CN116895929A - Transmission line transition structure and radar system circuit lamination architecture - Google Patents
Transmission line transition structure and radar system circuit lamination architecture Download PDFInfo
- Publication number
- CN116895929A CN116895929A CN202310971374.7A CN202310971374A CN116895929A CN 116895929 A CN116895929 A CN 116895929A CN 202310971374 A CN202310971374 A CN 202310971374A CN 116895929 A CN116895929 A CN 116895929A
- Authority
- CN
- China
- Prior art keywords
- waveguide structure
- transition
- transmission line
- gap
- dielectric substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007704 transition Effects 0.000 title claims abstract description 177
- 230000005540 biological transmission Effects 0.000 title claims abstract description 167
- 238000003475 lamination Methods 0.000 title abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 202
- 238000000034 method Methods 0.000 claims abstract description 24
- 230000008569 process Effects 0.000 claims abstract description 22
- 230000010287 polarization Effects 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 108
- 230000000737 periodic effect Effects 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 22
- 230000008878 coupling Effects 0.000 claims description 19
- 238000010168 coupling process Methods 0.000 claims description 19
- 238000005859 coupling reaction Methods 0.000 claims description 19
- 239000011229 interlayer Substances 0.000 claims description 18
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 230000002708 enhancing effect Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 230000002401 inhibitory effect Effects 0.000 claims description 2
- 230000001902 propagating effect Effects 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 6
- 238000009792 diffusion process Methods 0.000 description 13
- 239000004020 conductor Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000012779 reinforcing material Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 230000001629 suppression Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
- H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Security & Cryptography (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Waveguides (AREA)
Abstract
The invention discloses a transmission line transition structure and a radar system circuit lamination structure. The transmission line transition structure comprises a first transition assembly and a second transition assembly; the first transition assembly comprises a first radio frequency dielectric substrate provided with a first circuit transmission line and a first low frequency dielectric substrate provided with a first waveguide structure which are stacked, and the first circuit transmission line is used for being electromagnetically coupled with the first waveguide structure; the second transition assembly comprises a second radio frequency dielectric substrate provided with a second circuit transmission line and a second low frequency dielectric substrate provided with a second waveguide structure which are stacked, wherein the second waveguide structure is used for being matched with the first waveguide structure in polarization, and the second circuit transmission line is used for being electromagnetically coupled with the second waveguide structure. By adopting the scheme, the problems that the lamination design is complex and the cost is high due to the fact that the variety of the through holes is multiple and expensive high-frequency medium substrates are needed due to the fact that the traditional radar system lamination circuit is manufactured by an integrated lamination process and electromagnetic signals are transmitted through the metallized through holes are solved.
Description
Technical Field
The invention relates to the technical field of radar systems, in particular to a transmission line transition structure and a radar system circuit lamination structure.
Background
With the requirement of the 4D millimeter wave imaging radar for high resolution, the number of antenna channels of the vehicle-mounted radar needs to be multiplied, and the vehicle-mounted radar is extremely challenging to miniaturize. In order to reduce the size of the vehicle-mounted radar, the vehicle-mounted radar circuit is designed in a laminated structure, namely, an antenna layer, a low-frequency circuit layer and a device layer are distributed on different section heights from top to bottom, so that the size of the vehicle-mounted radar is greatly reduced.
At present, a multilayer printed circuit integrated lamination process is generally used for realizing a circuit lamination architecture of a radar system, a metallization via hole structure is adopted for realizing the electric connection between a device layer and a low-frequency circuit layer as well as between the device layer and an antenna layer, electromagnetic signals are transmitted among the low-frequency circuit layer, the device layer and the antenna layer through the metallization via holes, the number of types of the whole lamination via holes of the radar system is large, and the lamination design is complex; and because of the specificity of the integration high integration, the system optimization cost is high in the early development and verification stage; in addition, the metallized via holes for connecting the device layer and the antenna layer pass through the low-frequency circuit layer, so that the antenna layer, the low-frequency circuit layer and the device layer are all realized by adopting expensive high-frequency medium substrates in order to ensure the stability of the transition structure, and the cost of the radar system is greatly increased.
Disclosure of Invention
The invention provides a transmission line transition structure and a radar system circuit lamination structure, which are used for solving the problems that an existing radar system lamination circuit is manufactured by an integrated lamination process, electromagnetic signals are transmitted through metallized through holes, lamination design is complex due to multiple types of through holes, and cost is high due to the fact that expensive high-frequency medium substrates are needed.
According to an aspect of the present invention, there is provided a transmission line transition structure comprising a first transition assembly and a second transition assembly;
the first transition assembly comprises a first radio frequency medium substrate and a first low frequency medium substrate which are stacked, a first circuit transmission line is arranged on one side, away from the first low frequency medium substrate, of the first radio frequency medium substrate, a first waveguide structure is arranged on the first low frequency medium substrate, and the first circuit transmission line is used for being electromagnetically coupled with the first waveguide structure to realize transmission transition of electromagnetic signals;
the second transition assembly comprises a second radio frequency medium substrate and a second low frequency medium substrate which are stacked, a second waveguide structure is arranged on the second low frequency medium substrate, and the second waveguide structure is used for being matched with the first waveguide structure in polarization so as to realize the transmission of electromagnetic signals of the first waveguide structure to the second waveguide structure;
And one side of the second radio frequency medium substrate, which is away from the second low frequency medium substrate, is provided with a second circuit transmission line, and the second circuit transmission line is used for being electromagnetically coupled with the second waveguide structure to realize transmission transition of electromagnetic signals.
In an alternative embodiment of the invention, the first waveguide structure and the second waveguide structure each comprise a waveguide port, the waveguide port of the first waveguide structure being opposite to and polarization matched to the waveguide port of the second waveguide structure.
In an alternative embodiment of the invention, the first transition assembly and the second transition assembly are detachably connected, an assembly gap is provided between the first transition assembly and the second transition assembly, the transmission line transition structure further comprises a gap waveguide structure,
the assembly gap includes a propagation gap between the first waveguide structure and the second waveguide structure and a spatial gap for suppressing propagation of electromagnetic signals in the spatial gap other than the propagation gap.
In an alternative embodiment of the invention, the gap waveguide structure comprises a periodic printed circuit structure surrounding one of the first waveguide structure and the second waveguide structure and a metal plane disposed on a face of the other of the first waveguide structure and the second waveguide structure corresponding to the waveguide port;
The periodic printed circuit structure is opposite the metal plane.
In an alternative embodiment of the present invention, a first interlayer is disposed between the first radio frequency dielectric substrate and the first low frequency dielectric substrate, a second interlayer is disposed between the second radio frequency dielectric substrate and the second low frequency dielectric substrate, the number of the periodic printed circuit structures is plural, the periodic printed circuit structures include a bonding pad and a first conductive via, one end of the first conductive via is connected with the bonding pad, and the other end of the first conductive via penetrates through the first low frequency dielectric substrate and is electrically connected with the first interlayer or penetrates through the second low frequency dielectric substrate and is electrically connected with the second interlayer.
In an alternative embodiment of the present invention, the first interlayer is provided with a first gap, and the first circuit transmission line is used for realizing transmission transition of electromagnetic signals through electromagnetic coupling between the first gap and the first waveguide structure;
and/or the second interlayer is provided with a second gap, and the second circuit transmission line is used for realizing transmission transition of electromagnetic signals through electromagnetic coupling between the second gap and the second waveguide structure.
In an alternative embodiment of the present invention, a conductive patch is disposed in the first gap and/or the second gap, and the length of the conductive patch is smaller than the lengths of the first gap and the second gap;
the first circuit transmission line is used for enhancing electromagnetic coupling with the first waveguide structure through the conductive patch of the first gap so as to realize transmission transition of electromagnetic signals;
the second circuit transmission line is used for enhancing electromagnetic coupling with the second waveguide structure through the conductive patch of the second gap, so that transmission transition of electromagnetic signals is realized.
In an alternative embodiment of the present invention, the transmission line transition structure further comprises at least one of:
the second conductive via penetrates through the first radio frequency dielectric substrate;
a third conductive via penetrating the second radio frequency dielectric substrate;
the first prepreg is arranged between the first radio frequency dielectric substrate and the first low frequency dielectric substrate;
the second prepreg is arranged between the second radio frequency dielectric substrate and the second low frequency dielectric substrate;
and the fixed threaded hole is arranged on the first transition assembly and the second transition assembly, and when the fixed threaded hole on the first transition assembly is opposite to the fixed threaded hole on the second transition assembly, the waveguide port of the first waveguide structure is opposite to the waveguide port of the second waveguide structure and is matched with the waveguide port in polarization.
In an alternative embodiment of the present invention, the transmission line transition structure further comprises at least one of:
a fourth conductive via penetrating the first rf dielectric substrate and the first prepreg;
and the fifth conductive via penetrates through the second radio frequency dielectric substrate and the second prepreg.
According to another aspect of the present invention, there is provided a radar system circuit laminated structure, which is composed of an antenna layer, a low frequency layer and a device layer, and includes a radiation antenna, a radio frequency chip, a low frequency device, a low frequency circuit and the transmission line transition structure according to any embodiment of the present invention;
the transmission line transition structure comprises a first transition component and a second transition component, and the first transition component and the radiation antenna form an antenna layer;
the second transition assembly comprises a second radio frequency medium substrate and a second low frequency medium substrate which are stacked, a second waveguide structure is arranged on the second low frequency medium substrate, and a second circuit transmission line is arranged on one side, away from the second low frequency medium substrate, of the second radio frequency medium substrate;
the second radio frequency dielectric substrate, the second low frequency dielectric substrate, the second waveguide structure and the low frequency circuit form a low frequency layer;
The second circuit transmission line, the radio frequency chip and the low frequency device form a device layer.
In an alternative embodiment of the present invention, the first low frequency dielectric substrate is composed of at least one low frequency dielectric substrate;
the second low-frequency dielectric substrate is composed of at least one low-frequency dielectric substrate.
In an alternative embodiment of the invention, the low frequency layer and the device layer are made by an integrated lamination process;
the low-frequency layer, the device layer and the antenna layer are all provided with fixed threaded holes, and the low-frequency layer, the device layer and the antenna layer are used for realizing detachable connection through the fixed threaded holes.
In an alternative embodiment of the invention, the transmission line transition structure further comprises a gap waveguide structure integrated in the antenna layer and the low frequency layer;
the first transition assembly and the second transition assembly have an assembly gap therebetween, the assembly gap including a propagation gap and a spatial gap, the propagation gap being located between a first waveguide structure and the second waveguide structure, the gap waveguide structure being configured to inhibit propagation of electromagnetic signals in the spatial gap other than the propagation gap.
According to the technical scheme, the first transition assembly and the second transition assembly are arranged, the first transition assembly comprises a first radio frequency medium substrate and a first low frequency medium substrate which are stacked, a first circuit transmission line is arranged on one side, away from the first low frequency medium substrate, of the first radio frequency medium substrate, a first waveguide structure is arranged on the first low frequency medium substrate, and the first circuit transmission line can be electromagnetically coupled with the first waveguide structure to realize transition of electromagnetic signal transmission to the first waveguide structure. In addition, the second transition assembly comprises a second radio frequency medium substrate and a second low frequency medium substrate which are stacked, a second waveguide structure is arranged on the second low frequency medium substrate, and the second waveguide structure can be matched with the first waveguide structure in polarization, so that electromagnetic signals of the first waveguide structure are transmitted to the second waveguide structure. And finally, a second circuit transmission line is arranged on one side, away from the second low-frequency dielectric substrate, of the second radio-frequency dielectric substrate, and can be electromagnetically coupled with the second waveguide structure, so that the second waveguide structure can transfer electromagnetic signals to the second circuit transmission line. The electromagnetic signal output by the first circuit transmission line can be transmitted to the second circuit transmission line via the first waveguide structure and the second waveguide structure without designing a multilayer metallized via between the first circuit transmission line and the second circuit transmission line.
In addition, the first transition assembly and the second transition assembly can be processed separately, so that the types of the through holes are reduced. The first waveguide structure can be processed on the first low-frequency medium substrate through a printed circuit process, the second waveguide structure can be processed on the second low-frequency medium substrate through a printed circuit process, and an expensive high-frequency medium substrate is not required to be used in a low-frequency layer when the radar system is used; therefore, the problems that the lamination design is complex due to the fact that the types of the through holes are multiple and the cost is high due to the fact that expensive high-frequency medium substrates are needed in the traditional radar system lamination circuit are solved.
By manufacturing the radar system circuit laminated structure based on the transmission line transition structure provided by any embodiment of the invention, the transition from the first circuit transmission line to the first waveguide structure, the transition from the first waveguide structure to the second waveguide structure and the transition from the second waveguide structure to the second circuit transmission line can be realized. The transition structure can be divided into a first transition assembly and a second transition assembly for separate processing, so that the types of the through holes are reduced; the first waveguide structure can be processed on the first low-frequency medium substrate through a printed circuit process, and the second waveguide structure can be processed on the second low-frequency medium substrate through a printed circuit process, so that an expensive high-frequency medium substrate is not required to be used in a low-frequency layer; because the first transition assembly and the second transition assembly can be disassembled, the antenna layer formed by the first transition assembly can be independently optimized, and the device layer and the low-frequency layer can be reused, so that the cost of the radar system is greatly reduced.
It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the invention or to delineate the scope of the invention. Other features of the present invention will become apparent from the description that follows.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a transmission line transition structure according to a first embodiment of the present invention;
fig. 2 is an exploded view of a transmission line transition structure according to a first embodiment of the present invention;
fig. 3 is a schematic structural diagram of another transmission line transition structure according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of another transmission line transition structure according to a first embodiment of the present invention;
fig. 5 is a schematic structural diagram of another transmission line transition structure according to a first embodiment of the present invention;
Fig. 6 is a schematic structural diagram of a circuit laminated structure of a radar system according to a second embodiment of the present invention.
Wherein: 1. a first transition assembly; 11. a first radio frequency dielectric substrate; 12. a first low frequency dielectric substrate; 13. a first circuit transmission line; 14. a first waveguide structure; 15. a first interlayer; 16. a second conductive via; 17. a first prepreg; 18. a fourth conductive via; 19. a first gap; 2. a second transition assembly; 21. a second radio frequency dielectric substrate; 22. a second low frequency dielectric substrate; 23. a second waveguide structure; 24. a second circuit transmission line; 25. a second barrier layer; 26. a second gap; 27. a third conductive via; 28. a fifth conductive via; 29. a second prepreg; 3. a waveguide port; 4. a gap waveguide structure; 41. a periodic printed circuit structure; 411. a bonding pad; 412. a first conductive via; 42. a metal plane; 5. a conductive patch; 6. fixing the threaded holes; 60. a screw; 7. a radiating antenna; 8. a radio frequency chip; 9. a low frequency device; 10. a low frequency circuit; 20. an antenna layer; 30. a low frequency layer; 40. a device layer; 50. an assembly gap; 501. propagation gap; 502. a space gap.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Example 1
Fig. 1 is a schematic structural diagram of a transmission line transition structure according to a first embodiment of the present invention, and fig. 2 is an exploded structural diagram of a transmission line transition structure according to a first embodiment of the present invention, which is applicable to a radar system, as shown in fig. 1 and 2, and includes a first transition assembly 1 and a second transition assembly 2.
The first transition assembly 1 comprises a first radio frequency dielectric substrate 11 and a first low frequency dielectric substrate 12 which are stacked, a first circuit transmission line 13 is arranged on one side, away from the first low frequency dielectric substrate 12, of the first radio frequency dielectric substrate 11, a first waveguide structure 14 is arranged on the first low frequency dielectric substrate 12, and the first circuit transmission line 13 is used for being electromagnetically coupled with the first waveguide structure 14 to realize transmission transition of electromagnetic signals. The first rf dielectric substrate 11 refers to a material for developing a rf printed circuit board, the first low-frequency dielectric substrate 12 refers to a material for developing a low-frequency printed circuit board, the first rf dielectric substrate 11 may be disposed above the first low-frequency dielectric substrate 12, the first circuit transmission line 13 refers to a transmission line for transmitting electromagnetic signals, including but not limited to a microstrip line, a strip line, a grounded coplanar waveguide line, a dielectric integrated waveguide transmission line, and the like, and the microstrip line, the strip line, the grounded coplanar waveguide line, the dielectric integrated waveguide transmission line, and the like may be arbitrarily combined. The first waveguide structure 14 is a structure for directing electromagnetic waves. Electromagnetic coupling is also known as mutual inductance coupling, and is the effect that the current change of one circuit affects the other circuit through mutual inductance due to the mutual inductance existing between the two circuits. By electromagnetic coupling between the first circuit transmission line 13 and the first waveguide structure 14, electromagnetic signals on the first circuit transmission line 13 can be transmitted to the first waveguide structure 14, and transmission transition of the electromagnetic signals can be realized.
The second transition assembly 2 comprises a second radio frequency dielectric substrate 21 and a second low frequency dielectric substrate 22 which are stacked, a second waveguide structure 23 is arranged on the second low frequency dielectric substrate 22, and the second waveguide structure 23 is used for being matched with the first waveguide structure 14 in polarization, so that electromagnetic signals of the first waveguide structure 14 are transmitted to the second waveguide structure 23. The second rf dielectric substrate 21 is a material for developing an rf printed circuit board, the second low-frequency dielectric substrate 22 is a material for developing a low-frequency printed circuit board, the second low-frequency dielectric substrate 22 may be disposed above the second rf dielectric substrate 21, the first waveguide structure 14 may be opposite to the second waveguide structure 23, and polarization matching means that a polarization direction of electric wave transmission is consistent with a polarization direction of a receiving end. By polarization matching the second waveguide structure 23 with the first waveguide structure 14, electromagnetic signals of the first waveguide structure 14 can be transmitted to the first waveguide structure 14.
A second circuit transmission line 24 is arranged on one side of the second radio frequency dielectric substrate 21, which is away from the second low frequency dielectric substrate 22, and the second circuit transmission line 24 is used for electromagnetic coupling with the second waveguide structure 23, so that transmission transition of electromagnetic signals is realized. The second circuit transmission line 24 refers to a transmission line for transmitting electromagnetic signals, including but not limited to a microstrip line, a strip line, a grounded coplanar waveguide line, a dielectric integrated waveguide transmission line, etc., and the microstrip line, the strip line, the grounded coplanar waveguide line, the dielectric integrated waveguide transmission line, etc. may be arbitrarily combined. By electromagnetic coupling between the second circuit transmission line 24 and the second waveguide structure 23, electromagnetic signals on the second waveguide structure 23 can be transmitted to the second circuit transmission line 24, and transmission transition of electromagnetic signals can be realized.
According to the scheme, through the arrangement of the first transition assembly 1 and the second transition assembly 2, the first transition assembly 1 comprises the stacked first radio frequency dielectric substrate 11 and the first low frequency dielectric substrate 12, the first circuit transmission line 13 is arranged on one side, away from the first low frequency dielectric substrate 12, of the first radio frequency dielectric substrate 11, the first low frequency dielectric substrate 12 is provided with the first waveguide structure 14, and the first circuit transmission line 13 can be electromagnetically coupled with the first waveguide structure 14, so that transmission of electromagnetic signals is transited to the first waveguide structure 14. In addition, the second transition assembly 2 includes a second radio frequency dielectric substrate 21 and a second low frequency dielectric substrate 22 stacked, and a second waveguide structure 23 is disposed on the second low frequency dielectric substrate 22, where the second waveguide structure 23 can be polarization matched with the first waveguide structure 14, so as to realize transmission of electromagnetic signals of the first waveguide structure 14 to the second waveguide structure 23. The gap waveguide structure 4 is integrated in the first transition assembly 1 and the second transition assembly 2 for suppressing propagation of electromagnetic signals in the assembly gap 502 except the assembly gap 501 between the first waveguide structure 14 and the second waveguide structure 23, enabling low loss propagation of electromagnetic signals between the waveguide ports 3 of the first waveguide structure 14 and the second waveguide structure 23. Finally, a second circuit transmission line 24 is arranged on one side, away from the second low-frequency dielectric substrate 22, of the second radio-frequency dielectric substrate 21, and the second circuit transmission line 24 can be electromagnetically coupled with the second waveguide structure 23, so that the second waveguide structure 23 can transmit electromagnetic signals to the second circuit transmission line 24. The electromagnetic signal output by the first circuit transmission line 13 can be transmitted to the second circuit transmission line 24 via the first waveguide structure 14 and the second waveguide structure 23 without designing a multi-layered metallized via from the first circuit transmission line 13 to the second circuit transmission line 24.
In addition, the first transition assembly 1 and the second transition assembly 2 may be machined separately, reducing the via variety. The first waveguide structure 14 can be processed on the first low-frequency dielectric substrate 12 through a printed circuit process, the second waveguide structure 23 can be processed on the second low-frequency dielectric substrate 22 through a printed circuit process, and the high-frequency dielectric substrate is not required to be used in the low-frequency layer 30 when the radar system is used; therefore, the problems that the lamination design is complex due to the fact that the types of the through holes are multiple and the cost is high due to the fact that expensive high-frequency medium substrates are needed in the traditional radar system lamination circuit are solved. The circuit lamination of the radar system is detached, the antenna layer can be independently optimized, the device layer and the low-frequency circuit layer can be reused, and the development cost of the radar system is further reduced.
In an alternative embodiment of the invention, the first waveguide structure 14 and the second waveguide structure 23 each comprise a waveguide port 3, the waveguide port 3 of the first waveguide structure 14 being opposite to the waveguide port 3 of the second waveguide structure 23 and polarization matched. Wherein, since the waveguide port 3 of the first waveguide structure 14 is opposite to the waveguide port 3 of the second waveguide structure 23 and polarization-matched, the electromagnetic signal outputted by the first waveguide structure 14 can be transmitted to the second waveguide structure 23 through the waveguide port 3 of the first waveguide structure 14 via the waveguide port 3 of the second waveguide structure 23.
Specifically, the first waveguide structure 14 may be fabricated on the first low frequency dielectric substrate 12 by a printed circuit process. For example, a space with a metal inner wall may be disposed on the first low-frequency dielectric substrate 12, where the space is the first waveguide structure 14, and the waveguide port 3 of the first waveguide structure 14 is flush with a surface of a side of the first low-frequency dielectric substrate 12 facing away from the first radio-frequency dielectric substrate 11.
In particular, the second waveguide structure 23 may be processed on the second low frequency dielectric substrate 22 by a printed circuit process. For example, a space with a metal inner wall may be disposed on the second low-frequency dielectric substrate 22, which is the second waveguide structure 23, where the waveguide port 3 of the second waveguide structure 23 is flush with a surface of a side of the second low-frequency dielectric substrate 22 facing away from the second radio-frequency dielectric substrate 21.
In an alternative embodiment of the invention, the first transition assembly 1 and the second transition assembly 2 are detachably connected, an assembly gap 50 is arranged between the first transition assembly 1 and the second transition assembly 2, the transmission line transition structure further comprises a gap waveguide structure 4, the assembly gap 50 comprises a propagation gap 501 and a space gap 502, the propagation gap 501 is located between the first waveguide structure 14 and the second waveguide structure 23, and the gap waveguide structure 4 is used for inhibiting electromagnetic signals from propagating in the space gap 502 except the propagation gap 501.
Wherein, ideally, the distance between the waveguide ports 3 of the first waveguide structure 14 and the second waveguide structure 23 is capable of realizing that the electromagnetic signals of the first waveguide structure 14 are almost completely conducted to the second waveguide structure 23, and because the first transition assembly 1 and the second transition assembly 2 are detachably connected, when actually assembled, an assembly gap 50 may exist between the first transition assembly 1 and the second transition assembly 2, at this time, part of the electromagnetic signals output by the first waveguide structure 14 are transferred to the second waveguide structure 23 through the propagation gap 501, and the other part of the electromagnetic signals are transferred to other spaces through the space gap 502 in the assembly gap 50, so that the loss of the electromagnetic signals is caused. Since the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23 are opposite, there is also an assembly gap 50, that is, a propagation gap 501 between the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23, the gap waveguide structure 4 refers to a structure capable of suppressing propagation of electromagnetic signals in a space gap 502 other than the propagation gap 501 between the first waveguide structure 14 and the second waveguide structure 23, by providing the gap waveguide structure 4, it is possible to make most of electromagnetic signals transmitted from the waveguide port 3 of the first waveguide structure 14 to the waveguide port 3 of the second waveguide structure 23 to be transmitted to the second waveguide structure 23, and low-loss transmission of signals between the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23 is achieved, suppressing diffusion propagation of electromagnetic signals in other space regions.
On the basis of the above-described embodiment, the gap waveguide structure 4 includes the periodic printed circuit structure 41 and the metal plane 42, the periodic printed circuit structure 41 surrounding one of the first waveguide structure 14 and the second waveguide structure 23, the metal plane 42 being disposed on the face of the other of the first waveguide structure 14 and the second waveguide structure 23 on which the corresponding waveguide port 3 is located; the periodic printed circuit structure 41 is opposite the metal plane 42.
Wherein by providing the opposing periodic printed circuit structure 41 and the metal plane 42, the opposing periodic printed circuit structure 41 and the metal plane 42 are able to form the gap waveguide structure 4, the band-stop principle of the gap waveguide structure 4 is that according to electromagnetic theory, when the air space between the ideal magnetic conductor (PMC, perfect Magnetic Conductor) and the ideal electrical conductor (PEC, perfect Electric Conductor) is smaller than a quarter wavelength, no electromagnetic wave of any mode can propagate between the PEC and the PMC, and since the ideal magnetic conductor is not present in real life, the effect of the ideal magnetic conductor (PMC), i.e. the artificial magnetic conductor (AMC, artificial Magnetic Conductor), can be constructed with some periodic structures. Since the periodic printed circuit structure 41 surrounds one of the first waveguide structure 14 and the second waveguide structure 23, and the metal plane 42 is disposed on the surface on which the corresponding waveguide port 3 of the other of the first waveguide structure 14 and the second waveguide structure 23 is located, the gap waveguide structure 4 formed by the opposite periodic printed circuit structure 41 and the metal plane 42 can suppress transmission of electromagnetic signals to the space gap 502 other than the propagation gap 501 between the first waveguide structure 14 and the second waveguide structure 23, and low-loss transmission of signals between the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23 of electromagnetic signals is realized, and diffusion propagation of electromagnetic signals in other space regions is suppressed.
Alternatively, in one particular embodiment, as shown in fig. 3, a periodic printed circuit structure 41 is disposed on the first low frequency dielectric substrate 12 and surrounds the first waveguide structure 14, and a metal plane 42 is located on a side of the second low frequency dielectric substrate 22 opposite the first low frequency dielectric substrate 12 and opposite the periodic printed circuit structure 41. In another specific embodiment, as shown in fig. 1, the periodic printed circuit structure 41 is disposed on the second low frequency dielectric substrate 22 and surrounds the second waveguide structure 23, and the metal plane 42 is located on a side of the first low frequency dielectric substrate 12 opposite to the second low frequency dielectric substrate 22 and opposite to the periodic printed circuit structure 41.
As shown in fig. 1, a first interlayer 15 is disposed between the first rf dielectric substrate 11 and the first low-frequency dielectric substrate 12, a second interlayer 25 is disposed between the second rf dielectric substrate 21 and the second low-frequency dielectric substrate 22, the number of periodic printed circuit structures 41 is plural, the periodic printed circuit structures 41 include a pad 411 and a first conductive via 412, one end of the first conductive via 412 is connected to the pad 411, and the other end of the first conductive via 412 penetrates through the first low-frequency dielectric substrate 12 to be electrically connected to the first interlayer 15 or penetrates through the second low-frequency dielectric substrate 22 to be electrically connected to the second interlayer 25, that is, when the metal plane 42 is located on the first low-frequency dielectric substrate 12, one end of the pad 411 is opposite to the metal plane 42, the other end of the pad 411 is connected to the first conductive via 412, and one end of the first conductive via 412 away from the pad 411 penetrates through the second low-frequency dielectric substrate 22 to be electrically connected to the second interlayer 25; when the metal plane 42 is located on the second low-frequency dielectric substrate 22, one end of the bonding pad 411 is opposite to the metal plane 42, the other end of the bonding pad 411 is connected to the first conductive via 412, and one end of the first conductive via 412, which is away from the bonding pad 411, penetrates through the first low-frequency dielectric substrate 12 and is electrically connected to the first interlayer 15.
The first spacer 15 may be partially or entirely made of a metal material, the second spacer 25 may be partially or entirely made of a metal material, and the pad 411 may be circular, square or other shaped, so that the pad 411 and the first conductive via 412 may be mushroom-like in shape, and the pad 411 and the first conductive via 412 may be printed by a printed circuit technology, so that the pad 411 and the first conductive via 412 may form an Artificial Magnetic Conductor (AMC) with an ideal magnetic conductor (PMC) effect of a gap waveguide, the metal plane 42 may form an ideal electrical conductor (PEC), and the PEC and PMC may ensure that electromagnetic waves propagate along the first waveguide structure 14 to the second waveguide structure 23, and inhibit diffusion propagation of electromagnetic signals in other spatial regions.
In an alternative embodiment of the present invention, the first spacer layer 15 is provided with a first gap 19, and the first circuit transmission line 13 is configured to be electromagnetically coupled to the first waveguide structure 14 through the first gap 19, so as to implement a transmission transition of an electromagnetic signal.
The first gap 19 may be located between the first circuit transmission line 13 and the first waveguide structure 14, and through the first gap 19, the first circuit transmission line 13 may enable electromagnetic coupling of electromagnetic signals from the first circuit transmission line 13 to the first waveguide structure 14, so as to implement transmission transition of electromagnetic signals.
On the basis of the embodiment, the conductive patch 5 is disposed in the first gap 19, the length of the conductive patch 5 is smaller than that of the first gap 19, and the first circuit transmission line 13 is used for enhancing electromagnetic coupling with the first waveguide structure 14 through the conductive patch 5 of the first gap 19, so as to realize transmission transition of electromagnetic signals. Therefore, a new gap can be formed between the conductive patch 5 and the inner wall of the first gap 19, so that electromagnetic coupling between the first circuit transmission line 13 and the first waveguide structure 14 can be enhanced, and transmission transition of electromagnetic signals can be realized. The number of the conductive patches 5 may be one or more, and is not particularly limited herein.
In an alternative embodiment of the present invention, the transmission line transition structure further includes a second conductive via 16, where the second conductive via 16 penetrates the first rf dielectric substrate 11. The second conductive via 16 can inhibit the diffusion of the electromagnetic signal in the first radio frequency dielectric substrate 11, so that the electromagnetic signal of the first circuit transmission line 13 can be transmitted to the first waveguide structure 14 with low loss.
In an alternative embodiment of the present invention, as shown in fig. 4, the transmission line transition structure further includes a first prepreg 17, where the first prepreg 17 is disposed between the first rf dielectric substrate 11 and the first low frequency dielectric substrate 12. The first prepreg 17 is one of the main materials in the production of the multilayer board, and is mainly composed of resin and reinforcing materials, wherein the reinforcing materials are classified into glass fiber cloth, paper base, composite materials and the like, and most of prepregs (adhesive sheets) used for manufacturing the multilayer printed board adopt glass fiber cloth as the reinforcing materials. By arranging the first prepreg 17 between the first radio frequency dielectric substrate 11 and the first low frequency dielectric substrate 12, the connection between the first radio frequency dielectric substrate 11 and the first low frequency dielectric substrate 12 can be more stable, and the first radio frequency dielectric substrate 11 and the first low frequency dielectric substrate 12 are not easy to separate.
Based on the above embodiment, as shown in fig. 4, the transmission line transition structure further includes a fourth conductive via 18; the fourth conductive via 18 penetrates the first rf dielectric substrate 11 and the first prepreg 17. The fourth conductive via 18 can inhibit the diffusion of the electromagnetic signal in the first radio frequency dielectric substrate 11 and the first prepreg 17, so that the electromagnetic signal of the first circuit transmission line 13 can be transmitted to the first waveguide structure 14 with low loss.
In a specific embodiment, the transmission line transition structure includes the second conductive via 16 and the fourth conductive via 18, where the second conductive via 16 is closer to the first waveguide structure 14 than the fourth conductive via 18, so that the fourth conductive via 18 is prevented from being too close to the first waveguide structure 14 to affect the transmission of the electromagnetic signal, and diffusion suppression of the electromagnetic signal in the first rf dielectric substrate 11 and the first prepreg 17 is also enabled.
In a specific embodiment, as shown in fig. 5, the transmission line transition structure includes only the fourth conductive vias 18, and the number of the fourth conductive vias 18 is plural, so that diffusion suppression of electromagnetic signals in the first radio frequency dielectric substrate 11 and the first prepreg 17 can be better performed, and thus the electromagnetic signals of the first circuit transmission line 13 can be transmitted to the first waveguide structure 14 with low loss.
In an alternative embodiment of the present invention, as shown in fig. 3, the second spacer layer 25 is provided with a second gap 26, and the second circuit transmission line 24 is used to implement transmission transition of electromagnetic signals by electromagnetic coupling with the second waveguide structure 23 through the second gap 26.
The second gap 26 may be located between the second circuit transmission line 24 and the second waveguide structure 23, and through the second gap 26, the second circuit transmission line 24 can implement electromagnetic coupling of the electromagnetic signal from the second circuit transmission line 24 to the second waveguide structure 23, so as to implement transmission transition of the electromagnetic signal.
On the basis of the above embodiment, the conductive patch 5 is disposed in the second gap 26, and the length of the conductive patch 5 is smaller than the length of the second gap 26. The second circuit transmission line 24 is used for enhancing electromagnetic coupling with the second waveguide structure 23 through the conductive patch 5 of the second gap 26, so as to realize transmission transition of electromagnetic signals. Therefore, a new gap can be formed between the conductive patch 5 and the inner wall of the second gap 26, so that electromagnetic coupling between the second circuit transmission line 24 and the second waveguide structure 23 can be enhanced, and transmission transition of electromagnetic signals can be realized. The number of the conductive patches 5 may be one or more, and is not particularly limited herein.
In an alternative embodiment of the present invention, the transmission line transition structure further comprises a third conductive via 27 extending through the second rf dielectric substrate 21. The third conductive via 27 can inhibit the diffusion of the electromagnetic signal in the second radio frequency dielectric substrate 21, so that the electromagnetic signal of the second circuit transmission line 24 can be transmitted to the second waveguide structure 23 with low loss.
In an alternative embodiment of the present invention, as shown in fig. 4, the transmission line transition structure further includes a second prepreg 29, where the second prepreg 29 is disposed between the second rf dielectric substrate 21 and the second low frequency dielectric substrate 22. The second prepreg 29 is one of the main materials in the production of the multilayer board, and is mainly composed of resin and reinforcing materials, wherein the reinforcing materials are classified into glass fiber cloth, paper base, composite materials and the like, and most of prepregs (adhesive sheets) used for manufacturing the multilayer printed board adopt glass fiber cloth as the reinforcing materials. By disposing the second prepreg 29 between the second rf dielectric substrate 21 and the second low-frequency dielectric substrate 22, the connection between the second rf dielectric substrate 21 and the second low-frequency dielectric substrate 22 can be more stable, and the second rf dielectric substrate 21 and the second low-frequency dielectric substrate 22 are not easily separated.
The transmission line transition structure further includes a fifth conductive via 28, based on the above embodiments; the fifth conductive via 28 penetrates the second rf dielectric substrate 21 and the second prepreg 29. The fifth conductive via 28 can inhibit the diffusion of the electromagnetic signal in the second radio frequency dielectric substrate 21 and the second prepreg 29, so that the electromagnetic signal of the second waveguide structure 23 can be transmitted to the second circuit transmission line 24 with low loss.
In a specific embodiment, as shown in fig. 4, the transmission line transition structure includes a third conductive via 27 and a fifth conductive via 28, where the third conductive via 27 is closer to the second waveguide structure 23 than the fifth conductive via 28, so that the fifth conductive via 28 is prevented from being too close to the second waveguide structure 23 to affect the transmission of the electromagnetic signal, and diffusion suppression of the electromagnetic signal in the second rf dielectric substrate 21 and the second prepreg 29 is also enabled.
In a specific embodiment, as shown in fig. 5, the transmission line transition structure includes only the fifth conductive vias 28, where the number of the fifth conductive vias 28 is plural, so that diffusion suppression of the electromagnetic signal in the second radio frequency dielectric substrate 21 and the second prepreg 29 can be better performed, and thus the electromagnetic signal of the second circuit transmission line 24 can be transmitted to the second waveguide structure 23 with lower loss.
In an alternative embodiment of the invention, the transmission line transition structure further comprises a fixed threaded hole 6 arranged on the first transition component 1 and the second transition component 2, and the waveguide port 3 of the first waveguide structure 14 is opposite to and polarization matched with the waveguide port 3 of the second waveguide structure 23 when the fixed threaded hole 6 on the first transition component 1 and the fixed threaded hole 6 on the second transition component 2 are opposite. Wherein, when the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23 are opposite and polarization matched, the screws 60 can pass through the fixed threaded holes 6 on the first transition assembly 1 and the second transition assembly 2, thereby facilitating the assembly of the first transition assembly 1 and the second transition assembly 2.
Example two
Fig. 6 is a schematic structural diagram of a laminated structure of a radar system circuit according to a second embodiment of the present invention, where the laminated structure of the radar system circuit generally includes an antenna layer 20, a low frequency layer 30 and a device layer 40, and as shown in fig. 6, the laminated structure of the radar system circuit according to the second embodiment of the present invention includes a radiation antenna 7, a radio frequency chip 8, a low frequency device 9, a low frequency circuit 10 and a transmission line transition structure according to any embodiment of the present invention.
The transmission line transition structure comprises a first transition assembly 1 and a second transition assembly 2, the first transition assembly 1 and the radiating antenna 7 constituting an antenna layer 20. The radiation antenna 7 can control the radiation energy to be transmitted and received, and the signal related to the radar system is realized. The antenna layer 20 may be fabricated by a multilayer printed circuit board process or a low temperature co-fired ceramic process to effect transition and conversion of electromagnetic signals from the first waveguide structure 14 to antenna electromagnetic signals.
The second transition assembly 2 comprises a second radio frequency dielectric substrate 21 and a second low frequency dielectric substrate 22 which are stacked, a second waveguide structure 23 is arranged on the second low frequency dielectric substrate 22, and a second circuit transmission line 24 is arranged on one side, away from the second low frequency dielectric substrate 22, of the second radio frequency dielectric substrate 21. The second radio frequency dielectric substrate 21, the second low frequency dielectric substrate 22, the second waveguide structure 23 and the low frequency circuit 10 constitute a low frequency layer 30. The second circuit transmission line 24, the radio frequency chip 8 and the low frequency device 9 constitute a device layer 40. The rf chip 8 is mainly used for transmitting and receiving an rf signal, the rf chip 8 can realize conversion and transition from the signal of the rf chip 8 to the second waveguide structure 23 through the second circuit transmission line 24, the low-frequency device 9 is a device for the low-frequency circuit 10, and the low-frequency signal of the low-frequency device 9 can be electrically connected to the low-frequency circuit 10 through a via plating process, so as to realize low-frequency signal control. The low frequency layer 30 and the device layer 40 may be integrally processed through a multi-layer printed circuit board process or a low temperature co-fired ceramic process.
In the above-mentioned scheme, by manufacturing the laminated structure of the radar system circuit based on the transmission line transition structure provided by any embodiment of the present invention, the transition from the first circuit transmission line 13 to the first waveguide structure 14, the first waveguide structure 14 to the second waveguide structure 23, and the second waveguide structure 23 to the second circuit transmission line 24 can be realized. The transition structure can be divided into a first transition assembly 1 and a second transition assembly 2 for separate processing, so that the types of the through holes are reduced; the first waveguide structure 14 can be processed on the first low frequency dielectric substrate 12 by a printed circuit process, and the second waveguide structure 23 can be processed on the second low frequency dielectric substrate 22 by a printed circuit process without using an expensive high frequency dielectric substrate at the low frequency layer 30; because the first transition assembly 1 and the second transition assembly 2 can be disassembled, the antenna layer 20 formed by the first transition assembly 1 can be independently optimized, and the device layer 40 and the low-frequency layer 30 can be reused, so that the cost of the radar system is greatly reduced.
In an alternative embodiment of the present invention, the stacked circuit architecture of the radar system further includes a signal via penetrating through the device layer 40 to the low frequency circuit 10, where the signal via is used to electrically connect the rf chip 8 with the low frequency circuit 10, and according to different types of the low frequency circuit 10, the signal via can electrically connect a low frequency signal of the rf chip 8 to the low frequency circuit 10, so as to implement low frequency signal control.
In an alternative embodiment of the present invention, the first low frequency dielectric substrate 12 is formed by at least one low frequency dielectric substrate, that is, the first low frequency dielectric substrate 12 may be made of a single low frequency dielectric substrate, or may be made by laminating a plurality of low frequency dielectric substrates, which is not particularly limited herein.
In an alternative embodiment of the present invention, the second low frequency dielectric substrate 22 is formed by at least one low frequency dielectric substrate, that is, the second low frequency dielectric substrate 22 may be made of a single low frequency dielectric substrate, or may be made by laminating a plurality of low frequency dielectric substrates, which is not particularly limited herein.
In an alternative embodiment of the invention, the transmission line transition structure comprises a gap waveguide structure 4, the gap waveguide structure 4 being integrated in the antenna layer 20 and the low frequency layer 30. The first transition assembly 1 and the second transition assembly 2 have an assembly gap 50 therebetween, the assembly gap 50 comprising a propagation gap 501 and a space gap 502, the propagation gap 501 being located between the first waveguide structure 14 and the second waveguide structure 23, the gap waveguide structure 4 being adapted to suppress propagation of electromagnetic signals in the space gap 502 except for the propagation gap 501.
Wherein, since the first transition component 1 is disposed on the antenna layer 20, that is, the first waveguide structure 14 is also integrated on the antenna layer 20 at this time, and the second waveguide structure 23 is integrated on the low-frequency layer 30, by integrating the gap waveguide structure 4 in the antenna layer 20 and the low-frequency layer 30, propagation of electromagnetic signals in the space gap 502 except for the propagation gap 501 can be suppressed, and most of electromagnetic signals can be transmitted from the waveguide port 3 of the first waveguide structure 14 to the waveguide port 3 of the second waveguide structure 23 for transmission to the second waveguide structure 23, so that low-loss signal transmission of electromagnetic signals between the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23 is realized, and diffusion propagation of electromagnetic signals in other space regions is suppressed.
In an alternative embodiment of the invention, the radar system circuit laminate architecture is physically comprised of the antenna layer 20 and the integrally fabricated low frequency layer 30 and device layer 40. The low-frequency layer 30, the device layer 40 and the antenna layer 20 are respectively provided with a fixing threaded hole 6, and the low-frequency layer 30, the device layer 40 and the antenna layer 20 are used for realizing detachable connection through the fixing threaded holes 6. That is, the antenna layer 20 and the integrally processed low frequency layer 30 and the device layer 40 can be physically fixed by the screw 60 when the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23 are aligned and polarization is matched, and propagation of electromagnetic signals between the waveguide port 3 of the first waveguide structure 14 and the waveguide port 3 of the second waveguide structure 23 is realized by the gap waveguide structure 4, so that diffusion propagation of electromagnetic signals in other spatial regions is inhibited. When the antenna layer 20 and the integrated low-frequency layer 30 and the device layer 40 can be separated by taking out the screw 60 when the antenna layer needs to be detached.
In addition, since the radar system circuit laminated structure is physically constituted by the antenna layer 20 and the integrally processed low frequency layer 30 and the device layer 40, the antenna layer 20 of the radar system circuit laminated structure can be processed and optimized a plurality of times, and the low frequency layer 30 and the device layer 40 can be reused.
It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps described in the present invention may be performed in parallel, sequentially, or in a different order, so long as the desired results of the technical solution of the present invention are achieved, and the present invention is not limited herein.
The above embodiments do not limit the scope of the present invention. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of the present invention.
Claims (13)
1. A transmission line transition structure, characterized by comprising a first transition assembly (1) and a second transition assembly (2);
the first transition assembly (1) comprises a first radio frequency medium substrate (11) and a first low-frequency medium substrate (12) which are stacked, a first circuit transmission line (13) is arranged on one side, away from the first low-frequency medium substrate (12), of the first radio frequency medium substrate (11), a first waveguide structure (14) is arranged on the first low-frequency medium substrate (12), and the first circuit transmission line (13) is used for being electromagnetically coupled with the first waveguide structure (14) to realize transmission transition of electromagnetic signals;
The second transition assembly (2) comprises a second radiofrequency dielectric substrate (21) and a second low-frequency dielectric substrate (22) which are stacked, a second waveguide structure (23) is arranged on the second low-frequency dielectric substrate (22), and the second waveguide structure (23) is used for being matched with the first waveguide structure (14) in polarization so as to realize transmission of electromagnetic signals of the first waveguide structure (14) to the second waveguide structure (23);
and a second circuit transmission line (24) is arranged on one side of the second radio frequency medium substrate (21) away from the second low frequency medium substrate (22), and the second circuit transmission line (24) is used for being electromagnetically coupled with the second waveguide structure (23) to realize transmission transition of electromagnetic signals.
2. The transmission line transition structure according to claim 1, characterized in that the first waveguide structure (14) and the second waveguide structure (23) each comprise a waveguide port (3), the waveguide ports (3) of the first waveguide structure (14) being opposite and polarization matched to the waveguide ports (3) of the second waveguide structure (23).
3. The transmission line transition structure according to claim 2, characterized in that the first transition component (1) and the second transition component (2) are detachably connected, that an assembly gap (50) is provided between the first transition component (1) and the second transition component (2), and that the transmission line transition structure further comprises a gap waveguide structure (4);
The assembly gap (50) comprises a propagation gap (501) and a spatial gap (502), the propagation gap (501) being located between the first waveguide structure (14) and the second waveguide structure (23), the gap waveguide structure (4) being adapted to suppress propagation of electromagnetic signals in the spatial gap (502) other than the propagation gap (501).
4. A transmission line transition structure according to claim 3, characterized in that the gap waveguide structure (4) comprises a periodic printed circuit structure (41) and a metal plane (42), the periodic printed circuit structure (41) surrounding one of the first waveguide structure (14) and the second waveguide structure (23), the metal plane (42) being arranged on the face of the other of the first waveguide structure (14) and the second waveguide structure (23) where the corresponding waveguide port (3) is located;
the periodic printed circuit structure (41) is opposite to the metal plane (42).
5. The transmission line transition structure according to claim 4, wherein a first interlayer (15) is disposed between the first radio frequency dielectric substrate (11) and the first low frequency dielectric substrate (12), a second interlayer (25) is disposed between the second radio frequency dielectric substrate (21) and the second low frequency dielectric substrate (22), the number of the periodic printed circuit structures (41) is plural, the periodic printed circuit structures (41) include a pad (411) and a first conductive via hole (412), one end of the first conductive via hole (412) is connected with the pad (411), and the other end of the first conductive via hole (412) penetrates through the first low frequency dielectric substrate (12) to be electrically connected with the first interlayer (15) or penetrates through the second low frequency dielectric substrate (22) to be electrically connected with the second interlayer (25).
6. The transmission line transition structure according to claim 5, characterized in that the first spacer layer (15) is provided with a first gap (19), and the first circuit transmission line (13) is configured to be electromagnetically coupled to the first waveguide structure (14) through the first gap (19) so as to implement transmission transition of electromagnetic signals;
and/or, the second interlayer (25) is provided with a second gap (26), and the second circuit transmission line (24) is used for realizing transmission transition of electromagnetic signals through electromagnetic coupling between the second gap (26) and the second waveguide structure (23).
7. The transmission line transition structure according to claim 6, characterized in that a conductive patch (5) is provided in the first gap (19) and/or the second gap (26), the conductive patch (5) having a length smaller than the lengths of the first gap (19) and the second gap (26);
the first circuit transmission line (13) is used for enhancing electromagnetic coupling with the first waveguide structure (14) through the conductive patch (5) of the first gap (19) so as to realize transmission transition of electromagnetic signals;
the second circuit transmission line (24) is used for enhancing electromagnetic coupling with the second waveguide structure (23) through the conductive patch (5) of the second gap (26) so as to realize transmission transition of electromagnetic signals.
8. The transmission line transition structure according to any one of claims 2 to 7, characterized in that it further comprises at least one of the following:
a second conductive via (16) penetrating the first radio frequency dielectric substrate (11);
a third conductive via (27) penetrating the second radio frequency dielectric substrate (21);
a first prepreg (17) disposed between the first radio frequency dielectric substrate (11) and the first low frequency dielectric substrate (12);
a second prepreg (29) disposed between the second radio frequency dielectric substrate (21) and the second low frequency dielectric substrate (22);
and the fixed threaded hole (6) is arranged on the first transition assembly (1) and the second transition assembly (2), and when the fixed threaded hole (6) on the first transition assembly (1) and the fixed threaded hole (6) on the second transition assembly (2) are opposite, the waveguide port (3) of the first waveguide structure (14) is opposite to the waveguide port (3) of the second waveguide structure (23) and the polarization is matched.
9. The transmission line transition structure according to claim 8, characterized in that it further comprises at least one of the following:
a fourth conductive via (18) penetrating the first rf dielectric substrate (11) and the first prepreg (17);
And a fifth conductive via (28) penetrating through the second radio frequency dielectric substrate (21) and the second prepreg (29).
10. A radar system circuit stack architecture consisting of an antenna layer (20), a low frequency layer (30) and a device layer (40), characterized in that the radar system circuit stack architecture comprises a radiating antenna (7), a radio frequency chip (8), a low frequency device (9), a low frequency circuit (10) and a transmission line transition structure according to any of claims 1-9;
the transmission line transition structure comprises a first transition component (1) and a second transition component (2), wherein the first transition component (1) and the radiation antenna (7) form an antenna layer (20);
the second transition assembly (2) comprises a second radiofrequency medium substrate (21) and a second low-frequency medium substrate (22) which are stacked, a second waveguide structure (23) is arranged on the second low-frequency medium substrate (22), and a second circuit transmission line (24) is arranged on one side, away from the second low-frequency medium substrate (22), of the second radiofrequency medium substrate (21);
the second radio frequency dielectric substrate (21), the second low frequency dielectric substrate (22), the second waveguide structure (23) and the low frequency circuit (10) form a low frequency layer (30);
the second circuit transmission line (24), the radio frequency chip (8) and the low frequency device (9) constitute a device layer (40).
11. The radar system circuit stack architecture according to claim 10, wherein said first low frequency dielectric substrate (12) is constituted by at least one low frequency dielectric substrate;
the second low-frequency dielectric substrate (22) is composed of at least one low-frequency dielectric substrate.
12. The radar system circuit stack architecture according to claim 10, wherein the low frequency layer (30) and the device layer (40) are made by an integrated process;
the low-frequency layer (30), the device layer (40) and the antenna layer (20) are respectively provided with a fixing threaded hole (6), and the low-frequency layer (30), the device layer (40) and the antenna layer (20) are detachably connected through the fixing threaded holes (6).
13. The radar system circuit stack architecture according to any one of claims 10 to 12, characterized in that the transmission line transition structure further comprises a gap waveguide structure (4), the gap waveguide structure (4) being integrated in the antenna layer (20) and the low frequency layer (30);
the first transition assembly (1) and the second transition assembly (2) are provided with an assembly gap (50), the assembly gap (50) comprises a propagation gap (501) and a space gap (502), the propagation gap (501) is positioned between the first waveguide structure (14) and the second waveguide structure (23), and the gap waveguide structure (4) is used for inhibiting electromagnetic signals from propagating in the space gap (502) except the propagation gap (501).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310971374.7A CN116895929A (en) | 2023-08-03 | 2023-08-03 | Transmission line transition structure and radar system circuit lamination architecture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310971374.7A CN116895929A (en) | 2023-08-03 | 2023-08-03 | Transmission line transition structure and radar system circuit lamination architecture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116895929A true CN116895929A (en) | 2023-10-17 |
Family
ID=88314899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310971374.7A Pending CN116895929A (en) | 2023-08-03 | 2023-08-03 | Transmission line transition structure and radar system circuit lamination architecture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116895929A (en) |
-
2023
- 2023-08-03 CN CN202310971374.7A patent/CN116895929A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10615480B2 (en) | Radio frequency connection arrangement | |
| CN109004375B (en) | Antenna integrated printed circuit board and manufacturing method thereof | |
| CN109616759A (en) | Full duplex active phased array filter antenna front | |
| US11133594B2 (en) | System and method with multilayer laminated waveguide antenna | |
| EP2449621B1 (en) | Hybrid single aperture inclined antenna | |
| US8547187B2 (en) | Printed circuit board impedance matching step for microwave (millimeter wave) devices | |
| US8154469B2 (en) | Radio frequency (RF) transition design for a phased array antenna system utilizing a beam forming network | |
| EP3497745B1 (en) | Radio frequency connection arrangement | |
| CN111090076A (en) | Millimeter wave radar radio frequency front end circuit structure and manufacturing method thereof | |
| US20100033272A1 (en) | Apparatus and method for forming a bandgap surface and waveguide transition modules incorporating a bandgap surface | |
| WO2010013610A1 (en) | Planar antenna | |
| EP2862228B1 (en) | Balun | |
| JP2005051331A (en) | Coupling structure between microstrip line and dielectric waveguide | |
| JP2007243123A (en) | Electromagnetic field coupling structure and multilayer wiring board | |
| CN111048879A (en) | Broadband constant-amplitude conversion structure from rectangular waveguide to double-end strip line | |
| EP2006956B1 (en) | System and method for a radio frequency (RF) transition design for a phased array antenna system utilizing a beam forming network | |
| CN112242612A (en) | Patch antenna | |
| CN110957574A (en) | Strip line feed broadband millimeter wave antenna unit | |
| CN116895929A (en) | Transmission line transition structure and radar system circuit lamination architecture | |
| WO2005107014A1 (en) | Multilayer printed wiring board radiating device and phased array antenna using it | |
| CN210926321U (en) | Strip line feed broadband millimeter wave antenna unit | |
| CN109546346B (en) | Double-circular polarization antenna unit with laminated structure | |
| WO2016128766A2 (en) | RADIO FREQUENCY CONNECTION ARRANGEMENt | |
| JP2000022406A (en) | Planar transmission line | |
| CN210006926U (en) | Patch antenna |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |