positioned at positions capable of ensuring that the front probe and the rear probe are simultaneously abutted against the corresponding front row of chips and the corresponding rear row of chips respectively.
Please refer to fig. 6: the chip testing device in the invention further comprises: a clamp 8, an upper and lower tray device 4, a sucker device 2, a carrying platform device 5 and an optical measuring device 6.
The driving device is specifically a triaxial driving device 7, and the support panel 15 is connected to the driving end of the triaxial driving device 7. The suction cup device 2 is also connected to the support panel 15, the suction cup device 2 being used for sucking the clamp 8.
On the front side of the triaxial driving device 7, an upper and lower tray device 4 and a stage device 5 are arranged in order along the left-right direction. The tray 41 in the up-down tray device 4 is movable in the front-rear direction to stay at the up-feed level or the down-feed level. The stage device 5 is arranged in the left-right direction. The suction cup device 2 is capable of transferring the gripper 8 on the tray 41 to the stage device 5. The plurality of jigs 8 are arranged in an array while on the tray 41, each jig 8 being placed in the left-right direction. The jigs 8 on the stage device 5 are also arranged in the left-right direction. The jig 8 has a plurality of chip holding grooves 83 along the left-right direction. The optical measuring device 6 includes an optical measuring assembly and a left-right translation device 66. The left-right translation device 66 drives the optical measurement assembly to move in the left-right direction to perform optical measurements on the individual chips.
In the present invention, the tray 41 in the loading and unloading tray device 4 is first moved forward to the loading level so that the operator loads the chip-clamping jig 8 onto the tray 41. The tray 41 is then moved back to the blanking level. The three-axis driving device 7 drives the suction cup device 2 on the support panel 15 to transfer the jig 8 on the tray 41 to the stage device 5. The triaxial driving means 7 then drives the probe 12 down to remove the anode and cathode on the abutting chip to power up the chip. The optical measurement assembly detects the energized chip. The probe device 1 is driven by the triaxial driving device 7 to move to the position of the next chip, the next chip is electrified, and the optical measurement assembly moves to the position of the next chip along with the left-right translation device 66, so that the optical detection is performed on the next electrified chip.
The arrangement structure of the upper and lower tray devices 4 and the carrier device 5 and the arrangement mode of the chip clamping grooves 83 in the clamp 8 allow the probe device 1 and the adsorption device 2 to automatically realize the transfer of the needle insertion and the clamp 8 only through three-dimensional translation. The probe device 1 and the sucker device 2 are both arranged on the support panel 15, namely, the probe device 1 and the sucker device 2 are driven by the triaxial driving device 7, so that the structure of the equipment is greatly simplified, and the utilization rate of the driving device is improved.
Please refer to fig. 1: the suction cup device 2 specifically includes a suction cup 21, a suction cup fixing plate 22, and a suction cup cylinder 23. The sucking disc cylinder 23 sets up on supporting panel 15, and sucking disc fixed plate 22 is connected with the piston of sucking disc cylinder 23, and sucking disc 21 sets up on sucking disc fixed plate 22. The clamp 8 for clamping the chip specifically comprises a clamp body and a cover plate 82, wherein the cover plate 82 is horizontally arranged and locked at the middle position of the clamp body. The sucking disc 21 can adsorb the apron 82, and sucking disc 21 is two that are distributed about.
Please refer to fig. 9: the cover plate 82 in the clamp 8 is horizontally arranged and positioned at the middle position of the clamp body, so that the suction cup 21 can suck the cover plate 82, and after the clamp 8 is sucked up, the clamp 8 can be kept in a horizontal state, so that preparation is made for releasing the clamp 8 onto the stage device 5. In order to further secure the levelness of the sucked jig 8, the present invention arranges the suction cups 21 in two, the two suction cups 21 being arranged in the left-right direction.
Compared with a mechanical clamping jaw, the sucker 21 cannot damage the clamp. The expansion and contraction of the sucker 21 are realized by driving the matched sucker air cylinder 23, and are not realized by driving the triaxial driving device 7. When the chuck 21 adsorbs the fixture, the piston of the chuck cylinder 23 drives the chuck 21 to move downwards, and the support panel 15 does not move downwards at the moment, so that the probe device 1 on the support panel 15 is prevented from touching the fixture by mistake.
A spring 84 is arranged in each of the front chip clamping groove 83 and the rear chip clamping groove 83 of the clamp body, the cover plate 82 is placed on the clamp body, and as the screws are screwed, the front edge and the rear edge of the cover plate 82 gradually squeeze the spring 81 in the front chip clamping groove 83 and the spring 84 in the rear chip clamping groove 83, and the chips are pressed and fixed in the respective chip clamping grooves 83 through the springs 84.
Please refer to fig. 1: the chip test apparatus further includes a positioning camera device 3, and the positioning camera device 3 specifically includes a positioning camera 32 and a camera fixing member 31, and the positioning camera 32 is fixed on the support panel 15 through the camera fixing member 31. After the chuck 21 adsorbs and places the jig 8 on the stage device 5, the chuck 21 is retracted, and the positioning camera 32 photographs the jig 8 on the stage device 5 to acquire positional information of all chips on the jig 8 and sends the positional information to the controller of the three-axis driving device 7. The controller controls the triaxial movement of the triaxial driving device 7 according to the positional information so that the probes 12 are sequentially abutted against the respective chips on the jig 8 in the left-right direction.
The present invention provides for positioning the camera device 3 on the support panel 15 rather than being positioned solely near the stage device 5. If the positioning camera device 3 is arranged near the stage device 5, it will interfere with the movement of the probe device 1 and the suction cup device 2. In addition, when the positioning camera 32 photographs the jig 8 on the stage device 5, the optimal position of the positioning camera 32 is located right above the jig 8, which certainly increases the difficulty in setting the positioning camera device 3 and affects the transfer of the suction cup 21. The positioning camera device 3, the probe device 1 and the sucker device 2 are arranged on the support panel 15 together, so that the influence on the probe device 1 and the sucker device 2 can be avoided, and the positioning camera device 3 can be in an optimal photographing position under the driving of the three-axis driving device 7, so that the detection precision is improved.
The support panel 15 is also provided with a code scanning gun which is used for scanning the two-dimensional code on the clamp 8 so as to identify the clamp and trace the detection information of the chip on the clamp at a later stage. The code scanning gun is mounted on the right side of the support panel 15. The suction cup device 2 and the positioning camera arrangement 3 are in an intermediate position of the support panel 15. The probe device 1 is arranged in the lower left corner of the support panel 15. When the triaxial driving device 7 drives the probe device 1 to move downwards for needle insertion through the support panel 15, the sucking disc device 2 and the positioning camera device 3 are positioned upwards, so that the sucking disc device 2 and the positioning camera device 3 cannot touch a chip by mistake.
When assembling the support panel 15, the probe holder 11 is attached to the female magnetic holder 131, the male magnetic holder 132 is attached to the side-rotation angle modulation shaft 14, the female magnetic holder 131 and the male magnetic holder 132 are attracted, and the side-rotation angle modulation shaft 14 is attached to the support panel 15. The positioning camera 32 is mounted to the camera mount 31, and the camera mount 31 is mounted to the support panel 15. A suction cup cylinder 23 is installed on the right side of the positioning camera 32, and a suction cup fixing plate 22 and a suction cup 21 are installed on the suction cup cylinder 23 in advance. The code scanning gun is fixed on a code scanning gun fixing plate, and the code scanning gun fixing plate is mounted on the right side of the support panel 15.
Please refer to fig. 7 and 8: as is clear from the above description, the suction cup 21 will suck and put the jig 8 on the tray 41 onto the stage device 5. The stage device 5 includes a stage 51, and in order to ensure that the chips on the stage 51 are at a desired temperature, the present invention provides a heat plate on the stage 51 and a heat conduction block 52 on the heat plate. The heat conducting block 52 covers the heat plate. The heat conductive block 52 is provided with jig positioning pins 53, and the jig positioning pins 53 are two arranged in the left-right direction. The jig 8 is provided with two pin holes 81, respectively. When the suction cup 21 moves down with the jig 8, the jig positioning pins 53 on the heat conduction block 52 gradually enter the pin holes 81 on the jig 8, thus ensuring the positional accuracy of the jig 8. The horizontal area of the heat conducting block 52 is larger than the area of the heating plate, so that the heat conducting block 52 can disperse and balance the heat of the heating plate, the heat absorbed by the chips at all positions on the clamp 8 is ensured to be consistent, and the detection precision is improved.
Further, the heating plate is preferably a TEC plate 54 (semiconductor cooling plate). The carrier 51 is provided with a clamping groove for clamping the TEC sheet 54. One side of the TEC sheet 54 is cooled and the other side is heated. When the chip is required to be at a high temperature, then the upper surface of the TEC sheet 54 is heated and the lower surface is cooled. When the chip is required to be at a low temperature, then the upper surface of the TEC sheet 54 is cooled and the lower surface is heated. In the present invention, a water flow passage is provided in the stage 51, and water flows in the water flow passage. The water flow will absorb heat from the lower surface of the TEC plates 54. This reduces the power consumption of the TEC plates 54 and extends the lifetime of the TEC plates 54.
A bottom plate 55 is connected to the lower part of the stage 51, and the bottom plate 55 is connected to the ground by bolts. Two rows of bolt holes 57 are provided in the bottom plate 55, a front row of bolt holes and a rear row of bolt holes, respectively. The front row and rear row of bolt holes are provided on both front and rear sides of the stage 51. During the process of mounting the bottom plate 55, the left end of the bottom plate 55 is displaced in the front-rear direction with respect to the right end, so that the left and right clamp positioning pins 53 on the heat conducting block 52 are displaced in the front-rear direction. Since the left and right pin holes 81 on the jig 8 are aligned in the front-rear direction, the two jig positioning pins 53 on the heat conduction block 52 cannot be respectively entered into the two pin holes 81 on the jig 8 during the downward movement of the chuck 21 carrying the jig 8.
In order to solve the above problems, the present invention provides an angle modulation knob 56, the angle modulation knob 56 being located at the left end or the right end of the bottom plate 55, the angle modulation knob 56 being arranged in the front-rear direction. If the angle modulation knob 56 is provided at the right end of the bottom plate 55. If the right end of the bottom plate 55 is displaced rearward relative to the left end, the angle modulation knob 56 is operated to drive the right end of the bottom plate 55 forward, thereby aligning the left and right ends of the bottom plate 55, and then tightening the bolts. If the right end of the bottom plate 55 is displaced forward with respect to the left end, the angle modulation knob 56 is operated to drive the right end of the bottom plate 55 to move rearward, thereby aligning the left and right ends of the bottom plate 55, and then tightening the bolts.
The angle modulation knob 56 includes a screw shaft rotatably provided on the fixed body, the screw shaft being screw-engaged with the bottom plate 55, and when the screw shaft is rotated in one direction, the right end of the bottom plate 55 is pulled to move forward; when the screw shaft rotates in the other direction, the right end of the bottom plate 55 is pushed to move backward.
Please refer to fig. 10 and 11: the upper and lower tray device 4 in the invention comprises a mounting base 45, a guide rail tray fixing plate 42, a tray fixing plate switching block and a handle 44. The guide rail is arranged on the mounting base 45, the guide rail extends along the front-rear direction, the guide rail tray fixing plate 42 is slidably arranged on the guide rail, the upper surface of the guide rail tray fixing plate 42 is connected with a tray fixing plate conversion block, the upper surface of the tray fixing plate conversion block is connected with a tray 41, and the front end of the guide rail tray fixing plate 42 is provided with a handle 44.
During loading, the tray 41 is pulled to the loading level by the handle 44. After loading is completed, the tray 41 is pushed to a discharging position by the handle 44. To avoid touching the clamp 8 on the tray 41 by a human hand, a baffle may be provided around the handle 44. The arrangement of the tray fixing plate transfer block facilitates the replacement of the tray 1, so that the guide tray fixing plate 42 can be connected with trays 41 of different types.
In order to extend the displacement travel of the tray 41 and avoid taking up more space, the present invention provides the guide rail as a double-layered guide rail, a first guide rail 461 and a second guide rail 462, respectively. The first rail 461 is located above the second rail 462. The second guide rail 462 is connected to the mounting base 45, the second guide rail 462 is slidably fitted with a second slider, the first guide rail 461 is connected to the second guide rail 462 through the second slider, the first guide rail 461 is slidably fitted with a first slider, and the first slider is connected to the guide rail tray fixing plate 42. During the pulling-out, the tray 41 is advanced along the first rail 461, after which the tray 41 is advanced along the second rail 462 together with the first rail 461. During the pushing in, the tray 41 and the first rail 461 together move back along the second rail 462, after which the tray 41 continues to move back along the first rail 461.
The front end of the second guide rail 462 is provided with a front stopper 47, the rear end of the second guide rail 462 is provided with a rear stopper, and the second guide rail 462 is limited between the front stopper 47 and the rear stopper. The rear limiting block is a magnetic suction block 48, and the magnetic suction block 48 can adsorb the material tray 41. When the tray 41 moves to the discharging position, the tray 41 is adsorbed on the magnetic attraction block 48, so that the tray 41 is prevented from shaking, and the sucker device 2 is ensured to accurately adsorb the clamp 8 on the tray 41.
A lock cylinder 49 and a lock hook 43 are arranged near the rear end of the mounting base 45, and a piston of the lock cylinder 49 is vertically upwards arranged. The locking disc hook 43 is connected to the top of the piston, and the rear end of the locking disc hook 43 is hinged to the mounting base 45. When the tray locking cylinder 49 drives the tray locking hook 43 to rotate upward, the tray locking hook 43 cooperates with the front edge portion of the rail tray fixing plate 42 to prevent the rail tray fixing plate 42 from moving forward. The arrangement of the locking hooks 43 not only further improves the stability of the tray 41, but also prevents the operator from operating the tray 41 by mistake and pulling out the tray.
Please refer to fig. 12: the optical measurement assembly includes an optical assembly mounting plate 64, a detection camera 61, an optical measurement integrating sphere 62, and an optical measurement coupler 63 that are disposed on the optical assembly mounting plate 64 and arranged in the left-right direction. The optical assembly mounting plate 64 is attached to the moving end of the left-right translation device 66.
After the probe device 1 carries the probe pins 12 to the corresponding chips, the detection camera 61 moves to the bundled chips along with the left-right translation device 66 to take pictures so as to detect whether the probes 12 are in contact with the chips. The inspection camera is used in the debugging stage, and after the debugging is successful, the inspection camera 61 is not needed after entering the normal testing stage.
After the chip is powered up, the chip emits light. The optical measurement integrating sphere 62 moves with the left-right translation device 66 to the energized chip to measure the light intensity of the chip. The optical measurement coupler 63 is used to detect the wavelength of the light of the chip.
The optical assembly mounting plate 64 is further provided with an integrating sphere front-rear modulation knob and an integrating sphere fixing lock, the optical measurement integrating sphere 62 is connected with the integrating sphere front-rear modulation knob, the integrating sphere front-rear modulation knob is used for adjusting the front-rear position of the optical measurement integrating sphere 62, and the integrating sphere fixing lock is used for locking the integrating sphere front-rear modulation knob after the optical measurement integrating sphere 62 is adjusted in place.
The optical component mounting plate 64 is further provided with an optical measurement up-down shaft 65, the optical measurement up-down shaft 65 is movable up and down, and the optical measurement coupler 63 is connected to the optical measurement up-down shaft 65. The optical measurement coupler 63 moves up and down to an optimal position along with the optical measurement up and down shaft 65. The optical measuring upper and lower shafts 65 are driven by a motor. The left-right translation device 66 is also driven by a motor.
If the fixture 8 has front and rear dies and the probe 12 has front and rear probes, the optical measuring device 6 also includes front and rear optical measuring devices. The front optical measuring device performs optical measurement on the front chip, and the rear optical measuring device performs optical measurement on the rear chip.
Please refer to fig. 13: the triaxial driving device 7 specifically includes: the left support block 71, the right support block 72, the Y-direction movement axis 73, the Y-direction slide rail 74, the X-direction slide rail mounting plate 75, the X-direction movement axis 76, and the Z-direction movement axis 77. The Y-direction movement axis 73 is provided on the left support block 71, and the Y-direction movement axis 73 moves in the front-rear direction. The Y-direction slide rail 74 is provided on the right support block 72. One end of the X-direction slide rail mounting plate 75 is connected with the Y-direction moving shaft 73, and the other end is arranged on the Y-direction slide rail 74 in a sliding manner. The X-direction movement axis 76 is provided on the X-direction slide rail mounting plate 75. The Z-direction movement axis 77 is connected to the X-direction movement axis 76. The whole triaxial driving device 7 is in a gantry structure and is arranged at the rear of the whole equipment.
The working process of the chip testing equipment is as follows: the handle 44 in the loading and unloading tray device 4 is pulled to place the tray 41 at the loading level, and the clamp 8 is placed on the tray 41. The tray 41 is pushed to a blanking level by the handle 44. The tray 41 is attracted by the lower magnetic block 48 and is blocked by the tray locking hook 43 to be stably kept at the discharging position. The triaxial driving device 7 drives the sucker device 2 to move to the upper side of the tray 41 through the support panel 15, and the sucker cylinder 23 pushes the sucker 21 to move downwards to adsorb the clamp 8. The triaxial driving device 7 drives the sucker device 2 to move above the carrying platform 51, the sucker 21 releases the adsorption force, and the sucker cylinder 23 drives the sucker 21 to move upwards and retract. The positioning camera 32 on the support panel 15 photographs the jig 8 to acquire positional information of each chip on the jig 8. The upper surface of the TEC plate 54 on the carrier 51 is controlled to dissipate heat so that the chip is at a desired temperature. The controller drives the probe device 1 on the support panel 15 to move to one end of the clamp 8 according to the position information, and the triaxial driving device 7 drives the probe seat 11 to move downwards so that the front probe and the rear probe can respectively puncture the first chips in the front row and the first chips in the rear row. The two optical measuring assemblies are driven by the respective left-right translation devices 66 to move to the first chips of the front row and the first chips of the rear row, and perform optical measurement on the first chips of the front row and the first chips of the rear row respectively. After the measurement is finished, the triaxial driving device 7 drives the probe seat 11 to move upwards, then drives the probe seat 11 to move to the second chip position, and performs needle insertion on the front row second chip and the rear row second chip, and the two optical measurement components are respectively moved to the front row second chip and the rear row second chip under the driving of the respective left-right translation device 66 so as to perform optical measurement. This is repeated until optical measurements of all chips are completed.
Finally, it is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (16)

1. The chip testing equipment is characterized by comprising a probe device (1) and a driving device, wherein the probe device (1) comprises a support panel (15), a probe seat (11) and a probe (12), the probe (12) is connected to the probe seat (11), the probe seat (11) is connected to the support panel (15), the support panel (15) is connected to the driving end of the driving device, and the driving device drives the probe (12) to puncture a chip through the support panel (15) and the probe seat (11);
the probe device (1) further comprises a magnetic coupling seat (13), the magnetic coupling seat (13) comprises a male magnetic seat (132) and a female magnetic seat (131) which are mutually attracted, a magnetic attraction hole (133) is formed in the magnetic attraction surface of the female magnetic seat (131), a plurality of magnetic suction heads (134) which are matched with the magnetic attraction hole (133) are arranged on the magnetic attraction surface of the male magnetic seat (132), each magnetic suction hole (133) corresponds to one magnetic suction head (134), one of the male magnetic seat (132) and the female magnetic seat (131) is connected with the support panel (15), and the other magnetic suction head is detachably connected with the probe seat (11).
2. The chip testing apparatus according to claim 1, wherein the number of the magnetic attraction holes (133) is three, wherein two of the magnetic holes (133) are distributed at two corners of the magnetic attraction surface of the master magnetic seat (131), and the other magnetic attraction hole (133) is disposed at a center of an edge of the magnetic attraction surface of the master magnetic seat (131) opposite to the two corners.
3. Chip testing equipment according to claim 1, characterized in that the male magnetic seat (132) is mounted on the support panel (15), the female magnetic seat (131) is detachably connected with the probe seat (11), a concave arc part (135) is arranged on the side part of the male magnetic seat (132) in the front-rear direction, and a space which is favorable for human hand to enter is formed at the concave arc part (135) when the female magnetic seat (131) and the male magnetic seat (132) are mutually attracted.
4. A chip testing apparatus according to claim 3, wherein the probe holder (11) comprises a seat plate (111) and a connecting plate (112), the connecting plate (112) is vertically connected to one side of the seat plate (111), the connecting plate (112) is connected with the master magnetic holder (131), the probe (12) is mounted below the seat plate (111), a circuit board (16) is mounted on the upper surface of the seat plate (111), and the top of the probe (12) is abutted with a connector on the circuit board (16), and the connector is connected with an external power supply through a wire harness.
5. A chip testing apparatus according to claim 3, wherein the jig (8) has two rows of chip clamping grooves (83) in the front-rear direction, and the probes (12) are two groups arranged in front-rear direction;
Public magnetic seat (132) are installed through side-spin angle modulation axle (14) on supporting panel (15), side-spin angle modulation axle (14) are including modulation axle (142), modulating piece (141), guide rail piece (143), supporting shoe (144), guide rail piece (143) are fixed on supporting panel (15), guide rail piece (143) have in the horizontal plane along the arc guide rail of fore-and-aft direction extension, modulating piece (141) sliding fit in on the arc guide rail, supporting shoe (144) connect in the below of modulating piece (141), supporting shoe (144) with public magnetic seat (132) are connected, modulating axle (142) are arranged along fore-and-aft direction, just modulating axle (142) screw-fit in modulating piece (141).
6. The chip testing apparatus according to claim 1, wherein the chip testing apparatus further comprises: the device comprises a clamp (8), an upper and lower tray device (4), a sucker device (2), a carrying platform device (5) and an optical measuring device (6), wherein the driving device is a triaxial driving device (7), the sucker device (2) is arranged on a supporting panel (15), and the sucker device (2) is used for adsorbing the clamp (8);
the upper and lower tray devices (4) and the carrying platform device (5) are sequentially arranged on the front side of the triaxial driving device (7) along the left and right axial directions of the triaxial driving device (7); the tray (41) in the upper and lower tray device (4) can move along the front and back direction, and the carrying platform device (5) is arranged along the left and right direction; the suction cup device (2) can transfer the clamp (8) on the material tray (41) to the carrying platform device (5); the fixture (8) is provided with a plurality of chip clamping grooves (83) along the left-right direction, the optical measurement device (6) comprises an optical measurement assembly and a left-right translation device (66), and the left-right translation device (66) drives the optical measurement assembly to move along the left-right direction.
7. Chip testing apparatus according to claim 6, characterized in that the suction cup device (2) comprises a suction cup (21), a suction cup fixing plate (22), a suction cup cylinder (23), the suction cup cylinder (23) being arranged on the support panel (15), the suction cup fixing plate (22) being connected with a piston of the suction cup cylinder (23), the suction cup (21) being arranged on the suction cup fixing plate (22);
the clamp (8) comprises a clamp body and a cover plate (82), the cover plate (82) is locked at the middle position of the clamp body, the sucker (21) can adsorb the cover plate (82), and the sucker (21) is two distributed left and right.
8. Chip testing apparatus according to claim 7, characterized in that the chip testing apparatus further comprises a positioning camera device (3), the positioning camera device (3) comprises a positioning camera (32) and a camera fixing member (31), the positioning camera (32) is fixed on the support panel (15) through the camera fixing member (31), after the chuck (21) adsorbs and places the fixture (8) on the carrier device (5), the positioning camera (32) acquires position information of all the chips on the fixture (8) and sends the position information to a controller of the triaxial driving device (7), and the controller controls triaxial movement of the triaxial driving device (7) according to the position information, so that the probe (12) sequentially punctures each chip on the fixture (8).
9. The chip testing apparatus according to claim 6, wherein the stage device (5) includes a stage (51), a heating sheet is provided on the stage (51), a heat conduction block (52) is provided on the heating sheet, the heat conduction block (52) covers the heating sheet, two jig positioning pins (53) are provided on the heat conduction block (52), the jig positioning pins (53) are two arranged along the left-right direction, and pin holes (81) adapted to the jig positioning pins (53) are provided on the jig (8).
10. The chip testing apparatus according to claim 9, wherein the heating plate is a TEC plate (54), and a clamping groove for clamping the TEC plate (54) is provided on the carrier (51); a water flow channel is arranged in the carrying platform (51), and water flow in the water flow channel is used for absorbing heat at the back of the TEC chip (54).
11. Chip testing apparatus according to claim 9, characterized in that the carrier (51) is connected to a base plate (55), an angle modulation knob (56) is provided at the left end or the right end of the carrier (51), the angle modulation knob (56) is connected to the base plate (55), the angle modulation knob (56) is arranged in the front-rear direction;
the base plate (55) is provided with a plurality of bolt holes (57), and the plurality of bolt holes (57) are respectively arranged on the front side and the rear side of the carrier (51).
12. Chip testing apparatus according to claim 6, characterized in that the upper and lower tray means (4) comprises a mounting base (45), a guide rail tray fixing plate (42), a tray fixing plate transfer block, a handle (44);
the guide rail is arranged on the mounting base (45), the guide rail extends along the front-back direction, the guide rail tray fixing plate (42) is slidably arranged on the guide rail, the upper surface of the guide rail tray fixing plate (42) is connected with the tray fixing plate switching block, the upper surface of the tray fixing plate switching block is connected with the tray (41), and the front end of the guide rail tray fixing plate (42) is provided with the handle (44).
13. The chip testing apparatus according to claim 12, wherein the guide rail includes a first guide rail (461) and a second guide rail (462) arranged vertically, the second guide rail (462) is connected to the mounting base (45), a second slider is slidably fitted on the second guide rail (462), the first guide rail (461) is connected to the second guide rail (462) through the second slider, a first slider is slidably fitted on the first guide rail (461), and the first slider is connected to the guide rail tray fixing plate (42).
14. The chip testing apparatus according to claim 12, wherein a front stopper (47) is provided at a front end of the second guide rail (462), a rear stopper is provided at a rear end of the second guide rail (462), the rear stopper is a magnetic block (48), and the magnetic block (48) can adsorb the tray (41);
be close to the rear end of installation base (45) is provided with lock dish cylinder (49) and lock dish pothook (43), the piston of lock dish cylinder (49) is vertical upwards to be arranged, lock dish pothook (43) connect in the top of piston, the rear end of lock dish pothook (43) articulate in on installation base (45) lock dish cylinder (49) drive when lock dish pothook (43) upwards rotate, lock dish pothook (43) can with the front edge portion cooperation of guide rail charging tray fixed plate (42) prevents guide rail charging tray fixed plate (42) forward movement.
15. The chip testing apparatus according to claim 6, wherein the optical measurement assembly includes an optical assembly mounting board (64), a detection camera (61), an optical measurement integrating sphere (62), and an optical measurement coupler (63) disposed on the optical assembly mounting board (64) and arranged in a left-right direction, the optical assembly mounting board (64) being connected to a moving end of the left-right translation device (66);
The detection camera (61) is used for detecting the contact condition of the probe (12) and the chip; the optical measurement integrating sphere (62) is used for measuring the light intensity of the chip, and the optical measurement coupler (63) is used for detecting the wavelength of the light of the chip.
16. The chip test apparatus according to claim 15, wherein an integrating sphere front-rear modulation knob and an integrating sphere fixing lock are further provided on the optical component mounting plate (64), the optical measurement integrating sphere (62) is connected with the integrating sphere front-rear modulation knob, and the integrating sphere fixing lock is used for locking the integrating sphere front-rear modulation knob;
the optical component mounting plate (64) is further provided with an optical measurement up-down shaft (65), the optical measurement up-down shaft (65) can move up and down, and the optical measurement coupler (63) is connected to the optical measurement up-down shaft (65).
CN202310910285.1A 2023-07-24 2023-07-24 Chip test equipment Pending CN116908653A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310910285.1A CN116908653A (en) 2023-07-24 2023-07-24 Chip test equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310910285.1A CN116908653A (en) 2023-07-24 2023-07-24 Chip test equipment

Publications (1)

Publication Number Publication Date
CN116908653A true CN116908653A (en) 2023-10-20

Family

ID=88350807

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310910285.1A Pending CN116908653A (en) 2023-07-24 2023-07-24 Chip test equipment

Country Status (1)

Country Link
CN (1) CN116908653A (en)

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